WO2012005434A3 - Microphone - Google Patents

Microphone Download PDF

Info

Publication number
WO2012005434A3
WO2012005434A3 PCT/KR2011/002566 KR2011002566W WO2012005434A3 WO 2012005434 A3 WO2012005434 A3 WO 2012005434A3 KR 2011002566 W KR2011002566 W KR 2011002566W WO 2012005434 A3 WO2012005434 A3 WO 2012005434A3
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
sound hole
case
microphone
Prior art date
Application number
PCT/KR2011/002566
Other languages
English (en)
Korean (ko)
Other versions
WO2012005434A2 (fr
Inventor
이상호
심용현
허형용
Original Assignee
주식회사 비에스이
톈진 비에스이 일렉트로닉스 컴퍼니 리미티드
동관 바오싱 일렉트로닉스 컴퍼니 리미티드
롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 비에스이, 톈진 비에스이 일렉트로닉스 컴퍼니 리미티드, 동관 바오싱 일렉트로닉스 컴퍼니 리미티드, 롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드 filed Critical 주식회사 비에스이
Publication of WO2012005434A2 publication Critical patent/WO2012005434A2/fr
Publication of WO2012005434A3 publication Critical patent/WO2012005434A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Micromachines (AREA)

Abstract

La présente invention porte sur un microphone qui comprend : un boîtier ayant une rosace externe ; une première carte de circuit imprimé couplée à la partie interne du boîtier et ayant une rosace interne communiquant avec la rosace externe ; une puce de circuit micro-électromécanique (MEMS) montée sur la surface interne de la carte de circuit imprimé et disposée au niveau de la rosace interne ; une seconde carte de circuit imprimé couplée à la partie interne du boîtier et espacée de la première carte de circuit imprimé, et qui comprend des bornes de connexion sur la surface externe de celle-ci ; une pluralité d'éléments de connexion conducteurs, connectant électriquement la première carte de circuit imprimé à la seconde carte de circuit imprimé ; et un support d'espacement disposé entre les première et seconde cartes de circuit imprimé pour supporter les première et seconde cartes de circuit imprimé avec un espace entre elles. Le microphone peut fournir un espace de chambre arrière suffisant et être assemblé de manière efficace, et la forme et le volume de celui-ci peuvent varier de manière commode si nécessaire.
PCT/KR2011/002566 2010-07-09 2011-04-12 Microphone WO2012005434A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0066414 2010-07-09
KR1020100066414A KR101130335B1 (ko) 2010-07-09 2010-07-09 마이크로폰

Publications (2)

Publication Number Publication Date
WO2012005434A2 WO2012005434A2 (fr) 2012-01-12
WO2012005434A3 true WO2012005434A3 (fr) 2012-03-01

Family

ID=45429155

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/002566 WO2012005434A2 (fr) 2010-07-09 2011-04-12 Microphone

Country Status (4)

Country Link
KR (1) KR101130335B1 (fr)
CN (2) CN102316402A (fr)
TW (1) TW201208394A (fr)
WO (1) WO2012005434A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9485560B2 (en) 2012-02-01 2016-11-01 Knowles Electronics, Llc Embedded circuit in a MEMS device
US8995694B2 (en) 2012-02-01 2015-03-31 Knowles Electronics, Llc Embedded circuit in a MEMS device
CN102790940A (zh) * 2012-07-25 2012-11-21 中山市天键电声有限公司 防风传声器
EP2901714A4 (fr) * 2012-09-27 2016-06-08 Knowles Electronics Llc Circuit intégré dans un dispositif mems
CN108235832B (zh) * 2017-03-09 2021-01-05 华为技术有限公司 一种消费电子产品的主板及终端
CN115767948B (zh) * 2022-11-14 2024-04-02 北京自动化控制设备研究所 Mems惯性系统高密度低应力集成方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100737726B1 (ko) * 2006-07-10 2007-07-10 주식회사 비에스이 멤스 마이크로폰 패키징 구조체
KR100737732B1 (ko) * 2006-04-21 2007-07-10 주식회사 비에스이 멤스 마이크로폰의 패키징 구조
KR20080005801A (ko) * 2006-07-10 2008-01-15 주식회사 비에스이 멤스 마이크로폰 패키징 구조
KR20090004982A (ko) * 2006-04-19 2009-01-12 호시덴 가부시기가이샤 일렉트릿 컨덴서 마이크로폰
US20090257614A1 (en) * 2008-04-10 2009-10-15 Jia-Xin Mei Package for micro-electro-mechanical acoustic transducer with improved double side mountable electrodes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090004982A (ko) * 2006-04-19 2009-01-12 호시덴 가부시기가이샤 일렉트릿 컨덴서 마이크로폰
KR100737732B1 (ko) * 2006-04-21 2007-07-10 주식회사 비에스이 멤스 마이크로폰의 패키징 구조
KR100737726B1 (ko) * 2006-07-10 2007-07-10 주식회사 비에스이 멤스 마이크로폰 패키징 구조체
KR20080005801A (ko) * 2006-07-10 2008-01-15 주식회사 비에스이 멤스 마이크로폰 패키징 구조
US20090257614A1 (en) * 2008-04-10 2009-10-15 Jia-Xin Mei Package for micro-electro-mechanical acoustic transducer with improved double side mountable electrodes

Also Published As

Publication number Publication date
CN102316402A (zh) 2012-01-11
CN202135313U (zh) 2012-02-01
TW201208394A (en) 2012-02-16
KR101130335B1 (ko) 2012-03-26
KR20120005768A (ko) 2012-01-17
WO2012005434A2 (fr) 2012-01-12

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