WO2012139358A1 - 一种led灯泡 - Google Patents

一种led灯泡 Download PDF

Info

Publication number
WO2012139358A1
WO2012139358A1 PCT/CN2011/079749 CN2011079749W WO2012139358A1 WO 2012139358 A1 WO2012139358 A1 WO 2012139358A1 CN 2011079749 W CN2011079749 W CN 2011079749W WO 2012139358 A1 WO2012139358 A1 WO 2012139358A1
Authority
WO
WIPO (PCT)
Prior art keywords
opening
heat sink
bulb
fin
led light
Prior art date
Application number
PCT/CN2011/079749
Other languages
English (en)
French (fr)
Inventor
余鹭帆
吴忠成
王宏
Original Assignee
厦门阳光恩耐照明有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 厦门阳光恩耐照明有限公司 filed Critical 厦门阳光恩耐照明有限公司
Priority to DE112011105046.1T priority Critical patent/DE112011105046B4/de
Priority to US14/006,128 priority patent/US8866368B2/en
Publication of WO2012139358A1 publication Critical patent/WO2012139358A1/zh

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device, in particular to a conventional incandescent light bulb with LED as a light source.
  • LED is made of electroluminescent semiconductor material and has excellent characteristics such as low voltage, high efficiency, good monochromaticity, strong applicability, good stability, short response time, long life and no pollution to the environment.
  • LED bulb based on LED chips came into being.
  • An important difference between this kind of LED bulb and traditional incandescent bulb is that the illuminator in the bulb is replaced by LED chip.
  • LED chip As the LED bulb market is becoming smaller, this makes the junction temperature and temperature problem of the small-volume LED bulb chip more prominent. If the junction temperature of the LED chip is not solved well, it will inevitably affect the miniaturization. Promotion of the use of LED bulbs.
  • the object of the present invention is to overcome the deficiencies of the prior art and provide an LED light bulb.
  • the junction temperature and heat dissipation problem of the LED light bulb chip can be better solved, and the existing LED light bulb is excellent.
  • the characteristics, and the good heat dissipation, can effectively promote the promotion of miniaturized LED bulbs.
  • an LED bulb comprising a bulb, at least two fins, an LED chip, a circuit board for driving the LED chip, a lamp holder and a lamp cap; an upper part of the lamp cap and the lamp holder Connected, the circuit board is installed in the lamp holder, and the bottom of the bulb is connected with the upper part of the lamp holder; each heat sink comprises: an upper heat sink and a lower heat sink;
  • Each of the fins is circumferentially mounted around the lamp axis, and the heat sink is received in the bulb, and the outer side of the upper fin is respectively fixed with the LED chip;
  • each fin encloses an air cavity along the axial direction of the bulb, and the lower fin is provided with a first opening; the sidewall of the socket is uniformly provided with a second opening, and the first opening and phase of each fin Corresponding second opening is connected; a third opening is arranged at a top end of the bulb; the first opening, the second opening and the third opening are all connected with the air cavity, and the air cavity passes through the three openings to form a convective air flowing up and down .
  • the heat sink comprises a heat sink with a recess facing away from the bulb axis and a lower heat sink facing the bulb axis, and the upper heat sink and the lower heat sink are integrally bent and connected to form a joint portion, and the LED chip is solid. Connected to the recess of the upper fin, the lower fin is connected to the socket.
  • the lower heat sink is gradually inclined from the upper end to the lower end toward the axial direction of the bulb, and the lower heat sink is provided with one side opening; and the inner side of the lower heat sink is integrally provided with the inner piece, the bottom end of the inner piece and the lower heat sink
  • the bottom end of the inner side surface is integrally connected, and the top end of the inner sheet and the inner side surface of the lower fin enclose an upper opening communicating with the side opening of the lower fin; the first opening of the fin includes the upper opening and Side opening.
  • the lamp holder comprises a lamp holder main body and an isolation cover, wherein the lamp holder main body is provided with a cylindrical circuit board fixing cover and a heat sink mounting portion surrounding the outer cover of the circuit board fixing cover, and the upper end of the isolation cover and the circuit board fixing cover
  • the heat sink mounting portion is gradually inclined from the upper end to the lower end toward the bulb axis, and the second opening of the socket is disposed in the heat sink mounting portion, and one side slot is respectively disposed on two sides of the second opening. The two side ends of the lower heat sink are respectively inserted into the side slots of the corresponding second openings.
  • the bottom end of the second opening is provided with a bottom slot, and the bottom end of the lower heat sink is inserted into the bottom slot of the corresponding second opening.
  • the isolation cover is further provided with a connecting column which is gradually inclined outward, and a jack is arranged at the step of each heat sink, and the jack at the step of the heat sink is inserted into the corresponding connecting post on the isolation cover.
  • each of the connecting posts is respectively provided with a wire hole through which the wires of the circuit board mounted in the fixing plate of the circuit board are passed.
  • the third opening is provided with an opening edge facing the inside of the cover, and the top end of the inner side surface of the heat sink abuts the corresponding opening edge.
  • the first opening of the lower fin of the heat sink is a set of parallel arranged slots, and the lower fin is connected to the socket, and the slot communicates with the corresponding second opening on the socket.
  • the lower heat sink of the heat sink and the joint portion are provided with a transverse slit from the outer side to form a first opening; the lower heat sink is connected with the lamp socket, and the slit is corresponding to the socket The two openings are connected.
  • the first opening of the lower fin of the heat sink is a set of small holes.
  • the bulb comprises an upper bulb and a lower bulb, and a third opening is formed in the middle portion.
  • the third opening on the bulb may be a hole, or a group of holes, or a group of slots.
  • the invention has the beneficial effects that the heat sink is mounted on the lamp holder circumferentially around the bulb axis and is accommodated in the bulb, and the inner side surface of the fin encloses an air chamber along the axis of the bulb.
  • the outer side of the heat sink is respectively fixed with an LED chip; the bottom of the heat sink is respectively provided with a downward first opening, and the sidewall of the lamp holder is evenly provided with a second opening, and the bottom of the heat sink is respectively mounted on the light a second opening of the seat and the first opening of the heat sink are exposed in the corresponding second opening; a third opening is formed at the top end of the bubble, and the top end of the heat sink respectively abuts the inner side of the third opening, the third opening Connected to the air chamber.
  • the heat dissipation structure of the bulb can bring the following advantages:
  • the heat sink body extends from the top end of the bulb to the lamp head to facilitate heat conduction and heat dissipation;
  • the back surface of the heat sink forms a bare space that can convect with the outside air, and forms up and down convection, which has a good convection effect and forms a chimney effect;
  • the LED light source is attached to the heat sink to help dissipate heat, and the circumstance of the bulb is uniform.
  • Figure 1 is a front elevational view of Embodiment 1 of the present invention.
  • Figure 2 is a plan view of Embodiment 1 of the present invention.
  • Figure 3 is a bottom plan view of Embodiment 1 of the present invention.
  • Figure 4 is a schematic exploded perspective view of a first embodiment of the present invention.
  • FIG. 5 is a schematic structural view of a heat sink according to Embodiment 1 of the present invention.
  • FIG. 6 is a cross-sectional view showing Embodiment 1 of the present invention.
  • Figure 7 is a schematic exploded perspective view of a second embodiment of the present invention.
  • Figure 8 is a schematic exploded perspective view of a third embodiment of the present invention.
  • Figure 9 is a schematic structural view of a heat sink according to Embodiment 4 of the present invention.
  • Figure 10 is a schematic structural view of a heat sink according to Embodiment 5 of the present invention.
  • Figure 11 is a front elevational view of Figure 10;
  • Figure 12 is a schematic structural view of a heat sink according to Embodiment 6 of the present invention.
  • Figure 13 is a schematic exploded perspective view of a seventh embodiment of the present invention.
  • an LED bulb of the present invention includes a bulb 1, three fins 2, an LED chip 3, and a circuit board for driving the LED chip (not shown in the drawing) ), the lamp holder 5 and the lamp cap 4; the upper portion of the lamp cap 4 is connected to the lamp holder 5 (the manner in which the lamp cap is below is described below, and vice versa when the lamp cap is on), for example, a screwing can be fixed, etc.;
  • the plate is mounted in the socket 5, and the bottom of the bulb 1 is connected to the upper portion of the socket 5;
  • the fin 2 is circumferentially mounted around the bulb axis on the socket 5 and partially housed in the bulb 1, three pieces of heat dissipation
  • the inner side of the sheet 2 encloses an air cavity around the axis of the bulb; the outer side of the fin is respectively fixed to the LED chip 3; and the bottom of the fin 2 is respectively provided with a downward first opening 20, the base of the lamp holder 5
  • the second side opening 50 is evenly disposed on the
  • the heat sink 2 includes an upper fin 21 with a recess facing away from the bulb axis and a lower fin 22 facing the bulb axis.
  • the upper fin 21 and the lower fin 22 are integrally bent and connected to form a step.
  • the LED chip 3 is fixed in the recess of the upper fin 21, and the lower fin 22 is connected to the socket 5.
  • the lower fin 22 is gradually inclined from the upper end to the lower end toward the axis of the bulb, and the lower fin is provided with one side opening 221; and the inner side of the lower fin is integrally provided with an inner piece 222, and the bottom end of the inner piece 222 is The bottom end of the inner side surface of the lower heat sink 22 is integrally connected, and the top end of the inner piece 222 and the inner side surface of the lower heat sink enclose an upper opening 223 communicating with the side opening of the lower heat sink;
  • An opening 20 includes the upper opening 223 and the side opening 221.
  • the socket 5 includes a socket body 51 and a spacer cover 52.
  • the socket body 51 is provided with a cylindrical circuit board fixing cover 511 and a heat sink mounting portion 512 surrounding the circuit board fixing cover.
  • the isolation cover 52 is provided. Connected to the upper end of the circuit board fixing cover 511; the heat sink mounting portion 512 is gradually inclined from the upper end to the lower end toward the bulb axis, and the second opening 50 of the socket is disposed in the heat sink mounting portion 512, in the second A side slot 501 is defined on each side of the opening 50, and two side ends of the lower heat sink 22 are respectively inserted into the side slots 501 of the corresponding second opening.
  • the bottom end of the second opening is provided with a bottom slot, and the bottom end of the lower heat sink 22 is inserted into the bottom slot of the corresponding second opening.
  • the isolation cover 52 is further provided with a connecting column 521 which is gradually inclined outward.
  • a socket 231 is arranged at the step of each heat sink, and the corresponding connection between the socket 231 at the step of the heat sink and the isolation cover is provided.
  • the positions of the pillars 521 correspond to each other, and each of the connecting posts 521 is respectively provided with a wire hole 522 through which a wire of a circuit board mounted in the circuit board fixing cover is passed.
  • the third opening 10 is provided with an opening edge 11 facing the inside of the cover, and the top end of the inner side surface of the heat sink 2 abuts against the corresponding opening edge 11 .
  • An LED light bulb of the present invention comprises at least two mutually independent heat sinks 2 to form a heat dissipation structure.
  • the heat sink 2 is circumferentially mounted on the lamp holder 5 along the circumferential direction of the lamp axis and housed in the bulb 1 for heat dissipation.
  • the sheet 2 extends from the top end of the bulb 1 to the base 4, and the inner side of the fin 2 encloses an air chamber along the axis of the bulb.
  • the outer side of the fin 2 is fixed to the LED chip 3 and extends to the lower half of the bulb.
  • a through hole is disposed in the fin 2 at the bent portion, that is, a downward first opening 20 is respectively disposed at a bottom of the heat sink, and a second opening 50 is uniformly disposed on the sidewall of the socket, and the bottom of the heat sink 2 is respectively Correspondingly, the first opening 20 of the heat sink is exposed in the second opening 50 of the socket, so that the first opening 20 of the heat sink is completely open to the outside of the bulb.
  • the top end of the bulb 1 also has an opening 10, that is, a third opening 10 is formed at the top end of the bulb, and the top end of the fin 2 respectively abuts against the inside of the third opening 10, and the third opening 10 is connected to the air chamber.
  • the back surface of the heat sink 2 attached to the light source is exposed to the air, and the apex 10 of the blister 1 forms a convection with the through hole 20 of the heat sink, and the convection air is circulated up and down (as shown in FIG.
  • the outer side of the heat sink 2 is covered with a bulb 1 , and the bottom end of the bulb 1 is connected to the socket 5 , such as a snapping manner; thus, the LED chip fixed on the outer side surface of the heat sink 2 3 is enclosed between the bulb 1 and the fin 2 to realize the function of the light source.
  • Embodiment 2 is a specific embodiment of an LED bulb, and Embodiment 2 is mainly different from Embodiment 1 in that: 1.
  • the bulb 1a includes a slide 13a and a lower bulb. 12a, a third opening 10a is opened in the center of the slide 13a, and the slide 13a is mounted on the upper portion of the lower bulb 12a;
  • 2 the heat sink 2a includes an upper fin 21a, a lower fin 22a, an upper fin 21a and a lower fin
  • Between 22a is a joint portion 23a, and a first opening 20a is opened in the lower fin 22a.
  • the joint portion 23a extends obliquely upward in the horizontal direction to form a slope portion 25a.
  • the ramp section 25a extends upward to form a vertical section 24a; the ramp section 25a can mount the LED chip 3.
  • An LED bulb comprises a bulb 1a, three fins 2a, an LED chip 3, a circuit board for driving the LED chip, a lamp holder 5 and a lamp cap 4; an upper portion of the lamp cap 4 is connected to the lamp holder 5;
  • the bottom of the bulb 1 is connected to the upper portion of the socket 5;
  • the fin 2 is circumferentially mounted around the bulb axis on the socket 5 and partially housed in the bulb 1, three fins 2a
  • the inner side surface encloses an air cavity around the axis of the bulb;
  • the outer side of the heat sink is respectively fixed to the LED chip 3; the bottom of the heat sink 2a is respectively provided with a downward first opening 20a, and the sidewall of the socket 5 is evenly provided with a second opening 50, and the bottom of the heat sink 2 corresponds to the bottom Mounted in the second opening 50 of the socket and the first opening 20 of the heat sink is exposed in the corresponding second opening 50 to communicate with the air cavity; a third opening 10a is provided at the top end of the bulb 1a for heat dissipation The top end of the piece 2a is respectively abutted inside the third opening 10a, and the third opening 10a is connected to the air cavity; The air chamber enclosed by the inner sides of the three fins passes through three openings to form convective air flowing up and down.
  • Embodiment 3 is a specific embodiment of an LED bulb.
  • the main difference between Embodiment 3 and Embodiment 1 is: 1. Heat sink 2b structure; 2. Structure of lamp holder 5b.
  • An LED bulb of the present invention comprises a bulb 1b, three fins 2b, an LED chip 3, a circuit board for driving the LED chip, a lamp holder 5b and a lamp cap 4; an upper portion of the lamp cap 4 is connected to the lamp holder 5b;
  • the circuit board is mounted in the socket 5b, and the bottom of the bulb 1b is connected to the upper portion of the socket 5b;
  • the fin 2b is circumferentially mounted around the bulb axis on the socket 5b and partially housed in the bulb 1b, three pieces
  • the inner side surface of the heat sink 2b encloses an air cavity around the axis of the bulb; the outer side of the heat sink is fixed to the LED chip 3, respectively.
  • the heat sink 2b includes an upper heat sink 21b and a lower heat sink 22b.
  • the upper heat sink 21b and the lower heat sink 22b are a joint portion 23b, and the joint between the lower heat sink and the joint portion is provided with a transverse slit 24b from the outside to the inside.
  • the first opening 20b is formed; the lower fins are bent on both sides of the lower fins 24b into two fins 25b.
  • the socket 5b includes a socket body 51b and a spacer cover 52b.
  • the socket body 51 includes a circuit board fixing cylinder 511b, a heat sink mounting portion 512b, a fixing ring 513b, and a connecting rib 514b.
  • the fixing ring 513b is disposed at the upper end of the fixed cylinder 511b.
  • the outer periphery is connected to the fixed cylinder 511b via three connecting ribs 514b.
  • the fin mounting portion 512b is disposed around the fixed cylinder 511b, and the top portion thereof is fixedly connected to the connecting rib 514b to form a second opening 50b.
  • the isolation cover 52b is connected to the upper end of the circuit board fixing cylinder 511b; the end portions of the two side fins 25b of the lower heat sink 22 are respectively inserted into the corresponding second opening mounting portions 512b, and the upper heat dissipation fins 21b are fastened through the fixing ring 513b.
  • the lower bulb 13b is mounted on the fixing ring 513b, and the upper bulb 12b is mounted thereon.
  • the top of the upper fin 21b abuts against the inner side of the upper bulb 12b; the upper bulb 12b has a third opening 10b.
  • the heat sink 2c includes an upper heat sink 21c, a lower heat sink 22c, and between the upper heat sink 21c and the lower heat sink 22c.
  • a plurality of grooves are vertically parallel formed on the lower fins 22 to form the first opening 20b.
  • the grooves may also be arranged laterally or diagonally.
  • the heat sink 2d includes an upper heat sink 21d, a lower heat sink 22d, an upper heat sink 21d and a lower heat sink 22d. Between the joint portion 23d, a first opening 20d is opened in the lower fin 22d.
  • the upper fin 21d includes a vertical section 25d and a slope section 24d.
  • the lower end of the vertical section 25d is a joint portion 23d, and the upper end of the vertical section 25d extends obliquely upward to form a sloped section 24d; the vertical section 25d and the sloped section 24d can be mounted with the LED chip 3.
  • Embodiment 6 of the present invention is a specific embodiment of an LED bulb heat sink according to the present invention.
  • the heat sink 2e includes an upper heat sink 21e and a lower heat sink 22e.
  • the upper heat sink 21e and the lower heat sink 22e are combined.
  • the portion 23e has a small circular hole formed in the lower fin 22e to form the first opening 20e.
  • the small round holes may be geometric shapes such as triangular holes and five-star holes.
  • Embodiment 7 is a specific embodiment of an LED bulb.
  • the main difference between Embodiment 7 and Embodiment 1 is that the fins 2f are two.
  • An LED bulb comprises a bulb, two fins 2f, an LED chip 3, a circuit board for driving the LED chip, a lamp holder 5 and a lamp cap 4; an upper portion of the lamp cap 4 is connected to the lamp holder 5;
  • the bottom of the bulb 1 is connected to the upper portion of the socket 5;
  • the fin 2f is circumferentially mounted around the bulb axis on the socket 5 and partially housed in the bulb 1, two fins 2f
  • the inner side surface encloses an air cavity around the axis of the bulb;
  • the outer side of the heat sink is respectively fixed to the LED chip 3; the bottom of the heat sink 2f is respectively provided with a downward first opening 20f, and the sidewall of the socket 5 is evenly provided with a second opening 50, and the bottom of the heat sink 2f is respectively corresponding to Installed in the second opening 50 of the socket and expose the first opening 20 of the heat sink in the corresponding second opening 50 to communicate with the air cavity; a third opening 10f is provided at the top end of the bulb 1 to dissipate heat The top end of the piece 2f is respectively abutted inside the third opening 10f, and the third opening 10f is connected to the air cavity; The air chamber enclosed by the inner sides of the three fins passes through three openings to form convective air flowing up and down.
  • the LED bulb of the invention can better solve the problem of junction temperature and heat dissipation of the LED bulb chip, not only maintains the excellent characteristics of the existing LED bulb, but also can achieve good heat dissipation, thereby effectively promoting the miniaturization of the LED bulb. Promote use.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

一种LED灯泡 技术领域
本发明涉及一种照明设备,特别是涉及一种以LED为光源的仿传统白炽灯泡。
背景技术
LED是一种采用电致发光的半导体材料制作而成的,具有电压低、效能高、单色性好、适用性强、稳定性好、响应时间短、寿命长、不污染环境等优良特性;被广泛地应用于照明、装饰等领域中,一种基于LED芯片的LED灯泡便应运而生,该种LED灯泡与传统白炽灯泡的一个重要区别点是将灯泡内的发光体由LED芯片替代。随着LED灯泡市场向小型化发展,这就使得小体积的LED灯泡芯片的结温散热问题愈显突出,如果,LED芯片的结温散热问题无法得到较好的解决,势必会影响到小型化LED灯泡的推广使用。
发明内容
本发明的目的在于克服现有技术之不足,提供一种LED灯泡,通过对LED灯泡结构的改进,从而能够较好地解决LED灯泡芯片的结温散热问题,既保持了现有LED灯泡的优良特性,又能够很好地实现散热,从而有力地促进了小型化LED灯泡的推广使用。
本发明解决其技术问题所采用的技术方案是:一种LED灯泡,包括泡壳、至少两片散热片、LED芯片、驱动LED芯片工作的电路板、灯座和灯头;灯头的上部与灯座相连接,电路板安装在灯座中,泡壳的底部与灯座的上部相连接;各散热片均包括:一上散热片和一下散热片;
各散热片围绕灯泡轴线的周向环绕安装在灯座上,其上散热片容纳在泡壳内,上散热片的外侧面分别固接有LED芯片;
各散热片的内侧面围成一沿着灯泡轴线方向的气腔体,其下散热片设有第一开口;灯座的侧壁均匀设有第二开口,各散热片的第一开口与相对应的第二开口连通;在泡壳的顶端设有一第三开口;第一开口、第二开口、第三开口均与气腔体连通,气腔体通过三个开口,形成上下流通的对流空气。
所述的散热片包括凹口背向灯泡轴线的上散热片和凹口朝向灯泡轴线的下散热片,上散热片与下散热片之间一体弯折相连接并形成一结合部,LED芯片固接在上散热片的凹口中,下散热片与灯座相连接。
所述的下散热片由上端至下端呈渐次向灯泡轴线方向倾斜,该下散热片中设有一侧开口;在下散热片的内侧还一体设有内片,内片的底端与下散热片的内侧面的底端一体相连接,内片的顶端与下散热片的内侧面围成一与下散热片的侧开口相连通的上开口;所述的散热片的第一开口包括该上开口和侧开口。
所述的灯座包括灯座主体和隔离盖,灯座主体中设有筒形的电路板固定盖和环绕在该电路板固定盖外侧的散热片安装部,隔离盖与电路板固定盖的上端相连接;该散热片安装部由上端至下端呈渐次向灯泡轴线方向倾斜,所述灯座的第二开口设在散热片安装部中,在第二开口的两侧分别设有一侧插槽,所述下散热片的两侧端分别插接在对应的第二开口的侧插槽中。
所述的第二开口的底端设有一底插槽,所述下散热片的底端插接在对应的第二开口的底插槽中。
所述的隔离盖向上还设有渐次向外倾斜的连接柱,在每一个散热片的台阶处设有一个插孔,散热片的台阶处的插孔与隔离盖上对应的连接柱插接相配合;每一个连接柱分别设有能够让电路板固定盖内安装的电路板的导线穿出的导线孔。
所述的第三开口设有朝向罩内的开口沿,所述散热片的内侧面的顶端抵于对应的开口沿处。
所述的散热片的下散热片第一开口为一组平行排列的槽孔,下散热片与灯座相连接,其槽孔与灯座上相对应的第二开口连通。
所述的散热片的下散热片与结合部连接处设有由外向内设有横切槽,形成第一开口;下散热片与灯座相连接,其切槽与灯座上相对应的第二开口连通。
所述的散热片的下散热片第一开口为一组小孔。
所述的泡壳包括一上泡壳、一下泡壳,其中部开有一第三开口。
所述的泡壳上的第三开口可以是一个孔,也可以一组孔、或一组槽孔。
本发明的有益效果是,由于采用了将散热片沿着灯泡轴线的周向环绕安装在灯座上并容纳在泡壳内,且散热片的内侧面围成一沿着灯泡轴线方向的气腔体;散热片的外侧面分别固接一LED芯片;在散热片的底部分别设有一向下的第一开口,灯座的侧壁均匀设有第二开口,散热片的底部分别对应安装在灯座的第二开口中并使散热片的第一开口显露在对应的第二开口中;在泡壳的顶端设有一第三开口,散热片的顶端分别抵在第三开口内侧,该第三开口与气腔体相连接通。该灯泡的散热结构可以带来如下的优点:
一是,散热片体由泡壳顶端一直延伸到灯头处,有助于导热散热;
二是,散热片背面组成能与外部空气对流的裸露空间,且形成上下对流,具有较好的对流效果,形成一烟囱效应;
三是,LED光源立贴于散热片上,有助于散热,且灯泡圆周散光均匀。
以下结合附图及实施例对本发明作进一步详细说明;但本发明的一种LED灯泡不局限于实施例。
附图说明
图1是本发明实施例1的主视图;
图2是本发明实施例1的俯视图;
图3是本发明实施例1的仰视图;
图4是本发明实施例1的立体构造分解示意图;
图5是本发明实施例1的散热片的构造示意图;
图6是本发明实施例1的剖视图;
图7是本发明实施例2的立体构造分解示意图;
图8是本发明实施例3的立体构造分解示意图;
图9是本发明实施例4的散热片的构造示意图;
图10是本发明实施例5的散热片的构造示意图;
图11是图10的正面视图;
图12是本发明实施例6的散热片的构造示意图;
图13是本发明实施例7的立体构造分解示意图;
具体实施方式
实施例1,参见附图1-6所示,本发明的一种LED灯泡,包括一泡壳1、三片散热片2、LED芯片3、驱动LED芯片工作的电路板(图中未示出)、灯座5和灯头4;灯头4的上部与灯座5相连接(以下所描述的是灯头在下的方式,灯头在上时,则反之),比如可以采用旋接可固定等方式;电路板安装在灯座5中,泡壳1的底部与灯座5的上部相连接;散热片2围绕灯泡轴线的周向环绕安装在灯座5上并部分容纳在泡壳1内,三片散热片2的内侧面围成一围绕灯泡轴线方向的气腔体;散热片的外侧面分别固接LED芯片3;在散热片2的底部分别设有一向下的第一开口20,灯座5的侧壁均匀设有第二开口50,散热片2的底部分别对应安装在灯座的第二开口50中并使散热片的第一开口20显露在对应的第二开口50中,与气腔体相连通;在泡壳1的顶端设有一第三开口10,散热片2的顶端分别抵在第三开口10内侧,该第三开口10与气腔体相连接通; 三片散热片内侧面围成的气腔体通过三个开口,形成上下流通的对流空气。
所述的散热片2包括凹口背向灯泡轴线的上散热片21和凹口朝向灯泡轴线的下散热片22,上散热片21与下散热片22之间一体弯折相连接并形成一台阶23,LED芯片3固接在上散热片21的凹口中,下散热片22与灯座5相连接。
所述的下散热片22由上端至下端呈渐次向灯泡轴线方向倾斜,该下散热片中设有一侧开口221;在下散热片的内侧还一体设有内片222,内片222的底端与下散热片22的内侧面的底端一体相连接,内片222的顶端与下散热片的内侧面围成一与下散热片的侧开口相连通的上开口223;所述的散热片的第一开口20包括该上开口223和侧开口221。
所述的灯座5包括灯座主体51和隔离盖52,灯座主体51中设有筒形的电路板固定盖511和环绕在该电路板固定盖外侧的散热片安装部512,隔离盖52与电路板固定盖511的上端相连接;该散热片安装部512由上端至下端呈渐次向灯泡轴线方向倾斜,所述灯座的第二开口50设在散热片安装部512中,在第二开口50的两侧分别设有一侧插槽501,所述下散热片22的两侧端分别插接在对应的第二开口的侧插槽501中。
所述的第二开口的底端设有一底插槽,所述下散热片22的底端插接在对应的第二开口的底插槽中。
所述的隔离盖52向上还设有渐次向外倾斜的连接柱521,在每一个散热片的台阶处设有一个插孔231,散热片的台阶处的插孔231与隔离盖上对应的连接柱521位置相对应,每一个连接柱521分别设有能够让电路板固定盖内安装的电路板的导线穿出的导线孔522。
所述的第三开口10设有朝向罩内的开口沿11,所述散热片2的内侧面的顶端抵于对应的开口沿11处。
本发明的一种LED灯泡,是用至少两片相互独立的散热片2来构成散热结构,散热片2沿着灯泡轴线的周向环绕安装在灯座5上并容纳在泡壳1内,散热片2由泡壳1顶端延伸到灯头4处,散热片2的内侧面围成一沿着灯泡轴线方向的气腔体,散热片2的外侧面分别固接LED芯片3,延伸到灯泡下半部弯折处的散热片2上设置了通孔,即在散热片的底部分别设有一向下的第一开口20,灯座的侧壁均匀设有第二开口50,散热片2的底部分别对应安装在灯座的第二开口50中并使散热片的第一开口20显露在对应的第二开口50中,这样就使得散热片的第一开口20完全通向灯泡外。泡壳1顶端也有一个开口10,即在泡壳的顶端设有一第三开口10,散热片2的顶端分别抵在第三开口10内侧,该第三开口10与气腔体相连接通。因此,散热片2贴光源的背面就裸露在空气中,由泡壳1顶端开口10处与散热片的通孔20形成对流,且这种对流的空气是上下流通的方式(如图6中箭头所指),在散热片2的外侧包覆有泡壳1,泡壳1的底端与灯座5相连接,比如卡接等方式;这样,散热片2的外侧面所固接的LED芯片3就被围在泡壳1与散热片2之间,实现光源的作用。
实施例2,参见附图7所示,为本一种LED灯泡的一个具体实施例,实施例2与实施例1主要不同之处在于:1.泡壳1a,包括玻片13a和下泡壳12a,在玻片13a的中心开有第三开口10a,玻片13a安装在下泡壳12a的上部;2散热片2a,包括上散热片21a、下散热片22a,上散热片21a与下散热片22a之间为结合部23a,在下散热片22a上开有第一开口20a。结合部23a接近水平向上斜向延伸形成一斜面段25a, 斜面段25a向上延伸形成垂直段24a;斜面段25a可安装LED芯片3。
一种LED灯泡,包括一泡壳1a、三片散热片2a、LED芯片3、驱动LED芯片工作的电路板、灯座5和灯头4;灯头4的上部与灯座5相连接;电路板安装在灯座5中,泡壳1的底部与灯座5的上部相连接;散热片2围绕灯泡轴线的周向环绕安装在灯座5上并部分容纳在泡壳1内,三片散热片2a的内侧面围成一围绕灯泡轴线方向的气腔体;
散热片的外侧面分别固接LED芯片3;在散热片2a的底部分别设有一向下的第一开口20a,灯座5的侧壁均匀设有第二开口50,散热片2的底部分别对应安装在灯座的第二开口50中并使散热片的第一开口20显露在对应的第二开口50中,与气腔体相连通;在泡壳1a的顶端设有一第三开口10a,散热片2a的顶端分别抵在第三开口10a内侧,该第三开口10a与气腔体相连接通; 三片散热片内侧面围成的气腔体通过三个开口,形成上下流通的对流空气。
实施例3,参见附图8所示,为本一种LED灯泡的一个具体实施例,实施例3与实施例1主要不同之处在于:1. 散热片2b结构;2. 灯座5b的结构。
本发明的一种LED灯泡,包括一泡壳1b、三片散热片2b、LED芯片3、驱动LED芯片工作的电路板、灯座5b和灯头4;灯头4的上部与灯座5b相连接;电路板安装在灯座5b中,泡壳1b的底部与灯座5b的上部相连接;散热片2b围绕灯泡轴线的周向环绕安装在灯座5b上并部分容纳在泡壳1b内,三片散热片2b的内侧面围成一围绕灯泡轴线方向的气腔体;散热片的外侧面分别固接LED芯片3。
散热片2b包括上散热片21b、下散热片22b,上散热片21b与下散热片22b之间为结合部23b,下散热片与结合部连接处两侧由外向内设有横切槽24b,形成第一开口20b;横切槽24b下方下散热片两侧弯折为两翼片25b。
灯座5b包括灯座主体51b和隔离盖52b;灯座主体51包括:电路板固定筒511b、散热片安装部512b、固定圈513b、连接筋514b;固定圈513b设置在固定筒511b上端部的外围,并通过三根连接筋514b与固定筒511b连接;散热片安装部512b围绕固定筒511b设置,其顶部与连接筋514b固定连接,形成第二开口50b。
隔离盖52b与电路板固定筒511b的上端相连接;所述下散热片22的两侧翼片25b的端部分别插接在对应的第二开口安装部512b,上散热片21b穿固定圈513b向上延伸,下泡壳13b安装在固定圈513b上,其上安装有上泡壳12b, 上散热片21b的顶部抵靠至上泡壳12b的内侧;上泡壳12b上开有第三开口10b。
实施例4,参见附图9所示,本发明的一种LED灯泡散热片的具体实施例,散热片2c包括上散热片21c、下散热片22c,上散热片21c与下散热片22c之间为结合部23c,下散热片22上竖向平行开有一组沟槽形成第一开口20b。
沟槽也可以是横向排列或斜向排列。
实施例5,参见附图10、11所示,本发明的一种LED灯泡散热片的具体实施例,散热片2d包括上散热片21d、下散热片22d,上散热片21d与下散热片22d之间为结合部23d,在下散热片22d上开有第一开口20d。上散热片21d包括一垂直段25d和一斜面段24d, 垂直段25d下端为结合部23d,垂直段25d上端向上斜向延伸形成斜面段24d;垂直段25d、斜面段24d均可安装LED芯片3。
实施例6,参见附图12为本发明的一种LED灯泡散热片的具体实施例,散热片2e包括上散热片21e、下散热片22e,上散热片21e与下散热片22e之间为结合部23e,下散热片22e上开有一组小圆孔形成第一开口20e。
小圆孔可以是三角孔、五星孔等几何形状。
实施例7,参见附图8所示,为本一种LED灯泡的一个具体实施例,实施例7与实施例1主要不同之处在于:其散热片2f为两片。
一种LED灯泡,包括一泡壳1、两片散热片2f、LED芯片3、驱动LED芯片工作的电路板、灯座5和灯头4;灯头4的上部与灯座5相连接;电路板安装在灯座5中,泡壳1的底部与灯座5的上部相连接;散热片2f围绕灯泡轴线的周向环绕安装在灯座5上并部分容纳在泡壳1内,两片散热片2f的内侧面围成一围绕灯泡轴线方向的气腔体;
散热片的外侧面分别固接LED芯片3;在散热片2f的底部分别设有一向下的第一开口20f,灯座5的侧壁均匀设有第二开口50,散热片2f的底部分别对应安装在灯座的第二开口50中并使散热片的第一开口20显露在对应的第二开口50中,与气腔体相连通;在泡壳1的顶端设有一第三开口10f,散热片2f的顶端分别抵在第三开口10f内侧,该第三开口10f与气腔体相连接通; 三片散热片内侧面围成的气腔体通过三个开口,形成上下流通的对流空气。
上述实施例仅用来进一步说明本发明的一种LED灯泡,但本发明并不局限于实施例,凡是依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均落入本发明技术方案的保护范围内。
工业实用性
本发明一种LED灯泡,能够较好地解决LED灯泡芯片的结温散热问题,既保持了现有LED灯泡的优良特性,又能够很好地实现散热,从而有力地促进了小型化LED灯泡的推广使用。

Claims (12)

  1. 一种LED灯泡,包括泡壳、至少两片散热片、LED芯片、驱动LED芯片工作的电路板、灯座和灯头;灯头的上部与灯座相连接,电路板安装在灯座中,泡壳的底部与灯座的上部相连接;其特征在于:
    各散热片均包括:一上散热片和一下散热片;
    各散热片围绕灯泡轴线的周向环绕安装在灯座上,其上散热片容纳在泡壳内,上散热片的外侧面分别固接有LED芯片;
    各散热片的内侧面围成一沿着灯泡轴线方向的气腔体,其下散热片设有第一开口;灯座的侧壁均匀设有第二开口,各散热片的第一开口与相对应的第二开口连通;在泡壳的顶端设有一第三开口;第一开口、第二开口、第三开口均与气腔体连通,气腔体通过三个开口,形成上下流通的对流空气。
  2. 根据权利要求1所述的LED灯泡,其特征在于:所述的散热片包括凹口背向灯泡轴线的上散热片和凹口朝向灯泡轴线的下散热片,上散热片与下散热片之间一体弯折相连接并形成一台阶结合部,LED芯片固接在上散热片的凹口中,下散热片与灯座相连接。
  3. 根据权利要求2所述的LED灯泡,其特征在于:所述的下散热片由上端至下端呈渐次向灯泡轴线方向倾斜,该下散热片中设有一侧开口;在下散热片的内侧还一体设有内片,内片的底端与下散热片的内侧面的底端一体相连接,内片的顶端与下散热片的内侧面围成一与下散热片的侧开口相连通的上开口;所述的散热片的第一开口包括该上开口和侧开口。
  4. 根据权利要求3所述的LED灯泡,其特征在于:所述的灯座包括灯座主体和隔离盖,灯座主体中设有筒形的电路板固定盖和环绕在该电路板固定盖外侧的散热片安装部,隔离盖与电路板固定盖的上端相连接;该散热片安装部由上端至下端呈渐次向灯泡轴线方向倾斜,所述灯座的第二开口设在散热片安装部中,在第二开口的两侧分别设有一侧插槽,所述下散热片的两侧端分别插接在对应的第二开口的侧插槽中。
  5. 根据权利要求4所述的LED灯泡,其特征在于:所述的第二开口的底端设有一底插槽,所述下散热片的底端插接在对应的第二开口的底插槽中。
  6. 根据权利要求4所述的LED灯泡,其特征在于:所述的隔离盖向上还设有渐次向外倾斜的连接柱,在每一个散热片的台阶处设有一个插孔,散热片的台阶处的插孔与隔离盖上对应的连接柱位置相对应,每一个连接柱分别设有能够让电路板固定盖内安装的电路板的导线穿出的导线孔。
  7. 根据权利要求1所述的LED灯泡,其特征在于:所述的第三开口设有朝向罩内的开口沿,所述散热片的内侧面的顶端抵于对应的开口沿处。
  8. 根据权利要求1所述的LED灯泡,其特征在于:所述的散热片的下散热片第一开口为一组平行排列的槽孔,下散热片与灯座相连接,其槽孔与灯座上相对应的第二开口连通。
  9. 根据权利要求1所述的LED灯泡,其特征在于:所述的散热片的下散热片与结合部连接处设有由外向内设有横切槽,形成第一开口;
    下散热片与灯座相连接,其切槽与灯座上相对应的第二开口连通。
  10. 根据权利要求1所述的LED灯泡,其特征在于:所述的散热片的下散热片第一开口为一组小孔。
  11. 根据权利要求2或8或9或10所述的LED灯泡,其特征在于:所述的泡壳包括一上泡壳、一下泡壳,其中部开有一第三开口。
  12. 根据权利要求2或8或9或10所述的LED灯泡,其特征在于:所述的泡壳上的第三开口可以是一个孔,也可以一组孔、或一组槽孔。
PCT/CN2011/079749 2011-04-14 2011-09-16 一种led灯泡 WO2012139358A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112011105046.1T DE112011105046B4 (de) 2011-04-14 2011-09-16 LED-Glühbirne
US14/006,128 US8866368B2 (en) 2011-04-14 2011-09-16 LED light bulb

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110094207.6 2011-04-14
CN2011100942076A CN102207252B (zh) 2011-04-14 2011-04-14 一种led灯泡

Publications (1)

Publication Number Publication Date
WO2012139358A1 true WO2012139358A1 (zh) 2012-10-18

Family

ID=44696229

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/079749 WO2012139358A1 (zh) 2011-04-14 2011-09-16 一种led灯泡

Country Status (4)

Country Link
US (1) US8866368B2 (zh)
CN (1) CN102207252B (zh)
DE (1) DE112011105046B4 (zh)
WO (1) WO2012139358A1 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8967837B2 (en) 2013-08-01 2015-03-03 3M Innovative Properties Company Solid state light with features for controlling light distribution and air cooling channels
USD735368S1 (en) 2013-12-04 2015-07-28 3M Innovative Properties Company Solid state light assembly
USD736966S1 (en) 2014-03-28 2015-08-18 3M Innovative Properties Company Solid state light assembly
US9267674B2 (en) 2013-10-18 2016-02-23 3M Innovative Properties Company Solid state light with enclosed light guide and integrated thermal guide
US9354386B2 (en) 2013-10-25 2016-05-31 3M Innovative Properties Company Solid state area light and spotlight with light guide and integrated thermal guide
USD768316S1 (en) 2015-04-03 2016-10-04 3M Innovative Properties Company Solid state luminaire with dome reflector

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102444825A (zh) * 2011-10-28 2012-05-09 厦门阳光恩耐照明有限公司 一种led灯泡
CN102691904A (zh) * 2012-04-24 2012-09-26 厦门阳光恩耐照明有限公司 色温和显色指数可调的发光装置及装有该发光装置的灯具
JP2014086234A (ja) * 2012-10-23 2014-05-12 Beat Sonic:Kk Led電球
US9328908B2 (en) * 2013-04-16 2016-05-03 Checkers Industrial Products, Llc LED strobe light with integrated magnet and heat sink chimney
US9464799B2 (en) 2013-04-21 2016-10-11 Ledvance Llc Air cooling of electronic driver in a lighting device
TW201525357A (zh) * 2013-12-23 2015-07-01 Skynet Electronic Co Ltd 具中軸雙向對流式散熱結構之發光二極體燈泡
CN106704949B (zh) * 2014-08-29 2018-12-21 惠州市超频三光电科技有限公司 车用带led灯电源的前照灯用散热器
JP6787906B2 (ja) * 2015-02-12 2020-11-18 シグニファイ ホールディング ビー ヴィSignify Holding B.V. 照明モジュール及び照明モジュールを備える照明装置
CN106322158A (zh) * 2016-09-26 2017-01-11 王建军 一种led灯丝灯泡
CN107246552B (zh) * 2017-05-27 2019-06-28 东莞市闻誉实业有限公司 可拆装型光源装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201363682Y (zh) * 2009-03-10 2009-12-16 上海智密技术工程研究所有限公司 一种半导体led通用照明灯
CN201462741U (zh) * 2009-04-28 2010-05-12 叶瞰晖 塔状发光二极管灯泡散热结构
CN201507822U (zh) * 2009-09-29 2010-06-16 上海金浦节能环保科技有限公司 一种散热性能良好的led灯泡
CN201547729U (zh) * 2009-11-24 2010-08-11 东莞市友美电源设备有限公司 Led球泡灯的散热结构
EP2221523A1 (en) * 2009-02-23 2010-08-25 Taiwan Green Point Enterprises Co., Ltd. High efficiency light emitting diode apparatus
US20100220487A1 (en) * 2009-02-27 2010-09-02 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Lighting assembly and heat exchange apparatus for uniform heat dissipation
CN101929631A (zh) * 2010-09-30 2010-12-29 戴培钧 外壳绝缘和设有通风道的led灯

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070253202A1 (en) * 2006-04-28 2007-11-01 Chaun-Choung Technology Corp. LED lamp and heat-dissipating structure thereof
US7549774B2 (en) * 2007-04-24 2009-06-23 Hong Kuan Technology Co., Ltd. LED lamp with plural radially arranged heat sinks
DE102007040444B8 (de) * 2007-08-28 2013-10-17 Osram Gmbh LED-Lampe
CN201273477Y (zh) * 2008-09-25 2009-07-15 厦门龙胜达照明电器有限公司 一种仿白炽灯的大功率led灯
CN201416764Y (zh) * 2009-06-16 2010-03-03 西安圣华电子工程有限责任公司 一种led灯
CN201555069U (zh) * 2009-09-28 2010-08-18 赵焕兴 高效散热型led灯具
DE202009017104U1 (de) * 2009-12-18 2010-03-04 Lee, Han-Ming Lotfreie LED Struktur
CN201606723U (zh) * 2010-02-23 2010-10-13 东莞宏灿光电制品有限公司 Led灯泡
CN201772286U (zh) * 2010-05-26 2011-03-23 苏州久腾光电科技有限公司 一种led灯泡
CN201706282U (zh) * 2010-06-04 2011-01-12 深圳市旭翔光电科技有限公司 高密度多封装体集成led灯

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2221523A1 (en) * 2009-02-23 2010-08-25 Taiwan Green Point Enterprises Co., Ltd. High efficiency light emitting diode apparatus
US20100220487A1 (en) * 2009-02-27 2010-09-02 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Lighting assembly and heat exchange apparatus for uniform heat dissipation
CN201363682Y (zh) * 2009-03-10 2009-12-16 上海智密技术工程研究所有限公司 一种半导体led通用照明灯
CN201462741U (zh) * 2009-04-28 2010-05-12 叶瞰晖 塔状发光二极管灯泡散热结构
CN201507822U (zh) * 2009-09-29 2010-06-16 上海金浦节能环保科技有限公司 一种散热性能良好的led灯泡
CN201547729U (zh) * 2009-11-24 2010-08-11 东莞市友美电源设备有限公司 Led球泡灯的散热结构
CN101929631A (zh) * 2010-09-30 2010-12-29 戴培钧 外壳绝缘和设有通风道的led灯

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8967837B2 (en) 2013-08-01 2015-03-03 3M Innovative Properties Company Solid state light with features for controlling light distribution and air cooling channels
US9267674B2 (en) 2013-10-18 2016-02-23 3M Innovative Properties Company Solid state light with enclosed light guide and integrated thermal guide
US9354386B2 (en) 2013-10-25 2016-05-31 3M Innovative Properties Company Solid state area light and spotlight with light guide and integrated thermal guide
USD735368S1 (en) 2013-12-04 2015-07-28 3M Innovative Properties Company Solid state light assembly
USD736966S1 (en) 2014-03-28 2015-08-18 3M Innovative Properties Company Solid state light assembly
USD768316S1 (en) 2015-04-03 2016-10-04 3M Innovative Properties Company Solid state luminaire with dome reflector

Also Published As

Publication number Publication date
DE112011105046B4 (de) 2016-08-25
US20140021849A1 (en) 2014-01-23
CN102207252B (zh) 2013-03-20
CN102207252A (zh) 2011-10-05
DE112011105046T5 (de) 2013-12-12
US8866368B2 (en) 2014-10-21

Similar Documents

Publication Publication Date Title
WO2012139358A1 (zh) 一种led灯泡
WO2013047929A1 (ko) 엘이디 조명 장치
WO2015149512A1 (zh) 一种集成散热式led灯泡
WO2011122781A2 (ko) 발광다이오드 조명등
WO2013069446A1 (ja) ランプ
WO2010038983A2 (ko) 나선형 방열장치 및 이를 이용한 전구형 led 조명장치
JP6286480B2 (ja) ランプ
TWI481799B (zh) 燈具結構
KR101072584B1 (ko) 엘이디 조명 장치
WO2015016525A1 (ko) 조명 장치
WO2011059268A2 (ko) 전구형 led 조명장치
WO2013131301A1 (zh) 一种led灯
WO2011094949A1 (zh) Led荧光灯
WO2011085529A1 (zh) Led光源的照明灯具模块
WO2012050318A2 (ko) 착탈식 결합이 가능한 엘이디 조명등
WO2011160304A1 (zh) Led照明灯泡及其散热座
WO2010117157A2 (ko) 엘이디 투광등
WO2015012635A1 (ko) Led 조명 장치
WO2013070025A1 (ko) 엘이디 조명장치
WO2012141510A2 (ko) 엘이디를 이용한 다색 실내등
WO2011087243A2 (ko) Led조명장치와 그 제조방법
KR200453771Y1 (ko) Fpl형 엘이디 램프
JP3157515U (ja) Led照明装置
WO2013016953A1 (zh) 一种贴片式led灯泡
CN217540684U (zh) 一种防爆灯

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11863633

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 14006128

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 1120111050461

Country of ref document: DE

Ref document number: 112011105046

Country of ref document: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11863633

Country of ref document: EP

Kind code of ref document: A1