WO2012088693A1 - Système d'isolation thermique extérieure - Google Patents

Système d'isolation thermique extérieure Download PDF

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Publication number
WO2012088693A1
WO2012088693A1 PCT/CN2010/080518 CN2010080518W WO2012088693A1 WO 2012088693 A1 WO2012088693 A1 WO 2012088693A1 CN 2010080518 W CN2010080518 W CN 2010080518W WO 2012088693 A1 WO2012088693 A1 WO 2012088693A1
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WO
WIPO (PCT)
Prior art keywords
thermal insulation
epoxy
insulation system
weight
amine
Prior art date
Application number
PCT/CN2010/080518
Other languages
English (en)
Inventor
Xiaoming Wang
Cuiping Chen
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Priority to PCT/CN2010/080518 priority Critical patent/WO2012088693A1/fr
Publication of WO2012088693A1 publication Critical patent/WO2012088693A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/046—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0214—Materials belonging to B32B27/00
    • B32B2266/0221—Vinyl resin
    • B32B2266/0228—Aromatic vinyl resin, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2419/00—Buildings or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2607/00—Walls, panels
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/62—Insulation or other protection; Elements or use of specified material therefor
    • E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
    • E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
    • E04B1/762—Exterior insulation of exterior walls

Definitions

  • the present invention relates to an exterior thermal insulation system for use in the construction industry.
  • the present invention relates to an exterior thermal insulation system comprising a thermal insulation layer and a finish layer, wherein said finish layer is adhered to said thermal insulation layer through an epoxy adhesive.
  • EIFS External Insulation Finish Systems
  • a traditional EIFS consists of at least eight components: (1) an adhesive mortar layer, (2) a thermal insulation layer (normally thermal insulation board), (3) a rendering coat mortar layer, (4) a fiberglass mesh, (5) a mechanical fastener, (6) a tile adhesive mortar layer, (7) a finish layer, and (8) a tile grouting mortar layer, wherein the fiberglass mesh is embedded into the rendering coat mortar layer and the tile adhesive mortar layer is used to attach the finish layer with the rendering coat mortar layer.
  • the finish layer (ceramic tiles) of the composite panel is adhered to a thermal insulation board through a polymer modified mortar layer. .
  • insulation board such as EPS board or XPS board
  • insulation board is available in a large size, such as 600mm x 1200mm. It takes lots of time at the jobsite to cut the big insulation board into special dimensions to fit around structural features such as wall window openings, balconies, inside and outside corners, decorative lines, and the like.
  • Existing EIFS technology requires gaps between insulation boards and back-wrap mesh at expansion joints to hold the insulation and back rod.
  • ceramic tile sags during the first 1-3 hours after installation on the wall because an adhesive mortar is soft before completion of the curing process for such adhesive mortar. This shortcoming takes workers a lot of time to double-check that the installed tiles are in the proper position.
  • a new EIFS system is desirable, which is easily installed at construction site and which overcomes the existing disadvantages of the prior art technology.
  • An epoxy adhesive system is surprisingly found to be suitable for adhering thermal insulation boards and overcomes existing prior art issues.
  • the present invention is an exterior thermal insulation system comprising a thermal insulation layer and a finish layer, wherein the finish layer is adhered to the thermal insulation layer through an epoxy adhesive which comprises an epoxy resin composition comprising an aromatic epoxy and an aliphatic epoxy, and a hardener comprising at least one aromatic amine.
  • the aromatic epoxy is liquid diglycidyl ether of Bisphenol A and the aromatic amine is an aromatic difunctional amine.
  • the thermal insulation layer is thermal insulation board having side surfaces grooved to form drainage channels, and the finish layer is ceramic tile.
  • the exterior thermal insulation system of the present invention consists of fewer components and could be installed with greater efficiency as compared to traditional EIFS.
  • FIG.1 An isometric view of one example of an exterior thermal insulation system of the present invention.
  • FIG.2. Illustration of a side view of the exterior thermal insulation system of FIG.1.
  • EIFS exterior insulation finish system
  • ETICS External Thermal Insulation Composite Systems
  • thermal insulation material is normally in the form of a thermal insulation layer.
  • the thermal insulation layer can be a "thermal insulation board", which is a thermal insulation material in the form of board.
  • suitable thermal insulation materials can be selected from the group consisting of EPS (expanded polystyrene) foam board, XPS (extruded polystyrene) foam board, polyurethane foam board, phenolic foam board, mineral wool board and foam glass board, all of which can provide thermal insulation to the building as well as meeting insulation/energy codes.
  • One preferred thermal insulation material is XPS foam board such as that sold under the trade name STYROFOAMTM and WALLMATETM (STYROFOAM and WALLMATE are trademarks of The Dow Chemical Company.).
  • the thickness of the XPS foam board can vary depending on climate, humidity, etc. at construction site, and the energy saving requirements in different climate zones. Normally the XPS foam board has a thickness of from about 20 to about 150 millimeters (mm), but can have a greater thickness.
  • a thermal insulation board, as well as a thermal insulation panel normally is cuboid in shape. Therefore, each board or panel has three mutually perpendicular dimensions: length, width and thickness.
  • Length corresponds to the dimension of greatest magnitude and for XPS foam boards generally corresponds to the direction of extrusion (extrusion direction) of the board.
  • Width has a magnitude that is equal to or smaller than the length and equal to or greater than the thickness.
  • the surface consisting of the sides representing the length and the width is in parallel with the substrate wall on which the layer is applied.
  • Thickness has a magnitude equal to or less than the width dimension, and is normally much less than the length and the width in the thermal insulation layer.
  • “Side surfaces” of a thermal insulation board are the surfaces defined by the thickness and the length/width dimensions of the board. Normally side surfaces are rectangular and have a side representing the thickness of the board.
  • a “decorative layer”, also referred herein as a “finish layer”, means normally the outermost surface of a thermal insulation panel for aesthetic purposes.
  • the decorative layer could be a painting layer, a ceramic tile layer, a stucco layer, and the like.
  • a "rendering coat layer” is disposed between the thermal insulation layer and the decorative layer in an EIFS, such as a prefabricated thermal insulation panel.
  • the rendering coat layer may be used for example as a protective, mechanical abuse layer, as well as a substrate for adhesives, insulation, impact resistance, and fire resistance.
  • the rendering coat layer is normally made of a mortar composition.
  • An "adhesive mortar layer” is disposed between a thermal insulation layer and a substrate wall and used to adhere the two layers together.
  • the adhesive mortar layer could also be made of a mortar composition.
  • An “epoxy adhesive” as a copolymer may be normally formed by mixing an “epoxy resin” and a “hardener”.
  • An "epoxy resin” useful herein may include monomers or short chain polymers with an epoxide group at one or both ends of the polymer.
  • An epoxy adhesive can have one or more epoxy resins having more than one epoxide group per molecule including saturated and unsaturated aliphatic, cycloaliphatic, and aromatic epoxy resins.
  • An "aromatic epoxy” resin for example bisphenol A, bisphenol F and novolac epoxy resins, have at least one aromatic ring per molecule.
  • An aromatic epoxy resin includes for example diglycidyl ether of bisphenol-A (BADGE), and may be produced, for example, by reacting a epichlorohydrin and bisphenol-A. Having no aromatic or cycloaliphatic group, an "aliphatic epoxy” resins only has an aliphatic chain linked with one or more epoxide groups.
  • the aliphatic epoxy resin used in the present invention can be diglycidyl aliphatic ether represented by the following general formula (I):
  • the epoxy resin composition of the present invention comprises aliphatic epoxy resin. More preferably, the epoxy resin composition of the present invention comprises an aliphatic epoxy and an aromatic epoxy.
  • a “hardener” herein means a curing agent, such as an amine, hydroxyl and mercaptan- containing compound, comprising functionalities which are reactive with epoxy resins to cure the epoxy resins.
  • the epoxy resins can be reacted with one or more hardeners such that the epoxy resins are crosslinked.
  • polyamines may be used as hardeners. Suitable polyamines can be selected from the groups consisting of aliphatic, cycloaliphatic or aromatic polyamines, polyamide or amidoamine compounds and combinations thereof having at least two active amine hydrogens per molecule.
  • Aromatic hardeners such as aromatic amine, comprise at least one aromatic ring per molecule and are preferred in the present invention, such as m-phenylenediamine (MPD), m-xylylenediamine (MXDA), diaminodiphenyl- methane (DDM), diaminodiphenyl-sulfone (DDS), m-aminobenzamide (MAMA), benzidine, 4-chloro-o-diaminobenzene (CPDA), phenylenediamine trimer (GY-51) and its derivatives, dibenzylamino ether, a blend of m-phenylenediamine and diaminodiphenyl-methane, a blend of m-phenylenediamine, diaminodiphenyl-methane and m-xylylenediamine, a blend of isophoronediamine and diaminodiphenyl-methane, meta phenylene diamine (MPDA
  • aliphatic hardeners have an aliphatic chain and cycloaliphatic hardeners have a cycloaliphatic group per molecule.
  • the hardeners are selected from aliphatic amines and cycloaliphatic amines.
  • aliphatic amines and cycloaliphatic amines comprise N-adminoethyl piperazine (AEP), divinyltriamine (DETA), isophoronediamine (IPDA), hexanediamine (HDA), ethylene dicyclohexaneamine (4,4'-PACM) , ethylenediamine (EDA), diethylenetriamine (DETA), triethylenetetramine(TETA), tetraethylene pentamine (TEPA), polyethylene polyamine (PEP A), dipropylene triamine (DPTA), dimethylaminopropylamine (DMAPA), diethylaminopropylamine (DEAPA), trimethylhexmethylenedimine (TMD), dihexyltriamine, hexanediamine adduct, trimethylhexanediamine, diethylamine (DEA), polyetherdiamine, or mixtures thereof.
  • AEP N-adminoethyl piperazine
  • DETA divinyltriamine
  • the hardener suitable for the present invention can comprise at least one aromatic amine.
  • the hardener of the present invention further comprises a polyether amine, an aliphatic amine and/or a cycloaliphatic amine as crosslinking agents, and an alcohol and a phenol as accelerators.
  • the polyether amine may be polyoxypropylenediamine.
  • the aliphatic amine or the cycloaliphatic amine may be an amine having an aliphatic chain or a cycloaliphatic group.
  • the alcohol accelerator may be an aromatic alcohol and/or aliphatic alcohol.
  • the phenol accelerator can be selected from one or more of any phenols, bisphenols, multiphenols or a mixture thereof, such as phenol (carbolic acid), bisphenol A and bisphenol F.
  • the epoxy resin composition contains both aromatic and aliphatic epoxy resins.
  • the concentration of the aromatic epoxy resin is between about 60% and about 99%, preferably between about 70% and about 95%, and more preferably between about 80%> and about 92% by weight of the epoxy resin composition.
  • the aliphatic epoxy is present at a concentration in a range of about 1% and about 40%, preferably between about 5% and about 30%, more preferably between about 8% and 20% by weight of the epoxy resin composition.
  • the aromatic amine is present at a concentration in a range of between about 20% and about 60%), preferably between about 25% and about 55%, more preferably between about 30%) and 50% by weight of the hardener.
  • the polyether amine is present at a concentration in a range of between about 0% and about 30%, preferably between about 5% and about 20%, more preferably between about 7% and 15% by weight of the hardener.
  • the phenol accelerator is present at a concentration in a range of between about 0% and about 60%, preferably between about 10% and about 50%, more preferably between about 20% and 40% by weight of the hardener.
  • the alcohol accelerator is present at a concentration in a range of between about 0% and about 30%, preferably between about 5% and about 20%, more preferably between about 7% and 15% by weight of the hardener.
  • the aliphatic amine or the cycloaliphatic amine is present at a concentration in a range of between about 0% and about 30%), preferably between about 5% and about 20%, more preferably between about 7% and 15%) by weight of the hardener.
  • EW epoxy equivalent weight
  • the ceramic tile 7 is laminated to the insulation board 3 by epoxy adhesive 5.
  • Insulation board 3 is adhered to substrate wall 1 by adhesive mortar layer 2.
  • tile grouting material 8 is applied to fill the gap between tile faces.
  • Tile grouting material can be for example a standard grouting material, i.e. cement based material, or preferably be elastic material used for expansion joint, such as silicone.
  • Vertical groove 4 and horizontal groove 6 are designed / pre-cut on the side surfaces of the insulation foam before lamination of file face. These grooves are able to form a drainage channel net for anti-leakage purpose in the system.
  • the typical size of a single piece of an insulation board is preferably less than 600mm (width or length), and thickness is about 25mm - 100mm, based on regional energy saving code requirements and calculation.
  • the thickness of adhesive mortar layer 2 is about 3mm- 10mm, and epoxy adhesive 5 is applied in a thin layer, such as 0.1mm-1.5mm.
  • Ceramic tile 7 has a typical thickness of about 5mm- 15mm.
  • the size of the ceramic tile is preferably smaller than that of the insulation board in the length and the width.
  • the adjacent thermal insulation boards preferably contact with each other at the side surfaces but there is space left between ceramic tiles. Such design will significantly reduce the thermal-bridge effect between the thermal insulation boards and at the same time, tile grouting material could be easily applied between ceramic tiles.
  • Sample panels according to the present invention contain an insulation board as a thermal insulation layer, a ceramic tile as a finish layer, and an epoxy adhesive, wherein the epoxy adhesive is used to adhere the ceramic tile to the insulation board.
  • Sample panels for Inventive Examples A and B are made using components in Table 1 .
  • Table 1 Components of Sample Panels
  • STYROFOAM is a trademark of The Dow Chemical Company.
  • the epoxy resin SHA073E in Table 1 comprises:
  • the epoxy hardener SHA0734H in Table 1 comprises:
  • the epoxy resin (herein SHA073E of Table 1) is first placed into a mixing bowl, followed by adding the hardener components (herein SHA0734H of Table 1) and mixing them to form an adhesive system.
  • the mixing action is carried out for about 30 seconds at low velocity. After resting 60 seconds another mixing action is repeated for another 30 seconds.
  • One batch of epoxy adhesive is thus prepared.
  • the pot-life of fresh mixed adhesive system is in the range of 15-25 minutes at 23°C. It should be noted that after the pot-life, the mixed adhesive system will gel and cannot be used.
  • a sample panel is obtained by pasting the adhesive on the ceramic tile and then applying the ceramic tile onto the XPS foam board with the epoxy adhesive between the ceramic tile and the XPS foam board.
  • each formulated epoxy adhesive is used to adhere three ceramic tiles on one XPS foam board.
  • the part of the XPS foam board, which is attached with the ceramic tile, is then cut off from the board.
  • a sample panel containing the ceramic tile and the cut-off part of the XPS foam board adhered with said ceramic tile is thus obtained (curing is still needed before installation). That is to say, in one batch operation, three sample panels are produced based on each formulated epoxy adhesive.
  • Eight batches of epoxy adhesive are prepared and used to manufacture sample panels according to the Inventive Example A and another four batches based on the same formulation to manufacture sample panels according to the Inventive Example B in Table 1.
  • Bonding strength between the tile and XPS foam board of the sample panels is tested based on China National Code JGl 49-2003, "External thermal insulation composite systems based on EPS".
  • three sample panels prepared in the same batch are used respectively for different testing, one for Dry Bonding Strength, one for Wet Bonding Strength, and one for Freeze Thaw Bonding Strength.
  • the testing processes are briefed as below.
  • sample panels Before testing, the sample panels should be treated as below based on different testing purposes.
  • the sample panel is placed in a dry box at 50 ⁇ 3 °C for 16 hours; then immersed in water having a temperature of 23 ⁇ 3 °C for 8 hours wherein the water level is at least 20mm higher than the highest surface of the sample panel, which is the XPS foam board surface on which the epoxy adhesive is not applied; then frozen at -20 ⁇ 3 °C for 24 hours.
  • the upper surface of the ceramic tile of the sample panel is adhered stably with the lower surface of a tensile steel board.
  • adhesion could be obtained by an adhesive identified in the code JG149-2003.
  • Example 2 Comparison tests are conducted in XPS boards having 50mm thickness with regard to the epoxy system of the present invention against four other adhesives which are commonly used in the construction industry.
  • the adhesive system, samples and test processes are the same as Example 1 or following the instructions of the adhesives manufacturers.
  • Each of Tables 5-8 presents results from testing samples using a different adhesive.
  • Table 9 presents a summary of observations for each adhesive.
  • Adhesive Batch No. Dry bonding Wet bonding Freeze thaw product strength, MPa strength, MPa bonding strength,
  • Adhesive Batch No. Dry bonding Wet bonding Freeze thaw product strength, MPa strength, MPa bonding strength,
  • the Huntsman epoxy adhesive system consists of AW106CI (an epoxy resin comprising Biphenol-A epoxy and Biphenol-F epoxy), and HV953U (a hardener comprising polyaminoamide and an aliphatic amine).
  • Table 8 Test Result of Ashland PU Adhesive SP3030D.
  • Example 2 The test results in Example 2 above show that the epoxy adhesive system of the present invention shows superior performance over the four other adhesives.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Finishing Walls (AREA)

Abstract

La présente invention a trait à un système d'isolation thermique extérieure qui inclut une couche d'isolation thermique et une couche d'apprêt, laquelle couche d'apprêt est collée à la couche d'isolation thermique au moyen d'une colle époxyde qui comprend une composition de résine époxyde comprenant un époxyde aromatique et un époxyde aliphatique, et un durcisseur comprenant au moins une amine aromatique.
PCT/CN2010/080518 2010-12-30 2010-12-30 Système d'isolation thermique extérieure WO2012088693A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2010/080518 WO2012088693A1 (fr) 2010-12-30 2010-12-30 Système d'isolation thermique extérieure

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Application Number Priority Date Filing Date Title
PCT/CN2010/080518 WO2012088693A1 (fr) 2010-12-30 2010-12-30 Système d'isolation thermique extérieure

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WO2012088693A1 true WO2012088693A1 (fr) 2012-07-05

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005120340A (ja) * 2003-09-25 2005-05-12 Arakawa Chem Ind Co Ltd ビニル変性エポキシ樹脂水性物、その製造方法および水性被覆剤
CN1256396C (zh) * 2001-11-08 2006-05-17 3M创新有限公司 高温环氧粘合剂膜
CN101323772A (zh) * 2008-08-05 2008-12-17 湖南神力实业有限公司 一种超薄型石材与铝蜂窝复合的改性环氧胶粘剂及其制备方法
CN101560286A (zh) * 2007-10-04 2009-10-21 通用汽车环球科技运作公司 形状记忆的环氧化物聚合物
CN101457577B (zh) * 2008-12-31 2010-08-18 林启红 一种外墙挂板及其生产工艺

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1256396C (zh) * 2001-11-08 2006-05-17 3M创新有限公司 高温环氧粘合剂膜
JP2005120340A (ja) * 2003-09-25 2005-05-12 Arakawa Chem Ind Co Ltd ビニル変性エポキシ樹脂水性物、その製造方法および水性被覆剤
CN101560286A (zh) * 2007-10-04 2009-10-21 通用汽车环球科技运作公司 形状记忆的环氧化物聚合物
CN101323772A (zh) * 2008-08-05 2008-12-17 湖南神力实业有限公司 一种超薄型石材与铝蜂窝复合的改性环氧胶粘剂及其制备方法
CN101457577B (zh) * 2008-12-31 2010-08-18 林启红 一种外墙挂板及其生产工艺

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