WO2012007526A2 - Dispositif, système et procédé destinés à être utilisés dans des machines de réplication de motifs électrochimiques - Google Patents

Dispositif, système et procédé destinés à être utilisés dans des machines de réplication de motifs électrochimiques Download PDF

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Publication number
WO2012007526A2
WO2012007526A2 PCT/EP2011/061996 EP2011061996W WO2012007526A2 WO 2012007526 A2 WO2012007526 A2 WO 2012007526A2 EP 2011061996 W EP2011061996 W EP 2011061996W WO 2012007526 A2 WO2012007526 A2 WO 2012007526A2
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WO
WIPO (PCT)
Prior art keywords
substrate
contact
chuck
master electrode
master
Prior art date
Application number
PCT/EP2011/061996
Other languages
English (en)
Other versions
WO2012007526A3 (fr
Inventor
Patrik MÖLLER
Mikael Fredenberg
Tomas UTTERBÄCK
Stefan Svensson
Antonio Santos
Jean-Michel Chauvet
Daniel ROSÉN
Peter Wiwen-Nilsson
Lennart Lindgren
Gilbert Cavazza
Nicolas Raynaud
Original Assignee
Replisaurus Group Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Replisaurus Group Sas filed Critical Replisaurus Group Sas
Priority to EP11743802.8A priority Critical patent/EP2593584B1/fr
Priority to ES11743802.8T priority patent/ES2634088T3/es
Publication of WO2012007526A2 publication Critical patent/WO2012007526A2/fr
Publication of WO2012007526A3 publication Critical patent/WO2012007526A3/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Definitions

  • a system for monitoring and controlling relative or absolute displacement of machine parts moved between a first and a second position is useful in machines for performing electrochemical pattern replication (ECPR) or other high precision manufacturing or measurement tools and enables improved movement accuracy, which in turn enables smaller electrical circuits to be produced with lower tolerances and higher quality.
  • ECPR electrochemical pattern replication
  • Electroplating/electroetching is used for microelectronics in a wide range of
  • electroplating/electroetching is suitable for applications involving production of micro and nano structures in single or multiple layers, fabrication of PWB (printed wiring boards), PCB (printed circuit boards), MEMS (micro electro mechanical systems), IC (integrated circuit) interconnects, above IC interconnects, sensors, flat panel displays, magnetic and optical storage devices, solar cells and other electronic devices. It can also be used for different types of structures in conductive polymers, structures in semiconductors, structures in metals, and others. Even 3D-structures in silicon, such as by formation of porous silicon, are possible.
  • Chemical vapour deposition and physical vapour deposition are processes that may also be used for metallization, but electroplating/electroetching is often preferred since it is generally less expensive than other metallization processes and it can take place at ambient temperatures and at ambient pressures.
  • Electroplating/electroetching of a work piece takes place in a reactor containing an electrolyte.
  • An anode carrying the metal to be plated, is connected to a positive voltage.
  • the anode is inert and the metal to be plated comes from the ions in the electrolyte.
  • the conductivity of the work piece such as a semiconductor substrate, is generally too low to allow the structures to be plated to be connected through the substrate to backside contacts. Therefore, the structures to be plated first have to be provided with a conductive layer, such as a seed layer. Leads connect the pattern to finger contacts on the front side. The finger contacts are in turn connected to a negative voltage.
  • the electroplating step is an electrolytic process where the metal is transferred from the anode, or from the ions in the electrolyte, to the conductive pattern (cathode) by the electrolyte and the applied electric field between the anode and the conductive layer on the work piece, which forms the cathode.
  • ECPR plating/etching cells or cavities are formed between a master electrode and the substrate, said cavities being defined by a conductive surface on the master electrode, an insulating material, defining the pattern to be plated/etched, and the conductive surface of the substrate.
  • a predeposited anode material has been arranged, normally through electrochemical plating, in the cavities.
  • the master electrode and the substrate are put in close contact with each other in the presence of an electrolyte, suitable for the intended purpose, such that the electrolyte is "trapped" in the ECPR plating/etching cavities.
  • WO 02/103085 to the present inventors, describes a system of this kind.
  • the present invention preferably seeks to mitigate, alleviate or eliminate one or more of the above-identified deficiencies in the art and disadvantages singly or in any combination. At least one of these problems are solved by a device for
  • electrochemical pattern replication comprising; a base; a bottom chuck on a X- Y-Theta stage, said bottom chuck being configured to hold a master electrode or a substrate; and a Z-stage with an attached top chuck, said top chuck being configured to hold a master electrode when the bottom chuck is configured to hold a substrate or a substrate when the bottom chuck is configured to hold a master electrode; a
  • displacement monitor system for measuring displacement of the master electrode relative the substrate, wherein said displacement monitor system comprises a position sensor and a reference frame, wherein the position sensor measures a distance to the reference frame; and a method for electrochemical pattern replication method, ECPR, utilizing a master electrode and a substrate, said method comprising the steps of measuring x-, y-, and theta values of the master electrode, when the master electrode and the substrate are separated in a top position; measuring x-, y-, and theta values of the master electrode, when the master electrode and the substrate are adjacent in a bottom position; calculating a delta value, which is the difference in measured x-, y-, and theta values; comparing the delta value to a reference value; and adjusting the position of the master electrode in relation to the substrate to minimize the delta value; a device for providing electricity to a substrate arranged on a chuck during
  • electrochemical pattern replication said device comprising a contact module for mounting on the chuck on all sides of the substrate so that electrical contact is possible along the whole perimeter of a substrate.
  • Fig. 1 shows an embodiment of the system, which comprises a base 16, a bottom chuck on a X-Y-Theta stage 15, and a Z-stage 111.
  • the X-Y-Theta stage is a bottom stage.
  • a top chuck 110, 212, 312 is attached to the Z-stage 111, 21 1, 310.
  • the bottom chuck 15 is configured to hold a master electrode 14, 25, 38 and the top chuck 110, 212, 312 is configured to hold a substrate wafer 19.
  • the Z-stage 111, 21 1, 310 is guided by four guides 112, 113, 23, 27 to be movable relatively the X-Y-Theta stage 15, 26 back and forth along a Z-direction or axis 13, such that the master electrode 14, 25, 38 and the substrate 19 may be moved together and apart in a controlled manner.
  • the X-Y-Theta stage 15, 26 is movable in an x-y- plane, wherein the Z-direction is parallel to the normal direction of the x-y-plane.
  • the relative position and rotation of the master electrode 14, 25, 38 and the substrate 19, 24, 34 in the x-y-plane can be controlled by movement of the X-Y-Theta stage 15, 26.
  • the disclosed system is provided with inter- substrate measurement microscopes 12, 17 configured to be removably insertable into the space between the top and bottom chucks 110, 15 for scanning the master electrode 14, 25, 38 and substrate surfaces for alignment marks.
  • the position of the master electrode 14, 25, 38 is adjusted by movement and rotation of the X-Y-Theta stage 15, 26 until a desired relative position and rotation between master electrode 14, 25, 38 and the substrate 19, 24, 34 has been achieved.
  • the measurement microscopes When the measurement microscopes have finished the measurement of alignment markers, the measurement microscopes are retracted to a respective parking position out of the space between the top and bottom chucks 110, 15 where after the Z-stage performs a Z-travel towards the bottom chuck 15. In this way, the substrate 19, 24, 34 and the master electrode 14, 25, 38 are moved together a remaining distance along the Z-direction for performing the ECPR process.
  • the displacement monitoring system comprises a base 16, 210, 311 , a reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55, and a plurality of position sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54.
  • the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 is attached to the base 16, 210, 311 and the position sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 are attached to a measurement frame 47, 53 which is attached either to the Z-stage 111, 21 1, 310 or to the top chuck 110, 212, 312.
  • the system in Fig 2 is shown with the Z-stage 111, 211, 310 in a top position at the beginning of a Z-travel.
  • the position sensors are configured to determine the relative position and rotation of the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 and thereby the top chuck 110, 212, 312 and measurement frame 47, 53 by measuring the distance between each respective sensor 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 and the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55. Thereafter, conventional geometric calculations are used to calculate x-, y-, and a theta-values describing the relative position and rotation.
  • the measurements between the sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 and the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 are measured throughout the Z-travel of the Z-stage, from its top position, or open position, to its bottom position, or closed position, where the processing takes place.
  • the measurement with the optical alignment system using microscopes, as described above with reference to Fig. 1, is done when the Z-stage is in its top position, whilst ECPR printing is done at the bottom position, or closed position, of the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55.
  • Fig. 3 shows the monitoring system when the Z-stage has completed the Z-travel and is in its bottom position.
  • a delta coordinate is calculated describing difference in measured X-, y-, and theta values between the top position and bottom position of the Z-travel for each of the position sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54.
  • This delta is then compared to a reference delta that was previously created by calibration of the system.
  • the calculated delta coordinate will vary slightly.
  • the difference between the delta coordinate and the reference delta coordinate is then used to calculate correction factors in x-direction, in y direction and for theta rotation, which factors are then used for fine adjusting the position and rotation of the X-Y-Theta stage just before Z-travel completes and the substrate 19, 24, 34 and the master electrode 14, 25, 38 touch each other.
  • Fig. 4-5 shows a top-down view of an embodiment of the monitoring system, in which the Z-stage 414, the guides 45, 46, 412, 414. , the measurement frame 53, the sensors 41, 43, 48, 410, 51, 54 and the top chuck 413 can be seen.
  • the material of choice for the base 16, 210, 311, reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 and measurement frame 47, 53 are materials which are rigid and stiff and have low thermal expansion, such that varying temperature, vibrations, bending, twisting or any other cause of deformation will only marginally affect measurements.
  • the opposite ends 44, 411, 52 of the measurement frame may be positioned substantially symmetrically relatively the top chuck or Z-stage, so that any movements of said ends due to thermal expansion are substantially equally large.
  • One way of reducing the effect of thermal expansion is to first of all manufacture the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 in symmetrical highly stable construction, preferably also with a high eigenfrequency, and second of all attaching it to a base plate 16, 210, 311, for instance made of a thermally and mechanically stable material, such as granite or Zerodur, in a thermally insensitive manner using
  • the measurement frame 47, 53 that is attached to either the top chuck 110, 212, 312 or the Z-stage that holds the sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54.
  • this frame and its connections to other parts can be designed and manufactured in materials that allow thermal expansions or other disturbances of any of the mechanical parts in the whole tolerance chain to be done in a way that does not deform or expand the measurement frame 47, 53.
  • the measurement frame 47, 53 and the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 are typically manufactured typically in low thermal expansion materials such as invar, carbon fiber reinforced materials, Zerodur or other types low CTE materials commonly used.
  • such symmetries should preferably be chosen so that expansion of each respective part hits both sides in an opposite way. In that way, if there is an expansion in x-direction of the whole top chuck/Z-stage construction, the expansion will affect each one of the two x-sensors in substantially opposite directions.
  • sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 are attached to both ends of the measurement frame 47, 53, the position of each end of the measurement frame 47, 53 can be determined, and since the positions of both ends of the measurement frame 47, 53 are known, information of any rotation of the measurement frame 47, 53 can easily be derived using basic trigonometry. Further, this information makes it possible to calculate any expansion of the measurement frame 47, 53 caused by expansion of the measurement frame 47, 53 itself, or by for example forces from a thermally
  • the displacement monitoring system is used for relative measurements where it is the delta between the top position to the bottom position which is the critical part to measure and monitor.
  • sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 configured for relative and/or absolute distance measurements between the sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 and the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55.
  • Fig. 5 is an enlarged partial view from above showing a portion of the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 and an end portion of the measurement frame 47, 53 where the measurement and reference frames 11, 18, 21, 29, 31, 37, 42, 49, 55 are in close proximity.
  • a sensor attachment bracket 44, 411, 52 is provided at the end of the measurement frame 47, 53.
  • the attachment bracket 44, 411, 52 attaches the position sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 in a thermally stable and vibration stable manner.
  • Any spatial direction for stages, reference frames 11, 18, 21, 29, 31, 37, 42, 49, 55, sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 or base surfaces is given as examples and describing specific embodiments of the invention.
  • the invention is in no way limited to these specific embodiment, but can be used in multiple configurations to measure absolute and/or relative displacement errors for stages or other moving bodies, while they are moving along any spatial direction.
  • 36, 41, 43, 48, 410, 51, 54 may be configured to measure distance in a substantially perpendicular manner, wherein one sensor measures a distance in the x-direction dX and the other measures a distance in y-direction dY.
  • Said x- and y-directions being perpendicular or normal to a respective surface of the reference frame 11, 18, 21, 29, 31,
  • each respective sensor 51, 54 measures distance.
  • the position of the sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 are adjusted with respect to the two perpendicular faces of the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 so that the sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 are within their working range of measurement. It should be understood that the sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 could be otherwise arranged, as long as the trigonometric calculations used to determine the delta values take the orientations of the sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 into account.
  • the sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 can be of several different types of distance measurement sensors , typically capacitive sensors measuring against a conductive reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55, which can be Invar or another low thermal expansion metallic material.
  • the sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 can further be inductive sensors, wherein the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 should be a metallic material.
  • the sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 may be optical sensors, such as triangulation sensors or optical absolute interferometric sensors measuring against the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55.
  • the sensors 22, 28, 32, 36, 41, 43, 48, 410, 51, 54 can also be interferometers that send out a laser beam and measure the distance between the reference face and the sensor.
  • Another option is acoustic sensors but the invention should not be considered as being limited to these types of sensors.
  • the measurement requires fairly short time, typically only a few seconds.
  • basically all of the mentioned types of sensors can be used to make the relative measurement with a very high accuracy despite showing linear drift over time which would prevent them from being used for long term monitoring of the position.
  • Several different types of sensors can be combined on the sensor attachment brackets measuring against the same or a different reference frame face, or surface.
  • one face of the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 may be provided with a metallic surface, wherein a capacitive or inductive sensor could be used for measuring the distance to said face, whilst another face of the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 can be provided with a non-metallic reflective surface suitable for optical measurement by an interferometric or other type of optical sensor.
  • a capacitive or inductive sensor could be used for measuring the distance to said face
  • another face of the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 can be provided with a non-metallic reflective surface suitable for optical measurement by an interferometric or other type of optical sensor.
  • Combinations of different types of sensors could for example provide for good accuracy and low drift both for short term and for long term measurements. Calibration of monitoring system
  • Calibration of the monitoring system is done in several ways.
  • One way is to perform one single measurement sequence.
  • a measurement sequence starts with measuring the distance between each sensor and the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 when the Z-stage is in its top position.
  • the distance between each sensor and the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 is calculated when the Z-stage is at its bottom position, as previously mentioned.
  • one delta value for each sensor is calculated based on the difference between the two measured values of each respective sensor (between the top value and the bottom value). In this case, where two sensor pairs are used, four deltas are calculated, two x-distance deltas and two y-distance deltas.
  • Standard trigonometry is then used with the delta values in order to calculate any expansion, x/y-movement or rotational movement that has occurred during the Z-travel.
  • the result of the above measurements and calculations is one single reference delta for each measured dimension, which in this case means one x-reference delta, one y- reference delta and one theta-reference delta (rotational reference delta).
  • the reference delta values are saved to a calibration data file where they are accessible for future calculations.
  • the reference delta values are then used to calculate a correction factor used for fine adjusting the position and rotation of the X-Y- Theta stage just before Z-travel completes.
  • Another way of calibrating the measuring system is to perform a plurality of measurement sequences, where after an average delta value is calculated based on the plurality of delta values that are calculated for each sensor from the measurement sequences. The calculated average delta values are then used as reference deltas.
  • the reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 is designed to provide a very high level of thermal stability and vibration stability over time.
  • the actual geometry and shape of this frame can be done in many different embodiments.
  • the measurement frame 47, 53 is a beam or profile, which is attached in a stable manner to a base 16, 210, 311, for instance a granite or Zerodur base.
  • a reference frame 11, 18, 21, 29, 31, 37, 42, 49, 55 with two or more feet being connected to the base 16, 210, 311 is used to enhance the stability of the reference faces and by connecting top and bottom beams between vertical bodies of the frame, the eigenfrequency as well as the geometry and sensitivity to thermal expansion can be minimized.
  • the present disclosure also relates to a device for providing electrical contact to a substrate 70, 80, 90, 1000 positioned on a substrate chuck 60, 73, 83, 93, 1003 within an ECPR-machine (machine for performing electrochemical pattern replication).
  • ECPR-machine machine for performing electrochemical pattern replication
  • the disclosed substrate chuck 60, 73, 83, 93, 1003 and contact module as well as disclosed contacting methods can also be applied to other application areas where an electrical contact to a substrate 70, 80, 90, 1000 is desired, such as conventional electroplating, electrochemical machining or electrical discharge machining tools.
  • the substrate chuck 60, 73, 83, 93, 1003 is configured to removably receive and hold a substrate 70, 80, 90, 1000 for ECPR-processing.
  • the substrate chuck 60, 73, 83, 93, 1003 is configured to receive a certain size and shape of substrates 70, 80, 90, 1000 and if other sizes and shapes of substrates 70, 80, 90, 1000 are to be received, another similar but differently sized or shaped substrate chuck 60, 73, 83, 93, 1003 can be provided applying the teachings of this disclosure.
  • Substrate typically have a seed layer to provide a conducting surface, wherein electrical contact with the seed layer is preferably made around the circumference, or perimeter, of the substrate 70, 80, 90, 1000.
  • contact fingers 1100, 1200, 99 are provided in the ECPR machine for contacting the perimeter of a seed layer of a substrate 70, 80, 90, 1000 positioned on a substrate chuck 60, 73, 83, 93, 1003.
  • each contact segment 1101, 1201 is suitable for covering a portion of the perimeter of a seed layer 72, 82, 92, 1002 of a substrate 70, 80, 90, 1000.
  • the internal resistance of the seed layer 72, 82, 92, 1002 is significant, thereby creating a drop of potential within the seed layer 72, 82, 92, 1002 when electrical current/currents travels between different spatial locations of the seed layer 72, 82, 92, 1002.
  • each of the contact fingers 1100, 1200, 99 is arranged and attached in a flexible manner so that each of the contact fingers 1100, 1200, 99 makes good electrical contact to the seed layer 72, 82, 92, 1002 by applying enough contact force on each individual contact finger 1100, 1200, 99.
  • the contact segments 61, 71, 81, 91, 1001, 1101, 1201 are positioned in a contact position (as shown in Figs. 8 and 10) protruding inside the perimeter of the substrate 70, 80, 90, 1000, thereby contacting the surface of the seed layer 72, 82, 92, 1002.
  • the contact module comprises contact actuators configured to optionally move the substrate contact segments 61, 71, 81, 91, 1001, 1101, 1201 between said contact position and a substrate loading position (as shown in Figs. 7 and 9).
  • the whole contact module and the individual contact segments 61, 71, 81, 91, 1001, 1101, 1201 are so arranged that loading and unloading of substrates 70, 80, 90, 1000 can be done using standard substrate handling robots provided with standard end effectors for gripping, moving and releasing substrates 70, 80, 90, 1000 when moving them into and out of a chuck.
  • Fig. 6 shows a top view of a substrate chuck 60 according to an aspect, said substrate chuck 60 being provided with a contact module comprising a plurality of contact segments 61.
  • the contact module can instead of being provided by, or integrated with, a substrate chuck 60, 73, 83, 93, 1003, be provided by, or integrated with, another part of the ECPR-machine, such as the base chuck 74, 84, 94, 1004.
  • the contact module is configured and positioned for providing electrical contact to a substrate 70, 80, 90, 1000 positioned in a substrate chuck 60, 73, 83, 93, 1003.
  • the contact module comprises at least one contact segment 61, 71, 81, 91, 1001, 1101, 1201 arranged for contacting as large a portion as possible of the perimeter of a substrate 70, 80, 90, 1000 positioned within the substrate chuck 60, 73, 83, 93, 1003.
  • the contact fingers 1100, 1200, 99 of the contact module should be arranged to provide as uniformly distributed electrical contact as possible along the perimeter of a substrate 70, 80, 90, 1000 positioned in the substrate chuck 60, 73, 83, 93, 1003.
  • the distance between the contact fingers 1100, 1200, 99 should be kept low and the number of contact fingers 1100, 1200, 99 could be kept high.
  • contact fingers 1100, 1200, 99 could be arranged with a distance between each contact finger 1100, 1200, 99 being smaller than 5 mm or smaller than 1 mm.
  • the contact segments 61, 71, 81, 91, 1001, 1101, 1201 in themselves can be distributed along the perimeter of the substrate 70, 80, 90, 1000, preferably with a distance between each segment 61, 71, 81, 91, 1001, 1101, 1201 being in a similar distance to the distance between contact fingers 1100, 1200, 99 of an individual segment 61, 71, 81, 91, 1001, 1101, 1201 in a way that all contact fingers 1100, 1200, 99 arranged around the perimeter of the substrate 70, 80, 90, 1000 has a similar or nearly similar distance between each contact finger 1100, 1200, 99, no matter if they belong to the same contact segment 61, 71, 81, 91, 1001, 1101, 1201 or to adjacent contact segments 61, 71, 81, 91, 1001, 110
  • the contact segments 61, 71, 81, 91, 1001, 1101, 1201 can all be connected to the same electrical circuit or have separate electrical circuits. Further, groups of segments 61, 71, 81, 91, 1001, 1101, 1201 being connected together, may be connected to individual electrical circuits.
  • Figs. 7, 8, 9, and 10 all show a device according to different aspects of the present disclosure, in all aspects comprising a base chuck 74, 84, 94, 1004, a substrate chuck
  • Figs. 7 and 9 show the chucks in an open position moved away from each other, wherein a substrate 70, 90 can be inserted and removed into and out of the substrate chuck 73, 93.
  • Fig. 10 shows the chucks in a closed position, wherein the substrate 1000 and the master electrode 1005 are brought together such that ECPR printing can be performed on said substrate 1000.
  • the contact segment 61, 71, 81, 91, 1001, 1101, 1201 is attached to the holding member 76, 86 ,96, 1006.
  • the actuator/actuators 77, 87, 97, 1007, 1008 are arranged to move the holding member 76, 86 ,96, 1006 to move the contact fingers 1100, 1200, 99 between a loading position and a contact position.
  • Fig. 7 and 9 show the contact fingers 1100, 1200, 99 in the substrate loading position
  • Figs. 8 and 10 show the contact fingers 1100, 1200, 99 in the contact position.
  • the actuator/actuators of the contact module are positioned within the substrate chuck 60, 73, 83, 93, 1003.
  • the contact module can be either positioned by the substrate chuck 60, 73, 83, 93, 1003 or by the base chuck 74, 84, 94, 1004.
  • the master electrode 1005 positioned on the base chuck 74, 84, 94, 1004 comprises a recessed edge sized to fit an electrical contact segment 61, 71, 81, 91, 1001, 1101, 1201 within the recess when the chucks are in said closed position. Actuators
  • the actuators 77, 87, 97, 1007, 1008 moving the holding members 76, 86 ,96, 1006 and thereby the attached contact segments 61, 71, 81, 91, 1001, 1101, 1201 can be electrical actuators such as linear or stepper motors , or other electrical actuators, hydraulic actuators or pneumatic actuators such as pneumatic cylinders.
  • the actuators 77, 87, 97, 1007, 1008 may provide a rotational movement or a linear movement.
  • the movements of the actuators 77, 87, 97, 1007, 1008 can be mechanically translated into vertical, horizontal and/or rotational movements for moving the contact fingers 1100, 1200, 99 or segments 61, 71, 81, 91, 1001, 1101, 1201 between a substrate loading position and a contact position.
  • the holding member 76, 86, 96, 1006 can be a unified ring.
  • the holding member 76, 86, 96, 1006 can be rectangular.
  • the position of the contact fingers 1100, 1200, 99 have to adapt to the shape of the substrate 70, 80, 90, 1000, wherein the holder member has to be adapted to hold the contact fingers 1100, 1200, 99 in such as shape.
  • a cut out is typically provided in one side of the holding member 76, 86, 96, 1006 in a portion so that the thickness is partially reduced such that a substrate handling robot can better reach and handle the substrate 70, 80, 90, 1000.
  • each of the contact segments 61, 91, 1001, 1101, 1201 is arranged in a radial or lateral position where the tips of the contact fingers 1100, 1200, 99 of the contact segment 61, 71, 81, 91, 1001, 1101, 1201 are positioned at a distance from the substrate 70, 80, 90, 1000 in a normal direction of said substrate 70, 80, 90, 1000.
  • the contact segments, holding members 76, 86 ,96, 1006 and actuators 1001, 1002 can be arranged so that in the contact position, none of the contact fingers 1100, 1200, 99 touch any part of the master electrode 75, 85, 95, 1005, not even when the chucks are in the closed position.
  • Contact fingers can be arranged so that in the contact position, none of the contact fingers 1100, 1200, 99 touch any part of the master electrode 75, 85, 95, 1005, not even when the chucks are in the closed position.
  • the contact fingers 1100, 1200, 99 typically have a slightly bent shape which allows the contact fingers 1100, 1200, 99 to easily and precisely be brought into and out of contact with the seed layer 72, 82, 92, 1002 of the substrate 70, 80, 90, 1000.
  • the bent shape may also helps creating a small scratch movement when a contact finger 1100, 1200, 99 is pushed against the seed layer 72, 82, 92, 1002 surface, thereby enabling better electrical contact between the contact finger 1100, 1200, 99 and the substrate 70, 80, 90, 1000.
  • the force of the actuator 77, 87, 97, 1007 pressing the contact fingers 1100, 1200, 99 towards the seed layer 72, 82, 92, 1002 is sufficient to substantially flatten out the contact fingers 1100, 1200, 99 to a shape in which the size of the contact segment 61, 71, 81, 91, 1001, 1101, 1201, including any bent portion, is smaller than the recess of the master electrode 75, 85, 95, 1005, such that no physical contact occurs between the contact segment 61, 71, 81, 91, 1001, 1101, 1201 and the surface of the master electrode 75, 85, 95, 1005 when the chucks are in their closed position.
  • each of the contact segments 91 are attached to a holding member 96.
  • the holding member 96 is not a single member but instead two separately movable members 96, such that the contact segments 91 attached to each holding member 96 can make movements in both vertical direction and radial direction, thereby allowing contact fingers 1100, 1200, 99 to be moved in opposite directions by movement of the respective holding members 96 in opposite directions.
  • Fig. 9 shows specifically how a contact module encloses and protects a first actuator 97, a second actuator 98, a holding member 96 and a contact segment 91 within the boundaries of the contact module.
  • the contact segments 91 shown in Fig. 9 are shown in their parking position protected by a lid 910 of the contact module.
  • one or more actuators 77, 87, 97, 1007, 1008 When moving the contact fingers 1100, 1200, 99 from their substrate loading position to their contact position, one or more actuators 77, 87, 97, 1007, 1008 first move the holder members in a first direction 911 substantially parallel to a normal direction of said seed layer 72, 82, 92, 1002 in order to unfold and show the contact fingers 1100, 1200, 99, where after the actuator/actuators 77, 87, 97, 1007, 1008 move the holder members in a different second, or radial, direction 912 substantially normal to the first direction, for bringing the contact fingers 1100, 1200, 99 towards their contact positions at a distance from the seed layer 72, 82, 92, 1002 in a normal direction to said layer.
  • the actuator/actuators 97, 98 retracts, or adjusts the holder members 96 slightly in a direction opposite the first direction 911 to press the contact fingers 1100, 1200, 99 against the seed layer 72, 82, 92, 1002 for making electrical contact through a high and uniformly distributed contact force all around the perimeter of the substrate 70, 80, 90, 1000.
  • the contact fingers 1100, 1200, 99 are to be removed, the contact fingers 1100,
  • 99/contact segments 91 are then retracted from their contact position to their substrate loading position in the reverse manner. Then, the lid 910 may once again be fully closed for protecting the interior of the contact module from fluids and foreign objects, effectively, allowing wet and dry operations to be performed inside the process chambers without leaking process liquids or gases into the contact module.
  • All members of the contact module are preferably manufactured in materials that can withstand the chemicals used within the processing environments of an ECPR process chamber, which can contain low-pH acids as well as corrosive chemicals, oxidizing chemicals and so on.
  • the body of the contact module is preferably made in a non- electrically conducting material which has a good resistance and chemical inertness to these chemicals, such as Teflon-like materials such as PTFE or other polymers such as PP.
  • the body of the contact module could also be manufactured of ceramic materials or other non-electrically conducting materials.
  • the master electrode 75, 85, 95, 1005 or other ECPR chamber parts the master electrode 75, 85, 95, 1005 or other ECPR chamber parts.
  • Most types of actuators 77, 87, 97, 1007, 1008 can be made to withstand the above mentioned chemicals, and titanium, acid proof stainless steel or other high resistance metal alloys are good choices of materials.
  • the contact module can be divided into compartments where fluid and gas tight seals are used to seal off and protect any inner volumes enclosing contact segments 61, 71, 81, 91, 1001, 1101, 1201, holding members 76, 86 ,96, 1006, actuators 77, 87, 97, 1007, 1008 and/or electrical routing, so that such inner volumes are kept dry and protected from any chemicals used within the process chamber.
  • the surface of the master electrode 75, 85, 95, 1005 is coated with an insulating layer so all parts around the contact segments is insulating so touching would not detrimentally affect to the ERPC cell itself, but repeated mechanical contact over time may make mechanical wear of the master electrodes 75, 85, 95, 1005 and is therefore preferably avoided.
  • Another important aspect of the electrochemical setup is that in an outer recess area of the master electrode 75, 85, 95, 1005, where the contact segment is arranged during ECPR printing, there can be electrolyte present during the process sequences, hence in order to prevent electrical shorts or electrochemical thief current shorts it is preferred to avoid any contact to the insulating coating of the master electrode 75, 85, 95, 1005 in the recess area in order to prevent scratching or mechanical wear that might otherwise break the insulating coating of the master electrode.
  • the substrate contacts have the same potential as the seed layer 72, 82, 92, 1002. Since cathodic potential is applied to the contact segments and seed layer 72, 82, 92, 1002 during ECPR plating, any electrochemical contact to a corresponding anode surface immersed in the same electrolyte volume might give deposition of metal on the contact segments as well as the seed layer 72, 82, 92, 1002. This is a well known problem found with electrical contacts of conventional electroplating cells, where undesired electroplating of material can take place on electrical contacts. In the disclosed embodiment shown in Fig.
  • the master electrode 75, 85, 95, 1005 has an insulating material coated all around the surface preventing any electrolyte contact to conducting parts of the master electrode 75, 85, 95, 1005. All other parts of the ECPR process chamber being in contact with electrolyte may also be in insulated materials, or have floating potential, so that the contact segments being immersed in electrolyte can have a negative potential cathodic a without having any electrochemical reaction or deposition of metal taking place on to the contact segment.
  • Figs. 11 and 12 shows an embodiment of a contact segment 1101, 1201, comprising a plurality of contact fingers 1100, 1200, 99.
  • the contact fingers 1100, 1200, 99 should be dimensioned such that the stiffness of the contact fingers 1100, 1200, 99 is high enough to allow them to break through surface oxide of a seed layer upon being forced against the seed layer during movement of the contact fingers 1100, 1200, 99 from a substrate loading position to a contact position.
  • the contact fingers 1100, 1200, 99 should also me dimensioned such that the contact fingers 1100, 1200, 99 are flexible enough to allow all fingers 1100, 1200, 99 of a segment 61, 71, 81, 91, 1001, 1101, 1201 to contact the seed layer even if the seed layer is uneven and/or if the contact segment approaches the seed layer in a slightly non-parallel manner. Thereby, good electrical contact is promoted.
  • the material, thickness, length, width and overall shape of the contact fingers 1100, 1200, 99 may be varied to affect the stiffness and function of the contact fingers 1100, 1200, 99.
  • the contact fingers 1100, 1200, 99 of a segment may be aligned in a slightly curved row in order to be able to follow the outer shape of a specific substrate shape.
  • the contact segment 1101 is about 20 mm wide and has individual contact fingers 1100 being approximately 1 mm wide and having less than 1 mm spacing in between the contact fingers 1100.
  • An advantage of providing contact segments 61, 71, 81, 91, 1001, 1101, 1201 rather than just providing separate contact fingers 1100, 1200, 99 is that it is far less problematic to connect the contact fingers 1100, 1200, 99 to the electric circuit/circuits of the ECPR-machine, since only one routing is needed for each contact segment 61, 71, 81, 91, 1001, 1101, 1201 rather than one routing per separate contact finger 1100, 1200, 99, thereby decreasing the total number of routings needed.
  • a contact segment 61, 71, 81, 91, 1001, 1101, 1201 providing contact to a 200 mm diameter silicon substrate 70, 80, 90, 1000 can have as many as 700 separate contact fingers 1100, 1200, 99 but in other embodiments fewer or more separate contact fingers 1100, 1200, 99 may be needed. Also, the thickness of the contact segments 61, 71, 81, 91, 1001, 1101, 1201 can for instance be smaller than 500 micrometers, for instance less than 100 micrometers.
  • the contact segments 61, 71, 81, 91, 1001, 1101, 1201 including their contact fingers 1100, 1200, 99 can be rigid enough to be self supporting so that the contact segments 61, 71, 81, 91, 1001, 1101, 1201 can be directly attached to actuators 77, 87, 97, 1007, 1008 without the need of holding members 76, 86 ,96, 1006.
  • a lid 910 and/or holding member 76, 86 ,96, 1006 may be configured to apply a pressing force directly to each respective contact finger 1100, 1200, 99 somewhere between the inner and outer end of each respective contact finger 1100, 1200, 99.
  • the contact segments 61, 71, 81, 91, 1001, 1101, 1201 can comprise at least one layer of at least one material that does not erode or oxidize during electrochemical processing used in ECPR printing.
  • the material can be stainless steel, gold, silver, palladium, platinum, platinised titanium or combinations thereof.
  • Figure 13 shows schematically the electrical circuit diagram for a substrate contact module having 20 separate contact segments, each segment with a separate electrical routing to a relay 21 which is used to switch the connection to a contact segment between either ground, plating power circuit line or to a test signal circuit line.
  • a contact resistance test one contact segment at a time may be connected to said test signal, driving a current from the contact segment into the seed layer of a substrate, while at least one of the other contact segments is connected to ground, letting the input test current propagate from the contact segment being tested through the seed layer of the substrate out through the one or more of the other contact segments that are connected to ground.
  • the contact resistance for the segment being tested can be calculated and stored.
  • each of the contact segments of a contact module may be tested in terms of contact resistance to a seed layer of a substrate by repeating the procedure for each segment.
  • a de-multiplexer may also be connected to a line having an incoming test voltage, and used to select which of the 20 contact segments to be connected to the test signal line, which may be combined with a multiplexer to select which of the outgoing lines may be connected to ground and/or plating power.
  • the procedure for testing one or several of the contact segments may be performed after loading a new substrate to be printed in an ECPR process chamber, before the substrate is immersed in electrolyte or before the printing current is applied.
  • a test system that may abort the print sequence or give a warning signal if a contact resistance outside the allowed thresholds is detected, can be used together with the contact module.
  • printing of non-uniform current distribution and thereby non-uniform metal layers onto substrates as a result of poor contacts can be avoided.
  • the described contact test method can detect problems in the contact module itself as well as testing the electrical contact between contact segments and a seed layer of a substrate.
  • Fig. 13 shows the schematic circuit diagram describing how the contact segments of a substrate contact module can be connected in an electrical circuit for performing both testing of contact resistances according to disclosed test methods, as well as ECPR printing.
  • the routing from the substrate chuck goes through a measurement resistance 80 through a multiplexer then back to a power supply that applies a current to the printing cell or plating cell of the ECPR-machine.
  • Each of the contact segments shown in Fig. 13 are during contact testing connected through a multiplexer, which makes it possible to apply a test signal to all contact segments.
  • the multiplexer also provides means to disconnect one of the segments at a time from the other segments in order to be able to apply a test signal, that is applied between one contact segment, through the seed layer and then through the other contact segments and back through the multiplexer through a test resistance, which is used to measure the resistance of the contact finger/contact segment itself.
  • a multiplexer the resistance of all contact segments can be individually tested. By stepping through the individual contact segments by switching the multiplexer to the individual positions, all of the contact segments can be tested prior to a print cycle.
  • routing can be provided inside the contact module for a rinsing fluid, such as Dl-water, to be able to periodically rinse either the entire module or a wet compartment of the module in which electrolyte typically enter.
  • a rinsing operation of the wet compartment of a contact module can be performed at the same time as the rest of process chamber is being rinsed after a printing cycle.
  • inlets are provided to the contact module and/or the process chamber for a drying gas, such as room temperature or heated nitrogen, which drying gas can be introduced into and led out of the contact module to periodically dry out the contact module between printing cycles.
  • contact module In a further embodiment of the contact module, different sealing solutions involving standard lip seals, double lip seals, x-seals or o-rings, are provided for creating a fluid seal around the contact module in order to seal the contact module off from other parts of the process chamber to thereby avoid leaks of electrolytes or other process fluids into the contact module.
  • a complementary way to prevent leaks of fluids into the contact module is to apply a slight over pressure of gas inside the contact module when it is in its closed position, so that any damage to the seal or any other leak path shows.
  • the entire contact module is enclosed in one body including electrical routing in order to create a field replaceable unit that may easily be attached and detached to a process chamber of an ECPR-machine.
  • the detachable attachment is achieved by quick connectors for electrical cables and media routing pipes, such as rinsing water and vacuum and pressurized air or nitrogen
  • an over pressure can be used to actuate the cylinder in one direction, wherein vacuum can be routed to the cylinder to provide a force to move the actuator in the other direction.
  • the contact module is arranged radially inside the fluidic seal that encloses the chamber so that any wet or dry processing operations can take place inside the confined chamber created between the surfaces of the substrate chuck, the base chuck and in radial position enclosed by a fluid seal.
  • seal solutions can be applied between the contact module and the chuck surfaces in addition to having internal sealing solutions preventing leaks into the module itself.
  • a means for providing electrical contact between a master electrode and a substrate is also disclosed.
  • an electrical contact device for the backside of a master electrode for use in an ECPR-machine (machine for electrochemical pattern replication).
  • a device can be integrated with a base chuck for holding the master electrode, or alternatively in the substrate chuck for making contact to the backside of substrates, in cases where electrical contact can be done to the backside of a substrate.
  • the electrical contact means according to the present disclosure for making contact to a master electrode is according to an aspect provided through a base chuck for holding a master electrode.
  • the disclosed device provide a general, simple way to create electrical contacts to the master electrode, in a single center contact or multiple contact points, for instance distributed around the perimeter of the master.
  • Figs. 20-22 show three different cross-sections of a process chamber of an ECPR- machine. More specifically, Fig. 1 shows a bottom rigid chamber base with resilient compression layer arranged between the rigid chuck surface and the master electrode, the
  • the compression layer being attached to the chuck and considered as part of the chuck, the chuck having a centre contact point and peripheral contact points around the circle and here shown with numerous of these contact pins going through the base chuck surface at the edge of the master electrode and one central contact in the middle.
  • Fig. 21 shows a portion of the same chuck with a peripheral contact pin making contact the backside of the master electrode at the perimeter of it, a resilient compression layer with an embedded lip seal, for preventing leaks of electrolyte going to the backside of the master electrode.
  • Figs. 20 and 21 show an embodiment with an electrical pin in the centre area, which completely fill the cut-out, the hole, in the chuck in order to minimize the any areas underneath the master that is mechanically unsupported.
  • a center contact pin is arranged with a spring loaded mechanism either by a mechanical spring or by a gas over pressure from the back that creates an upforce of this contact point that both ensure a good electrical contact and also makes sure that it balances the mechanical counter pressure to the back of the master electrode that prevents any recession of the master electrode down into the chuck surface.
  • Fig 22. shows a similar solution at the edge of the master electrode where numerous contact pins that make electrical contacts to the master electrode are arranged.
  • These contact pins have a smaller diameter and are housed inside a sleeve, ensuring that the area underneath the master that is mechanically unsupported is minimized.
  • the outer pins can be actuated by a inflatable tube that is inflated for moving the contact pins upwards.
  • Other types of actuators may also be used, such as springs, pneumatic cylinders or electrical actuators, that gives the actuation of the pins. The purpose of the actuators is to apply a force which is high enough to create a good electrical contact, high enough to prevent bending of the master electrode, still preventing any significant deformation of the master electrode.
  • a device for sealing and fixation of substrates and master electrodes One purpose with substrate and master seals is to prevent electrolyte from flowing between the chuck surface and any of the master electrode or the substrate. This may be accomplished by arranging a seal at the edge of the substrate, the seal may be embedded in the processing chamber of the ECPR-machine. Figs. 14 to 21 for example show various embodiments of such seals for this application.
  • a specific challenge with ECPR is that if a standard industry seal, such as an solid O- ring, is used, there is a risk that any deflection of the surface of the master electrode would both endanger the function of the seal and give deflection of the master or substrate that may result in entrapment of electrolyte between the master and substrate during a docking sequence where the two surfaces are brought together for performing ECPR printing.
  • a standard industry seal such as an solid O- ring
  • the disclosed seals and related sealing methods have been developed to achieve sufficient sealing between a chuck and a master electrode, or other substrate-like element, at the same time minimizing deformation of the master electrode, avoiding potential seal leaks and electrolyte entrapment problems.
  • One principle for fixating substrates or master electrodes on ECPR chuck surfaces disclosed is to provide an under pressure in an inner volume between the chuck 142, 152, 162 and a master electrode 144, 154, 164 to be mounted to said chuck 142, 152, 162, 172, 182, 192.
  • a fluid pressure such as atmospheric pressure or pressure from electrolyte
  • the master electrode 144, 154, 164 causes the master electrode 144, 154, 164 to be pressed against the chuck 142, 152, 162, 172, 182.
  • the master electrode or substrate is once again free to move. As shown in Figs.
  • the inner volume between the chuck 162, 172, 182, 192and the master electrode 164 is effectively sealed off from and the outer volume on the other side of the master electrode 164, such that it is possible to achieve a large pressure difference between the two volumes, to thereby firmly hold the master electrode to the chuck 162, 172, 182, 192.
  • a source of vacuum is provided, such as a vacuum pump (not shown).
  • vacuum grooves 140, 150, 160, 170, 180, 190 and channels 143, 153, 163, 173, 183, 193 are provided in the chuck 142, 152, 162, 172, 182, 192 for leading fluid from the inner volume to the source of vacuum in order to lower the pressure in the inner volume.
  • a compliant layer, or resilient compression layer 145, 165 is provided.
  • the sealing element 161 is positioned in a sealing element groove 165 which is provided close to the edge of the master electrode 164.
  • the sealing element 161 has X-shaped cross section, but other embodiments are feasible within the scope of the present disclosure, such as the embodiments shown in Figs. 17, 18 and 19.
  • the material for the various embodiments of the sealing element 161 is preferably an elastomer or a flexible hollow body of another more rigid polymer material.
  • the sealing element 161 should be resilient enough to follow the surfaces of both the chuck and the master electrode to form a well sealing contact surface. Further, the seal should be configured and positioned to press hard enough against the contact surfaces without substantially deforming or bending the master electrode. In order to achieve this the sealing element 161 is positioned to protrude above the surface of the chuck when the sealing element 161 is not loaded so that when the master electrode is pressed against the sealing element 161, the sealing element 161 deforms and thus presses back on the contact surfaces. Disclosed sealing elements 161 are soft enough in the Z-direction(a direction normal to the one surface of the master electrode that faces the chuck) so that the sealing element 161 can be compressed enough to give sealing without substantially deflecting or bending the master electrode.
  • the sealing element 161 has a X- shaped cross-section.
  • the sealing element 171 is inflatable.
  • an inflatable seal could be of a one layer membrane as shown in Fig 17, or the sealing element 180 could have the shape of a tube that is positioned in a rounded groove around the substrate, as shown in Fig. 18, wherein the tube 180 is connected to a source of pressurized fluid and wherein the tube can be inflated and deflated as wanted.
  • sealing element 191, 2102 disclosed is a high flexibility lip seal, as shown in Fig 19 and Fig. 21, such as a lip seal with a shape that is fairly thin and has a pre-defined direction in this case going outwards so that when there is an under pressure in the inner volume and pressure on the outer side the seal lips being pressed against the surface of the master electrode or substrate.
  • a double lip seal embodiment It can be a single or double lip impression of the seal.
  • a sealing function to prevent leakage of electrolyte underneath the substrate or the master electrode is disclosed, based on a gas pressure zone created at the perimeter of the master electrode or substrate.
  • a gas seal is provided be arranging a groove 140, 150 in the chuck surface close to the edge of the master electrode, pressurized gas is distributed through said groove with an over pressure of for example about 0-0,3 bar through a gas distribution lead 143, 153.
  • the gas distribution pressure is regulated to provide an increased local pressure at an outer gas sealing area at the perimeter of the master electrode or substrate, preventing any fluid for entering this zone, but still avoiding creation of bubbles.
  • Suitable gases for use in the gas seal are gases that do not oxidize the metals active in the ECPR-process. For example nitrogen, argon, helium or possibly regular air as a worst case scenario. Nitrogen is a typical solution because it is inert and is fairly inexpensive compared to other inert gases.
  • the above mentioned use of an under pressure to hold the master electrode to the chuck can be combined with the gas seal technique.
  • the distance between the nearest vacuum groove 140, 150, 160, 170, 180, 190 and the groove of the gas seal may be larger than the distance between the groove of the gas seal and the periphery of the master electrode.
  • Sufficient gas distribution through holes, 143, 153, are preferably provided into the groove of the gas seal, and the cross section of the gas groove should be large enough, in order to provide for a uniform distribution of the over pressure in all portions of the gas seal.
  • the over pressure in the gas seal has a purpose to increase the local pressure under this surface of the master electrode to atmospheric or to the same pressure as the pressure inside the process chamber of the ECPR-machine.
  • a PID regulator may be used to control the pressure inside the gas seal.
  • a gas flow meter could also be used to measure the flow of gas into the gas seal and then control the supply rate and/or pressure of supplied gas using a PID controller.
  • a gas seal function according to this disclosure may be combined with any of the additional sealing elements disclosed in this document, to further improve the reliability of the sealing function.
  • Leaking electrolyte to the backside of master electrodes or substrates may impose difficulties rinsing and drying said master electrode or substrate without crystallization and creation of salts residues in small gaps between the master electrode or substrate surface and the chuck surfaces, creating problems for handling of the substrates and contamination and particle propagation.
  • an insulating layer is inserted between the chuck and the master electrode to make sure that if there is electrolyte to some extent in an outer zone at the perimeter, the electrolyte it is still isolated from the chuck surface.
  • the insulating layer is for example a Teflon tape or similar, an insulating layer that is laminated onto the chuck surface as a top coating of the chuck.
  • the chuck surface has a hydrophobic top coating which helps preventing leaks of electrolyte between the master electrode and the substrate.

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Abstract

L'invention concerne un dispositif de réplication électrochimique de motifs, ECPR. Le dispositif comprend: une base; un support de tranche inférieur sur un étage Thêta-X-Y, ledit support de tranche inférieur étant conçu pour retenir une électrode principale ou un substrat; et un étage Z auquel est fixé un support de tranche, ledit support de tranche supérieur étant conçu pour retenir une électrode principale lorsque le support de tranche inférieur est conçu pour retenir un substrat, ou un substrat lorsque le support de tranche inférieur est conçu pour retenir une électrode principale; un système de surveillance de déplacement pour mesurer le déplacement de l'électrode principale relativement au substrat, ledit système de surveillance de déplacement comprenant un capteur de position et un bâti de référence, le capteur de surveillance de position mesurant une distance par rapport au bâti de référence. L'invention concerne également un procédé de réplication électrochimique de motifs, ECPR. Le procédé comprend les étapes consistant à utiliser une électrode principale et un substrat, ledit procédé comprend les étapes consistant à mesurer des valeurs thêta, X et Y de l'électrode principale, lorsque l'électrode principale et le substrat sont séparés en une position supérieure; à mesurer des valeurs thêta, X et Y de l'électrode principale, lorsque l'électrode principale et le substrat sont adjacents en une position inférieure; à calculer une valeur delta, qui est la différence des valeurs thêta, X et Y mesurées; à comparer la valeur delta par rapport à une valeur de référence; et à régler la position de l'électrode principale par rapport au substrat afin de réduire au minimum la valeur delta. L'invention concerne en outre un dispositif de fourniture d'électricité à un substrat disposé sur un support de tranche au cours de la réplication électrochimique de motifs, ECPR. Le dispositif comprend un module de contact destiné à être monté sur le support de tranche de part et d'autre du substrat de sorte qu'un contact électrique soit possible sur le périmètre entier d'un substrat.
PCT/EP2011/061996 2010-07-15 2011-07-13 Dispositif, système et procédé destinés à être utilisés dans des machines de réplication de motifs électrochimiques WO2012007526A2 (fr)

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EP11743802.8A EP2593584B1 (fr) 2010-07-15 2011-07-13 Dispositif, système et procédé destinés à être utilisés dans des machines de réplication de motifs électrochimiques
ES11743802.8T ES2634088T3 (es) 2010-07-15 2011-07-13 Dispositivo sistema y procedimiento para su utilización en máquinas para la replicación electroquímica de patrones

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CN109798941A (zh) * 2019-03-14 2019-05-24 上海交通大学 Cfrp模压成形及cfrp/金属复合板材单步共固化成形测试装置

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