WO2012056873A1 - バスバ間内蔵コンデンサ、電力機器及び電力変換装置 - Google Patents
バスバ間内蔵コンデンサ、電力機器及び電力変換装置 Download PDFInfo
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- WO2012056873A1 WO2012056873A1 PCT/JP2011/073307 JP2011073307W WO2012056873A1 WO 2012056873 A1 WO2012056873 A1 WO 2012056873A1 JP 2011073307 W JP2011073307 W JP 2011073307W WO 2012056873 A1 WO2012056873 A1 WO 2012056873A1
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- capacitor
- bus bar
- bus bars
- built
- bus
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- 239000003990 capacitor Substances 0.000 title claims abstract description 111
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 16
- 239000003989 dielectric material Substances 0.000 claims abstract description 24
- 239000012212 insulator Substances 0.000 claims description 19
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 4
- 229910002113 barium titanate Inorganic materials 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 230000008030 elimination Effects 0.000 abstract 1
- 238000003379 elimination reaction Methods 0.000 abstract 1
- 238000009499 grossing Methods 0.000 description 14
- 238000009423 ventilation Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000011151 fibre-reinforced plastic Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
- H01G7/06—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture having a dielectric selected for the variation of its permittivity with applied voltage, i.e. ferroelectric capacitors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a bus bar built-in capacitor, a power device, and a power converter.
- Capacitors that can rapidly supply electrical energy to electrical circuits are used in a wide variety of power devices such as inverters (eg, high-voltage inverters), circuit breakers, transformers, and high-voltage power supplies. Further, the specifications of the capacitors are completely different depending on the difference in internal structure, voltage class, application, type of power equipment provided, and the like.
- a smoothing capacitor such as an aluminum electrolytic capacitor or a film capacitor is usually provided in an inverter (inverter panel) or an inverter unit constituting the inverter according to a voltage class.
- a snubber capacitor may be provided.
- An inverter such as a high-voltage inverter normally has an insulated gate bipolar transistor (Insulated Gate Bipolar Transistor; hereinafter referred to as “IGBT” as appropriate) and a smoothing capacitor electrically connected to the IGBT via a bus bar. ing.
- IGBT Insulated Gate Bipolar Transistor
- the smoothing capacitor becomes large, and therefore occupies a large volume ratio in the inverter.
- a certain amount of Spatial distance is required.
- Patent Document 1 describes a capacitor constituting a snubber circuit, in which a highly dielectric plate-like resin is provided in close contact with a facing region of a bus bar.
- the capacitor described in Patent Document 1 constitutes a snubber circuit as described above, and corresponds to a relatively low voltage (specifically, about 200 V or less). Therefore, the interval between the bus bars constituting the capacitor is narrow. Moreover, what is installed between bus bars is resin, and a dielectric constant is still low. Therefore, according to the technique described in Patent Document 1, a small capacitor such as a snubber capacitor can be reduced or reduced, but a capacitor provided between bus bars still has a small electric capacity. Therefore, the technique described in Patent Document 1 is insufficient to reduce or reduce the large-capacity high-voltage large capacitor such as a smoothing capacitor.
- the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a bus bar built-in capacitor, a power device, and a power conversion device that can reduce or reduce a large capacitor used in a high-voltage inverter or the like. Is to provide.
- the present inventors have found that by providing a high dielectric material having a particularly high dielectric constant between the bus bars, it is possible to provide a capacitor between the bus bars, a power device, and a power conversion device. It was.
- the present invention it is possible to provide a built-in capacitor between bus bars, a power device, and a power conversion device that can reduce or reduce a large capacitor used in a high-voltage inverter or the like.
- this embodiment a specific example of a built-in capacitor between bus bars according to a mode for carrying out the present invention (hereinafter referred to as “this embodiment” as appropriate) will be described in detail with reference to the drawings.
- the present invention is not limited to the following contents, and the present invention can be implemented with arbitrary changes within a range not departing from the gist thereof.
- FIG. 1 is a diagram schematically illustrating a bus bar provided with a built-in capacitor between bus bars according to the first embodiment.
- the inter-bus bar built-in capacitor 3 according to the first embodiment is provided between a pair of opposed bus bars, that is, an upper bus bar 1 and a lower bus bar 2.
- the inter-bus-bar built-in capacitor 3 according to the first embodiment includes a high dielectric material having a relative dielectric constant of 50 or more when a voltage of 1000 V is applied at 25 ° C.
- a plurality of inter-bus-bar capacitors 3 are provided between the pair of opposing bus bars (upper bus bar 1 and lower bus bar 2).
- An insulator 4 is provided between them.
- the inter-bus bar built-in capacitor 3 includes a high dielectric material.
- the relative dielectric constant of such a high dielectric material is 50 or more when a voltage of 1000 V is applied at 25 ° C. as described above, but is preferably 500 or more, more preferably 2000 or more. If the relative dielectric constant is too low, the inter-bus-bar capacitor including such a dielectric material cannot withstand high voltage, and dielectric breakdown may occur. Also, there is a possibility that the smoothing capacitor, which is usually a large capacitor with a large capacity, cannot be reduced in size or reduced.
- the inter-bus bar built-in capacitor 3 preferably has the same material as a so-called ceramic capacitor, and among them, barium titanate and zinc oxide-added silicon carbide are preferable. Note that one type of high dielectric material may be used alone, or two or more types may be used in any ratio and combination.
- the inter-bus bar built-in capacitor 3 usually includes an electrode in addition to the high dielectric material.
- the specific structure of the electrode is not particularly limited, it usually has an upper electrode in contact with the upper bus bar 1 and a lower electrode in contact with the lower bus bar 2.
- a high dielectric material is sandwiched between the upper electrode and the lower electrode.
- the distance between the upper electrode and the lower electrode is not particularly limited, but if it is too short, a short circuit may occur, and if it is too long, the capacitance of the capacitor between the bus bars may be reduced. Accordingly, it is usually 0.02 mm or more, preferably 0.05 mm or more, and usually 0.5 mm or less.
- a voltage applied in a high voltage inverter or the like is a high voltage, and therefore it is particularly important to provide a long inter-electrode distance in order to prevent dielectric breakdown. If the distance between the electrodes is long, the electric capacity is reduced.
- a sufficiently large electric capacity in the internal capacitor 3 between the bus bars even at such a long distance. Can be secured.
- FIG. 2 is a diagram schematically showing a preferred electrode structure used in the inter-bus-bar capacitor 3 according to the first embodiment.
- an upper electrode 5 in contact with an upper bus bar (not shown in FIG. 2), and an upper electrode 5
- the upper internal electrode 5a is connected to the lower bus bar (not shown in FIG. 2), and the lower internal electrode 6a is connected to the lower electrode 6 vertically.
- An electrode is preferred.
- a high dielectric material 7 is provided between the upper electrode 5 and the lower electrode 6.
- the upper internal electrode 5a and the lower internal electrode 6a are not necessarily provided perpendicular to the upper electrode 5 and the lower electrode 6, and may be provided substantially vertically. As shown in FIG. 3, the upper internal electrode 5 a and the lower internal electrode 6 a may be provided in parallel to the upper electrode 5 and the lower electrode 6. However, also in this case, the upper internal electrode 5a and the lower internal electrode 6a are not necessarily parallel, and may be substantially parallel.
- the contact area between the internal electrode and the high dielectric material 7 can be increased, and the electric capacity of the internal busbar capacitor 3 can be increased. Can be made larger. As a result, the large smoothing capacitor can be made smaller or reduced.
- the number of stacked layers 2 is particularly preferable as the structure of the electrode from the viewpoint that the number of electrodes can be increased.
- an insulator 8 may be provided between the upper electrode 5 and the lower internal electrode 6a and between the lower electrode 6 and the upper internal electrode 5a.
- the type of insulator is selected according to the voltage applied to the upper bus bar 1 and the lower bus bar 2, such as a mixture of barium titanate and manganese. What is necessary is just to determine suitably.
- a plurality of inter-bus-bar capacitors 3 according to the first embodiment are sandwiched between an upper bus bar 1 and a lower bus bar 2, and the adjacent inter-bus-bar capacitors 3 are sealed with an insulator 4.
- an insulator is not particularly limited as long as it has a high insulation resistance, and examples thereof include an insulating resin. Specific examples of the resin include epoxy resin, fiber reinforced plastic (FRP), unsaturated polyester, bakelite, and the like.
- FRP fiber reinforced plastic
- 1 type may be used independently and 2 or more types may be used by arbitrary ratios and combinations. For example, by providing an insulator 4 such as a resin between the bus bar built-in capacitors 3, creeping discharge between the ends of the bus bar built-in capacitors 3 can be prevented.
- an inter-bus bar capacitor unit 9 composed of an inter-bus bar capacitor 3 and an insulator 4 is manufactured, and the inter-bus bar capacitor units 9 are arranged on the lower bus bar 2 and arranged in a predetermined number.
- the inter-bus bar capacitor units 9 are arranged on the lower bus bar 2 and arranged in a predetermined number.
- the versatility of the bus bar built-in capacitor can be improved, and as a result, the manufacturing cost of the bus bar built-in capacitor can be reduced.
- the length of the bus bar in the lateral direction is long, it may be difficult to install a single internal capacitor between the bus bars (ie, a single high dielectric material).
- the inter-bus bar built-in capacitor according to the first embodiment since it is easy to handle, it can be easily installed.
- the inter-bus bar built-in capacitor 3 is a high dielectric material having a relative dielectric constant of 50 or more when a voltage of 1000 V is applied at 25 ° C. between a pair of opposed bus bars as described above. Is included. Therefore, it is not always necessary to provide a plurality of bus bar built-in capacitors 3 between a pair of bus bars, and a single bus bar built-in capacitor may be provided.
- FIG. 6 is a diagram schematically showing a modification of the inter-bus bar built-in capacitor 3 according to the first embodiment.
- a single inter-bus bar built-in capacitor 3 is provided over the entire area of the upper bus bar 1 and the lower bus bar 2. Further, the end portions of the inter-bus bar built-in capacitor 3 are arranged outside the end portions of the upper bus bar 1 and the lower bus bar 2. By arranging in this way, creeping discharge at the ends of the upper bus bar 1 and the lower bus bar 2 can be more reliably prevented.
- the end portion of the inter-bus bar built-in capacitor 3 is a high dielectric material itself.
- an insulator is provided at the end portion of the inter-bus bar built-in capacitor 3, and the end portion of the insulator is You may make it arrange
- FIGS. 1 to 6 the upper bus bar 1 and the lower bus bar 2 are bent, but the upper bus bar 1 and the lower bus bar 2 are not limited to the bent ones.
- the power device is a power device including a pair of opposed bus bars that supply power, and has a relative dielectric constant of 50 or more when a voltage of 1000 V is applied between the bus bars at 25 ° C. A high dielectric material is provided.
- the specific structure in the electric power apparatus which concerns on this embodiment is not restrict
- the power conversion device is a power conversion device that includes a switching element and includes a pair of opposed bus bars that supply power to the switching element.
- the power conversion apparatus includes 1000 V at 25 ° C. between the bus bars.
- a high dielectric material having a relative dielectric constant of 50 or more when the above voltage is applied is provided.
- FIG. 7 schematically shows an internal structure of an inverter panel 991 as a specific example of the power conversion apparatus according to this embodiment.
- the outer wall of the inverter panel 991 shown in FIG. 7 is usually a metal casing and is impermeable, and the internal structure cannot be observed from the outside.
- the internal structure is visualized for convenience of explanation. It shows.
- An inverter panel 991 as a power device shown in FIG. 7 includes an inverter unit 30 having a bus bar built-in capacitor according to this embodiment in a unit chamber 992, and further includes a fan 993, a ventilation duct 994, and a main circuit chamber 995. And at least a control unit 996.
- the inverter panel 991 is usually composed of a metal casing.
- the type of metal constituting the casing of the inverter panel 991 is not particularly limited. For example, stainless steel, iron, or the like is used.
- casing of the inverter panel 991 may be only 1 type, and 2 or more types may be combined arbitrarily.
- the unit chamber 992 is provided with the inverter unit 30 so that it can be inserted and removed.
- the number of inverter units 30 housed in the unit chamber 992 is three, but the number of inverter units 30 housed is not limited to three.
- the unit chamber 992 is provided with an opening (not shown) communicating with a ventilation duct 994 (described later). And the air in the ventilation duct 994 is sent into the inverter unit 30 through this opening. Further, a DC bus bar and control wiring (not shown) are provided inside the unit chamber 992.
- the fan 993 sends air to the inverter unit 30 through the ventilation duct 994.
- the fan 993 also feeds air into a main circuit chamber 995 described later.
- the specific configuration of the fan 993 is not particularly limited, and the number of fans 993 provided in the inverter panel 991 is not limited to the two illustrated in FIG. Further, the installation location is not particularly limited, but the apparatus can be simplified and the space can be saved by installing the inverter unit 99 collectively on the upper part of the inverter panel 991, without further installation. There is an advantage that when a fan fails, the failed fan can be easily replaced.
- the ventilation duct 994 serves as a ventilation path for blowing the air taken in by the fan 993 to each inverter unit 30. Further, the main circuit chamber 995 and the control unit 996 are provided with various power sources and control wirings (not shown), respectively, so that each inverter unit 30 is driven.
- FIG. 8 is a diagram schematically showing the internal structure of inverter unit 30 provided in inverter panel 991 shown in FIG. Also in FIG. 8, as in FIG. 7, the internal structure is visualized for convenience of explanation.
- the inverter unit 30 shown in FIG. 8 is a high dielectric having a relative dielectric constant of 50 or more when a voltage of 1000 V is applied between a pair of opposed bus bars at 25 ° C. according to this embodiment.
- An upper bus bar 1 and a lower bus bar 2 sandwiched by 3) that is, these bus bars become a pair of opposing bus bars, and are connected to the upper bus bar 1 and the lower bus bar 2.
- An IGBT 331, a fin 332 provided under the IGBT, an air filter 334, and a smoothing capacitor 339 connected to the upper bus bar 1 and the lower bus bar 2 are provided.
- the bus bar composed of the upper bus bar 1 and the lower bus bar 2 is made of a conductive metal, and supplies power to an IGBT 331 described later from a power supply source such as the control unit 996 provided in the inverter panel 991. It becomes a supply channel.
- the IGBT 331 is a semiconductor switching element, and power is supplied via the bus bar. Any known IGBT can be used as the IGBT 331.
- a fin 332 serving as a cooling fin for radiating heat generated from the IGBT 331 is provided below the IGBT 331.
- the air filter 334 passes when the air passing through the ventilation duct 994 is taken into the inverter unit 30.
- the air filter 334 can remove dust and the like from the air taken into the inverter unit 30.
- a smoothing capacitor 339 connected to the bus bar is provided between the power supply source such as the control unit 996 and the IGBT 331.
- the smoothing capacitor 339 accumulates electric charges, and the IGBT 331 is switched by the accumulated electric charges.
- the smoothing capacitor 339 for example, an aluminum electrolytic capacitor or a film capacitor can be used, and a known smoothing capacitor may be used as appropriate.
- the shape is also arbitrary, For example, things, such as a box shape and a column shape, can be used.
- a large capacitor used in a power conversion device such as a high-voltage inverter or a power device can be reduced in size or reduced. That is, since the power conversion device and the power device according to the present embodiment include the above-described capacitor between the bus bars, the large size of a smoothing capacitor or the like can be obtained without reducing the amount of electric charge accumulated in the power conversion device or the entire power device. Capacitors can be reduced in size or reduced. As a result, it is possible to reduce the size of the entire power conversion device or power device.
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Abstract
Description
図1は、第一実施形態に係るバスバ間内蔵コンデンサが設けられているバスバを模式的に表す図である。図1に示すように、第一実施形態に係るバスバ間内蔵コンデンサ3は、一対の対向するバスバ、即ち上バスバ1及び下バスバ2の間に設けられるものである。そして、第一実施形態に係るバスバ間内蔵コンデンサ3は、25℃で1000Vの電圧を印加した時の比誘電率が50以上である高誘電材料を含んでなるものである。また、図1に示す第一実施形態においては、上記一対の対向するバスバ(上バスバ1及び下バスバ2)間に複数のバスバ間内蔵コンデンサ3が設けられ、当該複数のバスバ間内蔵コンデンサ3の間には絶縁体4が設けられている。
第一実施形態に係るバスバ間内蔵コンデンサ3は高誘電材料を含んでなる。このような高誘電材料の比誘電率は、上記のように25℃で1000Vの電圧を印加した時の値で50以上であるが、好ましくは500以上、より好ましくは2000以上である。比誘電率が低すぎる場合、このような誘電材料を含むバスバ間内蔵コンデンサは高圧に耐えられず、絶縁破壊が起きる可能性がある。また、通常は大容量の大型コンデンサである平滑コンデンサを小型化したり削減したりすることができなくなる可能性もある。
第一実施形態に係るバスバ間内蔵コンデンサ3は、上記の高誘電材料の他にも、通常は電極を含む。電極の具体的な構造は特に制限されないが、通常は上バスバ1に接する上電極、及び下バスバ2に接する下電極を有する。そして、上電極と下電極との間に、高誘電材料が挟持されるようになっている。上電極及び下電極の間の距離は特に制限されるものではないが、過度に短すぎる場合短絡を起こす場合があり、過度に長すぎる場合バスバ間コンデンサの電気容量が低下する可能性がある。従って、通常は0.02mm以上、好ましくは0.05mm以上、また、通常は0.5mm以下とすることが望ましい。このように、例えば高圧インバータ等において印加される電圧は高圧であるため、絶縁破壊を防止するために電極間距離を長く設けることが特に重要である。電極間距離を長く設ければ電気容量は減少するが、本実施形態に係るバスバ間内蔵コンデンサ3によれば、このように長い距離であっても、バスバ間内蔵コンデンサ3において十分に大きな電気容量を確保することができる。
図1に示すように、第一実施形態に係るバスバ間内蔵コンデンサ3は、上バスバ1及び下バスバ2間に複数挟持され、さらに隣接するバスバ間内蔵コンデンサ3同士は絶縁体4にて封止されたものとなっている。このような絶縁体としては、絶縁抵抗が高いものであれば特に制限されるものではないが、例えば絶縁性の樹脂が挙げられる。樹脂の具体的な種類としては、例えばエポキシ樹脂、繊維強化プラスチック(Fiber Reinforced Plastics(FRP))、不飽和ポリエステル、ベークライト等が挙げられる。絶縁体としては1種が単独で用いられてもよく、2種以上が任意の比率及び組み合わせで用いられてもよい。そして、例えば樹脂等の絶縁体4をバスバ間内蔵コンデンサ3の間に設けることにより、バスバ間内蔵コンデンサ3の端部同士の沿面放電を防止することができる。
本実施形態に係る電力機器は、電力を供給する一対の対向するバスバを備えている電力機器であって、前記バスバ間に、25℃で1000Vの電圧を印加した時の比誘電率が50以上である高誘電材料が設けられているものである。本実施形態に係る電力機器における具体的な構成は特に制限されないが、本実施形態に係る電力機器に備えられるバスバ及び高誘電材料は、上記[1.バスバ間内蔵コンデンサ]において記載したものと同じものであるため、その説明を省略する。
本実施形態に係るバスバ間内蔵コンデンサに拠れば、高圧インバータ等の電力変換装置や電力機器に用いられる大型コンデンサを小型化若しくは削減することができる。即ち、本実施形態に係る電力変換装置や電力機器は、上記のバスバ間内蔵コンデンサを備えているため、電力変換装置や電力機器全体での電荷の蓄積量を減らすことなく、平滑コンデンサ等の大型コンデンサを小型化したり削減したりすることができる。その結果、電力変換装置や電力機器全体の小型化を図ることができる。
2 下バスバ
3 バスバ間内蔵コンデンサ
4 絶縁体
5 上電極
5a 上内部電極(内部電極)
6 下電極
6a 下内部電極(内部電極)
7 高誘電材料
8 絶縁体
30 インバータユニット
331 IGBT
332 冷却フィン
334 エアフィルタ
339 平滑コンデンサ
991 インバータ盤(インバータ)
992 ユニット室
993 ファン
994 通風ダクト
995 主回路室
996 制御部
Claims (10)
- 一対の対向するバスバ間に設けられるバスバ間内蔵コンデンサであって、
25℃で1000Vの電圧を印加した時の比誘電率が50以上である高誘電材料を含んでなる
ことを特徴とする、バスバ間内蔵コンデンサ。 - 前記一対の対向するバスバのうちの一方のバスバと電気的に導通する櫛歯状構造の内部電極が前記一対の対向するバスバ間に設けられ、
前記内部電極間に前記高誘電材料が設けられている
ことを特徴とする、請求項1に記載のバスバ間内蔵コンデンサ。 - 前記高誘電材料がチタン酸バリウム及び/又は酸化亜鉛添加炭化ケイ素である
ことを特徴する、請求項1に記載のバスバ間内蔵コンデンサ。 - 前記櫛歯状構造の内部電極が、前記一方のバスバに対して平行若しくは略平行又は垂直若しくは略垂直に設けられている
ことを特徴とする、請求項2に記載のバスバ間内蔵コンデンサ。 - 前記櫛歯状構造の内部電極の先端部と、前記一対の対向するバスバのうちの他方のバスバと、の間に、絶縁体が設けられている
ことを特徴とする、請求項2に記載のバスバ間内蔵コンデンサ。 - 前記バスバ間内蔵コンデンサの端部、又は該端部のさらに外側に設けられている絶縁体の端部が、前記バスバの端部よりも外側に配置されている
ことを特徴とする、請求項1に記載のバスバ間内蔵コンデンサ。 - 前記一対の対向するバスバ間に複数設けられている
ことを特徴とする、請求項1に記載のバスバ間内蔵コンデンサ。 - 前記複数のバスバ間内蔵コンデンサにおいて、隣接する前記バスバ間内蔵コンデンサの間には絶縁体が設けられている
ことを特徴とする、請求項7に記載のバスバ間内蔵コンデンサ。 - 電力を供給する一対の対向するバスバを備えている電力機器であって、
前記バスバ間に、25℃で1000Vの電圧を印加した時の比誘電率が50以上である高誘電材料が設けられている
ことを特徴とする、電力機器。 - スイッチング素子を備え、該スイッチング素子に電力を供給する一対の対向するバスバを備えている電力変換装置であって、
前記バスバ間に、25℃で1000Vの電圧を印加した時の比誘電率が50以上である高誘電材料が設けられている
ことを特徴とする、電力変換装置。
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CN2011800514512A CN103180921A (zh) | 2010-10-28 | 2011-10-11 | 母线间内置电容器、电力设备以及电力变换装置 |
US13/880,895 US9105397B2 (en) | 2010-10-28 | 2011-10-11 | Capacitor embedded between busbars, electric power device and electric power conversion device |
EP11836012.2A EP2634782A4 (en) | 2010-10-28 | 2011-10-11 | OMNIBUS BAR MOUNTED CAPACITOR, ELECTRICAL DEVICE, AND ELECTRIC POWER CONVERSION DEVICE |
KR1020137010596A KR101449883B1 (ko) | 2010-10-28 | 2011-10-11 | 버스바간 내장 콘덴서, 전력 기기 및 전력 변환 장치 |
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US8754462B2 (en) | 2012-03-09 | 2014-06-17 | Mitsubishi Electric Corporation | Semiconductor device |
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CN105321886B (zh) * | 2014-05-29 | 2019-07-05 | 联华电子股份有限公司 | 电容器结构及其制造方法 |
KR102254876B1 (ko) * | 2019-06-03 | 2021-05-24 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 실장 기판 |
JP7097341B2 (ja) * | 2019-10-02 | 2022-07-07 | 株式会社デンソー | コンデンサ |
WO2022092817A1 (ko) | 2020-10-27 | 2022-05-05 | 주식회사 만도 | 수소 연료 전지 차량용 직류 컨버터 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0855752A (ja) * | 1994-08-10 | 1996-02-27 | Taiyo Yuden Co Ltd | 積層コンデンサの実装方法及び積層コンデンサ |
JPH1098887A (ja) * | 1996-09-20 | 1998-04-14 | Hitachi Ltd | 電力変換装置 |
JP2003319665A (ja) * | 2002-04-19 | 2003-11-07 | Toyota Motor Corp | 電力変換装置 |
JP2008295227A (ja) | 2007-05-25 | 2008-12-04 | Toyota Motor Corp | コンデンサ一体バスバーの製造方法および電力変換装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4517406A (en) * | 1984-05-14 | 1985-05-14 | Eldre Components, Inc. | Laminated bus bar containing multilayer ceramic capacitors |
US4599486A (en) * | 1985-09-06 | 1986-07-08 | Rogers Corporation | High capacitance bus bar including multilayer ceramic capacitors |
US5142439A (en) * | 1991-08-28 | 1992-08-25 | Allied-Signal Inc. | Integrated bus bar/multilayer ceramic capacitor module |
JP4108602B2 (ja) * | 2001-08-28 | 2008-06-25 | Tdk株式会社 | 薄膜容量素子用組成物、高誘電率絶縁膜、薄膜容量素子および薄膜積層コンデンサ |
KR20050060401A (ko) * | 2003-12-16 | 2005-06-22 | 삼성전자주식회사 | 고유전물질을 포함하는 수직 핑거 커패시터 제조 방법 |
US7504150B2 (en) * | 2005-06-15 | 2009-03-17 | E.I. Du Pont De Nemours & Company | Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto |
JP5152174B2 (ja) * | 2007-03-08 | 2013-02-27 | パナソニック株式会社 | ケースモールド型コンデンサおよびその使用方法 |
-
2010
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0855752A (ja) * | 1994-08-10 | 1996-02-27 | Taiyo Yuden Co Ltd | 積層コンデンサの実装方法及び積層コンデンサ |
JPH1098887A (ja) * | 1996-09-20 | 1998-04-14 | Hitachi Ltd | 電力変換装置 |
JP2003319665A (ja) * | 2002-04-19 | 2003-11-07 | Toyota Motor Corp | 電力変換装置 |
JP2008295227A (ja) | 2007-05-25 | 2008-12-04 | Toyota Motor Corp | コンデンサ一体バスバーの製造方法および電力変換装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2634782A4 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8754462B2 (en) | 2012-03-09 | 2014-06-17 | Mitsubishi Electric Corporation | Semiconductor device |
DE102012224354B4 (de) | 2012-03-09 | 2021-09-30 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
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JP5469584B2 (ja) | 2014-04-16 |
CN103180921A (zh) | 2013-06-26 |
KR20130079562A (ko) | 2013-07-10 |
EP2634782A4 (en) | 2015-11-25 |
US20130279227A1 (en) | 2013-10-24 |
KR101449883B1 (ko) | 2014-10-10 |
JP2012094773A (ja) | 2012-05-17 |
US9105397B2 (en) | 2015-08-11 |
EP2634782A1 (en) | 2013-09-04 |
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