WO2012088807A1 - Led照明灯及其灯具 - Google Patents

Led照明灯及其灯具 Download PDF

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Publication number
WO2012088807A1
WO2012088807A1 PCT/CN2011/073007 CN2011073007W WO2012088807A1 WO 2012088807 A1 WO2012088807 A1 WO 2012088807A1 CN 2011073007 W CN2011073007 W CN 2011073007W WO 2012088807 A1 WO2012088807 A1 WO 2012088807A1
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WO
WIPO (PCT)
Prior art keywords
heat
diffusion plate
ribs
laminated
heat sink
Prior art date
Application number
PCT/CN2011/073007
Other languages
English (en)
French (fr)
Inventor
秦彪
Original Assignee
Qin Biao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qin Biao filed Critical Qin Biao
Publication of WO2012088807A1 publication Critical patent/WO2012088807A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention belongs to the field of LED lighting technology, and particularly relates to a heat sink and an LED light source (LED wick). technical background
  • LED lighting is considered to be the next generation of green lighting technology for human beings.
  • the current high cost of LED lighting products hinders the popularity of their applications.
  • the fundamental reason for the high cost of LED lighting products is caused by LED heat dissipation. People are very mature in heat transfer and technology research. However, practitioners in the electronic chip (including LED) heat dissipation industry generally lack such mature knowledge and even basic knowledge of heat transfer.
  • LED lamps use natural convection heat dissipation. Natural convection is due to air heating and density decrease. The resulting buoyancy drive, limited drive, ensuring smooth air flow is very important for heat dissipation, especially the smooth flow of air in the heat dissipation fins is more important.
  • the heat sink is formed by aluminum hot die casting, (1) high cost of hot die casting, (2) also equipped with turning and milling, (3) rib wall thickness, material
  • the ribs have a shallow depth, that is, the heat dissipation area of the ribs is small, so the heat dissipation is very limited.
  • the structure design the power supply is wrapped in the center of the heat sink, the power supply ambient temperature, and the glue (silica gel) is required, so the power supply is not well cooled, the life is not high, and the glue filling further increases the cost.
  • the present invention is directed to the above problems, and proposes an LED illumination lamp that is particularly suitable for LED bulb design. It not only improves the heat dissipation of the heat sink, but also reduces the material and manufacturing cost of the heat sink. It also proposes to reduce the thermal resistance of the inner package of the LED wick and improve the internal dielectric insulation strength, which is beneficial to reduce the power supply cost.
  • the LED lighting lamp of the present invention mainly comprises: a wick and a heat sink.
  • the heat sink is composed of a plurality of ribs, a laminated structure with a gap between the ribs, and a laminated laminated structure or a flanged portion at the root of the rib
  • the wick and the power source are respectively disposed on the front and rear sides of the heat sink; and more than three-fifths of the fins in the heat sink are metal sheets
  • the aluminum plate is a part formed by a stamping process;
  • the heat sink adopts a plurality of ribs, a laminated structure in which a plurality of ribs are stacked, and the ribs can be stamped and formed by punching.
  • the process has high efficiency and high precision, no need for turning and milling, and the processing cost is further Further reduction; the thickness of the ribs can be reduced as much as possible, which is conducive to saving the material.
  • the thickness of the ribs can be easily reduced to 0.5 liters, which is not achieved by the hot die casting process.
  • Multiple ribs, stacked together by the roots of the ribs (called laminated laminated structure), simple structure, high assembly efficiency, such as a screw or rivet can stack the roots of several ribs together And ensure that the thermal resistance of the thermal conduction is low.
  • laminated laminated structure laminated structure
  • the structure and structure are equally simple, and this structure is widely used in industrial heat exchangers.
  • the ribs may also be fabricated using other processes, such as an aluminum hot die casting process.
  • the present invention emphasizes that more than three-fifths of the ribs in the heat sink should be formed by a stamping process using a metal plate (best aluminum plate).
  • the installation posture of the LED lamp is not fixed.
  • the air can ensure good flow in the ribs
  • the ribs are provided with a vent, and the louver structure and the fork are adopted.
  • the power source is not included in the heat sink.
  • the heat generated by the LED chip reduces the influence of the power supply temperature environment, and the outer casing of the power supply room can open the vent hole, which can further improve the heat dissipation of the power supply, and the power supply does not need to be filled with glue, which is beneficial to reducing the cost of the power supply.
  • Fig. 1 is a schematic cross-sectional view showing the characteristic structure of an LED illuminating lamp of the present invention, showing the basic structural features of the present invention, using a laminated laminated structure.
  • FIG. 2 is a schematic cross-sectional view showing a characteristic structure of an LED illuminating lamp according to the present invention, which adopts a burr-type sheet-pressing structure.
  • FIG. 3 is a schematic cross-sectional view showing a characteristic structure of an LED illuminating lamp of the present invention, which adopts a laminated laminated structure and a lapped laminated type.
  • FIG. 4 is a schematic cross-sectional view showing a characteristic structure of an LED lighting fixture of the present invention.
  • FIG. 5 is a schematic cross-sectional view showing a louver type.
  • FIG. 6 is a schematic cross-sectional view showing a cross-hook type.
  • Figures 7, 8, and 9 are top plan views of three ribs, respectively, showing the kerf lines on the ribs in a radial shape.
  • FIG. 10 is an LED wick for use in the present invention, showing the basic structural features of the wick.
  • Figures 11, 12, and 13 are respectively three types of LED wicks in which the present invention is applied, and three kinds of enhancements are used to improve the insulation strength structure of the edges of the ceramic insulating sheets.
  • the LED lighting lamp of the present invention shown in FIG. 1 is provided with a mounting joint 1 and is screw-type, similar to the current light bulb.
  • the mounting joint can also be snap-fit type.
  • the figure shows that the ribs 4 are laminated laminated structure, which has a total of six ribs, the roots of which are closely laminated together, and the wick 5 and the ribs are laminated by a screw. together, Ensure that the contact between the wick and the heat sink (the first rib in the figure) is tight, so that the contact heat transfer resistance is small.
  • a lamp cover 6 is disposed in front of the wick 5, and a fixed connection between the heat sink and the mounting joint 1 can be completed through the power supply chamber casing 3.
  • the power supply chamber casing 3 should be provided with a plurality of vent holes, which is advantageous for heat dissipation of the internal power source 2.
  • the roots of the ribs are in direct contact, and the structure of the spacers can also be used in design.
  • the ribs 4 are formed by a cuffed sleeve structure, and the root of the rib 4 is processed into a hole with a flange, and the piece is sleeved on the heat conducting sleeve 7.
  • the wick 5 is fastened to the end face of the heat conducting sleeve 7 by screws, and the heat of the wick 5 is first transmitted to the heat conducting sleeve 7, and then transmitted to the rib by the contact between the flange of the root of the rib 4 and the heat conducting sleeve.
  • the heat-conducting sleeve 7 is a separate component that can be designed to be stretched into a thermally conductive sleeve using one of the fins.
  • the heat sink adopts a laminated structure of a laminated laminated type and a flanged sleeve type, and the heat conducting sleeve is formed by using the most front side rib of the heat sink. Stretched.
  • the wick 5 is attached to the end face of the heat conducting core 8 by screws, and the heat conducting core 8 is a cone.
  • FIG. 4 shows an LED lighting fixture of the present invention, which differs from that shown in FIG. 1 in that the wick 5 and the shade 6 are removed.
  • the metal plate (aluminum plate), stamped ribs, can be thinner to reduce material and reduce cost. However, the strength of the ribs is lowered.
  • a support member should be provided between the ribs, so that when a rib is subjected to force deformation displacement, adjacent ribs are also required. The displacement, thus increasing the overall strength, can be designed to be die cut directly from the rib itself.
  • the natural convection drive is small, so the gap between the ribs should not be too small, otherwise the amount of ribs is increased, but the amount of heat is not increased.
  • the average gap between the ribs should not be less than 2.
  • the thickness of the ribs should not be greater than 1.
  • increasing the thickness of the ribs can not effectively increase the heat dissipation, but waste material.
  • FIG. 5 and 6 respectively show the basic features of the louver type and the fork type vent, which can be punched and formed by punching.
  • Figures 7, 8, and 9 show three shapes of the slit line 9 of the vent, which are radial.
  • Fig. 7 shows the shape of the slit line of the vent type vent
  • Fig. 8 shows the shape of the slit line of the louver type vent
  • Fig. 9 may be the shape of the above two kinds of slit lines. Radial cut lines are used primarily to facilitate heat transfer within the ribs.
  • the ribs shown in FIGS. 7, 8, and 9 are all symmetrical disc-shaped, and can also be asymmetrically designed, and even a petal-like shape can be used.
  • the lampshade is also designed like a flower bud, and the LED illuminator is Like a flower.
  • the LED lamp of the present invention shown in FIGS. 1 to 3 is an improvement of the current LED bulb, and the wick, the heat sink and the power source, and the mounting joint are integrated.
  • the power supply can be set elsewhere, and the mounting structure can be different.
  • the power supply can be eliminated.
  • the LED chip 11 is disposed on one side of the heat diffusion plate 10 (this surface is referred to as the A surface of the heat diffusion plate), and the other surface (the surface is referred to as the B surface).
  • a ceramic insulating sheet 13 is provided, and an outer layer insulator 12 is disposed around the edge side wall of the heat diffusion plate 10.
  • the thickness of the ceramic insulating sheet 13 should be greater than 0.15 ⁇ , is responsible for high-voltage insulation, up to 1500V, With such high-voltage insulation, the power supply can be reduced, and the non-isolated drive power supply can be used to reduce the power supply cost.
  • the heat diffusion plate 10 is made of a copper or aluminum material, or a copper-aluminum composite material, and its main function is to reduce the high heat flux density diffusion.
  • the thermal thermal resistance in the LED chip is mainly due to the small area of the LED chip and the formation of a high heat flux density.
  • the LED chip is placed on a thermal diffusion plate of copper or aluminum, and the ceramic insulating sheet which is subjected to high voltage insulation is disposed between the heat diffusion plate and the heat transfer core or the heat sink.
  • the design idea is: first consider the insulation between the LED chip and the heat diffusion plate (high voltage insulation), firstly reduce the heat flow density, and then implement high voltage insulation, which can effectively reduce the internal heat conduction thermal resistance.
  • the heat diffusion plate made of a metal conductive material has no insulation or low dielectric strength between the wafers, and thus the high voltage insulation of the heat diffusion plate becomes a major problem.
  • the area and thickness thereof are also large enough.
  • the area of the heat diffusion plate should be more than five times the sum of the area of the LED chip on the surface of the heat diffusion plate, and the thickness of the heat diffusion plate should be more than ten times. If the wafer is lXlmm, 1W, the thickness of the heat diffusion plate should be above 1. Omm.
  • the purpose and function is to effectively diffuse heat in the heat diffusion plate and reduce the heat flux density.
  • the ceramic sheet sintered into porcelain has high density, high dielectric strength and high thermal conductivity. Therefore, the present invention selects a ceramic insulating sheet sintered into porcelain.
  • Alumina ceramic sheets which are the most commonly used ceramic substrates in electronic components, have low cost and high thermal conductivity.
  • the thermal conductivity of 96 alumina ceramics can reach 20W/m*K, which is the preferred ceramic insulating sheet material.
  • the ceramic insulating sheet and the outer layer insulator are two parts, two materials, the ceramic insulating sheet is thin (generally not exceeding 0.5 mm), the structure shown in FIG. 10, the ceramic insulating sheet 13 is combined with the outer insulating layer 12. Where the insulation strength is low, it is prone to breakdown. In order to strengthen the insulation strength of the joint between the ceramic insulating sheet and the outer insulator (that is, at the edge of the ceramic insulating sheet), as shown in Fig. 11, the edge of the ceramic insulating sheet 13 is larger than the edge of the heat diffusion plate 10, so that it can be enlarged The creepage distance between the edge of the heat diffusion plate and the peripheral conductor such as the heat sink (thermal conduction core) naturally increases the insulation strength. When designing, the edge of the high-voltage insulation sheet should be larger than the edge of the heat diffusion plate by 0.5 or more to ensure sufficient and reliable insulation strength.
  • FIG. 12 shows another enhancement of the insulation strength structure at the edge of the ceramic insulating sheet.
  • the B-face edge of the heat diffusion plate 10 is chamfered, and the edge of the ceramic insulating sheet 13 is larger than the chamfer of the heat diffusion plate 10.
  • the inner edge of the ceramic insulating sheet is the same size as the heat diffusing plate. Due to the chamfering, a triangular opening is naturally formed.
  • the figure also shows that the triangular opening is filled with insulating glue (lacquer) 14, which further improves The dielectric strength of the thermal diffuser at the edge of the ceramic insulating sheet.
  • lacquer insulating glue
  • the insulation strength structure at the edge of the ceramic insulating sheet is enhanced by reinforcement: a convex structure is adopted on the B surface of the heat diffusion plate 10, and the surface in close contact with the ceramic insulating sheet 13 is used. (the surface carrying the heat transfer), the raised edge is smaller than the edge of the ceramic insulating sheet 13, and thus a gap is formed at the edge of the heat diffusion plate 10 and the edge of the ceramic insulating sheet 13, as shown in the figure, Filled with insulating glue (lacquer) 14, this can enhance the insulation strength at the edge of the ceramic insulating sheet.
  • insulating glue lacquer
  • the ceramic insulating sheet 13 is disposed (preferably spliced) on the B side of the heat diffusion plate 10, and may also be designed to provide the ceramic insulating sheet in the wick.
  • the heat input surface (referred to as the heat absorbing surface) is in contact with the wick, as long as the ceramic insulating sheet is disposed between the B surface of the heat diffusion plate and the heat conductive core in the wick or the heat absorbing surface on the heat sink.

Description

LED照明灯及其灯具
技术领域
[0001 ] 本发明属于 LED照明技术领域， 特别涉及到散热片和 LED光源 （LED灯芯）。 技术背景
[0002] LED照明被认为是人类下一代绿色环保照明技术。 但当前 LED照明产品造价高， 阻碍着其应用普及， LED照明产品造价高的根本原因是 LED散热造成。 人们对传热学及技术 研究， 非常成熟。 但在电子芯片 （包括 LED ) 散热行业内从业人员， 普遍缺乏这些成熟的知 识， 甚至是传热学的基本知识， 比如， LED 灯散热采用自然对流散热， 自然对流是由于空气 受热升温， 密度下降产生的浮力驱动， 驱动有限， 保证空气流动畅通对散热就非常重要， 特 别是空气在散热肋片中的畅通流动更重要。
[0003] 现有一种 LED球泡灯， 散热片在中部， 肋片从中心筒辐射伸出， 中心筒内是电源， 肋片顺着轴向方向排列， 当横置时， 空气流经肋片中就不畅通， 散热性能影响很大。 散热片 是采用铝热压铸成形， （1 ) 热压铸成本高， （2 ) 还要配有车铣精加工， （3 ) 肋片壁厚， 材料
(铝料） 用量大， （4) 肋片深度浅， 即肋片散热面积小， 因而散热量非常有限。 另外这种结 构设计， 电源在散热片中心， 被包裹着， 电源环境温度， 又要灌胶（硅胶)， 因而电源散热不 佳， 寿命不高， 灌胶又进一步增加成本。
发明内容
[0004] 本发明是针对以上所述问题， 提出一种 LED照明灯， 特别适合用于 LED球泡灯设 计。 不仅提高了散热片的散热量， 而且降低了散热片的材料与制造成本， 还提出了降低 LED 灯芯内部封装的导热热阻， 以及提高内部的电的绝缘强度， 有利于降低电源成本。
[0005] 本发明的 LED照明灯的构成主要包括有： 灯芯和散热片。 本发明的特征是： 散热 片采用了数多片状肋片组成， 肋片之间留间隙的一片片垒起来的叠片式结构， 肋片根部采用 了叠片层压式结构、 或翻边套片式结构、 或叠片层压式结构与翻边套片式组合结构； 灯芯与 电源分别设置在散热片的前后两侧； 散热片中有五分之三以上的肋片是金属板材 （最好是铝 板） 采用冲压工艺成型的部件； 肋片上开有百叶窗式结构、 叉列式结构通气口。 电源， 灯芯 与电源分别设置在散热片的前后两侧
[0006] 散热片采用数多肋片， 一片片地垒叠起来的叠片式结构， 肋片就可采用冲床冲压 成型， 该工艺效率高， 精度又高， 无需车铣精加工， 加工成本又进一步降低； 肋片厚度可以 尽可能减薄， 有利于节省料材， 肋片厚度很容易减到 0. 5皿以下， 这是采用热压铸工艺实现 不了的。 数多肋片， 通过肋片根部叠压在一起（称为叠片层压式结构）， 结构简单， 装配效率 高， 比如一颗螺钉或铆钉就可将数多肋片的根部叠压在一起， 并保证导热热阻低。 翻片套片 式结构， 结构同样简单， 这种结构在工业热交换器应用很多。
[0007] 由于某种原因， 肋片也可能采用别的的工艺制造， 比如铝热压铸工艺。 但为了降 低成本， 本发明强调， 散热片中应该有五分之三以上的肋片是采用金属板（最好式铝板）， 采 用冲压工艺加工成型。
[0008] LED灯具安装姿态不固定， 为保证本发明的散热片， 在各种姿态下， 空气在肋片 中能保证良好的流动畅通， 肋片上开有通气口， 并且采用百叶窗式结构、 叉列式结构。 百叶 窗式和叉列式结构通气口： 一、 容易采用冲床加工， 二、 没有废料， 不减小散热面积。 为了 空气在肋片中流动畅通， 通气口应开得尽可能大， 面积应达到该肋片面积的三分之一以上。
[0009] 本发明中， 电源没有被包括在散热片中。 LED芯片发热对电源温度环境影响减小， 电源室的外壳就可开通气孔， 这样可进一步提高电源散热， 电源也不必用胶灌封， 有利于降 低电源的成本。
附图说明
[0010] 下面结合附图和具体实施方式对本发明作进一步说明。
[001 1 ] 图 1是一种本发明 LED照明灯的特征结构剖面示意图， 示出了本发明的基本结构 特征， 采用叠片层压式结构。
[0012] 图 2是一种本发明 LED照明灯的特征结构剖面示意图， 采用翻边套片压式结构。
[0013 ] 图 3是一种本发明 LED照明灯的特征结构剖面示意图， 采用叠片层压式与翻边套 片式组合结构。
[0014] 图 4是一种本发明 LED照明灯具的特征结构剖面示意图。
[0015] 图 5是一种百叶窗式的特征剖面示意图。
[0016] 图 6是一种叉列式的特征剖面示意图。
[0017] 图 7、 8、 9分别是三种肋片的俯视示意图， 表示肋片上的通气口的切口线呈辐射 形状。
[0018] 图 10是一种本发明所用的 LED灯芯， 示出了该种灯芯的基本结构特征。
[0019] 图 11、 12、 13分别是三种本发明所作用的 LED灯芯， 采用了三种强化提高陶瓷绝 缘片边缘的绝缘强度结构。
[0020] 图中： 1、 安装接头， 2、 电源， 3、 电源室外壳， 4、肋片， 5、 灯芯， 6、 灯罩， 7、 导热套筒， 8、 导热芯， 9、 切口线， 10、 热扩散板， 11、 LED 晶片， 12、 外层绝缘体， 13、 陶瓷绝缘片， 14、 绝缘胶（漆）。
具体实施方式
[0021 ] 图 1所示的本发明 LED照明灯， 设置有安装接头 1， 并采用螺扣式， 与现灯泡类 似， 当然安装接头还可以采用卡扣式。 图中示出， 肋片 4采用的是叠片层压式结构， 共有 6 片肋片， 其根部一片片地紧密叠压在一起， 通过一颗螺钉将灯芯 5与数片肋片叠压在一起， 保证灯芯与散热片 （图中最前的肋片）之间的接触紧密， 使得接触传热热阻小。 灯芯 5前设 置有灯罩 6， 散热片与安装接头 1之间的固定连接可以通过电源室壳 3完成， 电源室壳 3应 开有数多通气孔， 这样有利于其内部的电源 2散热。 图中肋片根部之间是直接接触， 设计时 还可以采用增加垫片的结构。
[0022] 图 2所示的本发明 LED照明灯， 肋片 4采用了翻边套片式结构， 肋片 4的根部被 加工成带翻边的孔， 一片片地套在导热套筒 7上， 灯芯 5通过螺钉紧贴在导热套筒 7的端面 上， 灯芯 5的热量先传到导热套筒 7， 再通过肋片 4根部的翻边与导热套筒之间的接触传到 肋片上。 图中导热套筒 7是一单独部件， 设计时可以利用散热片中某一肋片经拉伸成导热套 筒。
[0023] 图 3所示的本发明 LED照明灯中， 散热片采用了叠片层压式与翻边套片式的组合 结构， 导热套筒是用散热片中最前侧的肋片， 经拉伸成型的。 灯芯 5通过螺钉贴在导热芯 8 的端面上， 导热芯 8为圆锥体。
[0024] 图 4示出一种本发明 LED照明灯具， 与图 1所示区别就是拆除了灯芯 5和灯罩 6。 采用金属板（铝板）， 经冲压成型的肋片， 片厚可以薄， 以减少材料， 降低成本。 但肋片的强 度下降， 为保证肋片之间的间距不变以及散热片整体强度， 肋片之间应该设置支件， 使得当 一肋片受力变形位移时， 相邻的肋片也要位移， 因此增加了整体强度， 支件可设计成直接从 肋片本身板材上冲切成型。
[0025] 自然对流驱动小， 因而肋片之间间隙不能太小， 否则虽然肋片数量增加了， 但散 热量没增加。 设计时， 肋片之间的平均间隙不应小于 2. 0皿， 肋片的厚度 （平均厚度） 不应 大于 1. 0皿， 再增加肋片厚度并不能有效增加散热量， 反而浪费材料。
[0026] 图 5、 6分别示出了百叶窗式和叉列式通气口的基本特征， 可采用冲床冲切成型。 图 7、 8、 9示出了通气口的切口线 9的三种形状， 是辐射形。 图 7所示是叉列式通气口的切 口线形状， 图 8是百叶窗式通气口的切口线形状， 图 9可以是以上两种切口线形状。 采用辐 射形切口线， 主要是为了有利于肋片内的导热。
[0027] 图 7、 8、 9所示的肋片都为对称圆盘形， 设计时还可以采用非对称式， 甚至还可 以采用类似花瓣形， 灯罩也设计成象花蕾， 该 LED照明灯就象一朵花一样。
[0028] 图 1至图 3所示的本发明 LED灯是针对现 LED球泡灯的改进， 灯芯、 散热片和电 源以及安装接头合为一体结构。 但对用于射灯、 探照灯等， 特别是功率大的 LED灯， 电源就 可设置在别的地方， 安装结构也可不同。对于采用高压市电直接供电的灯芯， 电源都可省去。
[0029] 图 10示出一种本发明所用的 LED灯芯基本结构， LED晶片 11设置在热扩散板 10 一面（该面称为热扩散板的 A面）， 另一面（该面称为 B面） 设置有陶瓷绝缘片 13， 围着热 扩散板 10的边缘侧壁设置有外层绝缘体 12。
[0030] 陶瓷绝缘片 13的厚度应大于 0. 15匪， 是承担高压绝缘作用的， 可达 1500V以上， 有这样高压绝缘， 就可以减化电源， 采用非隔离式驱动电源， 降低电源成本。热扩散板 10采 用铜或铝质材料、 或铜铝复合材料， 其主要作用是将高热流密度扩散降低。
[0031 ] LED芯片内的导热热阻主要是由于 LED晶片面积小， 形成高热流密度所致。将 LED 晶片设置在铜或铝材的热扩散板上， 承担高电压绝缘的陶瓷绝缘片， 则设置在热扩散板与导 热芯或散热片之间。其设计思想是：先不考虑 LED晶片与热扩散板之间的绝缘（高电压绝缘）， 首先是降低热流密度， 再实施高电压绝缘， 就可有效降低内导热热阻。 采用金属导电材料制 成的热扩散板与晶片之间无绝缘或绝缘强度低，因而热扩散板的高电压绝缘就成了主要问题。
[0032] 作为热扩散作用的热扩散板， 其面积和厚度也要足够大。 热扩散板的面积应是其 上的 LED晶片面积之和的五倍以上， 设计时最好选十倍以上； 热扩散板的厚度应大于 0. 4皿。 如果晶片为 lXlmm, 1W, 热扩散板的厚度应达到 1. Omm以上， 其目的和作用就是使热量在热 扩散板内有效扩散， 降低热流密度。
[0033] 烧结成瓷的陶瓷片， 致密、 绝缘强度高， 导热系数高， 因而本发明选用烧结成瓷 的陶瓷绝缘片。 氧化铝陶瓷片， 是电子元件中最常用的陶瓷基片， 造价低， 导热系数高， 96 氧化铝陶瓷的导热系数可达 20W/m*K， 因而是首选的陶瓷绝缘片材料。
[0034] 陶瓷绝缘片与外层绝缘体是两个部件， 两种材料， 陶瓷绝缘片厚度薄（一般不超 过 0. 5mm)， 图 10中所示结构， 陶瓷绝缘片 13与外层绝缘体 12结合处， 绝缘强度低， 很容 易出现击穿现象。 为加强陶瓷绝缘片与外层绝缘体结合处（也就是陶瓷绝缘片的边缘处） 的 绝缘强度， 图 11中示出， 陶瓷绝缘片 13的边缘大于热扩散板 10的边缘， 这样就可以加大热 扩散板边缘与散热片 （导热芯）等外设导体的爬电距离， 自然就增加了绝缘强度。 设计时， 高压绝缘片的边缘应大于热扩散板的边缘 0. 5皿以上， 以保证足够、 可靠的绝缘强度。
[0035] 图 12中示出了另一种强化提高陶瓷绝缘片边缘处绝缘强度结构， 热扩散板 10的 B面边缘采用了倒角结构， 陶瓷绝缘片 13的边缘大于热扩散板 10倒角的内侧边缘， 图中陶 瓷绝缘片与热扩散板尺寸一致， 由于有倒角， 自然形成一三角口， 图中还示出， 在该三角口 中填充有绝缘胶（漆） 14， 这样又进一步提高了热扩散板在陶瓷绝缘片边缘处的绝缘强度。
[0036] 图 13所示的本发明 LED芯片中， 采用强化提高陶瓷绝缘片边缘处的绝缘强度结 构： 在热扩散板 10的 B面采用了凸起结构， 与陶瓷绝缘片 13紧贴的面（承担传热的面） 凸 起， 凸起的边缘小于陶瓷绝缘片 13的边缘， 因而在热扩散板 10边缘处与陶瓷绝缘片 13边缘 处形成间隙， 图中示出， 在该间隙中还填充有绝缘胶（漆） 14， 这样就可强化提高陶瓷绝缘 片边缘处的绝缘强度。
[0037] 图 10、 11、 12、 13中示出， 陶瓷绝缘片 13是设置（最好是悍接）在热扩散板 10 的 B面， 也可以设计成将陶瓷绝缘片设置在灯芯中的导热芯上或散热片上与灯芯接触热量传 入面（称为吸热面）上， 只要是热扩散板的 B面与灯芯中的导热芯或散热片上的吸热面之间 设置有陶瓷绝缘片即可。

Claims

权 利 要 求 书 、 一种 LED照明灯， 包括有灯芯 （5)和散热片， 其特征在于： 散热片采用了数多片状肋片 组成， 肋片之间留有间隙的叠片式结构， 肋片根部采用了叠片层压式结构、或翻边套片式 结构、或叠片层压式与翻边套片式组合结构； 散热片中有五分之三以上的肋片是金属板材 采用了冲压成形的部件； 肋片 （4)上开有百叶窗式结构、 叉列式结构通气口。
、 根据权利要求 1所述的 LED照明灯， 其特征在于： 百叶窗式、 叉列式结构的通气口的空 气流通面积应达到该肋片面积的三分之一以上。
、 根据权利要求 1所述的 LED照明灯， 其特征在于： 散热片中的导热套筒（7) 是其中某一 肋片根部经拉伸成型的部份。
、 根据权利要求 1所述的 LED照明灯， 其特征在于： 肋片 （4)上的百叶窗式结构、 叉列式 结构通气口的切口线 （9)呈辐射形状。
、 根据权利要求 1所述的 LED照明灯， 其特征在于： 灯芯 （5) 中设置有热扩散板（10)， 热扩散板（10)采用了铜质或铝质材料、 或铜铝复合材料， 热扩散板的厚度大于 0.4mm; 灯芯（5) 中的 LED晶片设置在热扩散板（10) 的 A面上； 热扩散板的 B面与灯芯中的导 热芯（8)或散热片的吸热面之间设置有烧结成瓷的陶瓷绝缘片（13)， 该陶瓷片绝缘片厚 度大于 0.15mm。 围着热扩散板的边缘侧壁设置有绝缘体（12)， 并与陶瓷绝缘片 （13) 相连。
、 根据权利要求 5所述的 LED照明灯， 其特征在于： 陶瓷绝缘片 （13) 是氧化铝陶瓷片. 、 根据权利要求 5所述的 LED照明灯， 其特征在于： 陶瓷绝缘片 （13)边缘处的绝缘强化 提高结构采用了，
陶瓷绝缘片的边缘大于热扩散板的边缘结构、
或热扩散板（10) 的 B面凸起结构， 该凸起的边缘小于陶瓷绝缘片 （13) 的边缘、 或热扩散板（10) 的 B面边缘采用了倒角结构。
、 一种 LED照明灯具， 包括有安装接头 （1 )， 电源（2)和散热片， 安装接头 （1 ) 为螺扣 式或卡扣式； 电源（2)设置在安装接头（1 )和散热片之间， 散热片的另一侧设置有 LED 灯芯安装位， 灯芯安装位位于散热片的中部， 其特征在于： 散热片采用了数多片状肋片组 成， 肋片之间留有间隙的叠片式结构， 肋片根部采用了叠片层压式结构、或翻边套片式结 构、或叠片层压式与翻边套片式组合结构； 散热片中有五分之三以上的肋片是金属板材采 用了冲压成形的部件； 肋片 （4) 上开有百叶窗式结构、 叉列式结构通气口， 该通气口的 切口线 （9)呈辐射形状。
、 根据权利要求 8所述的 LED照明灯具， 其特征在于： 肋片之间设置有支件。
0、根据权利要求 8所述的 LED照明灯具，其特征在于：肋片之间的平均间隙不小于 2.0mm， 肋片的平均厚度不大于 1 .0mm。
PCT/CN2011/073007 2010-12-28 2011-04-19 Led照明灯及其灯具 WO2012088807A1 (zh)

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