WO2012081605A1 - Dispositif de stockage de substrat - Google Patents

Dispositif de stockage de substrat Download PDF

Info

Publication number
WO2012081605A1
WO2012081605A1 PCT/JP2011/078876 JP2011078876W WO2012081605A1 WO 2012081605 A1 WO2012081605 A1 WO 2012081605A1 JP 2011078876 W JP2011078876 W JP 2011078876W WO 2012081605 A1 WO2012081605 A1 WO 2012081605A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
window
roller
container
rollers
Prior art date
Application number
PCT/JP2011/078876
Other languages
English (en)
Japanese (ja)
Inventor
浜田　智秀
徹 木内
鈴木　智也
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to KR1020137016405A priority Critical patent/KR20140004663A/ko
Priority to CN2011800598185A priority patent/CN103261066A/zh
Priority to JP2012548803A priority patent/JPWO2012081605A1/ja
Publication of WO2012081605A1 publication Critical patent/WO2012081605A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/34—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables
    • B65H75/38—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables involving the use of a core or former internal to, and supporting, a stored package of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/34—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables
    • B65H75/36—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables without essentially involving the use of a core or former internal to a stored package of material, e.g. with stored material housed within casing or container, or intermittently engaging a plurality of supports as in sinuous or serpentine fashion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Definitions

  • the present invention relates to a substrate storage device.
  • a display element constituting a display device such as a display device
  • a liquid crystal display element and an organic electroluminescence (organic EL) element are known.
  • organic EL organic electroluminescence
  • active elements active devices that form thin film transistors (TFTs) on the substrate surface corresponding to each pixel have become mainstream.
  • a technique for forming a display element on a sheet-like substrate for example, a film member
  • a technique called a roll-to-roll system for example, a technique called a roll-to-roll system (hereinafter simply referred to as “roll system”) is known (see, for example, Patent Document 1).
  • roll system a technique called a roll-to-roll system
  • one sheet-like substrate for example, a belt-like film member
  • the fed substrate is wound around the substrate collection side recovery roller
  • the substrate is subjected to desired processing by a processing apparatus installed between the supply roller and the collection roller.
  • the substrate is transported using, for example, a plurality of transport rollers, etc., and a gate electrode, a gate insulating film, a semiconductor constituting a TFT using a plurality of processing devices (units)
  • a film, source / drain electrodes, and the like are formed, and components of the display element are sequentially formed on the surface to be processed of the substrate.
  • a light emitting layer, an anode, a cathode, an electric circuit, and the like are sequentially formed on a substrate.
  • the processed substrate is stored in a substrate storage device in a wound state, for example.
  • An object of an aspect of the present invention is to provide a substrate storage device that can suppress adhesion of foreign matter to a substrate.
  • a container having a storage chamber for storing a flexible substrate, a window provided in the container, and a part of the substrate stored in the storage chamber are opposed to the window.
  • a substrate storage device including a substrate transport unit that transports a substrate.
  • FIG. 1 is a diagram showing an internal configuration of a substrate storage apparatus according to the first embodiment of the present invention.
  • the substrate storage device STR includes a container CT that accommodates a flexible substrate S formed in a strip shape, and a substrate transport unit CV on which the substrate S is placed.
  • the substrate storage device STR stores the substrate S in a container CT placed on the floor and stores the substrate S in a state of being hung on the substrate transport unit CV.
  • the substrate S is formed in an endless shape in the longitudinal direction.
  • the substrate S for example, a foil such as a resin film or stainless steel can be used.
  • the resin film is made of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, etc. Can be used.
  • the dimension in the short direction of the substrate S is, for example, about 50 cm to 2 m
  • the dimension in the long direction is, for example, 10 m or more.
  • this dimension is only an example and is not limited thereto.
  • the dimension in the Y direction of the substrate S may be 50 cm or less, or 2 m or more. In the present embodiment, even the substrate S having a dimension in the Y direction exceeding 2 m is preferably used.
  • the dimension in the X direction of the substrate S (the dimension in the longitudinal direction, the dimension of one round) may be 10 m or less.
  • the substrate S has a thickness of 1 mm or less, for example, and is formed to have flexibility.
  • the term “flexibility” refers to the property that the substrate can be bent without being broken or broken even when a predetermined force of at least its own weight is applied to the substrate. Further, for example, the property of bending by the predetermined force is also included in the flexibility. Further, the flexibility varies depending on the material, size, thickness, or environment such as temperature of the substrate.
  • a single strip-shaped substrate may be used, but a configuration in which a plurality of unit substrates are connected and formed in a strip shape may be used.
  • the substrate S preferably has a smaller coefficient of thermal expansion so that the dimensions do not change even when subjected to heat of about 200 ° C., for example.
  • an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient.
  • the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.
  • the floor surface of the XYZ orthogonal coordinate system is the XY plane.
  • the short direction of the substrate S is defined as the Y-axis direction
  • the direction orthogonal to the Y-axis direction is defined as the X direction.
  • a direction perpendicular to the floor surface (XY plane) is taken as a Z-axis direction.
  • the container CT has a substantially rectangular parallelepiped shape, for example.
  • the ⁇ X side wall portion CTa of the container CT has a shape in which the + Z side end portion is inclined, for example, to the + X side.
  • the + X side end portion CTb of the container CT has a shape in which the + Z side end portion protrudes to the + X side, for example.
  • a storage chamber RM surrounded by wall portions (including the wall portions CTa and CTb) constituting the container CT is formed inside the container CT.
  • the container CT has a window portion W on the wall portion CTa.
  • the window portion W is an opening formed through the wall portion CTa so as to communicate the outside of the container CT with the storage chamber RM.
  • the window part W is arrange
  • a connecting portion J is provided in the wall portion CTa.
  • the connection part J is a part connected to the apparatus side connection parts 90 and 91 provided in external apparatuses, such as processing apparatus PA, for example.
  • the window W is provided with a door member to be described later. The door member is opened when the processing apparatus PA is connected, and is closed when the connection of the processing apparatus PA is released. That is, in a state where the processing apparatus PA is not connected, the door member can prevent foreign matters such as dust and dirt from entering the container CT.
  • connection portion J can connect the processing apparatus PA and the container CT so as to suppress the relative position between the processing apparatus PA and the container CT from shifting.
  • the apparatus side connection parts 90 and 91 are connected to the edge part of the window part W among wall part CTa of the container CT.
  • the connection portion J is provided at the edge of the window portion W so as to correspond to the connection position of the device side connection portions 90 and 91.
  • the connection part J is provided in the same wall part CTa as the wall part CTa in which the window part W was provided, and is arrange
  • the processing apparatus PA is provided with nip rollers 92 and 93, a processing section 95 and the like in addition to the apparatus side connection sections 90 and 91.
  • the nip rollers 92 and 93 are disposed at positions that sandwich the processing unit 95 in the Z direction.
  • the + X side end point of the nip roller 92 and the + X side end point of the nip roller 93 are both in contact with a plane parallel to the YZ plane.
  • the processing unit 95 is formed to perform a predetermined process on the processing surface 95a indicated by a broken line in FIG.
  • the processing surface 95a is set parallel to the YZ plane, and is set on a plane including the + X side end points of the nip rollers 92 and 93, for example.
  • Examples of the predetermined process include a coating process, a film forming process, an exposure process, a developing process, a heating process, and a cooling process. Of course, it may be configured to perform other processing.
  • the substrate transport unit CV includes a plurality of rollers R that fold back the substrate S in the accommodation chamber RM.
  • rollers 11 to 66 When distinguishing a plurality of rollers R, they are expressed as rollers 11 to 66.
  • Each roller R has a shaft portion Ra parallel to the Y direction.
  • Each roller R is rotatably supported by the shaft portion Ra on, for example, the + Y side and ⁇ Y side wall portions of the container CT.
  • a cylindrical outer peripheral portion Rb around which the accommodated substrate S is hung is provided around the shaft portion Ra of each roller R.
  • the plurality of rollers R are sequentially arranged on the transport path of the substrate S in the accommodation chamber RM.
  • the plurality of rollers R are arranged separately in the vertical direction with respect to the central portion of the storage chamber RM.
  • the plurality of rollers R includes a first portion RM1 on the ⁇ Z side with respect to the central portion in the Z direction of the storage chamber RM, and a + Z side of the central portion in the Z direction of the storage chamber RM.
  • the second part RM2 is arranged separately.
  • the first portion RM1 of the accommodation chamber RM is provided with three rows of rollers R arranged in the X direction in the Z direction.
  • the diameters of the rollers R constituting one row are the same. Further, the diameter of the roller R decreases as the distance from the ⁇ Z side toward the + Z side approaches the central portion in the Z direction of the storage chamber RM.
  • a roller 12 and a roller 13 that change the direction of the substrate S are provided.
  • they when distinguishing the rows of the rollers R of the first portion RM1, they are expressed as a first row L1 to a third row L3 in order from the ⁇ Z side to the + Z side of the storage chamber RM.
  • the rollers 29, 33, 65 arranged on the most ⁇ X side among the rollers R of the first row L1, the second row L2, and the third row L3 are fixed by the roller support member 67.
  • the roller support member 67 is provided so as to be movable along the guide portion 68 in the Z direction.
  • the roller support member 67 is connected to the drive mechanism 69, for example.
  • the drive mechanism 69 is configured to be able to slide the roller support member 67 in the Z direction.
  • the amount and timing of movement of the roller support member 67 by the drive mechanism 69 are controlled by, for example, the control device CONT.
  • the second part RM2 is provided with a roller 11, a roller 31, and a roller 49 that change the direction of the substrate S in addition to the row of the rollers R described above.
  • roller 11 disposed in the second portion RM2 and the roller 12 disposed in the first portion RM1 are disposed at positions sandwiching the window portion W in the Z direction.
  • the rollers R of the second portion RM2 they are expressed as the fourth row L4 to the sixth row L6 in order from the ⁇ Z side to the + Z side of the storage chamber RM.
  • the substrate S is placed on the rollers 11 to 66 in order, so that the transport path of the storage chamber RM is guided.
  • the transfer path is a path that circulates through the storage chamber RM.
  • the transport path of the substrate S will be described with the roller 11 as a starting point and the clockwise direction as the forward direction.
  • the substrate S hung on the roller 11 is hung on the roller 12 disposed on the ⁇ Z side of the roller 11 and is folded back to the + X side.
  • the downstream side of the roller 12 in the substrate S is folded back to the + Z side by the roller 13 disposed in the vicinity of the corner on the ⁇ Z side and the + X side of the storage chamber RM.
  • the downstream side of the roller 13 in the substrate S is hung on the roller 14 disposed on the most + X side in the fourth row L4 of the roller R and folded back to the ⁇ Z side.
  • the downstream side of the roller 14 in the substrate S is hung on the roller 15 disposed on the most + X side in the first row L1 of the roller R and folded back to the + Z side.
  • the downstream side of the roller 15 in the substrate S is hung on the roller 16 disposed adjacent to the ⁇ X side of the roller 14 in the fourth row L4 and folded back to the ⁇ Z side.
  • the downstream side of the roller 16 in the substrate S is hung on the roller 17 disposed adjacent to the ⁇ X side of the roller 15 in the first row L1 and is folded back to the + Z side.
  • roller R rollers 18, 20, 22, 24, 26, 28, and 30
  • roller R rollers 19, 21, 23, 25, 27, and 29
  • the downstream side of the substrate S hung on the most ⁇ X side roller 30 in the fourth row L4 is folded back to the ⁇ X side and hung on the direction changing roller 31.
  • the downstream side of the roller 31 in the substrate S is hung on a roller 32 disposed adjacent to the + Z side of the roller 30 and is folded back to the ⁇ Z side.
  • the substrate S includes rollers R (rollers 33, 35, 37, 39, 41, 43, 45, and 47) in the second row L2 and rollers R (rollers 34, 36, 38, 40, and 42) in the fifth row R5. , 44, 46 and 48) are alternately applied in the + X direction.
  • the downstream side of the substrate S hung on the most + X side roller 48 in the fifth row L5 is folded back to the + X side and hung on the direction changing roller 49.
  • the downstream side of the roller 49 in the substrate S is hung on the roller 50 disposed adjacent to the + Z side of the roller 48 and is folded back to the ⁇ Z side.
  • the substrate S includes rollers R (rollers 51, 53, 55, 57, 59, 61, 63, and 65) in the third row L3 and rollers R (rollers 52, 54, 56, 58, and 60) in the fifth row R5. , 62, 64 and 66) are alternately applied in the ⁇ X direction.
  • the downstream side of the substrate S hung on the most -X side roller 66 of the sixth row L6 is folded back to the -Z side and hung on the roller 11 described above.
  • the roller 11 and the roller 12 are arrange
  • substrate conveyance part CV has the board
  • the substrate support part SP is provided at a position where the substrate S is sandwiched between the window part W of the container CT.
  • the substrate support portion SP is provided between the roller 11 and the roller 12 in the Z direction.
  • the substrate support SP includes a support plate 71 that supports the first surface Sa of the substrate S, a pair of support rollers 72 and 73, and a support member 74 that supports the support plate 71 and the support rollers 72 and 73. is doing.
  • the support plate 71 has a support surface 71a formed on the -X side.
  • the support surface 71a is formed flat.
  • the support plate 71 is disposed so that the support surface 71a is parallel to the YZ plane. In this state, the support surface 71a is disposed to face the first surface Sa of the substrate S.
  • Support rollers 72 and 73 are provided at positions that sandwich the support plate 71 in the Z direction.
  • the support rollers 72 and 73 are formed in a cylindrical shape or a columnar shape.
  • the support rollers 72 and 73 are arranged so that the central axis is parallel to the Y direction.
  • the dimensions of the support rollers 72 and 73 in the Y direction are larger than the dimension of the substrate S in the Y direction.
  • the support rollers 72 and 73 are supported by a support member 74 so as to be rotatable in the circumferential direction.
  • the support member 74 is integrally fixed so that the support plate 71 and the support rollers 72 and 73 do not move independently in the X direction, the Y direction, and the Z direction.
  • the ⁇ X side ends (points supporting the substrate S) of the support rollers 72 and 73 and the support surface 71a are arranged on the same plane. Accordingly, the substrate S is supported by the support surface 71a and the two support rollers 72 and 73 disposed on the same plane as the support surface 71a.
  • the support member 74 is provided so as to be movable in the X direction.
  • the substrate transport unit CV has a drive mechanism 75 that moves the support member 74 in the X direction.
  • the control device CONT can adjust the amount of movement of the support member 74 in the X direction, the timing of movement, and the like by controlling the drive mechanism 75.
  • guide rollers 81 and 82 rotatably supported on the side wall parallel to the XZ plane of the container CT are provided. ing.
  • the guide rollers 81 and 82 prevent the substrate S from coming into contact with the edge of the window portion W when the support member 74 (the support rollers 72 and 73 and the support plate 71) moves in the ⁇ X direction.
  • FIG. 2 is a diagram illustrating an example of the operation of the substrate storage device STR.
  • the apparatus side connection portions 90 and 91 of the external processing apparatus PA are connected to the connection portion J of the substrate storage device STR. Connect to.
  • control apparatus CONT controls the drive mechanism 75 to move the support member 74 in the ⁇ X direction.
  • the support rollers 72 and 73 come into contact with the first surface Sa of the substrate S, and the first surface Sa is pulled out to the ⁇ X side.
  • the control device CONT moves the support member 74 to a position where the substrate S is sandwiched between the support rollers 72 and 73 and the nip rollers 92 and 93.
  • the portion Sc between the portion sandwiched between the support roller 72 and the nip roller 92 and the portion sandwiched between the support roller 73 and the nip roller 93 in the substrate S is moved from the window portion W to the accommodation chamber RM. It is pulled out and exposed to the processing unit 95 of the processing apparatus PA.
  • the exposed portion Sc is supported by the support surface 71a of the support plate 71, and is disposed parallel to the YZ plane following the support surface 71a. Further, the exposed portion Sc is disposed on the processing surface 95a by the processing unit 95 of the processing apparatus PA by being disposed following the support surface 71a.
  • the transport path of the substrate S changes from the state of FIG. Specifically, since the exposed portion Sc is drawn out of the substrate storage device STR from the window portion W, the transport path along the wall portion CTa on the ⁇ X side of the substrate storage device STR becomes longer.
  • the substrate S stored in the substrate storage device STR is formed in an endless shape and has a constant length. For this reason, it is necessary to adjust the tension of the substrate S so that an excessive tension is not applied to the substrate S.
  • control device CONT controls the drive mechanism 69 to move the roller support member 67 to the + Z side.
  • the rollers 29, 33, and 65 together with the roller support member 67 move along the guide portion 68 to the + Z side. For this reason, the conveyance path
  • control device CONT supports the support member so that the change amount of the transport path of the substrate S that is changed by the movement of the support member 74 is equal to the change amount of the transport path that is changed by the movement of the roller support member 67. At least one of the movement amount of 74 and the movement amount of the roller support member 67 is adjusted. By this operation, the length of the transport path of the substrate S is maintained to be constant, so that excessive tension is not applied to the substrate S.
  • the processing unit 95 performs processing on the second surface Sb of the substrate S.
  • the control device CONT controls the drive mechanism 69 and the drive mechanism 75 to return the roller support member 67 and the support member 74 to their original positions while keeping the transport path length of the substrate S constant.
  • the apparatus side connection units 90 and 91 are removed from the connection unit J, and the processing apparatus PA is retracted from the substrate storage apparatus STR. In this way, the processing for the substrate S is performed.
  • the container CT having the storage chamber RM for storing the flexible and endless substrate S, the window W provided in the container CT, and the storage Since the substrate transport section CV transports the substrate S so that a part Sc of the substrate S accommodated in the chamber RM faces the window portion W, the substrate S is exposed to the outside of the accommodation chamber RM in the window portion W. At the same time, the remaining portion of the substrate S can be prevented from being exposed. Thereby, since the exposure range of the board
  • the processing apparatus PA since the processing apparatus PA is connected to the substrate storage device STR in a state where the substrate S is accommodated in the accommodation chamber RM, the substrate S is processed. Processing can be performed in an environment where it is difficult to adhere. Thereby, it can prevent that a foreign material adheres to the board
  • FIG. 3 is a diagram showing a configuration of the substrate storage device STR2 according to the present embodiment.
  • the configuration of the container CT in the vicinity of the window portion W is different from that of the first embodiment, and thus this difference will be mainly described.
  • the substrate storage device STR2 has drawers 170 and 171 for extracting the substrate S from the window W to the outside.
  • the drawer portions 170 and 171 have arm portions 174 and 175 attached to the inner peripheral portion of the window portion W.
  • the arm portion 174 is attached to the inner peripheral surface of the window portion W on the + Z side.
  • the arm portion 175 is attached to the ⁇ Z side surface of the window portion W.
  • the arm portions 174 and 175 are provided so as to be rotatable in the ⁇ Y direction around the mounting position. Arm portions 174 and 175 are connected to arm drive portions 176 and 177, respectively.
  • the arm drive units 176 and 177 have a motor mechanism (not shown), for example.
  • the control device CONT can control the drive amount and drive timing of the arm drive units 176 and 177.
  • Guide rollers 172 and 173 are attached to the tip portions of the arm portions 174 and 175.
  • the guide rollers 172 and 173 are formed in a cylindrical shape, and are arranged so that the central axis is parallel to the Y axis.
  • the guide rollers 172 and 173 are rotatably provided in the circumferential direction ( ⁇ Y direction).
  • a mounting portion 178 for mounting an external processing apparatus PA is formed in the container CT. Instead of the mounting portion 178, an opening for arranging the external processing apparatus PA may be formed.
  • the control device CONT controls the arm driving units 176 and 177, and the arm unit 174 is rotated counterclockwise in the drawing and the arm unit 175 is rotated clockwise in the drawing. Rotate each.
  • the guide rollers 172 and 173 attached to the respective distal ends of the arm part 174 and arm part 175 are hung on the substrate S, and the substrate S is pulled out of the window part W. It is.
  • FIG. 4 is a diagram illustrating a state in which the substrate S is pulled out from the window portion W to the outside of the storage chamber RM by the drawer portions 170 and 171. As shown in FIG. 4, in a state where the substrate S is pulled out, the arms 174 and 175 are arranged so that the tips of the arms 174 and 175 face the ⁇ X side.
  • the substrate S is exposed to the outside of the window portion W while being hung on the guide rollers 172 and 173.
  • the support surface 179a of the substrate support member 179 is pressed against the second surface Sb of the exposed portion Sc between the guide rollers 172 and 173 in the substrate S.
  • the support surface 179a is a curved surface formed to be convex toward the + X side, for example.
  • the exposed portion Sc is arranged to be curved to the + X side following the support surface 179a.
  • the substrate support member 179 is a rotating drum, for example.
  • the control device CONT controls the drive mechanism 69 to move the roller support member 67 to the + Z side along the guide portion 68 and adjust the path length of the transport path of the substrate S.
  • the structure which can move the roller support member 67 in the Z direction in a wide range compared with said 1st embodiment may be sufficient. Thereby, the adjustment amount of the path length of the transport path of the substrate S is increased.
  • the processing apparatus PA After the substrate S is pulled out of the storage chamber RM, the processing apparatus PA is disposed in the mounting portion 178 of the container CT. In a state where the processing device PA is mounted on the mounting unit 178, the processing unit 195 is directed to the ⁇ X side of the window W. For this reason, the exposed portion Sc is disposed at a position facing the processing unit 195 when viewed in the X direction. In this state, the processing unit 195 performs processing on the first surface Sa of the substrate S.
  • the processing device PA is removed from the mounting unit 178.
  • the control device CONT accommodates the arm portions 174 and 175 in the accommodation chamber RM of the container CT and simultaneously moves the roller support member 67 to the ⁇ Z side. By this operation, the substrate S is accommodated in the accommodation chamber RM together with the arm portions 174 and 175 while keeping the length of the transport path of the substrate S constant.
  • the substrate S is largely pulled out from the window W using the arms 174 and 175, and an external device such as the processing apparatus PA is provided between the exposed portion Sc of the substrate S and the container CT. Therefore, the first surface Sa of the substrate S can be processed.
  • the substrate support member for example, the rotating drum
  • the shape is in accordance with the shape of the support surface 179a.
  • the substrate S can be disposed at a position facing the processing unit 195. For example, if the support surface 179a is a flat surface, the substrate S is placed at a position facing the processing unit 195 in a flat state.
  • the window portion W is arranged on the wall portion CTa.
  • the present invention is not limited to this.
  • the configuration may be arranged on the wall.
  • the window part W is in several places of the container CT. It may be provided. In this case, a configuration in which a plurality of window portions W are disposed on one wall portion may be employed, or a configuration in which one or a plurality of window portions W are provided on a plurality of wall portions may be employed.
  • the door member may be a slide member SL that opens and closes the window W in FIG.
  • the slide member SL is connected to the slide drive unit 200.
  • the slide drive unit 200 is configured such that the drive amount and the drive timing are controlled by the control of the control device CONT.
  • the control device CONT may open and close the window portion W according to the connection state with the external processing device.
  • the control device CONT moves the slide member SL to the ⁇ Z side so that the window portion W is opened.
  • the control device CONT moves the slide member SL to the + Z side so that the window portion W is closed.
  • the configuration may be such that it is in contact with the first surface Sa of the substrate S and not in contact with the second surface Sb.
  • the substrate transport section CV has two transport sections CV1 and CV2.
  • the substrate S is folded inward in a spiral shape (+ X side in the drawing) by a plurality of rollers R so as to contact only the first surface Sa, and then guided by the roller R1. It is folded back toward the member 201.
  • the downstream side of the roller R1 of the substrate S is folded at one side 201a of the guide member 201.
  • the downstream side of one side 201 a of the substrate S is folded at an angle of 45 ° with the oblique side 201 b of the guide member 201.
  • the downstream side of the oblique side 201 b of the substrate S is turned back at the other side 201 c of the guide member 201 and then directed to the guide member 202.
  • the first surface Sa of the substrate S is wound around the guide member 201.
  • the portion of the substrate S directed to the guide member 202 is folded back at one side 202a of the guide member 202, and is folded back along the oblique side 202b and the other side 202c in the same manner as in the case of the guide member 201.
  • the downstream side of the other side 202c is directed to the roller R2. In this way, the first surface Sa of the substrate S is wound around the guide member 202.
  • the downstream side of the roller R2 is turned outward in a spiral shape by the plurality of rollers R, and then directed to the ⁇ X side transport unit CV2 in the drawing.
  • the transport unit CV2 has the same configuration as the transport unit CV1. In other words, the substrate S is folded in a spiral shape while contacting only the first surface Sa of the substrate S, and the roller R1, the guide members 201 and 202, and the roller R2 are provided at the center.
  • the first surface Sa is in contact with the rollers R, R1, R2 and the guide members 201, 202, and the second surface Sb is not in contact with these rollers and the guide member. S is folded.
  • substrate conveyance part CV can convey the board
  • the configuration of the guide members 201 and 202 is not limited to the configuration formed in the right isosceles triangle shape as described above.
  • a cylindrical roller is arranged on each side of the right angle isosceles triangle. It doesn't matter.
  • the configuration shown in FIG. 7 may be superposed in the Y direction.
  • conveyance units CV3 and CV4 are provided on the + Y side of the conveyance units CV1 and CV2.
  • the transport unit CV1 and the transport unit CV3 have the same configuration
  • the transport unit CV2 and the transport unit CV4 have the same configuration.
  • Direction changing rollers 301 to 304 are arranged between the conveyance units CV1 and CV2 and the conveyance units CV3 and CV4.
  • the direction is changed by the direction changing rollers 301 and 302 and hung on the transport parts CV3 and CV4.
  • the substrate S is hung on the conveyance units CV3 and CV4, then the direction is changed by the direction changing rollers 303 and 304, and is again hung on the conveyance unit CV1 and the conveyance unit CV2. It is always the first surface Sa of the substrate S that is hung on the direction changing rollers 301 to 304. In this way, the substrate S is hung so as to circulate between the transport unit CV1 to the transport unit CV4.
  • the substrates S are accommodated double in the Y direction.
  • the configuration may be such that the windows W1 and W2 are provided side by side in the Y direction. Since processing can be performed for each of the substrates S that are doubled in the Y direction, the processing efficiency can be increased.
  • a plurality of the configurations shown in FIG. 7 may be arranged in the X direction and the Z direction.
  • conveyance units CV3 and CV4 are provided on the ⁇ Z side of the conveyance units CV1 and CV2.
  • the transport unit CV1 and the transport unit CV3 have the same configuration
  • the transport unit CV2 and the transport unit CV4 have the same configuration.
  • each of the transport units CV1 to CV4 may have a configuration in which windows W1 to W4 are provided. Thereby, since processing can be performed at a plurality of locations, processing efficiency can be improved.
  • a processing unit may be provided in the storage chamber RM of the substrate storage device STR.
  • a processing unit that performs each process such as a plating process, a cleaning process, a drying process, and a heat treatment can be arranged on the substrate.
  • a processing unit PA2 that performs processing on the second surface Sb is provided in the storage chamber RM. It doesn't matter.
  • the storage device that stores the endless substrate in the longitudinal direction has been described.
  • the present invention is not limited to this configuration.
  • a supply roller, a recovery roller, a plurality of rollers for transporting the substrate wound around the supply roller to the window W1, and a substrate via the window W1 are recovered.
  • a plurality of rollers that send the substrate to the collection roller may be disposed, and the substrate conveyed in a roll-to-roll manner may be stored.
  • the said embodiment although demonstrated taking the example of the structure by which the roller R was arrange
  • the present invention can be applied even when the roller R is arranged so that the central axis is parallel to the X direction or the Z direction.
  • a mechanism for adjusting the conveyance path to be short may be adopted as employed in the first embodiment and the second embodiment.
  • the transport path is shortened by moving the roller, and the path length of the substrate transport path is adjusted to be constant. You may employ
  • Substrate storage device S ... Substrate Sa ... First side of substrate S Sb ... Second side of substrate S SP ... Substrate support part CT ... Container CV ... Substrate transport part CTa, CTb ... Wall part RM ... Containment chamber W , W1, W2 ... window portion J ... connection portion PA ... processing device R ... roller 67 ... roller support member 68 ... guide portion 69, 75 ... drive mechanism 71a ... support surface 90, 91 ... device side connection portion 92, 93 ... nip Roller 95 ... Processing unit 95a ... Processing surface 172, 173 ... Guiding rollers 174, 175 ... Arm unit 176, 177 ... Arm drive unit 178 ... Mounting unit 179 ... Substrate support member 179a ... Support surface 195 ... Processing unit 200 ... Slide drive unit 201, 202 ... guide members

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Storing, Repeated Paying-Out, And Re-Storing Of Elongated Articles (AREA)

Abstract

L'invention concerne un dispositif de stockage de substrat (STR) comprenant : un récipient (CT) doté d'une chambre (RM) qui contient un substrat flexible, (S) tel qu'un film de résine ; une fenêtre (W) ménagée dans le récipient (CT) ; et une bande transporteuse de substrat (CV) qui transporte le substrat de telle sorte qu'une partie dudit substrat (S) est opposée à la fenêtre (W). Le récipient (CT) comprend une jonction (J) qui reliée un appareil de traitement (PA). Le substrat sans fin (S) est contenu dans la chambre (RM) par enroulement autour de cylindres (11-66). Certains des cylindres (29, 33, 65) peuvent se déplacer dans une direction Z, la tension du substrat (S) étant ajustée par déplacement de ces cylindres. Une partie (Sc) du substrat (S) est tirée à l'extérieur de la fenêtre, et cette partie (Sc) est traitée par l'unité de traitement (95) de l'appareil de traitement (PA). La fenêtre (W) peut être recouverte d'un élément coulissant (SL). L'adhérence de particules étrangères sur le substrat (S) peut être limitée.
PCT/JP2011/078876 2010-12-15 2011-12-14 Dispositif de stockage de substrat WO2012081605A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020137016405A KR20140004663A (ko) 2010-12-15 2011-12-14 기판보관장치
CN2011800598185A CN103261066A (zh) 2010-12-15 2011-12-14 基板保管装置
JP2012548803A JPWO2012081605A1 (ja) 2010-12-15 2011-12-14 基板保管装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42319810P 2010-12-15 2010-12-15
US61/423,198 2010-12-15

Publications (1)

Publication Number Publication Date
WO2012081605A1 true WO2012081605A1 (fr) 2012-06-21

Family

ID=46244702

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/078876 WO2012081605A1 (fr) 2010-12-15 2011-12-14 Dispositif de stockage de substrat

Country Status (5)

Country Link
JP (1) JPWO2012081605A1 (fr)
KR (1) KR20140004663A (fr)
CN (1) CN103261066A (fr)
TW (1) TW201233606A (fr)
WO (1) WO2012081605A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5826352A (ja) * 1981-07-22 1983-02-16 メガテ−プ・コ−ポレ−シヨン 定張力高速双方向磁気テ−プ駆動装置
JPH0514373Y2 (fr) * 1987-12-28 1993-04-16
JPH07248463A (ja) * 1994-03-10 1995-09-26 Fuji Photo Film Co Ltd フィルムビュアー
US6258408B1 (en) * 1999-07-06 2001-07-10 Arun Madan Semiconductor vacuum deposition system and method having a reel-to-reel substrate cassette

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5826352A (ja) * 1981-07-22 1983-02-16 メガテ−プ・コ−ポレ−シヨン 定張力高速双方向磁気テ−プ駆動装置
JPH0514373Y2 (fr) * 1987-12-28 1993-04-16
JPH07248463A (ja) * 1994-03-10 1995-09-26 Fuji Photo Film Co Ltd フィルムビュアー
US6258408B1 (en) * 1999-07-06 2001-07-10 Arun Madan Semiconductor vacuum deposition system and method having a reel-to-reel substrate cassette

Also Published As

Publication number Publication date
CN103261066A (zh) 2013-08-21
JPWO2012081605A1 (ja) 2014-05-22
KR20140004663A (ko) 2014-01-13
TW201233606A (en) 2012-08-16

Similar Documents

Publication Publication Date Title
TW201733890A (zh) 搬送裝置及基板處理裝置
JP6384580B2 (ja) デバイス製造方法
JP5858068B2 (ja) 基板処理装置及び基板処理方法
WO2012081605A1 (fr) Dispositif de stockage de substrat
JP5929761B2 (ja) 基板処理システム及び表示素子の製造方法
JP5838964B2 (ja) 基板カートリッジ及び基板処理システム
JP6065954B2 (ja) 製造システム

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11848053

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2012548803

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20137016405

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 11848053

Country of ref document: EP

Kind code of ref document: A1