WO2012108217A1

WO2012108217A1 - Method of manufacturing organic electroluminescence element

Info

Publication number: WO2012108217A1
Application number: PCT/JP2012/050117
Authority: WO
Inventors: 成記森田; 純一長瀬; 良平垣内; 伸和根岸; 孝洋中井; 直子市枝; 聖彦渡邊
Original assignee: 日東電工株式会社
Priority date: 2011-02-08
Filing date: 2012-01-05
Publication date: 2012-08-16
Also published as: JP2012164581A

Abstract

The present invention provides a method of manufacturing an organic electroluminescence (to be called EL hereafter) element such that manufacturing can be executed continuously and at low cost, said method being configured such that, in the manufacturing of organic electroluminescence elements in a roll-to-roll manner, a mask comprising a sheet-like flexible film having an adhesion face and a prescribed opening pattern is laminated onto a sheet-like substrate, and a second-electrode forming material is formed onto the mask by vapor deposition, after which the mask is peeled off to form a second electrode having a prescribed pattern.

Description

Manufacturing method of organic electroluminescence device

The present invention relates to a method for producing an organic electroluminescence element that can be produced at low cost.

Organic electroluminescence (hereinafter referred to as "EL") light-emitting devices, which are expected as next-generation low-power-consumption light-emitting devices, can emit light of various colors derived from organic light-emitting materials. Therefore, it attracts attention as a display for a TV or the like.

An organic EL element used in such an organic EL light emitting device is a thin film element compared to an inorganic EL element, and also has a feature of being a surface light emitting element. It is expected to be used in a wide range of applications such as backlights for liquid crystal displays, light-emitting parts for display decoration, and digital signage.

On the other hand, organic EL devices have a problem of high cost due to poor productivity. Therefore, in order to reduce the cost of manufacturing the organic EL element, an efficient manufacturing method using a roll-to-roll process using a flexible substrate has been studied (see, for example, Patent Documents 1 and 2).

JP 2002-367774 A JP 2003-173870 A

However, the manufacturing method described in Patent Document 1 applies a resin to a sheet-like substrate to form a predetermined mask, forms a desired thin film on the entire surface of the sheet-like substrate including the mask, and then peels off the mask. A thin film pattern of an organic EL element is formed. For this reason, when manufacturing an organic EL element continuously, there is a concern that a volatile component such as a solvent contained in a resin mask may adversely affect the organic EL element, and an apparatus for applying the resin and the resin A device or the like for curing is required separately. Further, when a mask is formed by applying a resin, the peripheral edge of the opening of the mask is formed on a gentle inclined surface. Therefore, when a thin film is formed from above the mask by vacuum deposition or sputtering, the thin film is formed on a continuous surface from the sheet-like substrate exposed from the mask opening to the top of the mask. When the film is peeled off, not only the thin film formed on the mask but also the necessary part of the thin film formed on the sheet-like substrate in the mask opening is peeled off together, and the accuracy of forming the thin film pattern is lowered. The problem of, has arisen.

The manufacturing method described in Patent Document 2 uses a strip-shaped metal mask that travels, and first patterns an organic EL layer on a metal transfer substrate that travels synchronously, and then applies the patterned organic EL layer to the substrate. The image is transferred onto the substrate. This method requires a large-scale device for running the mask and the transfer substrate, and the metal transfer substrate contacts the substrate, which may damage the substrate. In addition, since it is necessary to align the metal transfer substrate with the substrate each time, there is a problem that efficient continuous production cannot be performed.

The present invention has been made in view of such circumstances, and an object thereof is to provide a method for producing an organic EL element that can be continuously produced at low cost.

In order to achieve the above object, the method for producing an organic EL device of the present invention includes a step of conveying a sheet-like substrate by roll-to-roll, a step of forming a first electrode on the upper side of the sheet-like substrate, and the first electrode. In the step of forming the second electrode, the step of forming an organic EL layer on the organic EL layer and the step of forming a second electrode having a predetermined pattern on the organic EL layer using a mask. A flexible film having an adhesive surface and an opening corresponding to the predetermined pattern, wherein the second electrode forming material is formed in the opening in a state where the mask is bonded to a sheet-like substrate on which the organic EL layer is formed. The first gist is that the second electrode having a predetermined pattern is formed by peeling the mask after vapor deposition on the organic EL layer through the roll toro. A step of transporting the sheet-like substrate, a step of forming a first electrode on the upper side of the sheet-like substrate, a step of forming an organic EL layer having a predetermined pattern on the first electrode using a mask, Forming a second electrode having the same pattern as the organic EL layer by using a mask on the organic EL layer, and in the step of forming the organic EL layer and the step of forming the second electrode, the mask The organic EL layer forming material and the second electrode are formed in a state where the same flexible film having an adhesive surface and an opening corresponding to a predetermined pattern is commonly used and the mask is bonded to a sheet-like substrate. After vapor-depositing the material on the first electrode in this order through the opening, the mask is removed to remove the organic EL layer having a predetermined pattern and the same pattern as the organic EL layer. Forming a second electrode having a down a second aspect.

That is, the present inventors have repeated research on forming a thin film pattern continuously by a roll-to-roll process instead of forming a thin film pattern in order to efficiently manufacture an organic EL element at a low cost. . In the above process, we focused on the mask used to form the thin film pattern, and further researched it. As a result, when the second electrode having the predetermined pattern is formed, a flexible film having a sheet-like adhesive surface provided with an opening corresponding to the predetermined pattern is used as a mask. The electrode formation scheduled portion is aligned, and the adhesive surface of the mask is used to bond to the substrate on which the organic EL layer is formed, and the second electrode forming material is deposited on the organic EL layer through the opening of the mask. Later, when the mask is peeled off, the organic EL element is not adversely affected by volatilization of the solvent and the like, and once the alignment is performed, each alignment is unnecessary, so An organic EL element can be manufactured at low cost. Moreover, when the second electrode forming material is deposited through the mask and the second electrode is formed, the second electrode is formed discontinuously due to the step between the portion exposed from the opening and the portion on the mask. . Accordingly, in the mask peeling process, the second electrode formed on the mask can be peeled together with the second electrode formed on the portion exposed from the opening of the mask, and the second electrode having a predetermined pattern can be peeled off together. It has been found that two electrodes can be easily and accurately formed, and the present invention has been achieved.

Thus, the manufacturing method of the organic EL element of the present invention uses a flexible film having a sheet-like adhesive surface provided with an opening corresponding to the predetermined pattern as a mask for forming the second electrode having the predetermined pattern. Then, the opening and the second electrode formation planned portion of the substrate are aligned and bonded to the substrate on which the organic EL layer is formed using the adhesive surface of the mask, and in this state, the second electrode forming material is attached to the opening. After vapor deposition on the organic EL layer via the mask, the mask is peeled off to form. For this reason, when forming the 2nd electrode which has a predetermined pattern, a large-scale apparatus becomes unnecessary and cost reduction is aimed at. Further, there is no adverse effect due to volatilization of the organic solvent or the like from the mask. Further, no substrate damage occurs due to the metal transfer substrate or mask coming into contact with the substrate. Furthermore, after the mask and the substrate are aligned and bonded, the second electrode having a predetermined pattern can be formed quickly because each alignment is unnecessary. When the second electrode forming material is deposited using the mask, the second electrode becomes discontinuous due to a step between the portion exposed from the opening of the mask and the portion on the mask. For this reason, the second electrode formed on the mask can be peeled together with the second electrode formed on the mask, and the second electrode having a predetermined pattern can be formed easily and accurately. it can.

In the step of forming the organic EL layer, a flexible film having an adhesive surface and having an opening corresponding to a predetermined pattern is used as a mask, and the mask is bonded to a sheet-like substrate. When an organic EL layer having a predetermined pattern is formed by peeling the mask after the EL layer forming material is deposited on the first electrode through the opening, the efficiency is continuously increased. Since an organic EL layer having a predetermined pattern can be formed well, the productivity of the organic EL element is improved, and a lower cost production can be realized.

Also, a step of transporting the sheet-like substrate by roll-to-roll, a step of forming the first electrode on the upper side of the sheet-like substrate, and forming an organic EL layer having a predetermined pattern on the first electrode using a mask And a step of forming a second electrode having the same pattern as the organic EL layer using a mask on the organic EL layer, and forming the organic EL layer and the second electrode. In the process, the same flexible film having an adhesive surface and having an opening corresponding to a predetermined pattern is commonly used as the mask, and the organic EL layer forming material is bonded to the sheet-like substrate. Then, after depositing the second electrode forming material on the first electrode in this order through the opening, the mask is peeled off to form an organic EL having a predetermined pattern. When the second electrode having the same pattern as that is formed, that is, when forming the organic EL layer having the predetermined pattern and the second electrode having the same pattern in the roll-to-roll process, Using the sheet-like flexible film provided with the opening corresponding to the predetermined pattern as a mask, the opening and the organic EL layer and the second electrode formation scheduled portion of the sheet-like substrate are aligned, Bonding to the sheet-like substrate using the adhesive surface, and the organic EL layer forming material and the second electrode forming material from above the mask bonding surface through the opening of the mask in this order. After vapor deposition on the electrode, the mask is peeled off to form an organic EL layer having a predetermined pattern and a second pattern having the same pattern. When so as to form a pole, forming a mask may for only performed each time bonding and peeling to the substrate, thereby enabling more rapid production. In addition, since the amount of mask used can be reduced, it is possible to realize lower-cost manufacturing.

FIG. 2A is a plan view of an organic EL element obtained by an embodiment of the present invention, and FIG. (A) is explanatory drawing of the said embodiment, (b) is the BB sectional drawing. (A) is explanatory drawing of the said embodiment, (b) is the CC sectional drawing. (A) is explanatory drawing of the said embodiment, (b) is the DD sectional drawing. (A) is explanatory drawing of the said embodiment, (b) is the EE sectional drawing. (A) is explanatory drawing of the said embodiment, (b) is the FF sectional drawing. (A) is explanatory drawing of the said embodiment, (b) is the GG sectional drawing. (A) is explanatory drawing of the said embodiment, (b) is the HH sectional drawing. (A) is explanatory drawing of the said embodiment, (b) is the II sectional drawing. It is explanatory drawing of the said embodiment. (A) is explanatory drawing of other embodiment of this invention, (b) is the JJ sectional drawing. (A) is explanatory drawing of said other embodiment, (b) is the KK sectional drawing. (A) is explanatory drawing of said other embodiment, (b) is the LL sectional drawing. (A) is explanatory drawing of said other embodiment, (b) is the MM sectional drawing. (A) is explanatory drawing of the said other embodiment, (b) is the NN sectional drawing. (A) is explanatory drawing of said other embodiment, (b) is the OO sectional drawing. It is explanatory drawing of said other embodiment. (A) is explanatory drawing of further another embodiment of this invention, (b) is the PP sectional drawing. (A) is explanatory drawing of the said further another embodiment, (b) is the QQ sectional drawing. (A) is an explanatory view of still another embodiment, and (b) is an RR cross-sectional view thereof. (A) is explanatory drawing of the said further another embodiment, (b) is the SS sectional drawing. (A) is an explanatory view of still another embodiment, and (b) is a TT cross-sectional view thereof. (A) is explanatory drawing of the said further another embodiment, (b) is the U sectional drawing. It is explanatory drawing of the said further another embodiment.

Next, a mode for carrying out the present invention will be described.

An organic EL element 1 obtained by the first embodiment of the present invention is shown in FIG. 1 (a) and FIG. The organic EL element 1 has a top emission structure in which an insulating layer 3, a first electrode 4, an organic EL layer 5, and a second electrode 6 are laminated on a substrate 2 in this order. 1A and 1B, each part is schematically shown, and is different from an actual size or the like (the same applies to the following drawings).

The manufacturing method in this embodiment (hereinafter referred to as “the first manufacturing method of the present invention”) is summarized as follows. When the organic EL element 1 is manufactured by a roll-to-roll process, the second electrode having a predetermined pattern is attached to the adhesive surface. In addition, a sheet-like flexible film having a predetermined opening pattern is used as a mask, and after the second electrode forming material is deposited on the mask, the mask is peeled off to form. Hereinafter, the first production method of the present invention will be described in detail.

First, a stainless steel (SUS) sheet-like (width 300 mm × thickness 50 μm × length 140 m) substrate 2 is wound around a supply roll at one end and wound around a take-up roll at a roll-to-roll process. Preparation for manufacturing the organic EL element 1 is performed. Then, while continuously feeding the substrate 2 from the supply roll to the take-up roll, an insulating resin is applied to the entire surface of the substrate 2, and FIG. 2 (a) and its BB cross-sectional view are shown. As shown in FIG. 2B, an insulating layer 3 (thickness 4 nm) is formed. Next, indium zinc oxide (IZO) is sputtered onto the insulating layer 3 to form a first electrode 4 formation scheduled layer, and this first electrode 4 formation planned layer is patterned by etching, and FIG. As shown in FIG. 3B, which is a sectional view taken along the line CC, the first electrode 4 (thickness 90 nm) is formed.

Next, as a mask 8, an adhesive layer is provided on one surface, and an opening 9 having the same shape as a portion where the organic EL layer 5 is to be formed (see FIG. 6) is continuously provided by punching. A flexible film (E-MASK RP300, manufactured by Nitto Denko Corporation) is prepared and adjusted so that the organic EL layer 5 formation planned portion of the substrate 2 and the opening 9 of the mask 8 coincide with each other. Using the layer, a mask 8 is bonded to the substrate 2 on which the first electrode 4 is formed, as shown in FIG. 4A and FIG. 4B which is a DD sectional view thereof.

Then, as shown in FIG. 5 (a) and FIG. 5 (b) which is a cross-sectional view taken along the line EE, the organic EL layer forming material is vacuum applied to the substrate 2 to which the mask 8 is bonded. The organic EL layer 5 is formed by vapor deposition. Thereafter, the mask 8 is wound off while being peeled off, so that the organic EL layer 5 is formed only at a predetermined portion, as shown in FIG. 6A and FIG. The

Subsequently, the mask 10 has an adhesive layer on one surface, and has a sheet-like flexible film (E−) in which openings 11 having the same shape as the second electrode 6 formation scheduled portion are continuously provided by punching. MASK RP300 (manufactured by Nitto Denko Corporation) is prepared and adjusted so that the second electrode 6 formation scheduled portion (see FIG. 9) of the substrate 2 and the opening 11 of the mask 10 are aligned with each other. Using the layer, a mask 10 is bonded to the substrate 2 on which the organic EL layer 5 is formed, as shown in FIG. 7A and FIG.

Then, as shown in FIG. 8A and FIG. 8B, which is a cross-sectional view taken along the line HH, the second electrode forming material is vacuum applied to the substrate 2 to which the mask 10 is bonded. The second electrode 6 is formed by vapor deposition. Thereafter, the second electrode 6 is formed only at a predetermined portion, as shown in FIG. 9A and its II sectional view, FIG. The As shown in FIG. 10, the organic EL element 1 can be obtained by cutting it into a predetermined size (see FIGS. 1A and 1B).

According to this method, since the organic EL layer 5 and the second electrode 6 are patterned using the

masks

8 and 10 made of a sheet-like flexible film when the organic EL element is manufactured by roll-to-roll, Separately, various apparatuses for patterning are not required. Moreover, since it is the

masks

8 and 10 which consist of a flexible film that touches the board | substrate 2 with which each layer was laminated | stacked, compared with the case where the board | substrate 2 and each layer laminated | stacked on this contact metal transfer boards and masks, Less susceptible to damage. And since components, such as a solvent, do not volatilize from the

masks

8 and 10 in a vacuum evaporation system, the organic EL element 1 does not receive a bad influence by a solvent. Further, since the sheet-

like masks

8 and 10 are bonded to the sheet-like substrate 2, it is not necessary to perform alignment each time. When the

masks

8 and 10 are used, the thin film of the organic EL layer 5 and the second electrode 6 is discontinuous due to a step between the portions exposed from the

openings

9 and 11 of the

masks

8 and 10 and the upper portion of the mask. Therefore, when the

masks

8 and 10 are peeled off, the organic EL layer 5 and the second electrode 6 formed in the portions exposed from the

openings

9 and 11 of the

masks

8 and 10 are not peeled off. The organic EL layer 5 and the second electrode 6 having a predetermined pattern with high accuracy can be formed. And since the organic EL layer 5 and the 2nd electrode 6 which have a predetermined pattern can be formed continuously and efficiently, the productivity of an organic EL element improves and manufacture at lower cost can be implement | achieved. In addition, since the second electrode is formed with high accuracy and no positional deviation or the like occurs, when the sheet-like substrate 2 on which each layer has been formed is cut into a predetermined size, the second electrode is formed in addition to the portion to be formed. A short circuit due to the contact between the second electrode 6 and the substrate 2 due to the formation of the electrode 6 does not occur.

In the above embodiment, SUS is used as the sheet-like substrate 2, but not limited to this, alloys such as 36 alloy and 42 alloy, copper (Cu), nickel, iron, aluminum (Al), titanium, and the like. A single-layer or multilayer resin film made of a metal film, an aromatic polyamide film, a polyimide resin film, an aramid film, a polyester film, or the like, a laminate of a metal film and a resin film, or the like can be used. Especially, it is preferable to use metal films, such as SUS and Al, from the point which can disperse | distribute the heat | fever which the organic EL layer 5 emits efficiently, and has high intensity | strength.

In the above embodiment, an insulating resin is applied to the entire surface of the substrate 2 to form the insulating layer 3 (thickness 4 nm), but the surface roughness (Ra) of the substrate 2 is small. If the substrate 2 is an insulating substrate or the like, the insulating layer 3 is not necessarily formed. However, it is preferable to form the insulating layer 3 in terms of ensuring the smoothness of the surface of the substrate 2.

In the above embodiment, IZO is used as the first electrode 4, but in addition, materials used as various electrodes such as indium tin oxide (ITO) and germanium zinc oxide (GZO) are used. it can. Further, the thickness thereof is preferably in the range of 10 nm to 500 nm, more preferably in the range of 50 nm to 300 nm in terms of conductivity. Furthermore, it is also possible to form by using vacuum deposition as another vapor deposition means instead of sputtering. However, it is preferable to use sputtering in terms of accuracy and process simplification.

In the above embodiment, the insulating layer 3 is provided directly on the substrate 2, but a reflective layer may be provided between the substrate 2 and the insulating layer 3. In this case, the light can be more effectively reflected by the reflective layer regardless of the nature of the substrate 2, so that more light can be extracted from the second electrode 6 side in the case of the top emission type element. The reflective layer can be provided, for example, by forming an Ag-based alloy (APC) containing silver (Ag), Al, chromium, molybdenum, palladium, and Cu in a single layer or multiple layers. The thickness should be sufficient to reflect light sufficiently, but is preferably in the range of 10 nm to 500 nm, more preferably in the range of 50 nm to 300 nm. When the insulating layer 3 is not provided, a reflective layer is provided between the substrate 2 and the first electrode 4.

In the above embodiment, a flexible film based on polyester resin (E-MASK RP300, manufactured by Nitto Denko Corporation) is used as the

masks

8 and 10, but it is also easy to punch the openings. From the viewpoint of high properties, lightness, and flexibility, those based on polyolefin resins and polyimide resins are preferably used. The adhesive strength of the adhesive surfaces of the

masks

8 and 10 is preferably in the range of 5 N / m to 100 N / m, and more preferably in the range of 10 N / m to 60 N / m. This is because if the adhesive strength is too low, it may be peeled off during the process, and conversely if too high, the substrate 1 may be deformed when the

masks

8 and 10 are peeled off. The thicknesses of the

masks

8 and 10 are both preferably in the range of 10 μm to 400 μm, particularly preferably in the range of 20 μm to 300 μm. If the thickness is too thin, the

masks

8 and 10 may be torn or torn at the time of peeling. On the other hand, if the thickness is too thick, the supply roll and the take-up roll will become meaningless in size and increase the manufacturing cost. Because it is. Further, the size of the

masks

8 and 10 is preferably equal to or slightly smaller than that of the substrate 2. If the size is too small, it will be necessary to prepare many masks, align them each time, and add them together, which tends to make it difficult to operate the roll-to-roll process continuously. is there.

Further, in the above embodiment, after the

masks

8 and 10 are peeled off, the substrate 2 is wound up to perform the next step. However, the

masks

8 and 10 are wound up without being peeled off. Also good. In this case, since the

masks

8 and 10 serve as spacers and the organic EL layer 5 can be wound without contacting the substrate 2, the risk of scratches due to winding deviation or the like can be reduced. When the

masks

8 and 10 are taken up without being peeled off, the

masks

8 and 10 may be peeled off when the substrate 2 is unwound, and then processed in the next step.

In the above embodiment, vacuum evaporation is used as the vapor deposition means when the organic EL layer 5 and the second electrode 6 are formed. However, as other vapor deposition means, sputtering or EB vapor deposition (electron beam vapor deposition) is used. Etc. may be used. However, vacuum deposition is preferably used from the viewpoint of efficiency.

In the above embodiment, Al is used as the second electrode 6, but in addition, materials used as various electrodes such as Ag, magnesium, and alloys thereof can be used. Further, the thickness is preferably in the range of 5 nm to 200 nm, more preferably in the range of 8 nm to 150 nm. That is, if the thickness is too thin, there is a tendency not to act as an electrode, conversely, if it is too thick, it is continuously formed up to the inner peripheral wall surface of the opening 11 of the mask 10, and when the mask 10 is peeled off, This is because there is a possibility that even a necessary part may be peeled off together. Furthermore, instead of vacuum vapor deposition, sputtering can be used as another vapor deposition means. However, it is preferable to use vacuum vapor deposition from the viewpoint of little damage to the organic EL layer 5.

Next, FIGS. 11 to 17 show a manufacturing method according to the second embodiment of the present invention (hereinafter referred to as “the second manufacturing method of the present invention”). In the second manufacturing method of the present invention, the second electrode 6 having a predetermined pattern is formed without patterning the organic EL layer 5 in the first manufacturing method of the present invention, and FIG. The organic EL element 12 shown in FIG. 11B, which is a cross section of −J, is manufactured. In the second manufacturing method of the present invention, the same components as those in the first manufacturing method of the present invention are denoted by the same reference numerals and description thereof is omitted.

That is, in the same manner as the first manufacturing method of the present invention, as shown in FIG. 12A and FIG. 12B which is a KK sectional view thereof, the insulating layer 3 and the first electrode 4 are formed on the substrate 2. Are formed in this order. Then, as shown in FIG. 13A and FIG. 13B which is an LL sectional view thereof, an organic EL layer forming material is vacuum-deposited on the substrate 2, and the organic EL layer 5 is formed on almost the entire surface of the substrate 2. Form.

Next, the mask 10 has an adhesive layer on one surface, and the opening 11 having the same shape as the second electrode 6 formation scheduled portion (see FIG. 16) is continuously provided by punching. A flexible film (E-MASK RP300, manufactured by Nitto Denko Corporation) is prepared and adjusted so that the second electrode 6 formation planned portion of the substrate 2 and the opening 11 of the mask 10 are aligned with each other. Using the layer, as shown in FIG. 14A and FIG. 14B, which is a MM cross-sectional view thereof, a mask 10 is bonded to the substrate 2 on which the organic EL layer 5 is formed.

Then, a second electrode forming material is vacuum-deposited on the substrate 2 from above the mask 10, and as shown in FIG. 15A and its NN cross-sectional view, FIG. 6 is formed. Thereafter, the second electrode 6 is formed only at a predetermined portion, as shown in FIG. 16A and its OO cross-sectional view, FIG. The Thereafter, as shown in FIG. 17, the organic EL element 12 (FIGS. 11A and 11B) can be obtained by cutting into a predetermined size.

According to the second manufacturing method of the present invention, in addition to the effects obtained by the first manufacturing method of the present invention, it is not necessary to pattern the organic EL layer 5, so that the low-cost organic EL element 12 can be formed more quickly. Can be manufactured.

Further, FIGS. 18 to 24 show a manufacturing method according to a third embodiment of the present invention (hereinafter referred to as “third manufacturing method of the present invention”). In the third manufacturing method of the present invention, in the first manufacturing method of the present invention, the mask used for forming the organic EL layer 5 having a predetermined pattern is not peeled off after the organic EL layer forming material is vacuum-deposited. An organic EL element in which a second electrode 6 having the same pattern as the organic EL layer 5 is formed so as to be peeled off after the second electrode forming material is vacuum-deposited after being vacuum-deposited. 13 [see FIG. 18 (a) and FIG. 18 (b) which is a cross-sectional view taken along the line PP thereof]. In the third manufacturing method of the present invention, the same components as those in the first or second manufacturing method of the present invention are denoted by the same reference numerals and description thereof is omitted.

That is, in the same manner as in the first manufacturing method of the present invention, as shown in FIG. 19A and FIG. 19B which is a QQ sectional view thereof, the insulating layer 3 and the first electrode 4 are formed on the substrate 2. Are formed in this order. Then, a sheet-like mask 14 (flexible film E-MASK RP300, which is provided with openings 15 having the same shape as the organic EL layer 5 and the second electrode 6 formation scheduled portion (see FIG. 23) continuously by punching. Nitto Denko Co., Ltd.) is prepared and adjusted so that the organic EL layer 5 and the second electrode 6 scheduled to be formed on the substrate 2 coincide with the opening 15 of the mask 14, and the adhesive layer of the mask 14 is used. Then, as shown in FIG. 20A and FIG. 20B which is an RR sectional view thereof, the mask 14 is bonded to the substrate 2 on which the first electrodes 4 are formed. Then, as shown in FIG. 21 (a) and FIG. 21 (b) which is an SS cross-sectional view, an organic EL layer forming material is vacuum-deposited on the substrate 2 from above the mask 14, and the mask 14 The second electrode forming material is vacuum-deposited as shown in FIG. 22A and FIG. 22B, which is a TT cross-sectional view, continuously from above the mask 14 without peeling off the organic layer. The EL layer 5 and the second electrode 6 are formed. Thereafter, the mask 14 is wound off while being peeled off, and the organic EL layer 5 and the second electrode 6 are to be formed, as shown in FIG. 23 (a) and FIG. Only the organic EL layer 5 and the second electrode 6 are formed, and the organic EL layer 5 having a predetermined pattern and the second electrode 6 having the same pattern are formed. As shown in FIG. 24, the organic EL element 13 (see FIGS. 18A and 18B) can be obtained by cutting it into a predetermined size.

According to the third manufacturing method of the present invention, in addition to the effects obtained by the first manufacturing method of the present invention, it is not necessary to peel off the mask after the organic EL layer 5 is formed. The organic EL element 13 can be manufactured. In addition, although the organic EL layer 5 and the second electrode 6 having a predetermined pattern are formed, since the mask to be used is made common, it is possible to realize manufacture at a lower cost.

Next, examples will be described together with comparative examples. However, the present invention is not limited to this.

[Example 1]
When manufacturing an organic EL element by a roll-to-roll process, a SUS substrate 2 having a width of 20 mm, a length of 140 m, and a thickness of 50 μm is prepared, and this one end is wound around a supply roll. The other end was wound around a take-up roll. Then, while continuously feeding the substrate 2, an insulating acrylic resin (JEM-477, manufactured by JSR) was applied to the surface of the substrate 2 to form an insulating layer 3 (thickness 4 μm). On top of that, IZO (thickness 20 nm) was sputtered and patterned by etching to form the first electrode 4. While aligning a flexible film (E-MASK RP300, manufactured by Nitto Denko Corp.) having an opening 9 corresponding to a portion where the organic EL layer 5 is to be formed as a mask 8 with respect to the substrate 2 formed up to the first electrode 4 From above the mask 8, copper phthalocyanine (CuPc) 25 nm / N, N'-diphenyl-NN-bis (1-naphthyl) -1,1'-biphenyl)-in a vacuum of 10 ^-4

Pa

4,4′-diamine (NPB) 45 nm / 8-quinolinol aluminum complex (Alq3) 60 nm / lithium fluoride (LiF) 0.5 nm was deposited at a rate of 0.1 nm / sec, and then the mask 8 was wound up. The organic EL layer 5 having a predetermined pattern was peeled off. Next, the organic EL layer 5 is formed while aligning a flexible film (E-MASK RP300, manufactured by Nitto Denko Corporation) provided with an opening 11 corresponding to the portion where the second electrode 6 is to be formed as the mask 10. The second electrode 6 having a predetermined pattern is bonded to the substrate 2 and evaporated from above the mask 10 by vapor deposition of Al (thickness 10 nm) in a vacuum of 10 ⁻⁴ Pa. Formed. This was cut into a size of 30 mm in length to obtain the target organic EL device.

[Example 2]
A target organic EL device was obtained in the same manner as in Example 1 except that the organic EL layer 5 was formed on almost the entire surface of the substrate 2 without patterning.

Example 3
After the organic EL layer 5 is formed, Al (thickness 10 nm) is deposited on the mask 8 in a vacuum of 10 ⁻⁴ Pa without peeling off the mask 8, and then peeled off while winding the mask 8. The target organic EL device was obtained in the same manner as in Example 1 except that the organic EL layer 5 having a predetermined pattern and the second electrode 6 having the same pattern were formed.

[Comparative Example 1]
For the formation of the organic EL layer 5 having a predetermined pattern, a shadow mask (thickness 50 μm) made of SUS304 is used instead of the mask 8 made of a flexible film, and the second electrode having a predetermined pattern is further formed by using a mask made of a flexible film. A target organic EL device was obtained in the same manner as in Example 1 except that a shadow mask (thickness: 50 μm) made of SUS304 was used instead of 10.

With respect to the organic EL elements of Examples 1 to 3 and Comparative Example 1 thus obtained, a current of 10 mA / cm ² was applied between the first electrode and the second electrode, and the element characteristics (luminous efficiency) were determined as organic. It was measured with an EL luminous efficiency measuring device (EL-3000, manufactured by Precise Gauge). As a result, the products of Examples 1 to 3 had a light emission efficiency of 1 cd / A. The product of Comparative Example 1 caused a short circuit and did not emit light.

From the above results, it can be seen that all the products of Examples 1 to 3 can be continuously produced by a roll-to-roll process and have excellent device characteristics. On the other hand, although the product of Comparative Example 1 can be produced by a roll-to-roll process, when the same continuous production as that of the Example product was performed, a short circuit occurred and no light was emitted. This seems to be because fine scratches were generated in each layer due to contact with a metal shadow mask.

In the above embodiments, specific forms in the present invention have been described. However, the above embodiments are merely examples and are not construed as limiting. Various modifications apparent to those skilled in the art are contemplated to be within the scope of this invention.

The method for producing an organic EL element of the present invention is suitable as a method for quickly and efficiently producing an organic EL element used for lighting equipment, a backlight of a liquid crystal display, a light emitting component for display decoration, digital signage, and the like.

Claims

A step of conveying a sheet-like substrate by roll-to-roll, a step of forming a first electrode on the upper side of the sheet-like substrate, a step of forming an organic electroluminescence layer on the first electrode, and the organic electroluminescence layer Forming a second electrode having a predetermined pattern using a mask, and in the step of forming the second electrode, the mask has an adhesive surface and has an opening corresponding to the predetermined pattern. After the second electrode forming material is vapor-deposited on the organic electroluminescent layer through the opening, in a state of being a flexible film and the mask being bonded to the sheet-like substrate on which the organic electroluminescent layer is formed, A second electrode having a predetermined pattern is formed by peeling the mask. Direct Russia preparation of the luminescence element.
In the step of forming the organic electroluminescent layer, a flexible film having an adhesive surface and having an opening corresponding to a predetermined pattern is used as a mask, and the mask is bonded to a sheet-like substrate. 2. The organic electroluminescence layer according to claim 1, wherein a luminescent layer forming material is deposited on the first electrode through the opening and then the mask is peeled to form an organic electroluminescence layer having a predetermined pattern. Manufacturing method of luminescence element.
A step of conveying the sheet-like substrate by roll-to-roll, a step of forming the first electrode on the upper side of the sheet-like substrate, and an organic electroluminescence layer having a predetermined pattern using a mask on the first electrode Forming a second electrode having the same pattern as the organic electroluminescence layer using a mask on the organic electroluminescence layer, and forming the organic electroluminescence layer and the second electrode. In the forming step, the same flexible film having an adhesive surface and an opening corresponding to a predetermined pattern is commonly used as the mask, and the organic electroluminescence is bonded to the sheet-like substrate. The layer forming material and the second electrode forming material are fed through the opening. An organic electroluminescence device comprising: an organic electroluminescence layer having a predetermined pattern and a second electrode having the same pattern by peeling off the mask after sequentially depositing on the first electrode The manufacturing method.