WO2012071693A1 - Dispositif de mesure de la pression et de la température - Google Patents

Dispositif de mesure de la pression et de la température Download PDF

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Publication number
WO2012071693A1
WO2012071693A1 PCT/CN2010/079217 CN2010079217W WO2012071693A1 WO 2012071693 A1 WO2012071693 A1 WO 2012071693A1 CN 2010079217 W CN2010079217 W CN 2010079217W WO 2012071693 A1 WO2012071693 A1 WO 2012071693A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
housing
measuring device
circuit board
temperature measuring
Prior art date
Application number
PCT/CN2010/079217
Other languages
English (en)
Chinese (zh)
Inventor
吴茂庭
Original Assignee
Wu Maoting
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wu Maoting filed Critical Wu Maoting
Priority to PCT/CN2010/079217 priority Critical patent/WO2012071693A1/fr
Publication of WO2012071693A1 publication Critical patent/WO2012071693A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation

Definitions

  • the invention relates to the field of measurement, and in particular to a pressure temperature measuring device.
  • Pressure sensors are used to sense pressure and convert them into usable output signals. They are widely used in various industrial automation environments such as water conservancy and hydropower, railway transportation, intelligent buildings, production automation, aerospace, military, petrochemical, oil wells, and electric power. , ships, machine tools, pipelines and many other industries.
  • the engine oil pressure sensor comprises a hollow housing 1 having a threaded joint 2 at one end and a terminal 3 at the other end.
  • the middle portion of the threaded joint 2 is formed with a through hole 21 which communicates with the inside of the casing.
  • the inside of the casing 1 is further provided with an elastic isolating diaphragm 4 and a circuit board 5, which are covered together and form a sealed cavity 6 therebetween, and the inside of the casing 1 is divided into two mutually disconnected spaces.
  • the cavity 6 is filled with a pressure transmitting medium;
  • the circuit board 5 is provided with a pressure sensing chip 51 on one side of the cavity 6, and a data acquisition chip on the other side, and is connected to the terminal 3 by means of a wire 52.
  • the engine oil pressure sensor described above is subjected to the pressure of the oil in the oil transfer chamber 41 through the elastic isolating diaphragm 4, and is transmitted to the pressure sensing chip 52.
  • the elastic isolating diaphragm 4 can play a certain isolation function, the pressure sensing and re-transmission to the pressure sensing chip 52 greatly affect the measurement accuracy of the engine oil pressure sensor.
  • the molding process of the above-described housing 1 is complicated, the number of steps is large, and the manufacturing cost is large.
  • the main object of the present invention is to provide a pressure and temperature measuring device, which aims to reduce the production and processing difficulty of the pressure temperature sensor, simplify the manufacturing process, reduce the cost, and improve the productivity; and also improve the stability and measurement accuracy of the pressure and temperature measuring device.
  • the invention provides a pressure and temperature measuring device, comprising a housing and a pressure sensor and a circuit board housed in the housing, the pressure sensor being connected with the housing and forming a sealed receiving cavity for the object to be tested
  • the inlet hole in the housing enters the receiving cavity; the pressure sensor senses a pressure signal of the object to be tested in the receiving cavity, and the pressure signal is converted into an electrical signal output by the circuit board.
  • the circuit board is further provided with a temperature sensing component, and the temperature sensing component senses a temperature signal of the object to be tested in the receiving cavity, and the temperature signal is converted into an electrical signal output by the circuit board.
  • the pressure sensor comprises a sensing portion and a strain gauge disposed on the sensing portion, the strain gauge is electrically connected to the circuit board, and the sensing portion is fixedly connected to the housing.
  • At least two recesses are provided on the sensing portion for mounting the pressure sensor and the housing.
  • the pressure temperature measuring device further includes a core shell, the core shell is integrally formed with the casing, the sensing portion is fixedly connected with the core shell, and the sealed receiving cavity is formed, the core body A through hole corresponding to the housing is disposed on the shell, and the object to be tested is in contact with the sensing portion by the through hole of the housing and the through hole of the core shell.
  • the sidewall surface of the core shell is tooth-shaped, and provides a radial suction force between the core shell and the shell when the core shell is integrally formed with the shell.
  • the side wall of the core shell is further provided with a ring groove, which provides a lateral suction force between the core shell and the shell when the core shell is integrally formed with the shell.
  • the inner wall of the casing is provided with a holding groove, and both sides of the circuit board are locked in the holding groove; and one end of the housing receiving circuit board is provided with a wire hole for the output line of the circuit board to pass through
  • the housing is connected to the outside world.
  • one end of the housing receiving pressure sensor is provided with a mounting portion for connecting the object receiving device, and the housing is fixedly connected to the object receiving device through the mounting portion, and the inlet hole penetrates the mounting portion.
  • the invention is fixedly connected with the housing through the pressure sensor and forms a receiving cavity, so that the pressure sensor can better sense the pressure signal of the object to be tested in the receiving cavity, and the circuit board disposed separately from the pressure sensor will The pressure signal is transmitted out.
  • the pressure temperature measuring device has the advantages of simple structure, convenient and quick installation, and further improves the stability and measurement precision of the pressure temperature measuring device.
  • FIG. 1 is a schematic structural view of a pressure sensor in the prior art
  • FIG. 2 is an exploded perspective view of an embodiment of a pressure temperature measuring device of the present invention
  • FIG. 3 is an exploded perspective view of the housing in an embodiment of the pressure temperature measuring device of the present invention.
  • FIG. 4 is another exploded perspective view of the housing in an embodiment of the pressure temperature measuring device of the present invention.
  • Figure 5 is an exploded perspective view showing a core body and a pressure sensor in another embodiment of the pressure temperature measuring device of the present invention.
  • 6A is a schematic view showing a combined structure of a core shell and a pressure sensor in another embodiment of the pressure temperature measuring device of the present invention
  • Figure 6B is a schematic cross-sectional view taken along line A-A of Figure 6A.
  • the pressure temperature measuring device of the present invention includes a housing 10 and a pressure sensor 20 and a circuit board 30 housed in the housing 10.
  • the pressure sensor 20 is coupled to the housing 10 and forms a closed receiving cavity for the object to be tested to enter the receiving cavity from the inlet opening 11 in the housing 10.
  • the pressure sensor 20 will sense the pressure signal of the object to be tested in the receiving cavity, and the pressure signal is converted into an electrical signal by the circuit board 30.
  • the circuit board 30 is further provided with a temperature sensing component, and the temperature sensing component can sense the temperature signal of the object to be tested in the receiving cavity, and the temperature signal is converted into an electrical signal output by the circuit board.
  • the pressure sensor 20 includes a sensing portion 21 and a strain gauge 22 disposed on the sensing portion 21.
  • the sensing portion 21 is fixedly coupled to the housing 10.
  • the strain gauge 22 is electrically connected to the circuit board 30.
  • the sensing portion 21 transmits the pressure of the object to be tested in the receiving chamber to the strain gauge 22, and the strain gauge 22 converts the pressure into a pressure signal and outputs it through the circuit board.
  • the circuit board 30 may also include a signal processing circuit that processes and outputs the pressure signal.
  • the sensing portion 21 includes a base portion and a connecting portion extending from the edge of the vertical base.
  • the strain gauge 22 is disposed on the base portion, and the connecting portion forms a sealed connection with the housing 10 and forms a sealed receiving cavity.
  • the sealing connection may be a threaded connection, a snap connection or a glue bond, etc., for better sealing, this embodiment is preferably a threaded connection.
  • At least two recesses 211 are further provided on the sensing portion 21 for mounting the pressure sensor 20 and the housing 10.
  • the pressure sensor 20 can be fixedly coupled to the housing 10 by a mounting tool having two latching legs, holding the latching legs in the recess 211, and rotating the mounting tool.
  • the housing 10 housing the pressure sensor 20 is provided with a mounting portion 12 for connecting the object receiving device (not shown).
  • the housing 10 is fixedly coupled to the object-receiving device through the mounting portion 12, and the inlet hole 11 extends through the mounting portion 12.
  • the fixed connection can be a threaded connection, a snap connection or a glue bond.
  • the present embodiment is preferably a threaded connection, that is, the outer wall of the mounting portion 12 is provided with a threaded structure, so that the housing 10 is stably connected to the object receiving device through the mounting portion 12.
  • the inner wall of the casing 10 is provided with a holding groove 13 , and both sides of the circuit board 30 are clamped in the holding groove 13 .
  • One end of the housing 10 housing the circuit board 30 is provided with a wire hole 14 through which the output line of the circuit board 30 is connected to the outside through the housing 10.
  • the pressure temperature measuring device of the embodiment is fixedly connected to the housing 10 through the pressure sensor 20, and forms a receiving cavity, so that the pressure sensor 20 can better sense the pressure signal of the object to be tested in the receiving cavity, and the pressure and pressure
  • the manufacturing process of the above pressure temperature measuring device may include the following steps:
  • the casing 10 is preferably one-shot injection molding, which is characterized in that the molding cycle is short, and the plastic parts with complicated shapes, accurate dimensions, and metal or non-metal inserts can be formed at one time.
  • the housing 10 In the prior art, the housing 10 must be completed by multiple moldings. Therefore, the manufacturing process of the pressure temperature measuring device is simpler than the prior art, and the production process is high.
  • the pressure temperature measuring device further includes a core case 40.
  • the core case 40 is integrally formed with the housing 10, and the sensing portion 21 of the pressure sensor 20 is fixedly coupled to the core case 40 to form the receiving cavity.
  • the fixed connection may be a threaded connection, a snap connection or a glue bond or the like. This embodiment is preferably a threaded connection.
  • the through hole 41 corresponding to the inlet hole 211 is further disposed on the core shell 40, and the object to be tested can enter the receiving cavity from the inlet hole 11 in the casing 10 and the through hole 41 in the core shell 40.
  • the outer side wall surface of the core shell 40 has a tooth-like shape, and provides a radial suction force between the core shell 40 and the casing 10 when the core shell 40 is integrally formed with the casing 10.
  • the outer side wall ring of the core shell 40 is provided with a ring groove 42 for providing a lateral suction force between the core shell 40 and the casing 10 when the core shell 40 is integrally formed with the casing 10.
  • the manufacturing process of the above pressure temperature measuring device may include the following steps:
  • the pressure sensor 20 and the core shell 40 are respectively formed in accordance with their predetermined shapes
  • the pressure sensor 20 and the core shell 40 are respectively molded, and then the core shell 40 and the shell 10 are integrally formed. Finally, the pressure sensor 20 is mounted on the core shell 40, so that the pressure sensor 20 is The core shell 40 can be stably mounted on the core shell 40, and the outer side of the core shell 40 is provided with a tooth groove and a groove structure, which further ensures the stable connection between the pressure sensor 20 and the casing 10, and improves the pressure temperature measuring device. measurement accuracy.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention concerne un dispositif de mesure de la pression et de la température, comprenant un boîtier (10), un capteur de pression (20) et un circuit électronique (30) qui sont logés dans le boîtier (10). Le capteur de pression (20) est relié au boîtier (10) de manière à former une cavité d'accueil scellée. Un objet à mesurer s'écoule dans la cavité d'accueil à travers un trou d'entrée (11) sur le boîtier (10). Le capteur de pression (20) détecte les signaux de pression de l'objet à mesurer dans la cavité d'accueil et le circuit électronique (30) transforme les signaux de pression en signaux électriques et les délivre. Un élément de détection de température est disposé sur le circuit électronique (30). L'élément de détection de température détecte les signaux de température de l'objet à mesurer et le circuit électronique (30) transforme les signaux de température en les signaux électriques et les délivre. Le dispositif de mesure de la pression et de la température présente une structure simple, est commode à installer et, de plus, a une meilleure stabilité et précision de mesure.
PCT/CN2010/079217 2010-11-29 2010-11-29 Dispositif de mesure de la pression et de la température WO2012071693A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2010/079217 WO2012071693A1 (fr) 2010-11-29 2010-11-29 Dispositif de mesure de la pression et de la température

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2010/079217 WO2012071693A1 (fr) 2010-11-29 2010-11-29 Dispositif de mesure de la pression et de la température

Publications (1)

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WO2012071693A1 true WO2012071693A1 (fr) 2012-06-07

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110186494A (zh) * 2019-03-11 2019-08-30 浙江毅力汽车空调有限公司 一种新能源汽车空调温度压力传感器的封装结构
CN111351607A (zh) * 2019-11-13 2020-06-30 中国科学院微电子研究所 一种温压复合传感器的制作方法
CN113252203A (zh) * 2021-04-20 2021-08-13 季诺金(宁夏)科技有限公司 一种温度压力一体化传感器
CN115096407A (zh) * 2022-06-15 2022-09-23 广东科源电气股份有限公司 组合式变电站状态监测装置
CN115388938A (zh) * 2022-07-13 2022-11-25 中列(武汉)科技有限公司 一种温压传感器
CN116481700A (zh) * 2023-06-05 2023-07-25 山东慧点智能技术有限公司 一种压力传感器及压力传感系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0893676A2 (fr) * 1997-07-24 1999-01-27 Texas Instruments Incorporated Transducteur de pression combiné avec un appareil sensible à la température
JP2005181032A (ja) * 2003-12-18 2005-07-07 Kawamoto Pump Mfg Co Ltd 流量圧力温度検出装置及びその装置を備えた自動給水装置
CN1943040A (zh) * 2004-04-19 2007-04-04 迅捷公司 压力传感器装置和方法
US7434470B2 (en) * 2005-12-19 2008-10-14 Robert Bosch Gmbh Combined pressure and temperature sensor
CN101614607A (zh) * 2009-07-31 2009-12-30 武汉光子科技有限公司 光纤f-p压力传感器及其压力液位传感装置
CN101720428A (zh) * 2007-06-02 2010-06-02 马夸特有限责任公司 传感器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0893676A2 (fr) * 1997-07-24 1999-01-27 Texas Instruments Incorporated Transducteur de pression combiné avec un appareil sensible à la température
JP2005181032A (ja) * 2003-12-18 2005-07-07 Kawamoto Pump Mfg Co Ltd 流量圧力温度検出装置及びその装置を備えた自動給水装置
CN1943040A (zh) * 2004-04-19 2007-04-04 迅捷公司 压力传感器装置和方法
US7434470B2 (en) * 2005-12-19 2008-10-14 Robert Bosch Gmbh Combined pressure and temperature sensor
CN101720428A (zh) * 2007-06-02 2010-06-02 马夸特有限责任公司 传感器
CN101614607A (zh) * 2009-07-31 2009-12-30 武汉光子科技有限公司 光纤f-p压力传感器及其压力液位传感装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110186494A (zh) * 2019-03-11 2019-08-30 浙江毅力汽车空调有限公司 一种新能源汽车空调温度压力传感器的封装结构
CN111351607A (zh) * 2019-11-13 2020-06-30 中国科学院微电子研究所 一种温压复合传感器的制作方法
CN111351607B (zh) * 2019-11-13 2022-01-11 中国科学院微电子研究所 一种温压复合传感器的制作方法
CN113252203A (zh) * 2021-04-20 2021-08-13 季诺金(宁夏)科技有限公司 一种温度压力一体化传感器
CN115096407A (zh) * 2022-06-15 2022-09-23 广东科源电气股份有限公司 组合式变电站状态监测装置
CN115096407B (zh) * 2022-06-15 2023-04-28 广东科源电气股份有限公司 组合式变电站状态监测装置
CN115388938A (zh) * 2022-07-13 2022-11-25 中列(武汉)科技有限公司 一种温压传感器
CN116481700A (zh) * 2023-06-05 2023-07-25 山东慧点智能技术有限公司 一种压力传感器及压力传感系统
CN116481700B (zh) * 2023-06-05 2024-03-08 山东慧点智能技术有限公司 一种压力传感器及压力传感系统

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