WO2012146147A1 - 一种pcb及包括所述pcb的移动终端 - Google Patents

一种pcb及包括所述pcb的移动终端 Download PDF

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Publication number
WO2012146147A1
WO2012146147A1 PCT/CN2012/074401 CN2012074401W WO2012146147A1 WO 2012146147 A1 WO2012146147 A1 WO 2012146147A1 CN 2012074401 W CN2012074401 W CN 2012074401W WO 2012146147 A1 WO2012146147 A1 WO 2012146147A1
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Prior art keywords
pcb
hole
metal cover
microphone
sound
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PCT/CN2012/074401
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English (en)
French (fr)
Inventor
王槐庆
Original Assignee
中兴通讯股份有限公司
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Publication of WO2012146147A1 publication Critical patent/WO2012146147A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly

Definitions

  • the utility model relates to the field of machinery and communication, in particular to a printed circuit board (PCB) and a mobile terminal including the same.
  • PCB printed circuit board
  • the microphone MUST guarantee two conditions: Suitable passage and closed sound chamber. If the path is not properly selected, the call sound will be small. If the sound chamber is not tightly sealed, it will result in The call echoes, especially in the hands-free call, the call echo is more obvious.
  • the path will span the back cover of the mobile phone and the battery cover, or the rear case of the mobile phone and the front case of the mobile phone. There is a gap between the two shells of the mobile phone, which is unavoidable during processing, which causes the sound chamber to be tightly sealed and a call whistling.
  • the embodiment of the present invention provides a PCB and a mobile terminal including the PCB, and is used for ensuring a good sound cavity effect on the premise that the terminal shape is flexible and compact.
  • a printed circuit board PCB comprising a functional body, comprising: a first through hole on the PCB;
  • a microphone located on the side of the PCB, a sealed metal cover opposite to the position of the microphone on the other side of the PCB;
  • the sound hole on the microphone is in communication with the first through hole.
  • a mobile terminal comprising a terminal housing, further comprising the PCB, wherein the terminal housing has a third through hole; the metal cover has a second through hole, and the second through hole The third through holes are connected.
  • the PCB of the embodiment of the present invention includes: a functional body, further comprising a first through hole on the PCB; and a microphone located on the side of the PCB, the other side of the PCB is sealed relative to the position of the microphone a metal cover; the sound hole on the microphone is in communication with the first through hole.
  • the metal cover body is sealed, so that the sound cavity formed by the metal cover body, the first through hole and the sound hole is better in sealing performance, and the call whistling is avoided.
  • the metal cover by making the metal cover thin, try to optimize the sound path and avoid the call sound is too small.
  • FIG. 1 is a main structural diagram of a PCB in an embodiment of the present invention.
  • FIG. 2 is a detailed structural diagram of a mobile terminal in an embodiment of the present invention. detailed description
  • the PCB of the embodiment of the present invention includes: a functional body, further comprising a first through hole on the PCB; and a microphone located on the side of the PCB, the other side of the PCB is sealed relative to the position of the microphone a metal cover; the sound hole on the microphone is in communication with the first through hole.
  • the metal cover body is sealed, so that the sound cavity formed by the metal cover body, the first through hole and the sound hole is better in sealing performance, and the call whistling is avoided.
  • the metal cover by making the metal cover thin, try to optimize the sound path and avoid the call sound is too small. Referring to FIG.
  • a PCB printed circuit board in an embodiment of the present invention includes a functional main body, which can be used for communication, particularly for a call function in a communication process, and further includes a microphone 1021 and a metal cover 1022. A first through hole is opened in the PCB.
  • the microphone 1021 is located on the PCB.
  • the PCB may be located under the keycap of the mobile terminal.
  • the microphone 1021 is fixed to the PCB and can be fixed by soldering.
  • a first through hole can be opened on the PCB by using a puncher, and a first through hole can be formed on a PCB, which is located at the edge portion of the PCB, that is, at the edge portion of the terminal keyboard. It should be noted that it is best not to place the first through hole between several buttons, which may affect the normal use of the terminal keyboard.
  • the height of the first through hole is the same as the height of the PCB even if the first through hole penetrates the PCB.
  • the sound hole on the microphone 1021 needs to communicate with the first through hole on the PCB to form a sound path.
  • the height of the sound hole on the microphone 1021 is lower than the total height of the microphone 1021, that is, the sound hole does not pass through the microphone 1021, ensuring the airtightness of the space.
  • the thickness (or width) of the sound hole is smaller than the first through hole, and the first through hole is required to cover the exit surface of the sound hole.
  • the metal cover 1022 is located on the other side of the PCB, and the metal cover 1022 and the microphone 1021 can be fixed on opposite sides of the PCB, so that the metal cover 1022 covers the exit surface of the first through hole of the PCB.
  • the fixing manner in the embodiment of the present invention may be welding.
  • the metal cover 1022 can be made by stretching a metal or metal alloy material, and the metal cover 1022 is a hollow cover, which can be circular or square in shape, and can be passed through a surface mount technology (SMT, Surface). Mounted Technology)
  • SMT Surface mount technology
  • Mounted Technology The soldering process is soldered to the PCB, which is equivalent to a tight bond to the PCB through a continuous soldering line to avoid gaps and affect the sound cavity tightness.
  • the height of the metal cover 1022 can be controlled within a certain range, for example, the range can be 0.6 mm to 1 mm, and the length of the sound chamber passage is generally 0.8 mm. Refers to the sum of the height of the metal cover 1022 and the height of the first through hole), which may range from 0.8 mm to 1.3 mm, and the sound chamber can be controlled by controlling the height of the metal cover 1022.
  • the length of the path is such that it ensures proper path of the sound chamber without affecting the normal use of the keyboard.
  • the metal cover 1022 (the upper left end in FIG.
  • the second through hole is provided with a second through hole, and the second through hole is connected with the third through hole on the terminal housing, and the foam can be attached to the joint surface of the two sides ( The portion shown by a broken line in Fig. 2) ensures the airtightness between the metal cover 1022 and the terminal housing 1023. The sound can be transmitted through the foam, so the foam does not hinder the transmission of sound.
  • the position of the second through hole may be changed correspondingly according to the shape of the metal cover 1022 or the position of the third through hole on the terminal outer casing without affecting the technical solution of the present invention.
  • the thickness (or width) of the second through hole may be the same as the thickness of the third through hole on the terminal housing, so that the second through hole and the third through hole are completely spliced.
  • the metal cover 1022 may be formed by stretching a metal or a metal alloy, and the metal may be a metal or a metal alloy having a good ductility such as copper, copper, or beryllium copper.
  • the thickness of the metal cover 1022 (herein referred to as the thickness of the metal or metal alloy, excluding the intermediate cavity portion) is preferably not more than 0.3 mm. Preferably, the thickness of the metal cover 1022 can be made 0.2 mm.
  • an embodiment of the present invention further provides a mobile terminal, which includes a terminal housing 1023, and further includes the PCB.
  • the terminal in the embodiment of the present invention may be a mobile phone.
  • the terminal housing 1023 is located at the edge of the keyboard of the mobile phone.
  • the terminal housing 1023 is provided with a third through hole.
  • the third through hole is connected to the second through hole of the metal cover 1022, and the foam can be attached to the joint surface of the two sides.
  • the sound can be transmitted through the foam, so the foam does not hinder the transmission of sound.
  • the terminal housing 1023 is a front housing of the terminal. Sound hole, first through hole, metal cover 1022, second through hole and The third through hole constitutes a sound cavity passage.
  • the PCB can be located under the keycap of the mobile terminal.
  • the PCB includes a first through hole, that is, a first through hole is formed in the PCB, and the first through hole may have one at the edge of the PCB, that is, at the edge of the keyboard of the mobile phone.
  • the microphone 1021 is also located at the edge of the PCB.
  • the height of the first through hole is the same as the height of the PCB, that is, the first through hole penetrates the PCB.
  • the first through hole communicates with the sound hole of the microphone 1021, and the exit surface of the first through hole is covered by the metal cover 1022, and the sound hole, the first through hole and the metal cover 1022 constitute a sound cavity. Cavity.
  • the PCB of the embodiment of the present invention includes: a functional body, further comprising a first through hole on the PCB; and a microphone located on the side of the PCB, the other side of the PCB is sealed relative to the position of the microphone a metal cover; the sound hole on the microphone is in communication with the first through hole.
  • the metal cover 1022 is in close contact with the PCB, and the metal cover 1022 completely covers the exit surface of the first through hole, and the first through hole completely covers the exit surface of the sound hole, and the second through hole
  • the bonding surface with the third through hole can be placed with a foam to ensure the airtightness of the metal cover 1022 with respect to the terminal housing 1023, so that the sound cavity formed by the sound hole, the first through hole and the metal cover 1022 has a good sealing performance. Avoid call whistling.
  • the metal cover 1022 can be made of a metal or a metal alloy having good ductility, and can be made as thin as possible. The length of the sound path is adjusted by adjusting the height of the metal cover 1022 to ensure the length of the sound path is ideal. .
  • the sound cavity passage formed by the sound hole, the first through hole, the metal cover 1022, the second through hole and the third through hole is ideal to avoid the sound being too small.
  • the PCB is located under the key cap of the mobile terminal, and the microphone is located on the PCB, and there is no need to set a special sound cavity area inside the terminal, thereby saving the internal space of the terminal, which is beneficial to the terminal to be lighter and thinner. A more compact direction.
  • the metal cover By providing a sealed metal cover opposite to the position of the microphone on the side of the PCB, the sound cavity formed by the metal cover, the first through hole and the sound hole is sealed, and the call whistling is avoided. At the same time, by making the metal cover thin, try to optimize the sound path and avoid the call sound is too small.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Description

一种 PCB及包括所述 PCB的移动终端 技术领域
本实用新型涉及机械及通信领域， 特别涉及一种印制电路板（PCB , Printed Circuit Board )及包括所述 PCB的移动终端。 背景技术
手机传声器（MIC, Microphone )要保证良好的效果， 必须保证两个条 件： 合适的通路和密闭的音腔， 如果通路选择不合适， 会造成通话声音小， 如果音腔密闭不严， 则会造成通话回声嘯叫， 尤其是在免提通话中， 通话 回声嘯叫更为明显。
为避免以上问题， 目前通常的做法是在手机中设计单独的音腔区， 通 过手机壳体、 泡棉或 TPU (热塑性聚氨酯弹性体橡胶）组成合适的通路和 密封的音腔。 但这种方式有两个缺点：
一、 需在手机中设置专用的音腔空间， 而这不利于手机向更薄、 更小 的方向发展。
二、 在某些手机的音腔设计中， 通路会跨越手机后壳与电池盖， 或手 机后壳与手机前壳。 而手机的两壳间会存在间隙， 此间隙是加工过程中无 法避免的， 这会导致音腔密封不严， 出现通话嘯叫。
如何在达到良好的通话效果的同时保证手机更灵活小巧， 就成为了普 遍关注并亟待解决的问题。 发明内容
本实用新型实施例提供一种 PCB及包括所述 PCB的移动终端、用于在 满足终端造型灵活小巧的前提下， 保证较好的音腔效果。 一种印刷电路板 PCB, 包括功能主体， 包括： 位于所述 PCB上的第一 通孔； 以及
位于所述 PCB—侧的传声器 ,位于所述 PCB另一侧与所述传声器位置 相对的密闭金属罩体；
所述传声器上的出音孔与所述第一通孔相通。
一种移动终端， 包括终端外壳， 还包括所述 PCB, 其中， 所述终端外 壳上开有第三通孔； 所述金属罩体上开有第二通孔， 所述第二通孔与所述 第三通孔相通。
本实用新型实施例中 PCB包括： 功能主体，还包括位于所述 PCB上的 第一通孔； 以及位于所述 PCB—侧的传声器，位于所述 PCB另一侧与所述 传声器位置相对的密闭金属罩体； 所述传声器上的出音孔与所述第一通孔 相通。 本实用新型实施例中金属罩体密闭， 使金属罩体、 第一通孔及出音 孔构成的音腔密闭性能较好， 避免出现通话嘯叫。 同时通过将金属罩体做 薄， 尽量优化音腔通路， 避免通话声音过小。 附图说明
图 1为本实用新型实施例中 PCB的主要结构图；
图 2为本实用新型实施例中移动终端的详细结构图。 具体实施方式
本实用新型实施例中 PCB包括： 功能主体，还包括位于所述 PCB上的 第一通孔； 以及位于所述 PCB—侧的传声器，位于所述 PCB另一侧与所述 传声器位置相对的密闭金属罩体； 所述传声器上的出音孔与所述第一通孔 相通。 本实用新型实施例中金属罩体密闭， 使金属罩体、 第一通孔及出音 孔构成的音腔密闭性能较好， 避免出现通话嘯叫。 同时通过将金属罩体做 薄， 尽量优化音腔通路， 避免通话声音过小。 参见图 1 , 本实用新型实施例中的 PCB (印刷电路板） 包括功能主体， 该功能主体可以用于通信， 特别是用于通信过程中的通话功能， 还包括传 声器 1021及金属罩体 1022。 所述 PCB上开有第一通孔。
传声器 1021位于 PCB上， 本实用新型实施例中 PCB可以位于移动终 端的键帽下。 传声器 1021 固定在 PCB上， 固定方式可以是焊接。 在 PCB 上有第一通孔， 例如， 可以利用打孔机在 PCB上开第一通孔， 一个 PCB上 可以有一个第一通孔，位于 PCB的边缘部分， 即位于终端键盘的边缘部分。 需要注意的是， 最好不要将第一通孔设置在几个按键之间， 这样可能会影 响终端键盘的正常使用。 第一通孔的高度与 PCB的高度相同， 即使第一通 孔贯通 PCB。 传声器 1021上的出音孔需与 PCB上的第一通孔相通， 以构 成声音通路。 传声器 1021上的出音孔的高度低于传声器 1021的总高度， 即该出音孔没有贯通传声器 1021 , 保证了空间的密闭性。 具体的， 出音孔 的厚度（或称为宽度） 小于第一通孔， 需使第一通孔将出音孔的出口表面 包覆在内。
金属罩体 1022位于 PCB另一侧，可以将金属罩体 1022与传声器 1021 相对固定在 PCB的两侧， 使金属罩体 1022将 PCB的第一通孔的出口表面 包覆在内。 具体的， 本实用新型实施例中固定方式可以是焊接。 金属罩体 1022可以为将金属或金属合金材料拉伸制成，所述金属罩体 1022为中空的 罩体，其形状可以为圆形或方形，可以将其通过表面贴装技术（ SMT, Surface Mounted Technology )焊接工艺焊接在 PCB上， 相当于通过连续的焊接线 与 PCB紧密贴合， 以避免出现缝隙而影响音腔密闭性。 由于金属或金属合 金材料可制作得较薄， 金属罩体 1022的高度可以控制在一定范围之内， 例 如该范围可以是 0.6mm至 1mm, 而音腔通路的长度一般在 0.8mm较为合 适（此处指的是金属罩体 1022的高度与第一通孔的高度之和）， 其取值范 围可以是 0.8mm至 1.3mm,通过控制金属罩体 1022的高度就可以控制音腔 通路的长度， 这样既保证合适的音腔通路， 又不影响键盘的正常使用。 金 属罩体 1022上（图 2中为左上端）开有第二通孔， 该第二通孔与终端外壳 上的第三通孔相接， 在两者的结合面上可以贴有泡棉（图 2 中虚线所示部 分）， 以保证金属罩体 1022与终端外壳 1023之间的密闭性。 而声音是可以 通过泡棉进行传输的， 因此泡棉不会阻碍声音的传输。 该第二通孔的位置 可随着金属罩体 1022的形状或终端外壳上第三通孔的位置在不影响本实用 新型的技术方案的前提下做相应变化。 较佳的， 该第二通孔的厚度（或称 为宽度）可以与终端外壳上的第三通孔的厚度相同， 以使第二通孔与第三 通孔完全拼接。
金属罩体 1022可以是通过将金属或金属合金进行拉伸制造而成， 所述 金属可以是洋白铜、 磷铜、 铍铜等延展性较好的金属或金属合金。 金属罩 体 1022的厚度（此处指金属或金属合金的厚度， 不包括中间的空腔部分） 最好不超过 0.3mm, 较佳的， 可以将金属罩体 1022的厚度制作为 0.2mm。 通过将金属罩体 1022做薄， 在不影响键盘正常使用的前提下保证了金属罩 体的高度及音腔通路的长度， 同时金属罩体 1022的轮廓与 PCB紧密贴合， 保证了音腔的密闭性。 节省了手机内部空间， 可以有效保证手机向更轻、 更薄、 更小巧的方向发展。
参见图 2, 本实用新型实施例还提供一种移动终端， 该移动终端包括终 端外壳 1023 , 还包括所述 PCB。 具体的， 本实用新型实施例中所述终端可 以是手机。
终端外壳 1023位于手机键盘边缘， 终端外壳 1023上开有第三通孔， 该第三通孔与金属罩体 1022上的第二通孔相接， 在两者的结合面上可以贴 有泡棉， 以保证金属罩体 1022与终端外壳 1023之间的密闭性。 而声音是 可以通过泡棉进行传输的， 因此泡棉不会阻碍声音的传输。 较佳的， 终端 外壳 1023为终端的前壳。 出音孔、 第一通孔、 金属罩体 1022、 第二通孔及 第三通孔构成了音腔通路。
其中， PCB可以位于移动终端的键帽下方。 PCB包括第一通孔，即 PCB 上开有第一通孔， 该第一通孔可以有一个， 位于 PCB的边缘位置， 即位于 手机键盘的边缘位置。则传声器 1021也位于 PCB的边缘位置。第一通孔的 高度与 PCB的高度相同，即第一通孔贯通了 PCB。该第一通孔与传声器 1021 的出音孔相通， 且该第一通孔的出口表面被金属罩体 1022包覆在内， 出音 孔、 第一通孔与金属罩体 1022构成了音腔腔体。
本实用新型实施例中 PCB包括： 功能主体，还包括位于所述 PCB上的 第一通孔； 以及位于所述 PCB—侧的传声器，位于所述 PCB另一侧与所述 传声器位置相对的密闭金属罩体； 所述传声器上的出音孔与所述第一通孔 相通。 金属罩体 1022与 PCB紧密贴合， 且金属罩体 1022将第一通孔的出 口表面完全包覆在内， 第一通孔将出音孔的出口表面完全包覆在内， 第二 通孔与第三通孔的结合面可以放置泡棉， 保证金属罩体 1022相对于终端外 壳 1023的密闭性， 使出音孔、 第一通孔及金属罩体 1022构成的音腔密闭 性能较好， 避免出现通话嘯叫。 同时， 金属罩体 1022可以使用延展性较好 的金属或金属合金制成， 可以尽量做薄， 通过调节金属罩体 1022的高度来 调整音腔通路的长度， 以保证音腔通路的长度较为理想。 使出音孔、 第一 通孔、 金属罩体 1022、 第二通孔及第三通孔构成的音腔通路较为理想， 避 免声音太小。同时本实用新型实施例中所述 PCB位于移动终端的键帽下方， 所述传声器位于所述 PCB上， 无需在终端内部设置专门的音腔区域， 节省 终端内部空间， 有利于终端向更轻薄、 更小巧的方向发展。
显然， 本领域的技术人员可以对本实用新型进行各种改动和变型而不 脱离本实用新型的精神和范围。 这样， 倘若本实用新型的这些修改和变型 属于本实用新型权利要求及其等同技术的范围之内， 则本实用新型也意图 包含这些改动和变型在内。 工业实用性
通过在所述 PCB—侧设置与所述传声器位置相对的密闭金属罩体， 使 金属罩体、 第一通孔及出音孔构成的音腔密闭性能较好， 避免出现通话嘯 叫。 同时通过将金属罩体做薄， 尽量优化音腔通路， 避免通话声音过小。

Claims

权利要求书
1、 一种印刷电路板 PCB, 包括功能主体， 其中， 包括： 位于所述 PCB 上的第一通孔； 以及
位于所述 PCB—侧的传声器 ,位于所述 PCB另一侧与所述传声器位置 相对的密闭金属罩体；
所述传声器上的出音孔与所述第一通孔相通。
2、 根据权利要求 1所述的 PCB, 其中， 所述传声器固定在所述 PCB 一侧的边缘位置。
3、 根据权利要求 2所述的 PCB, 其中， 所述固定方式为焊接。
4、 根据权利要求 1所述的 PCB, 其中， 所述金属罩体固定在所述 PCB 另一侧与所述传声器位置相对的位置。
5、 根据权利要求 4所述的 PCB, 其中， 所述固定方式为焊接。
6、 根据权利要求 1 所述的 PCB, 其中， 所述第一通孔的高度与所述 PCB的高度相同。
7、 根据权利要求 1所述的 PCB, 其中， 所述第一通孔将所述出音孔的 出口表面包覆在内。
8、 根据权利要求 1所述的 PCB, 其中， 所述金属罩体将所述第一通孔 的出口表面包覆在内。
9、 根据权利要求 1 所述的 PCB, 其中， 所述金属罩体的厚度不大于 0.3mm。
10、 根据权利要求 1所述的 PCB, 其中， 所述金属罩体的高度的范围 为 0.6mm至 lmm。
11、 根据权利要求 1所述的 PCB, 其中， 所述金属罩体及所述第一通 孔的高度之和的范围为 0.8mm至 1.3mm。
12、 一种移动终端， 包括终端外壳， 其中， 还包括如权利要求 1 至 8 任一所述的 PCB, 其中， 所述终端外壳上开有第三通孔； 所述金属罩体上 开有第二通孔， 所述第二通孔与所述第三通孔相通。
13、 根据权利要求 12所述的终端， 其中， 所述第二通孔与第三通孔的 结合面置有泡棉。
14、 根据权利要求 12所述的终端， 其中， 所述终端还包括键帽， 所述
PCB位于所述键帽下方。
PCT/CN2012/074401 2011-04-26 2012-04-19 一种pcb及包括所述pcb的移动终端 WO2012146147A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018082439A1 (zh) * 2016-11-04 2018-05-11 惠州Tcl移动通信有限公司 一种隐藏式麦克风出音结构及窄边框移动终端

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202094955U (zh) * 2011-04-26 2011-12-28 中兴通讯股份有限公司 一种pcb及包括所述pcb的移动终端
CN107911963B (zh) * 2017-10-27 2021-07-13 Oppo广东移动通信有限公司 电子设备的壳体组件及电子设备
CN109618251A (zh) * 2018-10-24 2019-04-12 通力电梯有限公司 具有增加声压级别的结构和具有该结构的声音指示器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201114237Y (zh) * 2007-09-24 2008-09-10 中兴通讯股份有限公司 一种手机音腔结构
CN201123121Y (zh) * 2007-11-28 2008-09-24 中兴通讯股份有限公司 一种用于移动终端的扬声器音腔及移动终端
CN202094955U (zh) * 2011-04-26 2011-12-28 中兴通讯股份有限公司 一种pcb及包括所述pcb的移动终端

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201114237Y (zh) * 2007-09-24 2008-09-10 中兴通讯股份有限公司 一种手机音腔结构
CN201123121Y (zh) * 2007-11-28 2008-09-24 中兴通讯股份有限公司 一种用于移动终端的扬声器音腔及移动终端
CN202094955U (zh) * 2011-04-26 2011-12-28 中兴通讯股份有限公司 一种pcb及包括所述pcb的移动终端

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018082439A1 (zh) * 2016-11-04 2018-05-11 惠州Tcl移动通信有限公司 一种隐藏式麦克风出音结构及窄边框移动终端

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