WO2012083768A1 - Led光源 - Google Patents

Led光源 Download PDF

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Publication number
WO2012083768A1
WO2012083768A1 PCT/CN2011/082115 CN2011082115W WO2012083768A1 WO 2012083768 A1 WO2012083768 A1 WO 2012083768A1 CN 2011082115 W CN2011082115 W CN 2011082115W WO 2012083768 A1 WO2012083768 A1 WO 2012083768A1
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WO
WIPO (PCT)
Prior art keywords
led
light source
led light
driver chip
led dies
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Application number
PCT/CN2011/082115
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English (en)
French (fr)
Inventor
文茂强
Original Assignee
深圳市长运通光电技术有限公司
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Publication of WO2012083768A1 publication Critical patent/WO2012083768A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H05B45/56—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits involving measures to prevent abnormal temperature of the LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/20—Responsive to malfunctions or to light source life; for protection
    • H05B47/24—Circuit arrangements for protecting against overvoltage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/20—Responsive to malfunctions or to light source life; for protection
    • H05B47/25—Circuit arrangements for protecting against overcurrent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the invention belongs to the field of light sources, and in particular relates to an LED light source.
  • LED light source is a light emitting diode (Light Emitting) Diode, LED) is the light source of the illuminant.
  • Light-emitting diodes were invented in the 1960s, and in the following decades, their basic use was as an indicator light for electronic devices such as tape recorders.
  • Now LED light source has become the mainstream product of next-generation lighting. This product has the characteristics of high efficiency and long life. It can be used continuously for 100,000 hours, which is 100 times longer than ordinary incandescent bulbs. However, there is no integrated overvoltage or overcurrent protection chip inside the package of the existing LED light source. If the LED light source is connected to the commercial power or the high voltage power supply, the LED light source may be burnt due to excessive voltage or excessive current.
  • An object of the present invention is to provide an LED light source, which aims to solve the problem that the existing LED light source does not have an integrated overvoltage or overcurrent protection chip and is easy to burn.
  • An LED light source includes:
  • the driver chip is used for overvoltage and overcurrent protection of the LED die
  • An encapsulant for encapsulating the driver chip and the LED die is an encapsulant for encapsulating the driver chip and the LED die.
  • the LED light source is connected in series with the LED chips, and the LED dies at both ends of the LED are respectively connected to the external power source and the first end of the driving chip, and the second end of the driving chip is grounded, and the driving chip and the LED crystal are driven.
  • the pellet is encapsulated in the encapsulant, and the LED chip is over-pressurized and over-current protected by the driving chip to adapt to different driving voltages.
  • Figure 1 is a schematic illustration of a first preferred embodiment of an LED light source of the present invention.
  • FIG. 2 is a schematic view of a second preferred embodiment of the LED light source of the present invention.
  • the LED dies at the ends of the first and last ends are respectively connected to the external power source and the first end of the driving chip, the second end of the driving chip is grounded, and the driving chip overvoltages the LED dies. And overcurrent protection to adapt to different drive voltages.
  • An LED light source comprising:
  • the driver chip is used for overvoltage and overcurrent protection of the LED die
  • An encapsulant for encapsulating the driver chip and the LED die is an encapsulant for encapsulating the driver chip and the LED die.
  • the LED die is over-pressurized and over-current protected by an integrated driving chip to adapt to different driving voltages.
  • an LED light source includes a plurality of LED dies 11 , a driving chip 30 , and an encapsulant 40 .
  • the LED dies 11 are connected end to end with each other such that the LED dies 11 are connected in series. By connecting different numbers of LED dies 11 in series, it is possible to adapt to different driving voltage requirements.
  • the LED dies 11 at the ends of the first and last ends are respectively connected to the first ends of the driving chips 30 integrated with the external power source VCC and the LED light source.
  • the second end of the driving chip 30 is grounded.
  • the driver chip 30 and the LED die 11 are both encapsulated in the encapsulant 40.
  • the driving chip 30 is used for overvoltage and overcurrent protection of the LED die 11. When the voltage of the LED die 11 is too high, the driving chip 30 cuts off the power of the LED light source to protect the LED die 11.
  • the driving chip 30 stabilizes the current of the LED light source such that the current of the LED light source is constant. In this embodiment, the driving chip 30 can withstand a no-load voltage of 500V or more, so that the LED light source can be operated without being damaged under the high voltage of 500V, so that the LED light source can be adapted to the commercial power standard in different regions of the world.
  • the LED light source of the present invention is connected in series with a plurality of LED dies 11 , and the LED dies 11 at the ends of the first and last ends are respectively connected to the external power source VCC and the first end of the driving chip 30 , the second end of the driving chip 30 is grounded, and the driving chip 30 and The LED die 11 is encapsulated in the encapsulant 40, and the LED die 11 is over-pressurized and over-current protected by the driving chip 30 to adapt to different driving voltages.
  • the driving chip 30 is also used for over-temperature protection of the LED die 11.
  • the driving chip 30 cuts off the power of the LED light source to protect the LED die. 11.
  • each wafer block 10 is formed by connecting six LED dies 11 in series.
  • the number of LED dies 11 connected in series in each wafer block 10 can be determined according to the applicable voltage or different power requirements, and the present invention is not limited thereto.
  • All wafer blocks 10 are sequentially connected end to end by metal connection lines 20 such that all wafer blocks 10 are connected in series.
  • the driving voltage of each wafer block 10 is about 4V, and the different driving voltage requirements are accommodated by serially connecting different numbers of wafer blocks 10. In this way, the number of serial connections of the metal connecting wires can be greatly reduced, and hundreds of LED dies 11 can be connected in series to improve the package yield.
  • the wafer blocks 10 at the ends of the first and last ends are connected to the external power source VCC and the driving chip 30, respectively.
  • all of the wafer blocks 10 are distributed in the encapsulant 40 according to a certain regularity.
  • the wafer blocks 10 are distributed in a matrix in the encapsulant 40.
  • each wafer block 10 is dissipated by distributed heat dissipation, which improves heat dissipation efficiency.
  • the metal connecting wires 20 are alloy wire segments of different materials such as gold, silver, and copper.
  • the first ends of all the wafer blocks 10 are connected to the external power source VCC through the metal connection lines 20, and the second ends of all the wafer blocks 10 are passed through the metal connection lines 20. It is connected to the driving chip 30. This allows all of the wafer blocks 10 to be connected in parallel.
  • the LED light source of the present invention connects the plurality of LED dies into a wafer block, and the wafer blocks are connected in series or in parallel.
  • the wafer blocks are connected in series or in parallel to the external power source and the first end of the driving chip, and the chip is driven. The second end is grounded.
  • the driver chip is used to overvoltage and overcurrent protection of the LED die to adapt to different driving voltages.

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  • Led Devices (AREA)

Description

LED光源 技术领域
本发明属于光源领域，特别涉及一种LED光源。
背景技术
LED光源是发光二极管（Light Emitting Diode，LED）为发光体的光源。发光二极管发明于20世纪60年代，在随后的数十年中，其基本用途是作为收录机等电子设备的指示灯。现在LED光源已成为新一代照明的主流产品，这种产品具有效率高、寿命长的特点，可连续使用10万小时，比普通白炽灯泡长100倍。然而现有的LED光源的封装内部没有集成过压或过流保护芯片，若将LED光源接入到市电或高压电源上，很可能因为电压过高或电流过大导致LED光源烧毁。
 技术问题
本发明实施例的目的在于提供一种LED光源，旨在解决现有的LED光源内部没有集成过压或过流保护芯片，容易烧毁的问题。
 技术解决方案
本发明实施例是这样实现的，一种LED光源，包括：
驱动芯片；
若干LED晶粒，所述LED晶粒串接相连，且位于首尾两端的LED晶粒分别与一外部电源及所述驱动芯片的第一端相连，所述驱动芯片的第二端接地，所述驱动芯片用于对LED晶粒进行过压及过流保护；以及
封装胶体，用于封装所述驱动芯片及LED晶粒。
 有益效果
本发明实施例LED光源通过将若干LED晶粒串接，位于首尾两端的LED晶粒分别与外部电源及驱动芯片的第一端相连，所述驱动芯片的第二端接地，驱动芯片及LED晶粒封装于封装胶体中，通过驱动芯片对LED晶粒进行过压及过流保护，从而适应不同的驱动电压。
 附图说明
图1是本发明LED光源的第一较佳实施例的示意图。
图2是本发明LED光源的第二较佳实施例的示意图。
 本发明的最佳实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
本发明实施例通过将若干LED晶粒串接，位于首尾两端的LED晶粒分别与外部电源及驱动芯片的第一端相连，驱动芯片的第二端接地，驱动芯片对LED晶粒进行过压及过流保护，从而适应不同的驱动电压。
本发明实施例是这样实现的：
一种LED光源，包括：
驱动芯片；
若干LED晶粒，所述LED晶粒串接相连，且位于首尾两端的LED晶粒分别与一外部电源及所述驱动芯片的第一端相连，所述驱动芯片的第二端接地，所述驱动芯片用于对LED晶粒进行过压及过流保护；以及
封装胶体，用于封装所述驱动芯片及LED晶粒。
本发明实施例中，通过集成的驱动芯片对LED晶粒进行过压及过流保护，从而适应不同的驱动电压。
以下结合具体实施例，对本发明的实现进行详细说明：
请参考图1，本发明第一较佳实施例提供的LED光源包括若干LED晶粒11、驱动芯片30及封装胶体40。
LED晶粒11彼此首尾相连，使得LED晶粒11通过串联的方式相连。通过串接不同数量的LED晶粒11，可适应不同的驱动电压的要求。
位于首尾两端的LED晶粒11分别与外部电源VCC及LED光源集成的驱动芯片30的第一端相连。驱动芯片30的第二端接地。
驱动芯片30及LED晶粒11均封装于封装胶体40中。驱动芯片30用于对LED晶粒11进行过压及过流保护。当LED晶粒11的电压过高时，驱动芯片30即切断LED光源的电源，以保护LED晶粒11。驱动芯片30稳定LED光源的电流，使得LED光源的电流恒定。本实施方式中，驱动芯片30可承受500V以上的空载电压，使得LED光源在500V高压下工作不会损坏，如此使得LED光源可适于全球不同地区的市电标准。
本发明LED光源通过将若干LED晶粒11串接，位于首尾两端的LED晶粒11分别与外部电源VCC及驱动芯片30的第一端相连，驱动芯片30的第二端接地，驱动芯片30及LED晶粒11封装于封装胶体40中，通过驱动芯片30对LED晶粒11进行过压及过流保护，从而适应不同的驱动电压。
作为本发明的优选实施例，驱动芯片30还用于对LED晶粒11进行过温保护，当LED晶粒11的温度过高时，驱动芯片30即切断LED光源的电源，以保护LED晶粒11。
作为本发明的优选实施例，若干LED晶粒11通过特殊制作工艺串接相连，形成晶圆方块10。本实施方式中，每一晶圆方块10由6颗LED晶粒11串联而成。其他实施方式中，可根据适用电压或不同的功率要求确定每一晶圆方块10中串接的LED晶粒11的数量，在此不用以限制本发明。
所有晶圆方块10通过金属连接线20依次首尾相连，使得所有晶圆方块10通过串联的方式相连。每一晶圆方块10的驱动电压约为4V，通过串接不同数量的晶圆方块10，适应不同的驱动电压的要求。如此可大幅度减少金属连接线的串接数量，实现上百颗LED晶粒11串接，提高了封装良率。
位于首尾两端的晶圆方块10分别与外部电源VCC及驱动芯片30相连。
作为本发明的优选实施例，所有晶圆方块10按照一定的规律分布在封装胶体40中。本实施方式中，晶圆方块10在封装胶体40中呈矩阵分布。工作时每一晶圆方块10通过分布式散热的方式进行散热，提高了散热效率。
作为本发明的优选实施例，金属连接线20为金、银、铜等不同材料的合金线段。
请参考图2，作为本发明的第二较佳实施例，所有晶圆方块10的第一端通过金属连接线20与外部电源VCC相连，所有晶圆方块10的第二端通过金属连接线20与驱动芯片30相连。如此使得所有晶圆方块10通过并联的方式相连。
本发明LED光源通过将若干LED晶粒串接成晶圆方块，晶圆方块通过串联或并联的方式相连，晶圆方块串联或并联后与外部电源及驱动芯片的第一端相连，驱动芯片的第二端接地。通过驱动芯片对LED晶粒进行过压及过流保护，从而适应不同的驱动电压。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (7)

  1. 一种LED光源，其特征在于，所述LED光源包括：
    驱动芯片；
    若干LED晶粒，所述LED晶粒串接相连，且位于首尾两端的LED晶粒分别与一外部电源及所述驱动芯片的第一端相连，所述驱动芯片的第二端接地，所述驱动芯片用于对LED晶粒进行过压及过流保护；以及
    封装胶体，用于封装所述驱动芯片及LED晶粒。
  2. 如权利要求1所述的LED光源，其特征在于，所述驱动芯片还用于对LED晶粒进行过温保护，当LED晶粒的温度过高时，驱动芯片即切断LED光源的电源。
  3. 如权利要求1所述的LED光源，其特征在于，所述LED晶粒通过串联的方式形成若干晶圆方块，所有晶圆方块通过金属连接线串接相连，且位于首尾两端的晶圆方块分别与外部电源及驱动芯片的第一端相连。
  4. 如权利要求1所述的LED光源，其特征在于，所述LED晶粒通过串联的方式形成若干晶圆方块，所有晶圆方块的第一端通过金属连接线与外部电源相连，所有晶圆方块的第二端通过金属连接线与驱动芯片的第一端相连。
  5. 如权利要求3或4所述的LED光源，其特征在于，每一晶圆方块包括六颗串接的LED晶粒。
  6. 如权利要求3或4所述的LED光源，其特征在于，所述晶圆方块在所述封装胶体中呈矩阵分布，并通过分布式散热的方式进行散热。
  7. 如权利要求3或4所述的LED光源，其特征在于，所述金属连接线为金、银或铜任意组合的合金线段。
PCT/CN2011/082115 2010-12-22 2011-11-11 Led光源 WO2012083768A1 (zh)

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Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
CN202901891U (zh) * 2012-07-12 2013-04-24 深圳市长运通光电技术有限公司 一种贴片式led发光器件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201234390Y (zh) * 2008-07-18 2009-05-06 金诗电子技术(上海)有限公司 高调光比led驱动芯片
DE202009001880U1 (de) * 2009-02-16 2009-07-16 APA Electronic Co., Ltd., Chung-Ho City Packaging-Struktur einer Vollfarb-LED mit Antriebsmechanismus
CN201341256Y (zh) * 2008-12-19 2009-11-04 晶锜科技股份有限公司 背光模块及其发光装置
CN201414246Y (zh) * 2009-06-10 2010-02-24 北京诚创星光科技有限公司 一种高效率步降led驱动器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2731908Y (zh) * 2004-09-06 2005-10-05 富微科技股份有限公司 结合发光二极管的驱动芯片
US7714348B2 (en) * 2006-10-06 2010-05-11 Ac-Led Lighting, L.L.C. AC/DC light emitting diodes with integrated protection mechanism
US20080188020A1 (en) * 2007-02-05 2008-08-07 Kuo Wei-Min Method of LED packaging on transparent flexible film
CN201114899Y (zh) * 2007-08-30 2008-09-10 杭州五联照明科技有限公司 发光二极管过热保护电路
CN201180966Y (zh) * 2008-02-26 2009-01-14 李史俊 大功率led灯冷却装置
CN101532612A (zh) * 2009-03-10 2009-09-16 广州南科集成电子有限公司 一种集成led芯片光源的制造方法
CN101908586A (zh) * 2009-06-03 2010-12-08 亿光电子工业股份有限公司 发光二极管封装结构
CN201478302U (zh) * 2009-07-03 2010-05-19 数能科技股份有限公司 发光元件的封装构造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201234390Y (zh) * 2008-07-18 2009-05-06 金诗电子技术(上海)有限公司 高调光比led驱动芯片
CN201341256Y (zh) * 2008-12-19 2009-11-04 晶锜科技股份有限公司 背光模块及其发光装置
DE202009001880U1 (de) * 2009-02-16 2009-07-16 APA Electronic Co., Ltd., Chung-Ho City Packaging-Struktur einer Vollfarb-LED mit Antriebsmechanismus
CN201414246Y (zh) * 2009-06-10 2010-02-24 北京诚创星光科技有限公司 一种高效率步降led驱动器

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