WO2012130108A1 - 光刻机硅片台双台交换系统 - Google Patents

光刻机硅片台双台交换系统 Download PDF

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Publication number
WO2012130108A1
WO2012130108A1 PCT/CN2012/072974 CN2012072974W WO2012130108A1 WO 2012130108 A1 WO2012130108 A1 WO 2012130108A1 CN 2012072974 W CN2012072974 W CN 2012072974W WO 2012130108 A1 WO2012130108 A1 WO 2012130108A1
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Prior art keywords
wafer stage
wafer
driving unit
station
stage
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PCT/CN2012/072974
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English (en)
French (fr)
Inventor
朱煜
陈亚英
张鸣
徐登峰
汪劲松
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清华大学
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Application filed by 清华大学 filed Critical 清华大学
Priority to US14/009,289 priority Critical patent/US9547245B2/en
Publication of WO2012130108A1 publication Critical patent/WO2012130108A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask

Definitions

  • the present invention relates to a lithographic apparatus comprising two platforms for holding silicon wafers, and more particularly to a lithographic apparatus provided with a rotating switching bridge, belonging to the field of semiconductor equipment.
  • the exposure design (lithography) of the chip design pattern on the photoresist on the surface of the silicon wafer is one of the most important processes.
  • the device used in this process is called a photolithography machine. machine).
  • the resolution and exposure efficiency of the lithography machine greatly affect the feature line width (resolution) and productivity of the integrated circuit chip.
  • the basic principle of the step-and-scan projection lithography machine is shown in Figure 1.
  • the deep ultraviolet light from the light source 45 passes through a mask 47 and a lens system 49 to form a part of the pattern on the reticle on a chip of the silicon wafer 50.
  • the reticle and the silicon wafer are synchronously moved at a certain speed ratio, and finally all the patterns on the reticle are imaged on a specific chip of the silicon wafer.
  • the basic function of the wafer stage motion positioning system is to carry the silicon wafer during the exposure process and move at a set speed and direction to achieve accurate transfer of the mask pattern to various areas on the silicon wafer. Since the line width of the chip is very small (the minimum line width has reached 45nm at present), in order to ensure the lithography precision and resolution, the wafer stage is required to have extremely high motion positioning accuracy; It greatly affects the productivity of lithography, and from the perspective of improving productivity, it requires the speed of movement of the wafer table to increase.
  • the wafer support platform includes a coarse motion module 18 and a micro motion module 20.
  • the coarse motion module 18 and the micro motion module 20 each include a stationary portion, a movable portion, and a driving portion.
  • Connected to the base 30 is the stationary portion 8 of the coarse motion module 18.
  • the movable portion of the coarse motion module 18 is movable relative to the stationary portion.
  • Connected to the movable portion 10 of the coarse motion module 18 is the stationary portion 12 of the micro-motion module 20.
  • the movable portion 14 of the micro-motion module 20 is movable relative to the stationary portion 12.
  • the wafer stage 16 is coupled to the movable portion 14 of the micro-motion module 20.
  • the wafer stage 16 is configured to support a silicon wafer W that is not part of the wafer support platform.
  • the "stationary portion" is relative to the movable portion, and the “stationary portion” itself may also be movable.
  • the drive motor of the coarse motion module may be a linear motor or the like, and the drive motor of the micro-motion module may be a planar motor, a voice coil motor, or the like.
  • a lithography machine wafer table double-table exchange device (publication number: CN 201364459) discloses a two-station exchange system of a lithography machine, which has the advantages of simple structure, high space utilization and no need for docking auxiliary devices.
  • the rotating motor is installed under the abutment, and the structure is complicated. When the whole base is rotated, the entire base is rotated. Because the base is equipped with X and Y linear motors, the coarse motion table and the micro motion table. In addition, the moment of inertia is large, the motor power is large, it is difficult to accurately control and position, and it is also susceptible to auxiliary devices such as cables.
  • the object of the present invention is to provide a lithography machine wafer stage dual-disc switching system with a rotating switching bridge, in order to overcome the existence of non-centroidal driving and structure of the existing silicon wafer table two-station switching system.
  • the technical scheme of the invention is: a lithography machine wafer table double exchange system, the system comprises running in an exposure station And a silicon wafer stage running on the pretreatment station, wherein the two silicon wafer stages are disposed on a base, wherein: a rotating electric machine is disposed on the lower layer of the base; After the wafer stage of the exposure station and the wafer stage running at the pretreatment station complete the exposure and pretreatment work respectively, the two wafer stages on the rotating motor drive base are rotated counterclockwise by 180° to realize the two silicon.
  • the station's station exchange. During the exchange process, the abutment is fixed.
  • the two sides of the long side edge X sides of the base of the present invention are respectively provided with two linear motor stator magnets, and the first single degree of freedom driving unit and the second single degree of freedom driving unit that are moved by the X direction share the first linear motor.
  • a stator magnet a stator magnet
  • the driving unit and the third single-degree-of-freedom driving unit are coupled to jointly drive the first wafer stage to move in the XY plane;
  • the unit is coupled to drive the second wafer stage to move in the XY plane;
  • the dual-frequency laser interferometer for measuring the X-direction displacement is
  • the technical feature of the present invention is that the output shaft of the rotating electrical machine passes through the base platform, and the end of the output shaft is connected to the exchange bridge.
  • the exchange bridge includes the main body of the exchange bridge, and the two sides of the main body of the exchange bridge are respectively provided with locking devices, and the two locking devices respectively correspond to two The movable portion of the micro-motion stage of the wafer support platform.
  • Yet another technical feature of the present invention is that the locking device can be extended and retracted relative to the exchange bridge body.
  • the invention has the following outstanding advantages: the system is provided with a rotating electric machine in the lower layer of the base station, and the rotating electric machine only drives the movable part of the micro-motion stage and the wafer stage to rotate, so as to realize the two silicon wafer stage
  • the station exchange, the base station does not rotate, thus avoiding the large moment of inertia and the high-power motor, eliminating the rail docking device, etc., greatly simplifying the system structure, at the same time the exchange is simple and easy to control, and the operation is convenient.
  • Figure 1 is a schematic diagram of the working principle of the lithography machine.
  • FIG. 2 is a schematic structural view of a silicon wafer supporting platform of a lithography machine in the prior art.
  • FIG. 3 is a schematic structural view of a silicon wafer stage dual-disc switching system of a lithography machine according to the present invention.
  • FIG. 4 is a top plan view of a wafer stage of a lithography machine according to the present invention before being exchanged.
  • FIG. 5 is a top view of the wafer stage of the lithography machine provided by the present invention after exchange.
  • FIG. 2 is a schematic structural view of a silicon wafer supporting platform including a coarse motion module 18 and a micro motion module 20.
  • the coarse motion module 18 and the micro motion module 20 each include a stationary portion, a movable portion, and a driving portion.
  • Connected to the base 30 is the stationary portion 8 of the coarse motion module 18.
  • the movable portion of the coarse motion module 18 is movable relative to the stationary portion.
  • Connected to the movable portion 10 of the coarse motion module 18 is the stationary portion 12 of the micro-motion module 20.
  • the movable portion 14 of the micro-motion module 20 is movable relative to the stationary portion 12.
  • FIG. 3 is a schematic view showing the structure of the two-seat exchange of the silicon wafer stage of the present invention.
  • the movable parts of the micro-motion stage of the two silicon-supporting platforms are respectively connected to the first silicon wafer stage 16.1 and the second silicon wafer stage 16.2, and the two silicon wafer supporting platforms.
  • the stationary portions of the coarse motion stage are connected to the base 30, respectively.
  • a rotating electric machine 41 is disposed on the lower layer of the base 30.
  • the output shaft 42 of the rotating electric machine 41 passes through the base 30.
  • the end of the output shaft of the rotating electric machine is connected to the exchange bridge.
  • the exchange bridge includes the exchange bridge main body 40, and the two sides of the exchange bridge main body 40 are respectively disposed first.
  • the locking device 43.1 and the second locking device 43.2 respectively correspond to the movable portion 14 of the micro-motion table of the two wafer supporting platforms.
  • the two silicon supporting platforms are moved to the two sides of the switching bridge, and the two locking devices respectively lock the movable parts of the micro-motion table of the two silicon supporting platforms, and the rotating electric motor 41 drives the rotating shaft 42 of the rotating electric machine and the exchange bridge and
  • the two movable portions and the first wafer stage 16.1 and the second wafer stage 16.2 are accurately rotated counterclockwise by 180[deg.], and the first locking device 43.1 and the second locking device 43.2 are unlocked after the precise positioning, and the exchange is completed.
  • the other parts of the wafer support platform, such as the coarse motion stage and the stationary part of the micro-motion stage, and the base 30 are fixed.
  • the first locking device 43.1 and the second locking device 43.2 can extend and retract relative to the exchange bridge body 40 to avoid interference with the silicon wafer supporting platform and save space.
  • Known lock devices are vacuum suction bearings and the like.
  • the fourth single degree of freedom driving unit 7 shows a top view of the exchange of the wafer stage of the lithography machine of the present invention, the base 30, a pretreatment station 2, and an exposure station 3.
  • the first wafer stage 16.1 runs in the pretreatment station 2 and the second wafer stage 16.2 runs in the exposure station 3.
  • Two linear motor stator magnets are respectively arranged in the X direction of the long side edge of both sides of the base 30, that is, the first linear motor stator magnet 9.1 and the second linear motor stator magnet 9.2, the first single free movement by the X direction
  • the degree driving unit 4 and the second single degree of freedom driving unit 5 share the first linear motor stator magnet 9.1, and the same, the third single degree of freedom driving unit 6 and the fourth single degree of freedom driving unit 7 that are moved in the X direction are shared.
  • the degree of freedom driving unit 4 and the third single degree of freedom driving unit 6 are coupled to jointly drive the first wafer stage 16.1 to move in the XY plane.
  • the Y direction rail 15.2 passes through the other wafer supporting platform and drives the wafer stage 16.2.
  • Moving in the Y direction, and the Y-direction second guide rails 15.2 are respectively coupled to the second single-degree-of-freedom driving unit 5 and the fourth single-degree-of-freedom driving unit 7 that move in the X direction, and jointly drive the second wafer stage 16.2 to move in the XY plane;
  • the bottom of the silicon support platform is equipped with a vacuum preloaded air bearing, the upper surface of the base 30 is a guiding surface, the Y direction guide is penetrated from the inside of the silicon supporting platform, and the linear motor stator magnet is mounted on the Y direction rail, and the coil is used as a linear electric wire.
  • the maneuver is mounted on the wafer support platform, and a closed preload air bearing is mounted on the two inner vertical faces of the silicon support platform to restrain the relative movement of the Y direction guide and the wafer stage in the Y direction.
  • the bottom of the single-degree-of-freedom drive unit is equipped with a linear motor coil mover and a vacuum preloaded air bearing, and the first linear motor stator magnet stator 9.1 and the second linear motor stator magnet 9.2 are respectively mounted on the long side of the base 30 On both sides.
  • the first single degree of freedom drive unit 4 and the third single degree of freedom drive unit 6 are coupled to the Y-direction first rail 15.1 to drive the first wafer stage 16.1 to move along the X-Y plane.
  • the second single degree of freedom drive unit 5 and the fourth single degree of freedom drive unit 7 are coupled to the Y-direction second rail 15.2 to drive the second wafer stage 16.2 to move along the X-Y plane.
  • Fig. 5 is a top plan view showing the exchange of the wafer stage of the lithography machine of the present invention.
  • the second wafer stage 16.2 which was originally in the exposure station 3 is transferred to the pre-processing station 2 together with the movable portion of the micro-motion stage, and the processing of the lower sheet is performed;
  • Other parts of the exchange such as the coarse motion table, the base station, the stationary part of the micro-motion stage, and the measuring device, are fixed.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

光刻机硅片台双台交换系统
本发明涉及一种包括两个用于保持硅片的平台的光刻设备，特别涉及一种设置有旋转交换桥的光刻设备，属于半导体装备领域。
在集成电路芯片的生产过程中，芯片的设计图形在硅片表面光刻胶上的曝光转印(光刻)是其中最重要的工序之一，该工序所用的设备称为光刻机(曝光机)。光刻机的分辨率和曝光效率极大的影响着集成电路芯片的特征线宽(分辨率)和生产率。而作为光刻机关键系统的硅片超精密运动定位系统(以下简称为硅片台)的运动精度和工作效率，又在很大程度上决定了光刻机的分辨率和曝光效率。
步进扫描投影光刻机基本原理如图1所示。来自光源45的深紫外光透过掩模版47、透镜系统49将掩模版上的一部分图形成像在硅片50的某个Chip上。掩模版和硅片反向按一定的速度比例作同步运动，最终将掩模版上的全部图形成像在硅片的特定芯片(Chip)上。
硅片台运动定位系统的基本作用就是在曝光过程中承载着硅片并按设定的速度和方向运动，以实现掩模版图形向硅片上各区域的精确转移。由于芯片的线宽非常小(目前最小线宽已经达到45nm)，为保证光刻的套刻精度和分辨率，就要求硅片台具有极高的运动定位精度；由于硅片台的运动速度在很大程度上影响着光刻的生产率，从提高生产率的角度，又要求硅片台的运动速度不断提高。
图2为现有技术中光刻机的硅片支撑平台的结构示意图。硅片支撑平台包括粗动模块18和微动模块20。粗动模块18和微动模块20均包括静止部分、可移动部分和驱动部分。连接到基台30的是粗动模块18的静止部分8。粗动模块18的可移动部分相对于静止部分是可移动的。连接到粗动模块18的可移动部分10的是微动模块20的静止部分12。微动模块20的可移动部分14相对于静止部分12是可移动的。硅片台16连接到微动模块20的可移动部分14。硅片台16配置用于支撑硅片W，硅片W并非所述硅片支撑平台的一部分。这里“静止部分”是相对可移动部分而言的，“静止部分”本身也可以是可移动的。粗动模块的驱动电机公知的可以为直线电机等，微动模块的驱动电机公知的可以为平面电机、音圈电机等。
 技术问题
传统的硅片台，如专利EP 0729073和专利US 5996437所描述的，光刻机中只有一个硅片运动定位单元，即一个硅片台。调平调焦等准备工作都要在上面完成，这些工作所需的时间很长，特别是对准，由于要求进行精度极高的低速扫描(典型的对准扫描速度为1mm/s)，因此所需时间很长。而要减少其工作时间却非常困难。这样，为了提高光刻机的生产效率，就必须不断提高硅片台的步进和曝光扫描的运动速度。而速度的提高将不可避免导致系统动态性能的恶化，需要采取大量的技术措施保障和提高硅片台的运动精度，为保持现有精度或达到更高精度要付出的代价将大大提高。
专利WO98/40791(公开日期：1998.9.17；国别：荷兰)所描述的结构采用双硅片台结构，将上下片、预对准、对准等曝光准备工作转移至第二个硅片台上，且与曝光硅片台同时独立运动。在不提高硅片台运动速度的前提下，曝光硅片台大量的准备工作由第二个硅片台分担，从而大大缩短了每片硅片在曝光硅片台上的工作时间，大幅度提高了生产效率。然而该系统存在的主要缺点在于硅片台系统的非质心驱动问题。
本申请人在2009年申请的发明专利“一种光刻机硅片台双台交换装置”(公开号：CN 201364459)公开了一种光刻机的双台交换系统，其有结构简单，空间利用率高以及无需对接辅助装置等优点。但是该双硅片台系统也存在一些问题，在基台下方安装旋转电机，结构复杂，交换时整个基台被旋转，由于基台上装有X、Y向直线电机以及粗动台、微动台等，转动惯量大，电机功率大，不易精确控制和定位，另外也容易受到线缆等辅助装置的影响。
 技术解决方案
针对现有技术的不足和缺陷，本发明的目的是提供一种设置旋转交换桥的光刻机硅片台双台交换系统，以克服已有硅片台双台交换系统存在非质心驱动、结构复杂、要求极高的导轨对接精度、转动惯量大等缺点，使其具有结构简单，空间利用率高，电机功率小，转动惯量小，无需导轨对接装置等优点，进而提高光刻机的曝光效率。
本发明的技术方案为：一种光刻机硅片台双台交换系统，该系统含有运行于曝光工位 的硅片台和运行于预处理工位的硅片台，所述的两个硅片台设置在一基台上，其特征在于：在所述的基台下层设置有一个旋转电机；运行于曝光工位的硅片台和运行于预处理工位的硅片台在分别完成曝光和预处理工作后，旋转电机驱动基台上的两硅片台同步逆时针旋转180°，从而实现两硅片台的工位交换。在交换过程中，基台固定不动。
本发明所述基台两侧长边边缘X方向分别设置有两条直线电机定子磁钢，由X方向运动的第一单自由度驱动单元和第二单自由度驱动单元共用第一直线电机定子磁钢；所述由X方向运动的第三单自由度驱动单元和第四单自由度驱动单元共用第二直线电机定子磁钢；Y方向第一导轨分别与X方向运动的第一单自由度驱动单元和第三单自由度驱动单元联结，共同驱动第一硅片台在X-Y平面运动；Y方向第二导轨分别与X方向运动的第二单自由度驱动单元和第四单自由度驱动单元联结，共同驱动第二硅片台在X-Y平面运动；所述在基台周围分别布置有测量X方向位移的双频激光干涉仪，测量Y方向位移的双频激光干涉仪。
本发明的技术特征还在于：旋转电机的输出轴穿过基台，输出轴末端连接交换桥，交换桥包括交换桥主体，交换桥主体两侧分别设置锁紧装置，两锁紧装置分别对应两硅片支撑平台的微动台的可移动部分。
本发明的又一技术特征是：所述锁紧装置可相对交换桥主体伸出和缩回。
 有益效果
本发明与现有技术相比，具有以下突出的优点：该系统在基台下层设有旋转电机，旋转电机仅驱动微动台可移动部分和硅片台旋转，以实现两个硅片台的工位交换，基台并不旋转，因此避免了大的转动惯量和大功率电机，省去导轨对接装置等，大大简化了系统结构，同时交换简单易控，操作方便。
附图说明
图1为光刻机的工作原理示意图。
图2为现有技术中光刻机的硅片支撑平台的结构示意图。
图3为本发明提供的光刻机硅片台双台交换系统的结构示意图。
图4为本发明提供的光刻机硅片台双台交换前的俯视图。
图5为本发明提供的光刻机硅片台双台交换后的俯视图。
图中：2-预处理工位；3-曝光工位；9.1-第一直线电机定子磁钢；9.2-第二直线电机定子磁钢；4-第一单自由度驱动单元;；5-第二单自由度驱动单元；6-第三单自由度驱动单元；7-第四单自由度驱动单元；11.1-测量X方向位移的第一双频激光干涉仪、11.2-测量X方向位移的第二双频激光干涉仪；8-粗动模块的静止部分；10-粗动模块的可移动部分；12-微动模块的静止部分；14-微动模块的可移动部分；16.1-第一硅片台；16.2－第二硅片台；18-粗动模块；20-微动模块；13.1-测量Y方向位移的双频激光干涉仪；13.2-测量Y方向位移的双频激光干涉仪；15.1-Y方向第一导轨；15.2-Y方向第二导轨；30-基台；40-交换桥主体；41-旋转电机；42-旋转电机的输出轴；43.1-第一锁紧装置；43.2第二锁紧装置；45-光源；47-掩模版；49-透镜系统；50-硅片。
 本发明的实施方式
下面结合附图来具体说明本发明光刻机硅片台双台交换装置。
图2为硅片支撑平台的结构示意图，硅片支撑平台包括粗动模块18和微动模块20。粗动模块18和微动模块20均包括静止部分、可移动部分和驱动部分。连接到基台30的是粗动模块18的静止部分8。粗动模块18的可移动部分相对于静止部分是可移动的。连接到粗动模块18的可移动部分10的是微动模块20的静止部分12。微动模块20的可移动部分14相对于静止部分12是可移动的。
图3显示了本发明硅片台双台交换的结构示意图，两硅片支撑平台的微动台的可移动部分分别连接第一硅片台16.1和第二硅片台16.2，两硅片支撑平台的粗动台的静止部分分别连接基台30。基台30下层设置一旋转电机41，旋转电机41的输出轴42穿过基台30，旋转电机输出轴末端连接交换桥，交换桥包括交换桥主体40，交换桥主体40两侧分别设置第一锁紧装置43.1和第二锁紧装置43.2，两锁紧装置分别对应两硅片支撑平台的微动台的可移动部分14。交换时，两硅片支撑平台运动到交换桥的两侧，两锁紧装置分别锁紧两硅片支撑平台的微动台的可移动部分，旋转电机41带动旋转电机旋转轴42、交换桥及两可移动部分和第一硅片台16.1和第二硅片台16.2逆时针精确旋转180°，精确定位后第一锁紧装置43.1和第二锁紧装置43.2解锁，完成交换。而硅片支撑平台的其它部分，如粗动台及微动台的静止部分，以及基台30均固定不动。其中第一锁紧装置43.1和第二锁紧装置43.2可相对于交换桥主体40伸出和缩回，以避免与硅片支撑平台发生干涉，并节约空间。锁紧装置公知的可以为真空吸附轴承等。
图4显示本发明光刻机硅片台双台交换前俯视图，基台30，一个预处理工位2，一个曝光工位3。第一硅片台16.1运行于预处理工位2，第二硅片台16.2运行于曝光工位3。基台30两侧长边边缘X方向分别设置有两条直线电机定子磁钢，即第一直线电机定子磁钢9.1和第二直线电机定子磁钢9.2，由X方向运动的第一单自由度驱动单元4和第二单自由度驱动单元5共用第一直线电机定子磁钢9.1，相同的，由X方向运动的第三单自由度驱动单元6和第四单自由度驱动单元7共用第二直线电机定子磁钢9.2；Y方向第一导轨15.1穿过硅片支撑平台并驱动第一硅片台16.1沿Y方向运动，并且Y方向第一导轨15.1分别与X方向运动的第一单自由度驱动单元4和第三单自由度驱动单元6联结，共同驱动第一硅片台16.1在X-Y平面运动，相同的，Y方向导轨15.2穿过另一硅片支撑平台并驱动硅片台16.2沿Y方向运动，并且Y方向第二导轨15.2分别与X方向运动的第二单自由度驱动单元5和第四单自由度驱动单元7联结，共同驱动第二硅片台16.2在X-Y平面运动；基台30周围分别布置有测量X方向位移的第一双频激光干涉仪11.1和测量X方向位移的第二双频激光干涉仪11.2，以及测量Y方向位移的第一双频激光干涉仪13.1和测量Y方向位移的第一双频激光干涉仪13.2。
硅片支撑平台底部装有真空预载气浮轴承，基台30上表面为导向面，Y方向导轨从硅片支撑平台内部贯穿，Y方向导轨上安装有直线电机定子磁钢，线圈作为直线电机动子安装在硅片支撑平台上，在硅片支撑平台两个内侧垂直面装有闭式预载气浮轴承来约束Y方向导轨与硅片台沿Y方向的相对运动。
单自由度驱动单元的底部均装有直线电机线圈动子和真空预载气浮轴承，第一直线电机定子磁钢定子9.1和第二直线电机定子磁钢9.2分别安装在基台30长边两侧。第一单自由度驱动单元4和第三单自由度驱动单元6与Y方向第一导轨15.1联接，驱动第一硅片台16.1沿X-Y平面运动。第二单自由度驱动单元5和第四单自由度驱动单元7与Y方向第二导轨15.2联接，驱动第二硅片台16.2沿X-Y平面运动。
图5显示本发明光刻机硅片台双台交换后俯视图。交换后，原来在曝光工位3的第二硅片台16.2连同微动台可移动部分转移到预处理工位2，进行下片等处理；原来在预处理工位2的第一硅片台16.1连同微动台可移动部分转移到曝光工位3，进行曝光处理。交换时其它部分，如粗动台、基台、微动台静止部分、测量装置等均固定不动。

Claims (4)

  1. 一种光刻机硅片台双台交换系统，该交换系统包括运行于预处理工位(2)的第一硅片台(16.1)和运行于曝光工位(3)的第二硅片台(16.2)，所述两个硅片台设置在一基台(30)上，其特征在于：在所述的基台(30)下层设置有一个旋转电机(41)，运行于曝光工位(3)的第二硅片台(16.2)和运行于预处理工位(2)的第一硅片台(16.1)在分别完成曝光和预处理工作后，旋转电机(41)驱动基台(30)上的两硅片台(16.1、16.2)同步逆时针旋转180°，从而实现两硅片台的工位交换，在交换过程中，基台（30）固定不动。
  2. 按照权利要求1所述的一种光刻机硅片台双台交换系统，其特征在于：所述基台(30)两侧长边边缘X方向分别设置有两条直线电机定子磁钢(9.1、9.2)，由X方向运动的第一单自由度驱动单元(4)和第二单自由度驱动单元(5)共用第一直线电机定子磁钢(9.1)；所述由X方向运动的第三单自由度驱动单元(6)和第四单自由度驱动单元(7)共用第二直线电机定子磁钢(9.2)；Y方向第一导轨(15.1)分别与X方向运动的第一单自由度驱动单元(4)和第三单自由度驱动单元(6)联结，共同驱动第一硅片台(16.1)在X-Y平面运动；Y方向第二导轨(15.2)分别与X方向运动的第二单自由度驱动单元(5)和第四单自由度驱动单元(7)联结，共同驱动第二硅片台(16.2)在X-Y平面运动；所述在基台(30)周围分别布置有测量X方向位移的双频激光干涉仪(11.1、11.2)，测量Y方向位移的双频激光干涉仪(13.1、13.2)。
  3. 按照权利要求1或2所述的一种光刻机硅片台双台交换系统，其特征在于：旋转电机(41)的输出轴(42)穿过基台(30)，输出轴(42)末端连接交换桥，交换桥包括交换桥主体(40)，交换桥主体(40)两侧分别设置锁紧装置(43.1、43.2)，两锁紧装置分别对应两硅片支撑平台的微动台的可移动部分(14)。
  4. 按照权利要求3所述的一种光刻机硅片台双台交换系统，其特征在于：两锁紧装置(43.1、43.2)相对于交换桥主体(40)伸出和缩回。
PCT/CN2012/072974 2011-04-01 2012-03-23 光刻机硅片台双台交换系统 WO2012130108A1 (zh)

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