WO2012097513A1 - 一种光电芯片组件及封装方法 - Google Patents
一种光电芯片组件及封装方法 Download PDFInfo
- Publication number
- WO2012097513A1 WO2012097513A1 PCT/CN2011/070416 CN2011070416W WO2012097513A1 WO 2012097513 A1 WO2012097513 A1 WO 2012097513A1 CN 2011070416 W CN2011070416 W CN 2011070416W WO 2012097513 A1 WO2012097513 A1 WO 2012097513A1
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- WIPO (PCT)
- Prior art keywords
- optoelectronic chip
- circuit board
- fixed
- carrier
- chip
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
Definitions
- the present invention relates to the field of electronic technologies, and in particular, to an optoelectronic chip assembly and a packaging method. Background technique
- the chip When the package is implemented, the chip is packaged as a separate sealing body by a special packaging device, and the packaging equipment is large and the packaging cost is high. Moreover, the packaging process is complicated, and since there is no reasonable design of the chip structure, the size of the chip after packaging is also large. Summary of the invention
- Embodiments of the present invention provide an optoelectronic chip assembly and a packaging method, which are capable of solving the corrosion and high temperature damage of the optoelectronic chip by using a sealant package in the conventional chip packaging mode, and the packaging cost is high and the package is packaged by using a special package device.
- the problem of large chip size is provided.
- An optoelectronic chip assembly comprising: a first optoelectronic chip, a fiber optic assembly, a circuit board and a cover, wherein
- the first optoelectronic chip and the optical fiber component are fixed on the circuit board, and a light receiving surface of the first optoelectronic chip is opposite to a light emitting surface of the optical fiber component, the first optoelectronic chip and the circuit Board electrical connection;
- the cover is located above the first optoelectronic chip and the optical fiber component, and is configured with the circuit board Closed space.
- a method of packaging an optoelectronic chip assembly comprising:
- a cover is secured to the circuit board, wherein the cover is positioned over the optoelectronic chip and the fiber optic assembly and forms a closed space with the circuit board.
- the cover is used instead of the sealant for packaging, thereby avoiding corrosion and high temperature damage caused by the sealant on the optoelectronic chip, and the optical component and the optoelectronic chip are directly opposed to save space and simplify operation, and the photoelectric chip is used.
- the integrated package with the board saves packaging space, simplifies the packaging process and reduces packaging costs.
- FIG. 1 is an overall package structure diagram of an optoelectronic chip assembly according to an embodiment of the present invention
- FIG. 2a is a top view of a circuit board according to an embodiment of the present invention.
- FIG. 2b is a side view of a circuit board according to an embodiment of the present invention.
- FIG. 3 is a positional relationship diagram of a first optoelectronic chip and a second optoelectronic chip according to an embodiment of the present invention
- FIG. 4 is a view showing a positional relationship between a fiber optic module and an optoelectronic chip according to an embodiment of the present invention
- Flow chart of the packaging method of the optoelectronic chip component is detailed description
- an embodiment of the present invention provides an optoelectronic chip assembly and a packaging method.
- An embodiment of the present invention provides an optoelectronic chip assembly, including: a first optoelectronic chip, an optical fiber component, a circuit board, and a cover, wherein
- the first optoelectronic chip and the optical fiber component are fixed on the circuit board, and a light receiving surface of the first optoelectronic chip is opposite to a light emitting surface of the optical fiber component, the first optoelectronic chip and the circuit Board electrical connection;
- the cover is located above the first optoelectronic chip and the fiber optic assembly and forms a closed space with the circuit board.
- a recess may be disposed on the circuit board, and the optical fiber component is fixed on a bottom surface of the recess, and the first optoelectronic chip is fixed in the slot.
- the fiber optic assembly is fixed on the bottom surface of the groove by a first carrier that is in contact with the bottom surface of the groove, and the first optoelectronic chip is fixed by the second carrier On the bottom surface of the recess, wherein the second carrier is fixed on the bottom surface of the recess and the first optoelectronic chip is fixed on the side of the second carrier.
- the material shield of the first carrier and the second carrier is ceramic or silicon-based material, and is fixed by the carrier, which is convenient for fixing and facilitating heat dissipation.
- a cavity may be disposed on the circuit board, and a bottom plate is fixed under the cavity, and the optical fiber component is fixed at
- the first optoelectronic chip is fixed on the sidewall of the cavity on the bottom plate, or the optical fiber component is fixed on the bottom plate by a first carrier that is in contact with the bottom plate,
- the first optoelectronic chip is fixed on the bottom plate by a second carrier, wherein the second carrier is fixed on the bottom plate and the first optoelectronic chip is fixed on a side of the second carrier.
- the bottom plate is generally made of a material having good thermal conductivity and high strength, and for example, a metal material such as copper may be used.
- the optoelectronic chip assembly further includes: a second optoelectronic chip, wherein when the first optoelectronic chip is fixed by the second carrier, the second optoelectronic chip is fixed on a top surface of the second carrier, or When the first optoelectronic chip is fixed on the sidewall of the recess or cavity, the second optoelectronic chip is fixed on a portion of the circuit board near the groove or the cavity,
- An implementation manner of electrically connecting an optoelectronic chip to the circuit board includes: the first optoelectronic chip is electrically connected to the second optoelectronic chip, and the second optoelectronic chip is electrically connected to the circuit board.
- the second photo chip is mainly used for processing electrical signals.
- the interior of the enclosed space is vacuum or filled with a protective gas.
- Embodiment 1 The solution in the present invention will be described in detail below with reference to a preferred embodiment.
- This embodiment provides an optoelectronic chip assembly, as shown in FIG. 1, the light is given in the figure.
- the overall packaging effect of the electrical chip assembly is given in the figure.
- the optoelectronic chip assembly in this embodiment comprises: a circuit board with a cavity, a bottom plate 6 located below the cavity and fixed to the bottom of the circuit board 1, and an optical fiber fixed to the bottom plate 6 by the first carrier 5.
- the shape of the circuit board 1 is shown in Figs. 2a and 2b.
- Fig. 2a shows a plan view of the circuit board 1 in the optoelectronic chip assembly
- Fig. 2b shows a side view of the circuit board 1 in the optoelectronic chip assembly.
- the circuit board 1 may be a printed circuit board, or may be an epoxy, ceramic circuit board or other material circuit board, including a plurality of electrical connection layers and an insulating layer, and the inside of the circuit board is completed according to the principle of the light emitting circuit and the light receiving circuit. Wiring, and designing an electrical interface on one side of the board to enable the input and output of electrical signals.
- the circuit board 1 in this embodiment can realize interconnection of various electrical signals to achieve impedance matching of the connection lines, and is mainly used for realizing signal transmission channels through electrical connection lines and optical fiber components located inside or on the surface of the circuit board.
- the board can be made of epoxy, ceramic or other substrate materials, and 'in order to reduce the package volume of the optoelectronic chip, a cavity is designed in the middle of the circuit board. The shape and size of the cavity are based on the optoelectronic chip and the fiber. The shape of the component is designed to be square or round.
- a bottom plate 6 is fixed under the cavity, and the bottom plate 6 is generally made of a material having high thermal conductivity and high strength.
- the optical fiber component 7 includes an optical fiber and a fiber fixing structure, and provides an optical signal interface, which is mainly used for realizing optical signal transmission.
- the first optoelectronic chip 3 is mainly used for converting photoelectric signals and electro-optical signals and processing the electrical signals. Specifically, when the photoelectric signals are converted, the optical signals are transmitted through the optical fibers inside the optical fiber assembly 7 to reach the optical fiber component 7.
- the light-emitting surface is directly incident on the light-receiving surface of the first optoelectronic chip 3 through the light-emitting surface of the optical fiber assembly 7, and the photoelectric signal is converted by the first optoelectronic chip 3.
- the electro-optical signal is converted, the electrical signal is first.
- the photoelectric chip 3 is internally converted into an optical signal, and is directly incident on the light receiving surface of the optical fiber module 7 by the light emitting surface of the first photovoltaic chip 3, and is transmitted through the optical fiber inside the optical fiber assembly 7.
- the positional relationship between the optical fiber component and the optoelectronic chip is shown in FIG. 4, in order to ensure that the optical signal is between the optical fiber component 7 and the first optoelectronic chip 3.
- For the transmission it is necessary to align the light emitting surface of the optical fiber unit 7 with the light receiving surface of the first photovoltaic chip 3.
- the optical fiber component 7 is fixed on the circuit board through the first carrier 5 attached to the circuit board 1, wherein the first carrier 5 has a smooth horizontal surface and good mechanical strength and Stability, at the same time, the first optoelectronic chip 3 is fixed on the circuit board 1 through the second carrier 4, and the second carrier 4 may have a rectangular shape, and the first optoelectronic chip 3 is fixed on the side of the second carrier 4. Therefore, the light receiving surface of the first optoelectronic chip 3 is opposite to the light emitting surface of the optical fiber assembly 7, the second carrier 4 can be directly fixed on the circuit board 1, or the second carrier 4 can be fixed to the circuit board through the first carrier 5. 1 on.
- the fixing between the first carrier 5 and the second carrier 4 and the circuit board 1, the fixing between the optical fiber component 7 and the first carrier 5, and the fixing between the first optoelectronic chip 3 and the second carrier 4 are both It can be achieved by means of glue or welding.
- the material of the first carrier 4 and the second carrier 5 may be ceramic or silicon-based material or the like, and fixed by a carrier, which is convenient for fixing and facilitating heat dissipation.
- the optical fiber component 7 and its internal optical fiber are horizontally fixed on the bottom plate 6, that is, the optical fiber is parallel to the plane of the bottom plate 6.
- the first optical chip 3 is fixed to the side of the second carrier 4, so it is perpendicular to the plane of the bottom plate.
- the first optoelectronic chip 3 and the optical fiber component 7 are directly coupled, that is, the three-dimensional adjustment of the optical fiber component 7 is implemented by using a precision coupling jig to realize optical signal coupling of the optical fiber component 7 and the first optoelectronic chip 3, and the combination is through the optical fiber.
- the component 7 is aligned with the position of the first optoelectronic chip 3, that is, the light emitting surface of the first optoelectronic chip 3 is also called the light receiving surface and the axial direction of the optical fiber of the optical fiber component 7 is perpendicular to each other, and the first optoelectronic chip 3
- the light emitting surface is also called the light receiving surface aligned with the fiber assembly 7, so that the light emitted by the first photovoltaic chip 3 can be directly incident into the optical fiber inside the optical fiber assembly 7, and the light emitted from the optical fiber inside the optical fiber assembly 7 can also be directly incident on the first surface.
- the end face of the optical fiber component 7 corresponding to the first optoelectronic chip 3 is at an angle to the vertical cross section of the internal optical fiber, and the angle may be between 0 and 15 degrees. That is to say, the optical fiber inside the optical fiber component 7 is not necessarily vertically cut, but may have a certain inclination when cutting, and the corresponding cut end face shape is also elliptical rather than true circular.
- the optical fiber component 7 and the first optoelectronic chip 3 are directly coupled, that is, directly aligned, and the optical signal is changed by the lens to change the optical transmission direction in the conventional implementation manner. Complex operations for transmission and reduced chip size.
- the embodiment may further include the second optoelectronic chip 2 for outputting the electrical signal to the first optoelectronic chip 3 or
- the electrical signal to be input to the first optoelectronic chip 3 is processed, such as amplification, filtering, and the like.
- the positional relationship diagram of the first optoelectronic chip 3 and the second optoelectronic chip 2 is shown in Fig. 3, and the second optoelectronic chip 2 can be fixed on the top surface of the second carrier 4.
- the second optoelectronic chip 2 and the first optoelectronic chip 3 are electrically connected, that is, a gold wire, an aluminum wire or another metal connecting wire is passed between the top surface of the second optoelectronic chip 2 and the light emitting surface of the first optoelectronic chip 3, that is, a picture
- the bonding wires 9 in 3 realize electrical connection, also called bonding, since the top surface of the second optoelectronic chip 2 and the light emitting surface of the first optoelectronic chip 3 are not on one horizontal plane, but are perpendicular to each other, so the bonding technique It can also be called three-dimensional bonding.
- the second optoelectronic chip 2 is electrically connected to the circuit board 1 for transmitting an electrical signal transmitted through the electrical interface on the circuit board 1 to the optical fiber component 7 via the first optoelectronic chip 3, and also for the slave optical fiber component 7
- the electrical signals transmitted via the first optoelectronic chip 3 are transmitted to the circuit board 1 and transmitted to other devices through the electrical interface on the circuit board 1.
- the first optoelectronic chip and the second optoelectronic chip in this embodiment may be a single chip or a chipset.
- the cover 8 in this embodiment forms a closed space with the circuit board 1 and the bottom plate 6 to realize the packaging of the optoelectronic chip assembly.
- the optical fiber component and the optoelectronic chip are located inside the closed space, and the inside of the closed space may be vacuum or Fill with a protective gas such as nitrogen.
- the cover can be fixed to the circuit board 1 by gluing or splicing.
- the optical fiber component 7 and the first optoelectronic chip 3 are placed in the cavity, thereby reducing the chip volume, and the optical fiber component 7 and the first photoelectric device are
- the chip 3 is fixed on the bottom plate 6 fixed to the bottom surface of the circuit board 1, and the bottom plate 6 is made of a material shield which is easy to dissipate heat, thereby facilitating heat dissipation of the chip.
- the optical fiber component 7 in the embodiment of the present invention is directly coupled to the first optoelectronic chip 3, and the implementation is simple and space-saving.
- the circuit board and the optoelectronic chip are integrally packaged, and the complicated process flow and equipment for separately packaging the optoelectronic chip are omitted.
- the carrier is used to fix the chip, and the chip is encapsulated by the cover, thereby avoiding the easy to use the chip when using the sealant in the conventional manner.
- the defects caused by stress damage and corrosion, thereby improving the reliability of the package, and the conventional use of the sealant package requires a high temperature, and the optoelectronic chip is easily damaged at a high temperature. Therefore, the photoelectric system provided by the embodiment of the present invention is used.
- the chip components are unaffected by the temperature of the encapsulant package and, therefore, extend the temperature range of the chip during operation and storage.
- the embodiments of the present invention may be implemented in other various manners.
- a recess may be provided to place the optoelectronic chip and the optical fiber component.
- the purpose of further reducing the volume of the chip can also be achieved.
- the bottom plate 6 can be omitted correspondingly, and the bottom plate 6 is replaced by the bottom of the KJ groove to fix the photovoltaic chip and the optical fiber assembly.
- the optical fiber component and the optoelectronic chip can be directly fixed on the bottom of the recess or the bottom plate 6 of the circuit board, thereby eliminating the carrier.
- the circuit board in order to achieve better heat dissipation, the circuit board can be better in heat dissipation.
- the ceramic material is fabricated.
- the second carrier since the second carrier is omitted, the first photovoltaic chip 3 cannot be fixed on the side of the second carrier.
- the first optoelectronic chip when the circuit board is provided with In the recess, the first optoelectronic chip can be fixed on the sidewall of the recess, and the second optoelectronic chip can be fixed on the circuit board near the recess; when the cavity is arranged on the circuit board, the first The optoelectronic chip is fixed on the sidewall of the cavity, and the second optoelectronic chip is fixed on the circuit board near the cavity.
- the specific implementation method can also be adjusted according to the actual situation, and is not specifically limited here.
- a cavity or a groove on the circuit board is only a preferred embodiment in the embodiment of the present invention. If a cavity or a groove is not provided on the circuit board, the optoelectronic chip and the optical fiber component are directly fixed on the bottom of the circuit board. Nor does it affect the normal implementation of the invention.
- Embodiments of the present invention provide a method for packaging an optoelectronic chip assembly, as shown in FIG. 5, including the following steps:
- S501 The first optoelectronic chip and the optical fiber component are fixed on the circuit board, and the first optoelectronic chip is electrically connected to the circuit board, wherein the light receiving surface of the first optoelectronic chip and the optical fiber component The light emitting surface is opposite;
- the step of fixing the first optoelectronic chip and the optical fiber component on the circuit board comprises: attaching and fixing the first carrier to the circuit board, and fixing the optical fiber component to the first carrier And attaching the second carrier to the first carrier, and fixing the optoelectronic chip to the side of the second carrier.
- the method further includes: fixing a second optoelectronic chip on the top surface of the second carrier, electrically connecting the second optoelectronic chip to the first optoelectronic chip, and the second optoelectronic chip and the The circuit board is electrically connected.
- the interior of the enclosed space is vacuum or filled with a protective gas.
- the structure of the optoelectronic chip in this embodiment can be designed with reference to the first embodiment.
- the optical fiber component 7 in this embodiment is directly coupled to the first optoelectronic chip 3, and the implementation is simple and space-saving.
- the circuit board and the optoelectronic chip are integrally packaged, and the complicated process flow and equipment for separately packaging the optoelectronic chip are omitted.
- the chip is fixed by the carrier, and the chip is encapsulated by the cover, thereby avoiding the defect that the chip is easily damaged and corroded by the sealant in the conventional manner, thereby improving the reliability of the package and expanding the package.
- the working and storage temperature range of the chip is provided by the carrier, and the chip is encapsulated by the cover, thereby avoiding the defect that the chip is easily damaged and corroded by the sealant in the conventional manner, thereby improving the reliability of the package and expanding the package.
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Description
一种光电芯片组件及封装方法 技术领域 本发明涉及电子技术领域, 特别是涉及一种光电芯片组件及封装方法。 背景技术
目前常用的芯片封装方式一般有两种, 一是通过塑封工艺, 将芯片用密 封胶灌注覆盖并完成固化。 但是, 这种方式由于密封胶与芯片直接接触, 因 此对芯片有严重的应力损伤隐患, 同时, 密封胶本身和芯片之间容易发生化 学反应, 从而对芯片造成腐蚀, 导致封装可靠性低。 而且, 由于密封胶灌注 覆盖时需要 4艮高的温度, 采用密封胶对光电芯片进行封装时的高温容易损坏 光电芯片。 二是采用陶瓷或金属外壳单独对芯片进行封装, 封装时采用熔焊 或钎焊工艺, 具体实现时, 通过专用的封装设备将芯片封装为独立的密封体, 而封装设备投入大, 封装成本高且封装流程复杂, 并且, 由于没有合理的设 计芯片的结构, 导致封装后芯片的体积也较大。 发明内容
本发明实施例提供一种光电芯片组件及封装方法, 以解决传统的芯片封 装方式中采用密封胶封装容易对光电芯片造成腐蚀及高温损坏, 以及采用专 用的封装设备封装时封装成本高且封装后芯片体积大的问题。
一种光电芯片组件, 包括: 第一光电芯片、 光纤组件、 电路板和封盖, 其中,
所述第一光电芯片和所述光纤组件固定在所述电路板上, 且所述第一光 电芯片的光接收面与所述光纤组件的发光面相对, 所述第一光电芯片与所述 电路板电连接;
所述封盖位于所述第一光电芯片和光纤组件上方 , 且与所述电路板构成
封闭空间。
一种光电芯片组件的封装方法, 包括:
将第一光电芯片和光纤组件固定在电路板上, 并将所述第一光电芯片与 所述电路板电连接, 其中, 所述第一光电芯片的光接收面与所述光纤组件的 发光面相对;
将封盖固定在所述电路板上, 其中, 所述封盖位于所述光电芯片和光纤 组件上方 , 且与所述电路板构成封闭空间。
本发明实施例中利用封盖代替密封胶进行封装, 从而避免了密封胶对光 电芯片造成的腐蚀及高温损坏, 且将光纤组件和光电芯片直接相对以节约空 间、 简化操作, 而且, 采用光电芯片和电路板的一体化封装, 从而节约了封 装空间, 简化了封装流程, 降低了封装成本。 附图说明
图 1为本发明实施例提供的光电芯片组件的整体封装结构图;
图 2a为本发明实施例提供的电路板的俯视图;
图 2b为本发明实施例提供的电路板的侧视图;
图 3为本发明实施例提供的第一光电芯片和第二光电芯片的位置关系图; 图 4为本发明实施例提供的光纤組件与光电芯片的位置关系图; 图 5为本发明实施例提供的光电芯片组件的封装方法流程图。 具体实施方式
为了实现本发明目的, 本发明实施例提出一种光电芯片组件及封装方法。 本发明实施例提供了一种光电芯片组件, 包括: 第一光电芯片、 光纤组 件、 电路板和封盖, 其中,
所述第一光电芯片和所述光纤组件固定在所述电路板上, 且所述第一光 电芯片的光接收面与所述光纤组件的发光面相对, 所述第一光电芯片与所述 电路板电连接;
所述封盖位于所述第一光电芯片和光纤组件上方, 且与所述电路板构成 封闭空间。
较佳的, 为了缩小光电芯片组件的体积, 可以在所述电路板上设置有凹 槽, 则所述光纤组件固定在所述凹槽的底面上, 所述第一光电芯片固定在所 述 槽的侧壁上, 或者, 所述光纤组件通过与所述凹槽的底面相贴合的第一 载体固定在所述凹槽的底面上, 所述第一光电芯片通过第二载体固定在所述 凹槽的底面上, 其中, 所述第二载体固定在所述凹槽的底面上且第一光电芯 片固定在所述第二载体的侧面。 其中, 所述第一栽体和第二载体的材盾为陶 瓷或硅基材料等, 通过栽体进行固定, 既便于固定又利于散热。
较佳的, 为了在缩小光电芯片组件体积的基础上, 更好的实现散热, 可 以在所述电路板上设置有空腔, 且所述空腔下方固定有底板, 则所述光纤组 件固定在所述底板上, 所述第一光电芯片固定在所述空腔的侧壁上, 或者, 所述光纤组件通过与所述底板相贴合的第一栽体固定在所述底板上, 所述第 一光电芯片通过第二载体固定在所述底板上, 其中, 所述第二载体固定在所 述底板上且所述第一光电芯片固定在所述第二载体的侧面。 其中, 底板一般 选用导热性好、 强度高的材料来制作, 例如可以选用金属材料, 如铜等。
较佳的, 该光电芯片组件还包括: 第二光电芯片, 当所述第一光电芯片 通过第二载体固定时, 则所述第二光电芯片固定在所述第二载体的顶面上, 或, 当所述第一光电芯片固定在所述凹槽或空腔的侧壁上时, 则所述第二光 电芯片固定在所述电路板上靠近凹槽或空腔的部位, 则所述第一光电芯片与 所述电路板电连接的实现方式包括: 所述第一光电芯片与所述第二光电芯片 电连接, 且所述第二光电芯片与所述电路板电连接。 其中, 所述第二光电芯 片主要用于实现电信号的处理。
较佳的, 所述封闭空间内部为真空或填充有保护气体。
下面结合说明书附图, 以一个优选实施例详细描述本发明中的方案。 实施例一、
本实施例提供了一种光电芯片组件, 参见图 1 所示, 该图中给出了该光
电芯片组件的整体封装效果。
本实施例中的光电芯片组件包括: 带有空腔的电路板 1、位于所述空腔下 方且固定在电路板 1底部的底板 6、通过第一载体 5固定在所述底板 6上的光 纤组件 7、 通过第二载体 4固定在所述底板 6上的第一光电芯片 3, 以及位于 所述第一光电芯片 3和光纤組件 7上方且与带有空腔的电路板 1 以及底板 6 构成封闭空间的封盖 8。
其中, 电路板 1的形状参见图 2a和图 2b所示, 图 2a给出了该光电芯片 组件中电路板 1的俯视图,图 2b给出了该光电芯片组件中电路板 1的侧视图。 电路板 1 可以是印刷电路板, 也可以是环氧、 陶瓷电路板或其他材料的电路 板, 包括多个电气连接层和绝缘层, 根据光发射电路与光接收电路的原理完 成电路板内部的布线, 并且在电路板的一侧设计电接口以实现电信号的输入 输出。 本实施例中的电路板 1 可以实现多种电气信号的相互连接, 实现连接 线的阻抗匹配, 主要用于通过位于电路板内部或表面的电气连接线和光纤组 件来实现信号的传输通道。 该电路板可以采用环氧、 陶瓷或其它基体材料来 制作,' 并且, 为了缩小光电芯片的封装体积, 在电路板的中间部位设计有空 腔, 该空腔的形状和大小依据光电芯片和光纤组件的形状来设计, 可以为方 形或圆形等。 该空腔下方固定有底板 6, 底板 6—般选用导热性好、 强度高的 材料制作。
光纤组件 7 包括光纤和光纤固定结构, 提供了光信号接口, 主要用于实 现光信号的传输。 第一光电芯片 3主要用于实现光电信号以及电光信号的转 换并对电信号进行处理, 具体的, 在实现光电信号转换时, 光信号通过光纤 组件 7内部的光纤传输过来, 到达光纤组件 7的发光面, 则光信号通过光纤 组件 7的发光面直接入射到第一光电芯片 3的光接收面, 由第一光电芯片 3 实现光电信号的转换; 在实现电光信号转换时, 电信号在第一光电芯片 3 内 部转换为光信号, 并由第一光电芯片 3的发光面直接入射到光纤组件 7的光 接收面, 经光纤组件 7 内部光纤进行传输。 其中, 光纤组件与光电芯片的位 置关系参见图 4所示, 为了确保光信号在光纤组件 7和第一光电芯片 3之间
的传输, 需要将光纤组件 7的发光面与第一光电芯片 3的光接收面对准。 具 体的, 在本实施例中, 将光纤组件 7通过与电路板 1相贴合的第一载体 5固 定在电路板上, 其中, 第一栽体 5具有光滑的水平表面和良好的机械强度和 稳定性, 同时, 将第一光电芯片 3通过第二栽体 4固定在电路板 1上, 第二 载体 4的形状可以为矩形, 将第一光电芯片 3固定在第二栽体 4的侧面, 从 而使得第一光电芯片 3的光接收面与光纤组件 7的发光面相对, 第二栽体 4 可以直接固定在电路板 1上, 也可以将第二载体 4通过第一载体 5固定在电 路板 1上。 其中, 第一栽体 5以及第二载体 4与电路板 1之间的固定、 光纤 组件 7与第一载体 5之间的固定以及第一光电芯片 3与第二栽体 4之间的固 定都可以通过粘胶或焊接的方式来实现。 并且, 第一栽体 4 以及第二栽体 5 的材质可选用陶瓷或硅基材料等, 通过载体进行固定, 既便于固定又利于散 热。
本实施例中, 光纤组件 7及其内部光纤水平固定在底板 6上, 即光纤与 底板 6所在平面平行; 第一光电芯片 3由于固定在第二栽体 4的侧面, 所以 与底板所在平面垂直。 并且, 第一光电芯片 3与光纤组件 7是直接耦合的, 即采用精密耦合夹具实现光纤组件 7的三维调整以实现光纤组件 7与第一光 电芯片 3的光信号耦合, 所述 合是通过光纤组件 7与第一光电芯片 3的位 置对准来实现的, 即: 第一光电芯片 3 的发光面也叫光接收面与光纤组件 7 内部光纤的轴向方向相互垂直, 且第一光电芯片 3 的发光面也叫光接收面对 准光纤组件 7,使得第一光电芯片 3发射的光可以直接入射到光纤组件 7内部 的光纤中, 并且光纤组件 7 内部光纤发射的光也可以直接入射到第一光电芯 片 3 的光接收面上。 优选的, 为了改善光信号的传输效果, 所述光纤组件 7 与第一光电芯片 3相对应的端面与内部光纤的垂直横截面呈一定的角度, 该 角度可以在 0到 15度之间。 也就是说, 光纤组件 7内部光纤并不一定是垂直 切割的, 而是在切割时可以有一定的倾斜, 相应的切出的端面形状也为椭圆 形而非正圓形。 本发明实施例中将光纤组件 7与第一光电芯片 3直接耦合, 即直接对准, 省去了传统实现方式中借助透镜改变光传输方向来实现光信号
传输的复杂操作, 且缩小了芯片体积。
并且, 当本实施例中的第一光电芯片 3本身不具备电信号的处理功能时, 本实施例中还可以进一步包括第二光电芯片 2,用于对第一光电芯片 3输出的 电信号或将要输入第一光电芯片 3的电信号进行处理, 如放大、 滤波等。 图 3 中给出了第一光电芯片 3和第二光电芯片 2的位置关系图, 第二光电芯片 2 可以固定在第二载体 4的顶面上。 并且, 第二光电芯片 2和第一光电芯片 3 电连接, 即将第二光电芯片 2的顶面和笫一光电芯片 3的发光面之间通过金 线、 铝线或其他金属连接线, 即图 3中的键合线 9实现电气连接, 也叫键合, 由于第二光电芯片 2的顶面和第一光电芯片 3的发光面并不在一个水平面上, 而是相互垂直, 因此该键合技术也可以称之为三维键合。 并且, 第二光电芯 片 2与电路板 1电连接, 用于将通过电路板 1上的电接口传输过来的电信号 经第一光电芯片 3传输给光纤组件 7,还用于将从光纤组件 7经第一光电芯片 3传输过来的电信号传送给电路板 1 , 并通过电路板 1上的电接口传送给其他 设备。 其中, 本实施例中的第一光电芯片和第二光电芯片可以是单一芯片, 也可以是芯片组。
本实施例中的封盖 8与电路板 1 以及底板 6—起构成封闭空间, 从而实 现光电芯片组件的封装, 光纤组件和光电芯片位于该封闭空间内部, 该封闭 空间内部可以为真空, 也可以填充保护气体, 如氮气。 具体实现时, 该封盖 可采用胶粘或悍接的方式固定在电路板 1上。
本实施例中通过在电路板上设计一个中空的空腔, 从而将光纤组件 7 以 及第一光电芯片 3置于该空腔内, 从而减少了芯片体积, 并且, 将光纤组件 7 以及第一光电芯片 3固定在与电路板 1的底面相固定的底板 6上,由于底板 6 采用易于散热的材盾制作, 从而利于芯片散热。 并且, 本发明实施例中的光 纤组件 7与第一光电芯片 3直接耦合, 实现方式简单且节约空间。 而且, 本 发明实施例中将电路板以及光电芯片进行一体化封装, 省去了对光电芯片单 独封装时的复杂工艺流程和设备。 而且, 本发明实施例中利用载体来固定芯 片, 通过封盖来封装芯片, 避免了传统方式中利用密封胶封装时容易对芯片
造成应力损伤和腐蚀的缺陷, 从而提高了封装可靠性, 并且, 传统的采用密 封胶封装时需要很高的温度, 而光电芯片在高温下极易损坏, 因此, 采用本 发明实施例提供的光电芯片组件不受密封胶封装时的温度影响, 因此, 还扩 展了芯片在工作与存储时的温度范围。
除上述介绍的实现方式之外, 本发明实施例还可以采用其他多种方式实 现, 例如, 可以不在电路板 1 上设置空腔, 而是设置一个凹槽, 从而将光电 芯片和光纤组件置于凹槽内, 同样可以实现进一步缩小芯片体积的目的, 这 时, 则可以相应的省去底板 6, 由 KJ槽的底部来代替底板 6固定光电芯片和光 纤组件。 另外, 还可以将光纤组件和光电芯片直接固定在电路板的凹槽底部 或底板 6上, 从而省去载体, 这时, 为了实现较好的散热效果, 可以将电路 板采用散热性较好的陶瓷材料制作, 此时, 由于省去了第二栽体, 所以第一 光电芯片 3 无法固定在第二栽体侧面, 为了实现第一光电芯片和光纤组件的 直接耦合, 当电路板上设置有凹槽时, 可以将第一光电芯片固定在凹槽的侧 壁上, 将第二光电芯片固定在电路板上靠近凹槽的部位上; 当电路板上设置 有空腔时, 可以将第一光电芯片固定在空腔的侧壁上, 将第二光电芯片固定 在电路板上靠近空腔的部位上。 当然, 具体实现方式也可以 居实际情况进 行调整, 此处不做具体限定。
另外, 在电路板上设置空腔或凹槽, 只是本发明实施例中的优选方案而 已, 如果不在电路板上设置空腔或凹槽, 而直接将光电芯片和光纤组件固定 在电路板底部, 也并不影响本发明的正常实施。
实施例二、
本发明实施例提供了一种光电芯片组件的封装方法, 如图 5 所示, 包括 以下步骤:
S501 : 将第一光电芯片和光纤组件固定在电路板上, 并将所述第一光电 芯片与所述电路板电连接, 其中, 所述第一光电芯片的光接收面与所述光纤 组件的发光面相对;
S502: 将封盖固定在所述电路板上, 其中, 所述封盖位于所述光电芯片
和光纤组件上方, 且与所述电路板构成封闭空间。
较佳的, 所述将第一光电芯片和光纤组件固定在电路板上的步骤, 具体 包括: 将第一载体贴合并固定在电路板上, 并将所述光纤组件固定在所述第 一载体上; 将第二载体贴合并固定在所述第一栽体上, 并将所述光电芯片固 定在所述第二载体侧面。
较佳的, 该方法还包括: 将第二光电芯片固定在所述第二栽体顶面, 并 将所述第二光电芯片与所述第一光电芯片电连接, 且第二光电芯片与所述电 路板电连接。
较佳的, 所述封闭空间内部为真空或填充有保护气体。
本实施例中的光电芯片结构可参照实施例一进行设计, 本实施例中的光 纤组件 7与第一光电芯片 3直接鵜合, 实现方式简单且节约空间。 而且, 本 发明实施例中将电路板以及光电芯片进行一体化封装, 省去了对光电芯片单 独封装时的复杂工艺流程和设备。 而且, 本发明实施例中利用载体来固定芯 片, 通过封盖来封装芯片, 避免了传统方式中利用密封胶封装时容易对芯片 造成应力损伤和腐蚀的缺陷, 从而提高了封装可靠性, 扩展了芯片的工作与 存储温度范围。
尽管已描述了本发明的优选实施例 , 但本领域内的技术人员一旦得知了 基本创造性概念, 则可对这些实施例做出另外的变更和修改。 所以, 所附权 利要求意欲解释为包括优选实施例以及落入本发明范围的所有变更和修改。
显然, 本领域的技术人员可以对本发明进行各种改动和变型而不脱离本 发明的精神和范围。 这样, 倘若本发明的这些修改和变型属于本发明权利要 求及其等同技术的范围之内, 则本发明也意图包含这些改动和变型在内。
Claims
1、 一种光电芯片组件, 其特征在于, 包括: 第一光电芯片、 光纤组件、 电路板和封盖, 其中,
所述第一光电芯片和所述光纤组件固定在所述电路板上, 且所述第一光 电芯片的光接收面与所述光纤组件的发光面相对, 所述第一光电芯片与所述 电路板电连接;
所述封盖位于所述第一光电芯片和光纤组件上方, 且与所述电路板构成 封闭空间。
2、 如权利要求 1所述的光电芯片组件, 其特征在于, 所述电路板上设置 有凹槽, 则所述光纤组件固定在所述凹槽的底面上, 所述第一光电芯片固定 在所述凹槽的侧壁上, 或者, 所述光纤组件通过与所述 IHJ槽的底面相贴合的 第一栽体固定在所述凹槽的底面上, 所述第一光电芯片通过第二载体固定在 所述凹槽的底面上, 其中, 所述第二载体固定在所述凹槽的底面上且第一光 电芯片固定在所述第二载体的側面。
3、 如权利要求 1所述的光电芯片组件, 其特征在于, 所述电路板上设置 有空腔, 且所述空腔下方固定有底板, 则所述光纤组件固定在所述底板上, 所述第一光电芯片固定在所述空腔的侧壁上, 或者, 所述光纤组件通过与所 述底板相贴合的第一载体固定在所述底板上, 所述第一光电芯片通过第二栽 体固定在所述底板上, 其中, 所述第二栽体固定在所述底板上且所述第一光 电芯片固定在所述第二载体的侧面。
4、 如权利要求 2或 3所述的光电芯片组件, 其特征在于, 还包括: 第二光电芯片, 当所述第一光电芯片通过第二载体固定时, 则所述第二 光电芯片固定在所述第二载体的顶面上, 或, 当所述第一光电芯片固定在所 述凹槽或空腔的侧壁上时, 则所述第二光电芯片固定在所述电路板上靠近凹 槽或空腔的部位, 则所述第一光电芯片与所述电路板电连接的实现方式包括: 所述第一光电芯片与所述第二光电芯片电连接, 且所述第二光电芯片与 所述电路板电连接。
5、 如权利要求 2或 3所述的光电芯片组件, 其特征在于, 所述第一载体 和第二载体的材质为陶瓷或硅基材料。
6、 如权利要求 1所述的光电芯片组件, 其特征在于, 所述封闭空间内部 为真空或填充有保护气体。
7、 一种光电芯片组件的封装方法, 其特征在于, 包括:
将第一光电芯片和光纤组件固定在电路板上 , 并将所述第一光电芯片与 所述电路板电连接, 其中, 所述第一光电芯片的光接收面与所述光纤组件的 发光面相对;
将封盖固定在所述电路板上, 其中, 所述封盖位于所述光电芯片和光纤 组件上方, 且与所述电路板构成封闭空间。
8、 如权利要求 7所述的封装方法, 其特征在于, 所述将第一光电芯片和 光纤组件固定在电路板上的步骤, 具体包括:
将第一栽体贴合并固定在电路板上, 并将所述光纤组件固定在所述第一 载体上;
将第二载体贴合并固定在所述第一载体上, 并将所述光电芯片固定在所 述第二载体侧面。
9、 如权利要求 8所述的封装方法, 其特征在于, 还包括:
将第二光电芯片固定在所述第二栽体顶面, 并将所述第二光电芯片与所 迷第一光电芯片电连接, 且第二光电芯片与所述电路板电连接。
10、 如权利要求 7所述的封装方法, 其特征在于, 所述封闭空间内部为 真空或填充有保护气体。
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CN105182483A (zh) * | 2015-10-27 | 2015-12-23 | 上海交通大学 | 一种特种光纤与反射型光学芯片耦合装置 |
CN105182483B (zh) * | 2015-10-27 | 2017-01-25 | 上海交通大学 | 一种特种光纤与反射型光学芯片耦合装置 |
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