WO2012005453A3 - 반도체 패키지 비전 검사방법 - Google Patents

반도체 패키지 비전 검사방법 Download PDF

Info

Publication number
WO2012005453A3
WO2012005453A3 PCT/KR2011/004354 KR2011004354W WO2012005453A3 WO 2012005453 A3 WO2012005453 A3 WO 2012005453A3 KR 2011004354 W KR2011004354 W KR 2011004354W WO 2012005453 A3 WO2012005453 A3 WO 2012005453A3
Authority
WO
WIPO (PCT)
Prior art keywords
picker
semiconductor packages
vision
semiconductor package
pick
Prior art date
Application number
PCT/KR2011/004354
Other languages
English (en)
French (fr)
Other versions
WO2012005453A2 (ko
Inventor
정현권
봉순기
Original Assignee
한미반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한미반도체 주식회사 filed Critical 한미반도체 주식회사
Priority to SG2012096756A priority Critical patent/SG186491A1/en
Publication of WO2012005453A2 publication Critical patent/WO2012005453A2/ko
Publication of WO2012005453A3 publication Critical patent/WO2012005453A3/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined

Abstract

본 발명은 반도체 패키지 비전 검사방법에 관한 것으로, 본 발명에 따른 반도체 패키지 검사방법은, 검사 대상 반도체 패키지들이 놓여져 있는 테이블과, 상호 간의 간격 조절이 가능하며 반도체 패키지를 고정하는 복수개의 픽업부재를 구비한 픽커와, 상기 픽커에 고정된 반도체 패키지를 촬영하는 비전카메라를 포함하는 반도체 패키지 제조장치에서 반도체 패키지를 검사하는 방법에 있어서, (a) 상기 픽커의 픽업부재들 간의 간격이 제1피치인 상태에서 픽커가 테이블에서 복수개의 반도체 패키지를 픽업하는 단계와; (b) 상기 픽커의 픽업부재 간의 간격을 상기 제1피치보다 작은 제2피치로 가변시키는 단계와; (c) 상기 픽커와 비전카메라가 정지하지 않고 상대 이동하면서 비전카메라가 픽커에 고정된 반도체 패키지들을 촬영하는 단계를 포함하는 것을 특징으로 한다.
PCT/KR2011/004354 2010-07-05 2011-06-14 반도체 패키지 비전 검사방법 WO2012005453A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG2012096756A SG186491A1 (en) 2010-07-05 2011-06-14 Method for vision inspecting semiconductor packages

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0064300 2010-07-05
KR20100064300A KR101315892B1 (ko) 2010-07-05 2010-07-05 반도체 패키지 비전 검사방법

Publications (2)

Publication Number Publication Date
WO2012005453A2 WO2012005453A2 (ko) 2012-01-12
WO2012005453A3 true WO2012005453A3 (ko) 2012-05-03

Family

ID=45441615

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/004354 WO2012005453A2 (ko) 2010-07-05 2011-06-14 반도체 패키지 비전 검사방법

Country Status (4)

Country Link
KR (1) KR101315892B1 (ko)
SG (1) SG186491A1 (ko)
TW (1) TWI487048B (ko)
WO (1) WO2012005453A2 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101601614B1 (ko) * 2015-11-30 2016-03-08 최혜정 반도체 소자 외관 검사장치
IT202000015316A1 (it) * 2020-06-25 2021-12-25 Euromatic Srl Testa di robot per il prelievo di contenitori in vetro

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000022686A (ko) * 1998-09-17 2000-04-25 이경자 반도체 리드 검사장치
KR20060127633A (ko) * 2005-06-08 2006-12-13 삼성전자주식회사 반도체 패키지 자동 외관 검사 장치
KR20080092671A (ko) * 2007-04-13 2008-10-16 (주)제이티 반도체디바이스 검사장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100622415B1 (ko) * 2004-12-06 2006-09-19 미래산업 주식회사 반도체 소자 테스트 핸들러의 소자 반송장치
US7196508B2 (en) * 2005-03-22 2007-03-27 Mirae Corporation Handler for testing semiconductor devices
KR100833716B1 (ko) * 2007-03-30 2008-05-29 (주) 인텍플러스 반도체 소자 비전 검사 시스템
KR100873672B1 (ko) * 2007-05-23 2008-12-12 (주) 인텍플러스 반도체 소자의 비전 검사 시스템
KR20090128707A (ko) * 2008-06-11 2009-12-16 한미반도체 주식회사 반도체 패키지 제조장치용 비전검사장치
KR20100003432A (ko) * 2008-07-01 2010-01-11 세크론 주식회사 반도체 칩 패키지 영상 검사를 위한 촬영 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000022686A (ko) * 1998-09-17 2000-04-25 이경자 반도체 리드 검사장치
KR20060127633A (ko) * 2005-06-08 2006-12-13 삼성전자주식회사 반도체 패키지 자동 외관 검사 장치
KR20080092671A (ko) * 2007-04-13 2008-10-16 (주)제이티 반도체디바이스 검사장치

Also Published As

Publication number Publication date
TW201203421A (en) 2012-01-16
TWI487048B (zh) 2015-06-01
SG186491A1 (en) 2013-01-30
KR20120003605A (ko) 2012-01-11
WO2012005453A2 (ko) 2012-01-12
KR101315892B1 (ko) 2013-10-15

Similar Documents

Publication Publication Date Title
WO2012091494A3 (ko) 기판 검사방법
WO2015034891A3 (en) Systems and methods for adjusting target manufacturing parameters on an absorbent product converting line
WO2012102501A3 (ko) 웨이퍼 레벨 발광 다이오드 패키지 및 그것을 제조하는 방법
WO2015070135A3 (en) Integrated testing and handling mechanism
WO2010068530A3 (en) Graded high germanium compound films for strained semiconductor devices
WO2013026174A3 (en) Wafer-level fabrication of optical devices. in particular of modules for computational cameras
WO2012151520A3 (en) Wafer scale packaging platform for transceivers
WO2013088263A3 (en) Heatsink interposer
EP2295229A3 (en) Method and device for moving wet ophthalmic lenses during their manufacture
WO2012141541A3 (en) Interposer for optical module, optical module using the same, method for manufacturing the same
EP2363899A3 (en) Piezoelectric film, piezoelectric device, liquid ejection apparatus, and method of producing piezoelectric film
WO2011115697A3 (en) A method for imaging workpiece surfaces at high robot transfer speeds with correction of motion-induced distortion
EP3933939C0 (en) METHOD FOR PROCESSING A PHOTOVOLTAIC MODULE
WO2012082438A3 (en) Method and apparatus for inspection of scattered hot spot areas on a manufactured substrate
WO2013003420A3 (en) A semiconductor substrate and method of manufacturing
WO2012005453A3 (ko) 반도체 패키지 비전 검사방법
EP3780170A4 (en) PROCESS FOR REMOVING A THERMAL RACKING CAUSED BY AN INTERNAL SHORT-CIRCUIT
WO2008084548A1 (ja) カメラユニット検査装置、及びカメラユニット検査方法
WO2017115484A8 (ja) 有機ｅｌ表示装置の製造方法
WO2012053852A3 (ko) 비전 검사 장치
WO2010042379A3 (en) Method and apparatus for manufacturing thin-film photovoltaic devices
WO2013035247A3 (en) High aspect ratio structure and method for manufacturing the same
WO2011139061A3 (ko) 반도체 자재 정렬방법
WO2013134010A3 (en) A method of manufacturing silicon-on-insulator wafers
EP3951837A4 (en) METHOD FOR PROCESSING A SEMICONDUCTOR STRUCTURE

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11803739

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11803739

Country of ref document: EP

Kind code of ref document: A2