WO2012066973A1 - Procédé de fabrication d'un substrat de circuit multicouche flexible - Google Patents

Procédé de fabrication d'un substrat de circuit multicouche flexible Download PDF

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Publication number
WO2012066973A1
WO2012066973A1 PCT/JP2011/075669 JP2011075669W WO2012066973A1 WO 2012066973 A1 WO2012066973 A1 WO 2012066973A1 JP 2011075669 W JP2011075669 W JP 2011075669W WO 2012066973 A1 WO2012066973 A1 WO 2012066973A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
insulating film
circuit
transfer
layer
Prior art date
Application number
PCT/JP2011/075669
Other languages
English (en)
Japanese (ja)
Inventor
大助 寺師
佐藤　禎倫
隆司 松川
Original Assignee
株式会社フジクラ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社フジクラ filed Critical 株式会社フジクラ
Publication of WO2012066973A1 publication Critical patent/WO2012066973A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer

Definitions

  • the present invention relates to a method for manufacturing a flexible multilayer circuit board, and more particularly to a method for manufacturing a flexible multilayer circuit board that can stably produce a flexible multilayer circuit board.
  • a flexible multilayer circuit board in which a plurality of flexible circuit boards each having a circuit layer formed on a flexible base film is used is used. There is.
  • Patent Document 1 describes a method for manufacturing such a flexible multilayer circuit board.
  • a circuit layer made of copper foil or the like is formed on a flexible base film to obtain a flexible circuit board. Then, in the part of the part where the circuit layer is formed in each flexible circuit board, leaving only the circuit layer and peeling the base film, the both sides of the circuit layer are exposed in the part where the base film is peeled off. And make it a bridge without support. Then, the flexible circuit boards are laminated and bonded so that the bridge portions of the circuit layer overlap each other. Thereafter, the circuit layers of the flexible circuit boards are connected to each other by welding at the portion where the circuit layers of the flexible circuit boards are bridged, and the circuit layers formed on the flexible circuit boards are electrically connected to each other.
  • an object of the present invention is to provide a method for manufacturing a flexible multilayer circuit board that can stably manufacture the flexible multilayer circuit board.
  • the method for producing a flexible multilayer circuit board of the present invention comprises a pair of transfer circuit boards in which a circuit layer is formed on a flexible base film, and a preparation step of preparing an insulating film in which through holes are formed.
  • the transfer circuit board has the surface on which the circuit layer is formed facing toward the insulating film, and the transfer hole is placed on both sides of the insulating film so that the through holes and a part of the circuit layer overlap each other. Bonding step of bonding the circuit board for use, a peeling step of peeling the base film of each of the circuit boards for transfer bonded to the insulating film from the circuit layer, and both surfaces of the insulating film in the through hole A connection step of connecting the circuit layers together by welding.
  • the base film is peeled off after the respective transfer circuit boards are bonded to both sides of the insulating film, so when the transfer circuit board is bonded to the insulating film, Even when stress is applied to the circuit board for transfer, the base film can suppress deformation of the insulating film in the vicinity of the through hole, and the circuit layer can be prevented from being disconnected by deformation of the insulating film. And after disconnection is prevented in this way and laminated
  • the flexible multilayer circuit board can be stably manufactured.
  • At least a part of the circuit layer may be an antenna.
  • a method for manufacturing a flexible multilayer circuit board capable of stably manufacturing a flexible multilayer circuit board is provided.
  • FIG. 1 is a plan view showing a flexible multilayer circuit board according to an embodiment of the present invention. It is sectional drawing in the II-II line of FIG. It is a flowchart which shows the manufacturing method of the flexible multilayer circuit board of FIG. It is a figure which shows the mode after a preparatory process. It is a figure which shows the mode after a bonding process. It is a figure which shows the mode after a peeling process. It is a figure which shows the mode of a connection process.
  • FIG. 1 is a plan view showing a flexible multilayer circuit board according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view taken along the line II-II in FIG.
  • the flexible multilayer circuit board 1 of the present embodiment includes an insulating film 30, a first circuit layer 10 provided on one surface of the insulating film 30, and the other surface of the insulating film 30. And the second circuit layer 20 provided in the main structure.
  • the insulating film 30 is made of an insulating resin having flexibility. As shown in FIGS. 1 and 2, the insulating film 30 is formed with a pair of circular through holes 31 a and 31 b.
  • the material of the insulating film 30 is not particularly limited, and examples thereof include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), and the like.
  • the first circuit layer 10 includes an antenna 13 and a pair of first connection portions 11 a and 11 b connected to both ends of the antenna 13.
  • the pair of first connection portions 11a and 11b are circular with a diameter larger than that of the through holes 31a and 31b, and the pair of penetrations formed in the insulating film 30 when the flexible multilayer circuit board 1 is viewed in plan view. It is formed so as to cover the holes 31a and 31b.
  • the antenna 13 has a thin conductor formed in a line shape having a substantially rectangular loop shape, and the first connection portion 11a is connected to the outer peripheral end of the antenna 13 so that the antenna A first connection portion 11b is connected to an end portion on the inner peripheral side of 13.
  • the material of the antenna 13 is not particularly limited as long as it is a conductive material, and examples thereof include metals such as copper (Cu), nickel (Ni), and aluminum (Al). Moreover, the material of the 1st connection parts 11a and 11b consists of a conductive material which can be welded, and the metal similar to the antenna 13 is mentioned as such a material.
  • the antenna 13 and the first connecting portions 11a and 11b may be made of the same material, or may be made of different materials.
  • the second circuit layer 20 includes a pair of circuit layers 20a and 20b.
  • the pair of circuit layers 20a and 20b are connected to the lines 23a and 23b and one end of each of the lines 23a and 23b.
  • Second connection portions 21a and 21b, and terminals 22a and 22b connected to the other ends of the respective lines 23a and 23b.
  • Each of the second connection portions 21a and 21b has substantially the same size and the same shape as the first connection portions 11a and 11b, and when the flexible multilayer circuit board 1 is viewed in plan as shown in FIG.
  • Each of the first circuit layers 10 is provided at a position overlapping the first connection portions 11a and 11b.
  • the size of the second connection portions 21a and 21b is written slightly larger than that of the first connection portions 11a and 11b for easy understanding.
  • the terminals 22a and 22b are provided outside the outer periphery of the antenna 13, and have substantially the same size and the same shape as the second connection portions 21a and 21b.
  • the pair of lines 23a and 23b are linearly formed from the second connection portions 21a and 21b to the terminals 22a and 22b, respectively.
  • the materials of the terminals 22a and 22b and the lines 23a and 23b are not particularly limited as long as they are conductive materials.
  • the same material as the material of the antenna 13 can be used.
  • the material of the second connection portions 21a and 21b is made of a conductive material that can be welded. Examples of such a material include the same materials as those of the first connection portions 11a and 11b.
  • each terminal 22a, 22b, each line 23a, 23b, and each 2nd connection part 21a, 21b may be comprised from the same material, and each may be comprised from another material. good.
  • the 1st connection part 11a and the 2nd connection part 21a are connected by welding in the through-hole 31a, and the 1st connection part 11b and the 2nd connection part 21b pass through.
  • the holes 31b are connected by the same method.
  • the first circuit layer 10 is covered with a protective layer 41 on the surface opposite to the insulating film 30 side, and the second circuit layer 20 is opposite to the insulating film 30 side.
  • This surface is covered with a protective layer 42 except for the terminals 22a and 22b.
  • a material of the protective layers 41 and 42 is not particularly limited as long as it is an insulating material, and examples thereof include resins such as polyimide. In FIG. 1, the protective layers 41 and 42 are not shown.
  • a plurality of through holes 39 used in the manufacturing process of the flexible multilayer circuit board 1 are formed in the insulating film 30.
  • the flexible multilayer circuit board 1 is an antenna device having terminals 22a and 22b as external terminals.
  • FIG. 3 is a flowchart showing a method for manufacturing the flexible multilayer circuit board of FIG.
  • the manufacturing method of the flexible multilayer circuit board 1 of this embodiment includes a preparation process P1, a bonding process P2, a peeling process P3, a connection process P4, and a protection process P5.
  • a second transfer circuit board 16 having the second circuit layer 20 formed on one surface thereof and an insulating film 30 having through holes 31a and 31b are prepared.
  • PI and PET are mentioned.
  • the first transfer circuit board 16 is prepared as follows. First, the base film 15 is prepared, and a metal layer to be the first circuit layer 10 is formed on the entire one surface of the base film 15. Formation of a metal layer is performed by sticking a metal layer on a base film using an adhesive. Next, a pinnacle cutter having the same shape as that of the first circuit layer 10 is prepared, and only the metal layer is cut into the same shape as the first circuit layer 10 with this pinnacle cutter. Then, the first transfer circuit board 16 shown in FIG. 4 may be obtained by peeling off and removing the unnecessary metal layer.
  • the thickness of the metal layer is not particularly limited, but is preferably 6 ⁇ m to 18 ⁇ m from the viewpoint of obtaining a predetermined strength.
  • a mask is formed with a resist or the like on the portion of the metal layer that becomes the first circuit layer 10, and unnecessary metal is etched.
  • the first transfer circuit board 16 shown in FIG. 4 is obtained by removing the layer and then removing the resist.
  • a plurality of through holes 19 are formed in the base film 15 at the same positions as the plurality of through holes 39 formed in the insulating film 30 shown in FIG. 1.
  • the through hole 19 may be formed by punching or the like.
  • the second transfer circuit board 26 is prepared on the second surface of the base film 25 by the same method as that for preparing the base film 25 and forming the first circuit layer 10 on the base film 15.
  • a circuit layer 20 is formed.
  • the base film 25 has a plurality of through holes 29 at the same position as the plurality of through holes 39 formed in the insulating film 30 shown in FIG. Form.
  • the second circuit layer 20 is formed on the base film 15 of the second transfer circuit board 26 and the positions of the plurality of through holes 19 formed in the base film 15 of the first transfer circuit board 16.
  • the second connection portions 21 a and 21 b are respectively connected to the first circuit layer 10.
  • the terminals 22 a and 22 b are provided outside the outer periphery of the antenna 13 so as to overlap the first connection portions 11 a and 11 b. In this way, the second transfer circuit board 26 shown in FIG. 4 is obtained.
  • the insulating film 30 prepares a flexible insulating film constituting the insulating film 30, and forms the through holes 31 a and 31 b and the plurality of through holes 39.
  • the plurality of through holes 39 are formed at the same positions as the plurality of through holes 19 formed in the base film 15 of the first transfer circuit board 16. And when the through-holes 31a and 31b match
  • the formation of the through holes 31a and 31b and the plurality of through holes 39 is not particularly limited, but may be formed by punching, for example.
  • a thermoplastic resin as an adhesive is applied to both surfaces of the insulating film 30.
  • the adhesive strength of the thermoplastic resin is that the adhesive that bonds the base film 15 of the first transfer circuit board 16 and the first circuit layer 10 and the base film 25 of the second transfer circuit board 26 and the first film It has stronger adhesive force than the adhesive that bonds the two circuit layers 20 together. In this way, the insulating film 30 shown in FIG. 4 is obtained.
  • the positions of the insulating film 30 and the second transfer circuit board 26 are aligned by using the plurality of through holes 29 of the second transfer circuit board 26 as pins of the jig described above.
  • the first transfer circuit board 16, the insulating film 30, and the second transfer circuit board 26 are aligned and overlapped with each other, and the through holes 31 a and 31 b of the insulating film 30 and the first transfer circuit board 16 are overlapped.
  • the first connection portions 11a and 11b and the second connection portions 21a and 21b of the second transfer circuit board 26 are overlapped with each other.
  • the first transfer circuit board 16, the insulating film 30, and the second transfer circuit board 26 are preferably temporarily fixed with an adhesive (not shown) from the viewpoint of preventing positional deviation.
  • the temperature of the roll press is a temperature at which the thermoplastic resin as the adhesive applied to the insulating film 30 is melted and the first transfer circuit board 16, the insulating film 30, and the second transfer circuit board 26 are not damaged.
  • the temperature is set to 150 ° C.
  • the first transfer portion 11a, 11b and the second connection portion 21a, 21b face each other through the through holes 31a, 31b, and the first transfer is performed on one surface of the insulating film 30.
  • the circuit board 16 for application is bonded, and the second transfer circuit board 26 is bonded to the other surface of the insulating film 30.
  • at least the insulating film 30 may be bonded to the first circuit layer 10 and the second circuit layer 20, and the base film 15 and the base film 25 are bonded to the insulating film 30. It is not necessary.
  • the base film 15 is peeled from the first transfer circuit board 16. That is, the base film 15 is peeled from the first circuit layer 10.
  • the base film 15 may be peeled by peeling the base film 15 from the insulating film 30.
  • the first transfer is performed using the adhesive having stronger adhesive force than the adhesive that bonds the base film 15 and the first circuit layer 10 in the first transfer circuit board 16. Since the circuit board 16 and the insulating film 30 are bonded together, the first circuit layer 10 remains on one surface of the insulating film 30 by peeling off the base film 15.
  • the base film 25 is peeled from the second transfer circuit board 26 in the same manner as the base film 15 is peeled off.
  • the base film 25 is peeled from the second circuit layer 20.
  • the second transfer is performed using the adhesive having stronger adhesive force than the adhesive that bonds the base film 25 and the second circuit layer 20 in the second transfer circuit board 26. Since the circuit board 26 and the insulating film 30 are bonded together, the second circuit layer 20 remains on the other surface of the insulating film 30 by peeling off the base film 25.
  • the first circuit layer 10 is formed on one surface of the insulating film 30, and the second circuit layer 20 is formed on the other surface of the insulating film 30.
  • connection process P4 Next, in each of the through holes 31a and 31b, the first connection portions 11a and 11b of the first circuit layer 10 formed on one surface of the insulating film 30 and the other surface of the insulating film 30 are formed.
  • the second connection portions 21a and 21b of the second circuit layer 20 are connected. As shown in FIG. 7, this connection is performed by sandwiching the first connection portion 11a and the second connection portion 21a between the electrodes 51a and 52a. Examples of this welding include resistance welding, ultrasonic welding, and laser welding.
  • the 1st connection part 11b and the 2nd connection part 21b are inserted
  • the protective layer 41 can be provided, for example, by applying an uncured ultraviolet curable resin and then curing the ultraviolet curable resin, or by attaching an insulating film.
  • a portion other than the terminals 22 a and 22 b on the other surface of the insulating film 30 on which the second circuit layer 20 is formed is covered with the protective layer 42.
  • the protective layer 42 may be provided by the same method as the protective layer 41, for example. In this way, the flexible multilayer circuit board 1 shown in FIGS. 1 and 2 is obtained.
  • the respective base films 15. , 25 are peeled off, and stress is applied to the first transfer circuit board 16 and the second transfer circuit board 26 when the first transfer circuit board 16 and the second transfer circuit board 26 are bonded to the insulating film 30.
  • the insulating films near the through holes 31a and 31b can be suppressed by the base films 15 and 25, the first circuit layer 10 or the second circuit layer 20 is disconnected due to the deformation of the insulating film. Can be prevented.
  • the flexible multilayer circuit board 1 can be manufactured stably.
  • the first transfer circuit board 16 and the second transfer circuit board 26 are bonded to the respective surfaces of the insulating film 30, and then the respective bases. Since the films 15 and 25 are peeled off and then connected by welding, the time during which the connecting portions of the first and second circuit layers 10 and 20 remain unsupported on the through holes 31a and 31b is shortened. Can do.
  • the first circuit layer 10 and the second circuit layer 20 may be damaged by touching other members or short-circuited. Can be prevented.
  • the first circuit layer 10 has the antenna 13, but an antenna may also be formed in the second circuit layer 20.
  • the antennas can be connected to form an antenna with higher radiation intensity or an antenna with a smaller area.
  • the antenna device is described as an example of the flexible multilayer circuit board 1, but the present invention is not limited to this and can be applied to other circuits.
  • the first and second transfer circuit boards 16 and 26 and the insulating film 30 are bonded to each other by using a strong adhesive, but the first and second circuit layers 10 and 20 are insulated in the peeling process.
  • the adhesive strength of the adhesive that bonds the first and second transfer circuit boards 16 and 26 and the insulating film 30 may have the same strength.
  • the first and second circuit layers 10 and 20 may be provided on the base films 15 and 25 by a method other than using an adhesive, and the base films 15 and 25 on the first and second transfer circuit boards 16 and 26 may be provided. 25 and the first and second circuit layers 10 and 20 may be bonded with an adhesive having a low strength.
  • the protective layers 41 and 42 are provided and the 1st circuit layer 10 and the 2nd circuit layer 20 are protected, the protective layers 41 and 42 are not essential, the protective layer 41, Only one of 42 may be provided.
  • a method for manufacturing a flexible multilayer circuit board capable of stably manufacturing the flexible multilayer circuit board 1 is provided.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne un procédé de fabrication de substrats de circuit multicouche flexibles, capable de fabriquer des substrats de circuit multicouche flexibles de façon stable. Le procédé de fabrication d'un substrat de circuit multicouche flexible (1) comprend : un processus de préparation (P1) destiné à préparer, sur des films de base (15, 25), des premier et second substrats de circuit de transfert (16, 26) présentant des première et seconde couches de circuit (10, 20) formées dessus, et un film isolant (30) dans lequel sont formés des trous traversants (31a, 31b) ; un processus de fixation (P2) destiné à fixer les premier et second substrats de circuit de transfert (16, 26) aux deux surfaces du film isolant (30), de sorte que les trous traversants (31a, 31b), les premières parties de connexion (11a, 11b) et les secondes parties de connexion (21a, 21b) se chevauchent ; un processus de décollement (P3) destiné à décoller les films de base (15, 25) des première et seconde couches de circuit (10, 20) ; et un processus de connexion (P4) destiné à connecter, par soudure, les première et seconde couches de circuit (10, 20) sur les deux surfaces du film isolant (30) au niveau des trous traversants (31a, 31b).
PCT/JP2011/075669 2010-11-17 2011-11-08 Procédé de fabrication d'un substrat de circuit multicouche flexible WO2012066973A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-257237 2010-11-17
JP2010257237A JP2012109406A (ja) 2010-11-17 2010-11-17 フレキシブル多層回路基板の製造方法

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Publication Number Publication Date
WO2012066973A1 true WO2012066973A1 (fr) 2012-05-24

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PCT/JP2011/075669 WO2012066973A1 (fr) 2010-11-17 2011-11-08 Procédé de fabrication d'un substrat de circuit multicouche flexible

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WO (1) WO2012066973A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5782013B2 (ja) * 2012-11-15 2015-09-24 日本メクトロン株式会社 フレキシブルプリント基板の接合方法
WO2015016353A1 (fr) 2013-08-02 2015-02-05 株式会社村田製作所 Dispositif d'antenne et terminal de communication

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03147393A (ja) * 1989-11-01 1991-06-24 Nitto Denko Corp 両面プリント板の製造法
JPH1187888A (ja) * 1997-09-03 1999-03-30 Mitsubishi Heavy Ind Ltd フィルム状絶縁基板の表裏面金属箔パターン部接続方法
JP2005123366A (ja) * 2003-10-16 2005-05-12 Nippon Kodoshi Corp 多層フレキシブル配線板の層間接続方法。

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0678705B2 (ja) * 1989-10-31 1994-10-05 スガツネ工業株式会社 扉等用ダンパー

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03147393A (ja) * 1989-11-01 1991-06-24 Nitto Denko Corp 両面プリント板の製造法
JPH1187888A (ja) * 1997-09-03 1999-03-30 Mitsubishi Heavy Ind Ltd フィルム状絶縁基板の表裏面金属箔パターン部接続方法
JP2005123366A (ja) * 2003-10-16 2005-05-12 Nippon Kodoshi Corp 多層フレキシブル配線板の層間接続方法。

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