WO2012025981A1 - Appareil de refroidissement, appareil électronique comportant un appareil de refroidissement, et procédé pour refroidir un corps générant de la chaleur - Google Patents

Appareil de refroidissement, appareil électronique comportant un appareil de refroidissement, et procédé pour refroidir un corps générant de la chaleur Download PDF

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Publication number
WO2012025981A1
WO2012025981A1 PCT/JP2010/064197 JP2010064197W WO2012025981A1 WO 2012025981 A1 WO2012025981 A1 WO 2012025981A1 JP 2010064197 W JP2010064197 W JP 2010064197W WO 2012025981 A1 WO2012025981 A1 WO 2012025981A1
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WIPO (PCT)
Prior art keywords
refrigerant liquid
cooling
unit
joint
supplies
Prior art date
Application number
PCT/JP2010/064197
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English (en)
Japanese (ja)
Inventor
林　信幸
米田　泰博
中西　輝
将 森田
Original Assignee
富士通株式会社
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Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP2012530437A priority Critical patent/JP5590128B2/ja
Priority to PCT/JP2010/064197 priority patent/WO2012025981A1/fr
Publication of WO2012025981A1 publication Critical patent/WO2012025981A1/fr
Priority to US13/751,564 priority patent/US20130139998A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Definitions

  • the present invention relates to a cooling device, an electronic device having a cooling device, and a method for cooling a heating element.
  • FIG. 1A As a technique for cooling a semiconductor device, for example, as shown in FIG. 1A, a jet cooling method in which a pressurized refrigerant liquid 103 is sprayed from a nozzle 105 onto a semiconductor element 121 or a package 120 (see, for example, Patent Documents 1 and 2) is known. ing.
  • FIG. 1B an immersion boiling cooling method in which the semiconductor element 121 is immersed in an insulating refrigerant liquid 104 having a low boiling point is known.
  • the semiconductor element 121 that is a high heating element can be cooled by utilizing the boiling and vaporization of the refrigerant liquids 103 and 104.
  • the refrigerant liquids 103 and 104 are circulated by the pump 108 and radiated by the radiator 106.
  • a fan 107 is used to increase the heat dissipation efficiency.
  • Patent Document 3 A technique for forming an air curtain around a chip when performing a jet cooling method has also been proposed (see, for example, Patent Document 3).
  • the chip is held downward, the coolant is sprayed from the lower nozzle to the chip, and an air curtain is formed by flowing air from the periphery of the chip in the direction opposite to the coolant spraying direction. This prevents the coolant from flowing into the region other than the cooling surface.
  • the joint 125 is a place that is responsible for electrical connection, cooling is performed directly using the aqueous coolant 103 from the viewpoint of maintaining insulation between different wirings. Is not preferred.
  • the cooling capacity is limited.
  • the semiconductor element 121 generates a large amount of heat, a large amount of boiling bubbles are generated, so that the cooling efficiency of the semiconductor element 121 decreases.
  • the semiconductor element 121 is immersed in the insulating refrigerant liquid 104, so that the joint 125 can be directly cooled.
  • the refrigerant liquid 104 has an insulating property, for example, when a fluorine-based refrigerant liquid such as chlorofluorocarbon is used, there is a problem that an environmental load increases.
  • the present invention relates to a cooling device, an electronic device having a cooling device, and a method for cooling a heating element capable of efficiently and stably cooling a heating element having a high calorific value such as a semiconductor element while minimizing environmental burden.
  • the issue is to provide.
  • the first cooling section that cools the joint portion of the heat generating body including the joint section with the substrate with the first coolant liquid having insulation properties is different from the joint section of the heat generating body.
  • a cooling device having a second cooling section that cools the portion with a second refrigerant liquid.
  • a semiconductor device having a junction with a substrate, a first cooling unit that cools the junction of the semiconductor device with a first coolant liquid having insulation, and the semiconductor
  • An electronic apparatus includes a second cooling unit that cools a portion of the apparatus that is different from the bonding unit with a second refrigerant liquid.
  • the joining portion of the heating element including the joining portion with the substrate is cooled with the first coolant liquid having insulation, and a portion different from the joining portion of the heating element is provided.
  • a method for cooling a heating element characterized by cooling with a second refrigerant liquid.
  • FIG. 1 is a schematic diagram of an electronic device having a cooling device of Example 1.
  • FIG. It is the schematic plan view and side view of a board
  • FIG. It is the schematic which shows the structure of the cooling device in the case of cooling the board
  • FIG. It is the schematic of the experimental model used in order to measure the cooling effect of the cooling device of Example 1.
  • FIG. It is a graph which shows the cooling effect of the cooling device of Example 1 compared with the conventional jet cooling system. It is a table
  • FIG. 6 is a schematic diagram of a semiconductor device using a cooling device of Example 2.
  • FIG. It is the schematic of the experimental model used in order to measure the cooling effect of the cooling device of Example 2.
  • FIG. It is a graph which shows the cooling effect of the cooling device of Example 2 in comparison with the conventional jet cooling method. It is a table
  • the same reference numerals are used for components having the same function, and repeated description is omitted.
  • the cooling device of the present invention is suitable for cooling an arbitrary heating element such as an electronic module, and in particular, an external device. Suitable for cooling a heating element having an electrical connection to
  • the insulating refrigerant liquid and the aqueous refrigerant liquid are used in two layers separated, and the electrical junction having a large calorific value is directly cooled by the insulating refrigerant liquid and other than the electrical junction.
  • the heating element portion is cooled with an aqueous refrigerant liquid.
  • the cooling device is applied to a horizontally arranged semiconductor device
  • the vertical arrangement refers to an arrangement in which semiconductor devices and substrates are placed along the direction of gravity.
  • semiconductor elements semiconductor elements (chips), semiconductor packages, semiconductor modules and the like to be cooled are collectively referred to as “semiconductor devices”, and a circuit board, a relay board, and a system board on which these semiconductor devices are mounted. May be collectively referred to as “substrate”.
  • FIG. 2 is a schematic diagram illustrating a configuration example of the electronic device 10 including the cooling device according to the first embodiment.
  • the horizontal semiconductor package 20 in which the substrate 30 is disposed horizontally (that is, in a direction orthogonal to the direction of gravity) is cooled.
  • the semiconductor package 20 is, for example, one in which a semiconductor element 21 is electrically connected to a circuit board or a relay board 22 by solder bumps 23 and is entirely sealed as one package.
  • the semiconductor package 20 has a joint 24 for electrical connection with the outside, and is electrically connected to a substrate 30 such as a printed wiring board via the joint 24.
  • the heat generated in the semiconductor element 21 is conducted to the circuit board (or relay board) 22 through the solder bumps 23 and the like, and is further transferred to the board 30 through the joints 24 and the like.
  • the joint 24 is a part that generates a higher amount of heat than other parts and requires efficient cooling. However, since the joint portion 24 is a portion that is responsible for electrical connection with the substrate, it is not preferable to cool the joint portion 24 with an aqueous refrigerant liquid.
  • the insulating refrigerant liquid 14 and the aqueous refrigerant liquid 13 are separated into two layers in the casing 11, and the insulating cooling liquid 14 is used for cooling the surface including the joint portion 24 of the semiconductor package 20, and the other portions.
  • the aqueous refrigerant liquid 13 is used for cooling.
  • the insulating refrigerant liquid 14 is arranged so that the semiconductor package 20 and the substrate 30 are disposed inside the airtight casing 11, and the joint 24 and the package side surface of the semiconductor package 20 are immersed in the insulating refrigerant liquid 14. Is enclosed in the casing 11.
  • the casing 11 can be made of metal, resin, ceramics, glass, or the like. In the embodiment, a metal having high thermal conductivity such as aluminum is used.
  • the insulating refrigerant liquid 14 is a fluid that is chemically stable, does not corrode, and has electrical insulation.
  • Refrigerant liquids that satisfy this condition include, for example, fluorinated inert liquids (FC-72, etc.), fluorocarbon refrigerants, alternative CFCs (HFC-365mfc, HFE-7000, etc.), halogenated hydrocarbon refrigerants (pentane, etc.) ),
  • a refrigerant liquid mainly composed of insulating oil such as silicone oil can be used.
  • the aqueous refrigerant liquid 13 is supplied to a portion different from the joint portion 24 such as the back surface 26 of the semiconductor package 20.
  • the aqueous refrigerant liquid 13 is, for example, water, pure water or the like, and is sprayed from the nozzle 15 located above the semiconductor package 20 to the back surface 26 of the semiconductor package 20.
  • the specific gravity of the insulating refrigerant liquid 14 is larger than the specific gravity of the aqueous refrigerant liquid 13 (the specific gravity of the insulating refrigerant liquid 14 is 1.68 when FC-72, which is a fluorine-based inert liquid, is used).
  • FC-72 which is a fluorine-based inert liquid
  • the aqueous refrigerant liquid 13 ejected from the nozzle 15 contacts the back surface 26 of the semiconductor package 20 and spreads to the peripheral region of the semiconductor package 20, takes heat of the semiconductor package 20, and moves to the inner wall of the casing 11 on the low temperature side. Spread.
  • the insulating refrigerant liquid 14 having a large specific gravity for immersing the side surface of the semiconductor package 20 and the bonding portion 24 exists below, the aqueous refrigerant liquid 13 is prevented from being mixed into the bonding portion 24.
  • the aqueous refrigerant liquid 13 whose temperature has been increased by removing heat from the back surface 26 of the semiconductor package 20 is discharged to the outside of the casing 11 by the pump 18a, and heat exchange is performed by external cooling means, for example, a radiator 16 and a fan 17. Is done.
  • the low-temperature aqueous refrigerant liquid 13 is supplied to the nozzle 15 by the pump 18b.
  • the pump 18a, 18b, the external cooling means 16, 17, the nozzle 15 and the pipe 19 connecting them constitute a circulation system of the aqueous refrigerant liquid 13. Thereby, the aqueous refrigerant liquid 13 taken out from the casing 11 can be circulated and supplied to a portion different from the joint portion 24.
  • the insulating refrigerant liquid 14 is vaporized by the heat transmitted to the joint portion 24 of the semiconductor package 20 and becomes vapor.
  • the vapor of the insulating refrigerant liquid 14 dissolves in the aqueous refrigerant liquid 13, but when the temperature of the aqueous refrigerant liquid 13 is lower than the boiling point of the insulating refrigerant liquid 14, the vapor of the insulating refrigerant liquid 14 enters the aqueous refrigerant liquid 13. It contacts and aggregates to form a liquid phase and naturally circulate into the insulating refrigerant liquid 14.
  • FC-72 which is a fluorine-based inert liquid
  • the insulating refrigerant liquid 14 can be naturally circulated in the casing inside 11. Volatilization of the low boiling point fluorine-based liquid 14 is suppressed by the shield of the aqueous refrigerant liquid 13.
  • a second circulation system that mechanically circulates the insulating refrigerant liquid 14 may be provided in addition to the circulation system for the aqueous refrigerant liquid 13.
  • FIG. 2 shows an example in which a single semiconductor package 20 is cooled for simplification.
  • the cooling device described above includes a multi-CPU in which a plurality of semiconductor packages 20 and electronic modules are mounted on a system boat 30. It can also be applied to cooling.
  • FIG. 3 is a top view of the substrate 30 on which the multi-CPU is mounted and a cross-sectional view taken along the line AA ′.
  • a plurality of CPUs (semiconductor packages) 20 a, 20 b, 20 c, and 20 d are arranged together with other modules 32.
  • the other modules are, for example, a memory module, a switch, a power module, etc., but are represented by the memory module 32.
  • heat is generated from each of the semiconductor packages 20a to 20d and the memory module 32. Therefore, when cooling the multi CPU in a horizontal arrangement, it is desirable to supply the aqueous refrigerant liquid 13 by arranging the nozzle 15 for each of the semiconductor packages 20a and 20b and the memory module 32.
  • FIG. 4 is a schematic diagram showing a configuration of a semiconductor device 40 with a cooling device for cooling the multi CPU.
  • the substrate 30 on which the semiconductor packages 20a and 20b and the memory module 32 are mounted is disposed in a hermetically sealed casing 11.
  • the insulating refrigerant liquid 14 that immerses the side surfaces of the semiconductor packages 20 a and 20 b and the joint portion 24 and the memory module 32 is enclosed.
  • the nozzles 15a, 15b, 15c are arranged above the semiconductor packages 20a, 20b and the memory module 32, and the aqueous refrigerant liquid 13 is directed toward the back surfaces 26a, 26b, 36 of the corresponding semiconductor devices (modules) 20a, 20b, 32. Be injected.
  • the joint portions 24 of the semiconductor packages 20a and 20b that generate a large amount of heat and the joint portion (not shown) to the substrate 30 of the memory module 32 are immersed in the insulating coolant 14 and directly cooled.
  • the aqueous refrigerant liquid 13 is circulated through a pipe 19 connecting the pumps 18a and 18b and the cooling means 16 and 17, and the aqueous refrigerant liquid 13 having a low temperature is supplied to the nozzles 15a to 15c.
  • the same size semiconductor packages 20a to 20d are arranged on the substrate 30.
  • cooling can be performed in the same manner.
  • a configuration may be adopted in which one nozzle 15 is provided for a plurality of semiconductor packages 20 by controlling the jetting direction of the nozzles 15 shown in FIG.
  • the insulating refrigerant liquid 14 and the aqueous refrigerant liquid 13 are separated into two layers by using the difference in specific gravity, and the junction 24 of the semiconductor package 20 is immersed and cooled by the insulating refrigerant liquid 14.
  • the aqueous refrigerant liquid 13 performs jet cooling on a portion different from the joint portion 24, such as the package back surface (surface opposite to the joint portion) 26. Since the semiconductor package 20 is cooled from the entire periphery with the main cooling means being water-cooled while ensuring the insulation with respect to the joint portion 24 responsible for electrical connection, the environmental load is minimized, and the semiconductor element 21 and the semiconductor package 20 Can be efficiently and stably cooled.
  • Example 1 since the whole semiconductor package 20 is immersed, it does not touch external air. Therefore, there is no risk of condensation and migration of the joint can be prevented.
  • FIG. 5 is a schematic diagram of an experimental model used to measure the effect of Example 1.
  • a CPU (CORE 2 QUAD 3 GHz) 20a manufactured by INTEL and peripheral parts 32 were used.
  • FC-72 which is a fluorine-based inert liquid, was used as the insulating refrigerant liquid 14 and water was used as the aqueous refrigerant liquid 13 to cool by two-layer separation.
  • the joint portion 24 of the CPU 20a is immersed in the insulating refrigerant liquid 14 having a high specific gravity.
  • the aqueous refrigerant liquid 13 having a lower specific gravity was circulated by the pump 18 at a flow rate of 3 liters / minute, heat was exchanged by the radiator 16 at a heat release amount of 80 W ⁇ h, and then supplied to the nozzle 15.
  • the temperature of the CPU 20 was measured when the CPU usage rate was 100%.
  • the measured temperature of the CPU 20 was the monitoring temperature inside the CPU.
  • the same CPU 20 and peripheral part 32 were used, and the CPU temperature when the CPU usage rate was 100% was measured in the same manner by the jet cooling method using only the aqueous refrigerant liquid 13 as shown in FIG. 1A.
  • FIG. 6A is a graph showing actual measurement results
  • FIG. 6B is a table comparing the CPU temperature and calorific value conversion of the experimental model of Example 1 and the conventional model by averaging the actual measurement results of FIG. 6A.
  • the CPU core temperature exceeds 60 ° C. several minutes after the CPU usage rate reaches 100%, and the average CPU temperature under cooling is 61 ° C.
  • the average CPU temperature when the CPU usage rate is 100% is 53 ° C.
  • the conventional model is 180 W
  • the experimental model of Example 1 is 140 W.
  • Example 1 With the configuration of Example 1, it is possible to achieve a 40 W reduction in terms of calorific value and an 8 ° C. reduction in average CPU temperature.
  • a slight amplitude is seen in the CPU core temperature. This is due to the influence of the operation of the CPU, and the stability of the cooling function is ensured.
  • the cooling function can be further improved by controlling the radiator heat radiation amount, the pump flow rate, the nozzle arrangement, the jet direction, and the like.
  • FIG. 7 is a schematic diagram illustrating a configuration example of an electronic device 70 including the cooling device according to the second embodiment.
  • the vertical semiconductor package 20 in which the substrate 30 is arranged vertically that is, along the direction of gravity
  • the configuration of the semiconductor package 20 and the bonding configuration to the substrate 30 are the same as those in the first embodiment, and a description thereof will be omitted.
  • the joint portion 24 of the semiconductor package 20 is directly cooled by the insulating refrigerant liquid 14, and the back surface (surface opposite to the joint portion 24) 26 of the semiconductor package, etc.
  • a portion different from the joint portion 24 is cooled by the aqueous refrigerant liquid 13.
  • the first nozzle 75 is arranged above the substrate 30 on which the semiconductor package 20 is mounted, and the insulating refrigerant liquid 14 is supplied from the upper end side of the substrate 30. Supply toward the joint 24.
  • the second nozzle 15 is disposed on the side of the vertically standing semiconductor package 20 to supply the aqueous coolant 13 toward the back surface 26 of the semiconductor package.
  • Insulating refrigerant 14 is a fluid that is chemically stable, non-corrosive, and has electrical insulation, as in Example 1.
  • insulation such as fluorinated inert liquids (FC-72, etc.), fluorocarbon refrigerants, alternative CFCs (HFC-365mfc, HFE-7000, etc.), halogenated hydrocarbon refrigerants (pentane, etc.), silicone oil, etc.
  • a refrigerant liquid mainly composed of oil can be used.
  • the second nozzle 15 injects the aqueous refrigerant liquid 13 to a portion different from the bonding portion 24 such as a surface (back surface) 26 opposite to the bonding portion 24 of the semiconductor package 20.
  • a portion different from the bonding portion 24 such as a surface (back surface) 26 opposite to the bonding portion 24 of the semiconductor package 20.
  • the insulating refrigerant liquid 14 and the aqueous refrigerant liquid 13 whose temperature has increased due to heat exchange with the semiconductor package 20 are accumulated at the bottom of the casing 11.
  • the fluorine-based inert liquid FC-72 is used as the insulating refrigerant liquid 14
  • the specific gravity is larger than the specific gravity of the aqueous refrigerant liquid 13.
  • the insulating refrigerant liquid 14 and the aqueous refrigerant liquid 13 flow down from above to the bottom of the casing 11, they are partially mixed at the bottom of the casing 11.
  • the insulating refrigerant liquid 14 and the aqueous refrigerant liquid 13 that have reached a high temperature are discharged from the bottom of the casing 11 through the first pipe 19 a and are heat-exchanged by the radiator 16 and the fan 17.
  • the refrigerant liquid that has undergone heat exchange and has reached a low temperature is sent to the refrigerant liquid separation tank 79.
  • the insulating refrigerant liquid 14 and the aqueous refrigerant liquid 13 are separated into two layers by the difference in specific gravity.
  • the insulating refrigerant liquid 14 is supplied to the first nozzle 75 via the pump 78a and the second pipe 19b.
  • the aqueous refrigerant liquid 13 is supplied to the second nozzle 15 via the pump 78b and the third pipe 19c.
  • the two-layer separation of the refrigerant liquid can be utilized to circulate the aqueous refrigerant liquid 13 and the insulating refrigerant liquid 14 that have become low temperature to the corresponding nozzles 15 and 75, respectively.
  • the semiconductor package 20 can be cooled efficiently and stably even in the vertical arrangement.
  • the configuration of the second embodiment can also be applied when the multi-CPU board 30 of FIG. 3 is arranged vertically.
  • the nozzles 75 for forming the curtain flow 76 are preferably provided for each row of the semiconductor packages 20 arranged in the direction of gravity on the substrate 30.
  • the number of nozzles 75 can be set as appropriate in accordance with the size, shape, and configuration of the opening of the nozzle, the flow rate of the insulating refrigerant liquid 14 to be jetted, the size of the substrate 30, and the like.
  • FIG. 8 is a schematic diagram of an experimental model used to measure the effect of Example 2.
  • a CPU (CORE 2 QUAD 3 GHz) 20 and peripheral parts 32 manufactured by INTEL were used as a cooling target.
  • FC-72 which is a fluorine-based inert liquid, was used as the insulating refrigerant liquid 14
  • water was used as the aqueous refrigerant liquid 13
  • cooling was performed by two-layer separation in the direction of gravity.
  • the insulating refrigerant liquid 14 and the aqueous refrigerant liquid 13 were discharged from the bottom of the casing 11, and heat was exchanged by the radiator 16 at a heat release amount of 80 W ⁇ h, and then two layers were separated in the horizontal direction by the refrigerant liquid separation tank 79.
  • the insulating refrigerant liquid was supplied to the nozzle 715 by the pump 78a, and the aqueous refrigerant liquid was supplied to the nozzle 15 by the pump 78b.
  • the temperature of the CPU 20 was measured when the CPU usage rate was 100%.
  • the measured temperature of the CPU 20 was the monitoring temperature inside the CPU.
  • the same CPU 20 and peripheral part 32 were used, and the CPU temperature when the CPU usage rate was 100% was measured in the same manner by the jet cooling method using only the aqueous refrigerant liquid 13 as shown in FIG. 1A.
  • FIG. 9A is a graph showing actual measurement results
  • FIG. 9B is a table comparing the CPU temperature and calorific value conversion of the experimental model of Example 2 and the conventional model by averaging the actual measurement results of FIG. 9A.
  • the CPU core temperature exceeds 60 ° C. several minutes after the CPU usage rate reaches 100%, and the average CPU temperature under cooling is 61 ° C.
  • the average CPU temperature when the CPU usage rate is 100% is 49 ° C.
  • the conventional model is 180 W
  • the experimental model of Example 1 is 120 W.
  • a reduction of 60 W in terms of calorific value and a reduction of 12 ° C. in the average CPU temperature can be achieved.
  • the configuration of the second embodiment has higher cooling efficiency than that of the first embodiment and can realize stable cooling. This is because the insulating refrigerant liquid 14 is supplied as a curtain flow to the joint portion 24 (see FIG. 7) of the semiconductor package 20. High cooling efficiency can be obtained by supplying and cooling the insulating refrigerant liquid 14 that is always kept at a low temperature to the joint portion 24 that generates a large amount of heat.
  • High-efficiency cooling Direct cooling of the entire circumference of the semiconductor device is realized by water cooling by using a jet cooling with an aqueous coolant and a cooling of the joint with an insulating coolant.
  • Large area cooling The entire system board including the memory, switch, power module, etc. can be integrally cooled.
  • Low environmental load Highly efficient cooling can be realized while reducing the load on the environment by minimizing the amount of fluorine-based refrigerant and water cooling the main cooling means.
  • High reliability Since the substrate does not come into contact with outside air, it is possible to prevent condensation due to a temperature difference and to prevent migration.
  • Cost reduction Since it is possible to cool together, it is not necessary to provide a thermal module for each CPU. In addition, it is possible to reduce the number of parts and power consumption, such as eliminating the need for a heater for preventing condensation.
  • ⁇ It can be used for cooling of heating elements and electronic equipment with cooling equipment. It can also be applied to a rack in which a large number of system boards are arranged vertically and a stack structure in which multiple system boards are stacked.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention porte sur un appareil de refroidissement, qui comprend : une première section de refroidissement, qui refroidit, un premier liquide réfrigérant ayant des caractéristiques isolantes, une partie de liaison d'un corps de génération de chaleur qui est disposé avec la partie de liaison effectuant une liaison avec un substrat ; et une seconde section de refroidissement, qui refroidit, avec un second liquide réfrigérant, une partie corps de génération de chaleur différente de la partie de liaison.
PCT/JP2010/064197 2010-08-23 2010-08-23 Appareil de refroidissement, appareil électronique comportant un appareil de refroidissement, et procédé pour refroidir un corps générant de la chaleur WO2012025981A1 (fr)

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JP2012530437A JP5590128B2 (ja) 2010-08-23 2010-08-23 冷却機器、冷却機器を有する電子機器及び発熱体の冷却方法
PCT/JP2010/064197 WO2012025981A1 (fr) 2010-08-23 2010-08-23 Appareil de refroidissement, appareil électronique comportant un appareil de refroidissement, et procédé pour refroidir un corps générant de la chaleur
US13/751,564 US20130139998A1 (en) 2010-08-23 2013-01-28 Cooling system, electronic equipment, and method for cooling heating element

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