WO2012049209A1 - Système et procédé laser destiné à usiner des surfaces à l'aide de moyens de mesure et d'une commande - Google Patents

Système et procédé laser destiné à usiner des surfaces à l'aide de moyens de mesure et d'une commande Download PDF

Info

Publication number
WO2012049209A1
WO2012049209A1 PCT/EP2011/067804 EP2011067804W WO2012049209A1 WO 2012049209 A1 WO2012049209 A1 WO 2012049209A1 EP 2011067804 W EP2011067804 W EP 2011067804W WO 2012049209 A1 WO2012049209 A1 WO 2012049209A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
workpiece
laser beam
measuring means
laser system
Prior art date
Application number
PCT/EP2011/067804
Other languages
German (de)
English (en)
Inventor
Detlef Gerhard
Karl Weidner
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2012049209A1 publication Critical patent/WO2012049209A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the invention relates to a laser system for machining surfaces, in particular for the structuring of coated materials as well as a corresponding method and an ent ⁇ speaking use.
  • Laser systems for machining surfaces allow the removal of thin layers, without resorting to übermä ⁇ SSIG loaded thermally or mechanically to as layer to be removed material adjacent materials in the pitch.
  • layers of different material systems for example fine-layer systems of organic and / or inorganic layers with thicknesses in the nanometer and micrometer range can be removed or patterned.
  • An object of the present invention is therefore to provide a laser system for treatment of surfaces as well as a corresponding method which enables a more reliable processing of surfaces, in particular Abtra ⁇ supply of layers.
  • the device should be simple and inexpensive to produce or the process should be simple and inexpensive to carry out.
  • the flexibility of the device or the method should be increased.
  • a laser system for processing surfaces comprising a laser source for generating a laser beam having at least one wavelength, a workpiece carrier on which a workpiece to be machined, preferably a wafer, is arranged with the laser beam can be acted upon, measuring means for monitoring a loaded with the laser beam portion of the workpiece, and control means for controlling the laser beam, wherein the control means and the measuring means cooperate such that a substantially continuous adjustment of the La ⁇ serstrahls in dependence of measured values of the measuring means he follows .
  • This object is also provided a method for machining machining of surfaces, in particular for the structuring of coated materials, and particularly suitable for off ⁇ guide with a device according to at least one of claims 1 - dissolved 9, comprising the steps of generating a laser beam having at least one wavelength, Irradiating a workpiece on a workpiece carrier with the generated laser beam, monitoring a region of the workpiece loaded with the laser beam by means of measuring means, and essentially continuous adjustment of the laser beam as a function of values of the measuring means.
  • the laser system and the corresponding method have that thus the intensity of the incident on the material to be treated laser source is automatically adjusted to the refreshes ⁇ elle situation, such as a layer to be removed, ie in particular the required heat input, the thickness of the material layer ak ⁇ TULLE to edit the advantage ,
  • This not only increases the accuracy of the processing of entspre ⁇ sponding surface but the laser system is also easy and inexpensive to produce and the corresponding procedural ⁇ ren simple and inexpensive to carry out.
  • the automatic adaptation also provides increased flexibility, since even greater tolerances can be reliably processed during the machining of surfaces, in particular during the removal of corresponding layers with the laser system or with the corresponding method.
  • positioning means for at least two-dimensional positioning of the workpiece carrier are arranged relative to the laser source.
  • This has the advantage that advertising placed by the workpiece support in an optimum position relative to the laser source, the workpiece to be machined the can, so that a complicated shift in ⁇ game as a beam optics of the laser source omitted who can ⁇ .
  • it is possible not only to move the workpiece carrier by means of positioning, but in addition also the laser source, if necessary, together with appropriate beam optics to allow for faster and / or more accurate positioning.
  • the positioning means for positio ⁇ discrimination in the nanometer range are formed.
  • An extremely precise and reliable machining of the workpiece by the laser system can take place.
  • the positioning means cooperate with the control means and / or the measuring means for machining the workpiece.
  • This further increases the Reliable ⁇ ness of the laser system in the processing of the workpiece, since these agents, in particular to determine the laser beam and / or technologicaltra ⁇ constricting residual layer thickness of the workpiece and the tax then réellesstoff corresponding to specifically adapt the energy input of the laser ⁇ source thereto, so that stillclocktra ⁇ constricting residual layer thickness is extremely accurate and reliable ablated ⁇ gen without damaging underlying layers.
  • the positioning means in turn allow accurate positioning of the workpiece carrier relative to the laser source, so that a reliable machining of the workpiece is made possible at the desired location.
  • a light source in particular a flash lamp is arranged for analyzing the area of the work ⁇ piece, which is mandated by the laser beam.
  • the advantage achieved here is that this actively exposes the workpiece to be machined.
  • the light reflected from the surface of the work light is then split into wavelengths give rich, for which purpose the entire wave length range ⁇ or only partial areas of the reflected wavelength range may be used.
  • the reflected light of the different wavelength ranges is mapped, for example, to different photosensitive sensors. Through the active exposure can be an illumination of the top
  • Layer of the workpiece to be machined can be achieved.
  • Information about the remaining residual layer ⁇ thickness can then be determined at ⁇ hand an analysis of reflection and transmission data.
  • the light source is arranged in such a way that an optical path of the light of the light source is substantially at least partially connected to a beam path of the laser beam. Beam matches. In this way a cultivatedgünsti ⁇ ges laser system is possible because optical components can be dispensed with for a completely separate the beam path of the light from the light source.
  • the measuring means are adapted to ⁇ Strah ⁇ lung in the wavelength range between 100 nm and 20, in particular between 300 nm and 10 ⁇ to be measured.
  • the measuring means are adapted to ⁇ Strah ⁇ lung in the wavelength range between 100 nm and 20, in particular between 300 nm and 10 ⁇ to be measured.
  • the laser source is designed as a pulse laser, in particular as a picosecond pulse laser.
  • a pulse laser has the advantage among others that are not too strong, he ⁇ hitzt for a reliable processing of the surface of the workpiece is made possible with the laser to be ⁇ working surface of the workpiece.
  • the material to be removed is evaporated and residue deposited on the surface of the work ⁇ tee. Due to the extremely short exposure ei ⁇ nes picosecond laser pulse of the denlaser Picosekun- with the material to be removed of the workpiece is only verome powder coated. Then this can be extracted in an extremely simple Wei ⁇ se, for example by means of a fan.
  • the measuring means comprise an at least two ⁇ dimensional imaging camera, which cooperates with the light source for the analysis of the portion of the workpiece, which is acted upon by the laser beam ⁇ .
  • the advantage achieved thereby is that, if necessary, residues on the surface of the work ⁇ piece can be detected by the removal by means of the laser beam and possibly eliminated, so that a machining of a workpiece is even more reliable possible.
  • the monitoring means of the Messmit ⁇ tel by spectroscopy is performed.
  • the advantage achieved is that thus also the material of the surface to be machined of the workpiece can be reliably determined. It is also possible, for example, not only to determine a layer transition between two layers, ie whether the layer to be removed has now been completely removed and thus the underlying layer has been exposed, but it is thus also possible to determine non-removed residual layer thicknesses and if necessary, reprocess the spot with the laser beam of the laser source adjusted accordingly. In this way, the reliability of the procedural ⁇ proceedings is increased even further.
  • FIG. 1 shows a laser system according to an embodiment of the present invention
  • FIG. 2 is a flowchart of steps of a method according to an embodiment of the present invention.
  • reference numeral 1 denotes a laser system according to an embodiment of the invention.
  • the laser system 1 includes fully while a laser source 2 which is formed as a picosecond laser from ⁇ . Between the laser source 2 and a workpiece 4, which is arranged on a workpiece carrier 3, a laser beam optics 2a in the form of lenses, mirrors, or the like is arranged. The laser source 2 can then generate a La ⁇ serstrahl L i and apply the workpiece 4 with this on the laser beam optics 2a.
  • the laser source 2 is provided with control means 6 for controlling the laser source 2 connected.
  • a positioning device 7b Arranged on the workpiece carrier 3 is a positioning device 7b, which comprises a nanopositioning device 7c, so that the workpiece carrier 3 and thus the workpiece 4 can be positioned relative to the laser source 2 with an accuracy in the nanometer range.
  • appropriate control means 7a for controlling the Po ⁇ sitiontechniks worn 7b and 7c are arranged Nanoposition michsein- direction.
  • the laser system 1 comprises measuring means 5a, 5b, 5c for monitoring a region of the workpiece which is acted upon by a laser beam of the laser source.
  • the measuring means comprise a measuring means 5a optics 5b, 5c, and a deflecting mirror entspre ⁇ sponding analysis means. Reflected on the surface of the workpiece 4 and / or scattered light by the measuring optics ⁇ 5b and the reflection mirror 5c transmitted to the analysis means 5a in a light beam L2.
  • the analysis means 5a analy ⁇ Sieren the light beam L 2 to analyze the machined by the laser beam Li surface of the workpiece 4, so as to determine at ⁇ game whether or to what extent a layer to be removed has been removed.
  • a light source 8 is arranged in the region of the laser source 2, in particular a flash lamp.
  • the flash lamp 8 emits a light beam L 3 , which is in the beam path of the
  • Laser beam Li of the laser source 2 is coupled in the temporal regions between two pulses of the picosecond laser.
  • the light beam L 3 strikes the workpiece 4 and is reflected by this in whole or in part.
  • the optical measuring means 5b and 5c, the deflecting mirror further route the so re ⁇ inflected light L 2 to the analyzing means 5a.
  • the Ana ⁇ lysing agent 5a then according to analyze the
  • the control means 6 for the laser source 2 the control means 7a for the positioning means 7b, 7c as well as the analysis means 5a cooperate with a central control means 10.
  • the central controller 10 receives the analyzed data from the analysis means 5a, then controls the control means 6 for the laser source 2 so that an optimal processing of the workpiece 4 is made possible.
  • the central control device 10 likewise controls the control means 7a for the positioning devices 7b, 7c in such a way that successively different positions or specific areas of the workpiece 4 are controlled reliably and accurately one after the other and are acted upon by the laser source 2 for processing with the laser beam Li can.
  • the central control device 10 and the control means 6 for the laser source 2 the
  • Laser source 2 to control such that at least one of the para ⁇ meter of the laser source 2, such as laser power, pulse temporal sequence of the laser is set, etc., or is constantly adapted.
  • the analysis means 5a are sensitive in a wavelength range in a range between 300 nm and 10 ⁇ .
  • the analysis means 5a analyze reflectance and transmission data of the light beam L2 reflected from the surface of the workpiece 4.
  • the present invention has the advantages that so that a so-called in-situ monitoring of aktu ⁇ ell machined with the laser source surface areas of workpieces is made possible. Another advantage is that it allows the machining of the workpiece to be constantly adapted to changing circumstances so that reliability and flexibility are increased.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un système laser (1) pour usiner des surfaces, en particulier pour structurer des matériaux munis d'un revêtement (3, 4). Le système laser (1) comprend une source laser (2) pour produire un faisceau laser (L1) présentant au moins une longueur d'onde, un porte-pièce (7b) sur lequel est disposée une pièce à usiner (3, 4), de préférence une tranche, pouvant être exposée au faisceau laser (L1), des moyens de mesure (5a-c) pour surveiller une zone de la pièce (3, 4) exposée au faisceau laser (L1), et des moyens de commande (6, 10) destinés à commander le faisceau laser (L1), les moyens de commande (6, 10) et les moyens de mesure (5a-c) coopérant de telle sorte qu'un ajustement sensiblement continu du faisceau laser (4) s'effectue en fonction des valeurs mesurées par les moyens de mesure (5a-c). L'invention concerne également un procédé correspondant et une utilisation correspondante.
PCT/EP2011/067804 2010-10-15 2011-10-12 Système et procédé laser destiné à usiner des surfaces à l'aide de moyens de mesure et d'une commande WO2012049209A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010042503A DE102010042503A1 (de) 2010-10-15 2010-10-15 Lasersystem zur Bearbeitung von Oberflächen sowie entsprechendes Verfahren
DE102010042503.6 2010-10-15

Publications (1)

Publication Number Publication Date
WO2012049209A1 true WO2012049209A1 (fr) 2012-04-19

Family

ID=45418617

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/067804 WO2012049209A1 (fr) 2010-10-15 2011-10-12 Système et procédé laser destiné à usiner des surfaces à l'aide de moyens de mesure et d'une commande

Country Status (2)

Country Link
DE (1) DE102010042503A1 (fr)
WO (1) WO2012049209A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017006358A1 (de) * 2017-07-06 2019-01-10 Forschungszentrum Jülich GmbH Verfahren zur Strukturierung einer Substratoberfläche

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2253282A (en) * 1991-02-27 1992-09-02 British Aerospace Method and apparatus for controllably laser processing a surface
DE4124162C1 (en) * 1991-07-20 1992-12-03 Ludger Dipl.-Ing. Overmeyer Optimising laser beam process quality, esp. ceramic cutting - includes measuring the intensity of e.g. UV and comparing against threshold value, increasing threshold value and measuring again when penetration occurs
JPH09225666A (ja) * 1996-02-22 1997-09-02 Sumitomo Heavy Ind Ltd レーザ溶接のモニタリング装置
US20040033311A1 (en) * 2002-03-09 2004-02-19 Erwin Bayer Method for removing coating from power unit components and device for carrying out the method
US20040094527A1 (en) * 2000-08-21 2004-05-20 Orson Bourne Methods for creating optical structures in dielectrics using controlled energy deposition
US20070095802A1 (en) * 2005-11-03 2007-05-03 Hon Hai Precision Industry Co., Ltd. Laser treatment apparatus
US20090273782A1 (en) * 2008-05-05 2009-11-05 Applied Spectra, Inc. Laser ablation apparatus and method
EP1658648B1 (fr) 2003-08-25 2009-11-25 PolyIC GmbH & Co. KG Procédé de production d'un composant électronique organique a structuration haute resolution

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2253282A (en) * 1991-02-27 1992-09-02 British Aerospace Method and apparatus for controllably laser processing a surface
DE4124162C1 (en) * 1991-07-20 1992-12-03 Ludger Dipl.-Ing. Overmeyer Optimising laser beam process quality, esp. ceramic cutting - includes measuring the intensity of e.g. UV and comparing against threshold value, increasing threshold value and measuring again when penetration occurs
JPH09225666A (ja) * 1996-02-22 1997-09-02 Sumitomo Heavy Ind Ltd レーザ溶接のモニタリング装置
US20040094527A1 (en) * 2000-08-21 2004-05-20 Orson Bourne Methods for creating optical structures in dielectrics using controlled energy deposition
US20040033311A1 (en) * 2002-03-09 2004-02-19 Erwin Bayer Method for removing coating from power unit components and device for carrying out the method
EP1658648B1 (fr) 2003-08-25 2009-11-25 PolyIC GmbH & Co. KG Procédé de production d'un composant électronique organique a structuration haute resolution
US20070095802A1 (en) * 2005-11-03 2007-05-03 Hon Hai Precision Industry Co., Ltd. Laser treatment apparatus
US20090273782A1 (en) * 2008-05-05 2009-11-05 Applied Spectra, Inc. Laser ablation apparatus and method

Also Published As

Publication number Publication date
DE102010042503A1 (de) 2012-04-19

Similar Documents

Publication Publication Date Title
EP3538298B1 (fr) Procédé pour calibrer un dispositif de balayage et machine d'usinage
DE102008004438B4 (de) Laserstrahlbearbeitungsvorrichtung
EP3049755B1 (fr) Procédé de mesure de la profondeur de pénétration d'un faisceau laser dans une pièce à usiner et dispositif d'usinage laser
EP3538299B1 (fr) Procédé pour déterminer un profil de faisceau d'un faisceau laser et machine d'usinage avec des retroreflecteurs
DE102008046386B4 (de) Höhenpositionsdetektor für ein auf einem Einspanntisch gehaltenes Werkstück
WO2017182107A1 (fr) Procédé et dispositif de mesure de la profondeur du capillaire de vapeur pendant un processus d'usinage par faisceau à haute énergie
EP0512313A2 (fr) Procédé et dispositif de mesure on-line sans contact d'une structure d'une surface ou d'une épaisseur d'une couche
DE19623121C2 (de) Verfahren und Vorrichtung zum photothermischen Prüfen von Werkstückoberflächen
DE102016110266A1 (de) Verfahren und Vorrichtung zur generativen Fertigung von Bauteilen
DE102018214743A1 (de) Höhenerfassungsvorrichtung und laserbearbeitungsvorrichtung
EP3111161B1 (fr) Procédé et dispositif de détermination optique d'une distance
WO2012101533A1 (fr) Machine de traitement au laser, en particulier machine de coupe au laser, ainsi que procédé permettant de centrer un faisceau laser, en particulier un faisceau focalisé
DE102010060958A1 (de) Laserbearbeitungsvorrichtung sowie Positionsermittlungsvorrichtung und Strukturermittlungsvorrichtung für eine Laserbearbeitungsvorrichtung
DE4320408A1 (de) Verfahren zur Prozeßkontrolle und -regelung bei der Oberflächenbearbeitung von Werkstücken mit gepulster Laserstrahlung
WO2019138038A1 (fr) Système et procédé pour contrôler la précision de fabrication lors de la fabrication additive de pièces en trois dimensions
WO2019052634A1 (fr) Dispositif et procédé pour séparer un empilement de substrats temporairement liés
DE19822924C2 (de) Verfahren und Vorrichtung zur Messung der Verteilung der Energiefeldichte eines Laserstrahls
EP2999568A1 (fr) Buse de traitement au laser pour dispositif de traitement au laser et dispositif de traitement au laser
DE102020212094A1 (de) Laserbearbeitungsvorrichtung
DE102014117613B4 (de) Laseranordnung und Verfahren zur Untersuchung eines Objektes
WO2012049209A1 (fr) Système et procédé laser destiné à usiner des surfaces à l'aide de moyens de mesure et d'une commande
WO2017153100A1 (fr) Procédé de détermination de la position du foyer d'un dispositif de rayonnement laser et procédé d'usinage d'une pièce de travail avec un rayonnement laser
DE102004042155B4 (de) Verfahren zur Überwachung der Schichtdicke und des Tiefenprofils der chemischen Zusammensetzung einer Beschichtung von sich bewegenden Werkstücken
EP3980217A1 (fr) Ensemble de surveillance de processus de structuration par laser, qui sont exécutés sur des surfaces de composants
DE19960880A1 (de) Messvorrichtung

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11773708

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11773708

Country of ref document: EP

Kind code of ref document: A1