WO2012070558A1 - Carte de câblage et carte de câblage pour dispositif d'affichage - Google Patents

Carte de câblage et carte de câblage pour dispositif d'affichage Download PDF

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Publication number
WO2012070558A1
WO2012070558A1 PCT/JP2011/076881 JP2011076881W WO2012070558A1 WO 2012070558 A1 WO2012070558 A1 WO 2012070558A1 JP 2011076881 W JP2011076881 W JP 2011076881W WO 2012070558 A1 WO2012070558 A1 WO 2012070558A1
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WO
WIPO (PCT)
Prior art keywords
wiring pattern
wiring
pattern
wiring board
chamfered
Prior art date
Application number
PCT/JP2011/076881
Other languages
English (en)
Japanese (ja)
Inventor
松田　成裕
琢也 大石
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012070558A1 publication Critical patent/WO2012070558A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136204—Arrangements to prevent high voltage or static electricity failures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09272—Layout details of angles or corners

Definitions

  • the present invention relates to a wiring board and a wiring board for a display device, and more particularly to a wiring board and a wiring board for a display device that prevent electrostatic breakdown.
  • a thin film is formed on an insulating substrate such as a glass substrate by using a plasma CVD method or a sputtering method, or the thin film formed by using a dry etching method is patterned.
  • a pixel portion is formed in the region, and a lead-out wiring pattern is formed in the frame region.
  • the lead wiring pattern is not grounded during the manufacture of the liquid crystal panel. For this reason, if static electricity is charged in the lead-out wiring pattern, the charged static electricity may be discharged toward the adjacent wiring pattern, resulting in electrostatic breakdown that damages the adjacent wiring pattern.
  • Patent Document 1 in order to prevent electrostatic breakdown due to such static electricity, a wiring pattern is formed from the signal input wiring of the liquid crystal display device to the end of the insulating substrate, and in order to short-circuit those wiring patterns, Attaching a conductive clip to the end of an insulating substrate is disclosed.
  • the circuit inspection of the signal input wiring is performed, the conductive clip is removed from the insulating substrate so that the wiring patterns are not short-circuited. Thereby, it can test
  • a conductive clip is attached to the end portion of the insulating substrate to short-circuit the wiring pattern. In this way, electrostatic breakdown of the signal input wiring is prevented.
  • Patent Document 2 discloses that a common wiring is disposed via a protection transistor in the vicinity of a wiring pattern that is formed in a peripheral region of an active matrix substrate and supplies a control signal and the like. The static electricity charged in the wiring pattern escapes to the common wiring through the protection transistor, so that electrostatic breakdown of the wiring pattern is suppressed.
  • an object of the present invention is to provide a wiring board and a display device wiring board that can prevent electrostatic breakdown without extra patterns or work.
  • a first aspect of the present invention is a wiring board in which a plurality of wiring patterns are formed on an insulating substrate,
  • the wiring pattern includes a first chamfered portion in which a corner portion to be projected toward an adjacent wiring pattern is chamfered at a bent portion.
  • a plurality of bypass wiring patterns formed so as to partially overlap each of the wiring patterns via an insulating film;
  • the bypass wiring pattern includes a second chamfered portion formed so as to surround the first chamfered portion of the wiring pattern with a certain distance therebetween.
  • the angle of the corner is an acute angle.
  • a display region having a plurality of pixel portions for displaying an image, a gate wiring and a source wiring electrically connected to the plurality of pixel portions, and the pixel portion on an insulating substrate.
  • a display device wiring board comprising: a drive circuit for driving a frame; and a frame region provided between the display region and the drive circuit, The frame region includes a wiring board according to the first or second invention, The wiring pattern formed on the wiring substrate is a lead-out wiring pattern that electrically connects the pixel portion and the driving circuit.
  • At least a part of the lead-out wiring pattern includes a straight line part and a meandering part composed of one or more bent parts
  • the meandering portion includes a third chamfered portion in which a corner portion to be projected toward the adjacent lead wiring pattern is chamfered.
  • a sixth aspect of the present invention is the fourth aspect of the present invention.
  • the lead-out wiring pattern is formed of the same metal as the gate wiring or the source wiring.
  • the corner portion that should protrude toward the adjacent wiring pattern is chamfered, whereby a plurality of corner portions having a large angle are formed.
  • a first chamfered portion is formed.
  • the bypass wiring pattern formed so as to partially overlap the wiring pattern via the insulating film is surrounded by a certain distance from the first chamfered portion of the wiring pattern.
  • a second chamfered portion is formed.
  • electrostatic discharge is likely to occur when the angle of a corner to be projected toward an adjacent wiring pattern is an acute angle. Therefore, the wiring pattern is damaged by chamfering such a corner. Can be made difficult to occur.
  • the wiring pattern formed on the wiring board according to the first or second aspect is used as the lead-out wiring pattern formed in the frame area of the display device wiring board. Therefore, even if an unnecessary pattern is not formed or an operation is not performed, it is possible to suppress damage to the lead-out wiring pattern, thereby reducing malfunction of the display device due to pattern damage.
  • the lead-out wiring pattern in order to align the resistance value of the lead-out wiring pattern with the largest resistance value among the resistance values of the plurality of lead-out wiring patterns, includes not only a straight portion but also a meandering portion. .
  • the meandering portion is chamfered with a corner portion that should protrude toward the adjacent lead wiring pattern to form a third corner portion.
  • electrostatic discharge from the lead-out wiring toward the adjacent lead-out wiring is less likely to occur, and damage to the adjacent lead-out wiring pattern is unlikely to occur.
  • the third chamfered portion is formed at the same time as the lead-out wiring, it is possible to prevent the lead-out wiring pattern from being damaged without forming an unnecessary pattern or performing an operation.
  • the lead wiring is formed simultaneously with the gate wiring or the source wiring
  • the first chamfered portion of the lead wiring is also formed simultaneously with the gate wiring or the source wiring.
  • FIG. 3 is a cross-sectional view taken along line AA of the lead wiring pattern shown in FIG.
  • FIG. 5 is a schematic diagram illustrating a distribution of electric charges due to static electricity accumulated at corners of the wiring pattern illustrated in FIG. 4.
  • FIG. 8A is a cross-sectional view taken along line BB in the width direction of the wiring pattern and the bypass wiring pattern shown in FIG. 7, and FIG. 8B is a portion where the wiring pattern and the bypass wiring pattern overlap each other.
  • FIG. 6 is a cross-sectional view taken along a line CC in the length direction of FIG. It is a top view which shows the wiring pattern and bypass wiring pattern which were mentioned as the comparative example of this embodiment, and was formed in the liquid crystal panel.
  • FIG. 8 is a schematic diagram illustrating a distribution of electric charges due to static electricity accumulated at corners of the wiring pattern illustrated in FIG. 7.
  • FIG. 15 is a diagram showing positions 15A to 15D in the wiring area shown in FIG. 1; It is a figure which shows the shape of the wiring pattern in the position 15B shown in FIG. 11, and a bypass wiring pattern. It is a figure which shows the shape of the wiring pattern in the position 15A shown in FIG. 11, and a bypass wiring pattern. It is a figure which shows the shape of the wiring pattern in the position 15C shown in FIG. 11, and a bypass wiring pattern.
  • FIG. 1 is a diagram illustrating a configuration of a liquid crystal panel 10 (also referred to as a “wiring substrate for a liquid crystal display device”) according to a first embodiment of the present invention.
  • the liquid crystal panel 10 is formed on an insulating substrate 11 such as glass, and includes a display area 12 for displaying an image, a frame area 13 provided around the display area 12, and a frame area 13. And a terminal region 14 provided in the periphery.
  • a plurality of gate lines 2 extending in the horizontal direction and a plurality of source lines 3 extending in a direction intersecting with the gate lines 2 are formed.
  • the pixel portion 1 is disposed.
  • a gate driver 16 and a source driver 17 are provided in the terminal area 14.
  • the gate driver 16 and the source driver 17 are respectively connected to the gate line 2 and the source line 3 in the display area 12 through lead lines (not shown) formed in the frame area 13.
  • the gate driver 16 sequentially applies a high level signal indicating the selected state to the gate wiring 2. Thereby, the gate wirings 2 are selected one by one in order. For example, when an arbitrary gate line 2 is selected, the pixel portions 1 for one row connected to the gate line 2 are selected at once.
  • the source driver 17 applies a signal voltage corresponding to the image signal DT to each source wiring 3. As a result, the signal voltage is written to each of the selected row of pixel portions 1. In this way, the liquid crystal display device displays an image on the liquid crystal panel 10.
  • the lead wiring formed in the frame region 13 is formed using a refractory metal such as molybdenum (Mo) or tungsten (W) simultaneously with the gate wiring 2 or the source wiring 3.
  • Mo molybdenum
  • W tungsten
  • the gate driver 16 and the source driver 17 may be collectively referred to as a drive circuit.
  • FIG. 2 is a plan view showing the shape of the lead-out wiring pattern 20 formed in the frame region 13 of the liquid crystal panel 10 shown in FIG.
  • FIG. 3 is a cross-sectional view taken along line AA of the lead wiring pattern 20 shown in FIG.
  • a lead-out wiring pattern 20 (in this embodiment, referred to as “wiring pattern 20”) that functions as a signal wiring is formed on the insulating substrate 11. Since a large number of wiring patterns 20 are formed in the frame region 13 having a limited area, the interval between the adjacent wiring patterns 20 is as very narrow as 6 to 8 ⁇ m.
  • These wiring patterns 20 are covered with a protective film 5 such as silicon nitride (SiNx).
  • each wiring pattern 20 is formed such that a linear pattern is bent at a bent portion 22 and is parallel to each other.
  • a corner portion (not shown) that should be convex outward is chamfered, and a chamfer portion 23 having a corner portion 24 having an angle larger than the angle of the chamfered corner portion is formed.
  • the chamfered portion 23 formed in this way is opposed to the linear pattern of the adjacent wiring pattern 20. Thereby, it can suppress that the adjacent linear wiring pattern 20 is damaged.
  • angular part which should become convex outside is performed once, as shown in FIG.
  • three or more corner portions 24 formed in the chamfered portion 23 may be formed by chamfering a plurality of times. Further, the chamfering of the bent portion 22 of the wiring pattern 20 is performed simultaneously with the patterning of the metal film formed on the insulating substrate 11, so that it is not necessary to add a new manufacturing process for chamfering.
  • FIG. 4 is a plan view showing a wiring pattern 30 formed in the frame region 13 of the liquid crystal panel 10 as a comparative example of the present embodiment.
  • the linear pattern is bent at two places, like the wiring pattern 20 shown in FIG. 2.
  • the corner portions 31 that protrude outward are left without being chamfered at the bent portions.
  • FIG. 5 is a schematic diagram showing the distribution of charges due to static electricity accumulated in the corners 31 of the wiring pattern 30 shown in FIG.
  • the wiring pattern 30 is not grounded. For this reason, electric charges (black circles in FIG. 5) due to static electricity charged in the wiring pattern 30 cannot escape from the wiring pattern 30 and are easily collected in the corner portions 31 of the wiring pattern 30.
  • ESD Electro Static Discharge
  • FIG. 6 is a schematic diagram showing the distribution of charges due to static electricity accumulated in the corners 24 of the wiring pattern 20 shown in FIG.
  • the chamfering is performed by cutting a corner (not shown) to be formed in the bent portion 22 of the wiring pattern 20 in a straight line.
  • a corner portion having a sharp tip is removed, and a chamfered portion 23 having a corner portion 24 having a larger angle than the corner portion 31 of the wiring pattern 30 is formed.
  • the electric charge accumulated in the corner portion 31 before the chamfering shown in FIG. 5 is dispersed in the two corner portions 24 formed by the chamfering. Since the angle of each corner 24 is larger than the angle of the corner 31 before chamfering, the electric field strength near the tip of the corner 24 is larger than the electric field strength near the tip of the corner 31 before chamfering. become weak. Further, the distance from the corner 24 to the adjacent wiring pattern 20 is increased. For these reasons, since there is no singular point in the wiring pattern 20, the charge accumulated in the corner portion 24 is difficult to be discharged toward the adjacent wiring pattern 20. As a result, pattern damage 35 due to electrostatic discharge is less likely to occur in adjacent wiring patterns 20.
  • the pattern breakage 35 can be more effectively suppressed by chamfering.
  • the angle of the corner to be formed is 90 degrees or more, the pattern breakage 35 can be made difficult to occur.
  • the angle of the corner portion to be formed in the bent portion 22 is 90 degrees or more, the pattern breakage 35 can be suppressed if the angle is 135 degrees or less.
  • the chamfered portion 23 having the corner portion 24 having a large angle is formed in the bent portion 22 of the wiring pattern 20 formed on the insulating substrate 11.
  • the charge due to static electricity charged in the wiring pattern 20 is dispersed in the two corners 24 and the angles thereof are large, so that the charge intensity at the corners 24 is weakened.
  • electrostatic discharge from the chamfered portion 23 toward the adjacent wiring pattern 20 is less likely to occur, and pattern damage is less likely to occur in the adjacent wiring pattern 20.
  • the damage of the wiring pattern 20 can be suppressed, the malfunction of the liquid crystal display device due to the pattern damage can be reduced.
  • FIG. 7 is a plan view showing the shapes of the wiring pattern 50 and the bypass wiring pattern 60 formed in the liquid crystal panel 10 according to the second embodiment of the present invention.
  • FIG. 8A is a cross-sectional view taken along the arrow BB in the width direction of the wiring pattern 50 and the bypass wiring pattern 60 shown in FIG. 7, and FIG. 8B shows the wiring pattern 50 and the bypass wiring pattern.
  • FIG. 6 is a cross-sectional view taken along the arrow line CC in the length direction of a portion overlapping 60. As shown in FIGS. 8A and 8B, not only the wiring pattern 50 having the same function as the wiring pattern 20 of the first embodiment but also a part of the wiring pattern 50 is formed on the insulating substrate 11.
  • a pattern 60 extending in the same direction as the wiring pattern 50 (referred to as “bypass wiring pattern 60” in this embodiment) is also formed.
  • the bypass wiring pattern 60 is electrically connected to the wiring pattern 50 so as to straddle the disconnected portion when the wiring pattern 50 is disconnected for some reason, and has a function of repairing the disconnection of the wiring pattern 50 and a display area.
  • 12 is a pattern having a light shielding function of shielding the peripheral portion of 12.
  • the lead-out wiring pattern includes the wiring pattern 50 that functions as a signal wiring, and the bypass wiring pattern 60 that has a repair function and a light shielding function.
  • a wiring pattern 50 is formed on the insulating substrate 11 in the same manner as in the first embodiment.
  • a wiring pattern 50 shown in FIG. 7 is a pattern formed in the vicinity of the display region 12 among the wiring patterns 50 formed in the frame region 13 as will be described later, and is formed by an interlayer insulating film 4 such as a silicon nitride film. Covered.
  • a bypass wiring pattern 60 made of a metal such as chromium is formed on the interlayer insulating film 4. The bypass wiring pattern 60 is formed so that the width direction and the length direction thereof partially overlap with the width direction and the length direction of the wiring pattern 50 in a plan view.
  • the bypass wiring pattern 60 is electrically connected to the wiring pattern 50 and the disconnection of the wiring pattern 50 is repaired. Furthermore, the wiring pattern 50 and the bypass wiring pattern 60 are covered with a protective film 5 such as silicon nitride.
  • the wiring pattern 50 is formed to be bent at a bent portion 52.
  • a corner portion (not shown) that should be convex outward is chamfered to form a chamfered portion 53.
  • a chamfered portion 63 is formed at a position facing the chamfered portion 53 of the wiring pattern 50 also in the bypass wiring pattern 60 formed so as to partially overlap the adjacent wiring pattern 50 in the width direction and the length direction. Yes.
  • the chamfered portion 63 is formed so as to surround the chamfered portion 53 of the wiring pattern 50 with a certain distance.
  • FIG. 9 is a plan view showing a wiring pattern 70 and a bypass wiring pattern 80 formed on the liquid crystal panel 10 as a comparative example of the present embodiment.
  • a linear pattern is bent in the middle like the wiring pattern 50 shown in FIG.
  • the corners 71 that protrude outward are left without chamfering.
  • the corner 81 is left without chamfering in the bypass wiring pattern 80 near the corner 71.
  • FIG. 9 also shows the distribution of charges (black circles) due to static electricity accumulated in the corners 71 of the wiring pattern 70.
  • the wiring pattern 70 is not grounded.
  • the charge due to static electricity charged in the wiring pattern 70 cannot escape from the wiring pattern 70 and tends to accumulate in the corners 71 of the wiring pattern 70.
  • electrostatic discharge toward the adjacent wiring pattern 70 is generated in the same manner as in the comparative example shown in FIG. For this reason, pattern damage 75 may occur at a position facing the corner 71 of the adjacent wiring pattern 70.
  • the corner 71 of the wiring pattern 70 is also close to the adjacent bypass wiring pattern 80, electrostatic discharge is generated from the corner 71 of the wiring pattern 70 toward the bypass wiring pattern 80, and a pattern breakage 85 occurs in the bypass wiring pattern 80. It may occur.
  • FIG. 10 is a schematic diagram showing the distribution of charges due to static electricity accumulated in the corners 24 of the wiring pattern 50 shown in FIG.
  • the chamfering is performed by cutting a corner portion to be formed in the wiring pattern 50 into a straight line.
  • corner portions 54 having a larger angle than the corner portion 71 are formed. Thereby, the electric charge of the corner
  • the chamfered portion 63 of the bypass wiring pattern 60 is formed so as to surround the chamfered portion 53 of the wiring pattern 50 with a certain distance. As a result, the distance from the chamfered portion 63 of the bypass wiring pattern 60 is the same at any location of the chamfered portion 53 of the wiring pattern 50 including the corner portion 54. The point disappears. As a result, electrostatic discharge from the wiring pattern 50 toward the bypass wiring pattern 60 is less likely to occur, and pattern damage to the bypass wiring pattern 60 is less likely to occur.
  • the bypass wiring pattern 60 is formed so as to partially overlap the wiring pattern 50 along the length direction with the interlayer insulating film 4 interposed therebetween. ing. There is no singular point between the wiring pattern 50 and the bypass wiring pattern 60. For this reason, even if the wiring pattern 50 and the bypass wiring pattern 60 are insulated, electrostatic discharge does not occur between the wiring pattern 50 and the bypass wiring pattern 60.
  • FIG. 11 is a diagram showing positions 15A to 15D in the wiring region 15 shown in FIG.
  • FIG. 12 is a diagram showing the shapes of the wiring pattern 50 and the bypass wiring pattern 60 at the position 15B shown in FIG. Since the position 15B is in the wiring region 15 substantially on the center line of the source driver 17, the length of the wiring pattern 50 that electrically connects the source driver 17 and the source wiring is the shortest. And the length of the wiring pattern 50 becomes long as it leaves
  • a meandering portion 58 obtained by bending the wiring pattern 50 is provided in the middle of the wiring pattern 50.
  • the length needs to be adjusted by 58. In this case, it is necessary to match the resistance values of all the wiring patterns 50 with the resistance values of the wiring patterns 50 formed at the position 15D.
  • a bent portion 52 is formed by bending the meandering portion 58 as many times as necessary. If chamfering is not performed at the bent portion 52 of the meandering portion 58, a corner portion (not shown) is formed.
  • FIG. 13 is a diagram showing the shapes of the wiring pattern 50 and the bypass wiring pattern 60 at the position 15A shown in FIG.
  • the position 15A is the wiring region 15 near the source driver 17.
  • one wiring pattern 50 is bent among the plurality of wiring patterns 50 formed to be parallel to each other.
  • a corner (not shown) to be formed in the bent portion 52 on the adjacent wiring pattern 50 side is chamfered linearly.
  • a chamfered portion 53 having two corner portions 54 is formed in the wiring pattern 50.
  • the angles of these corners 54 are larger than the angles of the corners before chamfering. Therefore, for the same reason as described above, electrostatic discharge from the corner portion 54 of the chamfered portion 53 toward the adjacent wiring pattern 50 is less likely to occur, and the adjacent wiring pattern 50 and the bypass wiring pattern 60 are less likely to be damaged. .
  • FIG. 14 is a diagram showing the shapes of the wiring pattern 50 and the bypass wiring pattern 60 in the wiring region 15 at the position 15C shown in FIG.
  • the position 15 ⁇ / b> C is the wiring area 15 near the display area 12. Since the wiring pattern 50 and the bypass wiring pattern 60 shown in FIG. 14 are patterns including the wiring pattern 50 and the bypass wiring pattern 60 shown in FIG. 7 described above, description of their shapes is omitted. Also in this case, electrostatic discharge from the corner portion 54 of the chamfered portion 53 formed in the wiring pattern 50 toward the adjacent wiring pattern 50 or bypass wiring pattern 60 is less likely to occur. Thereby, the adjacent wiring pattern 50 and bypass wiring pattern 60 are not easily damaged.
  • a chamfered portion 53 is formed in the meandering portion 58 formed for adjusting the resistance value of the wiring pattern 50.
  • the liquid crystal panel 10 has been described.
  • the present invention is not limited to the liquid crystal panel 10 and can also be applied to a display device substrate such as an organic EL (Electro Luminescence) display device wiring substrate.
  • a display device substrate such as an organic EL (Electro Luminescence) display device wiring substrate.
  • it is generally applicable to a substrate in which a large number of wiring patterns must be formed at intervals of, for example, several ⁇ m on an insulating substrate having a limited width.
  • the case where the liquid crystal panel 10 is charged with static electricity has been described by taking the manufacturing process of the liquid crystal panel 10 as an example.
  • the present invention is also effective against static electricity charged during handling of the manufactured liquid crystal panel 10.
  • the present invention is suitable for a display device such as an active matrix liquid crystal display device, and particularly suitable for an active matrix liquid crystal display device in which electrostatic destruction of a wiring pattern is prevented.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)

Abstract

L'invention concerne une carte de câblage capable d'éviter un endommagement par décharge électrostatique sans comporter de motif supplémentaire ni nécessiter d'opérations supplémentaires ; et une carte de câblage pour dispositif d'affichage. La section incurvée (22) d'un motif de câblage (20) formé sur un substrat isolant (11) est biseautée afin de former une section anguleuse dépassant vers un motif de câblage voisin (20), et deux angles (24) de grande valeur sont formés sur la section biseautée (23). Par conséquent, la charge électrique imposée à un motif de câblage (20) sous l'effet de l'électricité statique est dispersée au moyen des deux angles (24), cela affaiblissant l'intensité de la charge électrique à l'emplacement des angles (24) en raison de leur grande valeur. Par conséquent, la probabilité d'une décharge électrostatique de la section biseautée (23) vers le motif de câblage voisin (20) est moins élevée et la probabilité d'un endommagement du motif de câblage voisin (20) est moins élevée.
PCT/JP2011/076881 2010-11-26 2011-11-22 Carte de câblage et carte de câblage pour dispositif d'affichage WO2012070558A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010264327 2010-11-26
JP2010-264327 2010-11-26

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Publication Number Publication Date
WO2012070558A1 true WO2012070558A1 (fr) 2012-05-31

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111681554A (zh) * 2020-06-30 2020-09-18 上海中航光电子有限公司 显示面板及显示装置
JP2022515578A (ja) * 2019-01-08 2022-02-21 京東方科技集團股▲ふん▼有限公司 アレイ基板及び表示装置
WO2022264774A1 (fr) * 2021-06-18 2022-12-22 株式会社デンソー Dispositif électronique

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07249839A (ja) * 1994-03-10 1995-09-26 Toshiba Corp プリント基板
JP2007288079A (ja) * 2006-04-20 2007-11-01 Sumitomo Metal Mining Co Ltd 配線構造とこれを用いた高密度配線基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07249839A (ja) * 1994-03-10 1995-09-26 Toshiba Corp プリント基板
JP2007288079A (ja) * 2006-04-20 2007-11-01 Sumitomo Metal Mining Co Ltd 配線構造とこれを用いた高密度配線基板

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022515578A (ja) * 2019-01-08 2022-02-21 京東方科技集團股▲ふん▼有限公司 アレイ基板及び表示装置
JP7562418B2 (ja) 2019-01-08 2024-10-07 京東方科技集團股▲ふん▼有限公司 アレイ基板及び表示装置
CN111681554A (zh) * 2020-06-30 2020-09-18 上海中航光电子有限公司 显示面板及显示装置
WO2022264774A1 (fr) * 2021-06-18 2022-12-22 株式会社デンソー Dispositif électronique
JP7503026B2 (ja) 2021-06-18 2024-06-19 株式会社Soken 電子機器

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