WO2012130108A1 - 光刻机硅片台双台交换系统 - Google Patents

光刻机硅片台双台交换系统 Download PDF

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Publication number
WO2012130108A1
WO2012130108A1 PCT/CN2012/072974 CN2012072974W WO2012130108A1 WO 2012130108 A1 WO2012130108 A1 WO 2012130108A1 CN 2012072974 W CN2012072974 W CN 2012072974W WO 2012130108 A1 WO2012130108 A1 WO 2012130108A1
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WO
WIPO (PCT)
Prior art keywords
wafer stage
wafer
driving unit
station
stage
Prior art date
Application number
PCT/CN2012/072974
Other languages
English (en)
French (fr)
Chinese (zh)
Inventor
朱煜
陈亚英
张鸣
徐登峰
汪劲松
Original Assignee
清华大学
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 清华大学 filed Critical 清华大学
Priority to US14/009,289 priority Critical patent/US9547245B2/en
Publication of WO2012130108A1 publication Critical patent/WO2012130108A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask

Definitions

  • the present invention relates to a lithographic apparatus comprising two platforms for holding silicon wafers, and more particularly to a lithographic apparatus provided with a rotating switching bridge, belonging to the field of semiconductor equipment.
  • the exposure design (lithography) of the chip design pattern on the photoresist on the surface of the silicon wafer is one of the most important processes.
  • the device used in this process is called a photolithography machine. machine).
  • the resolution and exposure efficiency of the lithography machine greatly affect the feature line width (resolution) and productivity of the integrated circuit chip.
  • the basic principle of the step-and-scan projection lithography machine is shown in Figure 1.
  • the deep ultraviolet light from the light source 45 passes through a mask 47 and a lens system 49 to form a part of the pattern on the reticle on a chip of the silicon wafer 50.
  • the reticle and the silicon wafer are synchronously moved at a certain speed ratio, and finally all the patterns on the reticle are imaged on a specific chip of the silicon wafer.
  • the basic function of the wafer stage motion positioning system is to carry the silicon wafer during the exposure process and move at a set speed and direction to achieve accurate transfer of the mask pattern to various areas on the silicon wafer. Since the line width of the chip is very small (the minimum line width has reached 45nm at present), in order to ensure the lithography precision and resolution, the wafer stage is required to have extremely high motion positioning accuracy; It greatly affects the productivity of lithography, and from the perspective of improving productivity, it requires the speed of movement of the wafer table to increase.
  • the wafer support platform includes a coarse motion module 18 and a micro motion module 20.
  • the coarse motion module 18 and the micro motion module 20 each include a stationary portion, a movable portion, and a driving portion.
  • Connected to the base 30 is the stationary portion 8 of the coarse motion module 18.
  • the movable portion of the coarse motion module 18 is movable relative to the stationary portion.
  • Connected to the movable portion 10 of the coarse motion module 18 is the stationary portion 12 of the micro-motion module 20.
  • the movable portion 14 of the micro-motion module 20 is movable relative to the stationary portion 12.
  • the wafer stage 16 is coupled to the movable portion 14 of the micro-motion module 20.
  • the wafer stage 16 is configured to support a silicon wafer W that is not part of the wafer support platform.
  • the "stationary portion" is relative to the movable portion, and the “stationary portion” itself may also be movable.
  • the drive motor of the coarse motion module may be a linear motor or the like, and the drive motor of the micro-motion module may be a planar motor, a voice coil motor, or the like.
  • a lithography machine wafer table double-table exchange device (publication number: CN 201364459) discloses a two-station exchange system of a lithography machine, which has the advantages of simple structure, high space utilization and no need for docking auxiliary devices.
  • the rotating motor is installed under the abutment, and the structure is complicated. When the whole base is rotated, the entire base is rotated. Because the base is equipped with X and Y linear motors, the coarse motion table and the micro motion table. In addition, the moment of inertia is large, the motor power is large, it is difficult to accurately control and position, and it is also susceptible to auxiliary devices such as cables.
  • the object of the present invention is to provide a lithography machine wafer stage dual-disc switching system with a rotating switching bridge, in order to overcome the existence of non-centroidal driving and structure of the existing silicon wafer table two-station switching system.
  • the technical scheme of the invention is: a lithography machine wafer table double exchange system, the system comprises running in an exposure station And a silicon wafer stage running on the pretreatment station, wherein the two silicon wafer stages are disposed on a base, wherein: a rotating electric machine is disposed on the lower layer of the base; After the wafer stage of the exposure station and the wafer stage running at the pretreatment station complete the exposure and pretreatment work respectively, the two wafer stages on the rotating motor drive base are rotated counterclockwise by 180° to realize the two silicon.
  • the station's station exchange. During the exchange process, the abutment is fixed.
  • the two sides of the long side edge X sides of the base of the present invention are respectively provided with two linear motor stator magnets, and the first single degree of freedom driving unit and the second single degree of freedom driving unit that are moved by the X direction share the first linear motor.
  • a stator magnet a stator magnet
  • the driving unit and the third single-degree-of-freedom driving unit are coupled to jointly drive the first wafer stage to move in the XY plane;
  • the unit is coupled to drive the second wafer stage to move in the XY plane;
  • the dual-frequency laser interferometer for measuring the X-direction displacement is
  • the technical feature of the present invention is that the output shaft of the rotating electrical machine passes through the base platform, and the end of the output shaft is connected to the exchange bridge.
  • the exchange bridge includes the main body of the exchange bridge, and the two sides of the main body of the exchange bridge are respectively provided with locking devices, and the two locking devices respectively correspond to two The movable portion of the micro-motion stage of the wafer support platform.
  • Yet another technical feature of the present invention is that the locking device can be extended and retracted relative to the exchange bridge body.
  • the invention has the following outstanding advantages: the system is provided with a rotating electric machine in the lower layer of the base station, and the rotating electric machine only drives the movable part of the micro-motion stage and the wafer stage to rotate, so as to realize the two silicon wafer stage
  • the station exchange, the base station does not rotate, thus avoiding the large moment of inertia and the high-power motor, eliminating the rail docking device, etc., greatly simplifying the system structure, at the same time the exchange is simple and easy to control, and the operation is convenient.
  • Figure 1 is a schematic diagram of the working principle of the lithography machine.
  • FIG. 2 is a schematic structural view of a silicon wafer supporting platform of a lithography machine in the prior art.
  • FIG. 3 is a schematic structural view of a silicon wafer stage dual-disc switching system of a lithography machine according to the present invention.
  • FIG. 4 is a top plan view of a wafer stage of a lithography machine according to the present invention before being exchanged.
  • FIG. 5 is a top view of the wafer stage of the lithography machine provided by the present invention after exchange.
  • FIG. 2 is a schematic structural view of a silicon wafer supporting platform including a coarse motion module 18 and a micro motion module 20.
  • the coarse motion module 18 and the micro motion module 20 each include a stationary portion, a movable portion, and a driving portion.
  • Connected to the base 30 is the stationary portion 8 of the coarse motion module 18.
  • the movable portion of the coarse motion module 18 is movable relative to the stationary portion.
  • Connected to the movable portion 10 of the coarse motion module 18 is the stationary portion 12 of the micro-motion module 20.
  • the movable portion 14 of the micro-motion module 20 is movable relative to the stationary portion 12.
  • FIG. 3 is a schematic view showing the structure of the two-seat exchange of the silicon wafer stage of the present invention.
  • the movable parts of the micro-motion stage of the two silicon-supporting platforms are respectively connected to the first silicon wafer stage 16.1 and the second silicon wafer stage 16.2, and the two silicon wafer supporting platforms.
  • the stationary portions of the coarse motion stage are connected to the base 30, respectively.
  • a rotating electric machine 41 is disposed on the lower layer of the base 30.
  • the output shaft 42 of the rotating electric machine 41 passes through the base 30.
  • the end of the output shaft of the rotating electric machine is connected to the exchange bridge.
  • the exchange bridge includes the exchange bridge main body 40, and the two sides of the exchange bridge main body 40 are respectively disposed first.
  • the locking device 43.1 and the second locking device 43.2 respectively correspond to the movable portion 14 of the micro-motion table of the two wafer supporting platforms.
  • the two silicon supporting platforms are moved to the two sides of the switching bridge, and the two locking devices respectively lock the movable parts of the micro-motion table of the two silicon supporting platforms, and the rotating electric motor 41 drives the rotating shaft 42 of the rotating electric machine and the exchange bridge and
  • the two movable portions and the first wafer stage 16.1 and the second wafer stage 16.2 are accurately rotated counterclockwise by 180[deg.], and the first locking device 43.1 and the second locking device 43.2 are unlocked after the precise positioning, and the exchange is completed.
  • the other parts of the wafer support platform, such as the coarse motion stage and the stationary part of the micro-motion stage, and the base 30 are fixed.
  • the first locking device 43.1 and the second locking device 43.2 can extend and retract relative to the exchange bridge body 40 to avoid interference with the silicon wafer supporting platform and save space.
  • Known lock devices are vacuum suction bearings and the like.
  • the fourth single degree of freedom driving unit 7 shows a top view of the exchange of the wafer stage of the lithography machine of the present invention, the base 30, a pretreatment station 2, and an exposure station 3.
  • the first wafer stage 16.1 runs in the pretreatment station 2 and the second wafer stage 16.2 runs in the exposure station 3.
  • Two linear motor stator magnets are respectively arranged in the X direction of the long side edge of both sides of the base 30, that is, the first linear motor stator magnet 9.1 and the second linear motor stator magnet 9.2, the first single free movement by the X direction
  • the degree driving unit 4 and the second single degree of freedom driving unit 5 share the first linear motor stator magnet 9.1, and the same, the third single degree of freedom driving unit 6 and the fourth single degree of freedom driving unit 7 that are moved in the X direction are shared.
  • the degree of freedom driving unit 4 and the third single degree of freedom driving unit 6 are coupled to jointly drive the first wafer stage 16.1 to move in the XY plane.
  • the Y direction rail 15.2 passes through the other wafer supporting platform and drives the wafer stage 16.2.
  • Moving in the Y direction, and the Y-direction second guide rails 15.2 are respectively coupled to the second single-degree-of-freedom driving unit 5 and the fourth single-degree-of-freedom driving unit 7 that move in the X direction, and jointly drive the second wafer stage 16.2 to move in the XY plane;
  • the bottom of the silicon support platform is equipped with a vacuum preloaded air bearing, the upper surface of the base 30 is a guiding surface, the Y direction guide is penetrated from the inside of the silicon supporting platform, and the linear motor stator magnet is mounted on the Y direction rail, and the coil is used as a linear electric wire.
  • the maneuver is mounted on the wafer support platform, and a closed preload air bearing is mounted on the two inner vertical faces of the silicon support platform to restrain the relative movement of the Y direction guide and the wafer stage in the Y direction.
  • the bottom of the single-degree-of-freedom drive unit is equipped with a linear motor coil mover and a vacuum preloaded air bearing, and the first linear motor stator magnet stator 9.1 and the second linear motor stator magnet 9.2 are respectively mounted on the long side of the base 30 On both sides.
  • the first single degree of freedom drive unit 4 and the third single degree of freedom drive unit 6 are coupled to the Y-direction first rail 15.1 to drive the first wafer stage 16.1 to move along the X-Y plane.
  • the second single degree of freedom drive unit 5 and the fourth single degree of freedom drive unit 7 are coupled to the Y-direction second rail 15.2 to drive the second wafer stage 16.2 to move along the X-Y plane.
  • Fig. 5 is a top plan view showing the exchange of the wafer stage of the lithography machine of the present invention.
  • the second wafer stage 16.2 which was originally in the exposure station 3 is transferred to the pre-processing station 2 together with the movable portion of the micro-motion stage, and the processing of the lower sheet is performed;
  • Other parts of the exchange such as the coarse motion table, the base station, the stationary part of the micro-motion stage, and the measuring device, are fixed.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/CN2012/072974 2011-04-01 2012-03-23 光刻机硅片台双台交换系统 WO2012130108A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/009,289 US9547245B2 (en) 2011-04-01 2012-03-23 Dual wafer stage switching system for a lithography machine

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2011100827294A CN102141739B (zh) 2011-04-01 2011-04-01 光刻机硅片台双台交换系统
CN201110082729.4 2011-04-01

Publications (1)

Publication Number Publication Date
WO2012130108A1 true WO2012130108A1 (zh) 2012-10-04

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US (1) US9547245B2 (und)
CN (1) CN102141739B (und)
WO (1) WO2012130108A1 (und)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102141739B (zh) * 2011-04-01 2013-01-16 清华大学 光刻机硅片台双台交换系统
CN102393613B (zh) * 2011-11-12 2014-02-05 哈尔滨工业大学 一种基于同步齿轮调向的双工件台回转交换装置
CN102508414B (zh) * 2011-11-12 2013-09-18 哈尔滨工业大学 一种基于转台齿轮同步调向的双工件台回转交换方法与装置
CN105487343A (zh) * 2016-01-14 2016-04-13 哈尔滨工业大学 基于平面光栅测量的动磁钢磁浮双工件台矢量圆弧换台方法及装置
CN108173408B (zh) * 2018-01-18 2023-10-24 苏州大学 一种三自由度定位平台
CN109164680B (zh) * 2018-09-20 2024-02-02 矽电半导体设备(深圳)股份有限公司 双工位旋转载片装置及应用其的光刻机
US10867822B1 (en) * 2019-07-26 2020-12-15 Yaskawa America, Inc. Wafer pre-alignment apparatus and method
CN112083633A (zh) * 2020-09-30 2020-12-15 上海集成电路研发中心有限公司 一种光刻装置

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JPH09270383A (ja) * 1996-03-29 1997-10-14 Nikon Corp 基板搬送装置及び基板搬送方法
US5969441A (en) * 1996-12-24 1999-10-19 Asm Lithography Bv Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
CN101071275A (zh) * 2007-06-08 2007-11-14 上海微电子装备有限公司 一种旋转交换的双台系统
CN201364459Y (zh) * 2009-01-20 2009-12-16 清华大学 一种光刻机硅片台双台交换装置
CN101813890A (zh) * 2008-11-21 2010-08-25 Asml荷兰有限公司 设置有交换桥的光刻设备
CN102141739A (zh) * 2011-04-01 2011-08-03 清华大学 光刻机硅片台双台交换系统

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JPH0614789B2 (ja) * 1984-06-25 1994-02-23 株式会社東芝 テーブル微動方法およびこの方法を用いた微動装置
IL130137A (en) * 1996-11-28 2003-07-06 Nikon Corp Exposure apparatus and an exposure method
US20030020889A1 (en) * 2000-08-02 2003-01-30 Nikon Corporation Stage unit, measurement unit and measurement method, and exposure apparatus and exposure method
CN100570496C (zh) * 2007-12-21 2009-12-16 清华大学 一种采用十字导轨的光刻机硅片台双台交换系统
CN101551598B (zh) * 2009-04-03 2010-12-01 清华大学 一种光刻机硅片台双台交换系统

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09270383A (ja) * 1996-03-29 1997-10-14 Nikon Corp 基板搬送装置及び基板搬送方法
US5969441A (en) * 1996-12-24 1999-10-19 Asm Lithography Bv Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
CN101071275A (zh) * 2007-06-08 2007-11-14 上海微电子装备有限公司 一种旋转交换的双台系统
CN101813890A (zh) * 2008-11-21 2010-08-25 Asml荷兰有限公司 设置有交换桥的光刻设备
CN201364459Y (zh) * 2009-01-20 2009-12-16 清华大学 一种光刻机硅片台双台交换装置
CN102141739A (zh) * 2011-04-01 2011-08-03 清华大学 光刻机硅片台双台交换系统

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CN102141739B (zh) 2013-01-16
US9547245B2 (en) 2017-01-17
US20140071422A1 (en) 2014-03-13
CN102141739A (zh) 2011-08-03

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