CN103221896A - Portable electronic device - Google Patents

Portable electronic device Download PDF

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Publication number
CN103221896A
CN103221896A CN2011800479612A CN201180047961A CN103221896A CN 103221896 A CN103221896 A CN 103221896A CN 2011800479612 A CN2011800479612 A CN 2011800479612A CN 201180047961 A CN201180047961 A CN 201180047961A CN 103221896 A CN103221896 A CN 103221896A
Authority
CN
China
Prior art keywords
connector
housing
pcb
chip
microphone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2011800479612A
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Chinese (zh)
Other versions
CN103221896B (en
Inventor
F·R·罗斯科普
P·M·霍布森
A·米特尔曼
A-K·施德莱特斯基
E·S·乔尔
S·B·林奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apple Inc
Original Assignee
Apple Computer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/859,701 external-priority patent/US8427379B2/en
Priority claimed from US12/859,712 external-priority patent/US8477492B2/en
Priority claimed from US12/859,694 external-priority patent/US8634204B2/en
Priority claimed from US12/859,711 external-priority patent/US8515113B2/en
Priority claimed from US12/859,702 external-priority patent/US8391010B2/en
Priority claimed from US12/950,793 external-priority patent/US9602914B2/en
Application filed by Apple Computer Inc filed Critical Apple Computer Inc
Publication of CN103221896A publication Critical patent/CN103221896A/en
Application granted granted Critical
Publication of CN103221896B publication Critical patent/CN103221896B/en
Active legal-status Critical Current
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1688—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being integrated loudspeakers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114—Pad being close to via, but not surrounding the via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Thermal Sciences (AREA)
  • Electric Clocks (AREA)

Abstract

A modular material antenna assembly is provided that includes an antenna block having a portion with a shape that interlocks with a corresponding portion of an electrically non-conductive frame and secures the antenna block to the electrically non-conductive frame. The electrically non-conductive frame is attached to an interior of an electrically conductive housing so that the electrically non-conductive frame and the electrically conductive housing form an integrated structure. An antenna flex is then mechanically secured to the antenna block. The antenna flex may also be electrically connected to a circuit board. The frame is designed to support a cover glass for the portable electronic device and may be affixed to a housing. The dielectric constant of the antenna block is substantially less than the dielectric constant of the frame.

Description

Portable electric appts
Technical field
The present invention relates to consumer products, relate in particular to portable electric appts.
Background technology
Portable electric appts can be taked various ways, such as, for example, iPad TMSeries dull and stereotyped computing equipment, such as iPhone TMPortable communication device or such as iPod TMPortable electronic device, its each all is by Cupertino, the Apple Inc. of CA. makes.These equipment have wireless communication mechanism usually, so that the radio communication between portable set and base station, cellular tower, desk-top computer etc. is provided.Common wireless communication mechanism comprises IEEE802.11a, and b, g and n(are commonly referred to " WiFi "), worldwide interoperability for microwave inserts (WiMAX) and such as the cellular communication mechanisms of global system for mobile communications (GSM) and CDMA (CDMA).Need be used for antenna is integrated in the portable electric appts so that can carry out the improvement technology of radio communication.
Summary of the invention
The compact-folded configuration of integrated circuit encapsulation
Say that broadly embodiment disclosed herein has described the memory chip package that is very suitable for using and designed in the consumer-elcetronics devices such as kneetop computer, mobile phone, net book computer, portable electronic device and panel computer.The package design of the memory chip that uses in having the lightweight consumer-elcetronics devices of thin compact shell more specifically, has been described.Use the package design of memory chip in associated description, can be called as " collapsible memory devices ".This collapsible memory devices can solve and use the relevant assembling of a plurality of chips, electrical connection and RF shielding problem in electronic equipment.The following method and apparatus that uses description to realize these Chip Packaging.
In an embodiment of Chip Packaging design described herein, a plurality of chips can be coupled to flexible circuit connector to form memory devices.Flexible circuit connector can comprise data and the power trace that is used by chip.Two chips located adjacent one another on the flexible circuit connector can be separated by the part with certain-length of this flexible circuit connector.When memory devices was installed on electronic equipment, flexible circuit connector can be crooked or reverse in the described part of each chip chamber, to allow chip directed change relative to each other.
By means of the bending of chip chamber flexible circuit connector with reverse, memory devices can be configured to a plurality of orientations in installation process.For example, in a step of installation process, be connected to flexible circuit connector first chip can with the orientation on the second chip side offside ground.This orientation can used second chip attach to such as the assembly of printed circuit board (PCB) (PCB) time.Subsequently, during second step, the part of flexible circuit connector between first chip and second chip can fold, thereby allows the directed change between first chip and second chip.For example, after folding, first chip and second chip can and combine with the stack arrangement alignment.Generally speaking, when memory devices comprises two above chips, can adjust each chip orientation relative to each other in crooked or folding this flexible circuit connector in difference location by a plurality of steps, till chip is assembled in final package arrangements.
In specific embodiment, flexible circuit connector can comprise the metal connector liner, is used for flexible circuit connector is connected to metal framework or other metal parts and ground connection thus.For the ease of ground connection, flexible circuit connector can be folding in the zone of contiguous connector gasket, allows connector gasket to be bonded to a particular surface thus, such as the surface of metal framework.When by appropriate ground connection, flexible circuit connector can be used to form the part of faraday cup.
In one embodiment, faraday cup can be used to stop radio frequency (RF) signal of chip generation to arrive the antenna that is installed in the portable computing device.Antenna can be the parts of the wave point that uses on equipment.The part that the metallic shield of using flexible circuit connector rather than separating forms faraday cup can realize more frivolous design, because flexible circuit connector is thinner and lighter than the typical metal parts that are used for the RF shielding.For example, typically use stainless steel to be formed for the faraday cup of RF shielding.The thickness of flexible circuit connector can be the parts of stainless steel that uses in this way thickness about 1/6.
In a specific embodiment, the method that the memory chip that is attached to flexible circuit connector is installed has been described in portable computing device.This method can comprise: 1) first chip is attached to second chip via flexible circuit connector; 2) first chip attach to this first chip that makes of printed circuit board (PCB) can be positioned in the metal framework position of this metal framework to small part around this first chip thus, wherein this metal framework couples mutually with this printed circuit board (PCB); 3) folded flexible circuitry connector and second chip is alignd with first chip; 4) second chip is attached to first chip via bonding agent, wherein said first chip and described second chip are with stack arrangement alignment and combination; 5) part of flexible circuit connector is connected to a side of metal framework or many sides and ground connection thus, thereby avoid the RF signal from first chip and second chip, to spill (as mentioned above, the RF signal of leakage can influence the antenna for portable computing device work); And 6) assembly that will comprise first chip, second chip, metal framework and printed circuit board (PCB) is installed in the portable computing device.
Be used to optimize the inner frame of hardness and heat transmission
Say that broadly embodiment disclosed herein has described the structure member that is highly suitable for consumer-elcetronics devices (such as kneetop computer, mobile phone, net book computer, portable electronic device and panel computer).Especially, this paper has described such structure member, and it handles intensity and the heat problem relevant with the design of the lightweight consumer-elcetronics devices with thin compact shell.This paper has also described the method that is used to form these structure members.
In one embodiment, consumer-elcetronics devices can be the slim type portable electronic equipment that has display.The internal placement of this slim type portable electron device part can be counted as a plurality of layers that pile up.The layer that piles up can be relevant with the certain height with respect to device thickness.The various device parts such as, but not limited to display circuit, CPU, loudspeaker, storer, radio communication circuit and battery, can be arranged and be distributed on the layer that piles up.
One deck in the layer that piles up can be an inner frame.Inner frame can be couple to the external shell of slim type portable electronic equipment.Inner frame can be configured to provide hot distribution capability for the parts of the heating that is arranged in the layer adjacent with inner frame, such as heat radiation.Further, inner frame can be used to increase the one-piece construction hardness of equipment.In addition, inner frame can be used as the attachment point of employed miscellaneous equipment parts (such as display) in the equipment.
In one embodiment, inner frame can be the interior metal framework that is formed by the multilayer different metal.For example, the interior metal framework can comprise the middle layer between two exterior layers, and described middle layer is formed by first metal, and described two exterior layers are formed by second metal.First metal and second metal can be selected according to their intensity and/or thermal conduction characteristic respectively.In addition, the thickness of each layer can be different, to strengthen its intensity or hot feature.In one embodiment, the different metal layer of interior metal framework can utilize coating to handle and combination.
In a particular embodiment, first metal that is used for the middle layer can mainly be selected according to its thermal conduction characteristic, make the middle layer can serve as heating radiator, and second metal that is used for two exterior layers can mainly be selected as promoting the intensity of interior metal framework, thereby improves the integral hardness of equipment.Generally speaking, first metal and second metal can be selected as improving one or more in thermal conduction characteristic, strength characteristics (for example, hardness), environmental characteristics (for example, corrosion resistivity) and the aesthetic (for example, the outward appearance of equipment).For instance, the middle layer can be formed by copper, and this selects according to its thermal characteristics, and two exterior layers can be formed by stainless steel, and this selects according to its strength characteristics.In another embodiment, second metal that is used for two exterior layers can be selected as making that each exterior layer can both serve as heating radiator, and first metal that is used for the middle layer then can be selected according to its strength characteristics.
When first master metal in the middle layer that is used for the interior metal framework will be selected so that the middle layer can serve as heating radiator the time, can be provided with one or more holes in the exterior layer of interior metal framework according to its thermal characteristics.Each hole can be positioned as the heat generating components in the nearby device.Can provide heat bridge, so that the surface heat that will be associated with this heat generating components via the hole of contiguous heat generating components in the exterior layer is connected to the middle layer of interior metal framework.In a particular embodiment, heat bridge can be formed by welding material or bonding the bringing of heat conduction.
Synthetic microphone storehouse is to optimize sealing and mechanical attributes
Say that broadly embodiment disclosed herein has described the microphone assembly that is very suitable for using and designed in the consumer-elcetronics devices such as kneetop computer, mobile phone, net book computer, portable electronic device and panel computer.Microphone assembly can be installed in the consumer-elcetronics devices, and is utilized by the application that relates to SoundRec.More specifically, microphone assembly can be used to wireless communications application, such as digital telephone.
Microphone assembly can comprise microphone and microphone storehouse (the microphone boot) that is coupled to circuit board.In the time of in microphone assembly is installed in equipment, the microphone storehouse can provide pipeline for sound between the hole in microphone and the apparatus casing.Typically, the microphone storehouse comprises and being used for the hollow shell of sound conduction to microphone.So, can enter hole in the housing from the sound wave of device external, by the microphone storehouse and receiving by microphone subsequently.
In case sound wave enters by the hole in the external shell, for the purpose expectation minimization of tonequality by the mixing of (such as, the sound that generates by the internal loudspeaker in the equipment) of any sound of enclosure interior and the sound that has entered the microphone storehouse.Penetrate into the microphone storehouse for fear of sound, the two ends foundation that is desirably in the microphone storehouse can be kept the high-seal integrality of (and not broken) during operation of equipment.Typically, an end in microphone storehouse can be sealed to the surface of enclosure interior, and the other end in microphone storehouse then can be sealed to microphone.Following will the description and the relevant method and apparatus of microphone storehouse design with good seal performance.
Synthetic microphone storehouse can comprise the compressible centering portions that places between two end caps, and wherein two end caps are by making than the so not compressible material of centering portions.For example, end cap can be made by hard plastic material, and centering portions then can be made by softer plastic material (such as silastomer).Other lifts an example, and end cap can be made by softer plastic material, and centering portions then can be made by harder plastic material.Generally speaking, end cap and centering portions can be made by the material of different hardness respectively.In one embodiment, can select the relative hardness of every kind of material to improve the sealing integrity and/or the shock absorption properties in synthetic microphone storehouse.
Synthetic microphone storehouse comprises the hollow inside that can be formed by the dijection Shooting Technique.Can during whenever the penetrating of dijection Shooting Technique, use different materials respectively.For example, can during first emission, use harder plastic material, and during another emission, use softer plastic material.Can select the material that uses in the per injection, thereby during Shooting Technique, bond them together.
In another embodiment, the end cap in synthetic microphone storehouse and centering portions can be separated to form and be stacked on together subsequently.For example, end cap or centering portions can be separated molding or die-cut.End cap and centering portions can be stacked on together and be held in place, and need not each parts physical bond each other.For example, each parts can be by a certain mode by mechanical constraint, such as when being installed in parts in the equipment they being pressed together to be held in place.
Between installation period, contact adhesive (PSA) can be attached to each end in synthetic microphone storehouse.Subsequently, via PSA, an end that synthesizes the microphone storehouse can be bonded to the surface that is associated with microphone, and the opposite end be bonded to the inside surface of housing.Can apply force of compression to synthetic microphone storehouse.For example, the microphone assembly that comprises P.e.c., microphone and microphone storehouse can be fixed to housing so that force of compression is applied to the mode on the microphone storehouse.The major part of this force of compression can cause reducing of thickness thus by the centering portions carrying in synthetic microphone storehouse.The centering portions of compression can apply outward force to the end cap in synthetic microphone storehouse, enables thus and promotes between the housing on PSA and microphone storehouse one end and the excellent sealing between the microphone on PSA and the opposite end, microphone storehouse.This realization can cause 40dB or bigger isolates sound.
In a particular embodiment, the microphone storehouse can be formed hollow circular cylinder, though also can utilize other shapes when expectation.The microphone storehouse can comprise the centering portions that places between two end caps.In one embodiment, the size and dimension of each end cap can be about equally.In other embodiments, the size and dimension of each end cap can be different.For example, an end in microphone storehouse can be sealed to the crooked inner surface of housing, in the face of therefore the end cap in this inner microphone storehouse of housing can be shaped to comply with the shape of this inside surface, forms thus and keeps better sealing.
In one embodiment, a kind of method of making portable computing device has been described.This method can comprise that size, shape and the material of determining synthetic microphone storehouse are synthetic.Subsequently, can form this synthetic microphone storehouse.Should can use the dijection Shooting Technique to form in synthetic microphone storehouse.Next, the opposite end that should synthesize the microphone storehouse can be combined with the microphone of portable computing device and the inside surface of housing respectively.For example, can use PSA as bond.The microphone assembly that comprises synthetic microphone storehouse, microphone and printed circuit board (PCB) can be fixed to housing, and feasible synthetic microphone storehouse is held in place and keeps sealing.Subsequently, can finish the assembly of the portable computing device that comprises this synthetic microphone storehouse.
Modularization material antenna module
Say that broadly embodiment disclosed herein has described a kind of modularization material antenna module that comprises antenna block, described antenna block has a part, and this part has with the counterpart interlocking of non-conductive framework and antenna block is fixed to the shape of non-conductive framework.This non-conductive framework is attached to the inside of conductive shell, so that non-conductive framework and conductive shell form one-piece construction.Then, by antenna block mechanical support antenna flexible cable, and the antenna flexible cable is electrically connected to circuit board.Framework is designed to support the lid glass that is used for portable electric appts, and can be affixed on the housing.The specific inductive capacity of the permittivity ratio framework of antenna block is much smaller.In one embodiment, antenna block is made by cyclic olefin polymer (COP), and framework is made by glass filled plastics.The synthetic difference of specific inductive capacity combines with the difference of the interlocking portions of framework and antenna block and dielectric loss tangent and has improved antenna performance.
A kind of method of assembly portable formula electronic equipment is provided in another embodiment.In this embodiment, provide conductive shell.Then, non-conductive framework is adhered to the inside of conductive shell, to form one-piece construction.Non-conductive framework is made by the material with first specific inductive capacity.Then, the part interlocking corresponding to second shape of first shape of having by with the part with first shape of antenna block and framework is fixed on antenna block on the framework.Antenna block is made by the antenna block material with second specific inductive capacity, and second permittivity ratio, first specific inductive capacity is much smaller.Then, by antenna block supporting antenna flexible cable.
In another embodiment, a kind of computer-readable medium with computer code is provided, described computer code is used for non-conductive framework is appended to the inside of conductive shell, and to form one-piece construction, wherein non-conductive framework is made by the frame material with first specific inductive capacity.This can comprise and is used to control robotic arm non-conductive framework is adhered to the computer code of the inside of conductive shell.This computer-readable medium can also comprise and being used for by having corresponding to the part interlocking of second shape of first shape and antenna block is fixed to the computer code of framework the part with first shape of antenna block and framework.This can comprise and is used to control robotic arm to carry out the computer code of interlocking.This computer-readable medium can also comprise the computer code that is used for making by antenna block mechanical support antenna flexible cable.This can comprise and is used to control the computer code of automatic screwdriver the antenna flexible cable screwed in antenna block and to be screwed into the conducting bracket that is soldered to housing.
The PCB that forms
Say that broadly embodiment disclosed herein has described and be very suitable for the printed circuit board (PCB) (PCB) that uses in the consumer-elcetronics devices such as kneetop computer, mobile phone, net book computer, portable electronic device and panel computer.More specifically, the PCB design is described to solve the encapsulation problem when use has the lightweight consumer-elcetronics devices of slim compact case.Use description to design and form the method for PCB and the exemplary embodiment of PCB.
In one embodiment, consumer-elcetronics devices can be the slim type portable electronic equipment that has display.The internal placement of the parts of slim type portable electronic equipment in its shell can be counted as a plurality of layers that pile up, the part that can occupy described stack layer comprising the display and the battery of display driving circuit.Can arrange such as, but not limited to the remainder of CPU, storer, acoustic component, wave point, data connector, power connector and associated circuit the layer that is not occupied, perhaps to occupy but the part of the layer that is not utilized fully as yet by these parts with adaptive proximity displays, display circuit and battery.More specifically, the PCB of description design can allow various electronic units are adaptive and be connected to one another in the irregular space, and these irregular spaces are positioned at device housings and by be arranged and be fixed on described shell gained afterwards than the large equipment parts.
In a particular embodiment, can be provided in the multi-layer PCB of the relative thin of using in the portable computing device.This multi-layer PCB can form planar configuration.At the assembly process of portable computing device, PCB can be in some zone crooked so that its can install with non-planar configuration.This crooking ability can more effectively be used for PCB fit in big parts such as battery be mounted after in the remaining in the enclosure free space.
Multi-layer PCB can comprise a plurality of basalises and a plurality of trace layer, and wherein each trace layer forms at the basalis top.In order to form trace layer, can be at the solid layer of basalis top deposition such as the conducting metal of copper, the part that can remove this metal level subsequently is to form conductive trace.In order with non-planar configuration PCB to be installed, expection can be able to being born more, the interior conductive trace in zone of macrobending is made significantly thicker.Conductive trace can be used to connect the parts with the PCB electric coupling.Each parts is positioned at the top side of PCB and/or bottom side to fit in free space or to be connected to other internal parts when needed.
The hardness of multi-layer PCB can be adjusted to allow this circuit board to be easy in the specific region crooked and to be difficult to bending in other zones by the part.Typically, trace layer only comprises the trace that the parts that are used for being coupled to pcb board connect mutually, and the excess stock that wherein is not used to form trace can be removed.In one or more described trace layers, excess stock can be used to change the hardness property of PCB.For example, can in some trace layer zone, keep unnecessary trace material, remove materials in other zones simultaneously with the flexibility of increase PCB to increase near the total hardness of PCB these zones.
In a particular embodiment, described trace layer can be dedicated to adjust the hardness property of PCB.Can be primarily aimed at its hardness property but not its conductive property is selected the material of trace layer.In this layer, the part that can remove layer is with the hardness that reduces PCB and increase the flexibility that removes near the PCB the material.In one embodiment, can use marmem such as Nitinol.
In one embodiment, the main logic plate can be formed by this multi-layer PCB.This main logic plate can comprise first rectangle part and second rectangle part that connects mutually via narrow coupling part.Parts such as processor, storer and audio codec can be coupled to this main logic plate.This main logic plate can be shaped as fit in remaining after being installed in battery in the shell of portable computing device, be positioned on the battery top, under the bottom and along the space of battery side.This main logic plate can be installed with plane or non-planar configuration.
Use the ending connecting audio of the connector in the small form factor electronic equipment
A kind of personal media device, at least comprise: housing with a plurality of openings, wherein at least one opening holds the housing port of the first that is arranged to listened to the energy that output generates by the audio frequency maker that is included in the housing, and another opening is the replacement port that is used to broadcast the second portion of listened to the energy that is generated by this audio frequency maker at least.When at least a portion of housing port is blocked, can listen at least some energy in the first of energy to be redirected to the replacement port, keep constant substantially thus to the perception of the audio output level of listened to the energy of output.
Aspect of description embodiment, replacing port is to incorporate connector opening in the mode that a kind of maintenance is not seen by the user of individual media substantially.In yet another aspect, connector opening holds data connector, and aspect another, connector opening holds audio jack.
A kind of method of describing in described embodiment can be undertaken by carrying out following operation at least.A housing is provided, and this housing has the encirclement of being fit to and is used to personal media device that the size and the shape of a plurality of functional units of function are provided; Loudspeaker assembly is attached to enclosure interior; First air path of external environment condition is coupled to loudspeaker assembly in configuration via the first audio output port acoustics; Configuration is at loudspeaker assembly and be independent of second air path between second audio output port of first audio output port, first audio output port and second audio output port are oriented to physically when one of audio output port is stopped up by object thus, at least another audio output port keeps not getting clogged, and uses first and second audio output ports will be delivered to external environment condition by the sub-audible sound that loudspeaker assembly generates collaboratively.
Described is a kind of integrated sub-audible sound output system of incorporating in the personal media device.In described embodiment, personal media device comprises processor, voicefrequency circuit and data holding unit at least, and the latter comprises a sub-audible sound maker unit at least.This sub-audible sound maker unit is arranged to according to retrieval from data holding unit, produces sub-audible sound by voicefrequency circuit decoding and by the voice data of processor processing.Described integrated sub-audible sound output system comprises: first audio output port, wherein said first audio output port is coupled to sub-audible sound maker unit via the first air path acoustics.This system also comprises second audio port via second air path acoustics coupling sub-audible sound maker.First and second air path are delivered to external environment condition with the sub-audible sound that sub-audible sound maker unit generates via first audio port and second audio port collaboratively.
In another embodiment, a kind of non-transient state computer-readable medium that is used for storing the computer program carried out by processor and uses at the area of computer aided assembly of personal media device has been described.This computer-readable medium comprises at least: be used to provide the computer code of housing, described housing has the encirclement of being fit to and is used to personal media device that the size and the shape of a plurality of functional units of function are provided; Be used for loudspeaker assembly is attached to the computer code of enclosure interior; Be used to dispose the computer code that loudspeaker assembly is coupled to first air path of external environment condition via the first audio output port acoustics; Be used to dispose at loudspeaker assembly and be independent of the computer code of second air path between second audio output port of first audio output port, so that first audio output port is become when one of audio output port is stopped up by object by physical positioning with second audio output port, another audio output port keeps not blocked at least.In the operating process of personal media device, the sub-audible sound that first air path and second air path use first and second audio output ports also collaboratively loudspeaker assembly to be generated is delivered to external environment condition.
In a general sense, embodiment disclosed herein has described a kind of modularization material antenna module that comprises antenna block, and described antenna block has a part, and this part has with the counterpart interlocking of non-conductive framework and antenna block is fixed to the shape of non-conductive framework.This non-conductive framework is attached to the inside of conductive shell, so that non-conductive framework and conductive shell form one-piece construction.Then, by antenna block mechanical support antenna flexible cable, and the antenna flexible cable is electrically connected to circuit board.Framework is designed to support the cover glass that is used for portable electric appts, and can be affixed on the housing.The specific inductive capacity of the permittivity ratio framework of antenna block is much smaller.In one embodiment, antenna block is made by cyclic olefin polymer (COP), and framework is made by glass filled plastics.The synthetic difference of specific inductive capacity combines with the difference of the interlocking portions of framework and antenna block and dielectric loss tangent and has improved antenna performance.
A kind of method of assembly portable formula electronic equipment is provided in another embodiment.In this embodiment, provide conductive shell.Subsequently, non-conductive framework is glued to conductive shell inside to form one-piece construction.Non-conductive framework is made by the frame material with first specific inductive capacity.Subsequently, the part of the antenna block by will having first shape and a part of interlocking that has with the framework of corresponding second shape of this first shape are fixed to described framework with this antenna block.Antenna block is formed by the antenna block material that has much smaller than second specific inductive capacity of first specific inductive capacity.So can support the antenna flexible cable by this antenna block.
In another embodiment, a kind of computer-readable medium with computer code is provided, described code is used for non-conductive frame fixation to conductive shell inside to form one-piece construction, and wherein this non-conductive framework is made by the frame material with first specific inductive capacity.This medium can also comprise and is used for the control robot arm will this non-conductive framework to be glued to the computer code of conductive shell inside.This computer-readable medium also can comprise by the antenna block that will have first shape a part with have the computer code that this antenna block is fixed to described framework with a part of interlocking of the framework of corresponding second shape of this first shape.This medium can also comprise and is used for the control robot arm to carry out the computer code of interlocking.This computer-readable medium also can comprise the computer code that is used to make that the antenna flexible cable is supported by this antenna block machinery.This medium can also comprise and is used to control automatic screwdriver the antenna feed screw is fixed to the conduction rack of antenna block and welded case.
By the detailed description below in conjunction with accompanying drawing, other aspects and advantages of the present invention will become apparent, and wherein accompanying drawing illustrates principle of the present invention by way of example.
Description of drawings
By detailed description below in conjunction with accompanying drawing, the described embodiment easy to understand that will become, similar structural detail like the Reference numeral representation class wherein, and wherein:
Be used for the compact-folded configuration of integrated circuit encapsulation
Figure 11 A is the skeleton view according to the collapsible memory devices that is in the first pre-assembled configuration of described embodiment.
Figure 11 B is the skeleton view according to the collapsible memory devices that is in the second pre-assembled configuration of described embodiment.
Figure 11 C is the flexible circuit connector skeleton view that is used for collapsible memory devices according to described embodiment.
Figure 12 shows the top view of the collapsible memory devices that is coupled to printed circuit board (PCB) (PCB) of assembled configuration that is in according to described embodiment.
Figure 13 shows the sectional view according to the portable computing device that comprises collapsible memory devices of described embodiment.
Figure 14 shows the top view according to the collapsible memory devices that is coupled to printed circuit board (PCB) (PCB) that is in pre-assembled configuration of described embodiment.
Figure 15 A-15C show according to the different attachment method of the use of described embodiment be coupled to PCB and with the skeleton view of the mutually attached collapsible memory devices of metal framework.
Figure 15 D shows the skeleton view according to the collapsible memory devices that is coupled to PCB1214 of described embodiment, and wherein the contact site of this PCB and collapsible memory devices uses conduction band ground connection.
Figure 16 shows the top view according to the collapsible memory devices that is coupled to PCB that is in pre-assembled configuration of described embodiment.
Figure 17 is the process flow diagram of the method for the portable computing device that comprises collapsible memory devices of the assembling according to described embodiment.
Figure 18 A shows the top view according to the portable electric appts of described embodiment.
Figure 18 B shows the backplan according to the portable electric appts of described embodiment.
Figure 18 C shows the block diagram according to the media player of described embodiment.
Be used to optimize the inner frame of hardness and heat transmission
Figure 21 A shows the top view according to the portable electric appts of described embodiment.
Figure 21 B shows the backplan according to the portable electric appts of described embodiment.
Figure 21 C shows the block diagram according to the portable electric appts of described embodiment.
Figure 21 D shows the sectional view according to the portable electric appts of described embodiment.
Figure 22 A and 22B show according to the top view of the inner frame of described embodiment and backplan.
Figure 22 C shows the top view according to the inner frame of described embodiment.
Figure 23 A-23B shows the sectional view according to the inner frame of described embodiment.
Figure 24 A-24B shows according to described embodiment, and heat is connected to the sectional view of the inner frame of a plurality of parts of appliance.
Figure 25 is according to described embodiment, makes the process flow diagram of the method for the portable electric appts that has inner frame, and wherein said inner frame is designed to have specific thermal-structural behaviour.
Figure 26 is according to described embodiment, is constructed to the block diagram of the portable electric appts of media player.
Synthetic microphone storehouse is to optimize sealing and mechanical attributes
Figure 31 A-31C shows the skeleton view according to the microphone assembly that comprises microphone and microphone storehouse of described embodiment.
Figure 32 A-32B shows the skeleton view according to the microphone assembly that is in different orientations in the portable computing device housing of described embodiment.
Figure 33 A-33B shows the side view according to the microphone assembly that is in pre-installation site and installation site in housing of described embodiment.
Figure 33 shows the side view that applies the microphone assembly in the housing of power in response to the outside.
Figure 34 A-34D shows sectional view and the top view according to the synthetic microphone storehouse of preferred embodiment.
Figure 35 is the process flow diagram that comprises the method for the portable computing device that synthesizes the microphone storehouse according to the manufacturing of preferred embodiment.
Figure 36 A shows the top view according to the portable electric appts of described embodiment.
Figure 36 B shows the backplan according to the portable electric appts of described embodiment.
Figure 36 C is the block diagram according to the media player of described embodiment.
Modularization material antenna module
Figure 41 shows a top perspective view, and it illustrates the representative consumer products according to described embodiment.
Figure 42 shows the top perspective view according to the modularization material antenna module of an embodiment.
Figure 43 shows first sectional view according to the modularization material antenna module of an embodiment.
Figure 44 shows second sectional view according to the modularization material antenna module of an embodiment.
Figure 45 shows the extended view according to the top perspective view of the modularization material antenna module of an embodiment.
Figure 46 has described a kind of interchangeable interlocking shape according to an embodiment.
Figure 47 has described a kind of interchangeable interlocking shape according to another embodiment.
Figure 48 has described a kind of interchangeable interlocking shape according to an embodiment.
Figure 49 has described a kind of interchangeable interlocking shape according to another embodiment.
Figure 50 is a process flow diagram, and it has described the method that is used for assembly portable formula electronic equipment according to an embodiment.
Figure 51 is the block scheme of portable consumer product according to an embodiment of the invention.
The PCB that forms
Figure 61 A and 61B show according to the skeleton view of the portable computing device of described embodiment and the block diagram of portable computing device.
Accompanying drawing 62A, 62B and 62C show skeleton view and the side view according to the flexible main logic plate of described embodiment.
Accompanying drawing 63A, 63B and 62C show according to the skeleton view of the flexible PCB of described embodiment, top view and backplan.
Figure 64 A-64C shows the top view of the flexible PCB of various curved configuration.
Figure 65 A-65E shows the side view of the flexible PCB of various curved configuration.
Figure 66 A shows the side cross-sectional view of multi-layer PCB.
Figure 66 B shows the top view of two trace layers of the multi-layer PCB of Figure 66 A.
Figure 67 is to use multi-layer PCB to make the process flow diagram of the method for portable computing device.
Figure 68 is the block diagram according to the portable computing device that has media play function of described embodiment.
Use the ending connecting audio of the connector in the small form factor electronic equipment
Figure 71-the 72nd illustrates the skeleton view of each view of the personal media device of assembling fully according to the embodiment of the invention.
Figure 73 shows the viewgraph of cross-section of portable electric appts.
Figure 74 shows the guide wire of alternative shape of the housing of seeing shown in Figure 2 in front elevation.
Figure 75 is the side view that the part of housing shown in Figure 75 is shown, and has wherein highlighted the relation between output audio port and the sound reflection surface.
Figure 76 shows the view according to the interior section of the personal media device of description embodiment.
Figure 77 shows the guide wire of alternative shape shown in Figure 76.
Figure 78 shows along the viewgraph of cross-section of Figure 76 line A-A.
Figure 79 shows another embodiment that uses audio jack to transmit sub-audible sound.
Figure 80 has described the process flow diagram of describing according to the processing of description embodiment in detail.
Figure 81 is the block diagram of the layout of the functional module utilized of portable media device.
Figure 82 is the block diagram that is fit to the media player that uses with description embodiment.
Embodiment
In the following detailed description, will set forth numerous details, so that the complete understanding about the bottom notion of description embodiment is provided.Yet obvious for a person skilled in the art is, described embodiment can implement under the situation of some or all of these details not having.In other examples, do not describe known treatment step in detail, in order to avoid unnecessarily obscure described bottom notion.
Be used for the compact-folded configuration of integrated circuit encapsulation
In accompanying drawing subsequently, the package design of utilizing the multicore sheet that can overcome the shortcoming of describing in previous paragraphs has been described.This package design can be called as " collapsible memory devices ".The memory devices that this package design allows to comprise a plurality of memory chips that connected by flexible circuit connector is installed in the portable computing device simply.Flexible circuit connector can be utilized for memory devices provides data and/or power to connect, and can be used for RF shielding purpose.Use flexible circuit connector but not independent metallic shield is used for the general thickness profile that the RF shielding helps to reduce memory cell, and owing to can save the installation of independent metal RF shielding thereby can also simplify assembling process.
Following 11-18C with reference to the accompanying drawings discusses these and other embodiment.However, it will be recognized by those skilled in the art, only be used for the example purpose at the detailed description that accompanying drawing provides, and should be considered to restriction at this.More specifically, 11A-11C has described collapsible memory devices and associated component thereof in two different pre-assembled configuration with reference to the accompanying drawings.Subsequently, 12 and 13 discussed with reference to the accompanying drawings at its final collapsible memory devices that assemble and install in the configuration.With reference to the accompanying drawings 14 and 16, the collapsible memory device configurations that may occur in assembling process before the final configuration of collapsible memory devices arriving has been described.Different collapsible memory device configurations can partly obtain by the flexible circuit connector of folding or crooked collapsible memory devices.
Referring to Figure 15 A-D, the distinct methods that is used for the flexible circuit connector partial earth of collapsible memory devices has been described.Flexible circuit connector can be grounded to allow it to be used as around the part of the faraday cup of collapsible memory devices.The method of assembling the portable computing device that comprises collapsible memory devices has been described with reference to Figure 17.The skeleton view that can comprise the portable electric appts of collapsible memory devices has been described with reference to figure 18A-18B.At last, with reference to figure 18C the block diagram that can comprise the portable media device of collapsible memory devices has been discussed.
Figure 11 A is the skeleton view according to the collapsible memory devices 1100 that is in the first pre-assembled configuration of described embodiment.When this installation, collapsible memory devices 1100 can be used as the part of the memory cell of portable computing device.Collapsible memory devices such as 1100 can comprise two or more memory chips.Memory chip can be attached to the flexible circuit connector such as 1112.In one embodiment, memory chip is flash memory and non-chip.
The top surface 1112a that two chips (1102 and 1104) are attached to flexible circuit connector 1112 has been shown in Figure 11 A.In Figure 11 C, then show the top surface 1112a of the flexible circuit connector 1112 that does not adhere to these two chips.Flexible circuit connector 1112(also b referred to as " flexible cable connector ") can comprise power delivered to each chip (such as 1102 and 1104) and allow chip and other equipment (such as, main logic plate) between the trace of data communication.
In one embodiment, flexible cable connector 1112 can comprise the parts that extend from top surface 1112a, such as 1110.Parts 1110 are positioned on the folding cover 1112f of flexible connector.In specific embodiment, parts 1110 can be to allow the data-interface of communication between flexible cable connector and remote equipment (such as, main logic plate) and a part of electric power being delivered to the power interface of flexible cable connector 1112.
Chip (such as 1102 and 1104) can comprise the data that are coupled on the flexible cable connector 1112 and the data and the power interface of power interface.In one embodiment, these data and power interface (not shown) can be soldered to data and the power interface (not shown) on the flexible cable connector 1112.For example, flexible cable connector 1112 can comprise data and power interface on its top surface 1112a, and the corresponding interface on chip (such as 1102 and 1104) then can be soldered to described data and power interface.Except that welding, can also use other binding mechanisms in order to the top surface 1112a of chip attach to flexible cable connector 1112.For example, can use liquid adhesive or adhesive strip so that in chip 1102 and 1104 each is attached to flexible cable connector 1112.
Flexible cable connector 1112 can also comprise and is used to allow a plurality of shield traces of this flexible cable connector as the part of faraday cup.Shield traces can be coupled to connector gasket, such as 1106.As reference Figure 13,14 and 15A-15C describe in more detail, connector gasket can be coupled to (such as, band connects or is soldered to) other conducting parts, form faraday cup with in chip is installed in portable computing device the time around described chip.Faraday cup can prevent that the RF signal that is generated by chip from disturbing the miscellaneous part of portable computing device.For example, portable computing device can comprise antenna, and faraday cup can prevent that then the RF signal that chip generates from arriving described antenna.
Chip (such as 1102 and 1104) can be attached to flexible cable connector 1112, and the partial-length of flexible cable connector so that two chips can be separated by is such as 1112c.The part of flexible cable connector between two chips can be called as " partitioned portion ".Partitioned portion 1112c can be bent in different directions and/or reverse between the installation period of collapsible memory devices, realizes one or more different configurations of collapsible memory devices thus.For example, partitioned portion 1112c is can be during first installation steps crooked in one way and/or reverse in first chip attach to printed circuit board (PCB), is bonded in the top surface 1104a crooked and/or reverse in a kind of different mode subsequently during second installation steps in top surface 1112a.
Can select between the chip apart from 1105a, so that the flexible cable connector holds each parts and/or complies with different surfaces.For example, shown in Figure 13 and 14, can be so that the partitioned portion 1112c of flexible cable connector 1112 holds pcb board and metal framework.In each embodiment, be adjustable to take into account the lip-deep uncontinuity that it holds apart from 1105a, such as the parts of holding up from the surface.For example, as shown in figure 14, pcb board is in the differing heights with respect to metal framework.If expectation can be bonded to the intermediary surface with partitioned portion 1112c in a certain mode, so that it complies with these surfaces.In any case partitioned portion is all complied with these intermediary surfaces, and the topology on these intermediary surfaces can influence be selected at the chip chamber that uses in the specific collapsible memory devices design apart from 1105a.
The width of partitioned portion 1112c is shown as the width of approximate chip 1102 and 1104.In each embodiment, width 1105b can be more greater or lesser than chip width.For example, in one embodiment, the width 1105b of the partitioned portion 1112c between the chip can narrow down so that this partitioned portion can more be easy to reverse or bending.In another embodiment, can in this partitioned portion 1112c, arrange one or more holes.When holding intermediary when surface, the hole can allow parts to extend by this hole from the intermediary surface, and this is with to have discrete parts on extension component opposite.Design in this way, partitioned portion 1112c can more preferably comply with the surface around extension component.
In one embodiment, the partitioned portion 1112c of flexible cable connector 1112 between chip 1102 and 1104 can be folded (such as, along line 1108), thus the top surface 1102a of permission chip 1102 aligns with the top surface 1104a of chip 1104 and combines.In Figure 11 B, show the skeleton view of the flexible cable connector 1112 of the chip 1102 that is included in after folding and 1104.In Figure 11 B, flexible cable connector 1112 is folding along line 1108, exposes the basal surface 1112b of flexible cable connector 1112 thus.In one embodiment, first and second chips can have same size, and two chips can directly align on another top one with stack arrangement, and four of each chip jiaos are right after alignment thus.If expectation can be with two chips incorporate together in this configuration.In Figure 11 B, the chip that illustrates is in as yet directly alignment and also needs additional alignment to make two chips directly under the configuration of alignment.
In other embodiments, the flexible cable connector can be folded, and chip can be in overlapping stack arrangement (its chips is not direct and places on another top) alignment and combination.Under this configuration, on the top surface 1102a edge of the chip 1102 that the top surface 1104a of chip 1104 is suspended in.In other embodiments, chip 1102 and 1104 can have different size.In this embodiment, after folding, chip can be stacked and align, and makes less chip placed in the middle on bigger chip.Also can use eccentric stacked alignment configuration.For example, one or more outer rims of less chip can be alignd with the one or more outer rims than large chip.
Figure 12 shows the top view of the collapsible memory devices 1100 that is coupled to printed circuit board (PCB) (PCB) 1214 of assembled configuration that is in according to described embodiment.Collapsible memory devices 1100 can be the parts of assembly 1200.Assembly 1200 can comprise PCB1214 and a plurality of miscellaneous part, such as the main logic plate that can be positioned under the screening cover 1206.Assembly 1200 can be attached to the housing of portable computing device via a plurality of different attachment point (such as, attachment point 1215).
When folding, the folding cover 1112f of collapsible memory devices 1100 can be attached to screening cover 1206 and ground connection thus.The folding cover 1112d and the 1112e of collapsible memory devices 1100 can comprise connector gasket.These parts can be folded to the top so that connector gasket can be connected to around the metal framework (referring to attached Figure 13 and 14) of collapsible memory devices 1100 and ground connection thus.As mentioned above, when being grounded, the various piece of flexible cable connector and other metal parts (such as, metal framework and screening cover 1206) can be a part around the faraday cup of chip.
It is folding that the partitioned portion 1112c of flexible cable connector 1112 is shown in two places.First is folded near the PCB1214 bottom.Second is folded near the height of screening cover 1206.Partitioned portion 1112c does not comply with the little prominent frame from the extended PCB1214 of metal framework.Thus, between flexible cable and metal framework, can there be the gap.In other embodiments, partitioned portion 1112c can be attached to this prominent frame, so that this partitioned portion 1112c complies with better to this intermediary surface.
Figure 13 shows the sectional view of the portable computing device that comprises collapsible memory devices.The periphery of portable computing device can be formed by lid glass 1216 and housing 1208.Display 1218 and associated circuit thereof (such as, display driver) can be positioned under the lid glass 1216.The assembly 1200 that comprises PCB1214 and collapsible memory devices 1100 can be positioned under the display circuit.In one embodiment, assembly 1100 can be mounted so that the basal surface 1112b of the top of screening cover 1206 and flexible cable connector 1112 faces the inside surface of housing 1208 separately.
In the configuration of installation of collapsible memory devices, first chip 1102 and second chip 1104 are shown as one and are stacked on another top, and wherein first chip 1102 and second chip 1104 have roughly the same size and one over against on another top.As previously mentioned, if expectation, first chip 1102 and second chip 1104 can be shifted relative to each other to the left or to the right to obtain unsettled configuration.
The folding cover 1112f of flexible cable connector 1112 can be attached to screening cover 1206.The folding cover can comprise the connector gasket via screening cover 1206 ground connection.Folding cover 1112e can be attached to the outer surface part of metal framework 1210, thus with flexible cable external surface grounded through metal framework 1210.In other embodiments, the folding cover 1112e of flexible cable 1112 can be attached to the inside surface (referring to Figure 15 A) of metal framework 1210.
The outside surface that is positioned under the stacked chips of flexible cable connector 1112 is shown as with respect to the height on the inside surface of housing 1208, has the height a little less than screening cover 1206.In other embodiments, the height of stacked chips and flexible cable connector can be higher than the height of shielding.In addition, the stacked chips configuration can comprise two or more chips, and is not limited to two chips shown in Figure 13.
Typically, the screening cover as a faraday cup part can be formed by conducting metal (such as stainless steel).The thickness of flexible cable connector 1112 such as 1112 can be the screening cover that forms by stainless steel thickness about 1/6.So, use the flexible cable connector to replace metallic shield to create exceptional space as the use of other purposes in the package design.For example, exceptional space can be used for increasing the size of the battery that is utilized, and perhaps thickening is used to increase the structure of equipment hardness.
Figure 14 shows the top view of the collapsible memory devices that is coupled to printed circuit board (PCB) (PCB) 1214 that is in pre-assembled configuration.In an embodiment of installation steps, first chip 1102 can be disposed within the metal framework 1210 and for example be coupled to PCB1214 via the mounted on surface bonding agent.Can provide interim baffle plate 1224 when first chip is fixed to PCB, to be used for the location of chip.When first chip 1102 was attached to PCB1214, the partitioned portion 1112c of collapsible memory devices 1100 can launch and place a side, made collapsible memory devices be in the configuration of relatively flat.
In an embodiment of second installation steps, after first chip with collapsible memory devices 1100 is fixed to PCB1214, the partitioned portion 1112c of collapsible memory devices 1100 can be folded on the intermediary surface of being made up of a side of the side of PCB1214 and metal framework 1210, thus the related part of turning-over of chip 1104 and flexible cable connector thereof.After upset, the flexible cable parts 1220 on the folding cover 1112f can be aligned with in each hole 1222 that is fitted to the metallic shield lid.In one embodiment, flexible cable parts 1220 can be to the data of flexible cable connector 1112 and the part of power interface.
Collapsible memory devices can be configured to when flexible cable parts 1220 align with hole 1222, and two chips 1102 and 1104 are roughly alignment in stack arrangement.Can use the bond such as double faced adhesive tape bonding agent or liquid adhesive, thus as precedingly fix two chips in about accompanying drawing 12 and 13 described stack arrangement.So, can be grounded to another part of faraday cup such as the folding cover of connector gasket that comprises of 1112e, for example a side of metal framework 1210.Can use multiple diverse ways in order to the connector gasket on the folding cover of flexible cable connector 1112 is fixed to other parts of faraday cup.These methods 15A-15C are with reference to the accompanying drawings described.
In one embodiment, the chip in the collapsible memory devices is stacked in the metal framework.Under this configuration, the connector gasket on the folding cover of flexible cable connector is attached to metal framework so that flexible cable connector ground connection, and forms faraday cup around the chip on collapsible memory devices.Figure 15 A-15C show according to the different attachment method of the use of described embodiment be coupled to PCB and with the skeleton view of the mutually attached collapsible memory devices of metal framework.
In Figure 15 A, the connector gasket that can be formed by the conducting metal such as copper can be filled within the metal framework 1210.So connector gasket can be soldered to metal framework 1210 along apical margin 1226.In another embodiment, scolder can be applied to connector gasket, connector gasket and scolder can be filled in the metal framework subsequently.Next, can heat this metal framework, make scolder melt and connector gasket is bonded to metal framework 1210 inside.Scolder can be placed between metal framework inside and the connector gasket after the folding cover of the collapsible memory devices that comprises connector gasket has been filled in the metal framework.
In a specific embodiment, illustrated as Figure 15 B, the folding cover 1228 of collapsible memory devices can fold on the metal framework outside, then be applied with electroconductive binder in the outside of this metal framework, in order to connector gasket is bonded to the metal framework outside such as conductive adhesive tape.Can exert pressure to guarantee the formation of combination to folding cover 1228.In yet another embodiment, shown in Figure 15 C, scolder can be applied to connector gasket and connector gasket 1228 and metal framework outside, and can add hot solder connector gasket is soldered to this metal framework.
Collapsible memory devices can comprise a plurality of folding covers that contain the metal connector liner.In certain embodiments, a folding lid can be filled in such as combining in the metal parts of metal framework and with this metal inside, another folding lid then can be folded on the metal parts and with the outside of this metal parts and combine, such as combining with the top of screening cover or the Outboard Sections of metal framework.Depend on how flexible circuit connector folds and according to the connector gasket combination be which surface (for example, inside surface or outside surface), connector gasket can be positioned on the top surface or basal surface of flexible cable connector.As mentioned above, can use the electroconductive binder such as conductive strips or scolder and will roll over cover and be bonded to a surface.
Figure 15 D shows the skeleton view according to the collapsible memory devices that is coupled to PCB1214 of described embodiment, and wherein the contact site of this PCB and collapsible memory devices (for example, connector gasket 1240) uses conduction band 1230 ground connection.In one embodiment, the folding cover such as 1112f that is positioned on the flexible cable connector of collapsible memory devices can comprise connector gasket 1240 on a side, and comprises parts (parts 1220 as shown in figure 14) on opposite side.Among the embodiment that describes in Figure 14, collapsible memory devices is folded in, and makes that the parts 1220 on the folding cover 1112f are adaptive by the hole in the screening cover 1206.If folding cover 1112f does not comprise parts, then this folding cover can be placed on the top of screening cover, so that be shelved on this screening cover.In this embodiment, connector gasket can be placed on the opposite side of flexible cable connector, and it will be in the face of screening cover 1206 thus.
In the time shown in Figure 15 A, 15B or 15C, will rolling over cover and place on the screening cover top, can keep connector gasket and expose.Shown in Figure 15 D, the connector gasket 1240 of exposure can be covered by conductive strips (such as 1230), so that the connector gasket that should expose is through miscellaneous part, such as the top ground connection of screening cover 1206.When ground connection in this way, connector gasket can allow the part of the flexible cable connector on the collapsible memory devices to be used as the part of faraday cup.
Figure 16 shows the top view according to the collapsible memory devices that is coupled to PCB that is in pre-assembled configuration of described embodiment.In this embodiment, collapsible memory devices comprises four chips 1202,1203,1204 and 1205 that are attached to the flexible cable connector.These chips can be of different sizes than the chip in preceding description.For example, chip can be thinner, and all about 1/2 at preceding description chip thickness in this way make that the height that piles up can be roughly the same with the stacks as high that only comprises chip 1102 and 1104 when 1202,1203,1204 and 1205 are piled up on another by one.
In one embodiment, first chip of collapsible memory devices can be attached to PCB such as 1202, such as 1214.Subsequently, in one embodiment, the partitioned portion 1212d of flexible cable connector can be folded, so that chip 1203 combines with chip 1202.Next, partitioned portion 1212e can be folded, so that chip 1205 combines with chip 1204. and these steps are reversible, that is, chip 1205 can at first be bonded to chip 1204, and chip 1203 can be bonded to chip 1202 subsequently.
After chip 1202/1203 and 1204/1205 combined, the partitioned portion 1212c between chip 1202 and 1204 that can the folded flexible cable connector can be bonded to chip-stacked 1202/1203 with chip-stacked 1204/1205 thus.The parts 1220 that are positioned on the flexible cable connector of chip 1204 bottoms can be aligned, so that parts are adaptive by hole 1222.So, as previously mentioned, be positioned on the flexible cable connector of chip 1204 basal surfaces the folding cover can with other metal parts (such as, metal framework and screening cover) combine and ground connection thus, thereby form faraday cup around the chip that piles up.
In another embodiment, folding can being undertaken of collapsible memory devices (folding step can depend on that collapsible memory devices changes, and these steps only are provided for the purpose of example) by different order.For example, in one embodiment, the partitioned portion 1212e of flexible cable connector can be folded, so that chip 1205 combines with chip 1204.Subsequently, partitioned portion 1212c can be folded, so that chip-stacked 1204/1205 can combine with chip 1202.Then, partitioned portion 1212d can be folded, so that chip 1203 can combine with chip-stacked 1202/1204/1205.In this embodiment, the folding cover of flexible cable connector can be positioned at chip 1203 but not be positioned at the bottom of chip 1204 as shown in the figure.From the bottom of chip 1203 extended folding cover can with other metal parts (such as, screening cover 1206 and metal framework 1210) combine, thereby form faraday cup around the chip that piles up,
More than the number of assembling steps that uses collapsible memory devices to describe can be realized in the manufacture process of portable computing device.For example, with reference to Figure 17 the method 1300 that comprises the portable computing device of collapsible memory devices according to the assembling of described embodiment has been described.In step 1302, can be connected to flexible circuit connector such as a plurality of memory chips of chip.Flexible circuit connector can comprise power supply and data trace.Each chip all can be connected to power supply and the data trace on the flexible cable connector, can give chip with electric power supply thus, and data can be to and from each chip via data trace.
It is the part of the memory devices on the portable computing device that chip can be used as.1304, first chip on the collapsible memory devices can be attached to the assembly that will be installed in the portable computing device.For example, this assembly can comprise printed circuit board (PCB), and first chip can be attached to this printed circuit board (PCB).This assembly can be used to operating period at portable computing device with collapsible memory devices fix in position.The assembly that keeps collapsible memory devices can be to be fixed in the portable set housing, perhaps can be to be fixed during number of assembling steps subsequently.
In one embodiment, the partitioned portion between 1306, two chips can fold, and two chips can align in stack arrangement.1308, can be together in this stack arrangement with two chips incorporate.Generally speaking, folding step can depend on the number of chips on the collapsible memory devices, and how connected to one another via the partitioned portion of flexible connector each chip is.Whether the part that folding order is subjected to flexible connector will be used as the influence of the part of faraday cup, this is because this fold sequence can require each chip to end at a certain position after folding the generation, can realize being used for the appropriate connection with flexible cable connector ground connection thus.
1310, the connector gasket on the flexible circuit connector can be attached to other metal parts, to form the part of faraday cup.For example, as mentioned above, connector gasket can be incorporated in to the metal framework around chip.Faraday cup can be used to shield the RF signal that leaks from chip.For example, portable computing device can comprise antenna, and chip can be centered on so that the RF signal that is generated by chip can't arrive antenna by faraday cup.1312, not to be fixed under the situation of a part of assembly of housing of portable computing device at the collapsible memory devices that centers on by faraday cup, comprise that the assembly of collapsible memory devices can be installed in this portable computing device.
In said method, one or more steps can be finished by processor during computer-aided manufacturing is handled.For example processor can be programmed to allow the robot device to install and folding collapsible memory devices.Other lifts an example, and processor can be programmed to allow the robot device that chip is coupled to the flexible cable connector or the connector gasket on the flexible cable connector is coupled to miscellaneous part.
Figure 18 A and 18B show top view and the backplan according to the portable computing device 1400 of described embodiment.It is hand-held that portable computing device can be suitable for the user.Lid glass 1406 and display 1404 can be placed in the opening 1408 of housing 1402.Lid glass can comprise the opening that is used for input mechanism (such as load button 1414).In one embodiment, load button 1414 can be used to portable computing device is returned particular state, such as main interfacial state.
Can arrange other I/O mechanisms around the periphery of housing 1402.For example, can arrange power switch at the apical margin of housing such as 1410, and can be along an edge placement of housing such as 1412 volume switch.The audio jack 1416 and the data/power connector interface that are used to connect earphone or other audio frequency apparatuses then are positioned at the root edge of housing.This housing 1400 also comprises the hole of the camera 1415 that is used to allow receiving video data.
Figure 18 C is the block diagram according to the media player 1500 of described embodiment.Media player 1500 comprises processor 1502, and it belongs to whole microprocessor operating or the controller that is used to control media player 1500.Media player 1500 is stored the media data about media item in file system 1504 and high-speed cache (cache) 1506.Typically, file system 1504 is memory disk or a plurality of dish.Typically, file system provides the high capacity storage capacity for media player 1500.But because relatively slow to the access time of file system 1504, media player 1500 also comprises high-speed cache 1506.High-speed cache 1506 for example is the random access storage device (RAM) that is provided by semiconductor memory.Relative access time of high-speed cache 1506 is shorter than access time to file system 1504 greatly.Yet high-speed cache 1506 does not have the large storage capacity of file system 1504.
Further, when activity, file system 1504 consumes more electric power than high-speed cache 1506.When media player 1500 was portable electronic device by battery (not shown) power supply, power consumption was even more important.
Media player 1500 also comprises user input device 1508, and it allows the user and the media player 1500 of media player 1500 mutual.For example, user input device 1508 can be taked various ways, such as button, keypad, rotating disk etc.In addition, media player 1500 comprises display 1510(screen display), display can be by processor 1502 control with to user's display message.Data bus 1511 can help the data transmission between file system 1504, high-speed cache 1506, processor 1502 and codec (CODEC) 1512 at least.
In one embodiment, media player 1500 is used in file system 1504 storage a plurality of media item (for example song).When the user wanted the media renderer plays certain media items, the tabulation of available media items can be presented on the display 1510.Subsequently, utilize user input device 1508, the user can select one of available media items.After the selection that receives certain media items, processor 1502 offers encoder/decoder (CODEC, codec) 1512 with the media data (for example, audio file) of certain media items.Codec 1512 produces the analog output signal that is used for loudspeaker 1514 then.Loudspeaker 1514 can be the loudspeaker of media player 1500 inside or media player 1500 outsides.For example, headphone or the earphone that is connected to media player 1500 is considered to external loudspeaker.
Be used to optimize the inner frame of hardness and heat transmission
In the Thermal structures design of thin compact type portable electric appts, admissible primary factor can be the layout of parts relevant with user interface.After determining the disposed outside of these parts, just can consider factor, such as inside encapsulation, weight, under the expection operating conditions, be required intensity and the hardness of protection equipment about case design.Then, can consider heat problem, such as the development that prevents inner focus.When taking all factors into consideration these design factors, they may influence each other.Therefore, the design of equipment may be a process repeatedly.
As illustration, device design is discussed from the angle of described factor above to the Thermal structures design process of portable set.Typically, portable set can comprise display.Display and input mechanism can be arranged on the one side of equipment usually.If wish, the housing of thin contour can be defined as around and seal except that the visible display part of user all.The face relative with display can mainly be the structure relevant with housing, but can comprise the hole that is used for such as other input equipments such as cameras.
Along the edge of housing, can arrange various I/O mechanism, such as volume switch, power knob, data and power connector, audio sockets etc.Housing can comprise the hole that holds I/O mechanism.Can select to arrange that the position of I/O mechanism is to strengthen the availability at the condition lower interface of wanting operating equipment.For example, for the equipment of wanting with one-handed performance, the input mechanism such as audio control switch can be arranged in and point maneuverable position when equipment is held in the palm.In addition, the output mechanism such as audio sockets can be arranged in the position that can not hinder gripping device, such as on the top of equipment.
In case arranged the parts of user interface, be connected to portable electric appts and allowed portable electric appts that the apparatus operating parts can be encapsulated in enclosure for its expectation function.The example of internal unit parts can comprise loudspeaker, microphone, have the main logic plate of processor and storer, non-volatile memory apparatus, data and power interface plate, display driver and battery.Required connector can provide certain dirigibility aspect the internal unit position component, as long as can have enough spaces between the parts.Also have, can adopt PCB or the approach the battery that available inner space can be used effectively such as custom-shaped.
In case user interface has been designed and internal part is encapsulated in the suitable compact housing, just can consider heat problem.Many internal parts produce heat.In order to prevent that heat from some zone accumulation and may damage internal part, may need mechanism to dissipate in inside and conduction heat.The compact design of these equipment may be almost to convection current cooling (that is, allowing air to circulate in equipment with heat radiation) leaving space.Therefore, may need other approach to handle inner cooling problem.
A kind of approach that solves the cooling problem can provide one or more be constructed to different interior location in the slave unit lead become popular with conduct heat to equipment in the structure of different interior location.Except being used to cooling, this structure can also be used to strengthen the architectural characteristic of equipment, such as the integral hardness that increases equipment.In a particular embodiment, described be designed to satisfy with the design of portable electric appts with operate the relevant thermal limit and the inner frame of structural limitations.Inner frame can be constructed to conduct and the heat of generation in the enclosure that dissipates.In addition, inner frame can be constructed to increase the bulk strength of equipment.
Hereinafter with reference Figure 21 A-26 discusses to Thermal structures design and their uses in portable electric appts of these inner frames.But those skilled in the art will recognize easily that this paper is for task of explanation with reference to the given detailed description of these accompanying drawings, and should not be construed as restrictive.Particularly, with reference to Figure 21 A-21D, the unitary construction of portable electric appts has been described.Equipment can comprise the inner frame that possesses the capacity of heat transmission, and this inner frame is constructed to satisfy thermal limit and the structural limitations relevant with operation with the design of discussion equipment.In Figure 22 A-22C, the various embodiment of inner frame have been illustrated and have discussed.With reference to Figure 23 A and 23B, inner structure relevant with inner frame and material have been described.With reference to Figure 24 A, 24B and Figure 25 coupling and relevant manufacture method of inner frame and various device parts has been discussed.At last, with reference to Figure 26 the portable computing device that is constructed to media player has been described.
Figure 21 A and 21B show top view and the backplan according to the portable electric appts 210 of described embodiment.Equipment 210 can comprise the housing 2100 around display 2104.Housing 2100 can design the profile of relative thin.Housing 2100 provides opening 2108, and display 2104 is arranged in this opening 2108.Lid glass 2106 is arranged on the display 2104.Lid glass 2106 helps sealed open 2108.Equipment 210 can comprise the touch-screen (not shown) that is associated with display.
The very major part of the top surface areas of equipment 210 is shown device 2104 and occupies.This part as required can be littler and bigger.And the part that is used for display can be according to equipment and difference.In certain embodiments, equipment 210 even can not comprise display.
As previously mentioned, the parts in the user interface that display 2104 can be with equipment 210 is associated.Serve the diverse location of miscellaneous equipment component distribution on the housing 2100 of equipment 210 of the integrated operation of user interface or equipment 210.The layout of these parts may influence inner encapsulation, and therefore influences the position of the heat generating components in the equipment.
As an example of the disposed outside of part of appliance, load button 2114 is positioned on the front surface.In one embodiment, load button 2114 can be used to receive indicate and want to allow equipment return the input of certain particular state (such as " main interface (home) " state).Volume switch 2112 can be positioned on the side of housing 2100, and this volume switch can be used to regulate and the relevant volume of implementing on equipment of various voice applications.Power switch 2110 is positioned on the top side of equipment 210, and audio sockets and the opening that is used for data/power connector are positioned at the bottom side relative with the top side of housing 2100.The bottom side of housing 2100 comprises the hole.The camera lens 2115 of camera can be arranged in the hole.
Figure 21 C shows the block diagram of equipment 10.Display 2104, battery 2132, touch-screen 2122, wireless communication interface 2126, display controller 2120 and acoustic component 2124(for example, loudspeaker) all can be couple to main logic plate (MLB) 2105.Equipment 210 can comprise such as other parts (not shown) such as Sim card, microphone and nonvolatile memories, and be not limited to the parts shown in Figure 21 C.MLB2105 can comprise processor and storer.Processor and storer can be carried out various programming instructions and realize various functions with permission equipment.Aforesaid user interface can be considered to allow the user to select and adjustment equipment 210 on available various functions.In a particular embodiment, these functions can be used as the at user option application program on the equipment of being stored in and are provided.
Figure 21 D shows the sectional view according to the portable electric appts 210 of described embodiment.Shell can be made of top glass 2106 and housing 2100.Can there be other suprastructure and described embodiment to be not limited to this example.As shown in Figure 21 D, housing 2100 can provide the cavity that is covered by top glass 2106.Housing 2100 can comprise outside surface and inside face, and the in-profile 2117 of inside surface can be different with the exterior contour of housing 2100.
In shell (such as the shell that comprises top glass 2106 and housing 2100), be packaged with various internal unit parts, such as the part of appliance that is associated with user interface, equipment 210 can be worked for its expectation function.For the purpose of discussing, can consider the internal unit arrangements of components in a plurality of layers that pile up.The height of each layer can be stipulated with respect to the integral thickness 2136 of equipment in the layer that piles up.For example, the height of the mid point of top glass 2106 (middle) can be defined as first mark of integral thickness 2136 (first fraction), and the height of battery 2132 can be defined as second mark of integral thickness 2136.
The display screen of display 2104 can be positioned at the direct below of top glass 2106.In one embodiment, display screen and relevant display driving circuit thereof can be encapsulated in together the part as display 2104.Circuitry 2130(such as main logic plate or the circuit that is associated with other parts) and be that the battery 2132 that equipment 210 is powered can be positioned under the display 2104.
As mentioned above and shown in Figure 21 D, thereby internal part may almost be realized the effectively path leaving space of cooling via air circulation for the internal part of heating for allowing by compact package.Another kind of can in conjunction with or the alternative convection current air approach that cools off the processing internal heat problem of using be that the contiguous thermal source of Heat Conduction Material is placed.Heat Conduction Material can absorb heat and heat is led away from the internal heat resource such as the internal unit parts of heating, to be reduced near the temperature the thermal source during the operation of equipment.
In one embodiment, Heat Conduction Material can be incorporated in the inner structure that is associated with equipment 210, in inner frame 2140.Inner frame 2140(is described in more detail with reference to following accompanying drawing) can be constructed to heat is led away and increased from one or more part of appliance the bulk strength of equipment.For example, inner frame 2140 can be constructed to the integral hardness of increase equipment 210, such as the ability of the bending moment that stood of opposing housing 2100.
In Figure 21 D, inner frame 2140 be positioned under the display 2104 and circuitry 2130 on a certain height place.Inner frame 2140 can be set at this position so that the heat that display circuit was produced is siphoned away.In addition, the one or more thermals source relevant with circuitry 2130 can be positioned as contiguous inner frame 2140, and are inner and led away from thermal source to allow heat from these parts to be transmitted to inner frame 140.
Other packaging structure is possible.Therefore, in other embodiments, inner frame 2140 can be positioned at different height places with respect to the integral thickness 2136 of equipment, and can be positioned as contiguous different parts of appliance.In addition, can comprise a plurality of frameworks such as the equipment of equipment 210, and described embodiment is not limited to use single inner frame 2140 such as framework 2140.
In one embodiment, inner frame 2140 can be used as the attachment point of miscellaneous equipment parts.For example, inner frame 2140 can or use cement and is attached to installation surface (such as 2134a and 2134b) on the housing 2100 via securing member.Then, the miscellaneous equipment parts such as display 2104 can be couple to inner frame 2140 rather than directly be couple to housing 2100.With display 2104 via the advantage that inner frame 2140 is couple to housing be, display can be to a certain extent isolated with the bending moment relevant with housing 2100, that is, the bending moment that produces on housing can be dissipated in the inner frame 2140.Display 2104 and the bending moment isolation relevant with housing 2100 can be prevented damage to display 2104, such as breaking.
Figure 22 A and 22B show according to the top 2142a of the inner frame 2140 of described embodiment and the view of bottom 2142b.In one embodiment, inner frame can be formed by the sheet material of multilayer, such as the sheet material that comprises a plurality of metal levels (see Figure 23 A and 23B, it shows the cross section of the inner frame 2140 that comprises its different layers).In a particular embodiment, inner frame 2140 can be clipped in by the middle layer that makes first material between two exterior layers of second material and form.The material that is used for middle layer and exterior layer can be selected according to their thermal characteristics (such as thermal conductivity) and/or strength characteristics.
In one embodiment, first material that is used for the middle layer can mainly be selected according to its thermal characteristics, and second material that is used for exterior layer can mainly be selected according to its strength characteristics.For instance, the middle layer of copper can be clipped in two-layer stainless steel (Iconel for example TM) between.The thermal conductivity of copper is Iconel TMAbout 25 times, and stainless steel more can be counter-bending more than copper, copper may be quite soft.In one embodiment, the middle layer can account for the about 50% of inner frame thickness, and each layer of exterior layer can account for about 25% of inner frame thickness.When the middle layer is copper and exterior layer when being stainless steel, this structure only kept the same thickness of making by stainless steel inner frame hardness about 94%.
Other combination of materials is possible, and embodiment described herein is not limited to copper and stainless combination.For example, also can adopt other metallic combination, such as aluminium and stainless steel.In addition, nonmetal and metal material or dissimilar nonmetallic materials can make up to form the inner frame such as inner frame 2140.
In a particular embodiment, the copper layer is clipped in two inner frames (such as inner frame 2140) between the stainless steel layer and can utilizes coating processing formation.In a kind of realization that coating is handled, can under high pressure a slice copper be pressed between two stainless steels so that these sheet material combinations.For instance, as the part that coating is handled, can utilize high pressure extruded sheet between two rollers.Handling the sheet material that forms via coating can be cut to form inner frame 2140 as shown in the figure.
In metallurgy, coating (cladding) is that different metals is combined.This is a kind of welding or bonding method that metal is tightened together of being different from.Coating usually can by utilize two kinds of metals of mould extruding and under high pressure sheet material is compressed or roll extrusion together.Coating is handled and by " metallurgy method " metal to be combined, produce can be annealed, the continuous strip of rolling and incision, to satisfy the terminal requirements of point-device electricity, calorifics and/or mechanical aspects.On one or two base metal surfaces, can provide coating to inlay or cover with the combination of noble metal or base metal.
Generally speaking, coating can refer to a deposition process, and in this deposition process, a kind of metal is coated with another kind of metal, or base material (it can be nonmetal) is coated with another kind of metal.In some coating were handled, metal can be fused in the substrate, for example handled by the laser coating.Thereby embodiment described herein is not limited to the coating processing that metal sheet under high pressure for example combines by roller.
For such as 2140 inner frame, wherein middle heat conductive layer is sandwiched between two exterior layers with much lower thermal conductivity, and exterior layer can comprise one or more holes, and middle heat conductive layer is exposed in described one or more holes.The hole can be set, and heat connects to allow to form between middle heat conductive layer and heat generating components better.In a particular embodiment, the surface of heat generating components can be connected to middle heat conductive layer via welding material or thermal conductive belt heat.Two-sided thermal conductive belt is often used in and is attached to the parts such as processor in the computer utility with heat sink.Among the described herein embodiment, thus two-sided thermal conductive belt or welding material can be used to the surface engagement of heat generating components to and heat be connected to inner frame 2140.
On inner frame 2140, the position in hole can be selected as near the heat generating components in the portable set.A plurality of hole 2150a-f are illustrated among the top 2142a and bottom 2142b of inner frame 2140.As shown in the figure, for the top 2142a and the bottom 2142b of inner frame 2140, the position in hole can be different.As shown in Figure 22 A and the 22B, be different from the hole site on the 2142b of bottom in the hole site on the 2142a of top.In addition, on the 2142a of the top of inner frame 2140, have than more hole on the 2142b of bottom.
On the whole, the position in the hole in the exterior layer of inner frame 2140 can and be that the selected inner encapsulation scheme of each equipment changes between distinct device to some extent according to the used heat generating components of each equipment.In one embodiment, the hole can only be positioned on the one side of inner frame, for example only on end face or bottom surface.In another embodiment, exterior layer can be heat conduction and the middle layer intensity can be provided, for example stainless steel layer is clipped between two copper layers.In this example, the hole in the exterior layer is unnecessary for the purpose that heat connects, because the surface of pyrotoxin can directly join the exterior layer of heat conduction to.
Figure 22 C shows the top view according to the inner frame 2160 of described embodiment.In one embodiment, inner frame 2160 can comprise one or more holes that pass completely through inner frame 2160, such as hole 2162.These one or more holes can be used to placing component, such as the connector that passes inner frame 2160.In addition, the hole that passes completely through framework 2160 can be set so that inner frame 2160 is fastened to another parts, the apparatus casing of describing such as reference Figure 21 A, 21B and 21D 2100.
As above described with reference to Figure 22 A and 22B, inner frame 2160 can comprise the hole in one or more exposure solids middle layer in its exterior layer.In one embodiment, the hole can be filled with the material identical or different with the material that is used for the middle layer.Hole 2150a is example in the hole of having filled.In another embodiment, the hole can not be filled, and therefore might exist slight depression or cavity to expose middle heat conductive layer in the place that the hole is set.Hole 2164 is examples that form the hole of cavity in the exterior layer of inner frame 2160.
In one embodiment, can be provided with hot tie-in device such as 2166 projection.The hot tie-in device 2166 of projection can be formed by the Heat Conduction Material such as copper.The hot tie-in device 2166 of projection can be used for and will be positioned at the heat-conducting layer that certain is highly located on the inner frame 2160 thermal source heat is connected to inner frame, for example middle layer.Can use this hot tie-in device when heat generating components is positioned at a distance, hot tie-in device top of projection, wherein this distance can not utilize direct welding to provide heat to connect too greatly.In one embodiment, Tu Qi hot tie-in device 2166 can be via such as 2168 outer insulative layer and thermal insulation.
In a particular embodiment, Tu Qi hot tie-in device 2166 can be couple to inner frame 2160 after it forms.For example, Tu Qi hot tie-in device 2166 can weld or cement on the inner frame 2160.In one embodiment, when the hole being set when exposing the heat conduction middle layer in the layer externally, the hot tie-in device 2166 of projection can be arranged on one of these positions and locate, the surface heat of heat-producing device parts is connected to the middle layer of device framework via connector.The example of the hot tie-in device of the projection of laying by this way also has description when reference Figure 24 B.
Figure 23 A-23B shows the sectional view of inner frame, for example can be used to such as 2150 or 2160(with reference to Figure 22 A-22C inner frame 2150 and 2160 has been described) inner frame in the cross section.In Figure 23 A, show and comprise three layers cross section.These three layers comprise exterior layer 2170a and 2170b and are arranged in middle layer 2172 between these two exterior layers.
The thickness of each in middle layer and the exterior layer can change.In one embodiment, the thickness of each exterior layer can be roughly the same.In another embodiment, the thickness of each exterior layer can be different.The thickness in middle layer can be same as or be different from each the thickness in two exterior layers.In a particular embodiment, the thickness of each in two exterior layers is roughly the same, and the combination thickness of two exterior layers is substantially equal to the thickness in middle layer.
Every layer thickness can change to adjust intensity, weight and/or the thermal characteristics of inner frame.For instance, stainless steel layer can be made thicklyer in to increase the bulk strength of inner frame.In another example, the copper layer can be made thicklyer in to increase the hot material of inner frame.
The first hole 2171a can be arranged among the exterior layer 2170a of top, and the second hole 2171b can be arranged among the end exterior layer 2170b.Hole 2171a among the exterior layer 2170a of top is shown as and is not filled, thereby adjacent bores forms areola.Externally the hole 2171b among the layer 2170b is shown as and is filled with and the middle layer identical materials.The certain methods of filling such as the hole of 2171b will be described hereinafter.
In one embodiment, hole 2171b can completely or partially be filled in the coating processing procedure.For example, exterior layer and middle layer can be pressed together fully, make the part in middle layer reach in the hole.In another embodiment, the hole can be filled after coating is handled.The hole can be filled with the material identical or different with the material in middle layer.For example, the cavity that is formed with holes can be filled with welding material, and it is for middle layer 2172 heat being connected to the surface of heat generating components that described welding material is set.As another example, inner frame can immerse in the another kind of material, to fill one or more holes.
Figure 23 B shows another embodiment in the cross section that can be used to inner frame.In this embodiment, middle layer 2172 is sandwiched between two exterior layer 2170a and the 2170b.But the part in middle layer 2172 is isolated with another part heat in middle layer to a certain extent.The heat isolation is illustrated by the material 2173 that extends to 2170b from top layer 2170a.
In certain embodiments, may wish to reduce the coefficient of overall heat transmission between another part of the part of inner frame and inner frame.This can realize by placing to have than the material of low heat conductivity between two parts in heat conduction middle layer.For example, middle layer 2172 can be made up of two or more independent material strips, and described material strips is sandwiched between the sheet material that comprises exterior layer.In the coating processing procedure, in the space between material strips, exterior layer can be pressed together so that top layer is linked to each other with bottom, and is provided at the coefficient of overall heat transmission that reduces between the part in middle layer 2172.Similar processing as described above can be used to heat and connect two layers.For example, in Figure 23 B, if top layer is a Heat Conduction Material, such as copper, and the middle layer is more athermanous material, such as the stainless steel that is formed by independent bar, then during coating is handled, top copper layer and bottom copper layer can be pressed together by the space in the stainless steel strip, so that heat connects top copper layer and bottom copper layer.
Figure 24 A-24B shows according to described embodiment, and heat is connected to the sectional view of the inner frame of a plurality of parts of appliance.Represent that by arrow heat transfer enters the typical directions in middle layer.In Figure 24 A, different parts of appliance is shown as the cross section that is connected to the inner frame shown in Figure 23 A.In this example, the middle layer 2172 of inner frame can be formed by Heat Conduction Material, and such as copper, and exterior layer can be formed by the material bigger than copper intensity, such as stainless steel.The hole externally is set to expose the middle layer, so that permission forms better heat connection between the surface of the heat generating components in middle layer and contiguous each hole in the layer.
In Figure 24 A, controller circuitry 2186 can be positioned at top layer 2170a top.For example, controller circuitry 2186 can be a display circuit, as reference Figure 21 D is described.PCB2180 can be positioned at the inner frame below.PCB2180 can comprise a plurality of parts, such as 2182a and 2182b.In one embodiment, PCB can be the main logic plate that comprises processor and storer.
Externally the hole 2171a of layer among the 2170a can be positioned under the high thermal region 2188 relevant with controller circuitry 2186.Hole 2171a does not fill.Heat bridge 2184b such as welding material can be used for providing between the surface of circuitry 2186 and middle layer 2172 heat to connect.May wish to use heat bridge, be transmitted in the middle layer to prevent heat because insulator can be served as in the clearance between high thermal region and the heat bridge.Reserve the cavity that to place heat bridge and can allow controller circuitry to be placed more close inner frame, because do not need other space between the surface of inner frame and controller circuitry to be used for heat bridge.During operation, the heat that produces in high thermal region 2188 can be transmitted in the middle layer 2172, and leads away from high thermal region 2188.Therefore, the temperature of being close to high thermal region can be lowered via inner frame.
Externally the hole 2171b among the layer 2170b is filled.Between the surface of PCB parts 2182a and middle layer 2172, heat bridge 2184a is set.Because hole 2171b is filled and do not provide heat bridge can be positioned at wherein cavity, heat bridge 2184a may increase the space between PCB parts 2182a and the inner frame.In one embodiment, heat bridge 2184a can be a heat-conductive bonding agent, such as double-faced adhesive tape.
In the time of near heat bridge 2184a is used in such as the hole of 2171b, heat bridge 2184a can be greater than or less than the area in hole.In the example in Figure 24 A, heat bridge is shown as greater than hole 2171b.The area of heat bridge (such as 2184a) can be selected as guaranteeing that the operating period at equipment keeps suitable joint.
As shown in Figure 24 A, have only some parts (such as producing the parts of heat at most) of PCB heat to be connected to inner frame, and produce the not hot inner frame that is connected to of parts of less heat.In order to illustrate this point, PCB parts 2182a is shown as heat and is connected to inner frame, is not connected to inner frame and PCB parts 2182b is shown as heat.According to the quantity of the design of specified panel and the parts that are associated thereof, the one or more parts that are associated with plate can heat be connected to inner frame.
In Figure 24 B, show the sectional view that heat is connected to the part of appliance of inner frame.In the illustrated cross section, the top layer 2170a of inner frame comprises two holes that expose heat conduction middle layer 2172 in Figure 24 B.Bottom 2170b does not comprise any hole in this cross section.On top layer 2170a, a hole of contiguous heat bridge 2194 is filled and another hole of contiguous heat bridge 2196 is not filled.The PCB2190 that comprises PCB parts 2192 is positioned on the inner frame.Another part of appliance 2195 that is not associated with PCB2190 is shown as and is positioned on the PCB2190.
Pcb board is oriented and makes the heating surface of PCB parts towards inner frame.When adopting the heat conduction inner frame, such as other internal part of PCB towards/position can be adjusted so that the surface relevant with heat generating components can heat be connected to inner frame.In addition, the hope of wanting to help part of appliance on the PCB and the heat between the inner frame to connect also can become a factor in the PCB design, that is, part of appliance can be disposed on the PCB, makes to realize that easily heat connects.
In Figure 24 B, it is heat generating components for PCB parts 2192() the surface be shown as the middle layer 2172 that is connected to inner frame via heat bridge 2194 heat.In addition, parts 2195(its also be heat generating components) the surface be shown as the middle layer 2172 that is connected to inner frame via hot tie-in device 2198.Hot tie-in device 2198 is couple to the surface of middle layer 2172 and part of appliance 2195 via heat bridge 2196.As top described with reference to Fig. 2 C, hot tie-in device 2198 can comprise the outer insulative layer of surrounding heat conduction core.In this example, hot tie-in device 2198 is shown in the surface level top extension of PCB2190 to arrive heat generating components 2195.
Figure 25 is according to described embodiment, makes the process flow diagram of the method 2200 of the portable electric appts with inner frame, and wherein said inner frame is designed to have the particular thermal architectural characteristic.2202, can construct the inner frame that comprises a plurality of material layers.Construction process may relate to the intensity and the thermal characteristics of thickness and desired each layer of the quantity of selecting layer, each layer.The intensity and the thermal characteristics of desired each layer may influence the selected material of each layer.
In an embodiment, the layer of selecting owing to its thermal characteristics is sandwiched between two exterior layers, and these two exterior layers are selected for the intensity that increases inner frame, externally the one or more holes of structure in the layer.These holes can be provided, and heat connects to allow forming better between the heating surface of the middle layer of inner frame and internal unit parts.2202, can determine the layout in these holes.
In 2204, can form inner frame with selected hole site, thermal characteristics and strength characteristics.In one embodiment, inner frame can utilize coating to handle formation.2206, in the assembling process of electronic equipment, the surface that is associated with heat generating components in the electronic equipment can heat be connected to inner frame.2208, inner frame can mechanical attachment to the housing of electronic equipment.2210, one or more parts of appliance can mechanical attachment arrive inner frame.
Figure 26 is the block diagram according to the media player 2300 of described embodiment.Media player 2300 comprises processor 2302, and it belongs to whole microprocessor operating or the controller that is used to control media player 2300.Media player 2300 is stored the media data about media item in file system 2304 and high-speed cache (cache) 2306.Typically, file system 2304 is memory disk or a plurality of dish.Typically, file system provides the high capacity storage capacity for media player 2300.But because relatively slow to the access time of file system 2304, media player 2300 also comprises high-speed cache 2306.High-speed cache 2306 for example is the random access storage device (RAM) that is provided by semiconductor memory.Relative access time of high-speed cache 2306 is shorter than access time to file system 2304 greatly.Yet high-speed cache 2306 does not have the large storage capacity of file system 2304.
In addition, file system 2304 can consume than high-speed cache 2306 when activating and more many power.When media player 2300 was portable electronic device by battery (not shown) power supply, power consumption was even more important.
Media player 2300 also comprises user input device 2308, and it allows the user and the media player 2300 of media player 2300 mutual.For example, user input device 2308 can be taked various ways, such as button, keypad, rotating disk etc.In addition, media player 2300 comprises display 2310(screen display), display can be by processor 2302 control with to user's display message.Data bus 2311 can help the data transmission between file system 2304, high-speed cache 2306, processor 2302 and codec (CODEC) 2312 at least.
In one embodiment, media player 2300 is used in file system 2304 storage a plurality of media item (for example song).When the user wanted the media renderer plays certain media items, the tabulation of available media items can be presented on the display 2310.Subsequently, utilize user input device 2308, the user can select one of available media items.After the selection that receives certain media items, processor 2302 offers encoder/decoder (codec) 2312 with the media data (for example, audio file) of certain media items.Codec 2312 produces the analog output signal that is used for loudspeaker 2314 then.Loudspeaker 2314 can be loudspeakers media player 2300 inside or media player 2300 outsides.For example, headphone or the earphone that is connected to media player 2300 is considered to external loudspeaker.
In certain embodiments, the part of appliance such as display can mechanical attachment and heat be connected to inner frame.In some other embodiment, part of appliance can mechanical attachment to inner frame but the not hot inner frame that is connected to.In other embodiment, part of appliance can heat be connected to inner frame and be mechanically fixed to housing via other structure member.
In a particular embodiment, portable computing device can utilize computer-aided manufacturing and assembling process to assemble.Computer-aided manufacturing and assembling process may relate to the use of a plurality of equipment (such as a plurality of equipment that dispose) in the assembly line structure.For example, the area of computer aided machine can be configured to by removing material or formed the hole in sheet material after coating is handled before handling at coating, and in diverse location formation hole.As another example, the robot device can be configured to such as by welding technology heat generating components heat being connected to inner frame.
Synthetic microphone storehouse is to optimize sealing and mechanical attributes
In the consumer-elcetronics devices such as portable computing device, the SoundRec ability is quite general.So equipment typically comprises the microphone of a certain type.Usually, microphone uses in voice application, such as digital telephone, IP phone (VOIP) and voice memo.The videograph that microphone also can write down view image and sound at the same time uses in using.
Microphone can be positioned in the inner space of electronic equipment.For example, in having the portable computing device of housing, be provided with the built-in microphone that is configured to receive sound via the hole in the housing.Can be separated by a distance between built-in microphone and the hole.So the microphone storehouse can be used to provide the sound tube between hole and the built-in microphone.
In portable computing device, can expect to avoid by inside produce or sound by wherein with mix via the sound that the hole the housing enters the microphone storehouse from external source.For example, if equipment comprises internal loudspeaker, the sound compacting that then can expect to avoid being produced in inside by loudspeaker is by the sound of microphone through the generation of the outside of microphone storehouse reception.In addition, under the situation that the sound that generates in the outside that enters the microphone storehouse and other source of sound acoustics are isolated, method that then can more easy use such as echo cancelltion.In telephone communication, echo cancelltion has been described and removed the process that echo is improved the voice quality of call thus from voice communication.The echo cancelltion application can be known acoustic enviroment, such as the acoustic enviroment in the microphone storehouse, and easier being determined under this situation of being isolated by acoustics in the microphone storehouse.
The acoustics of inside, microphone storehouse is isolated and can be formed the microphone storehouse by the material by relative sound insulation and realize by provide good air-tightness to seal at two ends, microphone storehouse.Sealing integrity can be influenced by one or more materials that are used to form the microphone storehouse and the method that is used for fixing the microphone storehouse.For example, the microphone storehouse can so that pressure maintained that sealing is gone up and help thus to keep the every end in microphone storehouse seal sealing integrity mode and be fixed.
Sealing integrity can be subjected to forming the influence of relative hardness of the material in microphone storehouse.The advantage of relatively hard materials is and can provides good platform for set up sealing at the every end in microphone storehouse place.The outside generative power of the power that generates when the inferior position of relatively hard materials is its easier will falling such as equipment is delivered to device interior.If the power by the transmission of microphone storehouse is excessive, then might damage the internal part of portable computing device.In view of above-mentioned, microphone as described below storehouse design will utilize the advantage of the improved sealing property that relatively hard materials can provide, and take into account simultaneously and the shock transfer attribute that uses relatively hard materials to be associated.
In more detail, referring to Figure 31 A-36C, the synthetic microphone storehouse than the combination of soft material that can utilize the relatively hard materials selected at its sealing property and select at its damping performance has been described.But those skilled in the art will recognize easily that this paper is for task of explanation with reference to the given detailed description of these accompanying drawings, and should not be construed as restrictive.More specifically, will describe use hard and than the embodiment in the synthetic microphone storehouse of the combination of soft material with reference to figure 31A-31C.With reference to figure 32A-32B, the example of incorporating into as several installation sites in the synthetic microphone storehouse of a microphone assembly part has been discussed.In Figure 33 A-33B, then show microphone assembly at pre-installation and installed position.Between installation period, the microphone storehouse can be fixed to push the mode of improving sealing integrity thus.To the transmission of operating period external force by the microphone storehouse be described with reference to figure 33C.With reference to figure 34A-43C, the different embodiment in the synthetic microphone storehouse that comprises various dimensions and material are discussed.The method of making the portable computing device that comprises synthetic microphone storehouse has been described with reference to Figure 35.At last, 36A-36C has discussed the skeleton view and the block diagram that can comprise the portable computing device that synthesizes the microphone storehouse with reference to the accompanying drawings.
Figure 31 A-31C shows and comprises microphone 3106, circuit board 3104 and such as the microphone assembly 3100 in the microphone storehouse of 3102a, 3102b and 3102c.Microphone 3106 is shown as and is coupled to circuit board 3104.In a particular embodiment, circuit board can be formed by rigidity or flexible substrates.Microphone storehouse such as 3102a, 3102b and 3102c then can comprise each surface that centers on chamber 3112.Chamber 3112 can be used as sound tube.For example, as mentioned above and will be described in further detail with reference to figure 32A and 32B, in portable computing device, chamber 3112 can be coupled to hole in the housing by acoustics, sending into the sound tube of built-in microphone as the sound of the source generation that portable computing device is outer.
The microphone storehouse can comprise inner surface profile and outer surface profile.Inner surface profile provides the boundary of inner chamber 3110a.Shown in Figure 31 A, microphone storehouse 3102a is columniform.In this example, outer surface profile 3108a and inner surface profile 3110a can roughly be described as two concentric cylinders.Top surface 3111 and the basal surface of microphone storehouse 3102a can general planar.
The inner surface profile in microphone storehouse and outer surface profile are not to be made of concentric shape.Generally speaking, outer surface profile and inner surface profile can differ from one another, and can be shaped to have the shape that can change from the top surface to the basal surface arbitrarily separately.For example, chamber 3112 can be wideer and narrower in the bottom at the top.In addition, chamber 3112 can have a kind of shape and have another kind of shape in the bottom at the top.In addition, in a specific embodiment, the crooked route by inside, microphone storehouse can be followed in chamber 3112.
For example, the outer surface profile microphone storehouse 3102b different with inner surface profile has been shown among Figure 31 B.Microphone storehouse 3102 comprises the outer surface profile 3108b of columniform inner surface profile 3110b and rectangle.In another example, this shape profile can be just in time opposite, so that inner surface profile 3110b is a rectangle and outer surface profile 3108b is cylindrical.Be similar to the example of Figure 31 A, top surface 3111 and basal surface are smooth.
In each embodiment, one of the top surface in microphone storehouse and basal surface or both can be crooked.For example, in Figure 31 C, show the microphone storehouse 3102c that comprises crooked top surface 3111a and emerge.Microphone storehouse 3102c comprises the inner surface profile 3110c of rectangle and the outer surface profile 3108c of rectangle.
In certain embodiments, the top surface in microphone storehouse (such as 3111a) can combine with the crooked inner surface of apparatus casing.In order to improve sealing integrity, useful is the top surface of shaping such as 3111a, so that its curvature is complied with the curvature of shell inner surface more or less.For example, the top surface bending will obtain more equal top surface pressure distribution with the inside surface of complying with housing, improve sealing integrity thus.In other embodiments, the microphone storehouse that has planar top surface can be bonded to crooked inner surface, and the microphone storehouse that perhaps has crooked top surface can be bonded to flat inner surface.In this embodiment, the smooth or crooked top surface in microphone storehouse can use force of compression (that is, by compression microphone storehouse) to make to comply with inside surface.
In Figure 31 A-31C, the top surface of microphone 3106 is shown as microphone storehouse smooth and that have an emerge and is shown as with the planar top surface of microphone and combines.In other embodiments, the top surface of microphone 3106 can tilt or be crooked, then can tilt as required to comply with the top surface of microphone more or less such as the basal surface in the microphone storehouse of 3102a, 3102b and 3102c.As mentioned above, the sealing integrity between the top surface of the basal surface in microphone storehouse and microphone can be improved in the microphone storehouse that is shaped in this way.
In other embodiments, the top surface of the basal surface in microphone storehouse and microphone can differently be shaped.For example, the top surface of microphone can be crooked, and the basal surface in microphone storehouse can be smooth.The bottom in microphone storehouse can be made by compressible material, and when the emerge in microphone storehouse was pressed against on the curved surface of microphone, the emerge in microphone storehouse can be complied with the crooked top surface of microphone thus.
As mentioned above, microphone assembly can be installed in equipment (such as, portable computing device) inside.Microphone assembly and the microphone storehouse that is associated thereof can be positioned so that it aligns with the hole in the housing, and provide sound tube between hole and microphone.The hole can be positioned at each position on the outside surface of equipment.The layout in hole can influence the position and the orientation in microphone storehouse.Followingly will two examples that have the microphone assembly of different orientations in the band portable computing device be described with reference to figure 32A and 32B.
In Figure 32 A and 32B, comprise that the microphone assembly in microphone 3106, circuit board 3104 and microphone storehouse 3102 is shown as housing 3120 inside that are positioned at portable computing device.Housing 3120 is roughly rectangular.The outside surface of housing 3120 comprises outer surface profile 3120a and inner surface profile 3120b.Outer surface profile 3120a and inner surface profile 3120b can be shaped with differing from one another.For example, outside surface 3120a can be smooth in a zone, and corresponding interior zone then is crooked.Near the microphone storehouse inner surface configuration can influence the sealing integrity of the seal between microphone storehouse and the inside surface.As mentioned above, in certain embodiments, the top surface in microphone storehouse can be shaped to comply with the shape of shell inner surface, improves sealing integrity thus.Sealing integrity is important, because good gas-tight seal can help the acoustics of the sound tube of inside, microphone storehouse to isolate.
In Figure 32 A, microphone storehouse 3102 is shown as upwards directed, and aligns with housing along axle H from top to bottom in the chamber in the microphone storehouse.In this embodiment, the top cover such as lid glass can be placed on the opening of housing 3120.An embodiment of the portable computing device of the housing that comprises body glass with cover has been shown among Figure 36 A.Top cover can comprise the hole.Between installation period, microphone assembly is disposed in the housing, makes the top surface in microphone storehouse and hole in the top cover be in it and aligns the position the during installation site.Subsequently, when top cover was mounted, the basal surface of top cover can combine with the top surface in microphone storehouse, generated sound tube via the microphone storehouse between the hole of top cover and microphone thus.
In another embodiment, can comprise the hole 3122 that is used for such as 3106 microphone such as 3120 housing.In Figure 32 B, housing 3120 is shown near the sidepiece of its corner has hole 3122.Microphone 3106 is shown as the location so that the top surface of microphone is roughly parallel with sidepiece with holes with circuit board with circuit board 3104, and the opening in microphone storehouse 3102 aligns with this hole.The sound tube that is associated with the microphone storehouse is roughly alignd with axle W.
Other orientations in microphone assembly and microphone storehouse also are possible, and are not limited to the orientation shown in Figure 32 A and the 32B.For example, in one embodiment, the top surface in microphone storehouse 3102 can combine with near the shell inner surface the hole 3122, to form sound tube.Subsequently, can adjust the orientation of circuit board and microphone, so that microphone storehouse and internal pipeline thereof are slight curving in some way.The microphone storehouse can be by the flexible material structure to realize bending.Might not wish that the microphone storehouse is crooked above a certain definite limit, thereby avoid the possible hoop of microphone storehouse internal sound pipeline disconnected.
In other embodiments, can provide crooked microphone storehouse.For example, can construct the microphone storehouse that is similar to pipe bend.Can provide this pipe bend by the curved shape of a certain angular bend with ancon.Crooked microphone storehouse can allow the oriented phase of microphone and printed circuit board (PCB) to change for housing, and this may expect for the encapsulation reason.Followingly will the more details that microphone storehouse 3102 are attached to housing 3120 be described with reference to figure 33A and 33B.
Figure 33 A-33B shows the side view that is in the microphone assembly of pre-installation site and installation site in housing respectively according to described embodiment.In Figure 33 A, show the sectional view in microphone storehouse 3102.Hole 3121a in one end in microphone storehouse 3102 and the housing 3120 aligns, and second end in microphone storehouse then aligns with microphone 3106.So, form sound tube via the microphone storehouse between hole 3121a and the microphone 3106.
First seal 3122 can form between the top surface of the basal surface in microphone storehouse 3102 and microphone 3106.3124 of second seals can form between the inside surface of the top surface in microphone storehouse 3102 and housing 3120, so that the hole of this microphone storehouse in the housing 3120.In one embodiment, first seal and second seal use the bonding agent such as contact adhesive (PSA) to form.PSA can provide as double faced adhesive tape.In another embodiment, first seal 3122 or second seal 3124 can use liquid adhesive to form.
In one embodiment, microphone 3106 and circuit board 3104 can be provided for the microphone storehouse 3102 that has been attached to microphone 3106.In another embodiment, during device assembles, microphone 3106 and circuit board 3104 can be used as the parts that separate with microphone storehouse 3102 and provide.Under the situation that microphone storehouse and microphone provide as separate parts, microphone storehouse 3102 can at first be attached to microphone 3106, and is being attached to the inside surface of housing 3120 subsequently, and perhaps vice versa.Attach procedure can relate on each end in microphone storehouse arranges other sealed binder of PSA or some.
After aliging with the hole 3121a of housing and form initial the combination between microphone storehouse and enclosure interior in microphone storehouse 3102, can apply force of compression to the microphone storehouse, such as 3130a and 3130b.Force of compression can be in microphone storehouse 3102, generate when microphone 3106 and circuit board 3104 fix in position.For example, can use such as one or more securing members of screw circuit board 3104 is fixed near other structure of housing 3120 or some.In place along with screw can generate force of compression on microphone storehouse 3102.Force of compression can be used to any air pocket around seal is extruded, thereby can improve the sealing integrity of seal.
Shown in Figure 33 A, housing 3120 can be crooked near microphone storehouse 3102.So force of compression can distribute unequally by the microphone storehouse.For example, will be in the force of compression on the sidepiece 3114a in microphone storehouse less than the force of compression on the sidepiece 3114b in the microphone storehouse.As mentioned above, in certain embodiments, microphone storehouse 3102 can be shaped to the force of compression that distributes more equably.For example, the top surface in microphone storehouse can tilt, and follows the curvature of the inside surface of housing 3120 thus.In other embodiments, the curvature that the top surface in microphone storehouse 3102 can not followed shell inner surface (for example, top surface can be smooth and inside surface can be crooked, shown in Figure 33 A), and force of compression can be used for oppressing the top surface distortion in microphone storehouse, thereby makes it comply with the inside surface of housing.
Height 3135 between the position of circuit board 3104 and housing is shown in Figure 33 A.After the installation, as shown in Figure 33 B, height 3135 can change.For example, height 3135 can reduce, and this can reduce with the height in microphone storehouse 3102 to be associated.The size that the amount that microphone storehouse height reduces can depend on its original size, be used to form the material in microphone storehouse and impose on the force of compression in microphone storehouse.
The bulging force 3140 that reduces to cause being transferred to the microphone storehouse of microphone storehouse height.Bulging force 3140 can push against seal 3122 and 3124, thereby can improve the sealing integrity of seal.For example, as mentioned above, force of compression can help to remove air pocket.The improvement of sealing integrity can realize the more excellent isolates sound characteristic of microphone storehouse internal sound pipeline.For example, along with seal becomes more airtight, can reduce the sound that penetrates into the microphone storehouse via the sound channel of housing 3120 inside.In one embodiment, the isolation of the acoustics in the sound tube in microphone storehouse can be about 40dB even bigger.
Figure 33 C shows the side view that applies the microphone assembly in the housing 3120 of power 3142 in response to the outside.Operating period, can stand the power that the outside applies such as the equipment of portable computing device, such as 3142.For example, equipment may fall, thus generative power.
The power that the outside applies can transmit by this equipment via various paths.Power such as 3142a can transmit by microphone storehouse 3102, then can be sent in microphone 3106 and the circuit board 3104 such as the power of 3142b.Power can transmit with dynamical fashion.For example, the microphone storehouse can be compressed, and can cause the change of height 3135c subsequently in response to power expands.The expansion in microphone storehouse and shrink can each inter-module of push-and-pull attached, attached such as between the seal 3122 and 3124 of microphone 3106 and circuit board 3104 and every side.
If the microphone storehouse is not appropriately designed, the expansion in microphone storehouse 3102 and contraction and might cause deterioration so such as the sealing integrity of 3122 or 3124 seal such as the bending of the miscellaneous part of circuit board 3104.In test, at some microphone storehouse design, find that the seal such as 3122 or 3124 can be drawn back, microphone 3106 can break away from from circuit board 3104, and perhaps circuit board can be damaged.In one embodiment, microphone assembly can designed to be able to and bear the acceleration that reaches 10000g ' s, and this has arranged the outside amplitude that applies power.
Test period find to use by softer and more compressible single microphone assembly of planting the microphone storehouse that material forms, and than the microphone storehouse that is formed by hard material more, (such as the vibrations that caused by unexpected acceleration) have higher resistibility to shock damage.Yet also finding can provide better sealing integrity, and provide better acoustics to isolate thus by singly planting microphone storehouse that hard material more forms than the microphone storehouse that is formed by soft material more.Yet, use the microphone assembly in the microphone storehouse that forms by hard material more to be easier to be given a shock infringement.
In order to utilize more the antidetonation attribute of soft material and the improved sealing property of hard material, can provide the design of synthetic microphone storehouse.The combination of hard material and soft material can be used in synthetic microphone storehouse.Relatively hard materials can be used for improving sealing integrity, then can be used for improving shock resistance than soft material.The following embodiment that has described the synthetic microphone storehouse of in microphone assembly, using with reference to figure 34A-34D.
Figure 34 A-34D shows sectional view such as 3200,3225 and 3235 synthetic microphone storehouse according to preferred embodiment.Top seal and lower seals are shown on each microphone storehouse and form.At Figure 34 A, show the top view in the microphone storehouse 3200 that comprises seal 3202a.Top view shows microphone storehouse 3200 and comprises circular open 3210 to internal path 3215, to form the sound tube by the microphone storehouse.The packing ring that is similar to seal 3202a can form at the top in microphone storehouse 3200.As mentioned above, inner surface profile and the outer surface profile such as 3200 microphone storehouse can change along with internal path.So the top view in microphone storehouse can depend on for outline and the selected surface topography of interior profile and changes.Seal 3202a can be designed to almost cover the top surface in microphone storehouse 3200.So the shape of seal 3202a can correspondingly change.
Return Figure 34 A, the microphone storehouse can comprise the first terminal cap moiety 3204a.The first end cap 3204a can be formed by first material, and has first thickness 3212.Hermetic unit 3202a can combine with the top of the first end cap 3204a.The second end cap 3204b can be positioned on the bottom in microphone storehouse.Second end cap can be formed by second material, and can have second thickness 3216.Thickness is that the centering portions 3206 in 3214 microphone storehouse can be placed between the first end cap 3204a and the second end cap 3204b.Centering portions can be formed by the 3rd material.First thickness 3212, second thickness 3216 and the 3rd thickness 3214 can differ from one another.
Hermetic unit 3202b can be bonded to the second end cap 3204b.As previously mentioned, hermetic unit 3202a can be bonded to a surface, such as the inside surface of housing.Hermetic unit 3202b can be bonded to a surface, such as the top surface of microphone.Hermetic unit 3202a and 3202b can be formed by identical or different material.For example, hermetic unit can or have two kinds of different PSA to form by identical PSA.
In a particular embodiment, second material that is used for first material of the first end cap 3204a and is used for the second end cap 3204b can be selected according to the ability that they improve sealing integrity, and the 3rd material of centering portions 3206 then can be selected according to its damping performance.As mentioned above, use hard material can improve the sealing integrity that is associated with microphone storehouse seal (such as 3202a and 3202b), use the shock resistance that then can improve microphone assembly than soft material.So the material of selecting to be used for first end cap and second end cap can be formed to improve sealing integrity by relatively hard materials, centering portions then can be by forming to improve shock resistance than first end cap and the softer and more compressible material of second end cap.In one embodiment, first end cap and second end cap can be formed by duroplasts, and centering portions can be formed by the softer plastics of ratio end cap such as silica-based plastics.
In a specific embodiment, the first end cap 3204a and the second end cap 3204b can be made by first relatively hard materials, and centering portions then can be made than soft material by second.She Ji microphone storehouse is can be during the dijection Shooting Technique whole in this way forms, and wherein uses first material in a shot and use second material in biphasic injection.First material and second material can be selected so that two materials are combined together during the dijection Shooting Technique.In other embodiments, the first end cap 3204a, the second end cap 3204b and centering portions 3206 can be formed respectively, such as die-cut, and are being bonded together in some way to form the microphone storehouse subsequently.
In one embodiment, the first end cap 3204a and the second end cap 3204b can have the shape about equally of same thickness.Yet the thickness 3214 of centering portions can be different.In other embodiments, first end cap and second end cap can differently be shaped.For example, in Figure 34 B, show the first end cap 3228a and the variform microphone of second end cap 3228b storehouse 3225.The microphone storehouse comprises centering portions 3230, and can select to be used for the material of centering portions 3230, the first end cap 3228a and the second end cap 3228b, thereby improves sealing integrity and/or shock resistance in aforesaid mode.
The top surface of the first end cap 3228a can be by crooked or inclination someway.As mentioned above, the shape that can expect the first end cap 3228a roughly comply with its will in conjunction with the surface.For example, the shape of the first end cap 3228a can be complied with the crooked inner surface of housing, shown in Figure 33 A-33C.Seal 3226a and 3226b can be bonded to the first end cap 3228a and the second end cap 3228b respectively.Seal can be shaped to follow its will in conjunction with the surface.So seal 3226a can be crooked, to follow the shape of the first end cap 3228a, seal 3226b then is flat relatively, to follow the flat shape of bottom end cap 3228b.
In Figure 34 A and 34B, show the centering portions 3206 and 3230 in microphone storehouse with relative constant thickness.In other embodiments, the thickness of the centering portions in microphone storehouse can change.For example, in Figure 34 C, show the microphone storehouse 3235 of the variation in thickness of centering portions 3240.The microphone storehouse can comprise first end cap 3238a that has inclined upper surface and the second end cap 32238b that has planar bottom surface.Seal 3236a and 3236b can be attached to corresponding end cap respectively.Thickness at the second end cap 3238b shown in this example is constant relatively.
In Figure 34 C, the thickness of centering portions 3240 can be from thick attenuation.In addition, the thickness of first end cap 3238 then can be in the thickening of the place of centering portions 3240 attenuation and at the local attenuate of centering portions thickening.In other embodiments, interface between the centering portions 3240 and first end cap 3238a level and second end cap relatively can be made into thinner or thicker, so that the interface between the centering portions 3240 and the second end cap 3238b tilts, allow the variation of centering portions thickness profile thus.In another embodiment, the interface between interface between the first end cap 3238a and the centering portions 3240 and centering portions 3240 and the second end cap 3238b can all tilt in some way.
The thickness of the centering portions 3240 in microphone storehouse can change, and changes the distribution of microphone storehouse force of compression in it when being mounted thus.For example, the thickness of centering portions 3240 can change with the more uniform compression force distribution of generation, and the end cap that is provided as thus such as 3238a provides better sealing.In other embodiments, it is thicker or thinner that centering portions 3240 can be done in the specific region, to adjust these regional shock absorption properties.In some embodiment again, it is thicker or thinner that centering portions can be done in the specific region, generating preferred vibrations transmission path, such as the guiding vibrations away from more fragile regional and towards the path in more structure-reinforced zone.
In the synthetic microphone storehouse of describing with reference to figure 34A-34D, using multiple material to form should synthetic microphone storehouse.In one embodiment, shown in Figure 34 D, can use homogenous material for the microphone storehouse.Microphone storehouse 3245 comprises the centering portions 3250 of homogenous material.Seal 3246a and 3246b then are shown as and are attached to the microphone storehouse.If dampening effect can be to use being compensated someway beyond second vibration-absorptive material, then can select to use homogenous material, such as single relatively hard materials according to the ability that material improves sealing integrity.
In an example, the geometry in the microphone storehouse such as 3245 is adjustable to change its damping performance.For example, the projection such as 3250a can be set in microphone storehouse 3245, to help to disperse to transmit the vibrations of passing through the microphone storehouse.In another embodiment, thus can adjust microphone assembly in some way and improve its cushioning ability.For example, can in the means for attachment of microphone assembly, design the shock damping feature, perhaps can in microphone assembly, use more flexible circuit board to improve its damping characteristic.
Figure 35 is the process flow diagram 3300 that comprises the method for the portable computing device that synthesizes the microphone storehouse according to the manufacturing of preferred embodiment.3302, select the dimension and the material in microphone storehouse.For example, in the synthetic microphone storehouse that comprises the centering portions that places between two end caps, can determine at each end cap and the employed dimension of centering portions.Can select sealing integrity and the shock absorption properties of dimension to improve the microphone storehouse.In addition, the material that can select each parts to use.As previously mentioned, can also select sealing integrity and the shock absorption properties of material to improve the microphone storehouse.
Next, can form the microphone storehouse of concrete dimension of basis and material.In one embodiment, the microphone storehouse can be by the synthetic microphone storehouse of using integrally formed multiple material of Shooting Technique and parts to constitute.3304, the first in microphone storehouse can be formed by the shot of dijection Shooting Technique.3306, the second portion in microphone storehouse can be formed by another time injection of dijection Shooting Technique.Can use different materials for per injection.In other embodiments, can separately form the different piece in microphone storehouse, and after each parts forms, they be fitted together.
3308, this microphone storehouse can be attached to microphone.Microphone can be a part that comprises the microphone assembly of the microphone that is coupled to circuit board and microphone storehouse.3310, microphone assembly can be attached to the housing such as the electronic equipment of portable computing device, to form sealing between microphone and housing.In one embodiment, sealing can use contact adhesive to form.3312, when assembly is fixed, can compress this microphone storehouse by certain mode.Compression can change the dimension in microphone storehouse, and makes the microphone storehouse to its related seal application of force.The power that applies can be used to improve the sealing integrity of seal.
Figure 36 A and 36B show top view and the backplan according to the portable computing device 3400 of described embodiment.It is hand-held that portable computing device can be suitable for the user.Lid glass 3406 and display 3404 can be placed in the opening 3408 of housing 3402.Lid glass can comprise the opening that is used for input mechanism (such as load button 3414).In one embodiment, load button 3414 can be used to portable computing device is returned particular state, such as main interfacial state.
Can arrange other I/O mechanisms around the periphery of housing 3402.For example, can arrange power switch at the apical margin of housing such as 3410, and can be along an edge placement of housing such as 3412 volume switch.The audio jack 3416 and the data/power connector interface that are used to connect earphone or other audio frequency apparatuses then are positioned at the root edge of housing.This housing 3400 also comprises the hole of the camera 3415 that is used to allow receiving video data.
Figure 36 C is the block diagram according to the media player 3500 of described embodiment.Media player 3500 comprises processor 3502, and it belongs to whole microprocessor operating or the controller that is used to control media player 3500.Media player 3500 is stored the media data about media item in file system 3504 and high-speed cache (cache) 3506.Typically, file system 3504 is memory disk or a plurality of dish.Typically, file system provides the high capacity storage capacity for media player 3500.But because relatively slow to the access time of file system 3504, media player 3500 also comprises high-speed cache 3506.High-speed cache 3506 for example is the random access storage device (RAM) that is provided by semiconductor memory.Relative access time of high-speed cache 3506 is shorter than access time to file system 3504 greatly.Yet high-speed cache 3506 does not have the large storage capacity of file system 3504.
Further, when activity, file system 3504 consumes more electric power than high-speed cache 3506.When media player 3500 was portable electronic device by battery (not shown) power supply, power consumption was even more important.
Media player 3500 also comprises user input device 3508, and it allows the user and the media player 3500 of media player 3500 mutual.For example, user input device 3508 can be taked various ways, such as button, keypad, rotating disk etc.In addition, media player 3500 comprises display 3510(screen display), display can be by processor 3502 control with to user's display message.Data bus 3511 can help the data transmission between file system 3504, high-speed cache 3506, processor 3502 and codec (CODEC) 3512 at least.
In one embodiment, media player 3500 is used in file system 3504 storage a plurality of media item (for example song).When the user wanted the media renderer plays certain media items, the tabulation of available media items can be presented on the display 3510.Subsequently, utilize user input device 3508, the user can select one of available media items.After the selection that receives certain media items, processor 3502 offers encoder/decoder (CODEC, codec) 3512 with the media data (for example, audio file) of certain media items.Codec 3512 produces the analog output signal that is used for loudspeaker 3514 then.Loudspeaker 3514 can be the loudspeaker of media player 3500 inside or media player 3100 outsides.For example, headphone or the earphone that is connected to media player 3500 is considered to external loudspeaker.
In said method, the auxiliary manufacture process that can use a computer is carried out one or more described steps.The computer-aided manufacturing process can relate to the one or more different equipment of programming to form or assembling microphone storehouse and portable computing device.For example, the robot device can be programmed by certain orientation the microphone storehouse to be installed and/or to comprise the microphone assembly of microphone in the housing of portable computing device.
Modularization material antenna module
Say that broadly embodiment disclosed herein has described a kind of modularization material antenna module that comprises antenna block, described antenna block has a part, and this part has with the counterpart interlocking of non-conductive framework and antenna block is fixed to the shape of non-conductive framework.This non-conductive framework is attached to the inside of conductive shell, so that non-conductive framework and conductive shell form one-piece construction.Then, by antenna block mechanical support antenna flexible cable, and the antenna flexible cable is electrically connected to circuit board.Framework is designed to support the lid glass that is used for portable electric appts, and can be affixed on the housing.The specific inductive capacity of the permittivity ratio framework of antenna block is much smaller.In one embodiment, antenna block is made by cyclic olefin polymer (COP), and framework is made by glass filled plastics.The synthetic difference of specific inductive capacity combines with the difference of the interlocking portions of framework and antenna block and dielectric loss tangent and has improved antenna performance.
Figure 41 shows a top perspective view, and it illustrates the representative consumer products 4100 according to described embodiment.Consumer products 4100 can be taked various ways, are not only to comprise that portable electronic device is (such as iPod TMOr iPod Touch TM), smart phone is (such as iPhone TM), flat computer is (such as iPad TM), its each all is by Cupertino, the Apple Inc. of CA. makes.Consumer products 100 can be utilized inside antenna to send and/or receive radio communication.Can carry out these radio communications for many various objectives.For example, as described later, can be mobile phone communications, WiFi communication, Bluetooth TMCommunication, wireless broadband communication etc. are carried out radio communication.More efficient and the more effective user experiences that provide in the improvement of use during consumer products 4100 of these communications are provided.
Figure 42 shows the top perspective view according to the modularization material antenna module of an embodiment.Provide the housing of making by conductive material 4200 herein.An example that is applicable to the conductive material of this embodiment is a stainless steel, there are many other possibility materials that are applicable to this embodiment although it will be recognized by those skilled in the art, unless and spell out, claim should not be construed as limited to stainless steel.Framework 4202 is affixed on the housing 4200, and generally can be used for the front (not shown) of fastening.Positive can making by transparent material such as glass, and can be used for overlay device, but still allow the user to watch following display (not shown) by coverture.This display also can be used as input equipment.For example, display can be a kind of in many dissimilar touch-screens.
In order to support coverture, framework 4202 can comprise the edge 4204 with flange portion 4206.In one embodiment, coverture is adhered to edge 4204 around flange 4206, thus the sealing entire equipment.Therefore, edge 4204 not only is used as obducent support, and is used as the calmodulin binding domain CaM that coverture can be appended on the framework.Framework 4202 can be made by the non-conductive frame material such as glass filled plastics.A kind of example glass filled plastics that is applicable to framework 202 is the KALIX that the Solvay Advanced Polymers by GA.Alpharetta makes TMKALIX TMComprise 50% high performance nylon with the glass fibre reinforcement.It will be recognized by those of ordinary skills, have many other the possible frame materials that are applicable to present embodiment, unless and spell out, claim should not be construed as limited to KALIX TMOr other glass filled plastics arbitrarily.
The specific inductive capacity of the permittivity ratio antenna block 4208 of framework 4202 is much bigger.For example, glass filled plastics has about 5 specific inductive capacity, can have approximate 2.25 specific inductive capacity and describe the COP can be used as the antenna block material as the front.In addition, the dielectric loss tangent of the dielectric loss tangent ratio antenna piece 4208 of framework 4202 is much bigger.For example, glass filled plastics has the dielectric loss tangent between 2.5 and 4, and can have approximate 0.0005 dielectric loss tangent by the antenna block 4208 that COP constitutes.Dielectric loss tangent is the parameter that its intrinsic electromagnetic quantities of quantification of dielectric substance dissipates.This term refer in complex plane in resistive (diminishing) component of electromagnetic field and the angle between its reactance (can't harm) component.Dielectric loss tangent is more little, and " loss " that antenna receives is few more.
Except making with the antenna block material of just having described with specific inductive capacity more much smaller than frame material, antenna block 4208 also has a part, and this part has with the counterpart interlocking of framework 4202 and with antenna block and is fixed on shape on the framework.This is illustrated in Figure 43 and 44.This equipment can also comprise printed circuit board (PCB) (not shown) integrated circuit, and other electronic package can be installed on the circuit board, and can be used for operating equipment and control display.Printed circuit board (PCB) can comprise one or more processors of the various functions that are configured to actuating equipment.
Figure 43 shows first sectional view according to the modularization material antenna module of an embodiment.This sectional view is represented the view that one side of equipment is watched from Figure 42.Seen at Figure 43, antenna block 4208 comprises part 4210, and this part 4210 has the shape with counterpart 4212 interlockings of framework 4202.Herein, interlocking portions comprises the outshot 4212 of framework 4202, and the groove part 4210 of antenna block 4208.Yet, one of skill in the art will recognize that the many different modes of existence with these assemblies of mode interlocking of antenna block 4208 being fixed to framework 4202, unless and offer some clarification on, claim should not be construed as limited to any specific shape (one or more).
Figure 44 shows second sectional view according to the modularization material antenna module of an embodiment.This sectional view is represented the view that the top of equipment is watched from Fig. 3.Herein, antenna block 4208 has another part 4214, and this part 4214 has the shape with counterpart 4216 interlockings of framework 4202.This part 4214 is the juts on antenna block 4208 sides, and part 4216 is the groove parts 4216 on framework 4202 sides.By replace jut and groove part between antenna block 4208 and framework 4202, antenna block 4208 can be fixed on the framework 4202 more firmly.Should be noted that these counterparts that are used for interlocking antenna block 4208 and framework 4202 that have any specific number are optional.It is just enough so that antenna block 4208 is fixed to framework 4202 to have one group of interlocking portions.Yet, can provide additional interlocking portions, so that additional strength is provided for coupling of two assemblies.Additionally show support 4218 in this drawing, this support 4218 is connected to housing 4200, and allows to screw between the part of supports 218 and the housing 4200 by screw hole 4222 and be electrically connected.Support 4218 can be soldered to housing 4200.Support 4218 can be made of conductive material.
Figure 45 shows the extended view according to the top perspective view of the modularization material antenna module of an embodiment.Herein, antenna flexible cable 4222 has been mechanically secured to the top of antenna block 4208.As shown in figure 44, can use the screw 4224 that enters support 4218 that antenna flexible cable 4222 is fixed to antenna block 4208.Should be noted that support 4218 needs not to be the assembly that separates with housing 4200, in fact, in one embodiment, whole support 4218 and the housing 4200 of forming.Antenna flexible cable 4222 also can be electrically connected to the circuit board (not shown) of consumer products, and the electric assembly on the circuit board can additionally be electrically connected to housing 200, so that with each assembly ground connection.
In addition, antenna block 4208 can be grounding to housing 4200.In an example, can use power spring (being called as ground spring) to carry out this task.This spring self can have the shape with the counterpart interlocking of antenna block 4208 and housing 4200, so that fix this ground spring.This spring is designed to elastic deformation, this can reduce collide with or other damage to the influence of consumer products.Even the elastic deformation of spring can allow in drop event or between other this impact epoch, spring also is maintained between antenna block 4208 and the housing 4200.
Have given shape though antenna block 4208 is shown as in Figure 42-45, antenna block generally needn't form with any specific shape.In fact, the shape of antenna block can change based on some different factors, and described factor comprises that the easiness of easiness, installation of the design of adjacent structure and shape, structure and antenna block will be fixed to the firm degree on the framework.Framework and antenna block mode interlocked with one another also can influence antenna performance, and thinks that making interlocking portions with the material with differing dielectric constant has further improved above antenna performance.In other words, the interlocking aspect of differing dielectric constant material has improved above antenna performance, and has exceeded the performance that may occur when connecting the differing dielectric constant material under not having the situation of interlocking portions.
In addition, the shape of antenna block can change the wireless receiving characteristic of equipment.Some shape and/or size may increase or reduce wireless receiving usually.In addition, some shape and size can increase wireless receiving when using equipment in some mode, and reduce wireless receiving when otherwise using equipment.Position when for example, user's hand is being in one's hands equipment can change the wireless receiving characteristic of equipment.Provide bigger space between the housing parts of position that can be by holding equipment usually antenna block and user, or reduce or eliminate this influence by placing nonconducting physical buffer material (such as rubber buffer).So, antenna block can be designed to all above-mentioned factors of big as far as possible efficient way balance.
Antenna block, framework and housing can use the treatment process that is fit to arbitrarily to be made by the material that is fit to arbitrarily.This can comprise, for example, and metal, synthetic material, plastics etc.Can use the method that is fit to arbitrarily to make these assemblies, such as for example, shaping, forging, extruding, machining, die casting, punching press and any other suitable manufacturing treatment process or its combination.
Antenna block can be configured to operate on the one or more frequency bands that are fit to arbitrarily, so that cover existing arbitrarily or new interested service.If wish, can provide a plurality of antenna blocks so that cover more multiband, the wideband resonance element is provided maybe can for one or more antennas, so that cover a plurality of interested communication bands.Unless clearly abandon, any content among the application should not be interpreted as desired embodiment is confined to the individual antenna piece.
Figure 46 has described a kind of interchangeable interlocking shape according to an embodiment.The figure shows the feature of the interlocking shape area of antenna block and framework, and the further feature of not shown antenna block and framework (and not shown may be on these elements other interlocking shape of other position).Herein, antenna block 4600 comprises circular groove part 4602, jut 4604 interlockings of the circle of itself and framework 4606.Compare with being roughly rectangular shape, have round-shaped interlocking portions by manufacturing, assembling becomes more easy, and this is because these shapes can more promptly slide together than many rectangular shapes.Yet this must balance each other with the following fact: promptly, round-shapedly may not provide the same big separating resistance with the shape that is roughly rectangle.
Figure 47 has described a kind of interchangeable interlocking shape according to another embodiment.The figure shows the feature of the interlocking shape area of antenna block and framework, and the further feature of not shown antenna block and framework (and not shown may be on these elements other interlocking shape of other position).Divide 4702 except antenna block 4700 comprises with the lobes of circular groove part 4704 interlockings of framework 4706, this embodiment is similar to embodiment shown in Figure 46.As the embodiment of Figure 46, circular design can be quickened assembling, but with regard to locking antenna block 4700 and framework 4706, may be so unreliable yet.
Figure 48 has described a kind of interchangeable interlocking shape according to an embodiment.The figure shows the feature of the interlocking shape area of antenna block and framework, and the further feature of not shown antenna block and framework (and not shown may be on these elements other interlocking shape of other position).Herein, antenna block 4800 comprises the groove part 4802 with rectangle part 4804 and circular portion 4806.Jut 4808 interlockings of groove part 4802 and framework 4810.Jut 4808 comprises rectangle part 4812 and circular portion 4814.This design provides excellent locking ability, and the separating resistance of sizable antenna block 4800 and framework 4810 is provided.Yet this must balance each other with the following fact: promptly, the assembling of this interlocking portions may be difficult, if or have a plurality of this groove parts 4802 and jut 4808 in the equipment, assembling or even impossible.Yet each in antenna block and framework only has under the situation of single interlocking portions, and present embodiment may be desirable.
Figure 49 has described a kind of interchangeable interlocking shape according to another embodiment.The figure shows the feature of the interlocking shape area of antenna block and framework, and the further feature of not shown antenna block and framework (and not shown may be on these elements other interlocking shape of other position).Except antenna block 4900 comprised the jut 4902 with rectangle part 4904 and circular portion 4906, this embodiment was similar to embodiment shown in Figure 48.Groove part 4908 interlockings of jut 4902 and framework 4910.Groove part 4908 comprises rectangle part 4912 and circular portion 4914.As the embodiment among Figure 48, each in antenna block and framework only has under the situation of single interlocking portions, and this embodiment may be desirable.
Figure 50 is a process flow diagram, and it has described the method that is used for assembly portable formula electronic equipment according to an embodiment.5000, provide conductive shell.This housing can be made by for example stainless steel.5002, support is welded to housing.This support also can be made by conductive material.5004, non-conductive framework is bonded or otherwise be fixed to the inside of conductive shell, to form one-piece construction.Non-conductive framework is made by the frame material with first specific inductive capacity.5006, part by the interlocking antenna and framework with first shape have a part corresponding to second shape of first shape, antenna block is fixed on the framework.Antenna block is made by the antenna block material with second specific inductive capacity, and second permittivity ratio, first specific inductive capacity is much smaller.5008, the antenna flexible cable is mechanically secured to antenna block.The antenna flexible cable also can be electrically connected to circuit board.
Figure 51 is the block scheme of portable consumer product according to an embodiment of the invention.Portable consumer device 5100 can utilize the modularization material antenna module according to above-mentioned any embodiment.Portable consumer device 5100 comprises processor 5102, and processor 5102 belongs to the microprocessor or the controller of the integrated operation that is used to control portable consumer device 5100.The media data that portable consumer device 5100 will belong to media item is stored in file system 5104 and the high-speed cache 5106.File system 5104 is memory disc or a plurality of dish normally.File system 5104 is generally portable consumer device 5100 high capacity storage capability is provided.File system 5104 not only can the medium data, and can store non-media data (for example, when operating with the dish pattern).Yet because slow relatively to the access time of file system 5104, portable consumer device 5100 can also comprise high-speed cache 5106.High-speed cache 5106 is the random-access memory (ram)s that for example provide with semiconductor memory.The access time of being compared file system 5104 the relative access time of high-speed cache 5106 is short a lot.Yet high-speed cache 5106 does not have the large storage capacity of file system 5104.In addition, file system 5104 when being activated, more manys power than high-speed cache 5106 consumption.When portable consumer device 5100 was portable consumer device with battery (not shown) power supply, power consumption is the problem of a concern normally.
In one embodiment, portable consumer device 5100 is used at a plurality of media items of file system 5104 stored (for example, song).When the user wishes to make portable consumer device to play particular media item, on display 5108, show the tabulation of obtainable media item.Then, use the Trackpad that is built in the display 5108, the user can select one of obtainable media item.Processor 5102 offers codec (CODEC) 5110 with this certain media items purpose media data (for example, audio file) after receiving the selection of certain media items purpose.CODEC5110 is that loudspeaker 5112 produces analog output signal then.Loudspeaker 5112 can be the loudspeaker of portable consumer device 5100 inside, maybe can be the loudspeaker outside portable consumer device 5100.For example, headphone or the earplug that is connected to portable consumer device 5100 can be considered to external loudspeaker.Loudspeaker 5112 not only can be used for exporting the audio sound that belongs in progress media item, and can export sound effect and cellular calls audio frequency.Sound effect can be used as voice data and is stored on the portable consumer device 5100, such as being stored in file system 5104, high-speed cache 5106, ROM5114 or the RAM5116.Can respond user's input or system request, the output sound effect.When specific sound effect will be output to loudspeaker 5112, the sound effect voice data that processor 5102 retrievals are associated, and provide it to CODEC5110, CODEC5110 offers sound signal loudspeaker 5112 then.Under the situation that the voice data of media item also is output, processor 5100 can be handled the voice data of media item and sound effect.In this case, the voice data of sound effect can mix with the voice data of media item.Mixed voice data can be provided for CODEC5110 then, and CODEC5110 provides voice data (belonging to media item and sound effect) for loudspeaker 5112.
Portable consumer device 5100 also comprises the network/bus interface 5118 that is coupled to data link 5120.Data link 5120 allows portable consumer device 5100 to be couple to principal computer.Data link 5120 can be provided in wired connection or wireless connections.Under the situation of wireless connections, network/bus interface 5118 can comprise wireless transceiver.
The PCB that forms
Have display and expect the factor that at first will consider in the encapsulation of portable computing device of slim profile be big parts in the housing (such as, display, display circuit and battery) layout.In addition, also need to consider to be used for fixing these than the support of large equipment parts and/or the layout of attachment structure.Than the location of large equipment parts and supporting structure thereof also should consider need for the various I/O mechanism that arranges around the housing outer rim (such as, volume switch, power knob, data and power connector and audio jack etc.) enough spaces are provided.In the remaining space that is not occupied, then can arrange other internal parts (such as, but not limited to processor and storer, loudspeaker, microphone, camera and associated circuit board thereof) and allow all devices parts can its desired function and all kinds of connectors of Be Controlled and operation by big parts.
The remaining space that is occupied by big parts can not distribute with irregular shape, different position and height levels in shell.The parts that can design special shape are to fit in these spaces.Subsequently, each parts can be coupled to each other in some way.For example, provide its desired function in order to allow portable set, many parts can with controller board (such as, main logic plate) communication, to receive operational order.Other lifts an example, and many parts need electric power, and this then can be connected via various power supplys by internal cell provides.Typically, the space between each parts can be used to route data and/or power supply connection.So, need consider in the package design of equipment that power supply is connected required space with data.
Connect a solution that is distributed in each the electric parts in the housing and be to use flexible connector (flexible connector is commonly called " flexible cable " connector).A shortcoming of flexible cable connector is the increase of manufacturing step.Whenever an internal part is connected to another internal part by the flexible cable connector, just increase by two manufacturing steps.Can in assembling process, save in the above-mentioned steps by flexible cable is connected to one of parts during it is made.Yet, at assembly process, being typically, at least one end of flexible cable connector need be connected to related internal part.
Another shortcoming of flexible cable connector is that the tie point that flexible cable is connected to parts is easy to fault during operation of equipment.For example, the flexible cable tie point than the connection of other types be easier to because of vibrations (such as, when equipment falls) break down.In addition, at assembly process, inappropriate formation of flexible cable tie point may cause the too early or unexpected fault of equipment.So the use of flexible cable connector can be introduced the additional examples that wherein can reduce the foozle of equipment integral reliability.
As described herein,, can use the PCB of flexible and continuous formation in order to save the flexible cable connector and to be adapted to the portable electric appts of the thin compact of packaging environment association.For example, single continuous P CB can comprise two major parts (such as two rectangle parts), and it is by much thinner that PCB partly links to each other than two rectangle parts.Two major parts of PCB can be formed as two PCB that separate and connect by the flexible cable connector subsequently.Instead, can form the continuous P CB plate that replaces the flexible cable connector by the connector part of PCB.The relative thinning of connector part can allow it crooked easily.
The major part of PCB can have special shape (for example, non-rectangle) and size, to be fitted in the space that enclosure interior can use.The length of the connector part of PCB and shape can be placed the inner track that exists between wherein the space based on the major part of PCB and be determined.In one embodiment, the connector part of PCB can be at each location bending, in inner track available between the major part that is fitted to PCB.In other embodiments, the major part of PCB also can be crooked, so that it can be fitted in the available inner space.
The location of the profile of portable computing device, the parts that need to connect and each parts all can influence flexible PCB described here and can be shaped to the free space in the adaptive housing and can reside in circuit on the flexible PCB.So, the block diagram of each parts of the skeleton view of the portable computing device that has example profiles and portable computing device has been described with reference to figure 61A and 61B.In one embodiment, flexible PCB is formed by the main logic plate.So, the flexible main logic plate that comprises that in the housing of portable computing device exemplary panels is arranged has been described with reference to figure 62A, 62B and 63C.Other configurations of flexible PCB and layout are then discussed with reference to figure 63A, 63B and 63C.With reference to figure 64A-65E, illustration the various configurations of flexible PCB.The hardness property of flexible PCB can be adjusted by the formation of handling the one or more trace layers among the PCB.Formation of these layers and manipulation be 66A-66B description with reference to the accompanying drawings then.The method of making the portable computing device that utilizes flexible PCB has been described with reference to Figure 67.The block diagram of the portable computing device that has media play function is described with reference to Figure 68 at last.
Figure 61 A shows the skeleton view according to the portable computing device that has slim relatively profile 610 of described embodiment.Portable computing device 610 can comprise the housing 6100 that has opening 6108.The display 6104 that is centered on by framework can be positioned in this opening 6108.The display circuit of display 6104 then can be positioned in the housing 6100, such as being located immediately under the display 6104.As mentioned above, the location of display circuit can influence available inner space in the housing 6100.
Touch-screen can be associated with this display 6104.The circuit (such as touch screen controller) that is associated with this touch-screen can be positioned at housing 6100.Display 6104 can be via 6106 sealings of lid glass.Load button 6114 can be positioned in the opening of lid glass 6106.The observation circuit that is associated with load button 6114 then can be positioned at housing 6100.In one embodiment, load button can be used to equipment 610 is returned particular state, such as main interfacial state.
A plurality of I/O mechanism can be around the shell rim location.For example, data/power connector 6118 and audio jack 6116 can be positioned at the root edge of housing 6100, and power switch 6110 then can be positioned at the apical margin of housing 6100.Housing 6100 can also comprise the opening that is used for loudspeaker and/or microphone.Support the circuit of these parts can be encapsulated in housing 6100 inside.These circuit can be embodied in the various circuit boards that place in the housing, such as flexible PCB described herein.
The block diagram of equipment 610 is shown in Figure 61 B.Above-mentioned parts are typically controlled by the processor on the main logic plate (MLB) 6105.So, various inner connections to realize data moving between MLB6105 and each parts can be provided.The route that internal data connects can depend on how each parts is encapsulated, and comprises that MLB6105 is positioned in the position in the housing 6100 and the position of the available inner track after each internal unit positioning parts.
Connect about data, MLB6105 can be connected to the display controller 6120 that couples with display 6104.In addition, MLB6105 can also be coupled to acoustic component, such as loudspeaker, audio jack 6116, microphone or comprise that the associated audio of audio codec supports circuit.In addition, MLB6105 also can be coupled to various input equipments, such as touch-screen 6122, volume switch circuit, load button circuit and power switch circuit.In addition, MLB6105 can also be coupled to various data-interfaces, and to allow its reception and transmission external data, described interface is such as being radio interface 6126 and the data/power connector 6118 that comprises antenna.
Except data connected, many internal unit parts can also receive the electric power from internal electric source (such as battery 6130).For example, battery 6130 can be coupled to MLB6105, display 6104, display controller 6120, touch-screen 6122 and data/power connector 6118.Be connected similarly with data, the route that power supply connects also can depend on each the internal unit parts (such as battery 6130) in the housing 6100 and the location of available inner track.
Each embodiment of flexible PCB has been described with reference to the following drawings.In one embodiment, flexible PCB can comprise having the part that is shaped as the various sizes that fit in the inside free space that spreads all over housing.The large-size part of PCB can be connected by slim connector part, and described slim connector part then is shaped to adaptive being within the inner track available between the major part.Major part and connector part can form continuous P CB.In a particular embodiment, the main logic plate can be formed by illustrative flexible PCB in the following accompanying drawing.
Accompanying drawing 62A, 62B and 62C show according to the skeleton view of the flexible MLB6105 of described embodiment and side view.In Figure 62 A, show the sectional view of housing 6100.The cross section of housing 6100 comprises length 6150 and width 6151.The inner surface profile that depends on housing 6100, length 6150 can change at different cross sections to some extent with width 6151.
Battery 6130 can be positioned in the centering portions of housing.In one embodiment, battery 6130 can have make the inner space near the battery top can with, inner space near the battery bottom can with and inner space location and the size that can use along the battery side.MLB6105 can be so shaped that the 6105a of first can fit in the inner space near the battery top, and second portion 6105b can fit in the inner space near the battery bottom.Connector part 6105c can connect the 6105a of first with second portion 6105b mutually.Connector part 6105c is thinner longer than first 6105a and second portion 6105b.Connector part 6105c is shown as the internal path wiring along battery 6,130 one sides.
Shape and the position of the 6105a of first, second portion 6105b and connector part 6105c only provide for illustrative purposes, but not are used for restriction.In each embodiment, the 6105a of first of MLB6105 and second portion 6105b can be than the greater or lesser sizes that has shown in the figure.In addition, the 6105a of first can have the shape and size different with second portion 6105b.Similarly, can be non-rectangle such as the shape of each part of 6105a and 6105b, and can comprise curved surface when needed.In addition, the PCB such as MLB6105 can comprise two or more major parts.For example, the flexible PCB such as MLB6105 can comprise three major parts that connect mutually by two connector parts.
In each embodiment, connector part 6105c can be attached to major part 6105a and 6105b at diverse location.For example, connector part 6105c can be attached near the central authorities of part 6105a and part 6105b, to form " I " shape.In this example, if if having internal path can with or the shell of battery 6130 can comprise that then this connector 6105c can be routed on the top or bottom of battery 6130 as the groove of the path of connector 6105c at its top surface or basal surface.
Connector 6105c need not to form straight line.For example, connector 6105c can be formed to follow crooked route or to follow a plurality of straight line line segments (for example, step or Z-shaped path) each other in different angles.In another example, connector 6105c can comprise one or more branches.Branch can be connected to other circuit, such as additional PCB.Following will further describing with reference to figure 62C and 64B-65E, after connector 6105c forms, this connector 6105c can be bent or be reversed into the various specific internal paths that are configured to follow.For example, following will further describing with reference to figure 62C, connector 6105c can be bent to pass the differing heights in the equipment.
Figure 62 B shows the cross section with constant width value vertical with the cross section of Figure 62 A.MLB6105 can be positioned at height 6152 places under battery 6130 tops.The 6105a of first of MLB and second portion 6105b can have the size in the free space between the bottom side of the top side that can be fitted to battery 6130 and battery 6130.Connector part 6105c can pass the side that connects battery bottom side and top side, as shown in phantom in FIG..
In one embodiment, as shown in Figure 62 B, MLB6105 can stride PCB with a constant relatively height and install in a planar configuration, and promptly 6105a, 6105b and 6105c install with similar height.In other embodiments, MLB can install in non-planar configuration.For example, in Figure 62 C, the 6105a of first can be installed in height on the top of battery 6130 and concordant with display 6104, and second portion 6105b then is installed in the height place under the top of battery.Connector part 6105c then passes the difference in height between 6105a of first and the second portion 6105b.
In Figure 62 A-62C, show the embodiment of the flexible PCB that is configured to MLB6105.For illustrative purposes, the big top surface area of MLB6105 is shown as the basal surface installation that is roughly parallel to apparatus casing.In other embodiments, flexible PCB can be installed to be the bottom (referring to accompanying drawing 63A) that makes bigger top surface area be approximately perpendicular to apparatus casing.In other embodiment, the first of flexible PCB can be installed to be and make its basal surface with housing parallel, and second portion can be installed to be the bottom vertical that makes itself and housing.For example, in Figure 62 A, part 6105a can be installed to be roughly parallel with the bottom of housing, and roughly the basal surface with housing is vertical so that this connector 6105c can be installed to be and connector 6105c can be bent to a right angle.Vertical orientation can only be described for illustrative purposes.Setting angle such as each part of the flexible PCB of MLB6105 can change, and is not limited to relative to each other or is vertical orientation with respect to each dimension of housing install.
Figure 63 A show the big surf zone of PCB roughly with the configuration of the bottom vertical of housing 6100 in the skeleton view of flexible PCB6160.At bending position not, PCB6160 is roughly a rectangle band, and this illustrates for the illustration purpose, and can utilize other shapes.The top view of the PCB6160 under the bending position and backplan be not shown in accompanying drawing 63B and the 63C.At Figure 63 A, PCB6160 centers on the corner bending to fit in the space between part of appliance 6165 and the housing 6100.Part of appliance 6165 can be 1) inherent structure, such as the part of the framework that is used for fixing other internal parts; 2) be installed in the part of the part of appliance (such as battery) in the housing; Or 3) above-mentioned combination.
Assembly process, PCB6160 can be provided as flat band, and can be bent and/or be torqued in the space of expectation subsequently, such as the space between part of appliance 6165 and housing 6100 around corner.In one embodiment, the material of PCB6160 can be configured to make it not keep its curved shape.So PCB6160 may need to be fixed, so that it remains in the bending position shown in Figure 63 A.
For example, for PCB is fixed on curved shape, PCB6160 can be attached to the side of sidepiece or the bottom and/or the part of appliance 6165 of housing 6100.Other lifts an example, if place the space of PCB6160 enough narrow (such as, the space between part of appliance 6165 and housing 6100), then PCB6160 is bent and in the space of slipping into expectation subsequently at assembly process.The bending moment (that is, if not constraint, it is straight that this PCB6160 will become) that is accumulated among the PCB6160 can force the side in PCB6160 opposing space, and can help thus to be fixed in its space that has been placed.
In another embodiment, PCB6160 can be provided as flat band at assembly process.Yet PCB6160 can be configured to make its maintenance or part to keep crooked shape afterwards.PCB6160 can be configured to make its in the specific region (such as, be designed to crooked zone) in easier bending, and in other zones (such as, be designed to smooth zone) in then harder.Following will be with reference to the accompanying drawings 66A and 66B describe in more detail to form have the PCB(of variable durometer attribute such as 6160) details.
In yet another embodiment, PCB6160 can form with its curved shape before assembling.For example, PCB6160 can be molded into curved shape.In another example, PCB6160 can form even shape, but is manufactured into curved shape subsequently before the assembling of portable computing device.So, can provide the PCB6160 of curved shape to be used for assembling process.
In each embodiment, PCB6160 can comprise and only is attached to the PCB6160 top side, only is attached to PCB6160 bottom side or be attached to the parts of PCB6160 top side and bottom side.Attached parts can extend on each surface of PCB6160.Can according to PCB6160 be in its during the installation site free space in the housing come the alternative pack position.In addition, can come the alternative pack position based on being desirably in the last location of PCB bent position.In certain embodiments, expect some parts is attached as away from being intended to be enough to crooked zone, this is because crooked meeting damages the attached of parts or parts and PCB6160.
Figure 63 B and 63C show top view and the backplan of PCB6160.In Figure 63 B, the end near PCB6160 on the top of PCB6160 is furnished with parts 6162a and 6162b.In one embodiment, parts can be arranged to the bending axis 6165 away from the bending direction of being indicated by arrow 6164, because significantly bending may damage the parts that are attached to PCB6160.
The head room that is associated with each parts that is attached to PCB6160 (such as parts 6162a to 6162b) can change by parts ground.For example, parts 6162b than parts 6162a can extend from the circuit board top farther.Required headroom or amount of space when the effect of altitude of each parts is installed PCB6160.The height of each parts can influence the location of each parts on PCB6160.For example, when PCB6160 was positioned at its installation site, parts 6162b was positioned at and makes the position of PCB6160 away from part of appliance 6165.Parts 6162b can be selected as making it to be positioned at this zone away from part of appliance 6165 when being mounted in the location on the PCB6160, this is because available space is greater than space between part of appliance 6165 and the housing 6100 in this zone.
As mentioned above, PCB6160 can be included in the parts of its top surface and basal surface.Component layouts on top surface and basal surface and quantity can differ from one another.For example, in Figure 63 B, on the top surface of PCB6160, getting each other turns up the soil is attached with two parts very much.And in Figure 63 C, the parts that three sizes differ from one another are shown as than the approaching toward each other basal surface that is attached at PCB6160 of parts shown in Figure 63 B.
Figure 64 A-65E shows top view and the side view of the flexible PCB6170 of various curved configuration.As mentioned above, can form by curved configuration such as 6170 flexible PCB.For example, can in the curved configuration that respectively illustrates, form with reference to each configuration shown in the figure 64A-65E.In alternative embodiment, PCB6170 can form in non-curved configuration, and can the assembling before or during bend to another configuration.For example, PCB6170 can form by the arbitrary configuration shown in Figure 64 B and the 64C, and is bending to the configuration shown in Figure 64 A subsequently.Other lifts an example, PCB6170 can by the configuration of Figure 64 A form and subsequently according to direction 6164 around axle 6165 bendings to realize the configuration shown in Figure 64 B and the 64C respectively.
PCB such as 6170 can be configured to return its original shape after bending, perhaps can be configured to keep after bending takes place or partly keep specific curved configuration.In specific location, the PCB such as 6170 can pass through a plurality of bending shafts.Similarly, PCB can and reverse in the specific location bending.In Figure 65 D and 65E, part 6170a and 6170c install with the configuration that is an angle relative to each other and is in differing heights, and this installations is disposed the bending of the part 6170b that has introduced PCB6170 and reversed.
In other embodiments, can be such as 6170 PCB at a plurality of location bendings.For example, in Figure 64 A, each part 6170a, 6170b and 6170c can be around the specific amount of specific direction specific axis bending down (for example, each part can around the angle of the specified quantitative on the bending shaft specific direction).Other lifts an example, and in Figure 64 A, part 6170a, 6170b and/or 6170c respectively can be in the bendings of a plurality of positions.For example, part 6170b can be at least two diverse location place bendings.So, comprise that the assembly of the installation of specific PCB6170 can comprise a plurality of different crooked rank.
Flexible PCB6170 can be formed and/or be crooked to fit in the space of certain objects.For example, in Figure 65 A, show around the side view of the internal unit parts 6176a of PCB6170.PCB6170 can be bent with side week of compliant member 6176a roughly.Comprise straight line portion, stepped line part or curved portion the side week of parts 6176a.Shown in Figure 64 B and 64C, PCB6170 can be crooked to fit in around the curvilinear surface, such as comprising under the situation in curvilinear sides week at part of appliance 6176a.
In Figure 65 B, show the side view of part of appliance 6176b.PCB6170 can be crooked adaptive with top surface and basal surface around parts 6176b.Parts 6176b can have irregular shape.For example, parts 6176b comprises two breach.Plate carries parts 6178a and 6178b and is placed in position on the PCB6170 top surface, makes that plate carries parts and extends to by in the space that breach provided in the side profile of parts 6176b as PCB6170 during around parts 6176b bending.
At Figure 65 C, show the side view of part of appliance 6176c and the side view of part of appliance 6180.In one embodiment, part of appliance 6180 can be the structural element such as inner frame.PCB6170 can center on part of appliance 6176c and part of appliance 6180 bendings.Parts 6178a can be positioned on the top surface of PCB6170, and parts 6178b then can be positioned on the basal surface of PCB6170.Parts 6178a and 6178b can be decided to be to be fitted in space part of appliance 6176c and 6180, that created by its orientation.
PCB6170 is shown as bending, so that the side almost parallel of the basal surface of PCB6170 and part of appliance 6176c.In one embodiment, the basal surface of PCB6170 can comprise connector.Connector can be placed on the PCB6170, makes that the connector on the side of described connector and equipment 6176c aligns, and connects mutually to allow two connectors when PCB6170 is crooked under its installation configuration.These two connectors can connect in every way.For example, two connectors can be configured to snapping or weld together.
As previously mentioned, provide flexible PCB.Possible desired configuration PCB so that its curved shape after bending can be held.Generally speaking, can expect to change the hardness property that is associated with flexible PCB.66A-66B with reference to the accompanying drawings, description can be used to form method and the PCB configuration of the PCB with different hardness attribute.Figure 66 A shows the side cross-sectional view of multi-layer PCB 6200.The number of plies that provides is only for the illustration purpose, and can utilize than more or less layer is shown.
PCB6200 can be by a plurality of trace layers, such as 6202a, 6202b and 6202c, and a plurality of basalis, such as 6206a, 6206b and 6206c.Trace layer can be used to form and each PCB parts (such as 6204a and 6204b) and the data/power connector between each PCB parts. PCB parts 6204a and 6204b are shown as on the top surface that is positioned at PCB6200, but in other embodiments, these parts also can be positioned on the basal surface of PCB6200.
Trace layer can typically be formed by the conductive material such as copper.Trace layer can be formed solid layer, such as the paper tinsel layer, and in the part of subsequently can etching or grinding away this layer to form the trace that connects each parts.
The insulation requirements that depends on particular electrical circuit on the pcb board, basalis can be formed by different materials.Several examples of operable base material comprise (Teflon), FR-4, FR-1, CEM-1 or CEM-3.Different layers is laminated to together with the epoxy resin preimpregnation.Several examples of utilizable preimpregnation material include but not limited to FR-2(phenolic aldehyde cotton paper), FR-3(cotton paper and epoxy resin), FR-4(glass cloth and epoxy resin), FR-5(glass cloth and epoxy resin), FR-6(frosted glass and epoxy resin), G-10(glass cloth and epoxy resin), CEM-1(cotton paper and epoxy resin), CEM-2(cotton paper and epoxy resin), CEM-3(glass cloth and epoxy resin), CEM-4(glass cloth and epoxy resin) and CEM-5(glass cloth and polyester).
Substrate and trace layer are adjustable to influence its hardness and flexibility.For example, trace layer or basalis can be formed into thicker or thinner, so that multi-layer PCB is harder or more flexible.In addition, can select the material of substrate or trace layer at its hardness than other materials.
In one embodiment, at its hardness property but not the metal level that its conductive property is selected can be used for replacing trace layer.Metal level can be enough solid, so that when such as 6200 multi-layer PCB when crooked, this PCB keeps its curved shape.In multi-layer PCB, can use one or more such layers.In certain embodiments, these " sclerosis " layer can not comprise trace.
In a specific embodiment, hardened layer can combine with the marmem such as Nitinol.Marmem can be formed the curved shape of expectation, and subsequently by open and flat and be installed in such as 6200 PCB on.The shape of selecting for this shape memory alloy layer can be the expectation curved shape that is used for such as 6200 PCB.Plate carries parts and can be under the situation of its flat position attached at PCB6200.Subsequently, can be so that marmem returns the shape that its memory keeps.For example, can heat this marmem.When marmem returned the position of its memory, whole PCB can be curved to this configuration.
Figure 66 B shows the top view of two trace layers (such as 6202a, 6202b or 6202c) of the multi-layer PCB of Figure 66 A.First trace layer comprises four trace 6212a, 6212b, 6212c and 6216.These traces can be positioned on the substrate 6218.PCB6200 is configured to according to direction 6165 around axle 6165 bendings.In this zone, trace 6212a, 6212b and 6212c can be by thickening to resist the infringement that bending causes.Trace 6216 has been thick, so its size does not increase near the bending area axle 6165.
Typically, being not used in the excess stock that forms trace is removed from trace layer.In one embodiment, excess stock can be left with this PCB of sclerosis in the specific region.For example, can be left with the PCB that in these zones, hardens such as 6208 and 6210 excess stock.In one embodiment, remove near the bending axis 6165 excess stock.Excess stock can be removed to allow the hardness of PCB in this zone to reduce and therefore easier bending.
Another trace layer shown in Figure 66 B does not comprise trace, but only has material 6220.Can only select this material for its strength characteristics (such as its hardness property).Can remove the additional material part of bending axis to allow PCB more easily crooked in this zone.In another embodiment, can in this zone, increase extra material, rather than remove.Can increase extra material to allow trace layer and to allow PCB after axle 6165 bendings, keeping its shape thus.
Figure 67 is to use multi-layer PCB to make the process flow diagram of the method 6300 of portable computing device.6302, determine the plate shape.Plate can have the part of different size, this depends on the space of each part that purport is adaptive within it and whether these parts will be bent and crooked what.As previously mentioned, plate can perhaps can be formed by the configuration that comprises sweep by smooth formation.
6304, can be on the top surface of plate and/or basal surface the alternative pack position.Component locations can be based at it free space of panel area under the configuration being installed.6306, can determine trace locations and at the trace locations of plate.Trace locations the more plate bent position of hope can be done thicker.
6308, hardness property that can option board.So the trace material in the trace layer can stay in some zone and remove in some zone, adjusts the hardness or the flexible characteristic of plate thus.In addition, one or more layers can be exclusively used in the hardness property of adjusting plate.For example, the metal level of selecting at its length can be used to allow plate to keep shape after it is crooked.
6310, flexible PCB can form according to the rule of as above determining.It can form by even shape, perhaps can form by case of bending.Each parts can be attached to PCB.6312, can use the PCB assembly portable formula computing equipment of formation.Assembling process can relate to the PCB that assembling forms in curved configuration.The PCB that forms can be in assembling process by once or more times ground crooked.
In a particular embodiment, auxiliary make and assembling process is assembled this portable computing device that can use a computer.Computer-aided manufacturing and assembling process can relate to the use of a plurality of equipment, such as a plurality of equipment of structure in the assembly line configuration.For example, 6310, in the first area of computer aided assembling process, a plurality of equipment of can programming are to form flexible PCB according to the rule of determining at 6302-6308.This first area of computer aided assembling process can relate to the different equipment of programming the plate substrate formed and/or cuts into given shape and to arrange and can go up the particular trace pattern that basalis changes by PCB.Other computer-aided manufacturing process can relate to the equipment that can be programmed to assembly portable formula computing equipment, such as the mounter people.The assembly process mobile PC B that the mounter people can be programmed at portable computing device is by one or more curved configuration.
Figure 68 is the block diagram according to the media player 6400 of described embodiment.Media player 6400 comprises processor 6402, and it belongs to whole microprocessor operating or the controller that is used to control media player 6400.Media player 6400 is stored the media data about media item in file system 6404 and high-speed cache (cache) 6406.Typically, file system 6404 is memory disk or a plurality of dish.Typically, file system provides the high capacity storage capacity for media player 6400.But because relatively slow to the access time of file system 6404, media player 6400 also comprises high-speed cache 6406.High-speed cache 6406 for example is the random access storage device (RAM) that is provided by semiconductor memory.Relative access time of high-speed cache 6406 is shorter than access time to file system 6404 greatly.Yet high-speed cache 6406 does not have the large storage capacity of file system 6404.
Further, when activity, file system 6404 consumes more electric power than high-speed cache 6406.When media player 6400 was portable electronic device by battery (not shown) power supply, power consumption was even more important.
Media player 6400 also comprises user input device 6408, and it allows the user and the media player 6400 of media player 6400 mutual.For example, user input device 6408 can be taked various ways, such as button, keypad, rotating disk etc.In addition, media player 6400 comprises display 6410(screen display), display can be by processor 6402 control with to user's display message.Data bus 6411 can help the data transmission between file system 6404, high-speed cache 6406, processor 6402 and codec (CODEC) 6412 at least.
In one embodiment, media player 6400 is used in file system 6404 storage a plurality of media item (for example song).When the user wanted the media renderer plays certain media items, the tabulation of available media items can be presented on the display 6410.Subsequently, utilize user input device 6408, the user can select one of available media items.After the selection that receives certain media items, processor 6402 offers encoder/decoder (CODEC, codec) 6412 with the media data (for example, audio file) of certain media items.Codec 6412 produces the analog output signal that is used for loudspeaker 6414 then.Loudspeaker 6414 can be the loudspeaker of media player 6400 inside or media player 6400 outsides.For example, headphone or the earphone that is connected to media player 6400 is considered to external loudspeaker.
Use the ending connecting audio of the connector in the small form factor electronic equipment
Some aspects of described embodiment relate to a kind of small form factor electronic product.At the remaining part of this argumentation, described small form factor electronic equipment is described according to personal media device.Personal media device can comprise the housing that is fit to surround and support various functional units.Housing can be supported various I/O mechanism, for example volume switch, power knob, data and power connector, audio jack or the like.Housing can also comprise the opening that is used to hold I/O mechanism.Can strengthen the availability of interface under equipment scheduled operation condition by the position of selecting I/O mechanism place.For example, concerning will using the equipment of one-handed performance, the input mechanism such as audio control switch can be positioned at a position that is easy to finger manipulation when equipment is held in palm.Other output mechanisms such as audio jack can be positioned at the position of not disturbing the equipment of holding, for example the top of equipment.
Be connected to personal media device and allow described operation of equipment can encapsulate in the enclosure with the part of appliance of implementing its predetermined function.As long as between each parts, there are enough spaces to can be used for required connector, then can provide certain dirigibility for the internal unit position component.The method of printed circuit board (PCB) (PCB) that in addition, can be by utilizing custom-shaped or battery and so on allows effective utilization of available inner space.Personal media device can comprise the voicefrequency circuit that is adapted to the generation sub-audible sound.Described sub-audible sound can be by receiving and using sound signal to create with the acoustic equipment of the air capacity of modulation enclosure.In one embodiment, sub-audible sound can be generated by the sub-audible sound maker that is enclosed in enclosure interior.This sub-audible sound can adopt the form of the music that the music file that keeps by the decoding personal media device provides.Described sub-audible sound can initiatively transmit by the more than one opening in the housing of personal media device.The sub-audible sound maker can adopt the form of the acoustic speaker that has vibrating diaphragm at least, and described acoustic speaker is enclosed to the acoustic hood inside that is also referred to as audio amplifier.In one embodiment, opening can comprise first opening of the housing of at least a portion that is used for guiding the sub-audible sound that is generated by acoustic speaker.Second opening can be used to guide the remainder at least of the sub-audible sound that is generated by acoustic speaker.Second opening can be associated with connector assembly, and is called as connector port.
The connector assembly that is used to hold connector port can be diversified.For example, connector assembly can adopt the form (for example 30 pin-type connectors of standard) of data/power connector.Connector assembly also can be associated with output device, for example has the audio jack (audio jack) of the audio jack pipe (audio jack barrel) that size conforms to audio frequency post (audio post) with shape.The audio frequency post can be inserted into the audio jack pipe.In this way, electrically contacting with corresponding contact pad on the audio jack pipe internal surface on the audio frequency post engages, thereby allows externally to transmit electric signal between the circuit (for example, earphone) and personal media device.Typically, acoustic speaker is forbidden when the audio frequency post is inserted into the audio jack pipe, thus audio jack is inserted the output that audio jack Guan Buhui disturbs sub-audible sound.
Experience in order to strengthen the sense of hearing, can carry out the Acoustic Optimization that transmits at volume the inside dimension of connector port/loudspeaker assembly.In one embodiment, the housing port can have different sizes with connector port.One of advantage of using more than one port is: overall audio experience can part strengthen owing to the increase of perception volume.Except promoting the general perceives volume, feasible unlikely complete covering shell port of the configuration of housing port and connectivity port and connector port.Thus, the user can hold personal media device, and does not worry interrupting fully the air path from the loudspeaker to the external environment condition.In addition, the existence of second port has reduced the overall impedance to the air-flow in the air path from the loudspeaker to the external world, experiences thereby obtain better acoustics.
Followingly will discuss these and other embodiment with reference to figure 71-82.But those skilled in the art will recognize easily, and the detailed description that this paper provides at these accompanying drawings and should not be construed to restriction with it only for illustration purposes.
Figure 71-the 72nd illustrates the skeleton view of each view of the personal media device 7100 of assembling fully according to the embodiment of the invention.Personal media device 7100 can have the size than the zonule that is used for one-handed performance and is placed on pocket and so on, that is, personal media device 7100 can be the hand-held type miniature electronic equipment.For example, personal media device 7100 can be corresponding to computing machine, media device, telecommunication apparatus etc.Personal media device 7100 can deal with data, especially audio frequency and so on medium.Personal media device 7100 usually can be corresponding to music player, game machine, video machines, PDA(Personal Digital Assistant) etc.With regard to hand-held, personal media device 7100 can be operated separately by user's one hand or both hands,, does not need the reference surface of desktop and so on that is.In some cases, handheld device has the size that is used for being placed on user's pocket.Because small-sized, the user needn't directly carry this equipment, and this equipment can be taken Anywhere to (for example, user can not be subjected to carrying the equipment of huge heaviness restriction) thus at user's whilst on tour.
Personal media device 7100 can be diversified.In certain embodiments, personal media device 7100 (for example can be carried out simple function, be exclusively used in the equipment of broadcast and medium), and in other cases, personal media device can be carried out multiple function (for example, broadcast/medium, reception/transmission call/text message/the Internet and/or carry out the equipment that web browses).Personal media device 7100 can be wirelessly (having or do not have under the situation that wireless enabled backup system helps) and/or communicate via wired path (for example using traditional electric wire).In certain embodiments, personal media device 7100 can be extremely portable (for example, small form factor, thin, unshowy, in light weight).Personal media device 7100 even can have be used for one-handed performance and and the size than the zonule of placing pocket and so on, that is, personal media device 7100 can be the hand-held type miniature electronic equipment.Personal media device 7100 can be corresponding to can be from Cupertino, the iPod that the Apple Inc. of California buys TMOr iPhone TMIn arbitrary electronic equipment.
Personal media device 7100 can comprise housing 7102, and described housing is configured to surround to small part the parts of any right quantity that is associated with personal media device 7100.For example, housing 7102 can surround and the various electronic units of internal support (comprising integrated circuit (IC) chip and other circuit), so that provide calculating operation for equipment.Integrated circuit (IC) chip and other circuit can comprise microprocessor, storer, battery, circuit board, I/O, various I/O (I/O) support circuit etc.Though not shown in this figure, housing 7102 can define the cavity of placing each parts in it, and housing 7102 can also physically be supported the inner or mechanism of any right quantity of the open interior by housing 7102 surfaces of housing 7102.
Except above-mentioned functions, housing 7102 can also define the outward appearance of personal media device 7100 at least in part.That is to say that the shape of housing 7102 and form can help to define the overall shape or the form of personal media device 7100, perhaps the profile of housing 7102 can embody the physical appearance of personal media device 7100.Can use any suitable shape.In certain embodiments, the size of housing 7102 and shape can be designed to and can cosily be held in the hand by the user.In certain embodiments, described shape comprises the rear surface of slight bending and highly crooked side surface.Housing 7102 is with a kind of mode global formation that constitutes single full unit.By global formation, housing 7102 has seamless outward appearance, this with comprise two parts being fixed together and form the conventional housing of trough rim, seam thus betwixt different.That is to say that be different from conventional housing, housing 7102 does not comprise any gap, make it more firm and more attractive in appearance thus.Housing 7102 can be made with any amount of material, comprises for example plastics, metal, pottery or the like.In one embodiment, housing 7102 can be made by stainless steel, so that moving impression attractive in appearance to be provided, and provides structural intergrity and support for all sub-components of installing within it.When adopting metal, housing 7102 can be to use the flexible core metal forming technique of the known routine of those skilled in the art to form.
Personal media device 7100 also comprises lid 7106, and described lid comprises flat outer surface.Described outside surface can be for example concordant with the edge of the housing wall that centers on the lid edge.Lid 7106 cooperates with housing 7102 to surround personal media device 7100.Although lid 7106 can in illustrative embodiment, be arranged in lid 7106 in interior and close this mouth of mouth of the cavity of shell 7100 with the next relative housing of multiple mode location.That is to say that lid 7106 adapts to opening 7108.In alternative embodiment, lid 7106 can be opaque and can comprise the touch-sensing mechanism that forms touch pad.Lid 7106 can be configured to define/carry the user interface of personal media device 7100.Lid 7106 can be provided for viewing areas to user's display graphics user interface (GUI) and other information (for example text, object and figure) for display module 7104.Display module 7104 can be a part that is assembled and is included in the display unit (not shown) of housing 7102 inside.This class user incoming event can be used for any amount of purpose, and the personal media device 7100 that for example resets is selected between the display screen that presents on the display module 7104 etc.In one embodiment, lid 7106 is protection top layers of transparent or semitransparent material (clear), makes that display module 7104 can be by described lid and descried.That is to say that lid 7106 has served as the window (that is, transparent cover body has covered display screen) of display module 7104.In a specific embodiment, lid 7106 forms (for example, lid glass) by glass, and is more specifically formed by press polished glass.Yet should be realized that and to use other transparent materials, for example limpid plastics.
Viewing areas can be a touch-sensitive, is used to receive one or more touches inputs that help is controlled at the various aspects of displaying contents on the display screen.In some cases, can receive one or more inputs (for example, multiple point touching) simultaneously.In these embodiments, touch-sensing layer (not shown) can be positioned under the lid glass 7106.The touch-sensing layer for example can be arranged between lid 7106 and the display module 7104.In some cases, the touch-sensing layer puts on display module 7104, and the touch-sensing layer puts on lid glass 7106 in other situation.The touch-sensing layer for example can be attached to the inside surface (printing, deposition, lamination or otherwise combine with it) of lid glass 7106.The touch-sensing layer generally comprises and be configured to a plurality of sensors of activating when the upper surface of finger touch lid glass 7106.In the simplest situation, when finger process sensor, just produce electric signal.Number of signals in the preset time frame can be indicated position, direction, speed and the acceleration of finger on the touch-sensitive part, and promptly signal is many more, and it is many more that the user moves its finger.In most of situations, signal is monitored that by electrical interface this electrical interface becomes position, direction, speed and acceleration information with quantity, combination and the frequency inverted of signal.This information can be used for carrying out expectation control function for display module 7104 by personal media device 7100 subsequently.
Personal media device 7100 also can comprise one or more switches, and wherein switch comprises power switch, volume control switch, user input device etc.Power switch 7110 can be configured to open or close personal media device 7100, and volume switch 7112 is configured to regulate the audio volume level that personal media device 7100 produces.Personal media device 7100 also can comprise one or more connectors, and the personal media device 7100 that is used to come and go transmits data and/or electric power.For example, opening 7115 can hold audio jack 7116, and opening 7117 can hold data/power connector 7118.Audio jack 7116 allows audio-frequency information to have the wired connection device from personal media device 7100 outputs, and connector 7118 allows to send data and receive data from main process equipment to the main process equipment such as multi-purpose computer (for example desk-top computer, pocket computer).Connector 7118 can be used for uploading or downloading audio frequency, video and other view data and operating system, application etc. from it to personal media device 7100.For example, connector 7118 can be used for song and playlist, audiobook, photo etc. are downloaded in the storing mechanism (storer) of personal media device 7100.Connector 7118 also allows electric energy is sent to personal media device 7100.
The part 7200 of personal media device 7100 can comprise a plurality of communication features.For example, part 7200 can comprise first audio-frequency unit 7120 at least, can be used to export the first of the sub-audible sound that is generated by the sub-audible sound maker assembly that is enclosed in housing 7102 inside.Described sub-audible sound maker assembly can adopt various ways.But in described embodiment, sub-audible sound maker assembly comprise at least be arranged to personal media device 7100 in the vibrating diaphragm of the sound signal synchronous vibration that provides of the processing unit that comprises.Sound signal can be provided by the decoding personal media device 7100 inner audio data files that keep by processing unit.7122 of second audio ports that are enclosed in connector assembly 7118 inside can be used to export the remainder of the sub-audible sound that is generated by sub-audible sound maker assembly.In this way, first audio port 7120 and second audio port 7122 can be exported the sub-audible sound that is generated by sub-audible sound maker assembly collaboratively.Described cooperation for example refers to blocked or when otherwise being subjected to hindering (by finger, clothing or the like), the position of second audio port 7122 has been got rid of the equally also blocked possibility of this second audio port 7122 substantially at first audio port.Therefore, because the air path that first audio port 7120 and second audio port 7122 are shared from the sub-audible sound maker to external environment condition, therefore when the part of described air path (for example, the part that is associated with first audio port 7120) blocked or when otherwise being subjected to hindering, at least some sound of the first of the sub-audible sound that is generated by sub-audible sound maker assembly can be redirected to second audio port 7122 passively, keep general perceives sound output level thus substantially.
For example, because connector assembly 7118 can be accepted aerial lug (for example, 30 pin connectors), therefore when connector engaged with connector assembly 7118, the major part of second audio port 7122 can blocked or obstruction.In this case, the user of personal media device 7100 unlikely can hold housing 7102 in a kind of mode of stopping up or hindering first audio port 7120.Therefore, even the existence that the connector that engages could stop up or hinder second audio port, 7122, the first audio ports 7120 substantially also can help keep the general perceives audio output level by output at least some sound from the passive sub-audible sound that is redirected to first audio port 7120 of second audio port 7122.
Figure 73 shows the viewgraph of cross-section of the mancarried electronic aid 7100 shown in Figure 71-72.Housing 7102 can surround various internal unit parts, and permission personal media device 7100 operations that for example are associated with user interface are used for the parts of its predetermined function.For discussing purpose, can think that the internal unit parts are disposed in a plurality of layers that pile up.For example, the display screen of display module 7104 can be located immediately at the below of top glass 7106.In one embodiment, display screen and related display driving circuit thereof the part that can be used as display module 7104 is encapsulated in together.What be in display module 7104 belows can be circuitry 7130, the main logic plate or the circuit that for example are associated with miscellaneous part, and the battery 7132 that is used for providing to personal media device 7100 electric power.
Inner frame 7140 can increase the overall hardness of personal media device 7100 by the ability that for example strengthens the bending moment that opposing housing 7102 bears.This inner frame 7140 can be made with multiple firm and flexible material.For example, when inner frame 7140 was made by the metal of stainless steel and so on, inner frame 7140 can be called as the M(metal)-framework 7140.M-framework 7140 not only can be for personal media device 7100 provides structural support, but also can be used for helping the heat with various internal parts generate to be sent to external environment condition.M-framework 7140 can be positioned at the below of display module 7104 and the top of circuitry 7130.In this way, M-framework 7140 can provide support for various internal parts, and helps to send the heat from the internal part of display module 7104 and so on.
M-framework 7140 can be as the attachment point of other parts of appliance.For example, M-framework 7140 can or use bonding agent and is attached to installation surface 7134a and 7134b on the housing 7102 via fastener.Then, other parts of appliance of display module 7104 and so on can be coupled to M-framework 7140, rather than are directly coupled to housing 7102.Display module 7104 is via the advantage that M-framework 7140 is coupled to housing: display 7140 can be isolated slightly with the bending moment that is associated with housing 7102, that is, the bending moment that generates on the housing can be dissipated to M-framework 7140.By display module and the bending moment that is associated with housing 7102 are isolated, can prevent to damage display module 7104, the generation of for example breaking.
Should be noted that in certain embodiments, personal media device 7100 can comprise additional inner frame.For example, framework 7150 can directly be fixed to housing 7102, and can be used to support top glass 7106 usually.In this regard, framework 7150 can be called as G(glass)-framework 7150.In order to support lid glass 7106, G-framework 7150 can comprise the edge 7152 with flange portion, and wherein lid glass 7106 is bonding with edge 7152 around flange 7154, seals entire equipment thus.G-framework 7150 can be made with non-conductive frame material, for example glass filled plastics.An example about the glass filled plastics that is adapted in the G-framework 7150 using is by Alpharetta, the KALIX that the Solvay Advanced Polymers of GA makes TMKALIX TMThe high performance nylon that comprises 50% glass fiber reinforcement.It will be recognized by those of ordinary skills, have a lot of other potential frame materials also to be fit to use with this embodiment, unless and spell out, claim should be construed to is to be limited to KALIX TMOr other any glass filled plasticses.
Figure 74 shows the zoomed-in view of the part 7200 of housing 7102 shown in the Figure 72 that sees from the front.At the remainder of this argumentation and do not lose generality, first audio port 7120 will be called as housing port 7202, the second audio ports 7120 and then be called as connector port 7204.Housing port 7202 can have size and the shape that conforms to outward appearance with the overall shape of housing 7102.For example, the sidewall 7206 of housing 7102 can have batten or curved shape, and this helps the user that personal media device 7100 is held in the hand.Correspondingly, housing port 7202 can be shaped to the shape that is easier to sidewall 7206 and coordinates mutually.Housing port 7202 can be positioned at the position with rear surface 7208 standoff distances " d " of housing 7102.Housing port 7202 adopts a kind of like this mode to dispose, and shown in Figure 75, the sound 7210 that sends from housing port 7202 can be directed the rear surface 7208 of housing 7102 with angle θ.In this way, when being placed on personal media device 7100 on the support surface S, the sub-audible sound of sending from housing port 7,202 7210 can be directed with the angled θ of surperficial S, thus with at least some sound guidances in the sub-audible sound 7210 to support surface S.In this way, support surface 7210 can be served as soundboard, so that at least a portion sound in the sub-audible sound 7210 can be by support surface S reflection, the sounding audio-frequency of robust presents thereby produce more.
Figure 76 shows the view according to the interior section 7500 of the personal media device 7100 of description embodiment.Shown in Figure 76, M-framework 7140 can be used to various internal parts to provide support, for example sub-audible sound maker assembly 7504 and connector assembly 7506.In described embodiment, sub-audible sound maker assembly 7504 can be fixed to housing 7102 by G-framework 7150 and M-framework 7140.Connector assembly 7506 can be installed to printed circuit board (PCB) (PCB) 7508 by veneer.Sub-audible sound maker assembly 7504 can comprise the audio amplifier 7510 with first 7512 and second portion 7514.First 7512 can comprise being arranged to provides the sub-audible sound of sub-audible sound 7518 maker unit 7516.First 7512 can be configured to provide first air path 7520.First air path 7520 can be via housing port assembly 7522 acoustics coupling sub-audible sound maker unit 7516 and housing port 7202.In this way, the first 7524 of sub-audible sound 7518 can use first air path 7520 via housing port assembly 7522 and housing port 7202 and be delivered to external environment condition from sub-audible sound maker unit 7516.
Second portion 7514 can be integrally formed with first 7512.Second portion 7514(is also referred to as " sidecar (side car) " part) can be configured to provide second air path 7526.Second air path 7526 can be via connector assembly 7506 acoustics coupling sub-audible sound maker unit 7516 and connector port 7204.In this way, the second portion 7528 of sub-audible sound 7518 can use second air path 7526 and be delivered to external environment condition from sub-audible sound maker unit 7516 via connector port 7204.In order to ensure firm attachment sub-audible sound maker assembly 7504, can use fastener 7530.Fastener 7530 can be diversified.Fastener 7530 can adopt the form that sub-audible sound maker assembly 7504, M-framework 7140 and connector assembly 7506 is fixed to the screw 7530 of housing 7102.
Adopt first air path 7520 to have plurality of advantages with the existence of at least two parallel air path of second air path, 7526 forms.This class advantage is: the existence of at least two air path can reduce the overall impedance to air-flow, reduces the loss amount of sub-audible sound energy in the course of normal operation thus.In this way, can listen efficient (that is the sound sensed level at given volume input level place) greatly to improve.In addition, by provide at least two can be for the parallel air path of the sub-audible sound 7518 that generates by sub-audible sound maker unit 7516 along its propagation, any increase to flow impedance in air path can partly compensate by another air path that passively air-flow is redirected to the littler impedance air path of expression at least.In this way, even an audio output port partly even is fully stopped up, the output sound level of perception will can significantly not reduce.In this way, the described maintenance that presents of the audio frequency that personal media device 7100 is provided can significantly improve user's perception of the audio performance of personal media device 7100.
For example, when sub-audible sound maker unit 7516 was just providing sub-audible sound 7518, first 7524 can be delivered to housing port 7202 via first air path 7520.The second portion 7528 of sub-audible sound 7518 can be delivered to connector port 7204 via second air port 7526 simultaneously.When by user's perception, sound sensed level on housing port 7202 and connector port 7204 (that is acoustic energy level) is roughly the same.What in other words, overall audio frequency perception will cause the hearer to infer that sub-audible sound 7210 is actually from single position rather than send at least two positions.Yet, if for example the user will point or other objects are placed on the position of stopping up or hindering housing port 7202, will enlarge markedly the flow impedance in the air path 7520 so, cause the significantly reduction of housing port 7202 place's acoustic energy output quantities thus.In this case, the impedance to air-flow that meets with at first air path, 7520 places increases can cause passively that at least some sound in the first 7524 are redirected to second air path 7526 from first air path 7520.In this way, even the acoustic energy output quantity at housing port 7202 places significantly reduces, the acoustic energy output quantity at connector port 7204 places also can be redirected to second air path 7526 passively and increased substantially from first air path 7520 because of acoustic energy.Thus, the overall audio output level of perception (that is audio volume level) can keep constant substantially.
Thus, the general integrity of obvious first air path 7520 and second air path 7526 is very important for the above-mentioned advantage that is retained to small part (particularly about the perception of the audio balance between audio frequency efficient, each output port and keep whole acoustics to experience).For example, in air path, can both reduce the overall audio frequency efficient of sub-audible sound maker assembly 7504 to any systemic increase of flow impedance.For example, second air path 7526 directly is connected to external environment condition via connector port 7204.In order to prevent to reduce the quality (for example owing to the accumulation of dust increases impedance to air-flow) of air path 7526, can between connector port 7204 and second portion 7514, place filtrator 7532 from the intrusion of the dust of external environment condition and other foreign material.Filtrator 7532(is as being shown in further detail hereinafter and discussing) can be used for preventing that the foreign material of sealing and dust and so on pollute second air path 7526.In addition, in described embodiment, filtrator 7532 can be firm but accessible, is provided at the ability of periodically clearing up filtrator 7532 under the situation that does not cause damage for the user thus.In addition, foam seal 7533 and foam seal 7535 can be applied to housing port 7202 and connector port 7204 simultaneously.The foam seal 7533 that is used for sealing gland housing port 7202 can adopt the thicker relatively froth bed and the form of ornamental mesh, and foam seal 7535 then can take to use the form of the foam ring of overlap joint on connector port 7204.
In a useful especially embodiment, filtrator 7532 can adopt the form that can be placed on the ornamental/hydrophobic mesh heap 7532 in the air path 7526.When being placed into air path 7526, ornamental/hydrophobic mesh heap 7532 can prevent moisture and dust intrusion personal media device 7100.Mesh heap 7532 can comprise a plurality of layers, and this wherein comprises the mesh layer at least.The mesh layer can provide an ornamental screen cloth, and it can prevent from directly to see from external environment condition the inside of personal media device 7100.Usually, the mesh part of mesh heap 7532 can be made with coarse and waterproof materials.In some cases, mesh material can be enough firm, so that provide at least some structural support for connector port 7204.The intensity of ornamental mesh can be enough big, so that opposing is by for example object being inserted into the infringement that causes in the connector port.
Except the protection of avoiding dust and moisture intrusion being provided and protecting the inside of personal media device 7100, it is accessible that described mesh also keeps, so that implement cleaning and foreign material removing.The accessibility of mesh is very useful, because the gathering of dust or other foreign material is clearly on the mesh heap 7532.The gathering of mesh place dust or other foreign material is very tedious, because the pollutant of dust and so on can focus on the mesh place and hinder the output of sub-audible sound, reduces the overall performance of personal media device 7100 and total user experience thus.By the burnisher of wet cotton rod of simple insertion and so on, just can remove on the mesh such as the foreign material of dust, prevent that thus described sealing from being filled up and voice output reduces.
Can be used to help to keep the integrality of second air path 7526 such as the feature of sealing gland 7534.Engaging between the rear portion that sealing gland 7534 can be used to hermetically sealed connector assembly 7506 and the second portion 7514.Sealing gland 7534 can be made by any suitable compatible material with appropriately sealed characteristic.For example, sealing gland 7534 can adopt the form of foam seal 7534.Because foam has compressive characteristics, foam seal 7534 can compress (shown in Figure 77) in place between the adapter 7538 of the adapter 7536 of second portion 7514 and connector assembly 7506.In described embodiment, adapter 7536 can be shaped according to adapter 7538, and adapter 7536 can closely be combined thus.In this way, the spatial accommodation inside that is provided by adapter 7538 can closely be provided adapter 7536.
In assembling process, sub-audible sound maker unit 7504 can use tilting action to be placed on housing 7102 inside.This tilting action can make adapter 7536 enter adapter 7538 obliquely and be held by it, can exert pressure this moment to second portion 7514, and 7514 of described second portions can connect sub-audible sound maker unit 7504 and be fixed to connector assembly 7506 and PCB7508.Enter and exert pressure by inclination, adapter 7536 can compression adapter 7536 and adapter 7538 between foam seal 7534, make the significantly compression of foam seal 7534 experience.In described embodiment, adapter 7538 can be shaped in a kind of mode of the compression of foam seal 7534 experience of emphasizing, greatly strengthens the ability that foam seal 7534 stopped or at least obviously suppressed moisture or other pollutant invading air paths 7526 thus.The register pin that is associated with second portion 7514 can tilt to insert use in the processing.This register pin has shape and the position that is configured to insert the accommodation hole among the PCB7508.Because PCB7508 and connector assembly 7506 are welded together during reflow treatment, so register pin can also keep second portion 7514 in position so that second portion 7514 become can't with connector assembly 7506 delamination.
In addition, keep feature 7540 can be used for further guaranteeing the sealing gland integrality of second air path 7526.Keep the feature 7540 can adaptive M-framework 7140, and in case in place, just prevent that adapter 7536 from separating with adapter 7538.Correspondingly, M-framework 7140 is placed on the top of connector assembly 7506 and audio amplifier 7510.M-framework 7140 can comprise the finger piece that is suitable for putting into maintenance feature 7540, and in one embodiment, described maintenance feature can be positioned at the shell part of connector assembly 7506.M-framework 7140 can also comprise spring clamp, and the latter can load the side of second portion 7514 towards connector assembly 7506.The power of creating by spring clamp can cause sealing 7534 at the joint of adapter 7534 and adapter 536 by overcompression.Therefore, in case in place, M-framework 7140 can prevent that connector assembly 7506 from separating with second portion 7514.Should be noted that sub-audible sound generation unit 7504 can be mounted to M-framework 7140 and G-framework 7150 firmly.This hardness is installed can help to prevent hum, and amplifies sub-audible sound via back side of shell 7208, and wherein said back side of shell 7208 can be outstanding when personal media device 7100 is in the hard plane surface of desk or desk and so on.
Figure 77 shows the zoomed-in view of the part 7600 shown in Figure 76.Part 7600 provides the more detailed view about the joint of connector assembly 7506 and second portion 7514.More specifically, part 7600 shows the additional detail of the mesh heap of filtrator 7532.Filtrator 532 can be formed by ornamental mesh 7602, invades and deterioration second air path 7526 in order to other pollutants of anti-sealing and dust and so on.Between the erecting stage of personal media device 7100, connector assembly 7506 is mounted and is attached to PCB7508 by using the surface mounting technique that is called solder reflow or abbreviates backflow as.During reflow treatment, the scolder of fusion is used to each parts are electrically connected to electrical bonding pads and trace as a PCB7508 part.Because condition harshness (comprising high temperature), filtrator 7532 can not adhere to that therefore, filtrator 7532 can't be the integration section of connector assembly 7506 from the reflow treatment that is used for connector assembly 7506 is surface mounted to printed circuit board (PCB) 7508.Thus, filtrator 7532 can be installed after the mounting technology that uses " port-cullis " (that is sliding gate) by name is surface mounted to PCB7508 with connector assembly 7506.By using sliding gate, filtrator 7532 can use slit or groove and be dropped to appropriate position between erecting stage.In case in place, filtrator 7532 can use the bonding agent of glue and so on to come seal in place.In this way, filtrator 7532 can play sealing function to environmental pollutants, in order to avoid it enters personal media device inside.
Figure 78 shows along the viewgraph of cross-section 7700 of the line A-A of Figure 76.Viewgraph of cross-section 7700 shows the sealing ability of foam seal 7534 and the relation between adapter 7536 and the adapter 7538.More specifically, keep spring 7701 can be used for confining force F RetensionDirectly put on second portion 7514.Confining force F RetensionCan cause adapter 7536 directly closely to contact " lance " shape part 7702 of adapter 7538 again.In this way, the chamfering of lance shape part 7702 (chamfered) surface 7704 and 7706 can guide confining force F RetensionComponent (as foam power F FoamShown in), so that towards the part 7708 of M-framework 7150 " overcompression " foam seal 7534, significantly increase the sealing ability of foam seal 7534 thus.Sub-audible sound generation unit 7504 can comprise the alignment pin 7710 that size and shape conform to PCB opening 7712.Between the erecting stage of personal media device 7100, use the connector alignment pin 7714 that enters PCB opening 7716, connector assembly 7506 can be fixed to PCB7508.Sealing 7718 can be used to strengthen sealing, and reduces the possibility that sound is revealed thus.
Figure 79 shows another embodiment, and wherein as the replacement of connector port 7204 or replenish, audio jack port 7900 can be used for using audio jack air path 7902 to export the sub-audible sound that is generated by sub-audible sound maker unit 7516.Audio jack air path 7902 can be connected to audio jack unit 7904 with sub-audible sound maker unit 7516 acoustics.More specifically, second portion 7514 can be connected to audio jack unit 7904 at for example audio jack pipe 7906 places.In this way, when not taken by the audio jack post, the part 7908 of sub-audible sound 7518 can be sent from audio jack port 7900.Should be noted that when the audio jack post was inserted audio jack pipe 7906, sub-audible sound maker unit 7516 was disabled usually, and therefore can not conflict mutually with any potential sub-audible sound that audio jack port 7900 sends.
Figure 80 shows the process flow diagram of detailed description according to the processing 8000 of description embodiment.Handling 8000 can be beginning with the housing that is provided for surrounding a plurality of functional units 8002, and wherein said a plurality of functional units are used for personal media device provides function.This housing can be with making such as the metal of stainless steel or aluminium, and can have seamless Construction integration.Described housing can comprise a plurality of openings, and each opening all has size and the shape of holding input-output apparatus, switch, connector or the like.Next 8004, loudspeaker assembly can be attached to the inside of housing.This loudspeaker assembly can adopt various ways.In described embodiment, loudspeaker assembly comprises the acoustic speaker of for example making with vibrating diaphragm, the electric signal vibration that the voicefrequency circuit of the audio file that described vibrating diaphragm then keeps in the personal media device according to decoding provides.Next will be configured in 8006, the first air path.Described first air path is coupled to external environment condition with loudspeaker assembly via the first audio output port acoustics.In described embodiment, first audio output port can adopt the form of the opening in the housing.Next 8008, configuration is independent of second air path of first audio output port between the loudspeaker assembly and second audio output port.Independently mean first audio output port and second audio output port can be by physical positioning so that have only one or another port rather than all two ports to be stopped up in two ports by the object of user's finger and so on.In this way, at least one audio port can remain not blocked substantially.
8010, sub-audible sound is generated by loudspeaker assembly.8012, use first and second audio ports, sub-audible sound is delivered to external environment condition from loudspeaker assembly collaboratively.Transmit collaboratively and refer to, the coupled so that impedance that in air path acoustic energy is transmitted of first air path and second air path increases at least some that cause in the described acoustic energy and is redirected to more low-impedance air path from the air path of higher resistance passively.For instance, if first audio output port gets clogged or hindered at least, cause in first air path impedance of acoustic energy stream is increased, at least some so otherwise in the acoustic energy that can be blocked are redirected to second air path.In this way, the audio output level of the perception of personal media device will keep constant substantially.
Figure 81 is the block diagram by the layout 8100 of the functional module of portable media device utilization.Portable media device for example can be an illustrative portable media device 7102 among Figure 71 and Figure 72.Arrange that 8100 comprise and can also store the media player 8102 of the data relevant with retrieval and data storage device 8104 for user's output audio of portable media device simultaneously.Arrange that 8100 also comprise graphic user interface (GUI) manager 8106.Gui management device 8106 operation provides and is presented at information on the display device with control.Arrange that 8100 also comprise the communication module of communicating by letter 8108 that promotes between portable media device and the accessory device.Further, arrange 8100 also comprise operation with checking and obtain from can with the add-on manager 8110 of the data of the accessory device of portable media device coupling.For example, accessory device can be a wireless interface accessory, such as wireless interface accessory illustrative at Figure 71 and portable media device 7102 couplings.
Figure 82 is the block diagram that is fit to the media player 8150 that uses with described embodiment.Media player 8150 illustrations the circuit of typical portable media device.Media player 8150 comprises processor 8152, and it relates to the microprocessor or the controller of the overall operation that is used to control media player 8150.The media data that media player 8150 will be referred to media item is kept in file system 8154 and the high-speed cache 8156.File system 8154 is a memory disc or a plurality of dish normally.File system 8154 is generally media player 8150 the high capacity storage capacity is provided.But because the access time of file system 8154 is relatively slow, therefore, media player 8150 can also comprise high-speed cache 8156.High-speed cache 8156 for example is the random-access memory (ram) that is provided by semiconductor memory.The relative access time of high-speed cache 8156 will far be shorter than the access time of file system 8154.But high-speed cache 8156 does not have the large storage capacity of file system 8154.Further, when activity, file system 8154 consumes more electric power than high-speed cache 8156.When media player 1150 was portable media device by battery 8174 power supply, power consumption can be a problem usually.Media player 8150 can also comprise RAM8170 and ROM (read-only memory) (ROM) 8172.ROM8172 can store program, utility routine or the processing that will be performed non-volatilely.RAM8170 provides volatile data storage, for example is used for the data storage of high-speed cache 8156.
Media player 8150 also comprises the user input device 8158 that the user that allows media player 8150 and media player 8150 are mutual.For instance, user input device 8158 can adopt various ways, and for example button, keypad, dial (of a telephone), touch-screen, audio input interface, video are caught input block, adopts input of sensing data form or the like.Further, media player 8150 comprises and can be come to the display 8160(of user's display message screen display by processor 8152 controls).Data bus 8166 can promote that the data between file system 8154, high-speed cache 8156, processor 8152 and CODEC8163 transmit at least.
In one embodiment, media player 8150 is used for a plurality of media item (for example, song, blog or the like) are stored in the file system 8154.When the user wishes with the media renderer plays certain media items, will show the tabulation of available media items on the display 8160.Then, by using user input device 8158, the user can select one of them available media item.In case receive the selection to certain media items, processor 8152 offers encoder/decoder (CODEC) 8163 with the media data (for example, audio file) of certain media items.CODEC8163 produces the analog output signal that is used for loudspeaker 8164 subsequently.Loudspeaker 8164 can be the loudspeaker of media player 8160 inside or media player 8150 outsides.For example, can think that the earphone or the earplug that link to each other with media player 8150 are external loudspeakers.
Media player 8150 also comprises the network/bus interface 8161 with data link 8162 couplings.Data link 8162 allows media player 8150 to be coupled to principal computer or accessory device.Data link 8162 can provide in wired connection or wireless connections.Under the situation of wireless connections, network/bus interface 8161 can comprise transceiver.Media item (media asset) can relate to one or more dissimilar media contents.In one embodiment, media item is track (for example, song, talking book and a blog).In another embodiment, media item is image (for example a, photo).And in other embodiments, media item can be the combination in any of audio frequency, figure or video content.
In one embodiment, inside antenna is used for Wi-Fi communication, such as according to IEEE802.11a, and b, those of g and n standard are communicated by letter.Wi-Fi is generally used for the Wireless Networking computing equipment, thereby and is often used in the Wi-Fi connection transmission information relevant with computing machine.Yet the communication of other type of carrying out in the Wi-Fi connection is increasing, and described communication comprises, for example, video phone call, e-book is downloaded to flat computer etc.Modularization material antenna module described herein can be used to this Wi-Fi communication.In another embodiment, inside antenna is used to the short-distance radio connected network communication, such as according to Bluetooth TMThose communications of standard.
In another embodiment, inside antenna is used to WiMAX (WiBB) communication, and such as IEEE802.16, it is also referred to as WiMAX, Local Multipoint Distribution System (LMDS) and hyperchannel multiple spot distribution services (MMDS).In another embodiment, inside antenna is used to cellular communication.This can comprise a communication of carrying out of using in many different cellular communication protocols, and described cellular communication protocol is such as global system for mobile communications (GSM), GPRS (General Packet Radio Service) (GPRS), CDMA (CDMA), Evolution-Data Optimized (EV-DO), enhanced data rates for gsm evolution (EDGE), 3GSM, DECT (DECT), digital AMPS(IS-136/TDMA) and integrated digital enhanced networks (iDEN).
In certain embodiments, inside antenna is the broad-band antenna that can be configured to receive a plurality of different frequency bands.But expection becomes the additional frequency band of time spent deployment at new wireless traffic in the future.The Antenna Design of each embodiment can be configured to operate on the one or more frequency bands that are fit to arbitrarily, so that cover interested existing or new business arbitrarily.If wish, a plurality of antennas can be provided, so that cover more multiband, the wideband resonance element is provided maybe can for one or more antennas, so that cover a plurality of interested communication bands.An advantage that use to cover the broad-band antenna design of a plurality of interested communication bands is that this makes and can reduce equipment complexity and cost, and minimizes the quantity of the handheld device of distributing to antenna structure.
When a plurality of monomer antennas not being provided or using tunable antenna to arrange when the hope relatively large frequency range of covering, The Wide-Band Design can be used to the one or more antennas in the wireless device.If wish, it is tunable that the broad-band antenna design can be made into, so that expand its bandwidth coverage, or can use in conjunction with additional antenna.Yet usually, The Wide-Band Design has has often reduced or eliminated the needs to a plurality of antennas and tunable configuration.
In addition, embodiments of the invention also relate to the Computer Storage product with computer-readable medium, store on this computer-readable medium to be used to carry out various computer codes with computer implemented operation.Described medium and computer code can be for purposes of the present invention and those codes of particular design and structure, or they can be known type and technician that be computer software fields obtainable.The example of computer-readable medium includes but not limited to: magnetic medium, such as hard disk, floppy disk and tape; The light medium is such as CD-ROM and DVD and hologram device; Magnet-optical medium is such as floptical; And by the hardware device of particular arrangement, such as special IC (ASIC), programmable logic device (PLD) (PLD) and ROM and RAM device for storage and executive routine code.The example of computer code comprises machine code, such as the machine code that produces by compiler, and the file of carrying out by the computing machine that uses interpreter that comprises high layer identification code.
In one embodiment, provide a kind of computer-readable medium, it comprises the computer program instructions of the various steps that are used to carry out assembly portable formula electronic equipment.Particularly, computer program instructions can be used for controlling each automatic installation component, such as for example, and robotic arm, automatic screwdriver etc., they can assemble this equipment and (or intervention of minimized at least people) without human intervention.By this way, computer instruction can be programmed to control machine support is welded to conductive shell, non-conductive framework is adhered to the part corresponding to second shape of first shape of having of the inside of conductive shell, the part with first shape by the interlocking antenna and framework, with antenna block be fixed on the framework, by for example screw threads being crossed antenna flexible cable and support, it is first-class that the antenna flexible cable is mechanically fixed to antenna block.
From this written description, will understand many feature and advantage of the present invention, and therefore claims are intended to cover all these feature and advantage of the present invention.In addition, because those skilled in the art expect many modifications and change easily, the present invention should not be limited to the accurate structure and the operation that illustrate and describe.Therefore, all modification and equivalents that are fit to are considered within the scope of the invention.

Claims (101)

  1. Be used for the compact-folded configuration of integrated circuit encapsulation
    1. method of making portable computing device comprises:
    First chip is attached to second chip via flexible circuit connector;
    To printed circuit board (PCB), wherein first chip is positioned in and makes this metal framework partly around this first chip in the metal framework with first chip attach, and wherein this metal framework couples mutually with this printed circuit board (PCB);
    The folded flexible circuitry connector also aligns second chip with first chip;
    Second chip is attached to first chip via bonding agent, and wherein said first chip and described second chip are with the stack arrangement combination;
    The part of flexible circuit connector through a side or many side joints ground of described metal framework, is spilt from described first chip and described second chip to prevent the RF signal; And
    The assembly that will comprise first chip, second chip, metal framework and printed circuit board (PCB) is installed in the portable computing device.
  2. 2. the method for claim 1 also comprises: align in the hole that is right after first chip and second chip in the parts that will be attached to flexible circuit connector and the metallic shield.
  3. 3. method as claimed in claim 1 or 2, wherein the described part of flexible circuit connector comprises a plurality of connector gaskets.
  4. 4. method as claimed in claim 3 also comprises: the described side or the many sides that connector gasket are soldered to metal framework.
  5. 5. method as claimed in claim 3 also comprises: use conductive strips connector gasket to be bonded to a described side or many sides of metal framework.
  6. 6. method as claimed in claim 1 or 2 also comprises: the first of flexible circuit connector is attached to first side of metal framework, and the second portion of flexible circuit connector is attached to second side of metal framework.
  7. 7. memory devices comprises:
    Be coupled to first chip of the first of flexible circuit connector;
    Comprise top surface and basal surface and be coupled to second chip of the second portion of flexible circuit connector, wherein the second portion of flexible circuit connector roughly covers described basal surface;
    The third part between described first and described second portion of flexible circuit connector;
    Flexible circuit connector from extended the 4th part of described second portion, comprise the connector gasket that is coupled to the circuit trace in the flexible circuit connector; And
    Wherein for memory devices is installed in the computing equipment, the folded flexible circuitry connector combines with first chip with the top surface that allows second chip, and allows the connector gasket metal parts ground connection in the equipment as calculated on the 4th part of flexible circuit connector.
  8. 8. memory devices as claimed in claim 7, wherein connector gasket to allow the part of circuit trace as faraday cup, prevents that the RF signal that first chip and second chip generate from leaving through metal parts ground connection thus from this faraday cup.
  9. 9. as claim 7 or 8 described memory devices, wherein said memory devices is coupled to the printed circuit board (PCB) that comprises described metal parts before in being installed on computing equipment.
  10. 10. memory devices as claimed in claim 9, wherein connector gasket is soldered to described metal parts.
  11. 11. memory devices as claimed in claim 9, wherein connector gasket is bonded to described metal parts via conductive adhesive tape.
  12. 12. as claim 7 or 8 described memory devices, also comprise extended and comprise the 5th part of the flexible circuit connector of second connector gasket from described second portion, wherein for memory devices is installed in the computing equipment, folding described the 5th part is coupled to described metal parts to allow second connector gasket.
  13. 13. a portable computing device comprises:
    Housing;
    Be coupled to the antenna of housing;
    Via a plurality of chips that flexible circuit connector is coupled to each other and arranges with stack arrangement, wherein the basal surface of first chip is attached to this flexible circuit connector; And
    Arrive the faraday cup of antenna with radio frequency (RF) signal that prevents to generate by chip around described a plurality of chips, described faraday cup is made of the part that metal framework and described flexible circuit connector are right after the basal surface of described first chip, and wherein said flexible circuit connector is through described metal framework ground connection.
  14. 14. portable computing device as claimed in claim 13 also comprises: from least a portion of flexible circuit connector that flexible circuit connector extends and be right after the basal surface of first chip, wherein said first is through described metal framework ground connection.
  15. 15. as claim 13 or 14 described portable computing devices, wherein said first is soldered to the Outboard Sections of described metal framework.
  16. 16. as claim 13 or 14 described portable computing devices, the first that also comprises the flexible circuit connector between second chip and first chip and second chip, wherein between erecting stage, the first of flexible circuit connector is folding, allows the top surface of first chip to be attached to the top surface of second chip thus.
  17. 17. portable computing device as claimed in claim 16 also comprises printed circuit board (PCB), wherein second chip is coupled to this printed circuit board (PCB).
  18. 18. portable computing device as claimed in claim 17, wherein said metal framework is made by silver-nickel.
    Be used to optimize the inner frame of rigidity and heat transmission
  19. 19. heat structure parts that are used for portable computing device comprise:
    By the interior metal framework that at least two kinds of different metals form, wherein said two kinds of different metals arrange that with layer described interior metal framework comprises:
    Form and be configured to increase by two outer metal layer of the structural rigidity of described interior metal framework by first metal; And
    Place intermediate metal layer between two outer metal layer, that form greater than second metal of first metal by thermal conductivity, described intermediate metal layer is configured to conduct the heat that is produced by the heat producing components in the portable computing device, heat is spread in the intermediate metal layer of described interior metal framework, and wherein said two outer metal layer and described intermediate metal layer connect via cladding process; And
    Wherein said two outer metal layer comprise and are used to allow heat bridge described middle layer heat to be attached to one or more holes on the surface of described heat producing components.
  20. 20. heat structure parts as claimed in claim 19, wherein first metal is a stainless steel, and second metal is a copper.
  21. 21. as claim 19 or 20 described portable electric appts, wherein said one or more holes are filled by Heat Conduction Material.
  22. 22. portable electric appts as claimed in claim 21, wherein said Heat Conduction Material are second metals.
  23. 23. as each described portable electric appts among the claim 19-22, wherein said two outer metal layer are made of stainless steel, and described middle layer is made of copper, wherein each stainless steel layer occupies thickness about 25% of described interior metal framework, described copper layer then occupy described interior metal framework thickness about 50%.
  24. 24. a portable electric appts comprises:
    Have the housing of thickness roughly;
    Roughly thickness with respect to described housing is arranged a plurality of parts of appliance with differing heights in enclosure interior;
    Mainly with an inner frame of highly settling, this inner frame is coupled to described housing and is made of at least two kinds of different materials with respect to the roughly thickness of described housing, and wherein said at least two kinds of different materials arrange that with layer described inner frame comprises:
    Constitute and be configured to increase by two exterior layers of the structural rigidity of described equipment by first material; And
    Place between two exterior layers, by the middle layer that thermal conductivity forms greater than second material of first material, described middle layer is configured to conduct the heat that is produced by described a plurality of parts of appliance, and heat is spread in the middle layer of described inner frame;
    Wherein said two exterior layers comprise a plurality of holes of a part that exposes described middle layer separately; And
    A plurality of heat bridges, the heat production surface that is configured to separately to be associated with a part of appliance in described a plurality of parts of appliance is attached to described middle layer via a hole heat that is right after this heat production surface in described a plurality of holes.
  25. 25. portable electric appts as claimed in claim 24, wherein said two exterior layers are formed by first metal, and described middle layer is formed by second metal.
  26. 26. portable electric appts as claimed in claim 25, wherein said two exterior layers and described middle layer connect via cladding process.
  27. 27. portable electric appts as claimed in claim 26, the part in wherein said middle layer are clamp-oned each described hole during described cladding process.
  28. 28. portable electric appts as claimed in claim 24, wherein said a plurality of holes only are arranged in an exterior layer of described two exterior layers.
    Synthetic microphone storehouse is to optimize sealing and mechanical attributes
  29. 29. a synthetic microphone storehouse comprises:
    Be shaped to comply with first end cap of the crooked inner surface of portable computing device;
    Be shaped to comply with second end cap of the outside surface of microphone;
    Place the centering portions between first end cap and second end cap, this centering portions, first end cap and second end cap are around a hollow inside, the sound that this hollow inside is configured to enter via the hole in the housing of portable computing device causes microphone, wherein this centering portions is used as vibroshock at the portable computing device duration of work thus by forming than first end cap and the softer material of second end cap.
  30. 30. synthetic microphone as claimed in claim 29 storehouse, wherein said softer material is silica-based plastics.
  31. 31. synthetic microphone as claimed in claim 29 storehouse, wherein said synthetic microphone storehouse forms during the dijection Shooting Technique.
  32. 32. synthetic microphone as claimed in claim 29 storehouse, wherein first end cap, second end cap and centering portions are formed separately.
  33. 33. synthetic microphone as claimed in claim 32 storehouse, wherein first end cap, second end cap and centering portions are mounted in portable computing device via mechanical constraint and are held in place, and need not this first end cap, second end cap and centering portions physical bond each other.
  34. 34. synthetic microphone as claimed in claim 29 storehouse, wherein said microphone storehouse is columniform.
  35. 35. a microphone assembly comprises:
    Circuit board;
    Be coupled to the microphone of circuit board;
    Be bonded to the synthetic microphone storehouse of microphone, comprise the centering portions that places between first end cap and second end cap, this centering portions, first end cap and second end cap are around a hollow inside, the sound that this hollow inside is configured to enter via the hole in the housing of portable computing device causes microphone, wherein this centering portions, first end cap and second end cap are formed by the material of different hardness, and select described hardness to be configured at the portable computing device duration of work as vibroshock will synthesize the microphone storehouse.
  36. 36. microphone assembly as claimed in claim 35, wherein second end cap is bonded to the outside surface of microphone via contact adhesive (PSA).
  37. 37. as claim 35 or 36 described microphone assemblies, the upper surface bending of wherein said end cap is with the inside surface of the housing of complying with portable computing device.
  38. 38. as claim 35 or 36 described microphone assemblies, wherein first end cap and second end cap are formed by the material softer than centering portions.
  39. 39. as claim 35 or 36 described microphone assemblies, wherein first end cap and second end cap are formed by the material harder than centering portions.
  40. 40. as claim 35 or 36 described microphone assemblies, wherein centering portions is around the variation in thickness of described hollow inside.
    Modularization material antenna module
  41. 41. a portable electric appts comprises:
    Conductive shell;
    Non-conductive framework, described non-conductive framework is made by the frame material with first specific inductive capacity, and is attached to the inside of described conductive shell, and described conductive shell and described non-conductive framework form one-piece construction;
    Antenna block, described antenna block is made by the antenna block material with second specific inductive capacity more much smaller than described first specific inductive capacity, and the part of wherein said antenna block has with the counterpart interlocking of described non-conductive framework and described antenna block is fixed to the shape of described non-conductive framework; With
    Be mechanically fixed to the antenna flexible cable of described antenna block.
  42. 42. portable electric appts as claimed in claim 41, wherein said non-conductive frame material is a glass filled plastics.
  43. 43. as claim 41 or 42 described portable electric appts, wherein said antenna block material is a cyclic olefin polymer.
  44. 44. as claim 41 or 43 described portable electric appts, wherein said conductive shell comprises stainless steel.
  45. 45. portable electric appts as claimed in claim 41, wherein said non-conductive framework comprise the edge of the lid glass that is designed to support described portable electric appts.
  46. 46. portable electric appts as claimed in claim 45, wherein said edge comprises flange.
  47. 47. portable electric appts as claimed in claim 41, the part that has with the shape of the counterpart interlocking of described non-conductive framework of wherein said antenna block is a groove part, and the described counterpart of described non-conductive framework is a jut.
  48. 48. portable electric appts as claimed in claim 41, wherein said antenna block also comprise the second portion that has with the shape of the second counterpart interlocking of described non-conductive framework.
  49. 49. portable electric appts as claimed in claim 41, wherein said antenna flexible cable is mechanically secured on the conducting bracket that is welded on the described conductive shell, and is electrically connected to the circuit board of described portable electric appts.
  50. 50. a method that is used for assembly portable formula electronic equipment comprises:
    Conductive shell is provided;
    The inside that non-conductive framework is adhered to described conductive shell is to form one-piece construction, and wherein said non-conductive framework is made by the frame material with first specific inductive capacity;
    By the part with first shape of interlocking antenna block and the part with second shape corresponding of described non-conductive framework with described first shape, described antenna block is fixed on the described non-conductive framework, wherein said antenna block is made by the antenna block material with second specific inductive capacity, and described first specific inductive capacity of described second permittivity ratio is much smaller; With
    The antenna flexible cable is mechanically fixed to described antenna block.
  51. 51. method as claimed in claim 50 also comprises: conducting bracket is welded to described conductive shell, and wherein electrical connection comprises: described antenna flexible cable is connected to described antenna block and is connected to described conducting bracket.
  52. 52. method as claimed in claim 51 wherein is connected to described antenna block with described antenna flexible cable and comprises:
    Screw in screw by the hole in the described antenna flexible cable and by the hole in the described antenna block.
  53. 53. method as claimed in claim 51 wherein is connected to described conducting bracket with described antenna flexible cable and comprises:
    Screw in screw by the hole in the described antenna flexible cable and by the hole in the described conducting bracket.
  54. 54. method as claimed in claim 50 also comprises:
    Described antenna flexible cable is connected to system board, so that can use described antenna block to send and the reception radio communication.
  55. 55. method as claimed in claim 54 is wherein carried out described radio communication by the WiFi agreement.
  56. 56. method as claimed in claim 54 is wherein passed through Bluetooth TMAgreement is carried out described radio communication.
  57. 57. method as claimed in claim 54 is wherein carried out described radio communication by the short distance wide-bandwidth standards.
  58. 58. method as claimed in claim 54 is wherein carried out described radio communication by cellular telephony protocol.
  59. 59. method as claimed in claim 50, wherein said first specific inductive capacity is approximately 5, and wherein said second specific inductive capacity is approximately 2.25.
  60. 60. method as claimed in claim 50, wherein said non-conductive frame material has the dielectric loss tangent between 2.5 and 4, and wherein said non-conductive frame material has approximate 0.0005 dielectric loss tangent.
    The PCB that forms
  61. 61. a main logic plate comprises:
    Go up processor and the storer that forms at continuous multilayer board (PCB), be configured to receive electric power from battery,
    PCB comprises:
    Be configured to first rectangle part with the battery hanging;
    Be configured to second rectangle part that aligns with the battery bottom;
    The narrow thin third part that connects first and second portion is configured to roughly comply with a side of battery so that first, second portion and narrow thin third part center on described battery partly.
  62. 62. main logic plate as claimed in claim 61, wherein the main logic plate is installed in the shell of portable computing device, makes the rectangle part of winning be fixed in the described shell and the height height place inequality that second rectangle part is installed.
  63. 63. a plurality of traces that provide data or power to be connected between one or more parts that are attached to first rectangle part and the one or more parts that are attached to second rectangle part are provided for main logic plate as claimed in claim 61, wherein narrow thin third part.
  64. 64. main logic plate as claimed in claim 61, wherein narrow thin third part are crooked or reverse in its installation site in equipment.
  65. 65. main logic plate as claimed in claim 61, wherein PCB comprises trace layer, and is not used in the material that forms trace and is left in the trace layer of PCB, to influence the rigidity of PCB during bending.
  66. 66. main logic plate as claimed in claim 61, wherein PCB comprises the metal level that is formed with the material of the rigidity that increases PCB by selected, and described metal level does not comprise trace.
  67. 67. a portable electric appts comprises:
    Shell;
    Be encapsulated in the part of appliance in the described shell, described part of appliance comprises top, bottom and sidepiece, and wherein said sidepiece comprises each other two faces at angle; And
    The continuous multilayer printed circuit board (PCB) (PCB) that in planar configuration, forms, comprise 1) basalis, 2) trace layer, 3) metal level and 4) be attached to one or more assemblies of PCB, wherein relative to each other bending is at angle at the assembly process of portable electric appts for two of PCB parts, to allow PCB to fit in the space that is right after described two faces, the PCB sidepiece of compliant device parts roughly thus, and wherein metal level is configured to harden described PCB so that described two parts still are in the curved configuration after bending applies.
  68. 68. as the described portable electric appts of claim 67, wherein said one or more parts only are attached to the top surface of PCB.
  69. 69. as the described portable electric appts of claim 67, wherein one or more parts are positioned at the basal surface of PCB, and one or more parts are positioned at the top surface of PCB.
  70. 70. as the described portable electric appts of claim 67, wherein said side comprises sweep, and wherein the part of PCB is crooked to follow the curvature of this sweep.
  71. 71. as the described portable electric appts of claim 67, wherein PCB is the main logic plate that comprises processor.
  72. 72. a portable electric appts comprises:
    Shell;
    Be installed in the battery in the described shell;
    Be installed in a plurality of parts of appliance in the described shell; And
    The main logic plate, this main logic plate comprises processor and storer, go up to form at continuous multilayer board (PCB), and is configured to receive from the electric power of battery and controls described portable electric appts, this PCB comprises:
    The first special shaped portion in first space between the described a plurality of parts of appliance that are configured to fit in described battery and comprise processor;
    Be configured to fit in described battery and comprise the second special shaped portion in second space between described a plurality of parts of appliance of the circuit that is used to operate described portable electric appts;
    The path that is installed between described a plurality of part of appliance and the battery is interior in order to connect the narrow thin third part in first space and second space, and wherein this narrow thin shaped portion only comprises the trace that is used for providing data or power supply connection between the first special shaped portion and the second special shaped portion.
  73. 73. as the described portable electric appts of claim 72, wherein the first special shaped portion or the second special shaped portion are shaped as rectangle.
  74. 74. as the described portable electric appts of claim 72, wherein the first special shaped portion or the second special shaped portion comprise one or more sweeps.
  75. 75. as the described portable electric appts of claim 72, wherein the first special shaped portion and the second special shaped portion are installed each other at angle.
  76. 76. as the described portable electric appts of claim 72, wherein the first special shaped portion and the second special shaped portion are installed with differing heights relative to each other.
  77. 77. as the described portable electric appts of claim 72, wherein the path between first space and second space comprises one or more ladders or bending, and the third part bending is to follow described one or more ladder or bending.
    Use the ending connecting audio of the connector in the small form factor electronic equipment
  78. 78. a personal media device comprises:
    Housing, described housing has a plurality of openings, wherein at least one opening is first port that is arranged to be convenient to broadcast the first of listened to the energy that is generated by the audio frequency maker that is enclosed in enclosure interior, and at least one opening is second port that is used to broadcast the second portion of listened to the energy that is generated by described audio frequency maker, wherein when at least a portion of first port gets clogged, at least some energy in the described first of listening energy are redirected to second port.
  79. 79. according to the described personal media device of claim 78, wherein second port is incorporated connector opening in the mode that described second port keeps not seen by the user of personal media device substantially.
  80. 80. according to the described personal media device of claim 79, wherein second port is held by connector opening.
  81. 81. 0 described personal media device according to Claim 8, wherein connector opening holds data connector.
  82. 82. 1 described personal media device according to Claim 8, wherein data connector has 30 pins.
  83. 83. 0 described personal media device according to Claim 8, wherein connector opening holds audio jack.
  84. 84. according to the described personal media device of claim 78, wherein first and second audio ports are positioned so that a port in the described audio port is when being blocked by object, and another audio port still can be used for exporting otherwise in the sub-audible sound that can be blocked by described object at least some.
  85. 85. a method comprises:
    Housing is provided, and described housing has the encirclement of being fit to and is used to personal media device that the size and the shape of a plurality of functional units of function are provided;
    Loudspeaker assembly is attached to the inside of housing;
    Configuration is coupled to described loudspeaker assembly first air path of external environment condition via the first audio output port acoustics;
    At loudspeaker assembly and be independent of configuration second air path between second audio output port of first audio output port, so that first audio output port is become when one of described audio output port is blocked by object by physical positioning with second audio output port, keep another audio output port not get clogged at least; And
    Use first and second audio ports will be delivered to external environment condition by the sub-audible sound that loudspeaker assembly generates collaboratively.
  86. 86. 5 described methods according to Claim 8 also comprise:
    Increase the impedance that the first audio path place transmits sub-audible sound;
    At least some sound in the sub-audible sound are redirected to second audio path passively from first audio path, constant substantially so that the general perceives of audio output level keeps.
  87. 87. 6 described methods according to Claim 8 wherein increase the first audio path place impedance of sub-audible sound transmission are comprised:
    Use described object to block first audio output port.
  88. 88. 5 described methods according to Claim 8, wherein first audio output port is the housing port, and described housing port is held by the housing port openings in the housing.
  89. 89. 5 described methods according to Claim 8, wherein second audio output port is a connector port, and described connector port is included in the connector opening.
  90. 90. 9 described methods according to Claim 8, wherein said connector opening has size and the shape of holding data connector.
  91. 91. 9 described methods according to Claim 8, wherein said connector opening has size and the shape of holding audio jack.
  92. 92., also comprise according to the described method of claim 91:
    The audio frequency post is inserted audio jack;
    The forbidding loudspeaker assembly.
  93. 93. an integrated sub-audible sound output system of incorporating personal media device into, described personal media device has processor, voicefrequency circuit and data holding unit at least, and described integrated sub-audible sound output system comprises:
    Sub-audible sound maker unit, described sub-audible sound maker unit are arranged to according to from data holding unit retrieval, produce sub-audible sound by the voicefrequency circuit decoding and by the voice data of processor processing,
    First audio output port, described first audio output port is coupled to sub-audible sound maker unit via the first air path acoustics; And
    Second audio output port, described second audio output port is coupled to sub-audible sound maker unit via the second air path acoustics, and wherein the cooperation of first and second air path will be being delivered to external environment condition via first audio port and second audio port by the sub-audible sound that sub-audible sound maker unit generates.
  94. 94. according to the described integrated sub-audible sound maker of claim 93 system, wherein first audio output port is the housing port, second audio output port is accommodated in the data connector opening.
  95. 95. according to the described integrated sub-audible sound maker of claim 93 system, wherein first audio output port is the housing port, second audio output port is accommodated in the audio jack unit, and described audio jack unit comprises the audio jack pipe that links to each other with second air path.
  96. 96. according to the described integrated sub-audible sound maker of claim 93 unit, wherein when first audio output port gets clogged, the first of the sub-audible sound that is generated by described sub-audible sound maker unit will be prevented from being delivered to external environment condition from described sub-audible sound maker unit via first audio output port.
  97. 97. according to the described integrated sub-audible sound maker of claim 96 unit, wherein at least some sound in the first that gets clogged of the sub-audible sound that is generated by sub-audible sound maker unit are redirected to choke free substantially second air path of maintenance passively, make the general perceives of audio output level of personal media device keep constant substantially.
  98. 98. a nonvolatile computer-readable medium is used for storing the computer program of being carried out and being used at the area of computer aided assembly of personal media device by processor, described program comprises:
    Be used to provide the computer code of housing, described housing has the sealing of being fit to and is used to personal media device that the size and the shape of a plurality of functional units of function are provided;
    Be used for loudspeaker assembly is attached to the computer code of enclosure interior;
    Be used to dispose the computer code that loudspeaker assembly is coupled to first air path of external environment condition via the first audio output port acoustics;
    Be used at loudspeaker assembly and be independent of the computer code of configuration second air path between second audio output port of first audio output port, so that first audio output port is become when one of described audio output port is blocked by object by physical positioning with second audio output port, another audio output port keeps not getting clogged at least; Wherein in personal media device operating period, first air path and the cooperation of second air path are to use first and second audio ports to be delivered to external environment condition by the sub-audible sound that loudspeaker assembly generates.
  99. 99. according to the described computer-readable medium of claim 98, wherein when the impedance of on first audio path sub-audible sound being transmitted increases, at least some sound from the sub-audible sound of first audio path are redirected to second audio path passively, so that other general perceives of audio frequency output stage keeps constant substantially.
  100. 100. according to the described computer-readable medium of claim 99, wherein the impedance increase to the sub-audible sound transmission comprises on first audio path:
    Use described object to block first audio output port.
  101. 101. according to the described computer-readable medium of claim 98, wherein first audio output port is the housing port, described housing port is held by the housing port openings in the housing.
CN201180047961.2A 2010-08-19 2011-08-19 Portable electric appts Active CN103221896B (en)

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US12/859,701 US8427379B2 (en) 2010-08-19 2010-08-19 Modular material antenna assembly
US12/859,711 2010-08-19
US12/859,712 US8477492B2 (en) 2010-08-19 2010-08-19 Formed PCB
US12/859,712 2010-08-19
US12/859,702 2010-08-19
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US12/859,711 US8515113B2 (en) 2010-08-19 2010-08-19 Composite microphone boot to optimize sealing and mechanical properties
US12/859,701 2010-08-19
US12/859,694 2010-08-19
US12/859,702 US8391010B2 (en) 2010-08-19 2010-08-19 Internal frame optimized for stiffness and heat transfer
US37786610P 2010-08-27 2010-08-27
US61/377,866 2010-08-27
US12/950,793 US9602914B2 (en) 2010-08-27 2010-11-19 Porting audio using a connector in a small form factor electronic device
US12/950,793 2010-11-19
PCT/US2011/048404 WO2012024578A2 (en) 2010-08-19 2011-08-19 Portable electronic device

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CN103221896B CN103221896B (en) 2017-06-09

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CN (1) CN103221896B (en)
WO (1) WO2012024578A2 (en)

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CN109451411A (en) * 2018-11-28 2019-03-08 深圳市南和移动通信科技股份有限公司 Low interference player module and mobile terminal
CN111867826B (en) * 2019-02-27 2022-06-28 株式会社Lg化学 Case for secondary battery and secondary battery having the same
CN111867826A (en) * 2019-02-27 2020-10-30 株式会社Lg化学 Case for secondary battery and secondary battery having the same
CN115314813A (en) * 2019-02-28 2022-11-08 谷歌有限责任公司 Enhanced actuator for distributed mode loudspeaker
CN115314813B (en) * 2019-02-28 2024-03-15 谷歌有限责任公司 Enhanced actuator for distributed mode speakers
CN112235438A (en) * 2019-06-30 2021-01-15 Oppo广东移动通信有限公司 Shell assembly and preparation method thereof, antenna assembly and electronic equipment
CN113572882A (en) * 2020-04-29 2021-10-29 维沃移动通信有限公司 Protective sleeve of electronic equipment
CN113572882B (en) * 2020-04-29 2024-06-04 维沃移动通信有限公司 Protective sleeve of electronic equipment
CN111901733B (en) * 2020-07-28 2021-10-12 维沃移动通信有限公司 Electronic device
CN111901733A (en) * 2020-07-28 2020-11-06 维沃移动通信有限公司 Electronic device

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WO2012024578A3 (en) 2012-04-12
KR20130055661A (en) 2013-05-28
WO2012024578A2 (en) 2012-02-23
EP2606407A2 (en) 2013-06-26
KR101494555B1 (en) 2015-02-17
KR101417695B1 (en) 2014-07-08
CN103221896B (en) 2017-06-09
KR20130042050A (en) 2013-04-25

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