WO2012049209A1 - Système et procédé laser destiné à usiner des surfaces à l'aide de moyens de mesure et d'une commande - Google Patents

Système et procédé laser destiné à usiner des surfaces à l'aide de moyens de mesure et d'une commande Download PDF

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Publication number
WO2012049209A1
WO2012049209A1 PCT/EP2011/067804 EP2011067804W WO2012049209A1 WO 2012049209 A1 WO2012049209 A1 WO 2012049209A1 EP 2011067804 W EP2011067804 W EP 2011067804W WO 2012049209 A1 WO2012049209 A1 WO 2012049209A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
workpiece
laser beam
measuring means
laser system
Prior art date
Application number
PCT/EP2011/067804
Other languages
German (de)
English (en)
Inventor
Detlef Gerhard
Karl Weidner
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2012049209A1 publication Critical patent/WO2012049209A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Abstract

L'invention concerne un système laser (1) pour usiner des surfaces, en particulier pour structurer des matériaux munis d'un revêtement (3, 4). Le système laser (1) comprend une source laser (2) pour produire un faisceau laser (L1) présentant au moins une longueur d'onde, un porte-pièce (7b) sur lequel est disposée une pièce à usiner (3, 4), de préférence une tranche, pouvant être exposée au faisceau laser (L1), des moyens de mesure (5a-c) pour surveiller une zone de la pièce (3, 4) exposée au faisceau laser (L1), et des moyens de commande (6, 10) destinés à commander le faisceau laser (L1), les moyens de commande (6, 10) et les moyens de mesure (5a-c) coopérant de telle sorte qu'un ajustement sensiblement continu du faisceau laser (4) s'effectue en fonction des valeurs mesurées par les moyens de mesure (5a-c). L'invention concerne également un procédé correspondant et une utilisation correspondante.
PCT/EP2011/067804 2010-10-15 2011-10-12 Système et procédé laser destiné à usiner des surfaces à l'aide de moyens de mesure et d'une commande WO2012049209A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010042503A DE102010042503A1 (de) 2010-10-15 2010-10-15 Lasersystem zur Bearbeitung von Oberflächen sowie entsprechendes Verfahren
DE102010042503.6 2010-10-15

Publications (1)

Publication Number Publication Date
WO2012049209A1 true WO2012049209A1 (fr) 2012-04-19

Family

ID=45418617

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/067804 WO2012049209A1 (fr) 2010-10-15 2011-10-12 Système et procédé laser destiné à usiner des surfaces à l'aide de moyens de mesure et d'une commande

Country Status (2)

Country Link
DE (1) DE102010042503A1 (fr)
WO (1) WO2012049209A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017006358A1 (de) 2017-07-06 2019-01-10 Forschungszentrum Jülich GmbH Verfahren zur Strukturierung einer Substratoberfläche

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2253282A (en) * 1991-02-27 1992-09-02 British Aerospace Method and apparatus for controllably laser processing a surface
DE4124162C1 (en) * 1991-07-20 1992-12-03 Ludger Dipl.-Ing. Overmeyer Optimising laser beam process quality, esp. ceramic cutting - includes measuring the intensity of e.g. UV and comparing against threshold value, increasing threshold value and measuring again when penetration occurs
JPH09225666A (ja) * 1996-02-22 1997-09-02 Sumitomo Heavy Ind Ltd レーザ溶接のモニタリング装置
US20040033311A1 (en) * 2002-03-09 2004-02-19 Erwin Bayer Method for removing coating from power unit components and device for carrying out the method
US20040094527A1 (en) * 2000-08-21 2004-05-20 Orson Bourne Methods for creating optical structures in dielectrics using controlled energy deposition
US20070095802A1 (en) * 2005-11-03 2007-05-03 Hon Hai Precision Industry Co., Ltd. Laser treatment apparatus
US20090273782A1 (en) * 2008-05-05 2009-11-05 Applied Spectra, Inc. Laser ablation apparatus and method
EP1658648B1 (fr) 2003-08-25 2009-11-25 PolyIC GmbH & Co. KG Procédé de production d'un composant électronique organique a structuration haute resolution

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2253282A (en) * 1991-02-27 1992-09-02 British Aerospace Method and apparatus for controllably laser processing a surface
DE4124162C1 (en) * 1991-07-20 1992-12-03 Ludger Dipl.-Ing. Overmeyer Optimising laser beam process quality, esp. ceramic cutting - includes measuring the intensity of e.g. UV and comparing against threshold value, increasing threshold value and measuring again when penetration occurs
JPH09225666A (ja) * 1996-02-22 1997-09-02 Sumitomo Heavy Ind Ltd レーザ溶接のモニタリング装置
US20040094527A1 (en) * 2000-08-21 2004-05-20 Orson Bourne Methods for creating optical structures in dielectrics using controlled energy deposition
US20040033311A1 (en) * 2002-03-09 2004-02-19 Erwin Bayer Method for removing coating from power unit components and device for carrying out the method
EP1658648B1 (fr) 2003-08-25 2009-11-25 PolyIC GmbH & Co. KG Procédé de production d'un composant électronique organique a structuration haute resolution
US20070095802A1 (en) * 2005-11-03 2007-05-03 Hon Hai Precision Industry Co., Ltd. Laser treatment apparatus
US20090273782A1 (en) * 2008-05-05 2009-11-05 Applied Spectra, Inc. Laser ablation apparatus and method

Also Published As

Publication number Publication date
DE102010042503A1 (de) 2012-04-19

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