WO2012060235A1 - Piezoelectric vibration device - Google Patents
Piezoelectric vibration device Download PDFInfo
- Publication number
- WO2012060235A1 WO2012060235A1 PCT/JP2011/074390 JP2011074390W WO2012060235A1 WO 2012060235 A1 WO2012060235 A1 WO 2012060235A1 JP 2011074390 W JP2011074390 W JP 2011074390W WO 2012060235 A1 WO2012060235 A1 WO 2012060235A1
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- WO
- WIPO (PCT)
- Prior art keywords
- piezoelectric
- piezoelectric element
- support member
- vibration device
- drive electrode
- Prior art date
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02133—Means for compensation or elimination of undesirable effects of stress
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0509—Holders; Supports for bulk acoustic wave devices consisting of adhesive elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/178—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of a laminated structure of multiple piezoelectric layers with inner electrodes
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
Definitions
- the present invention relates to a piezoelectric vibration device used for, for example, a piezoelectric actuator and a piezoelectric sounding body, and more particularly to a piezoelectric vibration device in which a piezoelectric element is bonded to a support member and uses a bending mode.
- piezoelectric vibration devices are used for piezoelectric actuators, piezoelectric sounding bodies, Haptics, and the like.
- An example of the piezoelectric sounding body is a piezoelectric speaker.
- Patent Document 1 discloses a piezoelectric vibration device used for a piezoelectric sounding body.
- a piezoelectric vibration device a plurality of piezoelectric vibrators are housed in a case.
- FIG. 17 is a partial enlarged cross-sectional view showing a main part of a part where a plurality of piezoelectric vibrators 1001 and 1002 are housed in a case 1003. Here, only a part of the case 1003 is shown.
- Piezoelectric vibrators 1001 and 1002 are housed in a housing portion 1003 a provided in the case 1003.
- the piezoelectric vibrators 1001 and 1002 are stacked via a spacer 1004.
- a clamp 1005 made of metal is attached so as to sandwich the piezoelectric vibrators 1001 and 1002 stacked on both sides of the spacer 1004.
- the piezoelectric vibrators 1001 and 1002 are sandwiched by the clamp 1005 and are electrically connected to the electrodes on the outer surface of the piezoelectric vibrators 1001 and 1002 by the clamp 1005.
- the other ends of the piezoelectric vibrators 1001 and 1002 are also supported by the same structure.
- the clamp 1005 is used to electrically connect the piezoelectric vibrators 1001 and 1002. For this reason, it is possible to omit the bonding by the bonding wire.
- the piezoelectric vibrators 1001 and 1002 when the thickness of the piezoelectric vibrators 1001 and 1002 is reduced, the piezoelectric vibrators 1001 and 1002 supported by being sandwiched by the clamp 1005 are generated when the piezoelectric vibration device is vibrated. Due to the vibration, stress concentrates on the portions where the piezoelectric vibrators 1001 and 1002 are supported, and there is a problem that the piezoelectric vibrators 1001 and 1002 are damaged or deformed.
- a method of electrically connecting the bonding wire to the drive electrode of the piezoelectric vibrator has been conventionally used.
- the bonding wire may come off at the bonded portion of the bonding wire due to the vibration of the piezoelectric vibrator.
- the piezoelectric vibrator may be damaged due to stress concentration due to the difference between the rigidity of the bonding material and the rigidity of the drive electrode of the piezoelectric vibrator.
- the drive electrode and the wiring electrode may be peeled off.
- An object of the present invention is a piezoelectric vibration device using a piezoelectric element in which drive electrodes are formed on both main surfaces of a piezoelectric plate, and poor conduction in an electrically connected portion of the drive electrode hardly occurs.
- An object of the present invention is to provide a highly reliable piezoelectric vibration device that does not easily break and does not easily cause electrode peeling.
- the piezoelectric vibration device includes a piezoelectric body having first and second main surfaces facing each other, and a first main surface side of the piezoelectric body that is formed in parallel with the first main surface.
- a region where the first and second drive electrodes are opposed to each other in the thickness direction of the piezoelectric body is an active region, and a region where the first drive electrode and the second drive electrode are not opposed is an inactive region.
- a support member having a piezoelectric element bonding surface to which the piezoelectric element is bonded.
- the support member is formed on the piezoelectric element bonding surface and has a first wiring electrode that is electrically connected to the first drive electrode of the piezoelectric element.
- the first drive electrode of the piezoelectric element and the first wiring electrode of the support member are electrically connected, and the first main surface of the piezoelectric element is used as the support member and the piezoelectric element bonding surface.
- a first bonding material layer that is bonded is further provided.
- the piezoelectric element is formed on the first main surface of the piezoelectric body in the inactive region of the piezoelectric body, and is formed on the second main surface.
- a connection electrode electrically connected to the two drive electrodes.
- the support member further has a second wiring electrode formed on the piezoelectric element bonding surface and electrically connected to the second drive electrode.
- a second bonding material layer is further provided for electrically connecting the connection electrode and the second wiring electrode and bonding the first main surface of the piezoelectric element to the piezoelectric element bonding surface of the support member. It has been.
- the piezoelectric element is firmly bonded to the piezoelectric element bonding surface using not only the first bonding material layer but also the second bonding material layer.
- the first and second drive electrodes are electrically connected to the first and second wiring electrodes provided on the support member.
- the support member supports the support member from the outside so that when the piezoelectric element vibrates in the bending mode, the supporting member vibrates in the bending mode of the same frequency as the piezoelectric element.
- There is a bending mode support for the purpose.
- the piezoelectric element and the supporting member can be vibrated in the bending mode only by supporting the supporting member by the bending mode supporting portion from the outside as described above.
- the bending mode support portion is located in a peripheral portion located outside the region to which the piezoelectric element is bonded, and the first wiring electrode reaches the peripheral portion. In this case, the first wiring electrode can be easily electrically connected to the outside.
- At least a primary bending mode node of the supporting member is located in the bending mode support portion. In this case, vibration due to the bending mode is not easily inhibited.
- the piezoelectric element is formed on the first main surface of the piezoelectric body and further includes a protective layer made of an insulating material.
- the protective layer is bonded to the piezoelectric element bonding surface of the support member.
- the protective layer can surely prevent a short circuit between the first drive electrode and the second drive electrode on the first main surface side of the piezoelectric element.
- the protective layer can firmly bond the piezoelectric element to the piezoelectric element bonding surface of the support member.
- the piezoelectric element is formed on the second main surface of the piezoelectric body so as to cover the second drive electrode, and is made of an insulating material. It further has a layer. In this case, since the second drive electrode is covered with the protective layer, the second drive electrode can be prevented from coming into direct contact with the finger. Therefore, electric shock can be prevented.
- the protective layer is made of the same material as the piezoelectric body.
- a piezoelectric vibration device provided with a protective layer can be provided without increasing the type of material.
- the piezoelectric vibration device has first and second piezoelectric element bonding surfaces that face each other, and each of the first and second piezoelectric element bonding surfaces has Piezoelectric elements are joined.
- the piezoelectric elements are bonded to both surfaces of the support member, a large amount of displacement can be obtained and the sound pressure can be increased.
- the piezoelectric body and the support member have a rectangular planar shape having a short side and a long side.
- the length of the rectangular short side of the support member is equal to the length of the rectangular short side of the piezoelectric body.
- the first and second drive electrodes are formed over the entire length in the short side direction of the piezoelectric body.
- the mother laminated body formed by laminating the mother piezoelectric body and the mother supporting member is separated by a distance equal to the length of the rectangular short side of the supporting member and the length of the short side of the rectangular piezoelectric body.
- the piezoelectric vibration device can be easily obtained by cutting with. Therefore, the mass productivity of the piezoelectric vibration device can be improved.
- the first drive electrode is formed on the first main surface of the piezoelectric body
- the second drive electrode is the second main electrode of the piezoelectric body. It is formed on the entire surface.
- the piezoelectric element further includes a connection electrode that is formed on the first main surface of the piezoelectric body in the inactive region of the piezoelectric body and is electrically connected to the second drive electrode.
- the connection electrode is formed so as to extend from the first main surface of the piezoelectric body to the side surface of the piezoelectric body, and is connected to the second drive electrode at a ridge line formed by the side surface of the piezoelectric body and the second main surface.
- the first drive electrode can be easily joined to the second wiring electrode on the piezoelectric element joining surface of the support member without lowering the drive efficiency of the piezoelectric element.
- the length of the long side of the rectangular shape of the support member is longer than the length of the long side of the rectangular shape of the piezoelectric element.
- the first wiring electrode reaches the side region of the joined portion. In this case, the first wiring electrode can be easily electrically connected to the outside.
- the length of the long side of the rectangular support member is L1
- the length along the long side direction of the rectangular support member of the active region in the piezoelectric body is L2. (L2 / L1) ⁇ 100% is 75% or more.
- the piezoelectric element can be joined to the support member and the piezoelectric member can be electrically connected without reducing the amount of displacement of the piezoelectric element that vibrates in the bending mode.
- the first drive electrode of the piezoelectric element is electrically connected to the first wiring electrode of the support member by the first bonding material layer, and the first bonding material layer Since the piezoelectric element is bonded to the piezoelectric element bonding surface of the support member, the piezoelectric element is firmly bonded to the support member. Therefore, when the piezoelectric vibration device is vibrated in the bending mode, the electrical connection portion is hardly broken or the electrode is not peeled off, and the reliability of the piezoelectric vibration device can be effectively increased.
- FIGS. 1A and 1B are a perspective view and an exploded perspective view for explaining a piezoelectric vibration device according to a first embodiment of the present invention.
- FIG. 2 shows a ratio (L2 / L1) ⁇ 100% between the length L2 of the active region of the piezoelectric element and the length L1 of the long side of the support member in the piezoelectric vibration device according to the first embodiment of the present invention. It is a figure which shows the relationship between displacement amount.
- FIG. 3 shows a ratio (L2 / L1) ⁇ 100% between the length L2 of the active region of the piezoelectric element and the length L1 of the long side of the support member in the piezoelectric vibration device according to the first embodiment of the present invention.
- FIG. 4 is a perspective view of the piezoelectric vibration device according to the second embodiment of the present invention.
- FIG. 5 is an exploded perspective view of the piezoelectric vibration device according to the second embodiment of the present invention.
- FIG. 6 is a front sectional view showing a first modification of the piezoelectric element used in the piezoelectric vibration device of the present invention.
- FIG. 7 is a front sectional view showing a second modification of the piezoelectric element used in the piezoelectric vibration device of the present invention.
- FIG. 8 is a front sectional view showing a third modification of the piezoelectric element used in the piezoelectric vibration device of the present invention.
- FIG. 6 is a front sectional view showing a first modification of the piezoelectric element used in the piezoelectric vibration device of the present invention.
- FIG. 7 is a front sectional view showing a second modification of the piezoelectric element used in the piezoelectric vibration device of the present invention.
- FIG. 8 is a front
- FIG. 9 is a perspective view of a piezoelectric vibration device according to a third embodiment of the present invention.
- FIG. 10 is a front sectional view of a piezoelectric vibration device according to a fourth embodiment of the present invention.
- FIG. 11 is a schematic exploded perspective view of a vibration module provided with a plurality of piezoelectric vibration devices of the present invention.
- FIG. 12 is a perspective view for explaining a modification of the piezoelectric vibration device according to the first embodiment of the present invention.
- FIG. 13 is an exploded perspective view of the piezoelectric vibration device according to the modification shown in FIG.
- FIG. 14 is a perspective view for explaining a support member used in another modification of the piezoelectric vibration device according to the first embodiment of the present invention.
- FIG. 15 is a perspective view for explaining still another modification of the piezoelectric vibration device according to the first embodiment of the present invention.
- 16 is an exploded perspective view of the piezoelectric vibration device according to the modification shown in FIG.
- FIG. 17 is a partially enlarged cross-sectional view showing a main part of a conventional piezoelectric vibration device.
- FIGS. 1A and 1B are a perspective view and an exploded perspective view of the piezoelectric vibration device 1 according to the first embodiment of the present invention.
- the piezoelectric vibration device 1 is a unimorph type piezoelectric vibration device.
- the piezoelectric vibration device 1 includes a rectangular plate-like support member 2 that functions as a vibration plate.
- the support member 2 is configured by a rectangular plate-shaped substrate made of an insulating material.
- a glass epoxy substrate is used as the substrate made of such an insulating material.
- the glass epoxy substrate is excellent in machinability. Therefore, as will be described later, it can be easily and accurately cut out from the mother base. Therefore, the piezoelectric vibration device 1 can be mass-produced with high accuracy.
- the support member 2 can be made of an appropriate insulating material that realizes a large amount of displacement. Further, the support member 2 may be formed of a metal plate. In that case, if an insulating layer is provided on the upper surface of the metal plate in order to prevent a short circuit between first and second wiring electrodes described later, Good.
- the support member 2 has a rectangular plate shape, and the length direction dimension of the rectangular planar shape is L1, and the width direction dimension is W.
- the upper surface of the support member 2 is the piezoelectric element bonding surface 2a.
- a first wiring electrode 3 and a second wiring electrode 4 are formed on the upper surface of the support member 2.
- the first and second wiring electrodes 3 and 4 are electrically insulated from each other and face each other with a gap therebetween.
- the piezoelectric element 7 is bonded to the first and second wiring electrodes 3 and 4 via the first and second bonding material layers 5 and 6.
- the first and second bonding material layers 5 and 6 are made of an appropriate conductive adhesive containing a conductive filler. However, even with an adhesive that does not contain a conductive filler, conduction can be ensured if the electrodes are in direct contact with each other. Therefore, an insulating adhesive may be used.
- the electrodes are not necessarily provided between the first and second bonding material layers 5 and 6. May not be in direct contact with each other, and may be electromagnetic coupling such as a capacitor.
- the piezoelectric element 7 has a rectangular plate-like planar shape.
- the width direction dimension of the piezoelectric element 7 is made equal to the width direction dimension W of the support member 2. More specifically, the piezoelectric element 7 has a rectangular plate-like piezoelectric body 8.
- the piezoelectric body 8 has a lower surface 8a as a first main surface and an upper surface 8b as a second main surface.
- the piezoelectric body 8 is made of lead zirconate titanate (PZT) or a lead-free piezoelectric body, for example, a piezoelectric body such as potassium sodium niobate (KNN).
- PZT lead zirconate titanate
- KNN potassium sodium niobate
- the piezoelectric body 8 is made of piezoelectric ceramics. , Polarized in the thickness direction.
- a first drive electrode 9 is formed on the lower surface 8 a of the piezoelectric body 8.
- a second drive electrode 10 is formed on the entire upper surface 8 b of the piezoelectric body 8.
- a piezoelectric portion where the first drive electrode 9 and the second drive electrode 10 are opposed to each other via the piezoelectric body 8 is an active region driven by the piezoelectric effect. The portions other than the active region of the piezoelectric body 8 are inactive regions.
- the piezoelectric body 8 since the first drive electrode 9 is not formed on the entire surface of the lower surface 8a, the piezoelectric body 8 includes the active region and the inactive region.
- connection electrode 10a is formed so as to face the first drive electrode 9 with a gap.
- the connection electrode 10a extends from the lower surface 8a of the piezoelectric body 8 through the side surface to the ridge line formed by the side surface and the upper surface 8b.
- the connection electrode 10 a is connected to the second drive electrode 10 at the ridgeline.
- the first and second drive electrodes 9 and 10 and the connection electrode 10a can be formed of an appropriate conductive material. That is, the first and second drive electrodes 9, 10 and the connection electrode 10a can be formed by one or more conductive layers made of Ag, Cu, Ni, Cr, Pd, or an alloy thereof.
- the piezoelectric element 7 since the first and second drive electrodes 9 and 10 are opposed to each other via the piezoelectric body 8, an AC voltage or an arbitrary waveform voltage is applied from the first and second drive electrodes 9 and 10. By doing so, the laminated body of the piezoelectric element 7 and the supporting member 2 as a vibration plate can be vibrated in a bending mode.
- the first drive electrode 9 is bonded to the first wiring electrode 3 by the first bonding material layer 5.
- the connection electrode 10 a is bonded to the second wiring electrode 4 by the second bonding material layer 6.
- the bonding by the first bonding material layer 5 and the second bonding material layer 6 is performed on the upper surface of the support member 2 which is the piezoelectric element bonding surface 2a. Therefore, the piezoelectric element 7 can be firmly fixed to the first and second wiring electrodes 3 and 4 by the first and second bonding material layers 5 and 6.
- first and second bonding material layers 5 and 6 are made of a conductive adhesive as described above. Therefore, the first drive electrode 9 can be reliably electrically connected to the first wiring electrode 3, and the connection electrode 10 a, and hence the second drive electrode 10 can be reliably electrically connected to the second wiring electrode 4. Can be connected.
- the conventional piezoelectric vibration device shown in FIG. 17 has a problem that the piezoelectric vibrators 1001 and 1002 are damaged or deformed because the electrical connection is achieved using the clamp 1005.
- the piezoelectric element 7 is bonded to the support member 2 by the first and second bonding material layers 5 and 6, and electrical connection is achieved. Therefore, since vibration is hardly inhibited in the piezoelectric element 7, it is difficult for the displacement amount to decrease, and good vibration characteristics can be obtained. In addition, since stress concentration due to clamping or the like is unlikely to occur, peeling of the first and second drive electrodes 9 and 10 and destruction of the piezoelectric body 8 and the support member 2 are unlikely to occur.
- the first and second drive electrodes 9, 10 can be formed with high accuracy and at low cost by a printing method.
- the piezoelectric element 7 can be thinned.
- the support member 2 is made of an insulating material, it is difficult for electric leakage to occur, and it is difficult for an electric person who operates an electronic device on which the piezoelectric vibration device 1 is mounted to generate electric shock.
- a diaphragm made of metal since a diaphragm made of metal is used as a support member, it is necessary to form an insulating layer.
- the support member 2 is made of an insulating material. Therefore, it is not necessary to form such an insulating layer.
- the support member 2 includes a bending mode support portion that supports the support member 2 from the outside so that the piezoelectric element 7 vibrates in the bending mode together with the piezoelectric element 7 when the piezoelectric element 7 vibrates in the bending mode.
- the support structure of the support member 2 from the outside is arbitrary, such as a cantilever beam or a doubly supported beam. In any case, by supporting the supporting member 2 with the bending mode supporting portion, the supporting member 2 vibrates in the bending mode having the same frequency together with the piezoelectric element 7.
- the bending mode support portion is present in the extension portions 2b and 2c, which are peripheral portions located outside the region where the piezoelectric element 7 is bonded.
- the first and second wiring electrodes 3 and 4 reach the extensions 2b and 2c.
- At least a primary bending mode node point (node) in the supporting member 2 is located on the bending mode support portion. Thereby, it is difficult to inhibit at least the vibration in the primary bending mode.
- a mother support member and a mother piezoelectric element are prepared. That is, a mother support member and a mother piezoelectric element in which a large number of support members 2 and piezoelectric elements 7 are assembled in a matrix are prepared.
- the first and second wiring electrodes of the mother for forming the first and second wiring electrodes 3 and 4 are formed on the upper surface.
- the first and second wiring electrodes of the mother are formed by preparing a glass epoxy substrate with copper foil, patterning the copper foil, screen printing or thin film forming method on the glass epoxy substrate. It can be performed by an appropriate method such as a method of forming the second wiring electrode.
- the first and second drive electrodes of the mother are formed in the same manner on the upper and lower surfaces of the mother piezoelectric body.
- the mother piezoelectric element and the mother support member are bonded to each other with a conductive adhesive for constituting the first and second bonding material layers 5 and 6.
- a mother laminate is obtained.
- the mother laminate is cut in the thickness direction.
- the side surface portion of the connection electrode 10 a is formed on the side surface of the piezoelectric body 8. In this way, the piezoelectric vibration device 1 can be easily mass-produced.
- the width-direction dimension W which is the dimension in the length direction of the short side of the rectangular plate-shaped support member 2, and the width-direction dimension of the piezoelectric element 7 are equalized.
- a large number of piezoelectric vibration devices 1 can be mass-produced easily and with high accuracy by cutting the laminate.
- the length direction dimension L1 of the support member 2 is longer than the length direction dimension of the piezoelectric element 7.
- the support member 2 extends so as to reach the side where the piezoelectric elements 7 are laminated on the piezoelectric element bonding surface 2 a of the support member 2.
- First and second wiring electrodes 3 and 4 are formed so as to reach the extending portions 2b and 2c extending to the sides. Therefore, since the extension portions 2b and 2c are supported from the outside and are electrically connected, the supported portion is not the piezoelectric element 7, and is not an active region of the piezoelectric element 7 in particular.
- the first and second wiring electrodes 3 and 4 can be easily electrically connected to the external terminal without causing stress concentration.
- a metal clip may be used as the external terminal. If the metal clip is sandwiched between the first and second wiring electrodes 3 and 4 formed in the extending portions 2b and 2c, the first and second wiring electrodes 3 and 4 are used for the first and first wiring electrodes.
- the two drive electrodes 9, 10 can be easily electrically connected to the external terminals.
- the metal clip sandwiches and supports the extensions 2b and 2c, the problem that the piezoelectric element 7 is damaged or deformed due to the stress concentration of vibration caused by the metal clip is improved.
- the problem of peeling of the drive electrode and the wiring electrode due to the difference in rigidity of the drive electrode of the vibrator is improved.
- the active region lengthwise dimension in the piezoelectric element 7 is L2. That is, the dimension in the long side direction of the rectangle of the active region where the first and second drive electrodes 9 and 10 are opposed is L2.
- the ratio (L2 / L1) ⁇ 100 (%) of the lengthwise dimension L2 of the active region to the lengthwise dimension L1 of the support member 2 is variously changed to produce a large number of piezoelectric vibrators 1 of the above embodiments. The amount of displacement and the generated force were measured.
- both end portions of the support member 2 are sandwiched by edge-shaped members in the thickness direction so that the distances between the two extension portions 2b and 2c from the end surface of the support member 2 to the end surface of the piezoelectric element 7 are equal.
- the piezoelectric element 7 By fixing the piezoelectric element 7 to the central portion of the support member 2, the portion is restrained from being displaced in the thickness direction, the interval between the members is set to L 1, and a predetermined voltage (200 V) is applied
- the amount of displacement in the thickness direction of the central portion was measured with a laser displacement meter, and the value was taken as the amount of displacement.
- the generated force is the same voltage as when the displacement is measured, and the edge is pressed in the thickness direction of the support member so that the displacement is zero.
- L2 is 50 mm
- W is 5 mm
- the thickness is 50 mm
- W is 5 mm
- the support member 2 is made of a glass epoxy substrate with a copper foil having a rectangular shape of L1 of 53 mm, W of 5 mm, and thickness of 0.2 mm.
- FIG 4 and 5 are a perspective view and an exploded perspective view of the piezoelectric vibration device 21 according to the second embodiment of the present invention.
- the lower surface 2d of the support member 2 is also a piezoelectric element bonding surface, and the piezoelectric element 7 is also connected to the first and second bonding material layers 5 and 6 on the lower surface 2d. It is the same as that of 1st Embodiment except having laminated
- both surfaces of the support member may be piezoelectric element bonding surfaces.
- two or more piezoelectric elements 7 may be laminated on one piezoelectric element bonding surface.
- the piezoelectric element used in the piezoelectric vibration device of the present invention is not limited to the piezoelectric element 7.
- FIG. 6 shows a first modification of the piezoelectric element used in the piezoelectric vibration device of the present invention.
- the stacked piezoelectric element 31 has a piezoelectric body 32.
- the piezoelectric body 32 has first and second main surfaces 32a and 32b facing each other.
- the piezoelectric body 32 has a plurality of piezoelectric layers.
- a first drive electrode 33 is formed on the first main surface 32a of the piezoelectric body 32, and a second drive electrode 34 is formed on the second main surface 32b.
- a plurality of first internal drive electrodes 35 that are commonly connected to the first drive electrode 33 and the end face of the piezoelectric body 32 are formed in the piezoelectric body 32.
- a plurality of second internal drive electrodes 36 are formed so as to overlap the first drive electrode 33 or the first internal drive electrode 35 via the piezoelectric layer.
- the plurality of second internal drive electrodes 36 are commonly connected to the second drive electrode 34 at the end face of the piezoelectric body 32.
- the laminated piezoelectric element 31 having a plurality of internal drive electrodes may be used.
- the laminated piezoelectric element 31 By using the laminated piezoelectric element 31, a large displacement can be obtained with a low driving voltage. That is, the displacement due to the piezoelectric effect is proportional to the applied electric field strength. In the multilayer piezoelectric element 31, the thickness of the piezoelectric layer between the drive electrodes connected to different potentials can be reduced, so that a large displacement can be obtained with a lower voltage.
- FIG. 7 shows a second modification of the piezoelectric element used in the piezoelectric vibration device of the present invention.
- the piezoelectric body 42 has first and second main surfaces 42a and 42b that face each other.
- the piezoelectric body 42 has a plurality of piezoelectric layers.
- First and second drive electrodes 43 and 44 are formed in the piezoelectric body 42 so as to face each other through the piezoelectric layer.
- the first drive electrode 43 is formed in parallel with the first main surface 42 a on the first main surface 42 a side of the piezoelectric body 42.
- the second drive electrode 44 is formed on the second main surface 42b side of the piezoelectric body 42 in parallel with the second main surface 42b.
- the first and second drive electrodes may not be directly formed on the first and second main surfaces of the piezoelectric body.
- Inactive layers 42 c and 42 d are formed outside the first and second drive electrodes 43 and 44.
- the piezoelectric element 41 having the inactive layers 42c and 42d may be used.
- the inactive layers 42c and 42d are provided, the clamping of the active region inside the piezoelectric body 42 can be suppressed.
- the first and second drive electrodes 43 and 44 are covered with the inactive layers 42c and 42d, so that they are not easily exposed to external moisture. Therefore, the product life can be extended. In addition, it is difficult for electric leakage to occur, and it is also possible to prevent electric shock of a human who operates an electronic device equipped with the piezoelectric vibration device.
- FIG. 8 shows a third modification of the piezoelectric element used in the piezoelectric vibration device of the present invention.
- a stacked piezoelectric element 51 shown in FIG. 8 has a piezoelectric body 52.
- the piezoelectric body 52 has first and second main surfaces 52a and 52b facing each other.
- the piezoelectric body 52 has a plurality of piezoelectric layers.
- First and second drive electrodes 53 and 54 are formed in the piezoelectric body 52 so as to face each other through the piezoelectric layer.
- the first drive electrode 53 is formed on the first main surface 52a side of the piezoelectric body 52 in parallel with the first main surface 52a.
- the second drive electrode 54 is formed on the second main surface 52b side of the piezoelectric body 52 in parallel with the second main surface 52b.
- the multilayer piezoelectric element 51 has inactive layers 52c and 52d on the first and second main surfaces 52a and 52b side of the piezoelectric body 52, like the piezoelectric element 41 shown in FIG.
- a plurality of internal drive electrodes 55 are formed between the first and second drive electrodes 53 and 54.
- the piezoelectric element used in the piezoelectric vibration device of the present invention may have an inactive layer outside the first drive electrode and the second drive electrode.
- a laminated piezoelectric element in which another drive electrode is formed between the first and second drive electrodes may be used.
- FIG. 9 is a perspective view of a piezoelectric vibration device according to a third embodiment of the present invention.
- a protective layer 62 made of an insulating material is formed on the piezoelectric element 7.
- the piezoelectric vibration device 61 is the same as the piezoelectric vibration device 1 of the first embodiment. Accordingly, the description of the piezoelectric vibration device 1 is incorporated by giving the same reference numerals to the same portions.
- the protective layer 62 is made of an insulating material and is provided so as to cover the entire upper surface of the second drive electrode 10. Therefore, it is possible to prevent electric shock from being generated by the human second drive electrode 10 who operates the electronic device on which the piezoelectric vibration device is mounted.
- the insulating material constituting the protective layer 62 is not particularly limited, and synthetic resin, insulating ceramics, or the like can be used. However, in order not to suppress the displacement of the piezoelectric element 7, it is desirable to use an insulating material having excellent elasticity.
- the protective layer 62 may be formed of the same piezoelectric material as that of the piezoelectric body 8. In that case, the protective layer 62 can be formed without increasing the type of material for forming the piezoelectric vibration device 61 and without causing a complicated manufacturing process.
- FIG. 10 is a front sectional view showing a piezoelectric vibration device according to a fourth embodiment of the present invention.
- a protective layer 72 is formed on the lower surface side of the piezoelectric element 7 instead of the protective layer 62 of the third embodiment.
- the protective layer 72 is made of an insulating bonding material.
- the piezoelectric vibration device 71 includes the first and second bonding material layers 5A, 5A, which are formed thicker than the first and second bonding material layers 5 and 6 due to the formation of the protective layer 72. 6A.
- the piezoelectric element 7 is bonded to the piezoelectric element bonding surface 2 a of the support member 2 by the protective layer 72. Therefore, the area of the first bonding material layer 5A is reduced. Thus, when the protective layer 72 is provided, the piezoelectric element 7 can be firmly bonded to the support member 2 even if the area of the first bonding material layer 5A is reduced.
- the protective layer 72 When the protective layer 72 is provided, by using an insulating adhesive having excellent moisture resistance as the protective layer 72, it is possible to suppress deterioration of characteristics due to the ingress of moisture from the lower surface side of the piezoelectric element 7.
- an insulating adhesive having excellent moisture resistance As the protective layer 72, it is possible to suppress deterioration of characteristics due to the ingress of moisture from the lower surface side of the piezoelectric element 7.
- a member that can electrically insulate the first drive electrode 9 and the connection electrode 10a such as an insulating adhesive or an anisotropic conductive adhesive, is used as the protective layer 72, the support member 2 and the piezoelectric element are used.
- the protective layer 72 may be disposed between the 7 and the gap 7.
- both the protective layer 62 shown in FIG. 9 and the protective layer 72 shown in FIG. 10 may be formed. In that case, protection can be achieved by the protective layers 62 and 72 on either the upper surface or the lower surface of the piezoelectric element 7.
- the piezoelectric vibration device according to the present invention can be used as various piezoelectric actuators and piezoelectric sounding bodies such as piezoelectric speakers.
- touch panel type input devices have been widely used as a kind of input device for portable electronic devices.
- a device called “Haptics” in which a reaction force against an input by a human gives a click feeling has attracted attention.
- the piezoelectric vibration device of the present invention can be suitably used as an actuator that applies a reaction force in such haptics.
- FIG. 12 is a perspective view for explaining a piezoelectric vibration device 1A which is a modification of the piezoelectric vibration device 1 of the first embodiment
- FIG. 13 is an exploded perspective view thereof.
- the piezoelectric vibration device 1 ⁇ / b> A according to this modification includes a support member 2 ⁇ / b> A instead of the support member 2 of the first embodiment.
- the same piezoelectric element 7 as in the first embodiment is used.
- the width of the support member 2 ⁇ / b> A is wider than the width of the piezoelectric element 7.
- the first wiring electrode 3A and the second wiring electrode 4A are formed on the upper surface of the support member 2A.
- the first and second wiring electrodes 3A and 4A are electrically insulated from each other and face each other with a gap therebetween.
- the piezoelectric element 7 is bonded to the first and second wiring electrodes 3A and 4A via the first and second bonding material layers 5 and 6.
- 3 A of 1st wiring electrodes have the junction part 3a, the terminal part 3b, and the connection part 3c.
- a first bonding material layer 5 is laminated on the bonding portion 3a.
- the joint portion 3a reaches the full width in the width direction of the support member 2A.
- the terminal portion 3b is provided on the second wiring electrode 4A side.
- the terminal portion 3b is opposed to the second wiring electrode 4A with a gap in the width direction of the support member 2A.
- the terminal portion 3b is formed close to one end side of the support member 2A, similarly to the second wiring electrode 4A.
- the joint part 3a and the terminal part 3b are connected by the connection part 3c.
- the terminal part 3b and the 2nd wiring electrode 4A are exposed in the one end side of this support member 2A, as shown in FIG. Therefore, electrical connection with the outside can be easily performed.
- FIG. 14 is a perspective view for explaining a support member 2B used in another modification of the piezoelectric vibration device according to the first embodiment of the present invention.
- the width of the support member 2A is wider than the width of the piezoelectric element 7 in order to prevent a short circuit between the terminal portion 3b and the second wiring electrode 4A.
- the first wiring electrode 3B includes a joint portion 3d, a terminal portion 3e, and a connecting portion 3f.
- a first bonding material layer 5 is laminated on the bonding portion 3d.
- the joint portion 3d reaches the full width in the width direction of the support member 2B.
- the terminal portion 3e is provided on the second wiring electrode 4A side.
- the terminal portion 3e is opposed to the second wiring electrode 4A with a gap in the width direction of the support member 2B.
- the terminal portion 3e is formed close to one end side of the support member 2A, similarly to the second wiring electrode 4A.
- the joint portion 3d and the terminal portion 3e are connected by a connecting portion 3e that extends from one end surface of the support member 2B to the other end surface through the lower surface.
- the entire width of the support member 2 ⁇ / b> B shown in FIG. 14 may be larger than the width of the piezoelectric element 7.
- FIG. 15 is a perspective view for explaining a piezoelectric vibration device 1B which is a modified example of the piezoelectric vibration device 1 of the first embodiment
- FIG. 16 is an exploded perspective view thereof.
- the piezoelectric vibration device 1B is formed by laminating the laminated piezoelectric element 51 shown in FIG. 8 on the support member 2A.
- the support member 2A is substantially the same as the support member 2A shown in FIG.
- the width of the support member 2A is the same as the width of the multilayer piezoelectric element 51, but the support member 2A having a width wider than that of the multilayer piezoelectric element 51 may be used as in the case of FIG. Good.
- the terminal portion 3b of the first wiring electrode 3A is provided close to the second wiring electrode 4A and one end in the length direction of the support member 2A. Therefore, electrical connection with the outside can be easily performed on one end side in the length direction of the support member 2A. In addition, as shown in FIG. 15, since the terminal portion 3b and the second wiring electrode 4A are exposed on one end side of the support member 2A, connection to the outside can be more easily performed.
- FIG. 11 is a schematic exploded perspective view of a vibration module 81 using the piezoelectric vibration device of the present invention.
- the vibration module 81 the plurality of piezoelectric vibration devices 1, 1 of the first embodiment are mounted on the upper surface of the substrate 82 by bonding material layers 83 and 84.
- substrate 85 used with a touchscreen type input device is arrange
- Such a vibration module can be suitably used for Haptics.
- the piezoelectric body of the piezoelectric vibration device of the present invention has a shape other than the rectangular plate shape, for example, a disk shape.
- the support member is not limited to the rectangular plate shape as long as it functions as the diaphragm of the unimorph vibration device, and may have a disk shape or the like.
- Inactive layer 53 ... 1st drive electrode 54 ... Second drive electrode 55 ... Internal drive electrode 61 . Piezoelectric vibration device 62 ... Protective layer 71 ... Piezoelectric vibration device 72 ... Protective layer 81 ... Vibration module 82 ... Substrate 83, 84 ... Bonding material layer 85 ... Flexible substrate
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Abstract
Description
2,2A,2B…支持部材
2a…圧電素子接合面
2b,2c…延長部
2d…下面
3,3A,3B…第1の配線電極
3a…接合部
3b…端子部
3c…連結部
3d…接合部
3e…端子部
3f…連結部
4,4A…第2の配線電極
5…第1の接合材層
5A…第1の接合材層
6…第2の接合材層
7…圧電素子
8…圧電体
8a…第1の主面
8b…第2の主面
9…第1の駆動電極
10…第2の駆動電極
10a…接続電極
21…圧電振動装置
31…圧電素子
32…圧電体
32a…第1の主面
32b…第2の主面
33…第1の駆動電極
34…第2の駆動電極
35…第1の内部駆動電極
36…第2の内部駆動電極
41…圧電素子
42…圧電体
42a…第1の主面
42b…第2の主面
42c,42d…不活性層
43…第1の駆動電極
44…第2の駆動電極
51…圧電素子
52…圧電体
52a…第1の主面
52b…第2の主面
52c,52d…不活性層
53…第1の駆動電極
54…第2の駆動電極
55…内部駆動電極
61…圧電振動装置
62…保護層
71…圧電振動装置
72…保護層
81…振動モジュール
82…基板
83,84…接合材層
85…可撓性基板 DESCRIPTION OF
Claims (13)
- 対向し合う第1及び第2の主面を有する圧電体と、
前記圧電体の前記第1の主面側において、第1の主面に平行に形成されている第1の駆動電極と、
前記圧電体の前記第2の主面側において、第2の主面に平行に形成されており、前記第1の駆動電極と対向している第2の駆動電極とを有し、前記第1,第2の駆動電極が前記圧電体の厚み方向に対向している領域が活性領域とされており、前記第1の駆動電極と前記第2の駆動電極とが対向していない領域が非活性領域とされている圧電素子と、
前記圧電素子が接合される圧電素子接合面を有する支持部材とを備え、
前記支持部材は、前記圧電素子接合面に形成されており、前記圧電素子の第1の駆動電極に電気的に接続される第1の配線電極を有し、
前記圧電素子の前記第1の駆動電極と、前記支持部材の前記第1の配線電極とを電気的に接続するとともに、前記圧電素子の第1の主面を前記支持部材の圧電素子接合面に接合している第1の接合材層をさらに備える、圧電振動装置。 A piezoelectric body having first and second main surfaces facing each other;
A first drive electrode formed in parallel to the first main surface on the first main surface side of the piezoelectric body;
A second drive electrode which is formed in parallel to the second main surface on the second main surface side of the piezoelectric body and faces the first drive electrode; The region where the second drive electrode is opposed to the piezoelectric body in the thickness direction is the active region, and the region where the first drive electrode is not opposed to the second drive electrode is inactive. A piezoelectric element that is an area;
A support member having a piezoelectric element bonding surface to which the piezoelectric element is bonded;
The support member has a first wiring electrode formed on the piezoelectric element bonding surface and electrically connected to the first drive electrode of the piezoelectric element,
The first drive electrode of the piezoelectric element is electrically connected to the first wiring electrode of the support member, and the first main surface of the piezoelectric element is used as a piezoelectric element bonding surface of the support member. A piezoelectric vibration device further comprising a first bonding material layer bonded. - 前記圧電素子が、前記圧電体の前記非活性領域において前記圧電体の第1の主面に形成されており、前記第2の主面に形成されている第2の駆動電極と電気的に接続されている接続電極をさらに有し、
前記支持部材が、前記圧電素子接合面に形成されており、かつ前記第2の駆動電極に電気的に接続される第2の配線電極をさらに有し、
前記接続電極と、前記第2の配線電極とを電気的に接続するとともに、前記圧電素子の第1の主面を前記支持部材の圧電素子接合面に接合している第2の接合材層をさらに備える、請求項1に記載の圧電振動装置。 The piezoelectric element is formed on the first main surface of the piezoelectric body in the inactive region of the piezoelectric body, and is electrically connected to the second drive electrode formed on the second main surface. A connection electrode that is
The support member further includes a second wiring electrode formed on the piezoelectric element bonding surface and electrically connected to the second drive electrode;
A second bonding material layer electrically connecting the connection electrode and the second wiring electrode and bonding the first main surface of the piezoelectric element to the piezoelectric element bonding surface of the support member; The piezoelectric vibration device according to claim 1, further comprising: - 前記支持部材は、前記圧電素子が屈曲モードで振動すると、該圧電素子と共に同じ周波数の屈曲モードで振動するように、前記支持部材を外部から支持するための屈曲モード支持部が存在する、請求項1または2に記載の圧電振動装置。 The support member has a bending mode support portion for supporting the support member from the outside so that when the piezoelectric element vibrates in a bending mode, the supporting member vibrates in a bending mode of the same frequency as the piezoelectric element. 3. The piezoelectric vibration device according to 1 or 2.
- 前記屈曲モード支持部は、前記圧電素子が接合されている領域の外側に位置している周辺部に位置し、前記第1の配線電極が前記周辺部に至っている、請求項3に記載の圧電振動装置。 4. The piezoelectric device according to claim 3, wherein the bending mode support portion is located in a peripheral portion located outside a region where the piezoelectric element is bonded, and the first wiring electrode reaches the peripheral portion. 5. Vibration device.
- 前記屈曲モード支持部には、前記支持部材における少なくとも1次屈曲モードの節が位置する、請求項4に記載の圧電振動装置。 The piezoelectric vibration device according to claim 4, wherein at least a primary bending mode node of the supporting member is located in the bending mode support portion.
- 前記圧電素子が、前記圧電体の第1の主面に形成されており、かつ絶縁性材料からなる保護層をさらに有し、前記保護層が、前記支持部材の圧電素子接合面に接合されている、請求項1~5のいずれか1項に記載の圧電振動装置。 The piezoelectric element is formed on the first main surface of the piezoelectric body and further includes a protective layer made of an insulating material, and the protective layer is bonded to the piezoelectric element bonding surface of the support member. The piezoelectric vibration device according to any one of claims 1 to 5, wherein:
- 前記圧電素子が、前記第2の駆動電極を覆うように前記圧電体の第2の主面に形成されており、かつ絶縁性材料からなる保護層をさらに有する、請求項1~6のいずれか1項に記載の圧電振動装置。 7. The piezoelectric element according to claim 1, further comprising a protective layer formed on the second main surface of the piezoelectric body so as to cover the second drive electrode and made of an insulating material. The piezoelectric vibration device according to item 1.
- 前記保護層が、前記圧電体と同じ材料からなる、請求項6または7に記載の圧電振動装置。 The piezoelectric vibration device according to claim 6 or 7, wherein the protective layer is made of the same material as the piezoelectric body.
- 前記支持部材が対向し合う第1,第2の圧電素子接合面を有し、第1,第2の圧電素子接合面のそれぞれに、前記圧電素子が接合されている、請求項1~8のいずれか1項に記載の圧電振動装置。 9. The first and second piezoelectric element bonding surfaces that the support member oppose each other, wherein the piezoelectric element is bonded to each of the first and second piezoelectric element bonding surfaces. The piezoelectric vibration device according to any one of claims.
- 前記圧電体及び前記支持部材が短辺と長辺とを有する矩形の平面形状を有し、前記支持部材の矩形の短辺の長さと、前記圧電体の矩形の短辺の長さが等しくされており、
前記第1,第2の駆動電極が、前記圧電体の前記短辺方向全長にわたり形成されている、請求項1~9のいずれか1項に記載の圧電振動装置。 The piezoelectric body and the support member have a rectangular planar shape having a short side and a long side, and the length of the rectangular short side of the support member is equal to the length of the rectangular short side of the piezoelectric body. And
The piezoelectric vibration device according to any one of claims 1 to 9, wherein the first and second drive electrodes are formed over the entire length in the short side direction of the piezoelectric body. - 前記第1の駆動電極が前記圧電体の第1の主面に形成されており、
前記第2の駆動電極が、前記圧電体の第2の主面の全面に形成されており、
前記圧電素子が、前記圧電体の前記非活性領域において前記圧電体の第1の主面上に形成されており、かつ前記第2の駆動電極に電気的に接続されている接続電極をさらに有し、
該接続電極が、前記圧電体の前記第1の主面から前記圧電体の側面に至るように形成されており、かつ前記圧電体の側面と第2の主面とのなす稜線において前記第2の駆動電極に接続されている、請求項10に記載の圧電振動装置。 The first drive electrode is formed on the first main surface of the piezoelectric body;
The second drive electrode is formed on the entire second main surface of the piezoelectric body;
The piezoelectric element further includes a connection electrode formed on the first main surface of the piezoelectric body in the inactive region of the piezoelectric body and electrically connected to the second drive electrode. And
The connection electrode is formed so as to extend from the first main surface of the piezoelectric body to the side surface of the piezoelectric body, and at the ridge line formed between the side surface of the piezoelectric body and the second main surface, The piezoelectric vibration device according to claim 10, connected to the drive electrode. - 前記支持部材の前記矩形の長辺の長さが、前記圧電素子の前記矩形の長辺の長さよりも長くされており、前記支持部材の前記圧電素子が接合されている部分の側方領域に前記第1の配線電極が至っている、請求項11に記載の圧電振動装置。 The length of the long side of the rectangular shape of the support member is longer than the length of the long side of the rectangular shape of the piezoelectric element, and a side region of the portion where the piezoelectric element of the support member is joined. The piezoelectric vibration device according to claim 11, wherein the first wiring electrode is reached.
- 前記支持部材の前記矩形の前記長辺の長さをL1、前記圧電体における活性領域の前記支持部材の前記矩形の長辺方向に沿う長さをL2としたときに、(L2/L1)×100%が75%以上である、請求項12に記載の圧電振動装置。 When the length of the long side of the rectangle of the support member is L1, and the length of the active region in the piezoelectric body along the long side direction of the rectangle of the support member is L2, (L2 / L1) × The piezoelectric vibration device according to claim 12, wherein 100% is 75% or more.
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Also Published As
Publication number | Publication date |
---|---|
JPWO2012060235A1 (en) | 2014-05-12 |
CN103155410A (en) | 2013-06-12 |
JP5605433B2 (en) | 2014-10-15 |
CN103155410B (en) | 2016-05-25 |
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