WO2012008233A1 - Surface mount light-emitting device, and display unit - Google Patents

Surface mount light-emitting device, and display unit Download PDF

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Publication number
WO2012008233A1
WO2012008233A1 PCT/JP2011/062678 JP2011062678W WO2012008233A1 WO 2012008233 A1 WO2012008233 A1 WO 2012008233A1 JP 2011062678 W JP2011062678 W JP 2011062678W WO 2012008233 A1 WO2012008233 A1 WO 2012008233A1
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WIPO (PCT)
Prior art keywords
emitting device
display unit
wiring
wiring board
light
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Application number
PCT/JP2011/062678
Other languages
French (fr)
Japanese (ja)
Inventor
将人 寺西
江藤　力
斎藤　雄作
柳浦　聡
治彦 角谷
博夫 坂本
阿部　修
Original Assignee
三菱電機株式会社
岩谷産業株式会社
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Application filed by 三菱電機株式会社, 岩谷産業株式会社 filed Critical 三菱電機株式会社
Publication of WO2012008233A1 publication Critical patent/WO2012008233A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to a surface-mounted light-emitting device using an LED chip as a light-emitting source, and a display unit using the surface-mounted light-emitting device.
  • surface-mounted LED display units in which surface-mounted LED packages with built-in LED chips are arranged at lattice points have become widespread, and with the increase in outdoor use, development of higher-definition surface-mounted LED display units has been progressing. It is getting popular.
  • a surface mount type LED display unit has a surface mount type LED package mounted on the wiring board by connecting the electrodes of the surface mount type LED package to the wiring portion of the wiring board by soldering or brazing. Composed.
  • a surface-mount LED package is composed of an LED chip that is a light-emitting element, a pair of electrodes connected to the LED chip via bonding wires, and an insulating material such as a transparent epoxy resin that integrally accommodates these electrodes. And a mold part.
  • the wiring board on which the wiring portion is printed is made of an insulating material such as glass epoxy resin obtained by impregnating a glass fiber cloth with an epoxy resin or the like.
  • the conventional surface mount LED display unit configured as described above has a wiring between the electrode portion of the surface mount LED package and the wiring board due to the difference in linear expansion coefficient between the surface mount LED package and the wiring board.
  • electrodes of a surface mount LED package fixed to a circuit pattern of a wiring board via a bonding material are formed in a shape that can be elastically deformed, and the difference in linear expansion coefficient between the surface mount LED package and the wiring board
  • a surface-mounted light-emitting device that absorbs the strain caused by the above by an electrode that can be elastically deformed to prevent the occurrence of the above-mentioned cracks (see, for example, Patent Document 1).
  • a terminal portion in a circuit pattern of a wiring board fixed to an electrode of a surface mounting LED package via a bonding material is formed to be elastically deformable, and linear expansion between the surface mounting LED package and the wiring board is achieved.
  • a surface-mounted light-emitting device that absorbs strain caused by a difference in coefficients by the above-described elastically deformable terminal portion and prevents the occurrence of the above-described cracks (see, for example, Patent Document 2). .
  • the external connection terminal of the surface mount type LED package fixed to the circuit pattern of the wiring board via a bonding material is constituted by a clip portion sandwiching the LED package and an L-shaped elastic portion, and is surface mounted type.
  • a surface mount type light emitting device has been proposed in which distortion caused by a difference in linear expansion coefficient between an LED package and a wiring board is absorbed by an L-shaped elastic portion to prevent the occurrence of the aforementioned cracks ( For example, see Patent Document 3).
  • the conventional device in which the surface on the side in contact with the wiring board in the surface-mount type LED package described above is covered with another insulating material formed of a material having a linear expansion coefficient close to the linear expansion coefficient of the wiring board.
  • another insulating material formed of a material having a linear expansion coefficient close to the linear expansion coefficient of the wiring board.
  • the present invention has been made in order to solve the above-described problems in the conventional surface-mounted light-emitting device, and without causing the configuration to be complicated, the electrode portion of the surface-mounted light-emitting device and the wiring portion of the wiring board It is an object of the present invention to provide a highly reliable surface-mount light-emitting device in which the occurrence of cracks at the joint is reliably suppressed.
  • the present invention has been made in order to solve the above-described problems in the conventional surface-mount display unit, and without causing the configuration to be complicated, the electrode portion and the wiring board of the surface-mount light-emitting device can be obtained.
  • An object of the present invention is to provide a highly reliable display unit in which the occurrence of cracks at the joint with the wiring portion is reliably suppressed.
  • a surface-mount light-emitting device includes an LED chip serving as a light-emitting source, a plurality of electrode parts connected to the LED chip, and a mold part that houses the LED chip and the plurality of electrode parts.
  • a plurality of electrode parts are bonded to a wiring part of a wiring board, and the back surface of the mold part is mounted so as to be opposed to the front surface of the wiring board,
  • the mold part includes a hollow part that forms a space on the back surface side.
  • the display unit according to the present invention is a display unit in which a surface-mounted light-emitting device is disposed at each of a plurality of lattice points, and the surface-mounted light-emitting device includes an LED chip serving as a light source and the LED chip.
  • the back surface of the surface mount type light emitting device is configured to be mounted so as to be opposed to the front surface of the wiring board, and the mold portion of the surface mount light emitting device includes a recess portion that forms a space on the back surface side. It is what.
  • the surface-mounted light-emitting device is placed on the wiring board via glass beads, and bonding between the electrode and the wiring part of the wiring board is performed by soldering or This is performed by brazing, and the solder material by soldering or the brazing material by brazing is filled in the gaps between the respective electrodes formed by the glass beads and the wiring portion.
  • the recess portion that forms the space is provided on the back surface side of the mold portion that accommodates the LED chip and the plurality of electrode portions, the electrode portion and the wiring portion of the wiring board are provided. It is possible to reduce the stress generated at the joint portion.
  • the surface-mounted light-emitting device having a recess portion that forms a space on the back side of the mold portion that houses the LED chip and the plurality of electrode portions is provided with a plurality of lattice points. Therefore, the stress generated at the joint between the electrode portion and the wiring portion of the wiring board can be reduced.
  • the surface-mounted light-emitting device is placed on the wiring board via glass beads, so that the soldering material by soldering for joining the electrode part and the wiring part or the A brazing material by brazing is filled in a gap between each of the electrodes formed by the glass beads and the wiring portion, and the amount of the solder material or brazing material can be increased. The strength of the joint portion with the portion can be increased.
  • FIG. 1 is a cross-sectional side view showing a part of a surface-mounted light-emitting device and a display unit according to Embodiment 1 of the present invention. It is a cross-sectional side view which shows a part of display unit by Embodiment 2 of this invention.
  • a surface-mounted LED package 100 which is a surface-mounted light-emitting device, includes an LED chip 10 that emits light when a predetermined voltage is applied, a chip holding unit 11 that holds the LED chip 10, and an LED.
  • the chip 10 is composed of a pair of electrodes 14 and 15 connected to a pair of electrodes (not shown) of the chip 10 via bonding wires 12 and 13, respectively, and a mold portion 16 made of a transparent epoxy resin.
  • the mold part 16 is formed by molding a transparent epoxy resin, and houses the LED chip 10, the chip holding part 11, the pair of electrode parts 14 and 15, and the bonding wires 12 and 13 therein. These are fixed together.
  • the electrode portions 14 and 15 include wire connection portions 141 and 151 connected to the bonding wires 12 and 13, respectively, and an intermediate portion 142 that is bent substantially perpendicularly from the wire connection portions 141 and 151 and extends in the vertical direction in FIG. 152 and outer conductor connecting portions 143 and 153 which are bent at substantially right angles from the intermediate portions 142 and 152 and extend in the horizontal direction in FIG.
  • the lower surfaces of the external conductor connecting portions 143 and 153 in the electrode portions 14 and 15 are in the same plane as the back surface of the mold portion 16 and are exposed from the back surface of the mold portion 16. Further, the end portions of the outer conductor connecting portions 143 and 153 are exposed from the lower side surface of the mold portion 16.
  • a hollow part 17 formed by a concave groove penetrating from one end face to the other end face.
  • the hollow portion 17 forms a space that separates one electrode portion 14 and the other electrode portion 15 on the back surface side of the mold portion 16. That is, a part of the outer conductor connecting part 143 and the intermediate part 142 of one electrode part 14 and a part of the outer conductor connecting part 153 and the intermediate part 152 of the other electrode part 15 are the space formed by the recess part 17. Are separated from each other.
  • the wiring board 200 is made of an insulating material such as a glass epoxy resin obtained by impregnating a glass fiber cloth with an epoxy resin or the like, and a conductor is formed in a predetermined pattern on the surface by printing. A wiring part (not shown) is provided.
  • the surface-mounted LED package 100 is mounted on the wiring board 200 with a pair of electrode portions 14 and 15 bonded to predetermined wiring portions of the wiring board 200 by soldering.
  • the joint portions 31 and 32 made of solder material by soldering firmly fix the wiring portion of the wiring board 200 and the exposed portions of the external conductor connecting portions 143 and 153 of the surface mount LED package 100, and electrically connect them. Connected to.
  • the back surface of the mold part 16 faces the surface of the wiring board 200, and the back surface may abut against the surface of the wiring board 200.
  • the display unit according to Embodiment 1 of the present invention is configured by mounting the above-described surface-mount LED package 100 on a large number of lattice points on a wiring board.
  • Each surface-mount LED package 100 is configured as shown in FIG.
  • a known technique can be used for the operation relating to the display of video or characters in the display unit configured as described above, and the description thereof is omitted here.
  • the insulating material constituting the wiring board 200 and the mold portion 16 of the surface mount type LED package 100 are configured.
  • the insulating material is made of a different material and has a different linear expansion coefficient. Therefore, in the case of the conventional apparatus, due to the temperature change, stress is generated in the joint portions 31 and 32 due to the difference in the linear expansion coefficient, and the joint portions 31 and 32 may be cracked or peeled off.
  • the recess 17 is formed on the back surface side of the mold part 16 of the surface mount LED package 100, the contact between the surface mount LED package 100 and the wiring board 200 is achieved.
  • the electrode parts 14 and 15 of the surface-mount LED package 100 and the wiring part of the wiring board 200 are reduced. It is possible to suppress the occurrence of cracks in the joint portions 31 and 32 due to soldering, and to improve the reliability of the surface mount LED package 100 and the display unit.
  • FIG. 2 is a cross-sectional side view showing a part of a display unit according to Embodiment 2 of the present invention.
  • the structure of the surface-mounted LED package 100 as the surface-mounted light emitting device is the same as that of the surface-mounted LED package 100 shown in FIG. 1 in the first embodiment.
  • the configuration of wiring board 200 is the same as that of wiring board 200 shown in FIG. 1 in the first embodiment.
  • the surface-mounted LED package 100 is placed on the surface of the wiring board 200 through a large number of glass beads 18, and the external conductor connection parts 143 and 153 of the pair of electrode parts 14 and 15 are provided on the wiring board 200 according to a predetermined wiring.
  • the part is mounted by soldering.
  • a gap corresponding to the diameter of the glass beads 18 is provided between the wiring portion of the wiring substrate 200 and the exposed portions of the external conductor connecting portions 143 and 153 of the surface mount LED package 100. Is formed, and the gap is filled with a solder material by soldering, so that the thickness of the joint portions 31 and 32 is increased.
  • a display unit according to Embodiment 2 of the present invention is configured by mounting the surface-mount LED package 100 described above on a large number of grid points on a wiring board. The mounting is performed by mounting the surface mount LED package 100 on the surface of the wiring substrate 200 through the glass beads 18 as described above and soldering as described above.
  • a known technique can be used for the operation relating to the display of video or characters in the display unit configured as described above, and the description thereof is omitted here.
  • the insulating material constituting the wiring substrate 200 and the insulating material constituting the mold portion 16 of the surface mount LED package 100 are as described above.
  • the surface mount LED package 100 is formed of different materials and has different linear expansion coefficients, but the recess 17 is formed on the back surface side of the mold portion 16 of the surface mount LED package 100. Even if the wiring board 100 expands and contracts due to the lighting of the surface mount LED package 100 or a change in the ambient temperature, the electrode portions 14 and 15 of the surface mount LED package 100 are reduced.
  • the surface mount type LED package can suppress the occurrence of cracks in the joint portions 31 and 32 due to soldering between the wiring board 200 and the wiring portion of the wiring board 200. 00, and it is possible to improve the reliability of the display unit.
  • the glass beads 18 are interposed between the wiring portion of the wiring substrate 200 and the exposed portions of the external conductor connecting portions 143 and 153 of the surface mount LED package 100. Since the gap corresponding to the diameter is formed, the gap is filled with the solder material, the thickness of the joint portions 31 and 32 made of the solder material is increased, and the wiring portion of the wiring board 200 and the surface mount LED package 100 are increased.
  • the bonding force with the outer conductor connecting portions 143 and 153 of the first embodiment is increased as compared with the case of the first embodiment, and the occurrence of cracks occurring in the joint portion 3 can be further suppressed, and the reliability can be further improved. it can.
  • the surface mount LED package as the surface mount light emitting device includes the LED chip 10, the chip holder 11 that holds the LED chip 10, and the pair of electrodes of the LED chip 10. (It was not shown in figure) It comprised from the pair of electrode parts 14 and 15 connected via the bonding wires 12 and 13, respectively, and the mold part 16 which consists of transparent epoxy resins, but other structures, for example, a chip
  • the LED chip 10 may be directly placed on one of the pair of electrode portions 14 and 15 without providing the holding portion 11.
  • the hollow part 17 was formed by the ditch
  • the size and shape of the hollow portion 17 do not necessarily have the shape shown in FIGS. 1 and 2, and the larger the size, the more the stress generated in the joint portions 31 and 32 is alleviated and cracks are generated. The effect of suppressing is increased.
  • the wiring portion of the wiring board 200 and the exposed portions of the external conductor connecting portions 143 and 153 of the surface mount LED package 100 are joined by soldering. Instead of brazing, brazing may be used.

Abstract

[Problem] To provide a highly reliable surface mount light-emitting device wherein the occurrence of a crack in a joint between an electrode part of the surface mount light-emitting device and a wiring part of a wiring substrate is reliably suppressed without complicating a configuration, and a display unit. [Solution] This surface mount light-emitting device is provided with an LED chip serving as a light-emitting source, a plurality of electrode parts connected to the LED chip, and a mold part for housing the LED chip and the plurality of electrode parts, and is configured so that the plurality of electrode parts can be fastened to a wiring part of a wiring substrate and the back surface of the mold part can be mounted to face the surface of the wiring substrate. The mold part is provided with a recess that forms a space between at least two electrodes among the plurality of electrodes on the back surface side. This display unit is configured by disposing the surface mount light emitting devices configured as described above at a plurality of lattice points.

Description

表面実装型発光装置、および表示ユニットSurface mount type light emitting device and display unit
　この発明は、ＬＥＤチップを発光源として用いた表面実装型発光装置、及びその表面実装型発光装置を用いた表示ユニットに関するものである。 The present invention relates to a surface-mounted light-emitting device using an LED chip as a light-emitting source, and a display unit using the surface-mounted light-emitting device.
　近年、ＬＥＤチップを内蔵した表面実装型ＬＥＤパッケージを格子点に配列した表面実装型ＬＥＤ表示ユニットが普及し、その屋外使用用途の増加に伴い、より高精細な表面実装型ＬＥＤ表示ユニットの開発が盛んになってきている。通常、このような表面実装型ＬＥＤ表示ユニットは、配線基板の配線部に表面実装型ＬＥＤパッケージの電極を半田付け若しくはろう付けにより接続することで、表面実装型ＬＥＤパッケージを配線基板に実装して構成される。 In recent years, surface-mounted LED display units in which surface-mounted LED packages with built-in LED chips are arranged at lattice points have become widespread, and with the increase in outdoor use, development of higher-definition surface-mounted LED display units has been progressing. It is getting popular. Usually, such a surface mount type LED display unit has a surface mount type LED package mounted on the wiring board by connecting the electrodes of the surface mount type LED package to the wiring portion of the wiring board by soldering or brazing. Composed.
　一般に、表面実装型ＬＥＤパッケージは、発光素子であるＬＥＤチップと、このＬＥＤチップにボンディングワイヤを介して接続された一対の電極と、これ等を一体に収納した透明エポキシ樹脂等の絶縁材料からなるモールド部とにより構成される。一方、配線部をプリントした配線基板は、ガラス繊維製の布を重ねたものにエポキシ樹脂等を含浸させてなるガラスエポキシ樹脂等の絶縁材料により構成される。 In general, a surface-mount LED package is composed of an LED chip that is a light-emitting element, a pair of electrodes connected to the LED chip via bonding wires, and an insulating material such as a transparent epoxy resin that integrally accommodates these electrodes. And a mold part. On the other hand, the wiring board on which the wiring portion is printed is made of an insulating material such as glass epoxy resin obtained by impregnating a glass fiber cloth with an epoxy resin or the like.
　前述のように構成された従来の表面実装型ＬＥＤ表示ユニットは、表面実装型ＬＥＤパッケージと配線基板との線膨張係数の差に起因して、表面実装型ＬＥＤパッケージの電極部と配線基板の配線部との半田付け若しくはろう付けによる接合部にクラックが生じる恐れがある。そこで、表面実装型ＬＥＤパッケージに於ける配線基板と接する側の面を、配線基板の線膨張係数に近い線膨張係数を有する材料で形成された別の絶縁物質で覆い、前述のクラックの発生を抑制するようにした従来の装置がある。 The conventional surface mount LED display unit configured as described above has a wiring between the electrode portion of the surface mount LED package and the wiring board due to the difference in linear expansion coefficient between the surface mount LED package and the wiring board. There is a possibility that cracks may occur in the joint portion by soldering or brazing to the portion. Therefore, the surface on the side in contact with the wiring board in the surface mount type LED package is covered with another insulating material formed of a material having a linear expansion coefficient close to the linear expansion coefficient of the wiring board to prevent the occurrence of the cracks described above. There are conventional devices designed to suppress.
　又、従来、配線基板の回路パターンに接合材を介して固着される表面実装型ＬＥＤパッケージの電極を弾性変形可能な形状に形成し、表面実装型ＬＥＤパッケージと配線基板との線膨張係数の差に起因する歪を弾性変形可能な電極により吸収して、前述のクラックの発生を防止するようにした表面実装型発光装置が提案されている（例えば、特許文献１参照）。 Conventionally, electrodes of a surface mount LED package fixed to a circuit pattern of a wiring board via a bonding material are formed in a shape that can be elastically deformed, and the difference in linear expansion coefficient between the surface mount LED package and the wiring board There has been proposed a surface-mounted light-emitting device that absorbs the strain caused by the above by an electrode that can be elastically deformed to prevent the occurrence of the above-mentioned cracks (see, for example, Patent Document 1).
　更に、従来、表面実装型ＬＥＤパッケージの電極に接合材を介して固着される配線基板の回路パターンに於ける端子部を弾性変形可能に形成し、表面実装型ＬＥＤパッケージと配線基板との線膨張係数の差に起因する歪を前述の弾性変形可能な端子部により吸収して、前述のクラックの発生を防止するようにした表面実装型発光装置が提案されている（例えば、特許文献２参照）。 Further, conventionally, a terminal portion in a circuit pattern of a wiring board fixed to an electrode of a surface mounting LED package via a bonding material is formed to be elastically deformable, and linear expansion between the surface mounting LED package and the wiring board is achieved. There has been proposed a surface-mounted light-emitting device that absorbs strain caused by a difference in coefficients by the above-described elastically deformable terminal portion and prevents the occurrence of the above-described cracks (see, for example, Patent Document 2). .
　又、従来、配線基板の回路パターンに接合材を介して固着される表面実装型ＬＥＤパッケージの外部接続端子を、ＬＥＤパッケージを挟むクリップ部とＬ字型の弾性部とにより構成し、表面実装型ＬＥＤパッケージと配線基板との線膨張係数の差に起因する歪をＬ字型の弾性部により吸収して、前述のクラックの発生を防止するようにした表面実装型発光装置が提案されている（例えば、特許文献３参照）。 Conventionally, the external connection terminal of the surface mount type LED package fixed to the circuit pattern of the wiring board via a bonding material is constituted by a clip portion sandwiching the LED package and an L-shaped elastic portion, and is surface mounted type. A surface mount type light emitting device has been proposed in which distortion caused by a difference in linear expansion coefficient between an LED package and a wiring board is absorbed by an L-shaped elastic portion to prevent the occurrence of the aforementioned cracks ( For example, see Patent Document 3).
特開２００６－３０３３９６号公報JP 2006-303396 A 特開２００６－３０３１９１号公報JP 2006-303191 A 特開２００９－０５９９８２号公報JP 2009-059982 A
　前述の表面実装型ＬＥＤパッケージに於ける配線基板と接する側の面を、配線基板の線膨張係数に近い線膨張係数を有する材料で形成された別の絶縁物質で覆うようにした従来の装置の場合、表面実装型ＬＥＤパッケージのＬＥＤチップ等を収納したモールド部と前述の別の絶縁物質との界面からの水の浸入が懸念され、これまでその構造上の特徴から防水ケースを用いて屋外使用への対応を行っているが、ＬＥＤの輝度や排熱効率が防水ケースにより悪化してしまう。 The conventional device in which the surface on the side in contact with the wiring board in the surface-mount type LED package described above is covered with another insulating material formed of a material having a linear expansion coefficient close to the linear expansion coefficient of the wiring board. In the case, there is a concern about the intrusion of water from the interface between the mold part containing the LED chip etc. of the surface mount type LED package and the above-mentioned another insulating material. However, the brightness and exhaust heat efficiency of the LED are deteriorated by the waterproof case.
　又、特許文献１及び３に示された従来の装置の場合、表面実装型ＬＥＤパッケージの電極若しくは外部接続端子の構成が複雑となり、また、特許文献２に示された従来の装置の場合は、配線基板の配線部の構造が複雑となり、それらを用いて構成される表面実装型ＬＥＤ表示ユニットの製造コストが高くなり、更には故障の原因となる等の課題がある。 In addition, in the case of the conventional apparatus shown in Patent Documents 1 and 3, the configuration of the surface mount type LED package electrodes or external connection terminals is complicated, and in the case of the conventional apparatus shown in Patent Document 2, There is a problem that the structure of the wiring portion of the wiring board becomes complicated, the manufacturing cost of the surface mount type LED display unit constituted by using them becomes high, and further causes a failure.
　この発明は、従来の表面実装型発光装置に於ける前述の課題を解決するためになされたもので、構成の複雑化を招くことなく、表面実装型発光装置の電極部と配線基板の配線部との接合部に於けるクラックの発生が確実に抑制され、信頼性の高い表面実装型発光装置を提供することを目的としたものである。 The present invention has been made in order to solve the above-described problems in the conventional surface-mounted light-emitting device, and without causing the configuration to be complicated, the electrode portion of the surface-mounted light-emitting device and the wiring portion of the wiring board It is an object of the present invention to provide a highly reliable surface-mount light-emitting device in which the occurrence of cracks at the joint is reliably suppressed.
　また、この発明は、従来の表面実装型表示ユニットに於ける前述の課題を解決するためになされたもので、構成の複雑化を招くことなく、表面実装型発光装置の電極部と配線基板の配線部との接合部に於けるクラックの発生が確実に抑制され、信頼性の高い表示ユニットを提供することを目的としたものである。 The present invention has been made in order to solve the above-described problems in the conventional surface-mount display unit, and without causing the configuration to be complicated, the electrode portion and the wiring board of the surface-mount light-emitting device can be obtained. An object of the present invention is to provide a highly reliable display unit in which the occurrence of cracks at the joint with the wiring portion is reliably suppressed.
　この発明による表面実装型発光装置は、発光源となるＬＥＤチップと、前記ＬＥＤチップに接続された複数個の電極部と、前記ＬＥＤチップと前記複数個の電極部とを収納するモールド部とを備え、前記複数個の電極部が配線基板の配線部に接合され且つ前記モールド部の裏面が前記配線基板の表面に対向して実装され得るように構成された表面実装型発光装置であって、前記モールド部は、前記裏面側に空間を形成する窪み部を備えていることを特徴とするものである。 A surface-mount light-emitting device according to the present invention includes an LED chip serving as a light-emitting source, a plurality of electrode parts connected to the LED chip, and a mold part that houses the LED chip and the plurality of electrode parts. A plurality of electrode parts are bonded to a wiring part of a wiring board, and the back surface of the mold part is mounted so as to be opposed to the front surface of the wiring board, The mold part includes a hollow part that forms a space on the back surface side.
　また、この発明による表示ユニットは、表面実装型発光装置が複数個の格子点に夫々配置された表示ユニットであって、前記表面実装型発光装置は、発光源となるＬＥＤチップと、前記ＬＥＤチップに接続された複数個の電極部と、前記ＬＥＤチップと前記複数個の電極部とを収納するモールド部とを備え、前記複数個の電極部が配線基板の配線部に接合され且つ前記モールド部の裏面が前記配線基板の表面に対向して実装され得るように構成されており、前記表面実装型発光装置のモールド部は、前記裏面側に空間を形成する窪み部を備えていることを特徴とするものである。
　この発明による表示ユニットに於いて、望ましくは、前記表面実装型発光装置はガラスビーズを介して前記配線基板上に載置され、前記電極と前記配線基板の配線部との接合は、半田付け若しくはろう付けにより行なわれ、前記半田付けによる半田材若しくは前記ろう付けによるろう材は、前記ガラスビーズにより形成された前記夫々の電極と前記配線部との間隙内に充填される。 The display unit according to the present invention is a display unit in which a surface-mounted light-emitting device is disposed at each of a plurality of lattice points, and the surface-mounted light-emitting device includes an LED chip serving as a light source and the LED chip. A plurality of electrode portions connected to each other, and a mold portion for accommodating the LED chip and the plurality of electrode portions, wherein the plurality of electrode portions are joined to a wiring portion of a wiring board and the mold portion The back surface of the surface mount type light emitting device is configured to be mounted so as to be opposed to the front surface of the wiring board, and the mold portion of the surface mount light emitting device includes a recess portion that forms a space on the back surface side. It is what.
In the display unit according to the present invention, preferably, the surface-mounted light-emitting device is placed on the wiring board via glass beads, and bonding between the electrode and the wiring part of the wiring board is performed by soldering or This is performed by brazing, and the solder material by soldering or the brazing material by brazing is filled in the gaps between the respective electrodes formed by the glass beads and the wiring portion.
　この発明による表面実装型発光装置によれば、ＬＥＤチップと複数個の電極部とを収納するモールド部の裏面側に空間を形成する窪み部を備えているので、電極部と配線基板の配線部との接合部に発生する応力を軽減することができる。 According to the surface mount type light emitting device according to the present invention, since the recess portion that forms the space is provided on the back surface side of the mold portion that accommodates the LED chip and the plurality of electrode portions, the electrode portion and the wiring portion of the wiring board are provided. It is possible to reduce the stress generated at the joint portion.
　また、この発明による表示ユニットによれば、ＬＥＤチップと複数個の電極部とを収納するモールド部の裏面側に空間を形成する窪み部を備えた表面実装型発光装置を、複数個の格子点に夫々配置するように構成されているので、電極部と配線基板の配線部との接合部に発生する応力を軽減することができる。
　この発明による表示ユニットに於いて、前記表面実装型発光装置をガラスビーズを介して前記配線基板上に載置することで、前記電極部と配線部との接合を行なう半田付けによる半田材若しくは前記ろう付けによるろう材が前記ガラスビーズにより形成された前記夫々の電極と前記配線部との間隙内に充填され、前記半田材、若しくはろう材の量を増加させることができ、前記電極部と配線部との接合部の強度を高めることができる。 In addition, according to the display unit of the present invention, the surface-mounted light-emitting device having a recess portion that forms a space on the back side of the mold portion that houses the LED chip and the plurality of electrode portions is provided with a plurality of lattice points. Therefore, the stress generated at the joint between the electrode portion and the wiring portion of the wiring board can be reduced.
In the display unit according to the present invention, the surface-mounted light-emitting device is placed on the wiring board via glass beads, so that the soldering material by soldering for joining the electrode part and the wiring part or the A brazing material by brazing is filled in a gap between each of the electrodes formed by the glass beads and the wiring portion, and the amount of the solder material or brazing material can be increased. The strength of the joint portion with the portion can be increased.
この発明の実施の形態１による表面実装型発光装置及び表示ユニットの一部分を示す断面側面図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional side view showing a part of a surface-mounted light-emitting device and a display unit according to Embodiment 1 of the present invention. この発明の実施の形態２による表示ユニットの一部分を示す断面側面図である。It is a cross-sectional side view which shows a part of display unit by Embodiment 2 of this invention.
実施の形態１．
　以下、この発明の実施の形態１による表面実装型発光装置、及び表示ユニットについて詳細に説明する。図１は、この発明の実施の形態１による表面実装型発光装置及び表示ユニットの一部分を示す断面側面図である。図１に於いて、表面実装型発光装置である表面実装型ＬＥＤパッケージ１００は、所定の電圧が印加されることにより発光するＬＥＤチップ１０と、ＬＥＤチップ１０を保持するチップ保持部１１と、ＬＥＤチップ１０の一対の電極（図示せず）に夫々ボンディングワイヤ１２、１３を介して接続された一対の電極部１４、１５と、透明エポキシ樹脂からなるモールド部１６とから構成されている。 Embodiment 1 FIG.
Hereinafter, the surface-mounted light-emitting device and display unit according to Embodiment 1 of the present invention will be described in detail. 1 is a cross-sectional side view showing a part of a surface-mounted light-emitting device and a display unit according to Embodiment 1 of the present invention. In FIG. 1, a surface-mounted LED package 100, which is a surface-mounted light-emitting device, includes an LED chip 10 that emits light when a predetermined voltage is applied, a chip holding unit 11 that holds the LED chip 10, and an LED. The chip 10 is composed of a pair of electrodes 14 and 15 connected to a pair of electrodes (not shown) of the chip 10 via bonding wires 12 and 13, respectively, and a mold portion 16 made of a transparent epoxy resin.
　モールド部１６は、透明エポキシ樹脂をモールド成型して形成されており、内部に、ＬＥＤチップ１０と、チップ保持部１１と、一対の電極部１４、１５と、ボンディングワイヤ１２、１３とを収納し、これ等を一体に固定している。電極部１４、１５は、ボンディングワイヤ１２、１３に夫々接続されるワイヤ接続部１４１、１５１と、このワイヤ接続部１４１、１５１からほぼ直角に屈曲して図１の垂直方向に延びる中間部１４２、１５２と、この中間部１４２、１５２から更にほぼ直角に屈曲して図１の水平方向に延びる外部導体接続部１４３、１５３とから構成されている。 The mold part 16 is formed by molding a transparent epoxy resin, and houses the LED chip 10, the chip holding part 11, the pair of electrode parts 14 and 15, and the bonding wires 12 and 13 therein. These are fixed together. The electrode portions 14 and 15 include wire connection portions 141 and 151 connected to the bonding wires 12 and 13, respectively, and an intermediate portion 142 that is bent substantially perpendicularly from the wire connection portions 141 and 151 and extends in the vertical direction in FIG. 152 and outer conductor connecting portions 143 and 153 which are bent at substantially right angles from the intermediate portions 142 and 152 and extend in the horizontal direction in FIG.
　電極部１４、１５に於ける外部導体接続部１４３、１５３の下部表面は、夫々、モールド部１６の裏面と同一平面を成し、且つモールド部１６の裏面から露出している。また、外部導体接続部１４３、１５３の端部は、モールド部１６の下部側面から突出して露出している。 The lower surfaces of the external conductor connecting portions 143 and 153 in the electrode portions 14 and 15 are in the same plane as the back surface of the mold portion 16 and are exposed from the back surface of the mold portion 16. Further, the end portions of the outer conductor connecting portions 143 and 153 are exposed from the lower side surface of the mold portion 16.
　モールド部１６の裏面側には、その一方の端面から他方の端面に貫通する凹溝により形成された窪み部１７が設けられている。この窪み部１７は、一方の電極部１４と他方の電極部１５とをモールド部１６の裏面側に於いて分離する空間を形成している。即ち、一方の電極部１４の外部導体接続部１４３及び中間部１４２の一部と、他方の電極部１５の外部導体接続部１５３及び中間部１５２の一部とは、窪み部１７が形成する空間により互いに分離されている。 On the back side of the mold part 16, there is provided a hollow part 17 formed by a concave groove penetrating from one end face to the other end face. The hollow portion 17 forms a space that separates one electrode portion 14 and the other electrode portion 15 on the back surface side of the mold portion 16. That is, a part of the outer conductor connecting part 143 and the intermediate part 142 of one electrode part 14 and a part of the outer conductor connecting part 153 and the intermediate part 152 of the other electrode part 15 are the space formed by the recess part 17. Are separated from each other.
　配線基板２００は、ガラス繊維製の布を重ねたものにエポキシ樹脂等を含浸させたガラスエポキシ樹脂等の絶縁材料により構成されており、その表面に、プリントにより導体が所定のパターンに形成された配線部（図示せず）が設けられている。 The wiring board 200 is made of an insulating material such as a glass epoxy resin obtained by impregnating a glass fiber cloth with an epoxy resin or the like, and a conductor is formed in a predetermined pattern on the surface by printing. A wiring part (not shown) is provided.
　表面実装型LEDパッケージ１００は、その一対の電極部１４、１５が配線基板２００の所定の配線部に半田付けにより接合されて、配線基板２００に実装される。半田付けによる半田材からなる接合部３１、３２は、配線基板２００の配線部と表面実装型LEDパッケージ１００の外部導体接続部１４３、１５３の露出部とを強固に固着し、且つこれらを電気的に接続している。表面実装型LEDパッケージ１００は、配線基板２００に実装されたとき、モールド部１６の裏面が配線基板２００の表面に対向しており、その裏面が配線基板２００の表面に当接する場合もある。 The surface-mounted LED package 100 is mounted on the wiring board 200 with a pair of electrode portions 14 and 15 bonded to predetermined wiring portions of the wiring board 200 by soldering. The joint portions 31 and 32 made of solder material by soldering firmly fix the wiring portion of the wiring board 200 and the exposed portions of the external conductor connecting portions 143 and 153 of the surface mount LED package 100, and electrically connect them. Connected to. When the surface-mounted LED package 100 is mounted on the wiring board 200, the back surface of the mold part 16 faces the surface of the wiring board 200, and the back surface may abut against the surface of the wiring board 200.
　この発明の実施の形態１による表示ユニットは、前述の表面実装型LEDパッケージ１００を、配線基板上の多数の格子点に夫々実装することにより構成される。そして、夫々の表面実装型LEDパッケージ１００は、前述の図１に示すように構成されている。このように構成された表示ユニットに於ける映像、若しくは文字の表示に関する動作については、周知の技術を用いることができ、ここではその説明を省略する。 The display unit according to Embodiment 1 of the present invention is configured by mounting the above-described surface-mount LED package 100 on a large number of lattice points on a wiring board. Each surface-mount LED package 100 is configured as shown in FIG. A known technique can be used for the operation relating to the display of video or characters in the display unit configured as described above, and the description thereof is omitted here.
　以上のように構成されたこの発明の実施の形態１による表面実装型発光装置、および表示ユニットに於いて、配線基板２００を構成する絶縁材料と、表面実装型LEDパッケージ１００のモールド部１６を構成する絶縁材料とは、前述したように異なる材料で形成されており、それらの線膨張係数は異なる。従って、従来の装置の場合、温度変化により、その線膨張係数の差に起因して接合部３１、３２に応力が発生し、接合部３１、３２に亀裂が生じたり剥離したりする恐れがあるが、この発明の実施の形態１によれば、表面実装型LEDパッケージ１００のモールド部１６の裏面側に窪み部１７が形成されているので、表面実装型LEDパッケージ１００と配線基板２００との接触面積が小さくなり、表面実装型LEDパッケージ１００の点灯時や周囲温度の変化により、配線基板１００が膨張収縮しても、表面実装型LEDパッケージ１００の電極部１４、１５と配線基板２００の配線部との半田付けによる接合部３１、３２にクラックが生じるのを抑制することができ、表面実装型LEDパッケージ１００、及び表示ユニットの信頼性を高めることができる。 In the surface mount type light emitting device and display unit according to the first embodiment of the present invention configured as described above, the insulating material constituting the wiring board 200 and the mold portion 16 of the surface mount type LED package 100 are configured. As described above, the insulating material is made of a different material and has a different linear expansion coefficient. Therefore, in the case of the conventional apparatus, due to the temperature change, stress is generated in the joint portions 31 and 32 due to the difference in the linear expansion coefficient, and the joint portions 31 and 32 may be cracked or peeled off. However, according to the first embodiment of the present invention, since the recess 17 is formed on the back surface side of the mold part 16 of the surface mount LED package 100, the contact between the surface mount LED package 100 and the wiring board 200 is achieved. Even when the wiring board 100 expands and contracts due to the lighting of the surface-mount LED package 100 or a change in ambient temperature, the electrode parts 14 and 15 of the surface-mount LED package 100 and the wiring part of the wiring board 200 are reduced. It is possible to suppress the occurrence of cracks in the joint portions 31 and 32 due to soldering, and to improve the reliability of the surface mount LED package 100 and the display unit.
実施の形態２．
　次に、この発明の実施の形態２による表示ユニットについて詳細に説明する。図２は、この発明の実施の形態２による表示ユニットの一部分を示す断面側面図である。図２に於いて、表面実装型発光装置としての表面実装型LEDパッケージ１００の構成は、前述の実施の形態１に於ける図１に示す表面実装型LEDパッケージ１００と同一の構成である。また、配線基板２００の構成は、前述の実施の形態１に於ける図１に示す配線基板２００と同一の構成である。 Embodiment 2. FIG.
Next, a display unit according to Embodiment 2 of the present invention will be described in detail. 2 is a cross-sectional side view showing a part of a display unit according to Embodiment 2 of the present invention. In FIG. 2, the structure of the surface-mounted LED package 100 as the surface-mounted light emitting device is the same as that of the surface-mounted LED package 100 shown in FIG. 1 in the first embodiment. Further, the configuration of wiring board 200 is the same as that of wiring board 200 shown in FIG. 1 in the first embodiment.
　表面実装型LEDパッケージ１００は、多数のガラスビーズ１８を介して配線基板２００の表面に載置され、その一対の電極部１４、１５の外部導体接続部１４３、１５３が配線基板２００の所定の配線部に半田付けにより接合されて実装される。この実施の形態２による表示ユニットの場合、配線基板２００の配線部と表面実装型LEDパッケージ１００の外部導体接続部１４３、１５３の露出部との間には、ガラスビーズ１８の直径に相当する間隙が形成されており、その間隙内に半田付けによる半田材が充填され、接合部３１、３２の厚みが増大する。 The surface-mounted LED package 100 is placed on the surface of the wiring board 200 through a large number of glass beads 18, and the external conductor connection parts 143 and 153 of the pair of electrode parts 14 and 15 are provided on the wiring board 200 according to a predetermined wiring. The part is mounted by soldering. In the case of the display unit according to the second embodiment, a gap corresponding to the diameter of the glass beads 18 is provided between the wiring portion of the wiring substrate 200 and the exposed portions of the external conductor connecting portions 143 and 153 of the surface mount LED package 100. Is formed, and the gap is filled with a solder material by soldering, so that the thickness of the joint portions 31 and 32 is increased.
　この発明の実施の形態２による表示ユニットは、前述の表面実装型LEDパッケージ１００を、配線基板上の多数の格子点に夫々実装することにより構成される。そして、その実装は、前述したように表面実装型LEDパッケージ１００を多数のガラスビーズ１８を介して配線基板２００の表面に載置し、前述のように半田付けすることにより行われる。このように構成された表示ユニットに於ける映像、若しくは文字の表示に関する動作については、周知の技術を用いることができ、ここではその説明を省略する。 A display unit according to Embodiment 2 of the present invention is configured by mounting the surface-mount LED package 100 described above on a large number of grid points on a wiring board. The mounting is performed by mounting the surface mount LED package 100 on the surface of the wiring substrate 200 through the glass beads 18 as described above and soldering as described above. A known technique can be used for the operation relating to the display of video or characters in the display unit configured as described above, and the description thereof is omitted here.
　以上のように構成されたこの発明の実施の形態２による表示ユニットに於いて、配線基板２００を構成する絶縁材料と、表面実装型LEDパッケージ１００のモールド部１６を構成する絶縁材料とは、前述したように異なる材料で形成されており、それらの線膨張係数は異なるが、表面実装型LEDパッケージ１００のモールド部１６の裏面側に窪み部１７が形成されているので、表面実装型LEDパッケージ１００と配線基板２００との接触面積が小さくなり、表面実装型LEDパッケージ１００の点灯時や周囲温度の変化により、配線基板１００が膨張収縮しても、表面実装型LEDパッケージ１００の電極部１４、１５と配線基板２００の配線部との半田付けによる接合部３１、３２にクラックが生じるのを抑制することができ、表面実装型LEDパッケージ１００、及び表示ユニットの信頼性を高めることができる。 In the display unit according to the second embodiment of the present invention configured as described above, the insulating material constituting the wiring substrate 200 and the insulating material constituting the mold portion 16 of the surface mount LED package 100 are as described above. As described above, the surface mount LED package 100 is formed of different materials and has different linear expansion coefficients, but the recess 17 is formed on the back surface side of the mold portion 16 of the surface mount LED package 100. Even if the wiring board 100 expands and contracts due to the lighting of the surface mount LED package 100 or a change in the ambient temperature, the electrode portions 14 and 15 of the surface mount LED package 100 are reduced. The surface mount type LED package can suppress the occurrence of cracks in the joint portions 31 and 32 due to soldering between the wiring board 200 and the wiring portion of the wiring board 200. 00, and it is possible to improve the reliability of the display unit.
　また、この発明の実施の形態２による表示ユニットによれば、配線基板２００の配線部と表面実装型LEDパッケージ１００の外部導体接続部１４３、１５３の露出部との間には、ガラスビーズ１８の直径に相当する間隙が形成されているので、その間隙内に半田材が充填され、半田材からなる接合部３１、３２の厚みが増大し、配線基板２００の配線部と表面実装型LEDパッケージ１００の外部導体接続部１４３、１５３との結合力が実施の形態１の場合に比べて増大し、接合部３に発生するクラックの発生を更に抑制することができ、信頼性をより向上させることができる。 In addition, according to the display unit according to the second embodiment of the present invention, the glass beads 18 are interposed between the wiring portion of the wiring substrate 200 and the exposed portions of the external conductor connecting portions 143 and 153 of the surface mount LED package 100. Since the gap corresponding to the diameter is formed, the gap is filled with the solder material, the thickness of the joint portions 31 and 32 made of the solder material is increased, and the wiring portion of the wiring board 200 and the surface mount LED package 100 are increased. The bonding force with the outer conductor connecting portions 143 and 153 of the first embodiment is increased as compared with the case of the first embodiment, and the occurrence of cracks occurring in the joint portion 3 can be further suppressed, and the reliability can be further improved. it can.
　なお、前述の実施の形態１及び２では、表面実装型発光装置としての表面実装型LEDパッケージは、ＬＥＤチップ１０と、ＬＥＤチップ１０を保持するチップ保持部１１と、ＬＥＤチップ１０の一対の電極（図示せず）に夫々ボンディングワイヤ１２、１３を介して接続された一対の電極部１４、１５と、透明エポキシ樹脂からなるモールド部１６とから構成されていたが、その他の構成、例えば、チップ保持部１１を設けずに一対の電極部１４、１５の一方に直接LEDチップ１０を載置する構成であってもよい。 In the first and second embodiments described above, the surface mount LED package as the surface mount light emitting device includes the LED chip 10, the chip holder 11 that holds the LED chip 10, and the pair of electrodes of the LED chip 10. (It was not shown in figure) It comprised from the pair of electrode parts 14 and 15 connected via the bonding wires 12 and 13, respectively, and the mold part 16 which consists of transparent epoxy resins, but other structures, for example, a chip The LED chip 10 may be directly placed on one of the pair of electrode portions 14 and 15 without providing the holding portion 11.
　また、実施の形態１及び２では、窪み部１７は、モールド部１６の裏面側の一端部から他端部にかけて貫通する凹溝により形成したが、モールド部１６の裏面の一端部から他端部にかけて貫通しない凹部により形成してもよい。なお、窪み部１７の寸法及び形状は、必ずしも図１及び図２に示す形状でなくてもよく、その寸法は大きければ大きいほど、接合部３１、３２に発生する応力を緩和し、クラックの発生を抑制する効果は大きくなる。 Moreover, in Embodiment 1 and 2, although the hollow part 17 was formed by the ditch | groove penetrated from the one end part of the back surface side of the mold part 16 to the other end part, the other end part from the one end part of the back surface of the mold part 16 You may form by the recessed part which does not penetrate through. Note that the size and shape of the hollow portion 17 do not necessarily have the shape shown in FIGS. 1 and 2, and the larger the size, the more the stress generated in the joint portions 31 and 32 is alleviated and cracks are generated. The effect of suppressing is increased.
　さらに、実施の形態１及び２では、配線基板２００の配線部と表面実装型LEDパッケージ１００の外部導体接続部１４３、１５３の露出部との間を、半田付けにより接合していたが、半田付けに代えて、ろう付けを用いてもよい。 Further, in the first and second embodiments, the wiring portion of the wiring board 200 and the exposed portions of the external conductor connecting portions 143 and 153 of the surface mount LED package 100 are joined by soldering. Instead of brazing, brazing may be used.
１００　　表面実装型LEDパッケージ、　１０　　LEDチップ、
１１　　チップ保持部、１２、１３　　ボンディングワイヤ、
１４、１５　　電極部、１４１、１５１　　電極部のワイヤ接続部、
１４２、１５２　　電極部の中間部、
１４３、１５３　　電極部の露出部、１６　　モールド部、
１７　　窪み部、２００　　配線基板、３１、３２　　接合部、
１８　　ガラスビーズ 100 surface mount LED package, 10 LED chip,
11 Chip holder, 12, 13 Bonding wire,
14, 15 electrode part, 141, 151 wire connection part of electrode part,
142, 152 The middle part of the electrode part,
143, 153 Exposed part of electrode part, 16 mold part,
17 dent part, 200 wiring board, 31, 32 joint part,
18 Glass beads

Claims (6)

  1. 　発光源となるＬＥＤチップと、前記ＬＥＤチップに接続された複数個の電極部と、前記ＬＥＤチップと前記複数個の電極部とを収納するモールド部とを備え、前記複数個の電極部が配線基板の配線部に接合され且つ前記モールド部の裏面が前記配線基板の表面に対向して実装され得るように構成された表面実装型発光装置であって、
    　前記モールド部は、前記裏面側に空間を形成する窪み部を備えることを特徴とする表面実装型発光装置。     An LED chip serving as a light emitting source, a plurality of electrode portions connected to the LED chip, and a mold portion for housing the LED chip and the plurality of electrode portions, wherein the plurality of electrode portions are wired A surface-mounted light-emitting device configured to be bonded to a wiring portion of a substrate and mounted so that the back surface of the mold portion faces the surface of the wiring substrate,
    The surface mount type light emitting device, wherein the mold part includes a hollow part that forms a space on the back side.
  2. 　前記窪み部は、前記モールド部の前記裏面の一端面から他端面に連続して延びる凹溝により形成されていることを特徴とする請求項１に記載の表面実装型発光装置。 The surface-mount light-emitting device according to claim 1, wherein the recess is formed by a concave groove extending continuously from one end surface of the back surface of the mold portion to the other end surface.
  3. 　前記複数個の電極部は、前記モールド部の底面と同一平面内で前記モールド部から露出していることを特徴とする請求項１又は２に記載の表面実装型発光装置。 The surface-mount light-emitting device according to claim 1 or 2, wherein the plurality of electrode portions are exposed from the mold portion in the same plane as a bottom surface of the mold portion.
  4. 　請求項１乃至３のうちの何れか一項に記載の表面実装型発光装置が複数個の格子点に夫々配置されていることを特徴とする表示ユニット。 A display unit, wherein the surface-mount light-emitting device according to any one of claims 1 to 3 is arranged at a plurality of lattice points.
  5. 　前記表面実装型発光装置のモールド部は、前記配線基板の熱膨張係数とは異なる熱膨張係数を有する材料により形成されていることを特徴とする請求項４に記載の表示ユニット。 The display unit according to claim 4, wherein the mold part of the surface-mount light-emitting device is formed of a material having a thermal expansion coefficient different from that of the wiring board.
  6. 　前記表面実装型発光装置は、ガラスビーズを介して前記配線基板上に載置され、
    　前記電極と前記配線基板の配線部との接合は、半田付け若しくはろう付けにより行なわれ、
    　前記半田付けによる半田材若しくは前記ろう付けによるろう材は、前記ガラスビーズにより形成された前記夫々の電極と前記配線部との間隙内に充填されることを特徴とする請求項４又は５に記載の表示ユニット。     The surface-mount light-emitting device is placed on the wiring board via glass beads,
    Bonding between the electrode and the wiring portion of the wiring board is performed by soldering or brazing,
    6. The solder material by soldering or the brazing material by brazing is filled in a gap between each of the electrodes formed by the glass beads and the wiring portion. Display unit.
PCT/JP2011/062678 2010-07-14 2011-06-02 Surface mount light-emitting device, and display unit WO2012008233A1 (en)

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