WO2012024578A8 - Portable electronic device - Google Patents

Portable electronic device Download PDF

Info

Publication number
WO2012024578A8
WO2012024578A8 PCT/US2011/048404 US2011048404W WO2012024578A8 WO 2012024578 A8 WO2012024578 A8 WO 2012024578A8 US 2011048404 W US2011048404 W US 2011048404W WO 2012024578 A8 WO2012024578 A8 WO 2012024578A8
Authority
WO
Grant status
Application
Patent type
Prior art keywords
antenna
frame
electrically
conductive
electrically non
Prior art date
Application number
PCT/US2011/048404
Other languages
French (fr)
Other versions
WO2012024578A2 (en )
WO2012024578A3 (en )
Inventor
Phillip M. Hobson
Eric S. Jol
Stephen Brian Lynch
Adam Mittleman
Fletcher R. Rothkopf
Anna-Katrina Shedletsky
Original Assignee
Apple Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers; Analogous equipment at exchanges
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1626Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1688Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being integrated loudspeakers
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1698Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387Flexible insulating substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526Electromagnetic shields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • H05K1/112Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114Pad being close to via, but not surrounding the via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10General applications
    • H04R2499/11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00Circuits for transducers, loudspeakers or microphones
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0215Grounding of printed circuits by connection to external grounding means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/042Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10159Memory
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10371Shields or metal cases

Abstract

A modular material antenna assembly is provided that includes an antenna block having a portion with a shape that interlocks with a corresponding portion of an electrically non-conductive frame and secures the antenna block to the electrically non-conductive frame. The electrically non-conductive frame is attached to an interior of an electrically conductive housing so that the electrically non-conductive frame and the electrically conductive housing form an integrated structure. An antenna flex is then mechanically secured to the antenna block. The antenna flex may also be electrically connected to a circuit board. The frame is designed to support a cover glass for the portable electronic device and may be affixed to a housing. The dielectric constant of the antenna block is substantially less than the dielectric constant of the frame.
PCT/US2011/048404 2010-08-19 2011-08-19 Portable electronic device WO2012024578A8 (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
US12/859,711 2010-08-19
US12/859,702 2010-08-19
US12859711 US8515113B2 (en) 2010-08-19 2010-08-19 Composite microphone boot to optimize sealing and mechanical properties
US12859701 US8427379B2 (en) 2010-08-19 2010-08-19 Modular material antenna assembly
US12/859,701 2010-08-19
US12859712 US8477492B2 (en) 2010-08-19 2010-08-19 Formed PCB
US12859694 US8634204B2 (en) 2010-08-19 2010-08-19 Compact folded configuration for integrated circuit packaging
US12/859,712 2010-08-19
US12/859,694 2010-08-19
US12859702 US8391010B2 (en) 2010-08-19 2010-08-19 Internal frame optimized for stiffness and heat transfer
US37786610 true 2010-08-27 2010-08-27
US61/377,866 2010-08-27
US12950793 US9602914B2 (en) 2010-08-27 2010-11-19 Porting audio using a connector in a small form factor electronic device
US12/950,793 2010-11-19

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN 201180047961 CN103221896B (en) 2010-08-19 2011-08-19 Portable electronic devices
KR20137008424A KR101417695B1 (en) 2010-08-19 2011-08-19 Portable electronic device
EP20110749066 EP2606407A2 (en) 2010-08-19 2011-08-19 Portable electronic device
KR20137006996A KR101494555B1 (en) 2010-08-19 2011-08-19 Portable electronic device

Publications (3)

Publication Number Publication Date
WO2012024578A2 true WO2012024578A2 (en) 2012-02-23
WO2012024578A3 true WO2012024578A3 (en) 2012-04-12
WO2012024578A8 true true WO2012024578A8 (en) 2012-11-15

Family

ID=48430393

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/048404 WO2012024578A8 (en) 2010-08-19 2011-08-19 Portable electronic device

Country Status (4)

Country Link
EP (1) EP2606407A2 (en)
KR (2) KR101417695B1 (en)
CN (1) CN103221896B (en)
WO (1) WO2012024578A8 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8391010B2 (en) 2010-08-19 2013-03-05 Apple Inc. Internal frame optimized for stiffness and heat transfer
US9118110B2 (en) 2012-06-22 2015-08-25 Acer Incorporated Communication device and antenna element therein
CN103515703B (en) * 2012-06-28 2016-08-03 宏碁股份有限公司 Communication means
FR2993997B1 (en) * 2012-07-26 2014-08-22 Acep France A photographic lighting system for touchpad
US9332329B2 (en) 2012-09-28 2016-05-03 Htc Corporation Electronic apparatus
KR20150026082A (en) 2013-08-30 2015-03-11 삼성전자주식회사 Flexible electronic device
KR20150072986A (en) 2013-12-20 2015-06-30 엘지디스플레이 주식회사 Transparent display apparatus and transparent organic light emitting display appratus
US9253555B2 (en) 2014-02-18 2016-02-02 Htc Corporation Portable electronic apparatus
CN105196671B (en) * 2014-06-16 2018-08-24 深圳市西盟特电子有限公司 Tablet Case laminate molds
CN104377440A (en) * 2014-11-01 2015-02-25 昆山联滔电子有限公司 Novel antenna
US9860433B2 (en) * 2014-12-26 2018-01-02 Pegatron Corporation Electronic device and image building module thereof
CN105847481A (en) * 2016-05-27 2016-08-10 深圳天珑无线科技有限公司 Mobile terminal grounding structure and mobile terminal
US9900999B1 (en) 2017-02-03 2018-02-20 Google Inc. Circuit board architecture for an electronic device
KR101886693B1 (en) * 2017-02-07 2018-08-08 유호연 Portable heat remove device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4074419A (en) * 1976-03-16 1978-02-21 Texas Instruments Incorporated Printed wiring board with angled portion and its method of manufacture
FR2543780B1 (en) * 1983-03-31 1990-02-23 Rogers Corp flexible electric circuit retaining its shape and method for manufacturing this circuit
DE4131935A1 (en) * 1991-09-25 1993-04-08 Degussa Rigid, moved in partial areas flexible printed circuits and for the preparation thereof
US5784256A (en) * 1994-09-14 1998-07-21 Kabushiki Kaisha Toshiba Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board
US6208521B1 (en) * 1997-05-19 2001-03-27 Nitto Denko Corporation Film carrier and laminate type mounting structure using same
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6452811B1 (en) * 2000-09-01 2002-09-17 Motorola, Inc. Augmented circuitry integration for a printed circuit board
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
US6758303B2 (en) 2002-10-31 2004-07-06 Motorola, Inc. Electronic device having a multi-mode acoustic system and method for radiating sound waves
DE10252308B3 (en) * 2002-11-11 2004-04-29 Schweizer Electronic Ag Semi-finished product for making circuit board, has battery or accumulator element with temperature- and pressure-resistance matching manufacturing parameters fixed in opening in no-conductor region
US7375922B2 (en) 2003-10-28 2008-05-20 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Mounting apparatus for data storage device
JP2006100302A (en) * 2004-09-28 2006-04-13 Sharp Corp Radio frequency module and manufacturing method therefor
US7309914B2 (en) 2005-01-20 2007-12-18 Staktek Group L.P. Inverted CSP stacking system and method
JP2006279260A (en) * 2005-03-28 2006-10-12 Nec Saitama Ltd Portable terminal
KR101132447B1 (en) * 2006-06-23 2012-03-30 엘지전자 주식회사 Mobile communication terminal
US20080037769A1 (en) * 2006-07-24 2008-02-14 Motorola, Inc. User interface substrate for handset device
US7480145B2 (en) * 2006-11-01 2009-01-20 Apple Inc. Thin, passive cooling system
US7839656B2 (en) * 2007-06-15 2010-11-23 Sony Ericsson Mobile Communications Ab Shielded circuit assembly and method
JP2009021754A (en) * 2007-07-11 2009-01-29 Panasonic Corp Antenna
US7876273B2 (en) * 2007-12-21 2011-01-25 Nokia Corporation Apparatus and method
US8031864B2 (en) * 2008-01-18 2011-10-04 Apple Inc. Dual-purpose hardware aperture
DE102008008897B3 (en) * 2008-02-13 2009-07-30 Siemens Medical Instruments Pte. Ltd. Circuit with integrated shield and hearing aid
US8229153B2 (en) * 2008-04-01 2012-07-24 Apple Inc. Microphone packaging in a mobile communications device
EP2343872B1 (en) * 2010-01-08 2016-01-06 BlackBerry Limited Audio guiding channel to a microphone of a portable electronic device

Also Published As

Publication number Publication date Type
KR101417695B1 (en) 2014-07-08 grant
WO2012024578A2 (en) 2012-02-23 application
CN103221896A (en) 2013-07-24 application
EP2606407A2 (en) 2013-06-26 application
WO2012024578A3 (en) 2012-04-12 application
KR20130055661A (en) 2013-05-28 application
CN103221896B (en) 2017-06-09 grant
KR101494555B1 (en) 2015-02-17 grant
KR20130042050A (en) 2013-04-25 application

Similar Documents

Publication Publication Date Title
US8454372B2 (en) Electrical connector with power plug and power socket
US20120106103A1 (en) Radio frequency energy harvesting enclosure for radio frequency connected devices
US20150200448A1 (en) Mobile device and multi-band antenna structure therein
WO2008090734A1 (en) Semiconductor device for power
WO2012129426A3 (en) Integrated circuit with electromagnetic communication
US20140117928A1 (en) Wireless charging thin-film battery
US20100245265A1 (en) Wireless device
USD697511S1 (en) Display module for an electronic device
US20140292590A1 (en) Terminal including multiband antenna as conductive border
JP2007526985A (en) Electrical connection of the electronic module of the electronic devices to be mounted on the wrist
US20120178382A1 (en) Engagement features and adjustment structures for electronic devices with integral antennas
US20130335275A1 (en) Structures for Shielding and Mounting Components in Electronic Devices
US20150077047A1 (en) Rear case for wireless charging application
US20140286523A1 (en) Electronic device and conductive structure
US20130307736A1 (en) Antenna
US20120098709A1 (en) Antenna apparatus for portable terminal
US20140104116A1 (en) Coaxial cable designed antenna module for electronic device
US20140354218A1 (en) Magnetic mounting solution for electronic devices with integrated conductive charging of the device
US8890754B2 (en) Antenna apparatus integrating metal shell
US20120182190A1 (en) Portable wireless device
US20140009352A1 (en) Antenna assembly and wireless communication device employing same
US20140179242A1 (en) Watch and nfc antenna thereof
CN204216224U (en) A mobile terminal
US20140179224A1 (en) Watch having nfc antenna
US20070121307A1 (en) EMI/RFI shield for electronic device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11749066

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase in:

Ref country code: DE

ENP Entry into the national phase in:

Ref document number: 20137006996

Country of ref document: KR

Kind code of ref document: A

REEP

Ref document number: 2011749066

Country of ref document: EP