WO2012067463A2 - 전극형성용 은 페이스트 조성물 및 이를 이용한 실리콘 태양전지 - Google Patents
전극형성용 은 페이스트 조성물 및 이를 이용한 실리콘 태양전지 Download PDFInfo
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- WO2012067463A2 WO2012067463A2 PCT/KR2011/008843 KR2011008843W WO2012067463A2 WO 2012067463 A2 WO2012067463 A2 WO 2012067463A2 KR 2011008843 W KR2011008843 W KR 2011008843W WO 2012067463 A2 WO2012067463 A2 WO 2012067463A2
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- WIPO (PCT)
- Prior art keywords
- paste composition
- silver paste
- electrode
- silver
- average particle
- Prior art date
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 112
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 80
- 239000004332 silver Substances 0.000 title claims abstract description 80
- 239000000203 mixture Substances 0.000 title claims abstract description 75
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 43
- 239000010703 silicon Substances 0.000 title claims abstract description 43
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 239000006229 carbon black Substances 0.000 claims abstract description 46
- 239000002245 particle Substances 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 47
- 239000004065 semiconductor Substances 0.000 claims description 18
- 239000011230 binding agent Substances 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 239000012461 cellulose resin Substances 0.000 claims description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims 1
- 229940116411 terpineol Drugs 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 32
- 238000006243 chemical reaction Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 18
- 238000007650 screen-printing Methods 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 9
- 239000012535 impurity Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000000635 electron micrograph Methods 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 230000009974 thixotropic effect Effects 0.000 description 4
- 238000011049 filling Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000001112 coagulating effect Effects 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B22F1/0003—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a silver paste composition for forming an electrode and a silicon solar cell using the same. More particularly, the electrical characteristics of the solar cell are improved by stably making contact between the front electrode and the emitter of the solar cell and realizing a high aspect ratio.
- the present invention relates to a silver paste composition for forming an electrode and a silicon solar cell using the same.
- the metal paste generally used includes a conductive metal, a glass frit, and an organic binder. Silver, aluminum, and the like are used as the conductive metal, and silver is mainly used.
- conductive metal pastes are mainly used for mounting hybrid ICs and semiconductor ICs and various capacitors and electrodes, and are widely used in advanced electronic products such as PCBs, ELs, touch panels, RFID, LCDs, PDPs, and solar cells. As the related industries expand and develop, the demand also increases.
- the solar cell uses solar heat to generate the steam needed to rotate the turbine and the characteristics of the semiconductor It is classified as a photovoltaic cell that converts photons into electrical energy, and a solar cell generally refers to a photovoltaic cell (hereinafter referred to as a solar cell).
- FIG. 1 is a cross-sectional view showing the basic structure of a silicon solar cell.
- the silicon solar cell includes a substrate 101 made of a p-type silicon semiconductor and an emitter layer 102 made of an n-type silicon semiconductor, and a diode is provided at the interface between the substrate 101 and the emitter layer 102. Similarly, pn junctions are formed.
- Figure 2 briefly shows the configuration of the front electrode in the solar cell structure.
- the front electrode of the solar cell is formed Ag on the front surface of the substrate, and includes a conductive aluminum and silver on the back. At this time, the front electrode is not shown in the figure, but is connected to the emitter layer through the anti-reflection film when forming a silicon solar cell.
- Electrons and electrons generated by the photovoltaic effect are attracted to the n-type silicon semiconductor and the p-type silicon semiconductor, respectively, and the front electrode 103 and the rear electrode 104 bonded to the lower portion of the substrate 101 and the upper portion of the emitter layer 102, respectively. ), The current flows when the electrodes 103 and 104 are connected by wires.
- the conductive metal paste is used for manufacturing the front electrode or the back electrode in the solar cell, and as described above, is used for manufacturing various electrodes in other electronic products.
- the front electrode (Ag electrode) of commercially available crystalline silicon solar cell is screen Through the printing process.
- the line width of the front electrode formed on the front surface of the silicon substrate should be finer and the height should be higher.
- An object of the present invention is to make stable contact between the front electrode and the emitter of the solar cell during heat treatment, and to improve the printability of the electrode can realize the fine line width and high aspect ratio of the electrical characteristics by improving the light conversion conversion efficiency of the solar cell To provide a silver paste composition for forming an electrode and a silicon solar cell using the same.
- the present invention is a silver paste composition of about 90,000 to 500,000 cP (Brookfield viscometer, spindle 14, measuring temperature 25 ° C) containing silver powder, glass frit powder, organic binder and carbon black,
- the carbon black has an average particle diameter of about 0.1 kPa to 0.5 / m, a specific surface area of about 100 to 200 mVg, and about 1 to about the entire silver paste composition.
- the silver powder preferably comprises a spherical silver powder having an average particle diameter of about 1 to 3 and a flake silver powder having an average particle diameter of about 1 to 3 mm 3.
- the content of the spherical silver powder having an average particle diameter of about 1 to 3 / zm may be about 70 to 85 wt% based on the total silver paste composition. Also above The content of silver powder in the form of flakes having an average particle diameter of about 1/3 may be about 1 to 5% by weight based on the total silver paste composition.
- the present invention can provide a solar cell front electrode formed using the silver paste composition.
- the light conversion conversion efficiency of the crystalline silicon solar cell consisting of the electrode may be about 17 to 18%.
- a silicon semiconductor substrate In addition, according to the present invention, a silicon semiconductor substrate;
- the front electrode provides a silicon solar cell formed by applying and firing the silver paste composition in a predetermined pattern on the anti-reflection film.
- the silver paste composition for forming an electrode of the present invention carbon black having specific parameter properties is added, so that a stable fire-through occurs when the front electrode heat-treats the printed solar cell, thereby improving the fill factor.
- the carbon black has a high aspect ratio when the pattern is manufactured by screen printing by improving the rheological properties of the paste, thereby improving the electrical properties of the solar cell.
- FIG. 2 is a schematic view of a solar cell produced using the front electrode-forming silver paste for Joe "Dangerous to the present invention.
- Example 3 is a graph showing a comparison of the light conversion conversion efficiency of the solar cells of Example 1 and Comparative Example 1 according to the present invention.
- T.I thixotropic index
- FIG. 5 is an electron micrograph showing a structure in which the electrode of the solar cell implemented in Example 1 has a narrow line width and a high constitution.
- Example 6 is an electron micrograph showing an enlarged interface between an electrode and silicon after etching and removing the electrode of the silicon solar cell implemented in Example 1;
- An object of the present invention is to provide a silver paste composition for forming an electrode and a silicon solar cell using the same.
- the silver paste having a viscosity of about 90,000 to 500,000 cP (Brookfield viscometer, spindle 14, measuring temperature 25 ° C) including silver powder, glass frit powder, organic binder and carbon black
- the carbon black has an average particle diameter of about 0.1 to 0.5, a specific surface area of about 100 to 200 mVg, and comprises about 1 to 10% by weight of the total silver paste composition. do.
- the silver paste composition for forming an electrode of the present invention has an average particle diameter of about
- the carbon black may have an average particle diameter of about 0.9 mi to 0.4 and a specific surface area of about 120 to 150 mVg.
- the carbon black is a particle having a primary average particle size of 10 to 50 nm, a specific surface area of 50 to 400 ni7g, preferably a primary average particle size of 20 to 30 nm and a specific surface area of 100 to 50 nm.
- the particles having a second average particle size of 0.5 to 2 may be formed by coagulating the particles having an irf / g of 200 irf / g, and those formed by grinding the particles may be used.
- the final obtained silver paste composition includes carbon blocks of fine particles having the above-described size and specific surface area, and thus, when forming a pattern through screen printing, the resulting high paste yields higher light conversion efficiency.
- the present invention can improve the rheological properties associated with the viscosity and adhesion of the paste. Therefore, in the present invention, a stable fire-through is performed during heat treatment of the front electrode using the silver paste composition to improve the filling coefficient.
- the pattern when the pattern is manufactured by a screen printing process that is generally performed during electrode manufacturing, the pattern can be easily adjusted to realize a fine line width and a high aspect ratio.
- the average particle diameter of the carbon black is less than 0.1 ⁇ there is a problem of increasing the viscosity of the paste, there is a problem that when it is more than 0.5 and the other the dispersion of the solid content of the paste composition is reduced, lowering the electrical performance.
- the specific surface area of the carbon black is less than about 100 mVg
- the carbon black included in the silver paste composition may satisfy the above-described ranges of the average particle diameter and specific surface area, thereby obtaining a paste having a desired viscosity, thereby realizing high consensus and fine pattern of the final pattern.
- the average particle diameter of the parameter condition of the carbon black in the final silver paste composition satisfies the range of the present application, there is a problem that the thixotropic property is lowered if the specific surface area is outside the range of the present application.
- the content of the carbon black in the present invention may be included in about 1 to 10% by weight based on the total silver paste composition, more preferably about 3 to 7% by weight, most preferably about 3 to 4% by weight It is good to be. If the content of the carbon black is less than about 1% by weight, the thixotropic index (T.I) of the paste may be lowered. If the content of the carbon black exceeds 10% by weight, mask clogging may occur during screen printing.
- T.I thixotropic index
- the silver powder used in the present invention may be a mixture containing a spherical silver powder having an average particle diameter of about 3 mm 3 and a silver powder in the form of flakes having an average particle diameter of about 1-3.
- the content of the spherical silver powder having an average particle diameter of about 1 / m to 3 ⁇ is preferably about 70 to 85% by weight based on the total silver paste composition.
- the content of the silver powder of the flake type (flake type) having an average particle diameter of about 1 to 3 is preferably about 1 to 5% by weight based on the total silver paste composition.
- the average particle diameter of each silver powder is less than about 1
- the fire-though does not occur evenly, and if it exceeds about 3 /
- the viscosity of the paste is lowered and the aspect ratio of the pattern is lowered.
- the content of the spherical silver powder having an average particle diameter of about 1 to 3 mm is less than about 70 wt%
- the resistance of the electrode is increased, and when it exceeds about 85 wt%, the flowability between the powders suitable for the printability of the paste is increased. There is a problem of deterioration.
- the content of the silver powder in the form of flakes having an average particle diameter of about 1/3 is less than about 1% by weight, there is a problem that the contact with the emitter layer is not sufficiently made, about 5 weight 3 ⁇ 4> If it exceeds, there exists a problem that the flowability of the paste suitable for printing falls.
- the glass frit powder that can be used in the present invention may be used without limitation the glass frit used in the art.
- glass frit powders may include bismuth-based compounds that do not contain lead.
- Bi 2 0 3 -B 2 0 3 -Si0 2 type , or Bi 2 0 3 -B 2 0 3 -Zn0 type powder, or the like may be used alone or in combination of two or more kinds, but is not limited thereto. Do not.
- the content of the glass frit and the organic binder is easy to form the electrode, has a very easy viscosity for screen printing, and if the range can exhibit a suitable aspect ratio by preventing the paste from falling after screen printing,
- the range is not particularly limited.
- the content of the glass frit is preferably about 1 to 5% by weight based on the total silver paste composition, more preferably about 2 It is preferably from 3% by weight.
- the content of the organic binder is preferably about 5 to 15% by weight based on the total silver paste composition, more preferably about 8 to 12% by weight.
- the silver paste composition of the present invention may further include additional additives without departing from the scope of the present invention.
- electroconductive metal particle, an antifoamer, a dispersing agent, a plasticizer, etc. can be further added to the composition of this invention as needed.
- the silver paste composition of the present invention may further include an organic solvent.
- the silver paste composition of the present invention is not particularly limited in the production method, it can be produced by a method well known in the art.
- the silver paste composition may be prepared by adding the spherical and flake shaped silver powder, the glass frit powder, the binder, and the carbon black powder simultaneously into a mixer and mixing the same.
- the carbon black may be mixed first, and then pulverized so that the carbon black has an appropriate average particle size range.
- the viscosity of the silver paste composition of the present invention obtained by this method may be about 90,000 to 500,000 cP, more preferably about 100,000 to 500000 cP.
- each said viscosity uses the Brookfield viscometer and means the value measured on the conditions of spindle 14 and the measurement temperature of 25 degreeC .
- Such front electrodes may be prepared by methods well known in the art, and the method is not particularly limited. Then, the manufacturing method of the front electrode using the silver paste for front electrode formation which concerns on this invention is demonstrated to an example more specifically.
- the manufacturing method of the front electrode of the present invention may include the step of coating and baking the silver paste composition on a substrate in a predetermined pattern.
- the substrate may include an anti-reflection film and an emitter layer.
- the substrate may be a substrate used in manufacturing a conventional semiconductor device, for example, a silicon substrate may be preferably used.
- the thickness of the silver paste composition coated on the substrate is not particularly limited, but is preferably about 20 to 40 in consideration of stable electrical conductivity.
- the rheological properties of the silver paste are improved by carbon blocks satisfying specific parameter conditions included in the silver paste composition, thereby solving the problem of narrowing the existing heat treatment condition range to 790 to 820 ° C. Can be. Therefore, according to the present invention, firing may be performed for 30 seconds to 1 minute in a wide range of peak temperature 700 to 900 ° C., preferably 750 to 850 ° C.
- the carbon black is burned out by firing the substrate, but since the carbon black is effectively used to improve the rheological properties of the silver paste, it is possible to improve the electrical characteristics of the solar cell.
- the present invention provides a solar cell comprising a front electrode prepared using the silver paste composition.
- the solar cell may be a silicon solar cell.
- the present invention is a silicon semiconductor substrate; An emitter layer formed on the substrate; An anti-reflection film formed on the emitter layer; A front electrode penetrating the antireflection film and connected to the emitter layer; And a back electrode connected to a rear surface of the substrate, wherein the front electrode provides a silicon solar cell formed by coating and firing the silver paste composition on the antireflection film in a predetermined pattern.
- FIG. 2 a silicon solar cell using the silver paste composition of the present invention will be described with reference to FIG. 2 as an example.
- the embodiments described in the specification and the drawings shown below are only the most preferred embodiment of the present invention and represent all of the technical idea of the present invention Therefore, it should be understood that there may be various equivalents and modifications that can substitute for them at the time of the present application.
- FIG. 2 is a schematic view of a solar cell produced using the silver paste composition for forming a front electrode of the present invention.
- the silicon solar cell according to the present invention includes a silicon semiconductor substrate 201, an emitter layer (not shown) formed on the substrate 201, and an antireflection film 202 formed on the emitter layer. And a front electrode 203 which penetrates the antireflection film 202 and is connected to the upper surface of the emitter layer, and a rear electrode 205 which is connected to the rear surface of the substrate 201.
- a back surface field (BSF) layer 204 which is a p + layer, may be formed between the back electrode and the substrate and, in the case of the back electrode, includes a Ag pattern 206 having a predetermined pattern.
- the substrate 201 may be doped with impurities such as group III elements B, Ga, In, etc.
- the antireflective film 202 immobilizes defects (eg, dangling bonds) present in the surface or bulk of the emitter layer and reduces the reflectance of sunlight incident on the front surface of the substrate 201. Immobilization of defects in the emitter layer eliminates the recombination sites of minority carriers and increases the open voltage of the solar cell. When the reflectance of the solar light is reduced, the amount of light reaching the p-n junction is increased to increase the short circuit current of the solar cell. As such, when the open circuit voltage and the short circuit current of the solar cell are increased by the anti-reflection film 202, the conversion efficiency of the solar cell is improved by that much.
- defects eg, dangling bonds
- the anti-reflection film 202 is any one selected from the group consisting of a silicon nitride film, a silicon nitride film containing hydrogen (SiNx), a silicon oxide film, a silicon oxynitride film, MgF 2 , ZnS, MgF 2 , Ti0 2 and Ce0 2 , for example. It may have a single film or a multi-film structure in which two or more material films are combined, but is not limited thereto. It is not.
- the anti-reflection film 202 may be formed by vacuum deposition, chemical vapor deposition, spin coating, screen printing, or spray coating. However, the method of forming the anti-reflection film 202 according to the present invention is not limited thereto.
- the front electrode 203 and the back electrode 205 are metal electrodes made of silver and aluminum, respectively.
- the front electrode 203 can be made using the silver paste composition of the present invention and the back electrode 205 is made using a conventional aluminum paste composition.
- the silver electrode is excellent in electrical conductivity, and the aluminum electrode is not only excellent in electrical conductivity, but also has an excellent affinity with the substrate 201 made of a silicon semiconductor, which has the advantage of good bonding.
- the front electrode 203 and the back electrode 205 can be manufactured by various known techniques, but are preferably formed by screen printing. That is, the front electrode 203 is formed by screen printing the silver paste composition of the present invention described above on the front electrode formation point and then performing heat treatment. When the heat treatment is performed, the front electrode penetrates the antireflection film 202 and is connected to the emitter layer 202 by a punch through phenomenon.
- the back electrode 205 is formed by printing on the back surface of the substrate 201 using heat paste after the aluminum paste for back electrode, in which ordinary aluminum, quartz silica, binder, or the like is added.
- aluminum an electrode constituent material
- the back surface of the substrate 201 is formed by heat treatment of the back electrode, aluminum, an electrode constituent material, is diffused through the back surface of the substrate 201 to form a back surface field layer 204 on the interface between the back electrode 205 and the substrate 201. have.
- carriers may be prevented from moving back to the back of the substrate 201 and recombining. When recombination of the carrier is prevented, the open circuit voltage and the layer realization are increased, thereby improving the conversion efficiency of the solar cell.
- a back Ag pad 206 which is a back Ag pattern 206, may be formed in a predetermined pattern by a conventional deposition or screen printing method.
- the printing method for forming the front electrode and the back electrode described above In addition to screen printing, conventional methods such as doctor blade, ink jet printing, and gravure printing can be used.
- the silver paste composition was prepared by mixing and pulverizing each component with the composition and content shown in Table 1 below (unit: weight%).
- a silver paste including carbon black coagulated by mixing carbon black with silver powder, glass frit powder, and an organic binder was prepared.
- the viscosity of the prepared silver paste of Examples 1 to 4 was 250,000 cP, 80,000 cP, 40,000 cP and 150,000 cP, respectively.
- the silver pastes were pulverized using a 3-mill each to cause the particles in the silver paste to be pulverized evenly.
- a silver paste including carbon black having an average particle diameter of 0.1 was prepared.
- the viscosity of the silver paste of the finally obtained Examples 1-4 was 300,000 cP, 90,000 cP 500,000 cP, and 200,000 cP, respectively.
- the silver powder is a mixture of 80% by weight of the spherical silver powder having an average particle diameter of 1 to 3 and 2% by weight of the silver powder of the flake form having an average particle diameter of 2, and the glass frit contains bismuth oxide.
- Bi 2 0 3 -3 ⁇ 40 3 -Si0 2 with an average particle diameter of 10 / zm was used, and the organic binder was ethyl salose.
- the carbon black in each Example used the particle
- the silver paste composition was prepared by simply mixing each component with the composition and content of Table 1 below (unit: weight%).
- Comparative Example 1 no carbon black was used, and Comparative Examples 2 and 3 used carbon black in an amount of 12 wt% and 0.5 wt%, respectively.
- Comparative Example 4 an average particle diameter of 20 nm and a specific surface area of 70 mVg were used.
- Comparative Example 5 an average particle diameter of 30 nm and a specific surface area of 200 mVg were used.
- Comparative Example 6 instead of carbon black, an average particle diameter of 3 and a specific surface area of .20 mVg were used.
- Comparative Example 7 carbon black having an average particle diameter of 0.3 and a specific surface area of 220 mVg was used.
- Comparative Example 8 carbon black having an average particle diameter of 1 m and a specific surface area of 200 mVg was used.
- the viscosity of the silver paste composition of Comparative Examples 1-5 showed -270,000 cP, 600,000 cP, 100,000 cP, 200,000 cP, 350,000 cP, respectively.
- Carbon black average particle size 20nm, specific surface area 70mVg
- Carbon black average particle diameter 30nm, specific surface area 200mVg
- Carbon Black Average particle size 1 / m and specific surface area 200mVg
- Examples 1 to 4 of the present invention by using a silver paste containing a carbon block of the fine particles, it was possible to achieve a high aspect ratio when manufacturing the pattern by screen printing. Therefore, Examples 1 to 4 showed overall excellent battery characteristics compared to Comparative Examples 1 to 8, in particular, it was confirmed that the light conversion conversion efficiency is better. On the other hand, when the carbon black of the present invention is not used or by a pendulum as in Comparative Examples 1 and 6, it can be seen that the battery efficiency is lowered and the filling factor value is also lowered.
- Figure 3 is a graph showing the comparison of the optical conversion conversion efficiency of the solar cell of ⁇ Example 1 and Comparative Example 1 according to the present invention.
- Example 1 of the present invention not only implements a fine line width but also has excellent ohmic contact (ohmic contact) as the FF value is improved, the energy conversion efficiency is superior to the solar cell of Comparative Example 1 It was.
- Example 1 the viscosity at lrpm and lOrpm were analyzed by a viscometer to measure the thixotropic index (T.I.), and the results are shown in FIG. 4.
- Example 1 has rheological properties capable of confirming a pattern having a higher aspect ratio without line spread in screen printing than Comparative Example 1.
- FIG. 5 shows an electron micrograph showing a structure in which the electrode of the solar cell of Example 1 has a narrow line width and high consensus. 5, it can be seen that the electrode implemented according to the present invention implements a fine line width and exhibits a high aspect ratio.
- FIG. 6 is an electron micrograph showing an enlarged interface between the electrode and the silicon substrate after etching the electrode of the silicon solar cell implemented in Example 1. 6, the electrode of Example 1 is uniformly formed with the light emitting layer of the substrate. It can be seen that Ag is stably recrystallized by ohmic-contact. That is, FIG. 6 is an electron micrograph showing a state in which Ag is formed in the emitter layer in the electrode of the solar cell of Example 1 to form a stable ohmic-contact.
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Abstract
Description
Claims
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CN201180055844.0A CN103222011B (zh) | 2010-11-18 | 2011-11-18 | 银糊组合物及使用其的太阳能电池和太阳能电池前电极 |
US13/885,988 US9640298B2 (en) | 2010-11-18 | 2011-11-18 | Silver paste composition for forming an electrode, and silicon solar cell using same |
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US (1) | US9640298B2 (ko) |
KR (1) | KR101595035B1 (ko) |
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CN104137194A (zh) * | 2012-02-27 | 2014-11-05 | E.I.内穆尔杜邦公司 | 银浆及其在太阳能电池生产中的用途 |
KR101596548B1 (ko) * | 2013-03-27 | 2016-02-22 | 제일모직주식회사 | 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극 |
TWI480357B (zh) * | 2013-12-17 | 2015-04-11 | Ind Tech Res Inst | 導電膠組成物與電極的形成方法 |
Citations (4)
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JPH11330506A (ja) * | 1998-05-11 | 1999-11-30 | Matsushita Battery Industrial Co Ltd | 太陽電池およびその電極の製造方法 |
JP2005317898A (ja) * | 2004-03-31 | 2005-11-10 | Toyo Aluminium Kk | ペースト組成物およびそれを用いた太陽電池素子 |
KR20090126427A (ko) * | 2008-06-04 | 2009-12-09 | 주식회사 엘지화학 | 전극형성용 금속 페이스트 조성물 및 그 제조 방법과 그를이용한 실리콘 태양전지 |
KR20100042766A (ko) * | 2008-10-17 | 2010-04-27 | 대주전자재료 주식회사 | 도전성 페이스트 조성물, 이를 이용한 전극의 제조방법 및 이를 포함하는 태양전지 |
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WO2009098938A1 (ja) * | 2008-02-06 | 2009-08-13 | Namics Corporation | 熱硬化性導電ペースト、及びそれを用いて形成した外部電極を有する積層セラミック電子部品 |
US20090266409A1 (en) * | 2008-04-28 | 2009-10-29 | E.I.Du Pont De Nemours And Company | Conductive compositions and processes for use in the manufacture of semiconductor devices |
US20120000523A1 (en) * | 2008-06-04 | 2012-01-05 | Lg Chem, Ltd. | Metal paste composition for forming electrode and silver-carbon composite electrode and silicon solar cell using the same |
US7976734B2 (en) * | 2008-09-10 | 2011-07-12 | E.I. Du Pont De Nemours And Company | Solar cell electrodes |
WO2010103998A1 (ja) | 2009-03-11 | 2010-09-16 | 信越化学工業株式会社 | 太陽電池セル電極の接続用シート、太陽電池モジュールの製造方法及び太陽電池モジュール |
-
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- 2011-11-18 US US13/885,988 patent/US9640298B2/en active Active
- 2011-11-18 CN CN201180055844.0A patent/CN103222011B/zh active Active
- 2011-11-18 KR KR1020110120750A patent/KR101595035B1/ko active IP Right Grant
- 2011-11-18 WO PCT/KR2011/008843 patent/WO2012067463A2/ko active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11330506A (ja) * | 1998-05-11 | 1999-11-30 | Matsushita Battery Industrial Co Ltd | 太陽電池およびその電極の製造方法 |
JP2005317898A (ja) * | 2004-03-31 | 2005-11-10 | Toyo Aluminium Kk | ペースト組成物およびそれを用いた太陽電池素子 |
KR20090126427A (ko) * | 2008-06-04 | 2009-12-09 | 주식회사 엘지화학 | 전극형성용 금속 페이스트 조성물 및 그 제조 방법과 그를이용한 실리콘 태양전지 |
KR20100042766A (ko) * | 2008-10-17 | 2010-04-27 | 대주전자재료 주식회사 | 도전성 페이스트 조성물, 이를 이용한 전극의 제조방법 및 이를 포함하는 태양전지 |
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WO2012067463A3 (ko) | 2012-08-23 |
US20130306144A1 (en) | 2013-11-21 |
US9640298B2 (en) | 2017-05-02 |
CN103222011A (zh) | 2013-07-24 |
CN103222011B (zh) | 2016-04-20 |
KR101595035B1 (ko) | 2016-02-17 |
KR20120053978A (ko) | 2012-05-29 |
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