WO2012052531A1

WO2012052531A1 - Oled module

Info

Publication number: WO2012052531A1
Application number: PCT/EP2011/068395
Authority: WO
Inventors: Jörg AMELUNG; Christian Kirchhof; Michael Eritt
Original assignee: Ledon Oled Lighting Gmbh & Co. Kg
Priority date: 2010-10-21
Filing date: 2011-10-21
Publication date: 2012-04-26
Also published as: EP2630680A1; CN103238229A; DE102010042727A1; CN103238229B

Abstract

The invention relates to an OLED module comprising an OLED panel (10) and a plate-shaped carrier element (30) having a surface (35) on which the OLED panel (10) is arranged. The carrier element (30) has a region (36) projecting with respect to the OLED panel (10). Furthermore, the OLED module comprises a driver electronics arrangement (32) for electronically driving the OLED panel (10). The driver electronics arrangement (32) comprises a component (32') which is arranged at the projecting region (36) on the carrier element (30) and which does not extend beyond the OLED panel (10) in a direction (R) perpendicular to the surface (35). This arrangement makes it possible to configure the OLED module in a particularly flat fashion, the driver electronics arrangement (32) having no effect on the minimum structural height of the OLED module.

Description

OLED module

The invention relates to an OLED module (OLED: organic light-emitting diode) with an OLED panel and a plate-shaped carrier element with a surface on which the OLED panel is arranged, wherein the carrier element has a region projecting with respect to the OLED panel , as well as with one

Driver electronics arrangement for the electronic control of the OLED panel.

Furthermore, the invention relates to a luminaire with such an OLED module as the light source.

A corresponding OLED module is known from US 2008/0231180 AI, wherein the carrier element is a printed circuit board. The driver electronics assembly is arranged opposite with respect to the OLED panel of the circuit board opposite. This results in particular a comparatively large height for the OLED module.

The invention has for its object to provide an improved OLED module, which can be designed in particular with a comparatively low overall height. In addition, a luminaire is to be specified with such an OLED module. This object is achieved according to the invention with the objects mentioned in the independent claims. Particular embodiments of the invention are indicated in the dependent claims.

According to the invention, an OLED module is provided, which has an OLED panel, and a plate-shaped carrier element with a surface, on which the OLED panel is arranged, wherein the carrier element has a, with respect to the OLED panel projecting area. Furthermore, the OLED module has a

Driver electronics assembly for the electronic control of the OLED panel. The driver electronics assembly comprises a component which is connected to the projecting Area is arranged on the support element and which does not extend beyond the OLED panel in a direction perpendicular to the surface.

This arrangement makes it possible to make the OLED module particularly flat, in particular so that it has a height that is not greater than the sum of a thickness or thickness of the plate-shaped carrier element and a thickness or thickness of the OLED panels. In particular, the driver electronics assembly in this way has no effect on the minimum height of the OLED module. Particularly advantageously, all components of the driver electronics are arranged on the protruding region on the carrier element, wherein they do not extend beyond the OLED panel in a direction perpendicular to the surface. Furthermore, preferably, the OLED module is designed such that all components of the

Driver electronics assembly not more than 2.0 mm beyond the surface in the direction extend.

Advantageously, the carrier element has a depression or a recess in the surface on the protruding region, wherein at least one component of the driver electronics arrangement is arranged at least partially in the depression or in the recess. This makes it possible to achieve a further reduction in the overall height. In addition, this can cause a mechanical support of the relevant component of the driver electronics assembly on the support plate.

Preferably, the OLED panel has a flat side, with which it on the

Surface of the support element is arranged, wherein all components of

Driver electronics assembly are arranged in a region along the lateral boundaries of the flat side. As a result, it is possible, in particular in the case of a bendable or flexibly designed OLED module, to achieve this flexibility only comparatively little due to the components of the driver electronics assembly

is restricted.

Preferably, the OLED module further comprises at least one electrical

Contact element, which serves an electrical and mechanical connection between the support element and the OLED panel. This way you can have a produce corresponding electrical connection and also cause a mechanical stabilization of the OLED panel on the support element.

Further advantageously, the OLED module on a protective layer element, which is arranged with respect to the OLED panel opposite to the carrier element on the OLED panel. With the protective layer element not only a protection of the OLED panel can be achieved, but also a planarization of a surface of the OLED panel. If the protective layer element is made transparent, it may be provided that a light generated by the OLED panel by the

Protective layer element is discharged through to the outside.

The carrier element is preferably a printed circuit board, which is electrically and mechanically connected to the OLED panel. Furthermore, a particularly low overall height of the OLED module can be achieved if the carrier element has a thickness which is less than 1000 μπι, preferably less than 100 μιη.

The OLED module can furthermore advantageously be designed as a bendable or as a rigid OLED module.

A particularly good protection of the driver electronics assembly and / or a particularly good stability of the OLED module can be achieved if the OLED module further comprises a potting compound which is at least one component of the

Driver electronics assembly, preferably around all components of the

Driver electronics assembly is arranged. The potting compound is preferably impermeable to water and / or elastic.

Further protection can be achieved by a housing which is arranged around the OLED panel. Preferably, the housing is made of metal.

As a result, a particularly good dissipation of heat is possible, which can arise during operation of the OLED module. The carrier element may advantageously have a hexagonal shape. In this case, the OLED module is particularly suitable, for example, when several identical OLED modules are to be assembled to form one

Light output range of a lamp to form.

According to a further aspect of the invention, a luminaire is provided which has at least one inventive OLED module as the light source.

The invention is explained in more detail below with reference to exemplary embodiments and with reference to the drawings. Show it:

1 is a cross-sectional sketch of a first exemplary embodiment of an OLED module according to the invention,

2 is a cross-sectional diagram of a second embodiment,

3 is a cross-sectional diagram of a third embodiment,

4 is a sketched plan view of the third embodiment,

Figures 5, 6a and 6b sketches to another exemplary embodiment with hexagonal shape and

Figures 7 and 8 perspective sketches to the embodiment with hexagonal shape.

In Fig. 1 is a cross section through a first exemplary embodiment of a

sketched OLED module according to the invention. The OLED module has an OLED panel 10 and a plate-shaped carrier element 30 with a surface 35 on which the OLED panel 10 is arranged.

The OLED panel 10 may be constructed, for example, as follows: a transparent ITO (indium-tin-oxide) on glass with about 100 nm thickness, an organic layer (with up to seven sub-layers) with a thickness of about 100 to 200 nm and a metallic cathode (for example aluminum) with a thickness of about 100 to 500 nm.

The carrier element 30 has a region 36 projecting with respect to the OLED panel 10.

Furthermore, the OLED module has a driver electronics assembly 32 for the electronic control of the OLED panel 10. The driver electronics assembly 32 in this case comprises a component 32 'which is arranged on the projecting region 36, in particular on or on the surface 35, on the carrier element 30 and which in this case does not extend beyond the OLED in a direction R perpendicular to the surface 35. Panel 10 extends. With reference to the illustration of FIG. 1, therefore, the component 32 'does not extend further beyond the surface 35 than the OLED panel 10. It is therefore provided that - calculated from the surface 35 - the

Extension of the component 32 'is not greater than the extension of the OLED panel 10th

With this arrangement, it is possible to make the OLED module particularly flat or with a particularly low overall height. In particular, it can be provided that the OLED panel 10 has a flat side 15 - hereinafter also referred to as underside 15 - with which it is arranged on the surface 35 of the carrier element 30. In this case, a region of the carrier element 30, which is located outside the normal projection or the normal projection surface P of the underside 15 or the side 15 on the carrier element 30, is designated by the projecting region 36.

An overall particularly flat design is made possible if all components of the driver electronics assembly 32 are arranged according to the above-mentioned arrangement on the projecting portion 36 on the support member 30. In this way, it is achieved that no component of the drive electronics assembly 32 extends in a direction or in the direction R perpendicular to the surface 35 beyond the OLED panel 10. For example, the configuration may be such that no component of the driver electronics assembly 32 extends more than 2.0 mm or more than 1.8 mm beyond the surface 35. An even further reduction of the height can be achieved if the support member 30 at the protruding portion 36 has a recess (not shown in the figures) or a recess in the surface 35 and at least one component of the driver electronics assembly 32 at least partially in the recess or is arranged in the recess. In this way, it is advantageously possible to electrically contact the relevant component with the carrier element 30 and thereby also to mechanically support the carrier element 30. Furthermore, the OLED module can have at least one electrical contact element 31 which serves for an electrical and mechanical connection between the carrier element 30 and the OLED panel 10. As shown by way of example in FIG. 1, the OLED panel 10 may comprise a base substrate element 10 ', consisting for example of glass, as well as an encapsulation element 10 ", wherein the underside 15 of the OLED panel 10 has a side or a bottom side of the encapsulation element 10 "is. In this case, the base substrate element 10 'with respect to the

Encapsulation element 10 "having a projecting portion 13, which is with this projecting portion 13 of the base substrate element 10 '- analogous to the above definition of the protruding portion 36 of the support member 30 - a portion of the base substrate element 10' is designated, which is outside The normal projection or the normal projection surface P of the underside 15 or the side 15 is located on the carrier element 30. A contact surface 11 of an electrode of the OLED panel 10 can be arranged on this protruding region 13 of the base substrate element 10 ' This makes it possible to produce a reliable electrical and mechanical connection between the OLED panel 10 and the carrier element 30 comparatively easily.

In this embodiment, therefore, results between the surface 35 of the

Carrier element 30 on the one hand and the protruding portion 13 of the Grundsubstrat- element 10 'has a "recess", which advantageously at least partially for a

Arrangement of the driver electronics assembly 32 can be used. Seen in the top view, this recess may be annularly formed around the encapsulation element 10 ". Overall, several, for example, four, such electrical contact elements 31 and contact surfaces 11 may be provided. Furthermore, an adhesive layer can additionally be provided between the underside 15 of the OLED panel 10 and the carrier element 30, which serves for the mechanical connection between these two parts.

Furthermore, the OLED module can have a preferably light-permeable protective layer element 20, which is arranged on the OLED panel 10 opposite to the carrier element 30 with respect to the OLED panel 10. It can accordingly a light output of the OLED panel 10 through the translucent designed

Protective layer element 20 may be provided therethrough. With reference to the illustration of FIG. 1, therefore, the protective layer element 20 is arranged on top of the OLED panel 10 and an upward light emission is provided. The protective layer element 20 can be optically and mechanically connected to the OLED panel 10 in order to planarize a surface 16 of the OLED panel 10. The protective layer element 20 can be arranged or held on the OLED panel 10 by means of an adhesive layer.

The OLED module may thus comprise, in particular, three layers, wherein a first layer is formed by the protective layer element 20, a second layer by the OLED panel 10 and a third layer by the carrier element 30.

The carrier element 30 is preferably a printed circuit board, which is mechanically and electrically connected to the OLED panel 10. In this case, with reference to the lowest possible height of the OLED module, the carrier element 30 or the printed circuit board advantageously has a thickness which is less than 1000 μπι, preferably less than 100 μτη.

The driver electronics assembly 32 may include a driver IC for a

Constant power supply of the OLED panel 10 have, as well as passive

Components, such as a resistor for current adjustment or a coil and a capacitor for smoothing the output voltage. Furthermore, an integration of a bus interface for external control of the OLED module can be provided. For this purpose, in particular a microcontroller can be integrated, and optionally a level converter, if desired, and passive components.

With reference to the illustration of FIG. 1, therefore, preferably all components of the driver electronics assembly 32 have a flat design, so that they do not extend beyond the OLED panel 10 upwards. In this case, these components are arranged next to the OLED panel 10 or between the protruding region 13 of the base substrate element 10 'and the surface 35 of the carrier element 30. This flat design achieves a lower overall height of the OLED module compared to the prior art. The components of the driver electronics assembly 32 can in the areas of contact between the support member 30 and the

PCB and the OLED panel 10 in the "recesses" of the

Encapsulation element 10 "may be arranged so that this space is used particularly well.

Furthermore, the OLED module for electrical connection may have electrical connections 33.

With the at least one electrical contact element 31 to the OLED panel 10, active and passive driver components of the driver electronics assembly 32 and the terminals 33 to the outside so the circuit board can simultaneously mechanically and electrically connect to the OLED panel 10; In addition, a mechanical stabilization and an activation of the OLED module can thus be effected.

The OLED panel 10, the protective layer element 20 and the carrier element 30 may be rigid or flexible or bendable. An integration of said electrical components may be provided by means of SMD, chip-on-board, chip-on-foil or similar techniques; These techniques are advantageous with respect to a flat design.

The components of the driver electronics assembly 32 may be provided in particular in a region along the lateral boundaries of the underside 15, ie in FIG the plan view in an annular area around the bottom 15 around. A bendability or flexibility of the OLED module is not or at least only slightly limited by this arrangement or the flexibility or flexibility is limited only within said area around the bottom 15 around.

2, a further embodiment is outlined. Unless stated otherwise, the statements with reference to the first embodiment also apply to the second embodiment and the reference numerals are used analogously. Thus, in the following, only the differences from the first exemplary embodiment will be discussed.

In the second embodiment, a potting compound 40 is additionally provided; In particular, the potting compound 40 may be disposed in a region around the OLED panel 10, between the carrier element 30 and the

Protective layer element 20. In this way, the mechanical stability can be further increased and / or it can be an encapsulation of the components or the

Achieve contact surfaces, which ensures a particularly good protection. In this case, the potting compound 40 may be particularly preferably impermeable to water.

It may also be a potting compound 40 may be provided in which no complete curing takes place, so an elastic potting compound 40; This makes it possible to make the OLED module with the potting compound 40 bendable or flexible.

In Fig. 3, a third embodiment is outlined; Fig. 4 shows a corresponding supervision. Again, the above statements apply accordingly, so that only the differences from the above representations will be discussed. In this embodiment, the OLED module further comprises a housing 50. The

Housing 50 may have a bottom plate, which is arranged opposite to the OLED panel 10 with respect to the support member 30, so to speak, as a further, ie fourth position in the sense of the above-mentioned three layers. The housing 50 may in particular have openings for the electrical connections 33. It can be provided that 33 wires are soldered to the electrical connections or that by means of spring or terminal contacts an electrical connection to a power supply is established.

The housing may in particular be arranged around the OLED panel 10. By the housing 50, the encapsulation of the OLED module can be further increased. The housing 50 is preferably made of metal. As a result, a particularly good dissipation of heat is possible, which may arise during operation of the OLED panel 10.

In addition, can be influenced by the housing 50 advantageously the outer shape or shape of the OLED module, so that in this way the

Design options are improved with respect to the appearance of the OLED module.

4, the potting compound 40 and the housing 50 are omitted, one obtains corresponding views for the first and second embodiment. The reference numeral 12 denotes a luminous area of the OLED panel 10.

As is further apparent from FIG. 4, it can be provided that the carrier plate 30 is rectangular, wherein the components of the driver electronics assembly 32 are arranged on only two, given by this form, opposite sides on the support plate 30. As a result, a flexibility of the OLED module about an axis parallel to the respective two sides is particularly limited, if appropriate, in particular.

However, a rectangular shape is not mandatory. It can also be provided according to the invention that the OLED module seen in plan view has a shape that is not rectangular, for example, a hexagonal shape. This is shown by way of example with reference to a further exemplary embodiment in FIGS. 5, 6a and 6b. Again, the above statements apply accordingly, so that in

Below only the differences to the above explanations will be discussed. 6 shows a plan view of the OLED module without the protective layer element 20, and FIG. 6b shows a plan view of the OLED module with the protective layer element 20.

The hexagonal shape of the OLED module can be given by a corresponding shape of the support member 30. The OLED panel 10 may, for example, be designed octagonal and furthermore, for example, have a circular luminous surface 12.

The hexagonal shape of the OLED module is particularly suitable for the case where several OLED modules are to be joined together as closely as possible, so that a luminaire is formed with a light emitting surface, which is composed of the luminous surfaces of the individual OLED modules.

Fig. 7 shows a sketch like an exploded view of the latter

Embodiment. The reference numeral 21 denotes a decoupling system and the reference numeral 22 an optical surface (diffuse / specular). FIG. 8 shows by way of example the carrier element 30, here as a printed circuit board, with the integrated components or components of the driver electronics assembly 32.

For example, the driver electronics assembly 32 may include: PWM

Current driver, DMX 512 interface, optional touch interface; PWM

Driver specifications: 12V or 24V supply, 350mA PWM drift, 400: 1 dimming, 82% efficiency, 1.7mm overall height.

The OLED module according to the invention is particularly suitable for being used as a light source of a luminaire, for example for room lighting. Therefore, according to the invention, a luminaire is provided which has at least one OLED module as a light source. The light can be in accordance with the above

Configurations advantageously be designed particularly flat.

Claims

claims

OLED module, comprising

- an OLED panel (lO),

a plate-shaped carrier element (30) having a surface (35) on which the OLED panel (10) is arranged,

wherein the carrier element (30) has a region (36) projecting with respect to the OLED panel (10) and

a driver electronics arrangement (32) for the electronic control of the OLED panel (10),

characterized,

in that the driver electronics arrangement (32) comprises a component which is arranged on the projecting region (36) on the carrier element (30) and which in a direction (R) perpendicular to the surface (35) does not pass over the OLED panel (FIG. 10) extends.

OLED module according to claim 1,

wherein all components of the driver electronics assembly (32) are disposed on the protruding portion on the support member (30) and do not extend beyond the OLED panel (10) in a direction perpendicular to the surface.

OLED module according to claim 1 or 2,

wherein all components of the driver electronics assembly (32) extend no more than 2.0 mm above the surface (35).

OLED module according to one of the preceding claims,

in which the carrier element (30) has a depression or a recess in the surface (35) on the projecting region and at least one component of the driver electronics assembly (32) at least partially in the depression or is arranged in the recess.

OLED module according to one of the preceding claims,

wherein the OLED panel (10) has a flat side (15) with which it is arranged on the surface (35) of the carrier element (30), wherein all components of the driver electronics assembly (32) in a region along the lateral

Limits of the flat side (15) are arranged.

OLED module according to one of the preceding claims,

still having

- At least one electrical contact element (31), which serves an electrical and mechanical connection between the carrier element (30) and the OLED panel (10).

OLED module according to one of the preceding claims,

still having

- A protective layer element (20) with respect to the OLED panel (10) the support member (30) opposite to the OLED panel (10) is arranged, wherein the protective layer element (20) is preferably transparent.

OLED module according to one of the preceding claims,

in which the carrier element (30) is a printed circuit board which is electrically and mechanically connected to the OLED panel (10).

OLED module according to one of the preceding claims,

in which the carrier element (30) has a thickness which is less than 1000 μιη, preferably less than 100 μιη.

10. OLED module according to one of the preceding claims,

the bendable or rigid OLED module is formed.

11. OLED module according to one of the preceding claims,

still having

- A potting compound (40), the at least one component of Driver electronics assembly (32), preferably around all components of

Driver electronics assembly (32) is arranged,

wherein the potting compound (40) is preferably impermeable to water and / or elastic.

OLED module according to one of the preceding claims,

still having

- A housing (50) which is arranged around the OLED panel (10) around, wherein the housing (50) is preferably made of metal.

OLED module according to one of the preceding claims,

in which the carrier element (30) has a hexagonal shape.

14. Light, comprising

at least one OLED module according to one of the preceding claims as a light source of the lamp.