WO2012066957A1 - Composition conductrice, film conducteur et procédé de formation d'un film conducteur - Google Patents

Composition conductrice, film conducteur et procédé de formation d'un film conducteur Download PDF

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Publication number
WO2012066957A1
WO2012066957A1 PCT/JP2011/075585 JP2011075585W WO2012066957A1 WO 2012066957 A1 WO2012066957 A1 WO 2012066957A1 JP 2011075585 W JP2011075585 W JP 2011075585W WO 2012066957 A1 WO2012066957 A1 WO 2012066957A1
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Prior art keywords
component
conductive composition
conductive film
conductive
weight
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PCT/JP2011/075585
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English (en)
Japanese (ja)
Inventor
高松　秀機
丸山　浩樹
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ナミックス株式会社
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Priority to JP2012544182A priority Critical patent/JP5881613B2/ja
Publication of WO2012066957A1 publication Critical patent/WO2012066957A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Definitions

  • the present invention relates to a conductive composition that can be used, for example, for forming a conductive film of an electronic component, and a method for forming a conductive film using the conductive composition.
  • a subtractive method and an additive method are known.
  • a conductive composition is applied onto a substrate using a technique such as screen printing to form a pattern, and the conductive composition (conductive circuit) is formed by firing the conductive composition at a predetermined temperature. It is formed.
  • Patent Document 1 discloses copper powder, a solvent composed of a polyhydric alcohol having two or more OH groups such as ethylene glycol and diethylene glycol, two or more COOH groups such as malic acid and citric acid, and one OH group.
  • An electrically conductive composition containing an additive composed of the above compound is disclosed. This conductive composition can be fired at a low temperature not only in an inert atmosphere but also in an air atmosphere. Moreover, according to this electroconductive composition, it is possible to prevent the copper particle which is a filler from oxidizing, and to form the electrically conductive film which has favorable electroconductivity.
  • the conductive composition disclosed in Patent Document 1 has a very limited temperature range of 150 ° C. to 200 ° C. in the atmosphere. For this reason, the conductive composition disclosed in Patent Document 1 has a problem that it is difficult to control the firing temperature and it is difficult to put it to practical use.
  • the present invention has been made in view of the above circumstances, and an object thereof is to provide a conductive composition that can be fired in an air atmosphere and a method for forming a conductive film using the same.
  • a conductive composition that can be fired in an air atmosphere can be obtained by adding a specific carboxylic acid and a specific amine compound to a metal powder mainly composed of a base metal such as copper.
  • the conductive composition of the present invention is (A) metal powder mainly composed of base metal; (B) an amine compound represented by the following general formula (1), or an aliphatic amine having two or more amino groups; (C) an aliphatic hydroxy acid; It is characterized by containing.
  • R 2 HN—R 1 —O—R 3 (1)
  • R 1 represents an alkylene group having 2 to 8 carbon atoms
  • R 2 and R 3 each represents an H atom or an alkyl group having 1 to 4 carbon atoms.
  • the component (B) is preferably an aliphatic amine having an OH group.
  • the component (B) is preferably at least one selected from 3-amino-1-propanol, 3-methoxypropylamine, N-methylethanolamine, and 1,3-diaminopropane. Particularly preferred is 1-propanol.
  • the component (C) is preferably at least one selected from glycolic acid, lactic acid, and citric acid, and particularly preferably glycolic acid.
  • the conductive composition of the present invention preferably further contains a linear epoxy resin having one or more OH groups in the molecule.
  • the component (A) is preferably at least one selected from copper, nickel, zinc, tin, and solder.
  • this invention provides the electrically conductive film obtained by apply
  • this invention provides the formation method of the electrically conductive film which has the heat processing process heated at 70 degreeC or more and 500 degrees C or less, after apply
  • the heat treatment step is preferably performed in an air atmosphere.
  • the conductive composition according to this embodiment includes (A) a metal powder mainly composed of a base metal, and (B) an amine compound represented by the following general formula (1), or a fat having two or more amino groups. A group amine and (C) an aliphatic hydroxy acid.
  • R 2 HN—R 1 —O—R 3 (1)
  • R 1 represents an alkylene group having 2 to 8 carbon atoms
  • R 2 and R 3 each represents an H atom or an alkyl group having 1 to 4 carbon atoms.
  • the “metal powder mainly composed of a base metal” as the component (A) means a metal powder containing a base metal in an amount of 50% by weight or more, preferably 70% by weight or more, more preferably 90% by weight or more. Therefore, if not only metal powder consisting of only a base metal but also metal powder consisting of a mixture of a base metal and another metal contains 50% by weight or more of the base metal, the “metal mainly composed of base metal” is used here. Included in "powder”.
  • the metal powder made of an alloy of a base metal and another metal also contains 50% by weight or more of tin which is a base metal, here It is included in the “metal powder mainly composed of base metals”.
  • base metal is generally used as a synonym for “precious metal”.
  • the “base metal” may mean all metals other than gold and silver.
  • “base metal” chemically means a metal having a relatively high tendency to ionize and having a property of being easily oxidized in a high temperature atmosphere.
  • Examples of the “base metal” that can be used in the present invention include iron, cobalt, nickel, copper, zinc, molybdenum, tungsten, cadmium, indium, tin, and antimony. Among these, it is most preferable to use copper. This is because copper has low electrical resistivity and high conductivity, and is less susceptible to electromigration when used for forming a conductive circuit on a printed wiring board.
  • the average particle diameter of the “metal powder mainly composed of base metal” as the component (A) is not particularly limited, but is preferably 1 nm or more and 100 ⁇ m or less, and more preferably 100 nm or more and 10 ⁇ m or less.
  • the conductive composition can be suitably used as a conductive paste for circuit pattern printing.
  • the average particle diameter in this specification means the average particle diameter based on the number standard by laser diffraction scattering type particle size distribution measurement.
  • the metal powder mainly composed of a base metal can be produced by a known method such as an electrolysis method, a reduction method, or an atomization method.
  • Examples of the amine compound represented by the above formula (1) include 2-aminoethanol, 3-amino-1-propanol, 4-amino-1-butanol, 3-methoxypropylamine, N-methylethanolamine, and N-methyl. Specific examples include propanolamine and the like.
  • an aliphatic amine having an OH group is preferably used. That is, it is preferable that both R 2 and R 3 in the above formula (1) are H atoms.
  • 3-amino-1-propanol is most preferably used.
  • the “aliphatic amine having two or more amino groups (—NH 2 )” as the component (B) means that the H atom of a linear or branched saturated hydrocarbon is substituted by two or more amino groups. It means the compound made. That is, taking a diamine in which the H atom of a linear or branched saturated hydrocarbon is substituted by two amino groups, it means a compound represented by the following general formula (2).
  • R 4 represents an alkylene group.
  • R 4 is preferably an alkylene group having 2 to 12 carbon atoms, more preferably an alkylene group having 2 to 8 carbon atoms.
  • Examples of the compound represented by the above formula (2) include 1,3-diaminopropane, 1,4-diaminobutane, 1,5-diaminopentane, 1,8-diaminooctane, 1,10-diaminodecane, and the like. Specific examples can be given. Of these, 1,3-diaminopropane is most preferred.
  • the “aliphatic hydroxy acid” as the component (C) is an aliphatic carboxylic acid having an OH group, and includes glycolic acid, lactic acid, glyceric acid, hydroxybutyric acid, malic acid, tartaric acid, citric acid, 3-hydroxy Specific examples include propionic acid and the like. Among these, it is preferable to use at least one selected from glycolic acid, lactic acid, and citric acid, and it is most preferable to use glycolic acid.
  • the conductive composition of the present invention preferably contains (D) a linear epoxy resin having one or more OH groups in the molecule.
  • linear as used herein means that the molecule does not have a benzene ring and has a linear structure in which at least 3 carbons are continuous in the portion excluding the terminal epoxy group. To do.
  • an epoxy resin that can be used in the present invention is not particularly limited.
  • sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, diglycerol polyglycidyl ether, glycerol polyglycidyl ether, trimethylolpropane polyglycidyl ether, etc. Can be used. Each of these has the structure of the following formulas (3) to (7) (wherein n in formula (4) is 1 to 10).
  • the component (D) “linear epoxy resin having an OH group” is added to the components (A) to (C), the surface of the base metal particles is formed by the epoxy resin blocking oxygen. Can be prevented from oxidizing. As a result, the conductive composition can be fired at a higher temperature, and a conductive film having higher conductivity can be formed.
  • a paste-like conductive composition By adding and mixing the components (A) to (C) and, if necessary, the component (D), a paste-like conductive composition can be obtained.
  • the order of mixing the components (A) to (C) described above is arbitrary.
  • the components (A) to (C) may be mixed simultaneously, or the components (B) and (C) may be mixed.
  • (A) component may be added later and mixed.
  • the mixing ratio of the above components (A) to (C) in the conductive composition of the present invention is not particularly limited, but is 1 to 50 parts by weight of (B) component with respect to 100 parts by weight of component (A).
  • Part (C) preferably 1 to 50 parts by weight. More preferably, it is 5 to 25 parts by weight of component (B) and 5 to 25 parts by weight of component (C) with respect to 100 parts by weight of component (A). Most preferably, it is 5 to 10 parts by weight of component (B) and 5 to 10 parts by weight of component (C) with respect to 100 parts by weight of component (A).
  • the mixing ratio of the components (B) and (C) is less than the above, a conductive film having high conductivity may not be obtained.
  • a solvent or an organic binder for adjusting the viscosity to be suitable for printing on the substrate is added to the conductive composition of the present invention, if necessary. be able to.
  • the solvent and the organic binder for example, known ones disclosed in JP-A-2007-258123 can be used.
  • a solvent for diluting the conductive composition to lower the viscosity for example, water, methanol, ethanol, 1,3-propanediol, ethylene glycol monoacetate, ethyl hydroxyacetate and the like can be used.
  • a paste-like conductive composition is prepared by mixing the components (A) to (C) and, if necessary, the component (D), and then the conductive composition is applied onto a substrate.
  • a coating method for example, a known method such as a screen printing method can be used.
  • the conductive composition After applying the paste-like conductive composition on the substrate, the conductive composition is fired at a temperature of 70 ° C. or higher and 500 ° C. or lower (heat treatment step).
  • the firing temperature is lower than this range, the volatilization or thermal decomposition of the organic matter in the conductive composition becomes insufficient, and the conductivity of the conductive film may be hindered by the organic matter residue.
  • the firing temperature is higher than this range, the surface of the base metal particles in the conductive composition is easily oxidized, so that a conductive film having high conductivity may not be obtained.
  • a more preferable range of the firing temperature is 150 ° C. or more and 500 ° C. or less.
  • the preferable range of the firing temperature varies depending on the type of the base metal of the component (A). Further, it varies depending on whether or not the component (D) is contained in the conductive composition. For example, when copper is used as the base metal of the component (A) and does not contain the component (D), it is preferably fired at 150 to 400 ° C., and fired at 200 to 350 ° C. More preferably. In the case where copper is used as the base metal of the component (A) and the component (D) is contained, the firing is preferably performed at 250 to 500 ° C, and the firing is performed at 350 to 500 ° C. Is more preferable.
  • firing is preferably performed at 150 to 400 ° C., and is performed at 200 to 350 ° C. Is more preferable.
  • the firing is preferably performed at 250 to 500 ° C., and is performed at 350 to 500 ° C. Is more preferable.
  • the conductive composition is preferably fired at 80 to 300 ° C., preferably 80 to 150 More preferably, baking is performed at a temperature of 0 ° C.
  • firing is preferably performed at 80 to 230 ° C., and is performed at 80 to 150 ° C. Is more preferable.
  • the base metal of the component (A) it is possible to form a conductive film simply by drying the conductive composition around room temperature (20 ° C.).
  • room temperature 20 ° C.
  • zinc it is possible to form a conductive film by simply drying the conductive composition near room temperature.
  • the conductive composition is dried near room temperature or a temperature of 300 ° C. or lower. Is preferably fired at 80 to 150 ° C. In the case where zinc is used as the base metal of the component (A) and the component (D) is contained, the firing is preferably performed at 100 to 300 ° C., and is performed at 150 to 300 ° C. Is more preferable.
  • the step of heating and baking the conductive composition at 70 ° C. or higher and 500 ° C. or lower may be performed in an air atmosphere in which air (oxygen) exists around the conductive composition, and oxygen is excluded from the air. May be performed in a nitrogen atmosphere.
  • the step of drying the conductive composition near room temperature may also be performed in an air atmosphere in which air (oxygen) exists around the conductive composition, or may be performed in a nitrogen atmosphere excluding oxygen from the air. .
  • the conductive film thus obtained has high conductivity because particles made of a base metal are present in the film.
  • copper powder is used as the component (A)
  • copper is a material that has a low resistivity and is not easily affected by electromigration, so that a conductive film having high conductivity and migration resistance is obtained. Can do.
  • the conductive film obtained by firing the conductive composition of the present invention can be used for forming conductive circuits of various electronic components, for example, circuit patterns on a printed circuit board.
  • the conductive composition of the present invention can be fired in an air atmosphere in which oxygen is present. Therefore, a large facility for making the inside of the firing furnace a nitrogen atmosphere is unnecessary, and the conductive composition can be fired at a low cost.
  • a conductive film having high conductivity can be formed.
  • the reason why such an effect can be obtained by the conductive composition of the present invention is considered as follows.
  • the component (C) when the component (C) is contained in the conductive composition, the thin oxide layer on the particle surface made of a base metal is removed by the organic acid flux effect. It is considered that the components (B) and (C) form a kind of complex on the particle surface from which the oxide layer has been removed. And when an electroconductive composition is heated in an atmospheric condition, this complex becomes a protective layer, and it is thought that it thermally decomposes, suppressing the oxidation of the surface of the particle
  • Example 1 A conductive composition was prepared by mixing 100 parts by weight of copper powder as component (A), 10 parts by weight of 3-amino-1-propanol as component (B), and 10 parts by weight of glycolic acid as component (C). did.
  • As the copper powder a spherical powder having an average particle diameter of 1 ⁇ m was used. After apply
  • Example 2 A conductive composition was prepared by mixing 100 parts by weight of copper powder as the component (A), 10 parts by weight of 3-amino-1-propanol as the component (B), and 10 parts by weight of lactic acid as the component (C). .
  • As the copper powder a spherical powder having an average particle diameter of 1 ⁇ m was used. After apply
  • Example 3 A conductive composition is prepared by mixing 100 parts by weight of copper powder as the component (A), 10 parts by weight of 3-amino-1-propanol as the component (B), and 10 parts by weight of citric acid as the component (C). did.
  • As the copper powder a spherical powder having an average particle diameter of 1 ⁇ m was used. After apply
  • Example 4 A conductive composition was prepared by mixing 100 parts by weight of copper powder as the component (A), 5 parts by weight of 1,3-diaminopropane as the component (B), and 10 parts by weight of glycolic acid as the component (C). .
  • As the copper powder a spherical powder having an average particle diameter of 1 ⁇ m was used. After apply
  • Example 5 A conductive composition was prepared by mixing 100 parts by weight of copper powder as the component (A), 10 parts by weight of 3-methoxypropylamine as the component (B), and 10 parts by weight of glycolic acid as the component (C).
  • the copper powder a spherical powder having an average particle diameter of 1 ⁇ m was used. After apply
  • Example 6 A conductive composition was prepared by mixing 100 parts by weight of copper powder as the component (A), 10 parts by weight of N-methylethanolamine as the component (B), and 10 parts by weight of glycolic acid as the component (C).
  • As the copper powder a spherical powder having an average particle diameter of 1 ⁇ m was used. After apply
  • Example 7 100 parts by weight of copper powder as component (A), 2 parts by weight of 3-amino-1-propanol as component (B), 5 parts by weight of glycolic acid as component (C), and sorbitol as component (D)
  • a conductive composition was prepared by mixing 10 parts by weight of polyglycidyl ether.
  • As the copper powder a spherical powder having an average particle diameter of 1 ⁇ m was used. After apply
  • a conductive composition is prepared by mixing 100 parts by weight of nickel powder as component (A), 10 parts by weight of 3-amino-1-propanol as component (B), and 10 parts by weight of glycolic acid as component (C). did.
  • As the nickel powder a spherical powder having an average particle diameter of 1 ⁇ m was used. After apply
  • Example 9 A conductive composition is prepared by mixing 100 parts by weight of zinc powder as the component (A), 10 parts by weight of 3-amino-1-propanol as the component (B), and 10 parts by weight of glycolic acid as the component (C). did.
  • As the zinc powder a spherical powder having an average particle diameter of 4 ⁇ m was used. After apply
  • a conductive composition is prepared by mixing 100 parts by weight of solder powder as the component (A), 10 parts by weight of 3-amino-1-propanol as the component (B), and 10 parts by weight of glycolic acid as the component (C). did.
  • a conductive composition is prepared by mixing 100 parts by weight of zinc powder as the component (A), 10 parts by weight of 3-amino-1-propanol as the component (B), and 10 parts by weight of glycolic acid as the component (C). did.
  • As the zinc powder a spherical powder having an average particle diameter of 4 ⁇ m was used. After apply
  • a conductive composition is prepared by mixing 100 parts by weight of tin powder as component (A), 10 parts by weight of 3-amino-1-propanol as component (B), and 10 parts by weight of glycolic acid as component (C). did.
  • As the tin powder a spherical powder having an average particle diameter of 5 ⁇ m was used. After apply
  • Comparative Example 1 A composition was prepared by mixing 100 parts by weight of copper powder, 10 parts by weight of 3-amino-1-propanol, and 10 parts by weight of propionic acid.
  • As the copper powder a spherical powder having an average particle diameter of 1 ⁇ m was used. After the obtained composition was applied on a substrate, it was heated at 200 ° C. for 10 minutes to form a film. The film thus obtained was not conductive and could not be called a “conductive film”.
  • composition was prepared by mixing 100 parts by weight of copper powder, 10 parts by weight of 3-amino-1-propanol, and 10 parts by weight of p-hydroxybenzoic acid.
  • copper powder a spherical powder having an average particle diameter of 1 ⁇ m was used.
  • the obtained composition was applied on a substrate, it was heated at 200 ° C. for 10 minutes to form a film.
  • the film thus obtained was not conductive and could not be called a “conductive film”.
  • composition was prepared by mixing 100 parts by weight of copper powder, 10 parts by weight of 1-aminopropane, and 10 parts by weight of glycolic acid.
  • copper powder a spherical powder having an average particle diameter of 1 ⁇ m was used. After the obtained composition was applied on a substrate, it was heated at 200 ° C. for 10 minutes to form a film. The film thus obtained was not conductive and could not be called a “conductive film”.
  • composition was prepared by mixing 100 parts by weight of copper powder and 10 parts by weight of lactic acid.
  • As the copper powder a spherical powder having an average particle diameter of 1 ⁇ m was used.
  • the obtained composition was applied onto a substrate and then heated at 300 ° C. for 5 minutes to form a film.
  • the film thus obtained was not conductive and could not be called a “conductive film”.
  • the conductive composition using glycolic acid as the component (C) is higher than the case of using other hydroxy acids (lactic acid and citric acid). It has been found that a conductive film having conductivity can be obtained.
  • the conductive composition using 3-amino-1-propanol as the component (B) was obtained by using other amine compounds (1,3-diamino). It has been found that a conductive film having higher conductivity than that obtained using propane, 3-methoxypropylamine, N-methylethanolamine) can be obtained.
  • the conductive composition (Example 7) containing the above component (D) in addition to the above components (A) to (C) is composed of the above component (D). It has been found that a conductive film that can be fired at a higher temperature than a conductive composition containing no hydrogen (Example 1) and that has high conductivity can be obtained.
  • Example 1 As can be seen by comparing the results of Example 1 and Comparative Example 1, when an aliphatic carboxylic acid having no OH group is added instead of the component (C), a conductive film having high conductivity is obtained. Not found out.
  • Example 1 As can be seen by comparing the results of Example 1 and Comparative Example 2, it was found that when an aromatic hydroxy acid was added instead of the component (C), a conductive film having high conductivity could not be obtained. .
  • Example 1 As can be seen by comparing the results of Example 1 and Comparative Example 3, when an amine compound having one amino group and no OH group is added in place of the component (B), it has high conductivity. It was found that a conductive film could not be obtained.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
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  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

L'invention concerne une composition conductrice qui peut être soumise à une cuisson dans une atmosphère d'air, ainsi qu'un procédé de formation d'un film conducteur à l'aide de cette composition conductrice. Celle-ci comprend (A) une poudre métallique composée principalement d'un métal de base, (B) un composé amine représenté par la formule générale (1) : R2-HN-R1-O-R3 (dans laquelle R1 représente un groupe alkylène ayant de 2 à 8 atomes de carbone, R2 et R3 représentent chacun indépendamment un atome d'hydrogène ou un groupe alkyle ayant de 1 à 4 atomes de carbone) ou une amine aliphatique ayant au moins 2 groupes amino et (C) un hydroxy acide aliphatique.
PCT/JP2011/075585 2010-11-19 2011-11-07 Composition conductrice, film conducteur et procédé de formation d'un film conducteur WO2012066957A1 (fr)

Priority Applications (1)

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JP2012544182A JP5881613B2 (ja) 2010-11-19 2011-11-07 導電性組成物、及び導電膜の形成方法

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JP2010258984 2010-11-19
JP2010-258984 2010-11-19

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012131895A (ja) * 2010-12-21 2012-07-12 Tosoh Corp 導電性インク組成物、及びそれを用いて製造された電気的導通部位
JP2013062184A (ja) * 2011-09-14 2013-04-04 Namics Corp 導電性組成物及び導電膜
JP2016089146A (ja) * 2014-10-30 2016-05-23 日華化学株式会社 導電性インク組成物及びそれにより製造された導電性部材
CN111627698A (zh) * 2020-06-08 2020-09-04 江苏国瓷泓源光电科技有限公司 一种mlcc用镍内电极浆料

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130301A (ja) * 2006-11-20 2008-06-05 Sumitomo Bakelite Co Ltd 導電性銅ペースト
JP2008226726A (ja) * 2007-03-14 2008-09-25 Sumitomo Bakelite Co Ltd 導電性ペースト

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130301A (ja) * 2006-11-20 2008-06-05 Sumitomo Bakelite Co Ltd 導電性銅ペースト
JP2008226726A (ja) * 2007-03-14 2008-09-25 Sumitomo Bakelite Co Ltd 導電性ペースト

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012131895A (ja) * 2010-12-21 2012-07-12 Tosoh Corp 導電性インク組成物、及びそれを用いて製造された電気的導通部位
JP2013062184A (ja) * 2011-09-14 2013-04-04 Namics Corp 導電性組成物及び導電膜
JP2016089146A (ja) * 2014-10-30 2016-05-23 日華化学株式会社 導電性インク組成物及びそれにより製造された導電性部材
CN111627698A (zh) * 2020-06-08 2020-09-04 江苏国瓷泓源光电科技有限公司 一种mlcc用镍内电极浆料

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