WO2012033029A1 - X-ray diagnostic system - Google Patents
X-ray diagnostic system Download PDFInfo
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- WO2012033029A1 WO2012033029A1 PCT/JP2011/070080 JP2011070080W WO2012033029A1 WO 2012033029 A1 WO2012033029 A1 WO 2012033029A1 JP 2011070080 W JP2011070080 W JP 2011070080W WO 2012033029 A1 WO2012033029 A1 WO 2012033029A1
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- ray
- unit
- imaging
- flat panel
- detector
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- 238000001514 detection method Methods 0.000 claims abstract description 103
- 238000002360 preparation method Methods 0.000 claims abstract description 70
- 238000003384 imaging method Methods 0.000 claims description 97
- 238000012544 monitoring process Methods 0.000 claims description 89
- 238000004891 communication Methods 0.000 claims description 35
- 230000007704 transition Effects 0.000 claims description 26
- 238000002059 diagnostic imaging Methods 0.000 claims description 20
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000004044 response Effects 0.000 abstract description 11
- 238000001816 cooling Methods 0.000 abstract description 4
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- 230000008569 process Effects 0.000 description 59
- 238000012545 processing Methods 0.000 description 30
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- 230000004913 activation Effects 0.000 description 13
- 230000005855 radiation Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
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- 230000008901 benefit Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/54—Control of apparatus or devices for radiation diagnosis
- A61B6/542—Control of apparatus or devices for radiation diagnosis involving control of exposure
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/44—Constructional features of apparatus for radiation diagnosis
- A61B6/4488—Means for cooling
Definitions
- the present invention relates to an X-ray diagnostic imaging apparatus and an X-ray detector, and more particularly to suppression of temperature rise of the X-ray detector.
- Patent Document 1 discloses an X-ray flat panel detector provided with a cooling unit inside a housing containing the X-ray flat panel detector in order to suppress the temperature rise of the X-ray flat panel detector due to heat generation.
- the X-ray flat panel detector of Patent Document 1 has a problem that the structure of the X-ray flat panel detector becomes large because it is necessary to secure a space for incorporating a cooling unit.
- the present invention has been made in view of the above problems, and an X-ray diagnostic imaging apparatus and an X-ray detector that suppress an increase in temperature of an X-ray flat panel detector while avoiding an increase in the size of the X-ray flat panel detector.
- the purpose is to provide.
- an X-ray diagnostic imaging apparatus includes an X-ray irradiation unit that irradiates X-rays, and an X-ray detector that detects the X-rays that have passed through a subject and outputs image data And an X-ray image diagnostic apparatus having a control unit that controls the X-ray irradiation unit and the X-ray detector, and an imaging preparation state detection unit that detects an imaging preparation state in X-ray imaging of the subject, A power-on unit that turns on or off the power supplied to the X-ray detector according to the detection result of the imaging preparation state detection unit.
- the power-on unit detects the X-ray and detects the image signal according to the detection result of the imaging preparation state detection unit, the communication unit communicating with the control unit installed in the X-ray detector And a sensor array unit having a detecting element for outputting the power, and the power source is turned on or stopped.
- the imaging preparation state detection means includes an order acquisition detection unit that detects acquisition of order information related to the X-ray imaging of the subject, an anode rotation start instruction provided in the X-ray irradiation means, and the X-ray irradiation means
- An exposure switch detection unit for receiving an exposure switch status signal for instructing X-ray irradiation from, and the power-on unit is based on the acquisition result of the order information by the order acquisition detection unit
- the communication unit is powered on, and further, the sensor array unit is powered on based on the result of receiving the rotation start instruction signal of the anode by the exposure switch detection unit.
- the power-on unit stops the power that has been input to the sensor array unit It is characterized by that.
- the X-ray detector since the X-ray detector is turned on and off according to the imaging preparation state, heat generation is suppressed by reducing the power-on time. Thereby, the temperature rise of an X-ray detector can be suppressed, without using a cooling device. As a result, it is possible to provide an X-ray diagnostic imaging apparatus that suppresses an increase in temperature of the X-ray detector while avoiding an increase in size of the X-ray detector.
- the schematic diagram which shows schematic structure of the X-ray-image diagnostic apparatus which concerns on this embodiment It is a schematic diagram showing the configuration of the hand switch, (a) shows a state where the button is not pressed down, (b) shows a state where the first step is pressed down, (c) shows a state where the second step is pressed down Indicates.
- Block diagram showing the configuration of the X-ray flat panel detector 4 Explanatory diagram showing the relationship between the voltage applied to the X-ray flat panel detector 4 (lower stage) and the internal temperature change (upper stage) accordingly Explanatory diagram showing the relationship between elapsed time and temperature rise of X-ray flat panel detector 4
- the flowchart which shows the flow of the process of 1st embodiment.
- FIG. 1 is a schematic diagram showing a schematic configuration of the X-ray image diagnostic apparatus according to the present embodiment.
- An X-ray diagnostic imaging apparatus 1 includes an X-ray generator 2 that irradiates a subject 0 with X-rays, an exposure switch 3 that inputs an X-ray irradiation instruction from the X-ray generator 2, An X-ray plane detector 4 that is disposed opposite to the ray generator 2 and detects transmitted X-rays of the subject 0; and an image processor 5 that performs image processing on image data output from the X-ray plane detector 4.
- An image display unit 6 that displays an X-ray image of the imaging screen or the subject, and a control unit 7 that controls the X-ray image diagnostic apparatus 1.
- the X-ray flat panel detector 4 may be in any form as long as it can be connected to the control unit 7 regardless of wired or wireless. That is, the X-ray flat panel detector 4 may be wired with the control unit 7 and configured integrally with the X-ray image diagnostic apparatus, or may be configured separately from the main body of the X-ray image diagnostic apparatus 1. A so-called portable X-ray flat panel detector may be used.
- the present invention can be applied to all X-ray imaging apparatuses using FPD (flat panel detector), and can also be applied to general imaging apparatuses and round-trip cars.
- the control unit 7 includes an imaging preparation state detection unit 8 that detects an imaging preparation state, a detector control unit 9 that controls the X-ray flat panel detector 4 according to the detection result of the imaging preparation state detection unit 8, and radiation information.
- An order acquisition unit 10 that receives order information including an X-ray imaging instruction of a subject from a system (Radiology Information System: hereinafter referred to as “RIS”) 13 or a barcode reader (not shown), and an X-ray diagnostic imaging apparatus 1
- RIS Radiology Information System
- a central control unit 11 that performs control necessary for the operation of the X-ray image diagnostic apparatus 1, such as screen transition, X-ray irradiation, and X-ray image display.
- the X-ray generation unit 2 includes an X-ray tube 2a and an irradiation field lamp 2b for illuminating the same region as the X-ray irradiation field with visible light and confirming the X-ray irradiation field.
- the image processing unit 5 includes an image processing circuit that performs image processing such as gain adjustment on image data.
- the image processing unit 5 may include a storage device that stores data temporarily or fixedly, such as a hard disk or a memory, and may be configured to store image data after image processing.
- the image display unit 6 includes a liquid crystal monitor and a display device using an organic EL, and is necessary for an X-ray image of a subject based on an image signal corresponding to a transmitted X-ray of the subject 0 and a series of imaging preparations. Display the screen (GUI).
- the control unit 7 realizes hardware including arithmetic control devices such as CPU and MPU, and functions of each component of the imaging preparation state detection unit 8, the detector control unit 9, the order acquisition unit 10, and the central control unit 11.
- the imaging preparation state detection unit 8, the detector control unit 9, the order acquisition unit 10, and the central control unit 11 are configured by cooperation of the hardware and software.
- the imaging preparation state detection unit 8 includes an exposure switch detection unit 81 that receives a status signal of the exposure switch 3, an order acquisition detection unit 82 that detects acquisition of order information, and a signal indicating lighting of the irradiation field lamp 2b.
- the receiving field lamp detector 83 for receiving, the door detector 84 for detecting the opening / closing signal of the door 12 for entering and leaving the X-ray examination room where the X-ray diagnostic imaging apparatus 1 is installed, and the screen of the image display unit 6
- a GUI transition detection unit 85 that detects a transition, and a pressure / contact detection unit 86 that receives a detection signal of a pressure sensor or a contact sensor included in the X-ray flat panel detector 4 are provided.
- the detector control unit 9 turns on (starts) and turns off (maintains) the main power supply of the X-ray flat panel detector 4 and a connection unit that gives instructions to start and end the connection of the X-ray flat panel detector 4 92, a state switching unit 93 for instructing switching between the standby mode and the imaging state mode (both modes will be described later), and the surface temperature of the X-ray incident surface of the X-ray flat panel detector 4 are monitored and exceed the threshold.
- a temperature monitoring unit 94 that issues a warning is provided.
- the temperature monitoring unit 94 is provided in the detector control unit 9, but the temperature monitoring unit 94 may be provided as a means different from the detector control unit 9.
- the order acquisition unit 10 receives order information from the RIS 13 or barcode reader connected to the X-ray image diagnostic apparatus 1 via a LAN. In response to this, the central control unit 11 displays on the image display unit 6 a screen indicating that the order information has been received and an imaging screen for performing input setting of X-ray imaging conditions.
- the exposure switch 3 includes a hand switch and a foot pedal.
- the configuration of the hand switch will be described with reference to FIG.
- FIG. 2 is a schematic diagram showing the configuration of the hand switch.
- the hand switch 30 includes a switch 31 on the upper surface (see FIG. 2 (a)).
- the switch 31 is pushed down by one step (half-pressed: see FIG. 2 (b))
- the anode in the X-ray tube 2a starts rotating as preparation for X-ray irradiation.
- FIG. 2 (c) X-rays are emitted from the X-ray tube 2a.
- FIG. 3 is a block diagram showing a configuration of the X-ray flat detector 4.
- the X-ray flat panel detector 4 includes a sensor array unit 41 in which X-ray detection elements are two-dimensionally arranged in an array, a battery 42, a sensor array unit 41, and other components in the X-ray flat panel detector 4.
- a control signal instruction signal
- an image readout signal temperature information, and pressure sensor information are transmitted and received between the control unit 7 and the power-on unit 43 that turns on and off the power according to the standby mode and the shooting state mode.
- Communication unit 44 pressure sensor unit 45 that detects pressure on the X-ray incident surface of X-ray plane detector 4, first A / D conversion unit 46 that converts the detected analog signal into a digital signal, and X-ray plane detection A temperature measuring unit 47 that measures the internal temperature in the housing of the measuring device 4, a second A / D converting unit 48 that converts the measured analog signal into a digital signal, and a main power source unit 49 of the X-ray flat panel detector 4 Composed.
- a contact sensor that detects contact with the X-ray incident surface may be used.
- the X-ray flat panel detector 4 is provided with a pressure sensor or a contact sensor.
- the bed (not shown) used when photographing the subject in a supine position, or the subject stands during standing position photographing. You may provide a pressure sensor and a contact sensor in an upright stand.
- FIG. 4 is an explanatory diagram showing the relationship between the voltage applied to the X-ray flat panel detector 4 (lower stage) and the internal temperature change (upper stage) in response thereto.
- FIG. 5 is an explanatory diagram showing the relationship between the elapsed time of the X-ray flat panel detector 4 and the temperature rise.
- the X-ray flat panel detector 4 mainly has three modes depending on the power supply state.
- the first mode is a stop mode in which no voltage is supplied to the X-ray flat panel detector 4.
- the voltage in the stop mode is indicated by E 0 (v).
- E 0 (v) in FIG. It becomes a necessary power source, for example, E ⁇ (v).
- the number of modes is not limited to three, and control corresponding to the number of modes at a necessary stage may be performed as appropriate.
- the voltage E 1 (v) is supplied to the communication unit 44 of the X-ray flat panel detector 4, the X-ray flat panel detector 4 and the control unit 7 start connection, and standby is enabled.
- Mode also called standby).
- the third mode is an imaging preparation mode (also referred to as “ready”) in which the voltage E 2 (v) is applied to the sensor array unit 41 including the image reading circuit of the X-ray flat panel detector 4 to enable image reading. .
- the X-ray flat panel detector 4 since the main power of the X-ray flat panel detector 4 can be turned on from the control unit 7, the above three modes are set, but the X-ray flat panel detector 4 includes the control unit 7.
- the operator turns on the main power by operating a switch provided in the portable X-ray flat panel detector. Therefore, the power activation (state shift from E 0 to E 1 ) in FIG. 4 is performed by the operator's operation.
- a mode in which the communication unit 44 waits for a connection instruction is further added. Details of this will be described later with reference to FIG. 10 in the second embodiment.
- the internal temperature of the X-ray flat panel detector 4 increases according to the elapsed time from the turning on of the power. As shown in FIG. 5, the temperature rises moderately when the power is switched from OFF to standby mode (standby), i.e., during power activation, connection start, and standby mode. ), The slope of the graph showing the temperature rise becomes larger than the former. This temperature rise depends on the environmental temperature, and becomes a constant value (saturates) at a certain temperature.
- the X-ray flat panel detector 4 is a medical device and is in contact with the subject from the viewpoint of ensuring the safety of the subject.
- FIG. 6 is a flowchart showing a process flow of the first embodiment.
- FIG. 7 is an explanatory diagram showing the relationship between the internal temperature of the X-ray flat panel detector 4 and the surface temperature.
- FIG. 8 is a schematic diagram illustrating an example of a warning display.
- FIG. 9 is a schematic diagram showing the power supply state of the X-ray flat panel detector 4 when continuous imaging is performed on the same subject and when the captured subjects are different, and (a) is a diagram showing continuous exposure on the same subject. (B) shows the power supply state when the subject to be imaged is different.
- the first embodiment is an embodiment in which temperature monitoring is performed at any time during X-ray imaging processing while monitoring the surface temperature of the X-ray flat panel detector 4 continuously from the start to the end of the system power supply.
- description will be made along each step of FIG.
- Step S1 The system power of the X-ray image diagnostic apparatus 1 is turned on and the system is activated (S1). This process is performed immediately after the start of medical care, for example, and the system is kept in an activated state until the medical care for the day is completed.
- Step S2 After the system is started, the temperature monitoring process of the surface temperature of the X-ray flat panel detector 4 is started (S2). In the present embodiment, the temperature monitoring process is continuously executed while the system is in the activated state.
- Step S21 The temperature measurement unit 47 of the X-ray flat panel detector 4 measures the internal temperature of the X-ray flat panel detector 4, and the second A / D converter 48 generates digital data indicating the internal temperature (hereinafter referred to as “temperature information”). .
- the temperature information is transmitted to the temperature monitoring unit 94 of the control unit 7 via the communication unit 44.
- the temperature monitoring unit 94 calculates the surface temperature of the X-ray flat panel detector 4 based on the temperature information (S21).
- the X-ray flat panel detector 4 uses the same characteristics and types, and acquires in advance data obtained by measuring room temperature, internal temperature, and surface temperature. For example, as shown in FIG. 7, the internal temperature and the surface temperature at room temperature of 20 ° C., 25 ° C., and 30 ° C. are measured in advance. Even if the room temperature changes, the correlation between the internal temperature and the surface temperature (Equation 1) can be obtained, so the surface temperature can be specified by monitoring the internal temperature.
- Equation (1) shows the correlation between the internal temperature and the surface temperature of a specific X-ray flat panel detector. If an X-ray flat panel detector is equipped with a handle with a handle or a scattered radiation removal grid, the correction value of equation (1) is different, but the relationship between the surface temperature and the internal temperature can be derived.
- Step S22 The temperature monitoring unit 94 determines whether the calculated surface temperature is equal to or higher than the threshold value. If the calculated temperature is equal to or higher than the threshold value, the process proceeds to S23.
- This threshold is a value that can comply with the above-mentioned regulations of IEC60601-1, and may be 39 ° C. as an example.
- Step S23 The temperature monitoring unit 94 issues a warning to notify that the surface temperature is high (S23).
- An example of the warning will be described based on FIG.
- the temperature monitoring unit 94 displays a warning shown in FIG. 8 on the screen of the image display unit 6 and issues a warning to the operator.
- This warning display may display a message indicating the measured value of the internal temperature and the normal range, and further indicating the internal temperature and the temperature rise of the contact surface. Voice may be used for the warning.
- step S2 While the system is starting up, the temperature monitoring process in step S2 is being executed at any time.
- an X-ray imaging process (S3) is started, and a control process (S4) of the X-ray flat panel detector 4 is executed accordingly.
- Step S31 The order acquisition unit 10 in the control unit 7 receives the order information (S31).
- the order acquisition detection unit 82 of the imaging preparation state detection unit 8 detects that an order has been received, and transmits a temperature monitoring request and an order detection signal to the detector control unit 9.
- the detector control unit 9 executes the temperature monitoring process in step S2 described above in response to the request.
- Step S41 Power supply activation unit 91 in the detector control unit 9 receives an order detection signal, based on this, start the main power supply 49 of the X-ray flat panel detector 4 (input voltage from E 0 in FIG. 4 to E 1 Up) (S41).
- Step S32 The screen of the image display unit 6 transitions to a shooting screen that displays the acquired order information (S32).
- the GUI transition detection unit 85 detects that the screen has transitioned, and transmits a temperature monitoring process request and a screen transition detection signal to the detector control unit 9.
- the detector control unit 9 executes the temperature monitoring process in step S2 described above in response to the request.
- the operator calls a subject to perform X-ray imaging along the order (M1), and performs so-called positioning (M2) for taking an imaging posture. After that, the patient is withdrawn from the X-ray examination room and instructed to hold his / her breath (M3).
- connection unit 92 receives the screen transition detection signal, and receives a control instruction signal for starting connection with the control unit 7 based on the screen transition detection signal.
- the connection unit 92 transmits an instruction signal for shifting to the standby mode via the communication unit 44.
- the power-on unit 43 receives the instruction signal via the communication unit 44, turns on the E 1 (v) power from the battery 42 to the communication unit 44, and connects the X-ray flat panel detector 4 to the control unit 7. To start. Thereby, the X-ray flat panel detector 4 shifts to the standby mode (S42).
- Step S33 The operator depresses the first stage of the exposure switch (S33).
- the exposure switch detection unit 81 detects the first depression of the exposure switch, and transmits a request for temperature monitoring processing and a detection signal of the depression state of the exposure switch to the detector control unit 9.
- the detector control unit 9 executes the temperature monitoring process in step S2 described above in response to the request. Requests for temperature monitoring at this timing will turn on the X-ray flat panel detector 4 to (E 2 (v)) in the next step, and the temperature rise in the X-ray flat panel detector 4 will become stronger. It has the meaning of strengthening vigilance corresponding to this.
- Step S43 The state switching unit 93 receives the exposure switch detection signal, and based on this, the X-ray flat panel detector 4 instructs the sensor array unit 41 to switch from the standby mode to the imaging preparation mode. An instruction signal for powering on is sent.
- the power-on unit 43 of the X-ray flat panel detector 4 receives the instruction signal via the communication unit 44, and turns on the power E 2 (v) necessary for reading the image signal from the battery 42 to the sensor array unit 41. Is started (S43).
- Step S34 The operator depresses the second stage of the exposure switch (S34).
- the exposure switch detection unit 81 detects the second depression of the exposure switch and makes a temperature monitoring request to the detector control unit 9. Then, the temperature monitoring process in step S2 described above is executed.
- the request for temperature monitoring at this timing is similar to step S43 above, because the temperature in the X-ray flat panel detector 4 is increased as the power-on to the X-ray flat panel detector 4 is increased to (E 2 (v)). It has the meaning of strengthening vigilance in response to the increasing trend.
- Step S35 X-rays are emitted from the X-ray tube 2a (S35), and X-ray imaging is performed.
- Step S44 The sensor array unit 41 of the X-ray flat panel detector 4 detects transmitted X-rays that have passed through the subject 0, and the image signal readout circuit in the sensor array unit 41 reads out the image signals from the transmitted X-rays, The image is output by transmitting to the image processing unit 5 via (S44).
- the image processing unit 5 performs image processing such as gain adjustment on the image signal, and displays an X-ray image of the subject 0 on the image display unit 6.
- the received image signal and the image signal after image processing may be stored.
- Step S36 If X-ray imaging is continuously performed for the same subject, the process proceeds to step S45. If continuous imaging is not performed, the process proceeds to step S46 (S36).
- the standby mode (turn-on power supply E 1 (v)) is temporarily set after the X-ray exposure. Then, preparation for the X-ray exposure is made again by shifting to the imaging preparation mode (turn-on power supply E 2 (v)) for the next exposure.
- the standby mode is resumed and further preparations for the next X-ray exposure are made.
- the power supply can be turned on compared to when the imaging preparation mode is entered during continuous imaging of the same subject. The increase in the internal temperature and the surface temperature of the X-ray flat panel detector 4 can be suppressed.
- the GUI transition detection unit 85 detects the transition of the shooting screen for preparation for continuous exposure based on the received order information, and the detection. Based on the signal, the power activation unit 91 or the state switching unit 93 may be configured to perform power OFF or switching to the standby mode. Also, according to the order information, the control unit 7 (especially the central control unit 11) sets the shooting conditions and shooting procedures corresponding to the presence / absence of continuous shooting, and the power OFF or standby mode corresponding to the presence / absence of continuous shooting based on the contents You may switch to.
- Step S45 When the exposure switch detection unit 81 detects that the second-stage depression of the exposure switch has been released, it transmits a detection signal to the state switching unit 93.
- the state switching unit 93 switches the state of the X-ray flat panel detector 4 from the imaging preparation mode to the standby mode. That is, the power-on unit 43 terminates the power-on of E 2 (v) input to the sensor array unit 41 according to the switching instruction signal, and only E 1 (v) necessary for communication with the control unit 7
- the X-ray flat panel detector 4 is controlled so as to be in a connected state where S is input (S45). Then, the process returns to step S33 to perform continuous imaging.
- Step S46 When the exposure switch detection unit 81 detects that the second-stage depression of the exposure switch has been released, the detection signal is transmitted to the detector control unit 9.
- the connection unit 92 transmits an instruction signal for stopping the connection of the communication unit 44, and the power activation unit 91 transmits an instruction signal for turning off the main power to the X-ray flat panel detector 4.
- the power supply unit 43 of the X-ray flat panel detector 4 stops the power supply E 1 (v) of the communication unit 44, and the main power supply unit 49 turns off the main power supply. As a result, the power supplied to the X-ray flat panel detector 4 becomes E 0 (v) (S46).
- Step S5 When turning off the system power, the operator operates the main power of the system and inputs a system power off signal. In response to this, the system power supply is turned off after completing the temperature detection process in step S2, and the series of processes ends. On the other hand, if the system power is not turned off, the process returns to step S31 to prepare for reception of the next order information.
- the necessary power is turned on to the X-ray plane detector 4 along with the preparation operation for X-ray imaging, so that the minimum necessary power source corresponding to the imaging preparation stage is detected by the X-ray plane detection. It can be put into the container 4. As a result, it is possible to minimize the temperature rise accompanying the power-on of the X-ray flat panel detector 4.
- the above power-on is automatically performed by the X-ray diagnostic imaging apparatus in conjunction with the X-ray imaging preparation operation, no operator operation is required for power-on. It is possible to concentrate only on the above (processing of M1, M2, M3, M4). Therefore, the operability necessary for X-ray imaging can be improved.
- monitoring can be further strengthened in response to a change in the power state of the X-ray flat panel detector 4 while continuously performing temperature monitoring processing from turning on the system to turning it on. This can contribute to the improvement of the safety of the line image diagnostic apparatus.
- FIG. 10 is a schematic diagram showing a power supply state of the X-ray flat panel detector 4 in the second embodiment.
- FIG. 11 is a flowchart showing a process flow of the second embodiment.
- the second embodiment is an example in which temperature monitoring is performed at each stage of preparation for X-ray imaging. In particular, the temperature monitoring is performed using an operation of an exposure switch as a trigger.
- the power state of the X-ray flat panel detector 4 in the second embodiment will be described based on FIG.
- the input power supply is 0 (v).
- the power activation unit 91 transmits an instruction signal to turn on (or stop) the main power and the main power of the X-ray flat panel detector 4 is turned on (or off), the communication unit 44 is activated (or terminated).
- the power source E ⁇ (v) is turned on (or stopped) from the power-on unit 43 to the communication unit 44.
- connection start (or connection end) with the control unit 7 is input from the connection unit 92 of the control unit 7 to the X-ray flat panel detector 4, the communication unit 44 and the control unit A power supply E 1 (v) for starting (or ending) communication with 7 is turned on (or stopped) from the power-on unit 43 to the communication unit 44. As a result, the X-ray flat panel detector 4 enters the standby mode.
- FIG. 11 is a flowchart showing a process flow of the second embodiment.
- Step S100 The system of the X-ray image diagnostic apparatus 1 is activated (S100).
- Step S101 The order acquisition unit 10 receives the order information by barcode or LAN connection (S101).
- Step S102 The order acquisition detection unit 82 detects acquisition of order information, and transmits a detection signal to the detector control unit 9.
- the power supply activation unit 91 of the detector control unit 9 activates the main power supply unit 49 of the X-ray flat panel detector 4 (S102).
- E ⁇ (v) is input to the communication unit 44 and the communication unit 44 is activated.
- Step S103 Next, in order to display the order information received by the central control unit 11, a transition is made to an acquirable screen showing setting of shooting conditions and shooting procedures (S103).
- Step S104 The GUI transition detection unit 85 transmits a screen transition detection signal to the detector control unit 9.
- the connection unit 92 of the detector control unit 9 transmits a connection start instruction signal to the X-ray flat panel detector 4.
- the power-on unit 43 of the X-ray flat panel detector 4 receives the instruction signal via the communication unit 44, and accordingly, powers on the communication unit 44 by turning on the power source E 1 (v), and the control unit 7 and X Connection with the line plane detector 4 is started. As a result, the X-ray flat panel detector 4 enters the standby mode (S104).
- Step S105 Press down the first step of exposure switch 3.
- Step S106 The exposure switch detection unit 81 detects the first depression of the exposure switch, and transmits an exposure switch detection signal and a temperature monitoring request signal to the detector control unit 9.
- the temperature monitoring unit 94 in the detector control unit 9 detects the surface temperature of the X-ray flat panel detector 4, and proceeds to step S107 if it is equal to or higher than the threshold value, and proceeds to step S108 if it is lower than the threshold value.
- Step S107 The temperature monitoring unit 94 displays a warning indicating that the surface temperature is equal to or higher than the threshold, and temporarily stops X-ray imaging. Then, the process returns to S106 and temperature monitoring is performed (S107). Or, when the surface temperature becomes less than the threshold, the operator starts a series of operations relating to X-ray imaging again, or performs a process from step S107 before, for example, S105, and performs X-ray imaging. It may be configured to resume.
- Step S108 Based on the detection signal of the exposure switch, the state switching unit 93 in the detector control unit 9 instructs the X-ray flat panel detector 4 to switch from the standby mode to the imaging preparation mode, that is, the sensor array unit. Sends a power-on instruction signal to 41.
- the communication unit 44 of the X-ray flat panel detector 4 receives the instruction signal, and the power-on unit 43 switches on the power (E 2 (v)) necessary for reading the image signal from the battery 42 to the sensor array unit 41.
- the state switching instruction signal is transmitted based on the detection signal of the exposure switch.
- step S104 only the temperature monitoring request signal is received by the detector control unit 9, and the temperature monitoring unit 94 Based on this, temperature monitoring is performed, and when it is determined that the temperature is less than the threshold, the temperature monitoring unit 94 may make a request to control the state switching to the state switching unit 93.
- Step S109 The operator presses down the second stage of the exposure switch to irradiate X-rays.
- Step S110 The X-ray flat detector 4 detects transmitted X-rays and reads out image signals (S110).
- Step S111 When the exposure switch detection unit 81 detects that the second-stage depression of the exposure switch has been released, the detection signal is transmitted to the detector control unit 9.
- the state switching unit 93 transmits an instruction signal for switching to the standby mode, and the power-on unit 43 stops power-on E 2 (v) to the sensor array unit 41. Note that the supply of power E 1 (v) to the communication unit 44 continues. As a result, the X-ray flat panel detector 4 is switched to the standby mode. (S111).
- switching to the standby mode in this step is not indispensable, and the main power source of the X-ray flat panel detector 4 is stopped, the connection is completed, or the standby is performed by the power activation unit 91, the connection unit 92, and the state switching unit 93. You may replace with the process in any one of the switch to a mode. Which process is performed may be appropriately selected and executed by setting and inputting the presence / absence of continuous irradiation and the process after one X-ray irradiation.
- Step S112 If there is continuous shooting, the process proceeds to step S105, and if not, the process proceeds to step S113.
- the power activation unit 91 turns off the main power unit 49 based on the detection signal in step S111.
- Step S114 When turning off the system power, the operator operates the main power of the system and inputs a system power off signal. As a result, the system power is turned off, and the series of processing ends. On the other hand, if the system power is not turned off, the process returns to step S101 to prepare for reception of the next order information.
- the present embodiment by performing temperature monitoring in conjunction with the exposure switch, it is possible to avoid problems with the transmitted X-ray detection process associated with the temperature rise of the X-ray flat panel detector 4. Further, since the temperature monitoring is automatically performed in conjunction with the operation of the exposure switch, the operator does not need an operation only for the temperature monitoring, and the operability can be improved.
- the X-ray flat panel detector 4 is powered on in accordance with the X-ray imaging preparation operation.
- the minimum required input power can be supplied to the X-ray flat panel detector 4.
- FIG. 12 is a flowchart showing the flow of processing according to the third embodiment.
- Steps S200, S201 The system of the X-ray image diagnostic apparatus 1 is activated (S200). Simultaneously with the activation of the system, the power activation unit 91 of the detector control unit 9 activates the main power supply unit 49 of the X-ray flat panel detector 4 (S201).
- Step S202 When the order information acquisition unit 10 receives the order information by barcode or LAN connection, the order acquisition detection unit 82 detects the acquisition of the order information. The order acquisition detection unit 82 transmits a detection signal to the detector control unit 9 (S202).
- Step S203 When the detector control unit 9 receives the detection signal, the connection unit 92 transmits an instruction signal for instructing the start of connection of the X-ray flat panel detector 4 to the X-ray flat panel detector 4.
- the power-on unit 43 inputs E 1 (v) to the communication unit 44, starts communication, and enters a standby mode.
- Step S204 When the screen of the image display unit 6 of the X-ray image diagnostic apparatus 1 transitions to a screen that can be captured, the GUI transition detection unit 85 detects the screen transition.
- the GUI transition detection unit 85 transmits a screen transition detection signal and a temperature monitoring request signal to the detector control unit 9 (S204).
- Step S205 When the detector control unit 9 receives the request signal, the temperature monitoring unit 94 acquires the temperature information of the X-ray flat panel detector 4, and determines whether or not the threshold value (eg, 39 ° C.) is exceeded (S205). If it is equal to or greater than the threshold value, the process proceeds to step S206, and if it is less than the threshold value, the process proceeds to step S207.
- the threshold value eg, 39 ° C.
- Step S206 The temperature monitoring unit 94 displays a warning and temporarily stops X-ray imaging. Then, the process returns to S205, and temperature monitoring is performed (S206). Or, when the surface temperature becomes less than the threshold, the operator starts a series of operations relating to X-ray imaging again, or performs a process from step S206 before, for example, S204, and performs X-ray imaging. It may be configured to resume.
- Step S207 When the temperature monitoring unit 94 determines that the temperature is less than the threshold value, the state switching unit 93 transmits an instruction signal for switching the X-ray flat panel detector 4 from the standby mode to the imaging preparation mode based on the detection signal. In response to this, the X-ray flat panel detector 4 switches to the imaging preparation mode.
- Step S208 The operator depresses the first and second stages of the exposure switch (S208).
- Step S209 X-rays are irradiated, and the X-ray flat detector 4 detects transmitted X-rays and reads out image signals (S209).
- Steps S210 to S213 As in steps S111 to S114, the X-ray flat panel detector 4 is switched to the standby mode (S210), and the presence / absence of continuous exposure is determined (S211). If there is continuous exposure, the process returns to step S205 and the temperature is measured again. If there is no continuous exposure, the main power supply 49 of the X-ray flat panel detector 4 is turned off (S212). In the case of system termination, the operator turns off the system power and terminates the process. If the system is not terminated, the process returns to step S202 and waits for reception of the next order (S213).
- the present embodiment by performing temperature monitoring in conjunction with the screen transition of the imaging screen, it is possible to avoid a defect in the transmitted X-ray detection process associated with the temperature rise of the X-ray flat panel detector 4. Moreover, since the temperature monitoring is automatically performed in conjunction with the screen transition, the operator does not need an operation only for the temperature monitoring, and the operability can be improved. In particular, the screen transitions when an order is received, and then the subject is positioned (operation that takes the posture during X-ray imaging), so the temperature of the X-ray flat panel detector 4 must be monitored before the subject is positioned. Can do. Therefore, it is possible to avoid the problem that the subject is brought into contact with the high-temperature X-ray flat panel detector 4.
- FIG. 13 is a flowchart showing a flow of processing according to the fourth embodiment.
- Steps S300 to S302 The main power supply 49 of the X-ray flat panel detector 4 is activated simultaneously with the activation of the system incorporated in the X-ray diagnostic imaging apparatus 1 (S300), and E ⁇ (v) is input to the communication unit 44 (S301). . Subsequently, the X-ray flat panel detector 4 starts connection, that is, the power-on unit 43 starts connection by inputting E 1 (v) to the communication unit 44 and enters a standby mode (S302).
- Step S303 The order acquisition unit 10 receives the order information by barcode or LAN connection.
- the order acquisition detection unit 82 detects acquisition of order information, and transmits a detection signal and a temperature monitoring request signal to the detector control unit 9 (S303).
- Step S304 The temperature monitoring unit 94 of the detector control unit 9 calculates the surface temperature of the X-ray flat panel detector 4, and if it is equal to or greater than the threshold value, the process proceeds to step S305, and if it is less than the threshold value, the process proceeds to step S306 (S304).
- Step S305 to Step S312 Similar to the second embodiment, the temperature monitoring unit 94 displays a warning indicating that the surface temperature is equal to or higher than the threshold (S305), and temporarily suspends X-ray imaging.
- the state switching unit 93 in the detector control unit 9 instructs the X-ray flat panel detector 4 to switch from the standby mode to the imaging preparation mode, that is, A power-on instruction signal to the sensor array unit 41 is transmitted.
- the communication unit 44 of the X-ray flat panel detector 4 receives the instruction signal, and the power-on unit 43 switches on the power (E 2 (v)) necessary for reading the image signal from the battery 42 to the sensor array unit 41.
- step S306 To start the shooting preparation mode (S306). Thereafter, the first and second exposure switches are pressed (S307), X-ray irradiation is instantaneously, and image signal reading is started (S308).
- the X-ray flat panel detector 4 switches to the standby mode (S309). If there is continuous irradiation, the process returns to step S304 to monitor the temperature, and if not, the process proceeds to step S311 (S310). Next, the main power supply 49 of the X-ray flat panel detector 4 is turned off (S311). If the system power is turned off, the process is terminated. If the system power is not turned off, the process returns to step S303 to wait for the next order reception (S312).
- the present embodiment by performing temperature monitoring in conjunction with order reception, it is possible to avoid problems with the transmitted X-ray detection process associated with the temperature rise of the X-ray flat panel detector 4. Further, since the temperature monitoring is automatically performed in conjunction with the order reception operation, the operator does not need an operation only for the temperature monitoring, and the operability can be improved. Since order reception is the first process of X-ray imaging, temperature monitoring can be started simultaneously with the start of X-ray imaging.
- FIG. 14 is a flowchart showing a flow of processing according to the fifth embodiment.
- Step 400 The system incorporated in the X-ray image diagnostic apparatus 1 is activated (S400).
- Step S401 The order acquisition unit 10 receives the order information through a barcode or LAN connection (S401).
- Step S402 The order acquisition detection unit 82 detects acquisition of order information, and transmits a detection signal to the detector control unit 9.
- the power source activation unit 91 of the detector control unit 9 activates the main power source 49 of the X-ray flat panel detector 4 (S402).
- Step S403 The central control unit 11 changes the screen of the image display unit 6 to a screen capable of capturing and acquiring after receiving the order information (S403).
- Step S404 The GUI transition detection unit 85 detects a GUI transition and transmits the detection signal to the detector control unit 9.
- the connection unit 92 of the detector control unit 9 starts connection of the X-ray flat panel detector 4 and shifts to the standby mode.
- Step S405 The operator turns on the irradiation field lamp 2b for confirming the irradiation field.
- the irradiation field lamp detection unit 83 detects lighting of the irradiation field lamp 2b, and transmits a temperature monitoring request signal and a lighting detection signal to the detector control unit 9.
- Step S406 The temperature monitoring unit 94 of the detector control unit 9 performs a process for monitoring the surface temperature of the X-ray flat panel detector 4. If the temperature is equal to or greater than the threshold, the process proceeds to step S407, and if less than the threshold, the process proceeds to step S408.
- the temperature monitoring unit 94 displays a warning indicating that the surface temperature is equal to or higher than the threshold (S407), and temporarily suspends X-ray imaging.
- the state switching unit 93 in the detector control unit 9 instructs the X-ray flat panel detector 4 to switch from the standby mode to the imaging preparation mode, that is, A power-on instruction signal to the sensor array unit 41 is transmitted.
- the communication unit 44 of the X-ray flat panel detector 4 receives the instruction signal, and the power-on unit 43 switches on the power (E 2 (v)) necessary for reading the image signal from the battery 42 to the sensor array unit 41.
- step S408 To start the shooting preparation mode (S408). Thereafter, the first and second exposure switches are pressed (S409), X-ray irradiation is instantaneously, and image signal reading is started (S410). When the reading of the image is completed, the X-ray flat panel detector 4 switches to the standby mode (S411). If there is continuous irradiation, the process returns to step S304 to monitor the temperature, and if not, the process proceeds to step S413 (S412). Next, the main power supply 49 of the X-ray flat panel detector 4 is turned off (S413). When the system power is turned off, the process ends. When the system power is not turned off, the process returns to step S401 and waits for reception of the next order (S414).
- the present embodiment by performing temperature monitoring in conjunction with the lighting of the irradiation field lamp, it is possible to avoid a defect in the transmitted X-ray detection process associated with the temperature rise of the X-ray flat panel detector 4. Further, since the temperature monitoring is automatically performed in conjunction with the lighting of the irradiation field lamp, the operator does not need an operation only for the temperature monitoring, and the operability can be improved. Further, since the X-ray irradiation field is turned on and the X-ray irradiation field is confirmed and then the imaging preparation mode is entered, the temperature rise of the X-ray flat panel detector 4 can be suppressed.
- FIG. 15 is a flowchart showing a flow of processing according to the fifth embodiment.
- Step 400 to S404 The system incorporated in the X-ray diagnostic imaging apparatus 1 is activated (S400), and when order information is received via a barcode or LAN connection (S401), the power supply of the X-ray flat panel detector 4 is activated (S402). Next, when the system transits to a screen capable of capturing images (S403), the connection of the X-ray flat panel detector 4 is started and the standby mode is set (S404).
- Step S500 The operator finishes positioning the subject 0 and confirms the X-ray irradiation field by visible light, and then exits the X-ray examination room and closes the door (S500).
- the door detection unit 84 detects that the door is closed, and transmits a temperature monitoring request signal and a door close detection signal to the detector control unit 9.
- Steps S406 to S414) The temperature monitoring unit 94 compares the calculation of the surface temperature of the X-ray flat panel detector 4 with a threshold value (S406), and displays a warning if the threshold value is exceeded (S407). If it is less than the threshold value, the X-ray flat panel detector 4 is switched to the imaging preparation state (S408). Thereafter, the first and second exposure switches are pressed (S409), X-ray irradiation is instantaneously, image signal reading is started (S410), and the mode is switched to the standby mode (S411). If there is continuous irradiation, the process returns to step S406 to monitor the temperature, and if not, the process proceeds to step S413 (S412).
- the main power supply 49 of the X-ray flat panel detector 4 is turned off (S413).
- the process ends.
- the process returns to step S401 and waits for reception of the next order (S414).
- the operator performs temperature monitoring in conjunction with the operation of evacuating from the X-ray examination room for X-ray irradiation, without requiring the operator to perform an operation only for temperature monitoring.
- the temperature of the X-ray closed detector can be monitored. Further, since the mode shifts to the imaging preparation mode after evacuation from the X-ray examination room, the temperature rise of the X-ray flat panel detector 4 can be suppressed.
- the seventh embodiment is an example in which temperature monitoring is performed at each stage of preparation for X-ray imaging, and in particular, temperature monitoring is performed using an operation in positioning the subject as a trigger.
- the seventh embodiment is substantially the same as the flow of the fifth embodiment, and a different process is that step S600 described later is included instead of step S405 in the fifth embodiment. Therefore, in the present embodiment, the description of the same processing as that of the fifth embodiment is simplified.
- FIG. 16 is a flowchart showing a flow of processing according to the seventh embodiment.
- Step 400 to S404 The system incorporated in the X-ray diagnostic imaging apparatus 1 is activated (S400), and when order information is received via a barcode or LAN connection (S401), the power supply of the X-ray flat panel detector 4 is activated (S402). Next, when the system transits to a screen capable of capturing images (S403), the connection of the X-ray flat panel detector 4 is started and the standby mode is set (S404).
- Step S600 When the subject 0 takes an imaging posture and comes into contact with the X-ray flat panel detector 4, the pressure sensor unit 45 of the X-ray flat panel detector 4 detects this, and a detection signal is detected from the first A / D conversion unit 46. The The detection signal is transmitted to the shooting preparation state detection unit 9 via the communication unit 44. In response to this detection signal, the pressure / contact detection unit 86 in the imaging preparation state detection unit makes a temperature monitoring request and a pressure / contact detection signal to the detector control unit 9.
- Steps S406 to S414) The temperature monitoring unit 94 compares the calculation of the surface temperature of the X-ray flat panel detector 4 with a threshold value (S406), and displays a warning if the threshold value is exceeded (S407). If it is less than the threshold value, the X-ray flat panel detector 4 is switched to the imaging preparation state (S408). Thereafter, the first and second exposure switches are pressed (S409), X-ray irradiation is instantaneously, image signal reading is started (S410), and the mode is switched to the standby mode (S411). If there is continuous irradiation, the process returns to step S406 to monitor the temperature, and if not, the process proceeds to step S413 (S412).
- the main power supply 49 of the X-ray flat panel detector 4 is turned off (S413).
- the process ends.
- the process returns to step S401 and waits for reception of the next order (S414).
- the temperature of the X-ray flat panel detector can be monitored without requiring the operator to perform an operation only for the temperature monitoring. Can do.
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Abstract
Description
図1は本実施形態に係るX線画像診断装置の概略構成を示す模式図である。本発明に係るX線画像診断装置1は、被検体0にX線を照射するX線発生部2と、X線発生部2からのX線照射の指示を入力する曝射スイッチ3と、X線発生部2に対向配置され、被検体0の透過X線を検出するX線平面検出器4と、X線平面検出器4より出力される画像データに対し画像処理を施す画像処理部5と、撮影画面や被検体のX線画像を表示する画像表示部6と、X線画像診断装置1の制御を行う制御部7と、を備える。 <Outline configuration>
FIG. 1 is a schematic diagram showing a schematic configuration of the X-ray image diagnostic apparatus according to the present embodiment. An X-ray
次に、図6乃至図9に基づいて、第一実施形態に関する処理を説明する。図6は、第一実施形態の処理の流れを示すフローチャートである。図7は、X線平面検出器4の内部温度と表面温度との関係を示す説明図である。図8は、警告表示の一例を示す模式図である。図9は、同一被検体について連続撮影をする場合及び撮影する被検体が異なる場合のX線平面検出器4の電源状態を示す模式図であり、(a)は同一被検体について連続曝射をする場合の電源状態を示し、(b)は、撮影する被検体が異なる場合の電源状態を示す。 <First embodiment>
Next, processing related to the first embodiment will be described based on FIG. 6 to FIG. FIG. 6 is a flowchart showing a process flow of the first embodiment. FIG. 7 is an explanatory diagram showing the relationship between the internal temperature of the X-ray
X線画像診断装置1のシステム電源を投入し、システムを起動する(S1)。この処理は、例えば、診療開始直後に行い、その日の診療が終了するまでシステムは起動状態にしておく。 (Step S1)
The system power of the X-ray image
システム起動後、X線平面検出器4の表面温度の温度監視処理を開始する(S2)。本実施形態では、システムが起動状態中、継続して温度監視処理を実行する。 (Step S2)
After the system is started, the temperature monitoring process of the surface temperature of the X-ray
X線平面検出器4の温度計測部47がX線平面検出器4の内部温度を計測し、第2A/D変換部48が内部温度を示すデジタルデータ(以下「温度情報」という)を生成する。
温度情報は、通信部44を経由して、制御部7の温度監視部94へ送信される。温度監視部94は、温度情報を基に、X線平面検出器4の表面温度を算出する(S21)。 (Step S21)
The temperature measurement unit 47 of the X-ray
The temperature information is transmitted to the temperature monitoring unit 94 of the control unit 7 via the communication unit 44. The temperature monitoring unit 94 calculates the surface temperature of the X-ray
式(1)はある特定のX線平面検出器の内部温度と表面温度との相関を示す。X線平面検出器に持ち手つきのカバーや散乱線除去グリッドを付帯させると、式(1)の補正値が異なるが、表面温度と内部温度の関係は導きだせる。 Surface temperature [° C] = Internal temperature [° C]-1.0 (correction value) (1)
Equation (1) shows the correlation between the internal temperature and the surface temperature of a specific X-ray flat panel detector. If an X-ray flat panel detector is equipped with a handle with a handle or a scattered radiation removal grid, the correction value of equation (1) is different, but the relationship between the surface temperature and the internal temperature can be derived.
温度監視部94は、算出された表面温度が閾値以上か未満かを判定し、閾値以上であればS23へ進み、閾値未満であればステップS21へ戻り温度計測を続行する(S22)。この閾値は、上述のIEC60601-1の規制を順守できる値であり、一例として39℃でもよい。 (Step S22)
The temperature monitoring unit 94 determines whether the calculated surface temperature is equal to or higher than the threshold value. If the calculated temperature is equal to or higher than the threshold value, the process proceeds to S23. This threshold is a value that can comply with the above-mentioned regulations of IEC60601-1, and may be 39 ° C. as an example.
温度監視部94は、表面温度が高温であることを伝えるための警告を行う(S23)。
図8に基づいて、警告の一例を説明する。温度監視部94は、画像表示部6の画面に図8に示す警告表示を行い、操作者に対して警告を発する。この警告表示には、内部温度の実測値と、正常範囲とを示し、更に内部温度及び接触表面の温度上昇を示すメッセージを表示してもよい。警告には、音声を用いてもよい。 (Step S23)
The temperature monitoring unit 94 issues a warning to notify that the surface temperature is high (S23).
An example of the warning will be described based on FIG. The temperature monitoring unit 94 displays a warning shown in FIG. 8 on the screen of the
制御部7内のオーダ取得部10が、オーダ情報を受信する(S31)。撮影準備状態検出部8のオーダ取得検知部82は、オーダを受信したことを検知し、検出器制御部9に対して温度監視のリクエストと、オーダ検知信号とを送信する。検出器制御部9は、リクエストに応じて上述のステップS2内の温度監視処理を実行する。 (Step S31)
The
検出器制御部9内の電源起動部91は、オーダ検知信号を受信し、これに基づいて、X線平面検出器4の主電源49を起動(図4のE0からE1へ投入電圧をアップ)する(S41)。 (Step S41)
Power supply activation unit 91 in the detector control unit 9 receives an order detection signal, based on this, start the main power supply 49 of the X-ray flat panel detector 4 (input voltage from E 0 in FIG. 4 to E 1 Up) (S41).
画像表示部6の画面は、取得されたオーダ情報を表示する撮影画面に遷移する(S32)。GUI遷移検知部85は、画面が遷移したことを検知し、検出器制御部9に対して温度監視処理のリクエストと、画面遷移の検知信号とを送信する。検出器制御部9は、リクエストに応じて上述のステップS2内の温度監視処理を実行する。一方、操作者は、オーダに沿ったX線撮影を行うために被検体を呼び出し(M1)、撮影姿勢を取らせる、いわゆるポジショニングを行う(M2)。その後、X線検査室から退避し、息止めの指示を行う(M3)。 (Step S32)
The screen of the
接続部92は、画面遷移検知信号を受信し、これに基づいて、制御部7と接続を開始する制御指示信号を受信する。接続部92は、通信部44を介して待機モードに移行するための指示信号を送信する。電源投入部43は、通信部44を介してその指示信号を受信し、バッテリー42から通信部44にE1(v)の電源を投入し、X線平面検出器4と制御部7との接続を開始する。これにより、X線平面検出器4は、待機モードへ移行する(S42)。 (Step S42)
The connection unit 92 receives the screen transition detection signal, and receives a control instruction signal for starting connection with the control unit 7 based on the screen transition detection signal. The connection unit 92 transmits an instruction signal for shifting to the standby mode via the communication unit 44. The power-on unit 43 receives the instruction signal via the communication unit 44, turns on the E 1 (v) power from the battery 42 to the communication unit 44, and connects the X-ray
操作者が、曝射スイッチの1段目を押し下げる(S33)。曝射スイッチ検知部81は、曝射スイッチの1段目の押し下げを検知し、検出器制御部9に対して温度監視処理のリクエストと、曝射スイッチの押し下げ状態の検知信号とを送信する。検出器制御部9は、リクエストに応じて上述のステップS2内の温度監視処理を実行する。このタイミングでの温度監視のリクエストは、次のステップでX線平面検出器4への電源投入が(E2(v))へアップし、X線平面検出器4内の温度上昇傾向がより強まることへ対応した警戒強化の意味合いを有する。 (Step S33)
The operator depresses the first stage of the exposure switch (S33). The exposure switch detection unit 81 detects the first depression of the exposure switch, and transmits a request for temperature monitoring processing and a detection signal of the depression state of the exposure switch to the detector control unit 9. The detector control unit 9 executes the temperature monitoring process in step S2 described above in response to the request. Requests for temperature monitoring at this timing will turn on the X-ray
状態切替部93は、曝射スイッチの検知信号を受信し、これに基づいて、X線平面検出器4に対し、待機モードから撮影準備モードへの切替の指示信号、すなわち、センサアレイ部41への電源投入の指示信号を送信する。X線平面検出器4の電源投入部43は、通信部44を介して指示信号を受信し、バッテリー42からセンサアレイ部41に対して画像信号の読取に必要な電源E2(v)の投入を開始する(S43)。 (Step S43)
The state switching unit 93 receives the exposure switch detection signal, and based on this, the X-ray
操作者が、曝射スイッチの2段目を押し下げる(S34)。曝射スイッチ検知部81は、曝射スイッチの2段目の押し下げを検知し、検出器制御部9に対し、温度監視のリクエストを行う。そして、上述のステップS2内の温度監視処理が実行される。このタイミングでの温度監視のリクエストは、上記ステップS43と同様、X線平面検出器4への電源投入が(E2(v))へアップしたことに伴い、X線平面検出器4内の温度上昇傾向がより強まることへ対応した警戒強化の意味合いを有する。 (Step S34)
The operator depresses the second stage of the exposure switch (S34). The exposure switch detection unit 81 detects the second depression of the exposure switch and makes a temperature monitoring request to the detector control unit 9. Then, the temperature monitoring process in step S2 described above is executed. The request for temperature monitoring at this timing is similar to step S43 above, because the temperature in the X-ray
X線管球2aからX線が照射され(S35)、X線撮影が行われる。 (Step S35)
X-rays are emitted from the
X線平面検出器4のセンサアレイ部41は、被検体0を透過した透過X線を検出し、センサアレイ部41内の画像信号読出回路が透過X線による画像信号を読み出し、通信部44を介して画像処理部5に送信することにより画像の出力が行われる(S44)。画像処理部5は、画像信号に対しゲイン調整などの画像処理を施し、被検体0のX線画像を画像表示部6に表示する。また、受信した画像信号及び画像処理後の画像信号を記憶してもよい。 (Step S44)
The sensor array unit 41 of the X-ray
同一被検体について、連続してX線撮影をする場合にはステップS45へ進み、連続撮影を行わない場合は、ステップS46へ進む(S36)。 (Step S36)
If X-ray imaging is continuously performed for the same subject, the process proceeds to step S45. If continuous imaging is not performed, the process proceeds to step S46 (S36).
曝射スイッチ検知部81が、曝射スイッチの2段目の押下げが解除されたことを検知すると、状態切替部93に対してその検知信号を送信する。状態切替部93は、X線平面検出器4の状態を撮影準備モードから待機モードへ切り替える。すなわち、電源投入部43は、切替の指示信号に従ってセンサアレイ部41に対して投入されたE2(v)の電源投入を終了し、制御部7との通信に必要なE1(v)だけを投入した接続状態になるよう、X線平面検出器4を制御する(S45)その後、ステップS33へ戻り、連続撮影を行う。 (Step S45)
When the exposure switch detection unit 81 detects that the second-stage depression of the exposure switch has been released, it transmits a detection signal to the state switching unit 93. The state switching unit 93 switches the state of the X-ray
曝射スイッチ検知部81が、曝射スイッチの2段目の押下げが解除されたことを検知すると、検出器制御部9にその検知信号を送信する。接続部92は、通信部44の接続を停止する指示信号を送信し、電源起動部91は、X線平面検出器4に対して、主電源を落とす指示信号を送信する。X線平面検出器4の電源投入部43は、通信部44の電源E1(v)の投入をやめ、主電源部49は、主電源をOFFにする。これにより、X線平面検出器4に投入される電源はE0(v)となる(S46)。 (Step S46)
When the exposure switch detection unit 81 detects that the second-stage depression of the exposure switch has been released, the detection signal is transmitted to the detector control unit 9. The connection unit 92 transmits an instruction signal for stopping the connection of the communication unit 44, and the power activation unit 91 transmits an instruction signal for turning off the main power to the X-ray
システム電源をOFFにする場合には、操作者がシステムの主電源を操作してシステム電源のOFF信号を入力する。これに応動して、ステップS2の温度検出処理を終了してからシステム電源がOFFとなり、一連の処理を終了する。一方、システム電源をOFFにしない場合には、ステップS31へ戻り、次のオーダ情報の受信に備える。 (Step S5)
When turning off the system power, the operator operates the main power of the system and inputs a system power off signal. In response to this, the system power supply is turned off after completing the temperature detection process in step S2, and the series of processes ends. On the other hand, if the system power is not turned off, the process returns to step S31 to prepare for reception of the next order information.
Further, in the present embodiment, the case where the temperature monitoring process is continuously performed has been described. However, even when the temperature monitoring process is not performed, it is possible to reduce the temperature rise caused by turning on the X-ray
次に、図10及び図11に基づいて第二実施形態について説明する。図10は、第二実施形態におけるX線平面検出器4の電源状態を示す模式図である。図11は、第二実施形態の処理の流れを示すフローチャートである。第二実施形態は、X線撮影準備の各段階で温度監視を行う例であり、特に曝射スイッチの操作をトリガーとして温度監視を行う実施形態である。第二実施形態の説明に先立ち、図10に基づいて、第二実施形態におけるX線平面検出器4の電源状態について説明する。 <Second embodiment>
Next, a second embodiment will be described based on FIG. 10 and FIG. FIG. 10 is a schematic diagram showing a power supply state of the X-ray
X線画像診断装置1のシステムを起動する(S100)。 (Step S100)
The system of the X-ray image
バーコードやLAN接続により、オーダ取得部10がオーダ情報を受信する(S101)。 (Step S101)
The
オーダ取得検知部82がオーダ情報の取得を検知し、検出器制御部9に対してその検知信号を送信する。検出器制御部9の電源起動部91は、X線平面検出器4の主電源部49を起動する(S102)。これにより、通信部44にEα(v)が投入され、通信部44が起動する。 (Step S102)
The order acquisition detection unit 82 detects acquisition of order information, and transmits a detection signal to the detector control unit 9. The power supply activation unit 91 of the detector control unit 9 activates the main power supply unit 49 of the X-ray flat panel detector 4 (S102). As a result, E α (v) is input to the communication unit 44 and the communication unit 44 is activated.
次に、中央制御部11が受信したオーダ情報を表示するために、撮影条件の設定や撮影手順を示す取得可能な画面に遷移する(S103)。 (Step S103)
Next, in order to display the order information received by the central control unit 11, a transition is made to an acquirable screen showing setting of shooting conditions and shooting procedures (S103).
GUI遷移検知部85が画面遷移の検知信号を検出器制御部9に対して送信する。検出器制御部9の接続部92は、X線平面検出器4に対して接続開始の指示信号を送信する。X線平面検出器4の電源投入部43は、通信部44を介して指示信号を受信し、それに従い、通信部44に対して電源E1(v)を投入して、制御部7とX線平面検出器4との接続を開始する。これにより、X線平面検出器4は待機モードとなる(S104)。 (Step S104)
The GUI transition detection unit 85 transmits a screen transition detection signal to the detector control unit 9. The connection unit 92 of the detector control unit 9 transmits a connection start instruction signal to the X-ray
曝射スイッチ3の1段目を押し下げる。 (Step S105)
Press down the first step of
曝射スイッチ検知部81が曝射スイッチ1段目の押下げを検知し、検出器制御部9に対し、曝射スイッチの検知信号と温度監視のリクエスト信号を送信する。検出器制御部9内の温度監視部94は、X線平面検出器4の表面温度を検出し、閾値以上であればステップS107へ進み、閾値未満であればステップS108へ進む。 (Step S106)
The exposure switch detection unit 81 detects the first depression of the exposure switch, and transmits an exposure switch detection signal and a temperature monitoring request signal to the detector control unit 9. The temperature monitoring unit 94 in the detector control unit 9 detects the surface temperature of the X-ray
温度監視部94は、表面温度が閾値以上であることを示す警告表示を行い、X線撮影を一時中断する。そして、S106へ戻り、温度監視を行う(S107)。又は、表面温度が閾値未満になった頃を見計らって、操作者が再度X線撮影に関する一連の操作を開始、又は、ステップS107より前の段階、例えばS105からの処理を行い、X線撮影を再開するように構成してもよい。 (Step S107)
The temperature monitoring unit 94 displays a warning indicating that the surface temperature is equal to or higher than the threshold, and temporarily stops X-ray imaging. Then, the process returns to S106 and temperature monitoring is performed (S107). Or, when the surface temperature becomes less than the threshold, the operator starts a series of operations relating to X-ray imaging again, or performs a process from step S107 before, for example, S105, and performs X-ray imaging. It may be configured to resume.
検出器制御部9内の状態切替部93は、曝射スイッチの検知信号に基づいて、X線平面検出器4に対し、待機モードから撮影準備モードへの切替の指示信号、すなわち、センサアレイ部41への電源投入の指示信号を送信する。X線平面検出器4の通信部44は、指示信号を受信し、電源投入部43がバッテリー42からセンサアレイ部41に対して画像信号の読取に必要な電源(E2(v))の投入を開始し、撮影準備モードに移行する(S108)。なお、本実施形態では、曝射スイッチの検知信号に基づいて状態切替の指示信号を送信したが、ステップS104で温度監視のリクエスト信号のみを検出器制御部9が受信し、温度監視部94がそれに基づいて温度監視を行い、閾値未満と判断したときに、温度監視部94から状態切替部93に対して状態切替の制御を行うリクエストを行ってもよい。以下第三~第七実施形態においても同様である。 (Step S108)
Based on the detection signal of the exposure switch, the state switching unit 93 in the detector control unit 9 instructs the X-ray
操作者が、曝射スイッチの2段目を押し下げてX線を照射する。 (Step S109)
The operator presses down the second stage of the exposure switch to irradiate X-rays.
X線平面検出器4が透過X線の検出と画像信号の読出しを行う(S110)。 (Step S110)
The X-ray
曝射スイッチ検知部81が、曝射スイッチの2段目の押下げが解除されたことを検知すると、検出器制御部9にその検知信号を送信する。状態切替部93は、待機モードへ切り替える指示信号を送信し、電源投入部43は、センサアレイ部41への電源投入E2(v)を停止する。なお、通信部44への電源E1(v)の投入は続行する。これにより、X線平面検出器4は待機モードに切り替わる。(S111)。なお、本ステップにおける待機モードへの切り替えは必須ではなく、電源起動部91、接続部92、状態切替部93の各部により、X線平面検出器4の主電源の停止、接続の終了、又は待機モードへの切り替えのいずれかの処理に代えてもよい。何れの処理を行うかは、連続照射の有無や、1回のX線照射後の処理を設定入力しておくことにより、適宜選択実行されるように構成されてもよい。 (Step S111)
When the exposure switch detection unit 81 detects that the second-stage depression of the exposure switch has been released, the detection signal is transmitted to the detector control unit 9. The state switching unit 93 transmits an instruction signal for switching to the standby mode, and the power-on unit 43 stops power-on E 2 (v) to the sensor array unit 41. Note that the supply of power E 1 (v) to the communication unit 44 continues. As a result, the X-ray
連続撮影がある場合には、ステップS105へ進み、ない場合には、ステップS113へ進む。 (Step S112)
If there is continuous shooting, the process proceeds to step S105, and if not, the process proceeds to step S113.
電源起動部91は、上記ステップS111の検知信号に基づいて、主電源部49の電源を落とす。 (Sup S113)
The power activation unit 91 turns off the main power unit 49 based on the detection signal in step S111.
システム電源をOFFにする場合には、操作者がシステムの主電源を操作してシステム電源のOFF信号を入力する。これによりシステム電源がOFFとなり、一連の処理を終了する。一方、システム電源をOFFにしない場合には、ステップS101へ戻り、次のオーダ情報の受信に備える。 (Step S114)
When turning off the system power, the operator operates the main power of the system and inputs a system power off signal. As a result, the system power is turned off, and the series of processing ends. On the other hand, if the system power is not turned off, the process returns to step S101 to prepare for reception of the next order information.
In addition, even when the temperature monitoring process is not performed as in the first embodiment, the X-ray
次に、図12に基づいて第三実施形態について説明する。第三実施形態は、X線撮影準備の各段階で温度監視を行う例であり、特に撮影画面の遷移をトリガーとして温度監視を行う。図12は、第三実施形態に係る処理の流れを示すフローチャートである。 <Third embodiment>
Next, a third embodiment will be described based on FIG. The third embodiment is an example in which temperature monitoring is performed at each stage of preparation for X-ray imaging, and in particular, temperature monitoring is performed using transition of the imaging screen as a trigger. FIG. 12 is a flowchart showing the flow of processing according to the third embodiment.
X線画像診断装置1のシステムを起動する(S200)。システムの起動と同時に、検出器制御部9の電源起動部91は、X線平面検出器4の主電源部49を起動する(S201)。 (Steps S200, S201)
The system of the X-ray image
オーダ情報取得部10がバーコードやLAN接続によりオーダ情報を受信すると、オーダ取得検知部82がオーダ情報の取得を検知する。オーダ取得検知部82は、検出器制御部9に対して検知信号を送信する(S202)。 (Step S202)
When the order
検出器制御部9が検知信号を受信すると、接続部92は、X線平面検出器4の接続開始を指示する指示信号をX線平面検出器4に送信する。電源投入部43は、通信部44に対してE1(v)を投入して通信を開始し待機モードになる。 (Step S203)
When the detector control unit 9 receives the detection signal, the connection unit 92 transmits an instruction signal for instructing the start of connection of the X-ray
X線画像診断装置1の画像表示部6の画面が撮影取得可能な画面に遷移すると、GUI遷移検知部85が画面遷移を検知する。GUI遷移検知部85は、検出器制御部9に対し、画面遷移の検知信号と温度監視のリクエスト信号を送信する(S204)。 (Step S204)
When the screen of the
検出器制御部9がリクエスト信号を受信すると、温度監視部94は、X線平面検出器4の温度情報を取得し、閾値(例39℃)以上か否かを判断する(S205)。閾値以上であればステップS206へ進み、閾値未満であればステップS207へ進む。 (Step S205)
When the detector control unit 9 receives the request signal, the temperature monitoring unit 94 acquires the temperature information of the X-ray
温度監視部94は、警告表示を行い、X線撮影を一時中断する。そして、S205へ戻り、温度監視を行う(S206)。又は、表面温度が閾値未満になった頃を見計らって、操作者が再度X線撮影に関する一連の操作を開始、又は、ステップS206より前の段階、例えばS204からの処理を行い、X線撮影を再開するように構成してもよい。 (Step S206)
The temperature monitoring unit 94 displays a warning and temporarily stops X-ray imaging. Then, the process returns to S205, and temperature monitoring is performed (S206). Or, when the surface temperature becomes less than the threshold, the operator starts a series of operations relating to X-ray imaging again, or performs a process from step S206 before, for example, S204, and performs X-ray imaging. It may be configured to resume.
温度監視部94が、閾値未満であると判断すると、状態切替部93は、検知信号に基づいてX線平面検出器4を待機モードから撮影準備モードへ切り替える指示信号を送信する。これに応じて、X線平面検出器4は、撮影準備モードに切り替わる。 (Step S207)
When the temperature monitoring unit 94 determines that the temperature is less than the threshold value, the state switching unit 93 transmits an instruction signal for switching the X-ray
操作者は、曝射スイッチの1段目、及び2段目の押下げを行う(S208)。 (Step S208)
The operator depresses the first and second stages of the exposure switch (S208).
X線が照射され、X線平面検出器4が透過X線の検出と画像信号の読出しを行う(S209)。 (Step S209)
X-rays are irradiated, and the X-ray
ステップS111からS114と同様、X線平面検出器4が待機モードに切り替えられ(S210)、連続曝射の有無が判断される(S211)。連続曝射があればステップS205へ戻り、再度温度計測を行う。連続曝射がなければ、X線平面検出器4の主電源部49の電源が落とされる(S212)。システム終了の場合には、操作者がシステム電源を落として処理を終了する。システム終了でない場合には、ステップS202へ戻り、次のオーダ受信を待つ(S213)。 (Steps S210 to S213)
As in steps S111 to S114, the X-ray
次に、図13に基づいて第四実施形態について説明する。第四実施形態は、X線撮影準備の各段階で温度監視を行う例であり、特にオーダ受信をトリガーとして温度監視を行う。図13は、第四実施形態に係る処理の流れを示すフローチャートである。 <Fourth embodiment>
Next, a fourth embodiment will be described based on FIG. The fourth embodiment is an example in which temperature monitoring is performed at each stage of preparation for X-ray imaging, and in particular, temperature monitoring is performed using order reception as a trigger. FIG. 13 is a flowchart showing a flow of processing according to the fourth embodiment.
X線画像診断装置1に組み込まれているシステムの起動(S300)と同時にX線平面検出器4の主電源49を起動し、通信部44に対してEα(v)を投入(S301)する。続いて、X線平面検出器4が接続を開始、すなわち、電源投入部43は、通信部44に対してE1(v)を投入して接続を開始し、待機モードになる(S302)。 (Steps S300 to S302)
The main power supply 49 of the X-ray
バーコードやLAN接続により、オーダ取得部10がオーダ情報を受信する。オーダ取得検知部82がオーダ情報の取得を検知し、検出器制御部9に対して検知信号と温度監視のリクエスト信号を送信する(S303)。 (Step S303)
The
検出器制御部9の温度監視部94はX線平面検出器4の表面温度を算出し、閾値以上であればステップS305へ進み、閾値未満であればステップS306へ進む(S304)。 (Step S304)
The temperature monitoring unit 94 of the detector control unit 9 calculates the surface temperature of the X-ray
第二実施形態と同様、温度監視部94は、表面温度が閾値以上であることを示す警告表示を行い(S305)、X線撮影を一時中断する。一方、温度監視部94が閾値未満と判断すると、検出器制御部9内の状態切替部93は、X線平面検出器4に対し、待機モードから撮影準備モードへの切替の指示信号、すなわち、センサアレイ部41への電源投入の指示信号を送信する。X線平面検出器4の通信部44は、指示信号を受信し、電源投入部43がバッテリー42からセンサアレイ部41に対して画像信号の読取に必要な電源(E2(v))の投入を開始し、撮影準備モードに移行する(S306)。その後、曝射スイッチ1段目、2段目が押され(S307)、瞬時にX線が照射、画像信号の読み込みが開始される(S308)。画像の読み込みが終了すると、X線平面検出器4は、待機モードに切り替わる(S309)。連続照射がある場合には、ステップS304へ戻り温度監視を行い、ない場合には、ステップS311へ進む(S310)。次いで、X線平面検出器4の主電源49を落とす(S311)。システム電源をOFFにすると処理を終了し、システム電源をOFFにしない場合には、ステップS303へ戻り、次のオーダ受信を待つ(S312)。 (Step S305 to Step S312)
Similar to the second embodiment, the temperature monitoring unit 94 displays a warning indicating that the surface temperature is equal to or higher than the threshold (S305), and temporarily suspends X-ray imaging. On the other hand, when the temperature monitoring unit 94 determines that it is less than the threshold value, the state switching unit 93 in the detector control unit 9 instructs the X-ray
次に、図14に基づいて第五実施形態について説明する。第五実施形態は、X線撮影準備の各段階で温度監視を行う例であり、特にX線照射野を確認するための照射野ランプの点灯をトリガーとして温度監視を行う。図14は、第五実施形態に係る処理の流れを示すフローチャートである。 <Fifth embodiment>
Next, a fifth embodiment will be described based on FIG. The fifth embodiment is an example in which temperature monitoring is performed at each stage of preparation for X-ray imaging, and in particular, temperature monitoring is performed using a lighting of an irradiation field lamp for confirming an X-ray irradiation field as a trigger. FIG. 14 is a flowchart showing a flow of processing according to the fifth embodiment.
X線画像診断装置1に組み込まれているシステムを起動する(S400)。 (Step 400)
The system incorporated in the X-ray image
バーコードやLAN接続により、オーダ取得部10がオーダ情報を受信する(S401)。 (Step S401)
The
オーダ取得検知部82がオーダ情報の取得を検知し、検出器制御部9に対してその検知信号を送信する。検出器制御部9の電源起動部91は、X線平面検出器4の主電源49を起動する(S402)。 (Step S402)
The order acquisition detection unit 82 detects acquisition of order information, and transmits a detection signal to the detector control unit 9. The power source activation unit 91 of the detector control unit 9 activates the main power source 49 of the X-ray flat panel detector 4 (S402).
中央制御部11が、オーダ情報の受信後に画像表示部6の画面を撮影取得可能な画面に遷移させる(S403)。 (Step S403)
The central control unit 11 changes the screen of the
GUI遷移検知部85は、GUI遷移を検知し、その検知信号を検出器制御部9へ送信する。検出器制御部9の接続部92は、X線平面検出器4の接続を開始して待機モードに移行させる。 (Step S404)
The GUI transition detection unit 85 detects a GUI transition and transmits the detection signal to the detector control unit 9. The connection unit 92 of the detector control unit 9 starts connection of the X-ray
操作者は、照射野を確認する照射野ランプ2bを点灯する。照射野ランプ検知部83は照射野ランプ2bの点灯を検知し、温度監視のリクエスト信号と点灯検知信号とを検出器制御部9へ送信する。 (Step S405)
The operator turns on the
検出器制御部9の温度監視部94は、X線平面検出器4の表面温度の監視処理を行い、閾値以上であればステップS407へ、閾値未満であればステップS408へ進む。 (Step S406)
The temperature monitoring unit 94 of the detector control unit 9 performs a process for monitoring the surface temperature of the X-ray
第二実施形態と同様、温度監視部94は、表面温度が閾値以上であることを示す警告表示を行い(S407)、X線撮影を一時中断する。一方、温度監視部94が閾値未満と判断すると、検出器制御部9内の状態切替部93は、X線平面検出器4に対し、待機モードから撮影準備モードへの切替の指示信号、すなわち、センサアレイ部41への電源投入の指示信号を送信する。X線平面検出器4の通信部44は、指示信号を受信し、電源投入部43がバッテリー42からセンサアレイ部41に対して画像信号の読取に必要な電源(E2(v))の投入を開始し、撮影準備モードに移行する(S408)。その後、曝射スイッチ1段目、2段目が押され(S409)、瞬時にX線が照射、画像信号の読み込みが開始される(S410)。画像の読み込みが終了すると、X線平面検出器4は、待機モードに切り替わる(S411)。連続照射がある場合には、ステップS304へ戻り温度監視を行い、ない場合には、ステップS413へ進む(S412)。次いで、X線平面検出器4の主電源49を落とす(S413)。システム電源をOFFにすると処理を終了し、システム電源をOFFにしない場合には、ステップS401へ戻り、次のオーダ受信を待つ(S414)。 (Step S407 to Step S414)
As in the second embodiment, the temperature monitoring unit 94 displays a warning indicating that the surface temperature is equal to or higher than the threshold (S407), and temporarily suspends X-ray imaging. On the other hand, when the temperature monitoring unit 94 determines that it is less than the threshold value, the state switching unit 93 in the detector control unit 9 instructs the X-ray
次に、図15に基づいて第六実施形態について説明する。第六実施形態は、X線撮影準備の各段階で温度監視を行う例であり、特に操作室のドアの閉じる動作をトリガーとして温度監視を行う。なお、第六実施形態は、第五実施形態の流れとほぼ同様であり、異なる処理は、第五実施形態におけるステップS405に代わり、後述するステップS500を含む点である。よって、本実施形態のうち、第五実施形態と同様の処理については説明を簡略化する。以下、図15のステップ順に沿って説明する。図15は、第五実施形態に係る処理の流れを示すフローチャートである。 <Sixth embodiment>
Next, a sixth embodiment will be described based on FIG. The sixth embodiment is an example in which temperature monitoring is performed at each stage of preparation for X-ray imaging, and in particular, temperature monitoring is performed using an operation of closing a door of an operation room as a trigger. The sixth embodiment is substantially the same as the flow of the fifth embodiment, and a different process is that step S500 described later is included instead of step S405 in the fifth embodiment. Therefore, in the present embodiment, the description of the same processing as that of the fifth embodiment is simplified. In the following, description will be given along the order of steps in FIG. FIG. 15 is a flowchart showing a flow of processing according to the fifth embodiment.
X線画像診断装置1に組み込まれているシステムを起動し(S400)、バーコードやLAN接続によりオーダ情報を受信する(S401)と、X線平面検出器4の電源を起動する(S402)。次に、システムが撮影取得可能な画面に遷移する(S403)とX線平面検出器4の接続を開始して待機モードになる(S404)。 (Step 400 to S404)
The system incorporated in the X-ray
操作者が、被検体0のポジショニングと可視光によるX線照射野の確認を終え、X線検査室から出てドアをクローズする(S500)。ドア検知部84は、ドアが閉まったことを検知し、検出器制御部9に温度監視のリクエスト信号とドアのクローズ検知信号とを送信する。 (Step S500)
The operator finishes positioning the
温度監視部94は、X線平面検出器4の表面温度の算出と閾値との比較を行い(S406)、閾値以上であれば警告表示を行う(S407)。閾値未満であれば、X線平面検出器4を撮影準備状態に切り替える(S408)。その後、曝射スイッチ1段目、2段目が押され(S409)、瞬時にX線が照射、画像信号の読み込みが開始され(S410)、待機モードに切り替わる(S411)。連続照射がある場合には、ステップS406へ戻り温度監視を行い、ない場合には、ステップS413へ進む(S412)。次いで、X線平面検出器4の主電源49を落とす(S413)。システム電源をOFFにすると処理を終了し、システム電源をOFFにしない場合には、ステップS401へ戻り、次のオーダ受信を待つ(S414)。 (Steps S406 to S414)
The temperature monitoring unit 94 compares the calculation of the surface temperature of the X-ray
次に、図16に基づいて第七実施形態について説明する。第七実施形態は、X線撮影準備の各段階で温度監視を行う例であり、特に被検体のポジショニングにおける動作をトリガーとして温度監視を行う。なお、第七実施形態は、第五実施形態の流れとほぼ同様であり、異なる処理は、第五実施形態におけるステップS405に代わり、後述するステップS600を含む点である。よって、本実施形態のうち、第五実施形態と同様の処理については説明を簡略化する。以下、図16のステップ順に沿って説明する。図16は、第七実施形態に係る処理の流れを示すフローチャートである。 <Seventh embodiment>
Next, a seventh embodiment will be described based on FIG. The seventh embodiment is an example in which temperature monitoring is performed at each stage of preparation for X-ray imaging, and in particular, temperature monitoring is performed using an operation in positioning the subject as a trigger. The seventh embodiment is substantially the same as the flow of the fifth embodiment, and a different process is that step S600 described later is included instead of step S405 in the fifth embodiment. Therefore, in the present embodiment, the description of the same processing as that of the fifth embodiment is simplified. Hereinafter, description will be given along the order of steps in FIG. FIG. 16 is a flowchart showing a flow of processing according to the seventh embodiment.
X線画像診断装置1に組み込まれているシステムを起動し(S400)、バーコードやLAN接続によりオーダ情報を受信する(S401)と、X線平面検出器4の電源を起動する(S402)。次に、システムが撮影取得可能な画面に遷移する(S403)とX線平面検出器4の接続を開始して待機モードになる(S404)。 (Step 400 to S404)
The system incorporated in the X-ray
被検体0が撮影姿勢をとり、X線平面検出器4に接触すると、X線平面検出器4の圧力センサ部45がそれを検知し、第一A/D変換部46から検知信号が検出される。検知信号は、通信部44を介して撮影準備状態検出部9へ送信される。撮影準備状態検出部内の圧力/接触検知部86は、この検知信号に対応して、検出器制御部9に対し、温度監視のリクエストと圧力/接触検知信号とを行う。 (Step S600)
When the subject 0 takes an imaging posture and comes into contact with the X-ray
温度監視部94は、X線平面検出器4の表面温度の算出と閾値との比較を行い(S406)、閾値以上であれば警告表示を行う(S407)。閾値未満であれば、X線平面検出器4を撮影準備状態に切り替える(S408)。その後、曝射スイッチ1段目、2段目が押され(S409)、瞬時にX線が照射、画像信号の読み込みが開始され(S410)、待機モードに切り替わる(S411)。連続照射がある場合には、ステップS406へ戻り温度監視を行い、ない場合には、ステップS413へ進む(S412)。次いで、X線平面検出器4の主電源49を落とす(S413)。システム電源をOFFにすると処理を終了し、システム電源をOFFにしない場合には、ステップS401へ戻り、次のオーダ受信を待つ(S414)。 (Steps S406 to S414)
The temperature monitoring unit 94 compares the calculation of the surface temperature of the X-ray
Claims (12)
- X線を照射するX線照射手段と、被検体を透過した前記X線を検出して画像データを出力するX線検出器と、前記X線照射手段及びX線検出器を制御する制御部と、を有するX線画像診断装置において、
前記被検体のX線撮影における撮影準備状態を検出する撮影準備状態検出手段と、前記撮影準備状態検出手段の検出結果に応じた電源を前記X線検出器に投入又は投入した電源を停止させる電源投入部と、を有することを特長とするX線画像診断装置。 X-ray irradiation means for irradiating X-rays, an X-ray detector for detecting the X-rays transmitted through the subject and outputting image data, and a control unit for controlling the X-ray irradiation means and the X-ray detector In an X-ray diagnostic imaging apparatus having
An imaging preparation state detection unit for detecting an imaging preparation state in X-ray imaging of the subject, and a power source for stopping a power source that has been turned on or turned on to the X-ray detector according to a detection result of the imaging preparation state detection unit An X-ray diagnostic imaging apparatus characterized by comprising an input section. - 前記電源投入部は、前記撮影準備状態検出手段の検出結果に応じて、前記X線検出器内に設置された前記制御部と通信する通信部と、前記X線を検出して画像信号を出力する検出素子を備えたセンサアレイ部と、に電源を投入又は投入した電源を停止させることを特長とする請求項1に記載のX線画像診断装置。 The power-on unit detects the X-ray and outputs an image signal according to a detection result of the imaging preparation state detection unit, a communication unit communicating with the control unit installed in the X-ray detector 2. The X-ray diagnostic imaging apparatus according to claim 1, wherein the sensor array unit including the detecting element to be turned on and the power source that is turned on or off are stopped.
- 前記撮影準備状態検出手段は、前記被検体のX線撮影に関するオーダ情報の取得を検知するオーダ取得検知部と、前記X線照射手段に備えられ陽極の回転始動指示と前記X線照射手段からのX線照射の指示を行なう曝射スイッチの状態信号を受信する曝射スイッチ検知部と、を有し、
前記電源投入部は、前記オーダ取得検知部によるオーダ情報の取得結果に基づいて、前記通信部に電源を投入し、さらに、前記曝射スイッチ検知部による前記陽極の回転始動指示の信号を受信結果に基づいて、前記センサアレイ部に電源を投入することを特長とする請求項2に記載のX線画像診断装置。 The imaging preparation state detection means includes an order acquisition detection unit that detects acquisition of order information related to X-ray imaging of the subject, an anode rotation start instruction provided in the X-ray irradiation means, and the X-ray irradiation means An exposure switch detection unit for receiving an exposure switch status signal for instructing X-ray irradiation, and
The power-on unit powers on the communication unit based on an order information acquisition result by the order acquisition detection unit, and further receives a signal of an instruction to start rotation of the anode by the exposure switch detection unit. 3. The X-ray diagnostic imaging apparatus according to claim 2, wherein the sensor array unit is powered on based on the above. - 前記オーダ情報による連続撮影の設定がされていた場合に、前記X線照射手段によってX線照射がされた後、前記電源投入部は、前記センサアレイ部に投入していた電源を停止することを特長とする請求項3に記載のX線画像診断装置。 When the continuous shooting is set according to the order information, after the X-ray irradiation is performed by the X-ray irradiation unit, the power-on unit stops the power that has been input to the sensor array unit. The X-ray diagnostic imaging apparatus according to claim 3, which is a feature.
- 前記X線検出器の表面温度を検出し、当該表面温度が閾値以上の場合に警告を発する温度監視手段を更に備える、
ことを特徴とする請求項1に記載のX線画像診断装置。 A temperature monitoring means for detecting a surface temperature of the X-ray detector and issuing a warning when the surface temperature is equal to or higher than a threshold;
2. The X-ray image diagnostic apparatus according to claim 1, wherein - 前記X線検出器の内部温度を計測する温度計測手段を更に備え、前記温度監視手段は、前記X線検出器の内部温度に基づき前記X線検出器の表面温度を検出する、
ことを特徴とする請求項5に記載のX線画像診断装置。 Further comprising temperature measuring means for measuring the internal temperature of the X-ray detector, the temperature monitoring means detects the surface temperature of the X-ray detector based on the internal temperature of the X-ray detector,
6. The X-ray image diagnostic apparatus according to claim 5, wherein - 前記温度監視手段は、前記撮影準備状態検出手段による撮影準備状態の検出結果に応じて前記表面温度の算出を行う、ことを特徴とする請求項5に記載のX線画像診断装置。 6. The X-ray diagnostic imaging apparatus according to claim 5, wherein the temperature monitoring unit calculates the surface temperature according to a detection result of the imaging preparation state by the imaging preparation state detection unit.
- 前記温度監視手段が、前記表面温度が前記閾値未満であると判断すると、前記通信部への電源投入の開始、又は前記センサアレイ部への電源投入を開始することを特長とする請求項5に記載のX線画像診断装置。 6. The temperature monitoring unit according to claim 5, wherein when the surface temperature is determined to be less than the threshold value, the communication unit starts power on or the sensor array unit starts power on. The X-ray diagnostic imaging apparatus described.
- 前記X線照射手段は、前記X線の照射野を可視光で示す照射野ランプを更に備え、前記撮影準備状態検出手段は、前記照射野ランプの点灯により撮影準備状態を検出する、
ことを特徴とする請求項7に記載のX線画像診断装置。 The X-ray irradiation means further includes an irradiation field lamp indicating the X-ray irradiation field with visible light, and the imaging preparation state detection means detects an imaging preparation state by lighting the irradiation field lamp.
8. The X-ray image diagnostic apparatus according to claim 7, wherein - 前記撮影準備状態検出手段は、前記X線画像診断装置が設置されたX線検査室にあるドアの開閉信号により撮影準備状態を検出する、
ことを特徴とする請求項7に記載のX線画像診断装置。 The imaging preparation state detection means detects an imaging preparation state by an open / close signal of a door in an X-ray examination room where the X-ray image diagnostic apparatus is installed.
8. The X-ray image diagnostic apparatus according to claim 7, wherein - 前記X線画像診断装置は、前記被検体のX線撮影条件を入力設定する撮影画面を表示する画像表示手段を更に備え、
前記撮影準備状態検出手段は、前記画像表示手段の画面遷移により撮影準備状態を検出する、
ことを特徴とする請求項7に記載のX線画像診断装置。 The X-ray diagnostic imaging apparatus further includes image display means for displaying an imaging screen for inputting and setting X-ray imaging conditions of the subject,
The photographing preparation state detection means detects a photographing preparation state by a screen transition of the image display means.
8. The X-ray image diagnostic apparatus according to claim 7, wherein - 前記X線検出器、前記被検体を載置するベッド、若しくは前記被検体が起立する起立台の少なくとも一つに、圧力センサ又は接触センサの少なくとも一つを備え、
前記撮影準備状態検出手段は、前記圧力センサ又は接触センサの検知信号により撮影準備状態を検出する、
ことを特徴とする請求項7に記載のX線画像診断装置。 At least one of a pressure sensor or a contact sensor is provided on at least one of the X-ray detector, a bed on which the subject is placed, or a stand on which the subject stands.
The photographing preparation state detection means detects a photographing preparation state based on a detection signal of the pressure sensor or contact sensor.
8. The X-ray image diagnostic apparatus according to claim 7, wherein
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JPWO2012033029A1 (en) | 2014-01-20 |
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