WO2012032696A1 - Heat resistant ic tag - Google Patents

Heat resistant ic tag Download PDF

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Publication number
WO2012032696A1
WO2012032696A1 PCT/JP2011/003542 JP2011003542W WO2012032696A1 WO 2012032696 A1 WO2012032696 A1 WO 2012032696A1 JP 2011003542 W JP2011003542 W JP 2011003542W WO 2012032696 A1 WO2012032696 A1 WO 2012032696A1
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WIPO (PCT)
Prior art keywords
tag
container
heat
resistant
glass
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PCT/JP2011/003542
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French (fr)
Japanese (ja)
Inventor
俊行 佐藤
功次 中西
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日本板硝子株式会社
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Priority to JP2012532837A priority Critical patent/JP5885142B2/en
Publication of WO2012032696A1 publication Critical patent/WO2012032696A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources

Definitions

  • the present invention relates to an IC tag having heat resistance and impact resistance.
  • an IC tag with high heat resistance for example, an IC tag having a structure in which a non-contact type IC tag is covered with a fireproof layer and the fireproof layer is covered with a protective layer, and the fireproof layer has low thermal conductivity.
  • What is comprised of the air layer which consists of the bubble by a heat insulating material and a foaming agent, a hollow sphere, or those composites is known as a "fireproof IC tag.”
  • the protective layer is formed of a synthetic resin
  • the protective layer constituting the IC tag May be insufficient in durability.
  • the heat-insulating material of the refractory layer is composed of, for example, a nonwoven fabric made of glass fibers having open cells alone, and an air layer formed by combining the heat-insulating material with bubbles or hollow spheres using a foaming agent, Due to the liquid permeability, the chemical solution may come into contact with the IC tag in the process involving dipping into the chemical solution tank, and the durability may be poor.
  • the problem to be solved by the present invention is applicable to such a use even when the IC tag is required to have high chemical resistance, high heat resistance and impact resistance in the manufacturing process of the product to which the IC tag is attached. It is to provide a heat-resistant IC tag.
  • the heat-resistant IC tag of the present invention includes a non-contact type IC tag, a first container that is hermetically sealed with the non-contact type IC tag contained therein, and a second container that contains the first container therein.
  • the first container is made of one material selected from the group of glass, glass ceramics and ceramics, and a first gap is provided between the non-contact IC tag and the first container. The first gap is depressurized from atmospheric pressure, the second container is made of a heat-resistant resin, and a second gap is formed between the first container and the second container. Is provided.
  • the non-contact type IC tag is fixed to a holding member, and further, the holding member is fixed inside the first container.
  • the holding member is made of the same material as the first container.
  • the fixing method may be a method of directly bonding using a heat-resistant adhesive or a method of bonding or molding another fixing member in the first container in advance and bonding the holding member thereto.
  • a heat-resistant adhesive a commercially available heat-resistant inorganic adhesive (for example, one obtained by calcining an inorganic polymer containing an inorganic component such as alumina) or glass frit can be used.
  • the heat-resistant IC tag of the present invention includes a non-contact type IC tag, a first container that is hermetically sealed with the non-contact type IC tag contained therein, and a second container that contains the first container therein.
  • the first container is made of one material selected from the group of glass, glass ceramics and ceramics, and the first container is between the non-contact IC tag and the first container.
  • a gap is provided, the first gap is filled with a first heat insulating material having open cells around at least the non-contact type IC tag, and the second container is made of a heat-resistant resin.
  • a second gap is provided between the first container and the second container.
  • the heat transfer to the non-contact IC tag is further reduced and the heat resistance of the heat resistant IC tag is improved. is there.
  • the first container is made of one material selected from glass, glass ceramics and ceramics, and is hermetically sealed with the non-contact type IC tag contained therein, so that a cleaning process, etc.
  • these materials are suitable for constructing a heat-resistant IC tag because they do not transmit a liquid such as a chemical solution and these materials have an insulation property that does not hinder the communication of the IC tag in addition to the heat resistance.
  • a first gap is provided between the non-contact type IC tag and the first container, and the first gap has a continuous bubble at least around the non-contact IC tag.
  • the non-contact type IC tag is not damaged by high temperature exposure or thermal shock due to the structure filled with the heat insulating material.
  • the first heat insulating material is, for example, a woven fabric or a non-woven fabric made of glass fiber, which improves the heat resistance as well as the impact resistance. Furthermore, since the second container is made of a heat resistant resin, the first container is not damaged due to thermal shock or external force.
  • the material constituting the first container is a glass material
  • the thermal shock received by the first container is mitigated, and the first container is protected against an impact caused by an external force.
  • the impact resistance of the IC tag is further improved.
  • the heat-resistant IC tag of the present invention comprises the first container with a glass material having no permeability such as a chemical solution, in a manufacturing process of a product to which the IC tag is attached, it is used in a liquid tank such as a chemical cleaning tank or a plating tank. When the product is immersed, liquid can be prevented from entering the IC tag. Further, the gap between the IC tag and the first container is evacuated, or at least a part thereof is filled with a heat insulating material having open cells, thereby providing heat insulation and the first container or heat insulating material. The IC tag can be prevented from being damaged by the expansion of the gas remaining in the interior of the IC.
  • the inside of the first container is evacuated and decompressed, and the inside of the heat-resistant IC tag is evacuated to further improve heat resistance.
  • the second container made of a heat-resistant resin material protects the first container, the first container has a large amount of heat even in a usage situation where the heat-resistant IC tag is rapidly cooled from a high temperature.
  • the heat resistant IC tag of the present invention has high impact resistance because the second container protects the first container against impact due to external force without being subjected to impact.
  • FIG. 1 is an explanatory view showing one structural example of the heat-resistant IC tag of the present invention.
  • FIG. 2 is an explanatory view showing another structural example of the heat-resistant IC tag of the present invention.
  • FIG. 3 is an explanatory view showing another structural example of the heat-resistant IC tag of the present invention.
  • FIG. 4 is an explanatory view showing another structural example of the heat-resistant IC tag of the present invention.
  • the non-contact type IC tag may be depressurized from the atmospheric pressure inside the first container, or at least the non-contact type IC tag.
  • the contact IC tag is filled with a heat insulating material, sealed in the first container made of one material selected from the group consisting of glass, glass ceramics and ceramics, and then sealed with the second heat resistant resin. By putting it in a container, it was realized without impairing the performance of the non-contact type IC tag.
  • the inside of the protective layer made of a glass material is evacuated to make the inside of the heat resistant IC tag in a vacuum state. Can be improved.
  • Said 1st container which comprises the heat resistant IC tag of this invention can be comprised as heat resistant glass, such as quartz glass, borosilicate glass, alumino borosilicate glass, glass ceramics, and a ceramic.
  • heat resistant glass such as quartz glass, borosilicate glass, alumino borosilicate glass, glass ceramics, and a ceramic.
  • shape of the said container is not specifically limited, Shapes, such as cylindrical shape and prismatic shape, are used preferably from intensity
  • the first heat-insulating material constituting the heat-resistant IC tag of the present invention is a fireproof material such as a vacuum or an inorganic fiber body such as ceramic wool, glass wool or rock wool filled in the container, brick or ceramic formed body, etc.
  • a heat insulating material that does not contain closed cells and has a property of transmitting liquid or gas is preferably used.
  • Said 2nd container which comprises the heat resistant IC tag of this invention can be comprised as a container which consists of heat resistant resins, such as a phenol-type resin, a polyimide-type resin, and a polyamide-type resin.
  • heat resistant resins such as a phenol-type resin, a polyimide-type resin, and a polyamide-type resin.
  • shape of the said container is not specifically limited, Shapes, such as cylindrical shape and prismatic shape, are used preferably from intensity
  • the second heat insulating material constituting the heat-resistant IC tag of the present invention is an inorganic fiber body such as ceramic wool, glass wool, rock wool, etc. filled in the vacuum or inside the container, like the first heat insulating material,
  • a fire-resistant heat insulating material such as a brick or a ceramic formed body, which is a heat insulating material that does not contain closed cells and has a property of transmitting liquid or gas, is preferably used. It is also possible to use a fiber material made of or a film material.
  • FIG. 1 is a schematic view of an embodiment of the present invention, in which a non-contact type IC tag having an IC chip 2 and an antenna 3 is placed in a first container 4 made of borosilicate glass, and then made of ceramic wool.
  • the heat-resistant IC tag which has the structure stored in the 2nd container 6 which consists of a polyimide-type heat-resistant resin after filling the heat insulating material 5 which becomes the inside of the container 4 and carrying out pressure reduction sealing is shown.
  • An example of a structure in which the orientation relationship between the antenna of the IC tag and the cylindrical container is changed is shown in FIG.
  • the heat-resistant IC tag of Example 1 was created as follows. One end of a borosilicate glass tube having an outer diameter of 24 mm and an inner diameter of 22 mm was sealed and cut. A non-contact type IC tag was placed therein, and 1.3 g (apparent volume 8.2 ml) of rock wool was filled in the gap between the glass tube and the IC tag. Next, the inside of the borosilicate glass tube is evacuated from the open end side, the pressure is reduced to 0.5 Pa or less, the open end side is heated, and the container portion is sealed and sealed to a height of 26 mm. did. Further, the sealed borosilicate glass tube was wrapped with a glass fiber nonwoven fabric and placed in a container made of polyimide resin having an outer diameter of 28 mm and an inner diameter of 26 mm and sealed.
  • the heat-resistant tag of Example 1 was taken out after being held in an electric furnace under the conditions of temperature and time shown in Table 1. After leaving it in the air to cool to room temperature, it was evaluated whether it could be used with a reader. The results are as shown in Table 1. A circle indicates that the operation has been performed, and a cross indicates that the operation has not been performed. It was confirmed that it could be used as an IC tag even after holding at 450 ° C. for 30 minutes.
  • the heat-resistant IC tag in which the borosilicate glass tube was fixed and housed in the polyimide resin container so as to maintain a void also showed good heat resistance.
  • FIG. 3 is a schematic diagram of another embodiment of the present invention.
  • the filling amount of the heat insulating material 5 made of ceramic wool is 0.7 g (apparent volume 4.4 ml), and the IC chip 2 is positioned substantially at the center of the heat insulating material 5 made of ceramic wool.
  • Example 2 When the heat resistance of the heat-resistant IC tag of Example 2 was evaluated in the same manner as in Example 1, the same result as in Example 1 was obtained.
  • FIG. 4 is a schematic view of another embodiment of the present invention, in which a non-contact IC tag having an IC chip 2 and an antenna 3 is fixed to a holding member and a first container 4 made of borosilicate glass. 2 shows a heat-resistant IC tag having a structure housed in a second container 6 made of a polyimide heat-resistant resin after being sealed under reduced pressure.
  • the heat-resistant IC tag of Example 1 was created as follows. One end of a borosilicate glass tube having an outer diameter of 24 mm and an inner diameter of 22 mm was sealed and cut. Next, a non-contact IC tag antenna part adhered to a plate-like member made of borosilicate glass, which is the same material, using a heat-resistant adhesive (Aron Ceramic (registered trademark) D manufactured by Toagosei Co., Ltd.) The holding member was bonded and fixed in the same manner inside the glass tube. The calcining temperature at this time was 150 ° C.
  • the inside of the borosilicate glass tube is evacuated from the open end side, the pressure is reduced to 0.5 Pa or less, the open end side is heated, and the container portion is sealed and sealed to a height of 26 mm. did. Further, the sealed borosilicate glass tube was wrapped in a glass fiber non-woven fabric and placed in a container made of polyimide resin having an outer diameter of 28 mm and an inner diameter of 26 mm and sealed.
  • Example 3 When the heat resistance of the heat-resistant IC tag of Example 3 was evaluated in the same manner as in Example 1, the same result as in Example 1 was obtained.

Abstract

A heat resistant IC tag (1) of the present invention is configured such that a contactless type IC tag is housed and sealed airtightly within a first container (4) comprising glass material such as silica glass or borosilicate glass, which has impermeability against chemicals and heat resistance, and the first container (4) is further housed within a second container (6) comprising heat resistant resin. The most major characteristic of the heat resistant IC tag is in being configured such that the gap between the contactless type IC tag and the first container (4) is made vacuous, or at least a portion of the gap is filled with heat insulating material (5) comprising open cells.

Description

耐熱ＩＣタグHeat-resistant IC tag
　本発明は、耐熱性と耐衝撃性を有するＩＣタグに関するものである。 The present invention relates to an IC tag having heat resistance and impact resistance.
従来、耐熱性能の高いＩＣタグとして、たとえば非接触型ＩＣタグを耐火層で覆い、さらにその耐火層を保護層で覆った構造からなるＩＣタグであって、耐火層が、熱伝導率の低い断熱材と発泡剤による気泡、中空球体またはそれらの複合物からなる空気層で構成されているものが「耐火ＩＣタグ」などとして知られている。 Conventionally, as an IC tag with high heat resistance, for example, an IC tag having a structure in which a non-contact type IC tag is covered with a fireproof layer and the fireproof layer is covered with a protective layer, and the fireproof layer has low thermal conductivity. What is comprised of the air layer which consists of the bubble by a heat insulating material and a foaming agent, a hollow sphere, or those composites is known as a "fireproof IC tag."
　しかしながら、従来知られた耐火ＩＣタグには、以下のような問題が生じることがありうる。たとえば保護層が合成樹脂で形成されている場合には、ＩＣタグが取り付けられる対象物の製造工程に酸やアルカリを用いる洗浄などの薬液処理工程がある場合には、ＩＣタグを構成する保護層の耐久性が不十分とされることがある。 However, the following problems may occur in the conventionally known refractory IC tag. For example, when the protective layer is formed of a synthetic resin, if there is a chemical treatment process such as cleaning using acid or alkali in the manufacturing process of the object to which the IC tag is attached, the protective layer constituting the IC tag May be insufficient in durability.
また、セメントやヒートレスガラスのような耐熱性の高い固体に独立気泡が多く含まれる発泡体や中空球体を耐火層として用いる場合には、気泡内の気体が高温で膨張して破損の原因となることがある。 In addition, when using a foam or hollow sphere containing a large amount of closed cells in a highly heat-resistant solid such as cement or heatless glass, the gas in the bubbles expands at a high temperature, causing damage. May be.
さらにまた、耐火層の断熱材を、たとえば連続気泡を有するガラス繊維からなる不織布単独、およびその断熱材に発泡剤による気泡や中空球体を組み合わせてなる空気層で構成される場合、それらは基体や液体の透過性を有することから、薬液槽へのディッピングを伴う工程において、薬液がＩＣタグと接触することがあり、耐久性に乏しい場合がある。 Furthermore, when the heat-insulating material of the refractory layer is composed of, for example, a nonwoven fabric made of glass fibers having open cells alone, and an air layer formed by combining the heat-insulating material with bubbles or hollow spheres using a foaming agent, Due to the liquid permeability, the chemical solution may come into contact with the IC tag in the process involving dipping into the chemical solution tank, and the durability may be poor.
特開２００２－２３０５０３号公報JP 2002-230503 A 特開２００２－１３５２３２号公報JP 2002-135232 A 特開２００３－０１７５１４号公報JP 2003-017514 A
　本発明によって解決しようとする課題は、ＩＣタグを取り付ける製品の製造工程において、ＩＣタグに高い耐薬品性と高い耐熱性および耐衝撃性が求められる場合にも、そのような用途に適用可能な耐熱ＩＣタグを提供することである。 The problem to be solved by the present invention is applicable to such a use even when the IC tag is required to have high chemical resistance, high heat resistance and impact resistance in the manufacturing process of the product to which the IC tag is attached. It is to provide a heat-resistant IC tag.
　本発明の耐熱ＩＣタグは、非接触型ＩＣタグと、前記非接触型ＩＣタグを内部に収めて気密に封止された第一の容器と、前記第一の容器を内部に収める第二の容器と、を備え、前記第一の容器は、ガラス、ガラスセラミックスおよびセラミックスの群から選ばれた一つの材料からなり、前記非接触型ＩＣタグと前記第一の容器の間に第一の空隙が設けられており、前記第一の空隙は大気圧より減圧されており、前記第二の容器は、耐熱樹脂からなり、前記第一の容器と前記第二の容器の間に第二の空隙が設けられていることを特徴とする。 The heat-resistant IC tag of the present invention includes a non-contact type IC tag, a first container that is hermetically sealed with the non-contact type IC tag contained therein, and a second container that contains the first container therein. And the first container is made of one material selected from the group of glass, glass ceramics and ceramics, and a first gap is provided between the non-contact IC tag and the first container. The first gap is depressurized from atmospheric pressure, the second container is made of a heat-resistant resin, and a second gap is formed between the first container and the second container. Is provided.
ここで、前記非接触型ICタグは保持部材に固定され、さらに前記保持部材が前記第一の容器内部に固定されることとなる。このとき、熱膨張率を適合させるため、前記保持部材は前記第一の容器と同じ材質からなることが好ましい。また、固定の方法は、耐熱性を有する接着剤を用いて直接に接着する方法や、予め第一の容器内部に固定用の別の部材を接着ないし成型した上でそこに前記保持部材を接着する方法が使用できる。前記耐熱性を有する接着剤としては、市販の耐熱無機接着剤（例えばアルミナなどの無機成分を含む無機ポリマーを仮焼して用いるもの）やガラスフリットが使用できる。 Here, the non-contact type IC tag is fixed to a holding member, and further, the holding member is fixed inside the first container. At this time, in order to adapt the coefficient of thermal expansion, it is preferable that the holding member is made of the same material as the first container. In addition, the fixing method may be a method of directly bonding using a heat-resistant adhesive or a method of bonding or molding another fixing member in the first container in advance and bonding the holding member thereto. Can be used. As the heat-resistant adhesive, a commercially available heat-resistant inorganic adhesive (for example, one obtained by calcining an inorganic polymer containing an inorganic component such as alumina) or glass frit can be used.
　また本発明の耐熱ＩＣタグは、非接触型ＩＣタグと、前記非接触型ＩＣタグを内部に収めて気密に封止された第一の容器と、前記第一の容器を内部に収める第二の容器と、を備え、前記第一の容器は、ガラス、ガラスセラミックスおよびセラミックスの群から選ばれた一つの材料からなり、前記非接触型ＩＣタグと前記第一の容器の間に第一の空隙が設けられており、前記第一の空隙の少なくとも前記非接触型ＩＣタグの周辺には連続気泡を有する第一の断熱材が充填されており、前記第二の容器は、耐熱樹脂からなり、前記第一の容器と前記第二の容器の間に第二の空隙が設けられていることを特徴とする。 The heat-resistant IC tag of the present invention includes a non-contact type IC tag, a first container that is hermetically sealed with the non-contact type IC tag contained therein, and a second container that contains the first container therein. The first container is made of one material selected from the group of glass, glass ceramics and ceramics, and the first container is between the non-contact IC tag and the first container. A gap is provided, the first gap is filled with a first heat insulating material having open cells around at least the non-contact type IC tag, and the second container is made of a heat-resistant resin. A second gap is provided between the first container and the second container.
さらに、　第一の断熱材が充填されている前記第一の空隙を大気圧より減圧すると、前記非接触ＩＣタグへの伝熱がさらに小さくなって耐熱ＩＣタグの耐熱性が向上するという利点がある。 Further, when the first gap filled with the first heat insulating material is depressurized from the atmospheric pressure, the heat transfer to the non-contact IC tag is further reduced and the heat resistance of the heat resistant IC tag is improved. is there.
　前記第一の容器は、ガラス、ガラスセラミックスおよびセラミックスから選ばれた一つの材料からなり、かつその中に前記非接触型ＩＣタグを収めた状態で気密に封止されているから、洗浄工程などにおいて薬液などの液体を透過せず、かつこれらの材料は耐熱性に加えてＩＣタグの通信を阻害しない程度の絶縁性を有するので、耐熱ＩＣタグを構成するために適している。また、前記非接触型ＩＣタグと前記第一の容器の間に第一の空隙が設けられており、かつ前記第一の空隙の少なくとも前記非接触ＩＣタグの周辺には連続気泡を有する第一の断熱材が充填されている構成に起因して、前記非接触型ＩＣタグが高温暴露や熱衝撃では破損することがない。ここで、前記第一の断熱材は、例えばガラス繊維からなる織布または不織布をもちいると、断熱性のほか耐衝撃性も向上して好ましい。さらに、前記第二の容器が耐熱樹脂で構成されているため、前記第一の容器が熱衝撃や外力に起因して破損することがない。 The first container is made of one material selected from glass, glass ceramics and ceramics, and is hermetically sealed with the non-contact type IC tag contained therein, so that a cleaning process, etc. In this case, these materials are suitable for constructing a heat-resistant IC tag because they do not transmit a liquid such as a chemical solution and these materials have an insulation property that does not hinder the communication of the IC tag in addition to the heat resistance. In addition, a first gap is provided between the non-contact type IC tag and the first container, and the first gap has a continuous bubble at least around the non-contact IC tag. The non-contact type IC tag is not damaged by high temperature exposure or thermal shock due to the structure filled with the heat insulating material. Here, it is preferable that the first heat insulating material is, for example, a woven fabric or a non-woven fabric made of glass fiber, which improves the heat resistance as well as the impact resistance. Furthermore, since the second container is made of a heat resistant resin, the first container is not damaged due to thermal shock or external force.
　また、前記第一の容器を構成する材料がガラス材料であると、切断加工や溶融融着加工が容易であるため、耐熱ＩＣタグを製造することが容易になるという利点がある。 Further, when the material constituting the first container is a glass material, there is an advantage that it is easy to manufacture a heat-resistant IC tag because cutting processing and melt-bonding processing are easy.
　また、前記第二の空隙にも断熱材が充填されていると、第一の容器の受ける熱衝撃が緩和され、かつ、外力による衝撃に対しても第一の容器が保護されるから、耐熱ＩＣタグの耐衝撃性がさらに向上するという利点がある。 In addition, if the second gap is also filled with a heat insulating material, the thermal shock received by the first container is mitigated, and the first container is protected against an impact caused by an external force. There is an advantage that the impact resistance of the IC tag is further improved.
　本発明の耐熱ＩＣタグは、薬液などの透過性が無いガラス材料等で第一の容器を構成しているので、ＩＣタグを取り付ける製品の製造プロセスにおいて薬品洗浄槽やメッキ槽などの液槽に製品を浸漬する際に、ＩＣタグ内部への液体の侵入を防止できる。さらにＩＣタグと第一の容器との間の空隙を、真空とするかまたは少なくともその一部を連続気泡を有する断熱材で充填することにより、断熱性を付与するとともに第一の容器や断熱材の内部に残存する気体の膨張によるＩＣタグの破損を防止できる。さらに、少なくとも非接触タグの近傍に連続気泡を有する断熱材を充填した後に、第一の容器の内部を排気減圧して、耐熱ＩＣタグの内部を真空状態にすることによって、より耐熱性を向上させることができる。またさらに、耐熱性を有する樹脂材料からなる第二の容器が第一の容器を保護しているため、耐熱ＩＣタグが高温から急冷されるような使用状況においても、第一の容器が大きな熱衝撃を受けることがなく、また外力による衝撃に対しても第二の容器が第一の容器を保護するために、本発明の耐熱ＩＣタグは高い耐衝撃性を有するものとなっている。 Since the heat-resistant IC tag of the present invention comprises the first container with a glass material having no permeability such as a chemical solution, in a manufacturing process of a product to which the IC tag is attached, it is used in a liquid tank such as a chemical cleaning tank or a plating tank. When the product is immersed, liquid can be prevented from entering the IC tag. Further, the gap between the IC tag and the first container is evacuated, or at least a part thereof is filled with a heat insulating material having open cells, thereby providing heat insulation and the first container or heat insulating material. The IC tag can be prevented from being damaged by the expansion of the gas remaining in the interior of the IC. Furthermore, after filling a heat insulating material having open cells in the vicinity of at least the non-contact tag, the inside of the first container is evacuated and decompressed, and the inside of the heat-resistant IC tag is evacuated to further improve heat resistance. Can be made. Furthermore, since the second container made of a heat-resistant resin material protects the first container, the first container has a large amount of heat even in a usage situation where the heat-resistant IC tag is rapidly cooled from a high temperature. The heat resistant IC tag of the present invention has high impact resistance because the second container protects the first container against impact due to external force without being subjected to impact.
図１は本発明の耐熱ＩＣタグの一つの構造例を示した説明図である。FIG. 1 is an explanatory view showing one structural example of the heat-resistant IC tag of the present invention. 図２は本発明の耐熱ＩＣタグの他の構造例を示した説明図である。FIG. 2 is an explanatory view showing another structural example of the heat-resistant IC tag of the present invention. 図３は本発明の耐熱ＩＣタグの他の構造例を示した説明図である。FIG. 3 is an explanatory view showing another structural example of the heat-resistant IC tag of the present invention. 図４は本発明の耐熱ＩＣタグの他の構造例を示した説明図である。FIG. 4 is an explanatory view showing another structural example of the heat-resistant IC tag of the present invention.
　非接触型ＩＣタグに耐薬品性、耐熱性および耐衝撃性を同時に付与するという目的を、前記非接触型ＩＣタグを、第一の容器の内部を大気圧より減圧するかまたな少なくとも前記非接触ＩＣタグの周辺を断熱材で充填して、ガラス、ガラスセラミックスおよびセラミックスの群から選ばれた一つの材料からなる前記第一の容器に収めて封止した後に耐熱樹脂からなる前記第二の容器に収めることにより、非接触型ＩＣタグの性能を損なわずに実現した。 For the purpose of simultaneously imparting chemical resistance, heat resistance and impact resistance to the non-contact type IC tag, the non-contact type IC tag may be depressurized from the atmospheric pressure inside the first container, or at least the non-contact type IC tag. The contact IC tag is filled with a heat insulating material, sealed in the first container made of one material selected from the group consisting of glass, glass ceramics and ceramics, and then sealed with the second heat resistant resin. By putting it in a container, it was realized without impairing the performance of the non-contact type IC tag.
さらに、少なくとも非接触タグの近傍に連続気泡を有する断熱材を充填した後に、ガラス材料からなる保護層の内部を排気して、耐熱ＩＣタグの内部を真空状態にすることによって、より耐熱性を向上させることができる。 Furthermore, after filling a heat insulating material having open cells in the vicinity of at least the non-contact tag, the inside of the protective layer made of a glass material is evacuated to make the inside of the heat resistant IC tag in a vacuum state. Can be improved.
本発明の耐熱ＩＣタグを構成する前記第一の容器は、石英ガラス、ホウ珪酸ガラス、アルミノホウ珪酸ガラス等の耐熱性ガラスや、ガラスセラミックス、セラミックスからなる容器として構成できる。前記容器の形状は特に限定されるものではないが、強度と取扱いの容易さから円筒状、角柱状等の形状が好ましく用いられる。 Said 1st container which comprises the heat resistant IC tag of this invention can be comprised as heat resistant glass, such as quartz glass, borosilicate glass, alumino borosilicate glass, glass ceramics, and a ceramic. Although the shape of the said container is not specifically limited, Shapes, such as cylindrical shape and prismatic shape, are used preferably from intensity | strength and the ease of handling.
本発明の耐熱ＩＣタグを構成する前記第一の断熱材は、真空または前記容器の内部に充填されたセラミックウール、ガラスウール、ロックウールなどの無機繊維体や、レンガ、セラミックス形成体などの耐火断熱材であって、独立気泡を含まず液体や気体を透過する性質を有する断熱材であるものが好ましく用いられる。 The first heat-insulating material constituting the heat-resistant IC tag of the present invention is a fireproof material such as a vacuum or an inorganic fiber body such as ceramic wool, glass wool or rock wool filled in the container, brick or ceramic formed body, etc. A heat insulating material that does not contain closed cells and has a property of transmitting liquid or gas is preferably used.
本発明の耐熱ＩＣタグを構成する前記第二の容器は、フェノール系樹脂、ポリイミド系樹脂、ポリアミド系樹脂などの耐熱樹脂からなる容器として構成できる。前記容器の形状は特に限定されるものではないが、強度と取扱いの容易さから円筒状、角柱状等の形状が好ましく用いられる。 Said 2nd container which comprises the heat resistant IC tag of this invention can be comprised as a container which consists of heat resistant resins, such as a phenol-type resin, a polyimide-type resin, and a polyamide-type resin. Although the shape of the said container is not specifically limited, Shapes, such as cylindrical shape and prismatic shape, are used preferably from intensity | strength and the ease of handling.
本発明の耐熱ＩＣタグを構成する前記第二の断熱材は、第一の断熱材と同様に真空または前記容器の内部に充填されたセラミックウール、ガラスウール、ロックウールなどの無機繊維体や、レンガ、セラミックス形成体などの耐火断熱材であって、独立気泡を含まず液体や気体を透過する性質を有する断熱材であるものが好ましく用いられるほか、第二の容器同様に耐熱性の樹脂材料からなる繊維材料、フィルム材料からなるものを用いることもできる。 The second heat insulating material constituting the heat-resistant IC tag of the present invention is an inorganic fiber body such as ceramic wool, glass wool, rock wool, etc. filled in the vacuum or inside the container, like the first heat insulating material, A fire-resistant heat insulating material such as a brick or a ceramic formed body, which is a heat insulating material that does not contain closed cells and has a property of transmitting liquid or gas, is preferably used. It is also possible to use a fiber material made of or a film material.
図１は、本発明の一実施例の概略図であって、ＩＣチップ２とアンテナ３を備えた非接触型ＩＣタグをホウ珪酸ガラスからなる第一の容器４に収め、その後にセラミックウールからなる断熱材５を容器４内部に充填して減圧封止した後に、さらにポリイミド系耐熱樹脂からなる第二の容器６に格納した構造を有する耐熱ＩＣタグを示す。
またＩＣタグのアンテナと円筒形容器の方位関係を変更した構造の例を図２に示す。 FIG. 1 is a schematic view of an embodiment of the present invention, in which a non-contact type IC tag having an IC chip 2 and an antenna 3 is placed in a first container 4 made of borosilicate glass, and then made of ceramic wool. The heat-resistant IC tag which has the structure stored in the 2nd container 6 which consists of a polyimide-type heat-resistant resin after filling the heat insulating material 5 which becomes the inside of the container 4 and carrying out pressure reduction sealing is shown.
An example of a structure in which the orientation relationship between the antenna of the IC tag and the cylindrical container is changed is shown in FIG.
　実施例１の耐熱ＩＣタグは、以下のように作成した。外径２４ｍｍ、内径２２ｍｍのホウ珪酸ガラス管の片端を封じ切りした後に切断した。その中に非接触型ＩＣタグを納め、さらにガラス管と前記ＩＣタグの間の空隙にロックウールを１．３ｇ（見かけ体積８．２ｍｌ）充填した。次に開放端側から前記ホウ珪酸ガラス管の内部を真空排気し、真空度０．５Ｐａ以下まで減圧した後に開放端側を加熱し、容器部分が高さ２６ｍｍになるように封じ切りして密封した。さらに、封じ切りした前記ホウ珪酸ガラス管を、ガラス繊維不織布でくるんで外径２８ｍｍ、内径２６ｍｍのポリイミド樹脂からなる容器に収めて封止した。 The heat-resistant IC tag of Example 1 was created as follows. One end of a borosilicate glass tube having an outer diameter of 24 mm and an inner diameter of 22 mm was sealed and cut. A non-contact type IC tag was placed therein, and 1.3 g (apparent volume 8.2 ml) of rock wool was filled in the gap between the glass tube and the IC tag. Next, the inside of the borosilicate glass tube is evacuated from the open end side, the pressure is reduced to 0.5 Pa or less, the open end side is heated, and the container portion is sealed and sealed to a height of 26 mm. did. Further, the sealed borosilicate glass tube was wrapped with a glass fiber nonwoven fabric and placed in a container made of polyimide resin having an outer diameter of 28 mm and an inner diameter of 26 mm and sealed.
　実施例１の耐熱ＩＣタグの耐熱性を評価するために、前記耐熱タグを表１に示す温度、時間の条件で電気炉中に保持した後に取り出した。大気中に放置して常温まで冷却した後に、リーダを用いて使用可能か否かを評価した。結果は表１に記載のとおりであり、○印は動作したことを示し、×印は動作しなかったことを意味する。４５０℃で３０分間の高温保持を行った後でもＩＣタグとして使用可能であることが確認された。 In order to evaluate the heat resistance of the heat-resistant IC tag of Example 1, the heat-resistant tag was taken out after being held in an electric furnace under the conditions of temperature and time shown in Table 1. After leaving it in the air to cool to room temperature, it was evaluated whether it could be used with a reader. The results are as shown in Table 1. A circle indicates that the operation has been performed, and a cross indicates that the operation has not been performed. It was confirmed that it could be used as an IC tag even after holding at 450 ° C. for 30 minutes.
前記ホウ珪酸ガラス管を空隙を保つように前記ポリイミド樹脂容器に固定して収めた耐熱ＩＣタグも、同様に良好な耐熱性を示した。 The heat-resistant IC tag in which the borosilicate glass tube was fixed and housed in the polyimide resin container so as to maintain a void also showed good heat resistance.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
図３は、本発明の別の一実施例の概略図である。本実施例においては、セラミックウールからなる断熱材５の充填量を０．７ｇ（見かけ体積４．４ｍｌ）とし、ＩＣチップ２がセラミックウールからなる断熱材５のほぼ中央に位置するようにした他は、実施例１と同様にして耐熱ＩＣタグを作成した。 FIG. 3 is a schematic diagram of another embodiment of the present invention. In this embodiment, the filling amount of the heat insulating material 5 made of ceramic wool is 0.7 g (apparent volume 4.4 ml), and the IC chip 2 is positioned substantially at the center of the heat insulating material 5 made of ceramic wool. Produced a heat-resistant IC tag in the same manner as in Example 1.
　実施例２の耐熱ＩＣタグの耐熱性について、実施例１と同様に評価したところ、実施例１と同様の結果が得られた。 When the heat resistance of the heat-resistant IC tag of Example 2 was evaluated in the same manner as in Example 1, the same result as in Example 1 was obtained.
　図４は、本発明の別の一実施例の概略図であって、ＩＣチップ２とアンテナ３を備えた非接触型ＩＣタグを保持部材に固定してホウ珪酸ガラスからなる第一の容器４に収めて減圧封止した後に、さらにポリイミド系耐熱樹脂からなる第二の容器６に格納した構造を有する耐熱ＩＣタグを示す。 FIG. 4 is a schematic view of another embodiment of the present invention, in which a non-contact IC tag having an IC chip 2 and an antenna 3 is fixed to a holding member and a first container 4 made of borosilicate glass. 2 shows a heat-resistant IC tag having a structure housed in a second container 6 made of a polyimide heat-resistant resin after being sealed under reduced pressure.
　実施例１の耐熱ＩＣタグは、以下のように作成した。外径２４ｍｍ、内径２２ｍｍのホウ珪酸ガラス管の片端を封じ切りした後に切断した。次いで、同じ素材であるホウ珪酸ガラスからなる板状部材に耐熱接着剤（東亞合成株式会社製アロンセラミック（登録商標）D）を用いて非接触ＩＣタグのアンテナ部分を接着したものをその中に納め、前記保持部材を前記ガラス管の内部に同様に接着固定した。このときの仮焼温度は１５０℃であった。次に開放端側から前記ホウ珪酸ガラス管の内部を真空排気し、真空度０．５Ｐａ以下まで減圧した後に開放端側を加熱し、容器部分が高さ２６ｍｍになるように封じ切りして密封した。さらに、封じ切りした前記ホウ珪酸ガラス管を、ガラス繊維不織布で包んで外径２８ｍｍ、内径２６ｍｍのポリイミド樹脂からなる容器に収めて封止した。 The heat-resistant IC tag of Example 1 was created as follows. One end of a borosilicate glass tube having an outer diameter of 24 mm and an inner diameter of 22 mm was sealed and cut. Next, a non-contact IC tag antenna part adhered to a plate-like member made of borosilicate glass, which is the same material, using a heat-resistant adhesive (Aron Ceramic (registered trademark) D manufactured by Toagosei Co., Ltd.) The holding member was bonded and fixed in the same manner inside the glass tube. The calcining temperature at this time was 150 ° C. Next, the inside of the borosilicate glass tube is evacuated from the open end side, the pressure is reduced to 0.5 Pa or less, the open end side is heated, and the container portion is sealed and sealed to a height of 26 mm. did. Further, the sealed borosilicate glass tube was wrapped in a glass fiber non-woven fabric and placed in a container made of polyimide resin having an outer diameter of 28 mm and an inner diameter of 26 mm and sealed.
　実施例３の耐熱ＩＣタグの耐熱性について、実施例１と同様に評価したところ、実施例１と同様の結果が得られた。 When the heat resistance of the heat-resistant IC tag of Example 3 was evaluated in the same manner as in Example 1, the same result as in Example 1 was obtained.
　実施例１の耐熱ＩＣタグ１０個を用意し、実際の使用を想定して１ｍの高さからコンクリート製の床に落下させて容器の破損有無を確認したところ、１０個のうち破損したものはなかった。比較のため前記ポリイミド樹脂容器のないもの（前記ホウ珪酸ガラス管）を落下させたところ、１０個のうち６個が破損した。 10 heat-resistant IC tags of Example 1 were prepared, dropped on a concrete floor from a height of 1 m on the assumption of actual use, and confirmed whether or not the container was damaged. There wasn't. For comparison, when one without the polyimide resin container (the borosilicate glass tube) was dropped, 6 out of 10 were damaged.
　１　耐熱ＩＣタグ
２　非接触ＩＣタグのＩＣチップ部分
３　非接触ＩＣタグのアンテナ部分
４　第一の容器
５　第一の断熱材
６　第二の容器
７　第二の断熱材
８　保持部材 DESCRIPTION OF SYMBOLS 1 Heat-resistant IC tag 2 IC chip part of non-contact IC tag 3 Antenna part of non-contact IC tag 1st container 5 1st heat insulating material 6 2nd container 7 2nd heat insulating material 8 Holding member
　本発明の耐熱ＩＣタグにより、薬品や高温の環境を含みさらに耐衝撃性が要求される製造工程においても、ＩＣタグによる物品管理が良好に実現できる。 With the heat-resistant IC tag of the present invention, it is possible to satisfactorily manage articles using the IC tag even in manufacturing processes that require chemicals and high-temperature environments and further require impact resistance.

Claims (5)

  1. 　非接触型ＩＣタグと、
    前記非接触型ＩＣタグを内部に収めて気密に封止された第一の容器と、
    前記第一の容器を内部に収める第二の容器と、を備え、
    前記第一の容器は、ガラス、ガラスセラミックスおよびセラミックスの群から選ばれた一つの材料からなり、
    前記非接触型ＩＣタグと前記第一の容器の間に第一の空隙が設けられており、
    前記第一の空隙は大気圧より減圧されており、
    前記第二の容器は、耐熱樹脂からなり、
    前記第一の容器と前記第二の容器の間に第二の空隙が設けられていることを特徴とする、
    耐熱ＩＣタグ。     A non-contact IC tag;
    A first container hermetically sealed with the non-contact IC tag contained therein;
    A second container that houses the first container,
    The first container is made of one material selected from the group of glass, glass ceramics and ceramics,
    A first gap is provided between the non-contact IC tag and the first container;
    The first void is depressurized from atmospheric pressure;
    The second container is made of a heat resistant resin,
    A second gap is provided between the first container and the second container,
    Heat resistant IC tag.
  2. 　非接触型ＩＣタグと、
    前記非接触型ＩＣタグを内部に収めて気密に封止された第一の容器と、
    前記第一の容器を内部に収める第二の容器と、を備え、
    前記第一の容器は、ガラス、ガラスセラミックスおよびセラミックスの群から選ばれた一つの材料からなり、
    前記非接触型ＩＣタグと前記第一の容器の間に第一の空隙が設けられており、
    前記第一の空隙の少なくとも前記非接触ＩＣタグの周辺には連続気泡を有する第一の断熱材が充填されており、
    前記第二の容器は、耐熱樹脂からなり、
    前記第一の容器と前記第二の容器の間に第二の空隙が設けられていることを特徴とする、
    耐熱ＩＣタグ。     A non-contact IC tag;
    A first container hermetically sealed with the non-contact IC tag contained therein;
    A second container that houses the first container,
    The first container is made of one material selected from the group of glass, glass ceramics and ceramics,
    A first gap is provided between the non-contact IC tag and the first container;
    At least the non-contact IC tag around the first gap is filled with a first heat insulating material having open cells,
    The second container is made of a heat resistant resin,
    A second gap is provided between the first container and the second container,
    Heat resistant IC tag.
  3. 　前記第一の空隙が、大気圧より減圧されていることを特徴とする、請求項２に記載の耐熱ＩＣタグ。 The heat-resistant IC tag according to claim 2, wherein the first gap is depressurized from atmospheric pressure.
  4. 　前記第一の容器が、ガラス材料からなることを特徴とする、請求項１ないし３に記載の耐熱ＩＣタグ。 The heat-resistant IC tag according to claim 1, wherein the first container is made of a glass material.
  5. 　前記第二の空隙に、第二の断熱材が充填されていることを特徴とする、請求項１ないし４に記載の耐熱ＩＣタグ。 The heat-resistant IC tag according to any one of claims 1 to 4, wherein the second space is filled with a second heat insulating material.
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JP2015065253A (en) * 2013-09-25 2015-04-09 富士通株式会社 Package structure
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