WO2012111154A1

WO2012111154A1 - Probe inspection method and cured resin composition

Info

Publication number: WO2012111154A1
Application number: PCT/JP2011/053552
Authority: WO
Inventors: 剛介中島; 渡辺　淳
Original assignee: 電気化学工業株式会社
Priority date: 2011-02-18
Filing date: 2011-02-18
Publication date: 2012-08-23

Abstract

Provided are: a probe inspection method that confirms the state of a probe for inspecting the electrical characteristics of a subject of inspection; and a cured resin composition used in the probe inspection method. The probe inspection method contains a step wherein a cured body of a specific cured resin composition is brought into contact with the probe for inspecting the electrical characteristics of a subject of inspection, the needle mark of the probe is transferred to the cured body, the state of the probe is confirmed on the basis of the transferred needle mark, and after transferring the needle mark of the probe, the cured body is heated to at least the glass transition temperature of the cured body, eliminating the needle mark of the probe. By means of the step, the cured body is repeatedly made available for inspecting. The cured resin composition contains a specific monofunctional (meth)acrylate, a photoinitiator, and an antioxidant. The glass transition temperature of the cured body of the cured resin composition is 40-100°C inclusive.

Description

Probe inspection method and curable resin composition

The present invention relates to an inspection method for inspecting the state of a probe, a curable resin composition used for transferring a probe trace in a probe inspection step, a cured body obtained by curing the curable resin composition, and the cured body The present invention relates to a probe inspection apparatus including a sheet made of

In determining the quality of an IC chip formed on a wafer in a semiconductor manufacturing process, the electrical characteristics are generally inspected using a probe device. When inspecting the electrical characteristics of the IC chip using the probe device, it is necessary to align the probe in order to bring the electrode pad on the IC chip into contact with the probe provided on the probe card.

Conventionally, for probe alignment, the tip of the probe is photographed with a CCD camera or the like, and the position of the probe tip is determined based on the X and Y coordinate positions at this time. However, this method has a problem that it takes a long time to align the probe because it takes time to focus the camera on the tip of the probe.

Also, in order for the electrode pad on the IC chip and the probe to make electrical contact, it is necessary to push the tip of the probe to a certain predetermined depth. Depending on the probe, the position of the tip of the probe may shift in a certain direction when pushed. However, the conventional probe positioning method determines the position of the tip of the probe in a non-contact state, and does not take into account the shift at the time of contact.

In order to solve the above problems, there is provided a probe inspection method and a probe inspection apparatus that provide a member for transferring a needle trace, transfer the probe trace of the probe to the member, and align the probe based on the transferred needle trace. Proposed.

For example, in Patent Literature 1, the traces of the tips of a plurality of probes on a probe card are transferred to a deformed body before inspection, and the push-in depth of the probe into the electrode is calculated based on the size of the needle trace opening. The time required for alignment is shortened.

In Patent Document 2, a support base is provided in the probe device, and a sheet for providing a probe trace on the support base is provided, and the probe is aligned based on the transferred needle trace. Proposed.

In Patent Document 3, the needle trace transferred to the needle trace evaluation wafer is image-recognized, and the needle trace of the probe needle is evaluated by superimposing the virtual electrode pad and the image-recognized needle trace. An evaluation method has been proposed.

In Patent Document 4, a probe is brought into contact with a probe position adjusting film made of an elastomer composition to make a scar, and the positional relationship between the scar and the electrode portion of the integrated circuit is confirmed. A method for adjusting the position of the probe is described.

In Patent Document 5, a transparent film is pasted on a detection substrate on which an electrode is formed, and the position of the needle trace transferred on the transparent film is compared with the position of the electrode on the substrate. A method is described in which the probe is positioned with high accuracy without being affected by the repetition accuracy of movement.

Further, in Patent Document 6, when performing an inspection at a high temperature, the probe is pressed against the transfer sheet at a high temperature to transfer the needle trace, thereby preventing the displacement of the probe due to the thermal expansion of the probe card, A method for positioning the probe with high accuracy even at high temperatures is described. Further, a method of repeatedly using the transfer sheet by melting the transfer sheet by heating to eliminate the needle trace has been proposed.

Further, Patent Document 7 discloses that a needle shape transfer member uses a shape memory polymer that reversibly and rapidly changes between a glass state having a high elastic modulus and a rubber state having a low elastic modulus at a glass transition temperature. It is described that the trace can be erased in a very short time to increase the throughput, and that the influence of temperature can be reduced during high temperature inspection.

Patent Document 8 discloses a curable resin composition containing a monofunctional (meth) acrylate and / or (meth) acrylamide and a photopolymerization initiator as a needle trace transfer member and having a glass transition temperature of 130 ° C. or lower. The article describes that needle traces can be easily erased by heating above the glass transition temperature and can be used repeatedly.

JP 2001-189353 A JP 2004-327805 A JP 2007-200904 A JP 2005-308549 A Japanese Patent Laid-Open No. 2007-273631 Japanese Patent Laying-Open No. 2005-079253 JP 2009-198407 A International Publication No. 2009/107558 JP 2004-176032 A JP 2007-273026 A

However, in Patent Document 1, although it is described that the deformable body is heated to refill the needle traces and reused, examples of the material of the deformable body include low melting point metals, alloys, or organic insulators. However, specific materials and heating conditions for implementing reuse are not shown.

Further, in Patent Document 2, when transferring a needle trace a plurality of times, the transfer position of the needle trace must be shifted each time, so the number of repetitions is limited, and the probe is further displaced from a predetermined position. In some cases, there is a possibility of overlapping with the last transferred needle trace. Further, no method for reusing the sheet other than shifting the needle mark transfer position is shown.

Further, Patent Documents 3 and 4 do not mention the reuse of the needle trace transfer member, and in Patent Document 4, in particular, the heat resistance remaining of the needle trace is imparted so that the needle trace does not disappear. Therefore, it is difficult to eliminate the needle trace and reuse it.

Further, in Patent Document 5, the adhesiveness of the transparent film is lowered by ultraviolet irradiation, and the detection substrate can be reused by peeling the film. However, the method for reusing the transparent film is not shown.

Moreover, in patent document 6, although a sheet | seat trace is erase | eliminated by heating-melting a sheet | seat and it can be used repeatedly, in order to stick a sheet | seat through an adhesive, it is the adhesive and a resin sheet by repeated heating and melting. There is a possibility that the desired properties may not be obtained due to the migration of each component or the progress of the degradation reaction.

In Patent Document 7, it is possible to erase the needle trace for a short time by using the shape memory polymer. However, the shape memory polymer is set to a temperature lower than that of the wafer chuck holding the wafer during the transfer of the needle trace. Therefore, there is a possibility that the temperature difference may adversely affect the high temperature inspection. In general, a shape memory polymer is deformed in a state of being heated to a temperature higher than the glass transition temperature, and the shape is memorized by cooling while maintaining the state. However, since Patent Document 7 performs needle trace transfer at a temperature lower than the glass transition temperature, the shape of the needle tip may not be memorized.

Further, Patent Document 8 describes that a polyfunctional (meth) acrylate having two or more functions may be contained. Even if polyfunctional (meth) acrylate is not used, there is no description that cracks do not occur around the needle traces when forming the needle traces.

In Patent Documents 9 and 10, there is no description that changes the shape of the cured body of the curable resin composition by heating. In Patent Document 10, the storage stability of the curable resin composition is improved by blending a polymerization inhibitor. This improvement in stability is in the liquid state before curing, and is shown below. There is no description about the durability improvement of the cured body of such a curable resin composition.

The present invention has been made in view of the above circumstances, and an object thereof is an inspection method capable of repeatedly inspecting a probe without exchanging a member for transferring a needle trace for each inspection or for each type of wafer. Is to provide. It is another object of the present invention to provide a curable resin composition that can be easily transferred by contact with a probe and that can easily be erased by a simple method. Moreover, it is providing the hardening body formed by hardening | curing such a curable resin composition. Moreover, it is providing the inspection apparatus of a probe provided with the sheet | seat which consists of this hardening body.

In one aspect of the present invention, a cured body of the curable resin composition is brought into contact with a probe for inspecting the electrical characteristics of an object to be inspected, and the needle trace of the probe is transferred to the cured body, and the transferred needle trace is used as a basis. And confirming the state of the probe and transferring the probe traces of the probe, and then heating the cured body to a temperature equal to or higher than the glass transition temperature of the cured body to erase the probe traces of the probe. It is a probe inspection method for repeated inspections,
The curable resin composition is
(A) a monofunctional (meth) acrylate having a saturated alicyclic hydrocarbon group having 9 to 12 carbon atoms via an ester bond,
(B) a monofunctional (meth) acrylate having a saturated hydrocarbon group having 5 to 18 carbon atoms (excluding a saturated alicyclic hydrocarbon group) shown in the following (1) to (3) via an ester bond; At least one monofunctional (meth) acrylate selected from the group consisting of monofunctional (meth) acrylates having an alkoxyalkyl group having 2 to 8 carbon atoms via an ester bond:

(C) a photopolymerization initiator,
(D) A probe inspection method containing an antioxidant and having a glass transition temperature of 40 ° C. or more and 100 ° C. or less of a cured product of the curable resin composition.

In the probe inspection method according to the present invention, in one embodiment, the thickness of the cured body of the curable resin composition is 20 to 100 μm.

In another aspect of the present invention,
(A) a monofunctional (meth) acrylate having a saturated alicyclic hydrocarbon group having 9 to 12 carbon atoms via an ester bond,
(B) a monofunctional (meth) acrylate having a saturated hydrocarbon group having 5 to 18 carbon atoms (excluding a saturated alicyclic hydrocarbon group) shown in the following (1) to (3) via an ester bond; At least one monofunctional (meth) acrylate selected from the group consisting of monofunctional (meth) acrylates having an alkoxyalkyl group having 2 to 8 carbon atoms via an ester bond:

(C) a photopolymerization initiator,
(D) A curable resin composition for transferring a probe trace of a probe containing an antioxidant and having a glass transition temperature of 40 ° C. or higher and 100 ° C. or lower of a cured product of the curable resin composition.

In one embodiment, the curable resin composition according to the present invention is:
Component (A) is 10 to 99 parts by weight, component (B) is 1 to 90 parts by weight, and (C) photopolymerization initiator is 0.1 parts by weight with respect to 100 parts by weight as a total of component (A) and component (B). 1 to 20 parts by mass and (D) 0.001 to 3 parts by mass of an antioxidant.

In yet another aspect, the present invention provides a cured body for transferring a probe mark of a probe formed by curing the curable resin composition.

In another aspect of the present invention,
A sheet made of the cured product,
A support table on which the sheet is placed;
A heating device for heating the sheet above the glass transition temperature of the cured body;
A probe card having a probe;
An inspection apparatus for a probe, comprising: an imaging device for confirming a state of the probe based on a probe mark transferred to the sheet.

According to the inspection method of the present invention, it is possible to repeatedly inspect the probe without exchanging the member for transferring the needle trace for each inspection or for each type of wafer.

The cured product of the curable resin composition according to the present invention is a copolymer of (A) and (B). The cured product of the curable resin composition according to the present invention generally has a two-phase structure of a stationary phase for preventing resin fluidity and a softened / cured reversible phase in which softening and curing occur reversibly with temperature change. It is different from the shape memory polymer.

According to the curable resin composition of the present invention, the member that transfers the needle trace can be brought into contact with the probe to easily transfer the needle trace, and the member that transfers the needle trace is heated to the glass transition temperature or higher. Thus, the needle trace can be easily erased, and the effect that the sheet made of the cured body does not melt when heated is obtained. In particular, by containing an antioxidant, the storage stability and durability are improved, and in particular, even when repeatedly heated above the glass transition temperature, the cured product does not deteriorate and the effect of high durability can be obtained.

According to the inspection apparatus according to the present invention, the needle trace can be easily transferred by being brought into contact with the probe, and the needle trace can be easily erased by heating to the glass transition temperature or higher. The inspection of the probe can be repeatedly performed without changing every inspection or every kind of wafer.

It is drawing explaining the inspection apparatus of this Embodiment 2. FIG.

[Explanation of terms]
In the present specification, the “curable resin composition” means a mixture containing a resin that is cured by light irradiation to form a cured product. In general, the curable resin composition has a temperature range that is a glass transition temperature described below.

In this specification, the “glass transition temperature” is a temperature at which the liquid state (rubber state) reversibly changes to an amorphous solid (glass state) or an amorphous solid (glass state) to a liquid state (rubber state). ) Means a reversibly changing temperature. In general, the glass transition temperature is defined by, for example, JIS K 7121.

In this specification, the symbol “to” means “above” and “below”, for example, “A to B” means more than A and less than B.

[Background of the invention]
The inventor can transfer the needle trace by bringing a probe into contact with a cured body of a specific curable resin composition, and then heating the cured body to a temperature higher than the glass transition temperature. The needle trace can be erased, and furthermore, by obtaining a cured body of the curable resin composition as a thin film, the needle trace transferred onto the cured body and the reference position formed on the wafer can be observed simultaneously with the same focus. The present invention has been obtained and the present invention has been achieved.

[Embodiment 1: Curable resin composition]
The curable resin composition according to this embodiment is
(A) a monofunctional (meth) acrylate having a saturated alicyclic hydrocarbon group having 9 to 12 carbon atoms via an ester bond,
(B) a monofunctional (meth) acrylate having a saturated hydrocarbon group having 5 to 18 carbon atoms (excluding a saturated alicyclic hydrocarbon group) shown in the following (1) to (3) via an ester bond; At least one monofunctional (meth) acrylate selected from the group consisting of monofunctional (meth) acrylates having an alkoxyalkyl group having 2 to 8 carbon atoms via an ester bond:

According to the acrylic curable resin composition, the needle trace can be easily transferred by bringing the needle trace transfer member into contact with the probe, and the needle trace transfer member is heated to the glass transition temperature or higher. With this, it is possible to easily erase the needle trace.

Hereinafter, each component of the curable resin composition according to the present embodiment will be described.

((A) monofunctional (meth) acrylate having a saturated alicyclic hydrocarbon group having 9 to 12 carbon atoms via an ester bond)
Examples of the saturated alicyclic hydrocarbon group having 9 to 12 carbon atoms include a dicyclopentanyl group, an isobornyl group, an adamantyl group, and the like. From the viewpoint of cost, a dicyclopentanyl group and an isobornyl group are particularly preferable. Groups and the like. As for acrylate and methacrylate, acrylate is preferably selected because it has a high curing rate.

Examples of the monofunctional (meth) acrylate having a saturated alicyclic hydrocarbon group having 9 to 12 carbon atoms via an ester bond include 2-methyl-2-adamantyl (meth) acrylate and 2-ethyl-2-adamantyl. (Meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, and the like, preferably isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, 2-methyl-2-adamantyl (meth) ) Acrylate, etc., more preferably isobornyl (meth) acrylate, etc., which may be used alone or in combination of two or more. These monofunctional (meth) acrylates are preferable in terms of imparting needle trace transferability.

Moreover, the curable resin composition of this invention has the glass transition temperature of the hardened | cured material of 40 to 100 degreeC. When the glass transition temperature of the cured body is 40 ° C. or more and 100 ° C. or less, the cured curable resin composition is cured in the step of erasing the probe traces by heating the cured body after transferring the probe traces of the probe. It can suppress that the sheet | seat which consists of a body fuse | melts and flows at the time of a heating. If the glass transition temperature is within this range, good needle trace transferability and needle trace erasability can be obtained at a temperature at which the electrical characteristics of the IC chip are inspected, for example, at room temperature or at a high temperature. As room temperature, 20 degreeC or more and 30 degrees C or less are preferable. As high temperature, 70 degreeC or more and 100 degrees C or less are preferable, 70 degreeC or more and less than 100 degreeC are more preferable, and 80 degreeC or more and 90 degrees C or less are more preferable. When the glass transition temperature of the cured body is less than 40 ° C., it becomes difficult to transfer the probe traces of the probe, and when the glass transition temperature of the cured body exceeds 100 ° C., it becomes difficult to erase the probe traces of the probe.
In order to set the glass transition temperature of the cured product to 40 ° C. or more and 100 ° C. or less, in the curable resin composition, a monofunctional (meta) having a saturated alicyclic hydrocarbon group having 9 to 12 carbon atoms via an ester bond. ) Acrylate may be used. The curable resin composition of the present invention has a glass transition temperature of 40 ° C. or more and 100 ° C. or less of the cured product, but further suppresses the melting behavior during heating of the sheet made of the cured product of the curable resin composition. For this purpose, it is preferably 50 ° C. or higher, more preferably 55 ° C. or higher. In order to further suppress the melting behavior, the glass transition temperature of the cured product is further preferably 70 ° C. or higher. The glass transition temperature is preferably less than 100 ° C, more preferably 95 ° C or less, and most preferably 90 ° C or less. Moreover, within this temperature range, heating and cooling can be easily performed with an electric heater, a dryer or the like.

((B) a monofunctional (meth) acrylate having a saturated hydrocarbon group having 5 to 18 carbon atoms (excluding a saturated alicyclic hydrocarbon group) shown in the following (1) to (3) via an ester bond; (At least one monofunctional (meth) acrylate selected from the group consisting of monofunctional (meth) acrylates having an alkoxyalkyl group having 2 to 8 carbon atoms via an ester bond))

Examples of the saturated hydrocarbon group having 5 to 18 carbon atoms (excluding the saturated alicyclic hydrocarbon group) include, for example, 2-ethylhexyl group, octyl group, isooctyl group, isoamyl group, nonyl group, isononyl group, decyl group, Examples include a lauryl group, a tridecyl group, a tetradecyl group, an isotetradecyl group, a stearyl group, and an isostearyl group, and particularly preferably an isoamyl group and a lauryl group. As for acrylate and methacrylate, methacrylate is preferably selected.

Examples of the monofunctional (meth) acrylate having a saturated hydrocarbon group having 5 to 18 carbon atoms (excluding the saturated alicyclic hydrocarbon group) via an ester bond include, for example, isoamyl (meth) acrylate, 2-ethylhexyl ( (Meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) Acrylate, isotetradecyl (meth) acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate, and the like, preferably isoamyl (meth) acrylate, lauryl (meth) acrylate, and more preferably Soamiru (meth) acrylate. These may be used alone or in combination of two or more.

Examples of the alkoxyalkyl group having 2 to 8 carbon atoms include methoxymethyl group, methoxyethyl group, ethoxymethyl group, ethoxyethyl group, butoxyethyl group, propoxyethyl group, methoxypropyl group, methoxybutyl group and the like. Particularly preferred are a butoxyethyl group and an ethoxyethyl group. As for acrylate and methacrylate, methacrylate is preferably selected.

Examples of monofunctional (meth) acrylates having an alkoxyalkyl group having 2 to 8 carbon atoms via an ester bond include methoxymethyl (meth) acrylate, methoxyethyl (meth) acrylate, ethoxymethyl (meth) acrylate, and ethoxyethyl. (Meth) acrylate, butoxyethyl (meth) acrylate, propoxyethyl (meth) acrylate, methoxypropyl (meth) acrylate, methoxybutyl (meth) acrylate, and the like are preferable, butoxyethyl (meth) acrylate, ethoxyethyl (meth) ) Acrylate and the like, more preferably butoxyethyl (meth) acrylate and the like. These may be used alone or in combination of two or more.

In 100 parts by mass of the total amount of (A) and (B), (A) :( B) = 10 to 99: 1 to 90 parts by mass is preferable, 40 to 95 parts by mass: 5 to 60 parts by mass is more preferable. 50 to 90 parts by mass: 10 to 50 parts by mass is still more preferred, and 60 to 85 parts by mass: 15 to 40 parts by mass is most preferred.

As a result, the glass transition temperature can be set to 40 ° C. or more and 100 ° C. or less, and the effect of imparting needle trace transferability in a temperature range from room temperature to high temperature (for example, 80 to 90 ° C.) can be obtained. it can. Moreover, the prevention effect of the melting behavior at the time of heating and the deterioration prevention effect when repeatedly heated above the glass transition temperature can be enhanced.

The curable resin composition is preferably a bifunctional or higher polyfunctional (meth) acrylate, preferably 3 parts by mass or less in a total of 100 parts by mass of the monofunctional (meth) acrylate and the polyfunctional (meth) acrylate. Less than or equal to parts by mass is more preferred, and most preferably no polyfunctional (meth) acrylate is contained. When polyfunctional (meth) acrylate is contained in the curable resin composition, cracks may be generated around the needle marks when the needle marks are formed.

In addition, (meth) acrylate containing phosphorus may be used in combination with the composition of the above components (A) and (B).

((C) Photopolymerization initiator)
The curable resin composition further includes a photopolymerization initiator in addition to the above (A) and (B). The photopolymerization initiator is blended for sensitization with visible light or ultraviolet actinic light to promote photocuring of the resin composition, and various known photopolymerization initiators are preferably used.

Here, the photopolymerization initiator is not particularly limited, but benzophenone and its derivatives, benzyl and its derivatives, anthraquinone and its derivatives, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether, benzyldimethyl Benzoin derivatives such as ketal, acetophenone derivatives such as diethoxyacetophenone, 4-t-butyltrichloroacetophenone, 2-dimethylaminoethylbenzoate, p-dimethylaminoethylbenzoate, diphenyldisulfide, thioxanthone and its derivatives, camphorquinone, 7,7 -Dimethyl-2,3-dioxobicyclo [2.2.1] heptane-1-carboxylic acid, 7,7-dimethyl-2,3-dioxobicyclo 2.2.1] Heptane-1-carboxy-2-bromoethyl ester, 7,7-dimethyl-2,3-dioxobicyclo [2.2.1] heptane-1-carboxy-2-methyl ester, 7 , 7-dimethyl-2,3-dioxobicyclo [2.2.1] heptane-1-carboxylic acid chloride and other camphorquinone derivatives, 2-methyl-1- [4- (methylthio) phenyl] -2-morphol Α-aminoalkylphenone derivatives such as linopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, benzoyldiphenylphosphine oxide, 2,4,6-trimethyl Benzoyldiphenylphosphine oxide, benzoyldiethoxyphosphine oxide, 2,4,6-trimethylbenzoyl And acylphosphine oxide derivatives such as dimethoxyphenylphosphine oxide and 2,4,6-trimethylbenzoyldiethoxyphenylphosphine oxide.

Of these, benzoin derivatives and / or α-aminoalkylphenone derivatives are preferred because of their great effects. Among the benzoin derivatives, benzyldimethyl ketal is preferable because of its large effect. Among the α-aminoalkylphenone derivatives, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one is preferable because of its large effect.

As the photopolymerization initiator, one or a combination of two or more of the above substances can be used.

The amount of the photopolymerization initiator used is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the total amount of the above (A) and (B). When the usage-amount of a photoinitiator exists in this range, the obtained curable resin composition can further prevent melting and flowing at the time of heating. Moreover, if the usage-amount of a photoinitiator is 0.1 mass part or more, the effect of a hardening acceleration will be acquired reliably, and if it is 20 mass parts or less, sufficient hardening rate can be achieved.

The amount of the photopolymerization initiator used is further preferably 0.5 to 15 parts by mass, and more preferably 1 to 10 parts by mass. By using such a use amount, the melting behavior at the time of heating of the curable resin composition obtained can be particularly prevented, and a cured product having sufficient adhesive strength can be obtained.

((D) Antioxidant)
The said curable resin composition contains antioxidant for the durability improvement and storage stability improvement.

The antioxidant is not particularly limited as long as it is a generally known antioxidant such as a hindered phenol, a phosphorus-based antioxidant, or a sulfur-based antioxidant. Examples of hindered phenols include 2,2-methylene-bis (4-methyl-6-tertiarybutylphenol), pentaerythritol tetrakis (3- (3,5-di-tertiarybutyl-4-hydroxyphenyl) propionate, octadecyl -3- (3,5-di-tertiarybutyl-4-hydroxyphenyl) propionate, isooctyl-3- (3,5-di-tertiarybutyl-4-hydroxyphenyl) propionate Examples of the inhibitor include tris (2,4-di-t-butylphenyl) phosphite, tris [2-[[2,4,8,10-tetra-t-butyldibenzo [d, f] [1,3 , 2] dioxaphosphine-6-yl] oxy] ethyl] amine, bis [2,4-bis (1,1-dimethyl) Ethyl) -6-methylphenyl] ethyl ester phosphorous acid, 6- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propoxy] -2,4,8,10-tetra-t- And butyldibenzo [d, f] [1,3,2] dioxaphosphine, and the like, and sulfur-based antioxidants include didodecyl 3,3′-thiodipropionate, dimyristyl 3,3′-thio. Dipropionate, dioctadecyl 3,3′-thiodipropionate, distearyl 3,3′-thiodipropionate, pentaerythrityltetrakis (3-laurylthiopropionate), 2-mercaptobenzimidazole, etc. Other compounds that can be used as antioxidants include hydroquinone, catechol, and hydroquinone monomethyl ether. Monotertiary butyl hydroquinone, 2,5-di-tertiary butyl hydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-di-tertiary butyl-p-benzoquinone, picric acid, citric acid Examples include acid, phenothiazine, tertiary butyl catechol, 2-butyl-4-hydroxyanisole, 2,6-di-tert-butyl-p-cresol, and 4-methoxy-1-naphthol.

Among these, hindered phenol is preferable because of its great effect. Among the hindered phenols, 2,2-methylene-bis (4-methyl-6-tertiary butylphenol) is preferable because of its great effect.

As the antioxidant, one or more of the above substances can be used in combination.

The amount of these antioxidants used is preferably 0.001 to 3 parts by mass with respect to 100 parts by mass of the total amount of the above (A) and (B). If the amount of the antioxidant used is 0.001 part by mass or more, durability and storage stability are sufficient, and if it is 3 parts by mass or less, reliable adhesiveness is obtained and there is no possibility of becoming uncured. .

Furthermore, the amount of antioxidant used is more preferably 0.01 to 2 parts by mass. Thereby, the effect that storage stability and durability improve further can be acquired. In addition, durability here means that the cured product of the curable resin composition is deteriorated even if a thermal history is obtained by repeating needle trace transfer and heat erasure to the cured product of the curable resin composition. Without having a thermal history, it shows that it has the same needle trace transferability and needle trace erasability as before. If the amount of antioxidant used is small, the cured product will deteriorate due to repeated needle trace transfer and heat erasure, and the way the needle traces are attached will change, for example, the depth of the needle traces will become less uniform. There is a risk that.

The curable resin composition is composed of various elastomers such as acrylic rubber, urethane rubber, acrylonitrile-butadiene-styrene rubber, solvents, reinforcing materials, plasticizers, thickeners, dyes, pigments, flame retardants. In addition, additives such as a silane coupling agent and a surfactant may be included. In addition, it is not preferable that an inorganic filler or an inorganic filler is contained in the curable resin composition of the present invention. When an inorganic filler or an inorganic extender is contained, the probe and the inorganic filler or the probe and the inorganic extender may come into contact with each other when the needle trace is transferred to the cured body of the curable resin composition. This is because there is a risk of bending.

(Thickness of cured body)
The cured product of the curable resin composition can be obtained as a thin film. By obtaining a cured product of the curable resin composition as a thin film, the needle trace transferred to the cured product of the curable resin composition and the reference position on the wafer can be observed simultaneously with the same focus. Leads to shortening.

Here, the thickness of the cured body is preferably 20 to 100 μm, and more preferably 40 to 60 μm. If the thickness of the cured body is 20 μm or more, it is sufficient to reliably obtain a continuous cured body. Further, if the thickness of the cured body is 100 μm or less, it can correspond to the thickness of a general semiconductor wafer, and the needle trace transferred to the cured body and the reference position on the wafer can be observed simultaneously with the same focus.

[Embodiment 2: Probe inspection method]
In the probe inspection method according to the present embodiment, a cured body of a curable resin composition is brought into contact with a probe for inspecting electrical characteristics of an object to be inspected such as an IC chip on a wafer, and a probe trace of the probe is placed on the cured body. After transferring, check the probe state based on the transferred needle trace, and after transferring the probe needle trace, the cured body is heated above the glass transition temperature of the cured body to erase the probe needle trace. A method for inspecting a probe for repeated inspection.

According to the above inspection method, there is an effect that the inspection of the probe can be repeatedly performed without replacing the member for transferring the needle trace for each inspection or for each type of wafer. However, “without replacement” does not mean that the member for transferring the needle trace is not permanently replaced. That is, when replacement is necessary due to deterioration, wear, or the like, replacement is performed as appropriate, but it is sufficient that it can be used repeatedly at least twice.

Next, the probe inspection method will be described.

First, a cured body of the curable resin composition is brought into contact with a probe used for inspection, and the needle trace of the probe is transferred to the cured body. Then, after checking the state of the probe based on the needle trace of the transferred probe, the wafer is inspected using the probe. At this time, if the confirmation operation reveals that the position of the probe is not appropriate or the depth of pushing is not sufficient, the probe can be appropriately adjusted.

Here, the contact means that the probe is pressed against the surface of the cured body so that a probe mark of the probe is formed on the surface of the cured body. By this operation, probe traces of the probe are formed on the surface of the cured body. Transfer is the formation of probe marks on the surface of the cured body by the contact operation described above. Thus, by transferring the probe trace of the probe onto the surface of the cured body, it is possible to know the position of the probe, the pressing depth, the state of the probe tip, and the like.

The confirmation of the probe state based on the needle trace is preferable because it is surely performed by visual observation using an imaging device such as a CCD camera. For example, an image captured by the imaging device is analyzed by software. Then, the probe arrangement may be automatically corrected.

Note that the temperature at the time of contact and transfer is the same as the temperature at which the electrical characteristics of the IC chip are inspected, and examples thereof include room temperature and high temperature. The room temperature is preferably 20 to 30 ° C. The high temperature is preferably from 70 to 100 ° C, more preferably from 80 to 90 ° C. The temperature at the time of confirmation is the same as or lower than the above temperature.

Then, after the inspection of a predetermined number of wafers is completed, the cured body is heated to a temperature higher than the glass transition temperature of the cured body to erase the probe traces of the probe. Further, the erasing of the needle trace may be performed for each inspection of different types of wafers.

Here, erasing the needle trace is to raise the temperature of the cured body to a temperature higher than the glass transition temperature by heating the cured body and to erase the needle trace of the probe formed on the surface of the cured body. Needle traces need not be erased completely.

For example, if the height gap between the lowermost part of the needle trace and the surface of the hardened body becomes 100 nm or less, it is assumed that it has been erased. More preferably, it is erased when it becomes 50 nm or less.

Whether or not the needle trace has been erased can be confirmed by visual observation using an imaging device. By erasing the needle marks formed on the surface of the cured body, a plurality of inspections can be repeated with one cured body.

In the above inspection, the cured body is a cured body obtained by curing the curable resin composition by light irradiation in the present invention, and the curable resin composition described in Embodiment 1 is used.

The wavelength upon irradiation is preferably 355 to 375 nm, and more preferably 360 to 370 nm. If it is 350 nm or more, the light absorption of another component can be suppressed, and if it is 375 nm or less, the decomposition reaction of the photoinitiator proceeds. Integrated quantity of light during irradiation is preferably 1500 ~ 6000mJ / cm ^2, more preferably 3000 ~ 5000mJ / cm ^2, and most preferably 3500 ~ 4500mJ / cm ^2. If it is 1500 mJ / cm ² or more, the curing reaction proceeds sufficiently, and if it is 6000 mJ / cm ² or less, there is no photodegradation.

This makes it possible to easily transfer the needle traces in contact with the probe, and to easily erase the needle traces by heating to a temperature above the glass transition temperature, and is therefore preferably used for the probe inspection. And after erasing the needle trace, it can be reused by cooling to the temperature at the time of contact, transfer and confirmation.

According to the above inspection method, there is an effect that the inspection of the probe can be repeatedly performed without replacing the member for transferring the needle trace for each inspection or for each type of wafer.

Also, when the inspection object is inspected at a high temperature (eg, 80 ° C. to 90 ° C.), it is possible to transfer the needle mark to the cured body even if it is below the glass transition temperature or above the glass transition temperature. For example, the temperature of the cured body can be the same as the temperature at the time of inspection of the object to be inspected. That is, the position of the probe tip of the probe at a high temperature can be detected. As a result, even when the inspection object is inspected at a high temperature, the probe tip can be accurately brought into contact with the electrode pad without the probe tip position being deviated from the detection position.

(Inspection equipment)
For the inspection of the probe, as shown in FIG. 1, a sheet 10 made of a cured body, a support base 12 on which the sheet 10 is placed, and the sheet 10 are heated to a temperature higher than the glass transition temperature of the cured body. A probe inspection apparatus comprising a heating device 17, a probe card 14 having a probe 15, and an imaging device 16 for confirming the probe state based on the needle trace 11 of the probe 15 transferred to the sheet 10. Preferably used. The probe inspection apparatus may be incorporated in a probe apparatus including a mounting table 13 on which an object to be inspected such as a wafer W is mounted.

Here, the constituent members of the inspection apparatus are not limited to those described above, and may include a vacuum pump, a gas supply source, a control mechanism for controlling the movement of the mounting table, and the like. The inspection apparatus may be incorporated in an apparatus such as a vacuum chamber.

(Method for heating curable resin composition)
The curable resin composition according to Embodiments 1 and 2 can erase the needle trace by heating the glass trace temperature or higher after contacting the probe after curing to transfer the needle trace.

In Embodiments 1 and 2, the glass transition temperature of the curable resin composition can be obtained by a simple heating method. Although it does not specifically limit as a heating method, Since it can be used easily, it is preferable to use an electric heater, a dryer, etc.

The heating temperature is preferably 180 ° C. or lower, more preferably 50 to 150 ° C. A heating temperature of 180 ° C. or lower is preferable because the curable resin composition can withstand multiple uses.

In the second embodiment, the heating device means, for example, an electric heater, a dryer or the like. The heating device needs to be able to heat the temperature of the sheet 10 to be equal to or higher than the glass transition temperature, but is preferably attached so as not to affect other members and the object to be inspected.

The needle trace erasing method can be not only heating but also combining heating and pressurization. By pressurizing, the surface of the cured body can be further kept flat. Here, as a method for pressurizing the curable resin composition, it is preferable to use a conventionally known apparatus such as a press.

The curable resin compositions of Embodiments 1 and 2 can be used repeatedly, but the number of repetitions is preferably 2 or more, and from the viewpoint of cost, it is preferable that the curable resin composition can be used 30 or more times.

Moreover, you may produce a mark on the hardening body of the said curable resin composition as a reference position. Examples of the method for producing the mark include ink application by ink jet, screen printing, metal vapor deposition, laser ablation, and the like, but ink application by ink jet is preferable from the viewpoint of workability and durability against repeated use.

As mentioned above, although embodiment of this invention was described, these are illustrations of this invention and various structures other than the above are employable.

Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples. Unless otherwise stated, the evaluation was performed at 25 ° C.

[Example 1]
Each material was mix | blended with the following compositions and the curable resin composition was produced.
(A) Monofunctional (meth) acrylate isobornyl acrylate having a saturated alicyclic hydrocarbon group having 9 to 12 carbon atoms via an ester bond (“Kyoeisha Chemical Co., Ltd.,“ Light Acrylate IB-XA ”) IB-XA ") 90 parts by weight.
(B) Monofunctional (meth) acrylate having a saturated hydrocarbon group having 5 to 18 carbon atoms (excluding a saturated alicyclic hydrocarbon group) via an ester bond and / or alkoxyalkyl having 2 to 8 carbon atoms 10 parts by mass of a monofunctional (meth) acrylate isoamyl acrylate having a group via an ester bond (manufactured by Kyoeisha Chemical Co., Ltd., “light acrylate IAA”, hereinafter abbreviated as “IAA”).
(C) Photopolymerization initiator 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one (100 parts by mass of (A) and (B) above) Ciba Specialty Chemicals, “IRGACURE907”, hereinafter abbreviated as “I-907”) 1 part by weight.
(D) Antioxidant 2,2-methylene-bis (4-methyl-6-tertiary butylphenol) (hereinafter abbreviated as “MDP”) with respect to a total of 100 parts by mass of the above (A) and (B) .) 0.1 parts by weight.

Using the obtained curable resin composition, measurement of glass transition temperature, measurement of tensile shear adhesive strength, needle trace transferability, needle trace erasability, melting behavior and needle trace transfer by the following evaluation methods The 10th needle mark depth was evaluated.

(Measurement of glass transition temperature)
After applying a curable resin composition to a thickness of 200 μm on a silicon wafer and covering it with a release film, a condition of an integrated light quantity of 4000 mJ / cm ² with a wavelength of 365 nm is obtained by a fusion device using an electrodeless discharge lamp. And cured. Thereafter, the cured product obtained by peeling off the release film was scraped off, and the glass transition temperature was measured with a differential scanning calorimeter “SII EXSTAR DSC6220” (manufactured by Seiko Instruments Inc.) (temperature increase rate: 10 ° C./min).

(Measurement of tensile shear bond strength (bond strength))
The tensile shear bond strength was measured according to JIS K 6850. Specifically, using the heat-resistant Pyrex (registered trademark) glass (25 mm × 25 mm × 2.0 mm) as the adherend, the produced curable resin composition was applied in a circular shape with a diameter of 8 mm, and the shape of the adhesive surface Two heat-resistant Pyrex (registered trademark) glasses were bonded together in a circular state with a diameter of 8 mm. Then, it was hardened on the conditions of the integrated light quantity 2000mJ / cm < ² > of the wavelength of 365 nm with the fusion | curing apparatus by the fusion company using an electrodeless discharge lamp, and the test piece for tensile shear bond strength measurement was produced. Then, using a tensile tester, the tensile shear bond strength of the prepared test piece was measured in an environment of a temperature of 23 ° C. and a humidity of 50% at a tensile speed of 10 mm / min and an adhesive thickness of 100 μm.

(Evaluation of needle trace transferability (needle trace transferability, needle trace depth, number of cracks))
After a curable resin composition is applied to a silicon wafer to a thickness of 50 μm and covered with a release film, the integrated light amount of 4000 mJ / cm ^{2 at} a wavelength of 365 nm is obtained using a fusion device using an electrodeless discharge lamp. Curing was performed under the following conditions. Thereafter, the release film was peeled off to obtain a test piece. Using a manual prober, the probe was lowered by 40 μm from the surface of the cured body of the curable resin composition at a speed of about 15 μm / s and brought into contact with the cured body of the curable resin composition on the silicon wafer. Thereafter, the presence or absence of transfer of the needle trace to the surface of the cured product of the curable resin composition was observed with a confocal laser microscope. When the needle trace was transferred, the depth of the needle trace was measured. The depth of the needle mark was measured with a confocal laser microscope (OLYMPUS, “OLS1100”, magnification: 500 times). Further, when the needle trace was transferred, the number of cracks was confirmed in order to know whether there was a crack around the needle trace.

(Needle mark depth after heating at 140 ° C. (Number of cracks in needle mark erasure)
Using the test piece to which the needle trace was transferred in the above test, after heating in an oven at 140 ° C. for 10 minutes, it was confirmed whether the needle trace was erased. If the needle trace was not erased, the needle trace depth was measured. The presence or absence of needle marks and the depth of the needle marks were confirmed with a confocal laser microscope. In addition, when there was a crack in the transfer of needle marks, the number of cracks was checked to know whether the crack was erased.

(Melting behavior of cured product after heating (melting behavior))
On a hot plate in which a test piece (size of a curable resin composition cured body: width 30 mm × width 30 mm × thickness 50 μm) prepared for evaluation of needle trace transferability and needle trace erasability is heated to 140 ° C. For 5 minutes to observe whether the cured body has melting behavior (the width of the test piece after heating was measured).

(10th needle mark depth of needle mark transfer)
Using a test piece in which needle trace transfer and needle trace erasure were repeated nine times under the conditions described above, needle trace transferability was evaluated. The depth of the needle mark was measured with a confocal laser microscope (OLYMPUS, “OLS1100”, magnification: 500 times). The positions of needle trace transfer in the repeated test were all the same.

The above experimental results are shown in Table 1.

[Examples 2 to 13]
A curable resin composition was prepared in the same manner as in Example 1 except that the raw materials of the type shown in Table 1 were used in the composition shown in Table 1. The obtained curable resin composition was evaluated in the same manner as in Example 1. Table 1 shows the experimental results.
The needle trace transferability of Example 4 was evaluated at 85 ° C.

(Materials used)
The materials used in Examples 2 to 13 and their abbreviations are specified below. This abbreviation corresponds to Table 1.
FA-513AS: Dicyclopentanyl acrylate (manufactured by Hitachi Chemical Co., Ltd., “FANCRYL FA-513AS”)
IM-A: Isotetradecyl acrylate (manufactured by Kyoeisha Chemical Co., Ltd., “Light acrylate IM-A”)
L: Lauryl methacrylate (manufactured by Kyoeisha Chemical Co., “Light Ester L”)
EH: 2-ethylhexyl methacrylate (manufactured by Kyoeisha Chemical Co., “Light Ester EH”)
BO: Butoxyethyl methacrylate (manufactured by Kyoeisha Chemical Co., “Light Ester BO”)
2-MTA: Methoxyethyl acrylate (Osaka Organic Chemical Industry Co., Ltd., “2-MTA”)
BO-A: Butoxyethyl acrylate (Kyoeisha Chemical Co., Ltd., “Light acrylate BO-A”)
BDK: benzyl dimethyl ketal

[Comparative Examples 1 to 5]
A resin composition was prepared in the same manner as in Example 1 except that the raw materials of the type shown in Table 1 were used in the composition shown in Table 1. The obtained resin composition was evaluated in the same manner as in Example 1. The results are shown in Table 1.

(Materials used)
The materials used in Comparative Examples 2 to 4 and their abbreviations are specified below. This abbreviation corresponds to Table 1.
ACMO: Acryloyl morpholine (manufactured by Kojinsha, "ACMO")
1,9ND-A: 1,9-nonanediol diacrylate (manufactured by Kyoeisha Chemical Co., Ltd., “Light acrylate 1,9ND-A”)
ID: Isodecyl methacrylate (manufactured by Kyoeisha Chemical Co., “Light acrylate ID”)

[Discussion]
As can be seen from Table 1, in Examples 1 to 13, the needle trace could be transferred and the needle trace could be erased by heating. That is, by using the curable resin composition according to the present invention, the inspection of the probe can be repeatedly performed without replacing the member for transferring the needle trace for each inspection or for each type of wafer.

However, in contrast to Examples 1 to 13, since Comparative Example 1 had a glass transition temperature of less than 40 ° C., needle trace transfer was not possible, and the cured product was melted after heating. In Comparative Example 2, the needle traces could not be erased by heating because heating was not performed above the glass transition temperature. In Comparative Example 3, since the bifunctional monomer was contained, a crack occurred around the needle trace, and the crack remained even after heating. If cracks remain, there is a risk of adversely affecting the detection of subsequently transferred needle traces, leading to a reduction in the number of times that they can be used repeatedly. Moreover, although the comparative example 4 was also slight, the crack remained. In Comparative Example 5, since no antioxidant was used, the cured product deteriorated due to repeated needle trace transfer and heat erasure, and the needle trace depth became shallower than the initial one.

As can be seen from Table 1, the cured product of the curable resin composition according to the present invention can be formed to a thickness of about 20 to 100 μm. By forming the cured body to such a thickness, it is possible to cope with the thickness of a general semiconductor wafer. That is, the probe trace transferred to the cured body and the reference position formed on the wafer can be observed simultaneously with the same focus, and the working time can be shortened.

Also, as shown in Example 4, if the glass transition temperature is high, it can be used at a high temperature, and deep needle traces can be transferred by raising the temperature during needle trace transfer.

DESCRIPTION OF SYMBOLS 10 Sheet | seat 11 Needle trace 12 Support stand 13 Mounting stand 14 Probe card 15 Probe 16 CCD camera (imaging device)
17 Heating device W Wafer

Claims

Contact the cured body of the curable resin composition with the probe that inspects the electrical characteristics of the object to be inspected, transfer the probe needle trace to the cured body, and check the probe status based on the transferred needle trace. And, after transferring the probe traces of the probe, includes a step of heating the cured body to a temperature higher than the glass transition temperature of the cured body and erasing the probe traces of the probe, thereby inspecting the probe for repeated inspection of the cured body Is the way
The curable resin composition is
(A) a monofunctional (meth) acrylate having a saturated alicyclic hydrocarbon group having 9 to 12 carbon atoms via an ester bond,
(B) a monofunctional (meth) acrylate having a saturated hydrocarbon group having 5 to 18 carbon atoms (excluding a saturated alicyclic hydrocarbon group) shown in the following (1) to (3) via an ester bond; At least one monofunctional (meth) acrylate selected from the group consisting of monofunctional (meth) acrylates having an alkoxyalkyl group having 2 to 8 carbon atoms via an ester bond:

(C) a photopolymerization initiator,
(D) A probe inspection method containing an antioxidant and having a cured product of the curable resin composition having a glass transition temperature of 40 ° C. or higher and 100 ° C. or lower.
The probe inspection method according to claim 1, wherein the thickness of the cured body of the curable resin composition is 20 to 100 µm.
(A) a monofunctional (meth) acrylate having a saturated alicyclic hydrocarbon group having 9 to 12 carbon atoms via an ester bond,
(B) a monofunctional (meth) acrylate having a saturated hydrocarbon group having 5 to 18 carbon atoms (excluding a saturated alicyclic hydrocarbon group) shown in the following (1) to (3) via an ester bond; At least one monofunctional (meth) acrylate selected from the group consisting of monofunctional (meth) acrylates having an alkoxyalkyl group having 2 to 8 carbon atoms via an ester bond:

(C) a photopolymerization initiator,
(D) A curable resin composition for transferring a probe trace of a probe which contains an antioxidant and has a glass transition temperature of 40 ° C. or more and 100 ° C. or less of a cured product of the curable resin composition.
Component (A) is 10 to 99 parts by weight, component (B) is 1 to 90 parts by weight, and (C) photopolymerization initiator is 0.1 parts by weight with respect to 100 parts by weight as a total of component (A) and component (B). The curable resin composition according to claim 3, comprising 1 to 20 parts by mass and 0.001 to 3 parts by mass of (D) an antioxidant.
A cured body for transferring the needle trace of a probe formed by curing the curable resin composition according to claim 3 or 4.
A sheet comprising the cured body according to claim 5;
A support table on which the sheet is placed;
A heating device for heating the sheet above the glass transition temperature of the cured body;
A probe card having a probe;
An inspection apparatus for a probe, comprising: an imaging device for confirming a state of the probe based on a probe mark of the probe transferred to the sheet.