WO2012122685A1 - Fpc stratifié pour téléphone cellulaire à couvercle pliant/coulissant et son procédé de fabrication - Google Patents

Fpc stratifié pour téléphone cellulaire à couvercle pliant/coulissant et son procédé de fabrication Download PDF

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Publication number
WO2012122685A1
WO2012122685A1 PCT/CN2011/000809 CN2011000809W WO2012122685A1 WO 2012122685 A1 WO2012122685 A1 WO 2012122685A1 CN 2011000809 W CN2011000809 W CN 2011000809W WO 2012122685 A1 WO2012122685 A1 WO 2012122685A1
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WO
WIPO (PCT)
Prior art keywords
fpc
layer
layered
flip
layers
Prior art date
Application number
PCT/CN2011/000809
Other languages
English (en)
Chinese (zh)
Inventor
林均秀
Original Assignee
珠海元盛电子科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 珠海元盛电子科技股份有限公司 filed Critical 珠海元盛电子科技股份有限公司
Publication of WO2012122685A1 publication Critical patent/WO2012122685A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly

Definitions

  • the present invention relates to a flexible printed circuit board and a method of fabricating the same, and more particularly to a layered FPC for a flip/slider handpiece and a method of fabricating the same.
  • the layers of the multi-layer board are hard when the layers are bonded together. On the other hand, the stress between the layers cannot be released during the rotation.
  • the flip cover life of such boards is very short, and it is prone to local line breakage and failure under normal use conditions, and only a few thousand to tens of thousands of times appear black screen or flower screen phenomenon, which seriously restricts the stable use of the mobile phone. Therefore, the shortcomings of the existing FPC for flipping the mobile phone shaft are as follows:
  • the technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and to provide a layered FPC and a manufacturing method which are simple in design and can significantly improve the life of the flip or slide of the flip/slider mobile phone.
  • the technical solution adopted by the layered FPC involved in the present invention is: a layered FPC for a flip/slider mobile phone, connected between the mobile phone main board and the upper flip/slider main board, including at least two layers of FPC a veneer and an adhesive layer disposed in a partial region between two adjacent FPC veneers.
  • the FPC veneers of each layer are freely separated, and two adjacent layers are No adhesive layer is disposed between the FPC boards; the bonding layer is disposed between the FPC boards of the fixed areas of the two ends of the layered FPC and is tightly fixed.
  • the flip phone shaft plate is designed as the above-mentioned layered structure, it is necessary to design a layer of the middle portion of the movement of the rotating shaft.
  • the layers can be arbitrarily opened, and the other parts that are fixed after assembly are designed to be in a bonding mode to have sufficient rigidity and rigidity to support the connector of the mobile phone main board and the upper flip board.
  • the adhesive layer is a prepreg or an adhesive film.
  • electrical performance vias are disposed on each of the FPC boards and the bonding layers of the fixed area.
  • the FPC board included in the layered FPC is generally 2 to 8 layers.
  • A cutting, cutting the substrate of each layer of the FPC veneer and the bonding layer to be bonded, and punching off the portion of the bonding layer located in the bending region;
  • Multi-layer composite using the positioning holes formed as described above, the prepared inner layer FPC single board, the outermost two layers of the FPC single board substrate and the partially punched adhesive layer are used exclusively.
  • the jig is pressed together in a fixed area;
  • each of the FPC boards includes a plurality of FPC units, and a plurality of FPC units are uniformly fabricated, and a bonding layer in each of the FPC units is located in the bending area. Partial die cutting is performed, and after the completion of the step E, the shape is punched to obtain an FPC unit product, which can improve production efficiency.
  • step D press-bonding is carried out by means of thermocompression bonding.
  • the beneficial effects of the present invention are as follows: Since the layered FPC of the present invention is freely barrier between the FPC boards of the two layers in the bending region of the intermediate portion, no adhesive layer is disposed between the FPC boards of the two adjacent layers. The bonding layer is disposed between the FPC boards of the fixed areas at both ends of the layered FPC and is tightly fixed.
  • the structure of the partial layering design of the bending area can effectively remove the stress and make the FPC bend.
  • the folding life is increased, and the partial layered structure design method can ensure the conduction and free extension of the lines between different layers, reduce the thickness of the bending area and the stress generated during the bending or assembly process, and the structure is simple but can greatly improve the flexibility.
  • the life of bending or sliding of the circuit board can increase the life of the flip phone flip cover to more than 100,000 times to meet the requirements of the mobile phone.
  • FIG. 1 is a schematic view showing a layered area of a FPC of a flip phone shaft plate according to the present invention
  • Fig. 2 is a cross-sectional view showing the layered area of the FPC of the flip phone shaft plate in the present invention.
  • the flip phone is taken as an example in this embodiment, and the slider phone is similar.
  • the invention relates to a layered FPC for moving around a hinge of a flip phone, which is connected between the mobile phone main board and the upper flip board, and is fixedly connected by the respective connectors of the mobile phone main board and the upper flip board, for transmitting the mobile phone main board and Data on the flip top board.
  • the layered FPC is a multi-layer board comprising at least two layers of FPC boards 3 and an adhesive layer 4 disposed in a partial region between adjacent two layers of FPC boards 3, the bonding layer 4 being a prepreg or bonding
  • the number of layers of the FPC veneer 3 is generally designed to be 2 to 8 layers; in the bending region 1 of the intermediate portion of the layered FPC, the FPC boards 3 of each layer are freely separated, and the FPC of two adjacent layers
  • the bonding layer 4 is not disposed between the veneers 3; the bonding layer 4 is disposed between the FPC boards 3 of the fixing regions 2 at both ends of the layered FPC and is tightly fixed, the fixing
  • the area 2 is designed in a bonding mode, on the one hand for fixing the FPC boards 3 of each layer, and on the other hand having sufficient twist and rigidity to support and connect the connectors of the mobile phone main board and the upper flip board.
  • the partial layered design of the intermediate part bending field 1 can be freely extended as the shaft moves, and the stress can be effectively removed to increase the FPC bending life. Similar to the prior art multi-layer board, electrical performance via holes are provided on the FPC single board 3 and the bonding layer 4 of each of the fixed areas 2 to ensure the conduction of the lines between the different layers.
  • the method for fabricating the layered FPC is to use a single panel, and each layer is bonded by a film or a prepreg.
  • the layer or the prepreg is pre-cleaned, and the layers are combined according to the positioning.
  • the hole is strictly in good position, and various production parameters are controlled.
  • the produced layered area of the finished product will be naturally layered, including the following steps:
  • A cutting, cutting the substrate of each layer of the FPC veneer 3 and bonding the bonding layer 4, and punching off the portion of the bonding layer 4 located in the bending region 1;
  • C drilling, drilling the outer side of each FPC veneer 3 or bonding layer 4 (prepreg or film) shape to form positioning holes and air guiding holes in the subsequent multilayer composite process
  • D Multi-layer composite, using the positioning holes formed above, the inner layer FPC veneer 3 of the prepared circuit, the outermost two layers of the FPC veneer 3, and the partially die-cut bonding layer 4 Use special fixtures to press together in the fixed area. The hot pressing process is generally used in the existing process
  • each of the above FPC boards may include a plurality of FPC units, and a plurality of FPC units on each board are uniformly fabricated in the production process, and correspondingly corresponding to each layer of the bonding layer. If a plurality of FPC units are partially punched in the bending region, and then integrally pressed, and then after the step E is completed, the shape is punched to obtain an FPC unit product, which can greatly improve the production efficiency.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention porte sur un FPC stratifié pour téléphone cellulaire à couvercle pliant/coulissant et sur son procédé de fabrication. Le FPC stratifié est connecté entre la carte principale de téléphone cellulaire et une carte principale de couvercle pliant/coulissant, et comprend une planche FPC (3) d'au moins 2 couches et une couche adhésive (4) qui est disposée dans une zone partielle entre des planches FPC (3) à deux couches adjacentes. Dans une zone courbée (1) dans la partie intermédiaire du FPC stratifié, diverses planches FPC (3) sont librement espacées, et la couche adhésive (4) peut ne pas être disposée entre les planches FPC adjacentes ; la couche adhésive (4) peut être disposée entre diverses planches FPC (3) d'une zone fixe (2) de deux bornes du FPC stratifié afin de les rendre étroitement fixées.
PCT/CN2011/000809 2011-03-15 2011-05-09 Fpc stratifié pour téléphone cellulaire à couvercle pliant/coulissant et son procédé de fabrication WO2012122685A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110061768.6 2011-03-15
CN 201110061768 CN102186304A (zh) 2011-03-15 2011-03-15 用于翻盖/滑盖手机的分层fpc及制作方法

Publications (1)

Publication Number Publication Date
WO2012122685A1 true WO2012122685A1 (fr) 2012-09-20

Family

ID=44572356

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/000809 WO2012122685A1 (fr) 2011-03-15 2011-05-09 Fpc stratifié pour téléphone cellulaire à couvercle pliant/coulissant et son procédé de fabrication

Country Status (2)

Country Link
CN (1) CN102186304A (fr)
WO (1) WO2012122685A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106604570A (zh) * 2016-12-21 2017-04-26 深圳市景旺电子股份有限公司 一种柔性分层板及其制作方法
CN109076121B (zh) * 2018-02-02 2020-11-17 华为技术有限公司 一种滑盖式终端
CN109548272B (zh) * 2018-11-16 2020-09-15 深圳欣旺达智能科技有限公司 耐弯折fpc及其制造方法
CN112505856A (zh) * 2020-12-23 2021-03-16 江苏奥雷光电有限公司 一种高速mini光电转换模块设计及工艺方法
CN114628067B (zh) * 2022-03-24 2023-11-24 苏州思源科安信息技术有限公司 一种基于多层分离式柔性fpc排线及其应用设备

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CN1805652A (zh) * 2005-01-11 2006-07-19 株式会社有泽制作所 软性印刷电路板和多层软性印刷电路板及便携式电话终端
CN2831690Y (zh) * 2005-03-15 2006-10-25 惠州Tcl移动通信有限公司 柔性印制线路板及其折叠手机
CN1976396A (zh) * 2005-11-28 2007-06-06 三星电机株式会社 照相机组件封装件

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TWI310860B (en) * 2002-11-13 2009-06-11 Toppoly Optoelectronics Corp Assembly structure for flat panel display
US7377032B2 (en) * 2003-11-21 2008-05-27 Mitsui Mining & Smelting Co., Ltd. Process for producing a printed wiring board for mounting electronic components
CN201039143Y (zh) * 2007-04-24 2008-03-19 宁波萨基姆波导研发有限公司 一种移动终端射频电路与天线的连接结构
CN201585201U (zh) * 2010-01-28 2010-09-15 华为终端有限公司 一种含有数据接头的电子产品及挠性印制电路板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1805652A (zh) * 2005-01-11 2006-07-19 株式会社有泽制作所 软性印刷电路板和多层软性印刷电路板及便携式电话终端
CN2831690Y (zh) * 2005-03-15 2006-10-25 惠州Tcl移动通信有限公司 柔性印制线路板及其折叠手机
CN1976396A (zh) * 2005-11-28 2007-06-06 三星电机株式会社 照相机组件封装件

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