WO2012064133A3 - 전도성 투명 접착 조성물 및 이를 이용하여 제조한 전도성 투명 접착제 - Google Patents

전도성 투명 접착 조성물 및 이를 이용하여 제조한 전도성 투명 접착제 Download PDF

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Publication number
WO2012064133A3
WO2012064133A3 PCT/KR2011/008581 KR2011008581W WO2012064133A3 WO 2012064133 A3 WO2012064133 A3 WO 2012064133A3 KR 2011008581 W KR2011008581 W KR 2011008581W WO 2012064133 A3 WO2012064133 A3 WO 2012064133A3
Authority
WO
WIPO (PCT)
Prior art keywords
transparent adhesive
conductive transparent
conductive
adhesive composition
same
Prior art date
Application number
PCT/KR2011/008581
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English (en)
French (fr)
Other versions
WO2012064133A2 (ko
Inventor
김은경
김병관
김영중
김정훈
Original Assignee
연세대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 연세대학교 산학협력단 filed Critical 연세대학교 산학협력단
Priority to US13/884,962 priority Critical patent/US9096779B2/en
Publication of WO2012064133A2 publication Critical patent/WO2012064133A2/ko
Publication of WO2012064133A3 publication Critical patent/WO2012064133A3/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/02—Presence of polyamine or polyimide polyamine
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2481/00—Presence of sulfur containing polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

본 발명은 전도성 투명 접착 조성물 및 이를 이용하여 제조한 전도성 투명 접착제에 관한 것으로서, 투명 접착성 단량체, 다공성 탄소, 전도성 고분자 및 이들의 조합으로 이루어진 군에서 선택되는 어느 하나의 전도성 메조포러스 충진제, 그리고 중합 개시제를 포함한다. 상기 전도성 투명 접착 조성물은 가격이 낮아 경제성이 뛰어나며, 전기 전도성 및 투명성이 우수할 뿐만 아니라 기계적 강도가 우수하여 터치스크린, 디스플레이, 전자소자 등의 다양한 전기 전자 분야에서 사용이 가능하다.
PCT/KR2011/008581 2010-11-12 2011-11-10 전도성 투명 접착 조성물 및 이를 이용하여 제조한 전도성 투명 접착제 WO2012064133A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/884,962 US9096779B2 (en) 2010-11-12 2011-11-10 Conductive transparent adhesive composition and adhesive prepared by using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100112900A KR101357604B1 (ko) 2010-11-12 2010-11-12 전도성 투명 접착 조성물 및 이를 이용하여 제조한 전도성 투명 접착제
KR10-2010-0112900 2010-11-12

Publications (2)

Publication Number Publication Date
WO2012064133A2 WO2012064133A2 (ko) 2012-05-18
WO2012064133A3 true WO2012064133A3 (ko) 2012-09-13

Family

ID=46051440

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/008581 WO2012064133A2 (ko) 2010-11-12 2011-11-10 전도성 투명 접착 조성물 및 이를 이용하여 제조한 전도성 투명 접착제

Country Status (3)

Country Link
US (1) US9096779B2 (ko)
KR (1) KR101357604B1 (ko)
WO (1) WO2012064133A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101364229B1 (ko) * 2012-12-20 2014-02-17 동우 화인켐 주식회사 감광성 수지 조성물 및 이로부터 제조되는 절연막
CN107430903A (zh) * 2015-04-02 2017-12-01 综研化学株式会社 透明导电薄板、触摸面板模块以及触摸面板装置
KR20170109264A (ko) * 2016-03-21 2017-09-29 동우 화인켐 주식회사 화학증폭형 포지티브 감광형 유기절연막 수지 조성물 및 이로부터 제조된 절연막
JP7283654B2 (ja) * 2019-03-12 2023-05-30 日本メクトロン株式会社 粘着シート

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050062024A1 (en) * 2003-08-06 2005-03-24 Bessette Michael D. Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof
JP2007051173A (ja) * 2005-08-15 2007-03-01 Shin Etsu Polymer Co Ltd 帯電防止性粘接着剤、帯電防止性粘接着層および保護材
KR100814525B1 (ko) * 2004-09-22 2008-03-17 신에츠 폴리머 가부시키가이샤 도전성 조성물 및 그 제조 방법, 대전 방지 도료, 대전방지막, 대전 방지 필름, 광학 필터 및 광 정보 기록매체,콘덴서 및 그 제조방법
KR20090087704A (ko) * 2008-02-13 2009-08-18 주식회사 엘지화학 수성 점착제 조성물, 그의 제조 방법, 점착 시트 및 이를사용한 백그라인딩 방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100964561B1 (ko) 2009-06-01 2010-06-21 박기호 도전성 점착제 조성물

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050062024A1 (en) * 2003-08-06 2005-03-24 Bessette Michael D. Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof
KR100814525B1 (ko) * 2004-09-22 2008-03-17 신에츠 폴리머 가부시키가이샤 도전성 조성물 및 그 제조 방법, 대전 방지 도료, 대전방지막, 대전 방지 필름, 광학 필터 및 광 정보 기록매체,콘덴서 및 그 제조방법
JP2007051173A (ja) * 2005-08-15 2007-03-01 Shin Etsu Polymer Co Ltd 帯電防止性粘接着剤、帯電防止性粘接着層および保護材
KR20090087704A (ko) * 2008-02-13 2009-08-18 주식회사 엘지화학 수성 점착제 조성물, 그의 제조 방법, 점착 시트 및 이를사용한 백그라인딩 방법

Also Published As

Publication number Publication date
WO2012064133A2 (ko) 2012-05-18
KR101357604B1 (ko) 2014-02-03
KR20120051457A (ko) 2012-05-22
US20130234076A1 (en) 2013-09-12
US9096779B2 (en) 2015-08-04

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