WO2011149139A1 - Dissipateur thermique refroidi par air et lampe à diode électroluminescente le comprenant - Google Patents

Dissipateur thermique refroidi par air et lampe à diode électroluminescente le comprenant Download PDF

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Publication number
WO2011149139A1
WO2011149139A1 PCT/KR2010/003550 KR2010003550W WO2011149139A1 WO 2011149139 A1 WO2011149139 A1 WO 2011149139A1 KR 2010003550 W KR2010003550 W KR 2010003550W WO 2011149139 A1 WO2011149139 A1 WO 2011149139A1
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WIPO (PCT)
Prior art keywords
horizontal
sink
tube
sinks
tubes
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Application number
PCT/KR2010/003550
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English (en)
Korean (ko)
Inventor
김복용
김경식
김영진
Original Assignee
Kim Bok Yong
Kim Kyung Sik
Kim Young Jin
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Application filed by Kim Bok Yong, Kim Kyung Sik, Kim Young Jin filed Critical Kim Bok Yong
Publication of WO2011149139A1 publication Critical patent/WO2011149139A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an air-cooled heat sink and a light emitting diode lamp employing the same, and particularly, has a lattice structure through which copper tubes penetrate horizontally arranged aluminum heat sink plates, and has natural convection of heat conduction and air inside the structure.
  • the present invention relates to an air-cooled heat sink that induces heat dissipation by a phenomenon and a light emitting diode lamp employing the air-cooled heat sink.
  • LED light emitting diode
  • a light emitting diode (LED) device has many limitations in being used as a light source due to a heat problem occurring in a light emitting diode (hereinafter, referred to as 'LED').
  • the light emitting diode has a light efficiency of about 20 to 30%, and assuming that the light efficiency of the light emitting diode is 30%, power consumed by heat per light emitting diode can be estimated to be about 70% of the total power consumption.
  • a printed circuit board (PCB) in which a power LED lamp chip or a power LED chip is mounted has a relatively high heat generation rate. If the heat generated is not efficiently processed through its heatsink, the amount of heat generated per unit area increases, and thus the temperature inside the printed circuit board or the backlight unit in which the power LED lamp chip is mounted may increase.
  • a method of dissipating heat with a heat dissipation plate made of metal has been proposed.
  • an insulating layer is stacked on the metal heat sink, a circuit pattern is formed on the insulating layer, and a semiconductor device such as a light emitting diode is mounted on the circuit pattern.
  • the metal heat sink is mainly composed of aluminum, aluminum has the advantage of good thermal conductivity, light weight and low cost.
  • the thermal conductivity of the insulating layer determines the thermal conductivity of the entire printed circuit board.
  • the insulating layer has a low thermal conductivity, heat generated from a power LED lamp chip or a printed circuit board on which the power LED chip is mounted is not effectively released. That is, since the heat generated from the power LED lamp chip is not sufficiently transferred to the metal heat sink by the blocking effect of the insulating layer, the heat sink made of the above-described metal is inferior in heat dissipation efficiency.
  • the power LED lamp chip or a printed circuit board mounted with the power LED chip has a problem that the life of the power LED lamp chip is reduced due to heat because the amount of heat generated per unit area generated in its heat sink is very large. Therefore, the power LED lamp chip is difficult to use independently without a separate heat sink.
  • the present invention has been made to solve the above problems, the present invention is in contact with the heat sink of the heat generating chip is a new type of heat dissipating heat of the self heat sink of the heat generating chip by conduction and air convection It is an object to provide an air-cooled heat sink.
  • the present invention is composed of a horizontal sink portion and tubes passing through each of two or more kinds of pure metal (matter) having different thermal conductivity and thermal conduction rate, respectively.
  • Another object is to provide such an air-cooled heat sink that uses heat conduction and natural convection of air to dissipate heat with high efficiency.
  • another object of the present invention is to provide a light emitting diode lamp having a high heat dissipation efficiency by assembling the heat sink in a substrate module mounted with a light emitting diode lamp chip.
  • An air-cooled heat sink includes first horizontal sinks and second horizontal sinks, the first horizontal sink having a larger diameter than the second horizontal sink, and the second horizontal sink between the first horizontal sinks.
  • a horizontal sink having at least one sink, first and second tubes having closed surfaces at one end thereof, and third tubes having open ends, wherein the first and second tubes are formed of the first and second tubes.
  • the third tubes include a vertical sink portion penetrating the two horizontal sinks and penetrating the first and second horizontal sinks, wherein the thermal conduction between the horizontal sink portion and the vertical sink portion is opened. Heat is released by convection of air entering and exiting the face.
  • the first tube has a closed surface exposed through the outermost first horizontal sink in the first direction, and the end including the closed surface is bonded with a self-heating sink and a conductive adhesive of the heat generating chip.
  • the second tubes may be configured such that the open surface is exposed through the second outer horizontal sink in the first direction while the closed surface is disposed so as to be located in a direction opposite to that of the first tube.
  • the open surface of the first tube may be configured to be exposed while passing through any one of the first horizontal sink and the second horizontal sink in the horizontal sink.
  • the closed surface of the second tube may be configured to be exposed while passing through any one of the first horizontal sink and the second horizontal sink in the horizontal sink.
  • the closed surface of the first tube may be provided with a protrusion that can be assembled with a groove formed in the self heat sink of the heat generating chip.
  • the first tube may be disposed in the center of the horizontal sink and be configured of any one of a circular or square tube.
  • the third tubes may be configured to further pass through the second horizontal sinks.
  • the third tubes may be configured to pass through the second horizontal sinks disposed at the outermost sides of both ends and to expose an open surface.
  • the horizontal sink unit may further include a washer disposed between the first horizontal sinks and the second horizontal sinks and through which the first tube passes.
  • the first horizontal sink and the second horizontal sink may be formed of a circular disk made of aluminum, and the first to third tubes may be formed of copper.
  • the light emitting diode lamp according to the present invention, an epoxy base substrate, a metal base substrate or a ceramic base system having a light emitting diode lamp chip mounted on the front surface and its own heat sink radiating heat of the light emitting diode lamp chip on the rear surface And an air-cooled heat sink assembled to the rear surface of the substrate module, wherein the air-cooled heat sink includes first horizontal sinks and second horizontal sinks.
  • the first horizontal sink has a larger diameter than the second horizontal sink, and the first and second tubes each having a horizontal sink portion having at least one second horizontal sink disposed between the first horizontal sinks and a closed surface at one end thereof.
  • third tubes open at both ends, wherein the first tube and the second tubes pass through the first and second horizontal sinks.
  • the third tubes include a vertical sink portion passing through the first horizontal sink.
  • the new type of air-cooled heat sink according to the present invention is in contact with the heat sink of the heat generating chip, thereby dissipating heat of the heat sink of the heat generating chip by conduction and air convection. There is.
  • the air-cooled heat sink is a horizontal heat sink and a tube through which two or more kinds of metal (matter) having different thermal conductivity and thermal conduction rate are respectively formed.
  • the air-cooled heat sink is assembled to a substrate module including a light emitting diode lamp chip in the center of the front surface and an epoxy base substrate, a metal base substrate, or a ceramic base substrate substrate having a heat sink on its rear surface.
  • the light emitting diode lamp is configured to have a high heat dissipation effect.
  • FIG. 1 is a perspective view showing a first embodiment of an air-cooled heat sink according to the present invention.
  • FIG. 2 is a plan view of the first embodiment of FIG.
  • FIG. 3 is a partial cross-sectional view taken along line 1-1 of FIG. 1.
  • FIG. 4 is a partial cross-sectional view taken along line 2-2 of FIG.
  • FIG. 5 is a plan view and a longitudinal sectional view of the first tube 14 of FIG.
  • FIG. 6 is a plan view and a longitudinal sectional view of the second tube 16 of FIG. 1.
  • FIG. 7 is a plan view and a longitudinal sectional view of the third tube 18 of FIG. 1.
  • FIG. 8 is an exemplary plan view of a washer installable in FIG. 1.
  • FIG. 8 is an exemplary plan view of a washer installable in FIG. 1.
  • FIG. 9 is a perspective view showing a second embodiment of an air-cooled heat sink according to the present invention.
  • FIG. 10 is a plan view of the second embodiment of FIG.
  • FIG. 11 is a partial cross-sectional view taken along line 3-3 of FIG.
  • FIG. 13 is a plan view and a longitudinal sectional view of the first tube 14a of FIG.
  • FIG. 14 is a perspective view showing a third embodiment of an air-cooled heat sink according to the present invention.
  • FIG. 15 is a plan view of the third embodiment of FIG.
  • FIG. 16 is a plan view and a longitudinal sectional view of the first tube 14b of FIG. 14.
  • FIG 17 is a perspective view showing a fourth embodiment of an air-cooled heat sink according to the present invention.
  • FIG. 18 is a plan view of the fourth embodiment of FIG. 17.
  • 19 is a perspective view illustrating the substrate module 30 by way of example.
  • FIG. 20 is a perspective view illustrating an example of a self heat sink of the substrate module 30 of FIG. 19.
  • FIG. 21 is a perspective view illustrating another example of a heat sink of the substrate module 30 of FIG. 19.
  • Fig. 22 is an assembled perspective view showing a preferred embodiment of a light emitting diode lamp according to the present invention.
  • FIG. 23 is a graph illustrating a light flux of a light emitting diode chip by applying power.
  • 24 is a graph showing the temperature of the first heat sink having a larger diameter among the heat sinks made of aluminum.
  • FIG. 25 is a photograph taken by an IR camera of a front surface temperature distribution of an epoxy substrate base surface on which a light emitting diode lamp chip photographed by an IR camera is mounted.
  • 26 is a side photograph showing an initial temperature distribution of an air cooled heat sink according to the present invention.
  • 27 and 28 are side pictures showing the temperature distribution of the air-cooled heat sink according to the present invention 20 minutes after the power is applied in the state of FIG. 26.
  • FIGS. 27 and 28 are graph illustrating a temperature measurement of the heat sink corresponding to the states of FIGS. 27 and 28.
  • FIG. 30 is a photograph showing a temperature distribution with respect to a plane of a light emitting diode lamp employing an air-cooled heat sink according to the present invention 20 minutes after power is applied.
  • FIG. 31 is a graph illustrating a temperature measurement of a heat sink corresponding to the state of FIG. 30.
  • FIG. 32 is a photograph showing a temperature distribution of the rear surface of a light emitting diode lamp employing an air-cooled heat sink according to the present invention 20 minutes after power is applied.
  • FIG. 33 is a graph illustrating a temperature measurement of a heat sink corresponding to the state of FIG. 32.
  • An air-cooled heat sink includes first horizontal sinks and second horizontal sinks, the first horizontal sink having a larger diameter than the second horizontal sink, and the second horizontal sink between the first horizontal sinks.
  • a horizontal sink having at least one sink, first and second tubes having closed surfaces at one end thereof, and third tubes having open ends, wherein the first and second tubes are formed of the first and second tubes.
  • the third tubes include a vertical sink portion penetrating the two horizontal sinks and penetrating the first and second horizontal sinks, wherein the thermal conduction between the horizontal sink portion and the vertical sink portion is opened. Heat is released by convection of air entering and exiting the face.
  • the light emitting diode lamp according to the present invention includes an epoxy base substrate, a metal base substrate, or a ceramic base substrate, in which a light emitting diode lamp chip is mounted on a front surface thereof and a heat sink for dissipating heat of the light emitting diode lamp chip on a rear surface thereof.
  • an air-cooled heat sink assembled to the rear surface of the substrate module, wherein the air-cooled heat sink includes first horizontal sinks and second horizontal sinks, and the first horizontal The sink has a diameter larger than that of the second horizontal sink, and the first and second tubes each having a horizontal sink portion having at least one second horizontal sink disposed between the first horizontal sinks and a closed surface at one end thereof; And third tubes open at both ends, wherein the first tube and the second tubes pass through the first and second horizontal sinks. And to the third tube it may comprise a vertical sync penetrating the first horizontal sync.
  • the air-cooled heat sink according to the present invention includes a horizontal sink portion and a vertical sink portion, the horizontal sink portion includes first horizontal sinks 10 and second horizontal sinks 12, and first and second horizontal sinks. 10 and 12 may be manufactured in a circular disk shape, the first horizontal sinks 10 having a larger diameter than the second horizontal sinks 12, and a second between the first horizontal sinks 10. Horizontal sinks 12 are arranged one by one. That is, the first horizontal sink 10 and the second horizontal sink 12 are alternately arranged vertically spaced apart from each other.
  • the vertical sink portion includes a first tube 14 and a second tube 18 having a closed surface at one end and third tubes 16 having both ends open, and the first tube 14 and the second tube. The tubes 18 pass through and engage with the first horizontal sinks 10 and the second horizontal sinks 12, and the third tubes 16 pass through the first horizontal sink 10. Is formed.
  • a spaced distance between the first horizontal sink 10 and the second horizontal sink 12 may be configured to be supported by the washer 17, and the washer 17 is configured as an o-type ring type. It may be configured to be inserted into the first tube 14 to be.
  • first horizontal sinks 10 and the second horizontal sinks 12 arranged in the horizontal sink portion as described above are arranged to have a concentric (first to third tube 14, 18, 16) Combined with the air-cooled heatsink according to the invention.
  • the first tube 14 and the second tube 18 have closed surfaces at one end thereof, and the third tube 16 has an open shape at both ends thereof.
  • the first tube 14 may be configured as a tube having a cross-section having a rectangular or square shape
  • the second tube 18 and the third tube 16 may be configured as a tube having a circular cross section. .
  • the first tube 14 is configured to penetrate and engage with the center of the stacked first and second horizontal sinks 10, 12.
  • a plurality of second tubes 18 may be disposed, spaced apart from each other on a circumference having the same diameter from the first tube 14, and may penetrate the first and second horizontal sinks 10 and 12. It is configured to be combined with these.
  • the second tube 18 is illustrated as being configured as four in the embodiment of the present invention, it is not limited thereto, and may be configured in various ways according to the intention of the manufacturer.
  • a plurality of third tubes 16 may be formed, and the plurality of third tubes 16 may be spaced apart from each other on the circumference having the same diameter from the first tube 14, but at a position farther from the first tube 14 than the second tube 18. It is disposed and configured to penetrate and engage the first and second horizontal sinks 10, 12.
  • the third tube 16 is illustrated as being configured as four in the embodiment of the present invention, it is not limited thereto and may be configured in various ways according to the intention of the manufacturer. In particular, in the first embodiment the third tube 16 is arranged at a position in contact with the rim of the second horizontal sink 12.
  • the number of the first horizontal sink 10 and the second horizontal sink 12 included in the horizontal sink portion, the diameter thereof, and the number of the first to third tubes 14, 18, 16 and Their diameter and length may be determined in consideration of the amount of heat generated by a heat generating chip such as a light emitting diode lamp chip of a light emitting diode lamp combined with an air-cooled heat sink according to the present invention.
  • the separation distance between the first horizontal sink 10 and the second horizontal sink 12 and the density at which the first to third tubes 14, 18, and 16 are disposed may be determined in consideration of heat dissipation efficiency.
  • first and second horizontal sinks 10 and 12 and the first to third tubes 14, 18 and 16 may use different types of pure metal materials, and the first to third tubes 14. , 18, 16 is preferably made of a material having a better thermal conductivity than the first and second horizontal sinks (10, 12).
  • the first to third tubes 14, 18, and 16 may be manufactured using copper.
  • Copper is a metal with a distinctive red luster with the element symbol Cu, atomic number 29, atomic weight 63.546, melting point 1084.5 ° C, melting point 2595 ° C and specific gravity 8.92 (20 ° C), and exhibits malleability, ductility and processability. Not only is this outstanding but there is also strength.
  • the thermal conductivity of copper is 300 to 340 Kcal / m ⁇ hr ⁇ ° C, and the thermal and electrical conductivity of copper is the second largest after silver, and the crystal system is an equiaxed crystal system.
  • the copper may be used as a material of the washer 17 as well as the first to third tubes 14, 18, and 16.
  • an upper portion of the closed surface of the first tube 14 may be bonded to a heat sink of a light emitting diode lamp chip, and the bonding may be performed using a conductive adhesive made of silver.
  • a one-component conductive adhesive which is usually sold for bonding the silver electrode of the tantalum chip capacitor and the lead frame, may be used, and may be used for dispensing. It has moderate viscosity characteristics and thixotropic lndex, has a low shrinkage rate during natural curing, and has a very low solvent content of less than 1% to form a uniform bond line, and has excellent adhesion. It has a high electrical conductivity of 2.0 ⁇ 10 ⁇ 4 ⁇ cm, excellent heat and moisture resistance at high temperature, and small change in electrical conductivity with temperature.
  • the first and second horizontal sinks 10 and 12 may be manufactured using aluminum.
  • Aluminum is an aluminum white, light and soft metal with elemental symbol Al, atomic number 13, atomic weight 26.9815, melting point 660.4 ° C, breaking point 2519 ° C and density 2.70g / cm 3 (20 ° C).
  • Aluminum has high ductility, thermal conductivity of 175Kcal / m ⁇ hr ⁇ °C, and good electrical conductivity. Aluminum has lower thermal conductivity than copper.
  • the first tube 14 is configured such that the closed surface is exposed through the outermost first horizontal sink 10 on the side where the heat generating chip such as a light emitting diode lamp chip is disposed, and is opposite to the open state.
  • the end portion is configured to be exposed through the outermost second horizontal sink 12 included in the horizontal sink portion.
  • the second tube 18 is configured such that the open end is exposed through the outermost second horizontal sink 12 in the direction in which the closed surface of the first tube 14 is disposed, and the closed surface is opposite to the outermost second. It is configured to be exposed through the horizontal sink 12.
  • the third tube 16 is configured such that both ends of the open state are exposed through the outermost first horizontal sink 10 in both directions.
  • the first embodiment has a thermal conductivity between the first and second horizontal sinks 10 and 12 and the first to third tubes 14, 18 and 16 and the first to third tubes 14, 18, 16) Air cooling is achieved by natural air convection inside the structure, in which the horizontal sinks and the tubes are combined, both inside and in the form of a lattice.
  • first to third tubes 14, 18, and 16 have a higher thermal conductivity than the first and second horizontal sinks 10 and 12
  • the first to third tubes 14, 18, and 16 have a higher heat conductivity than the first and third tubes 14, 18, and 16 to quickly pump heat from the heat sink of the heat generating chip.
  • second horizontal sinks 10 and 12 to enable efficient heat dissipation.
  • first to third tubes 14, 18, and 16 have a tube shape in which one side or both sides are open to form a system of heat dissipation by natural convection air. That is, cold outside air as shown by the arrow shown in the drawing flows into the inner space of the first to third tubes 14, 18 and 16 and the inner wall of the first to third tubes 14, 18 and 16. The heat-absorbed air may cause a natural convection phenomenon emitted to the outside, thereby allowing the first to third tubes 14, 18, and 16 to more effectively radiate heat.
  • first and second horizontal sinks 10 and 12 have different diameters, a space for convection of air is formed between the first horizontal sinks 10 so that natural convection of air can be more efficiently ensured. And thus the heat dissipation effect can be increased.
  • first and second tubes 14 and 18 are disposed in opposite directions to each other, convection and heat dissipation of air are dispersed without being concentrated in a specific portion, so that effective heat dissipation can be achieved.
  • the stacked first and second horizontal sinks 10 and 12 are combined with the first to third tubes 14, 18 and 16 to form a lattice structure, heat conduction may be effectively performed.
  • the third tube 18 disposed on the periphery of the second horizontal sink (10, 12) can be made smoothly heat transfer by promoting heat dissipation at the end by using the tube is open at both ends.
  • the second embodiment differs in that the second horizontal sink 12a and the third tube 16a are separated from each other in comparison with the first embodiment shown in FIGS. 1 to 8, and the first tube 14a Is different in that the cross section is configured to be circular.
  • the third tube 16a coupled to the first horizontal sink 10a may be disposed at a more outer side than the third tube 16 of the first embodiment, or the second horizontal sink 12a may be disposed. It may be designed to have a diameter smaller than the second horizontal sink 12 of the first embodiment.
  • the arrangement relationship between the first to third tubes 14a, 18a, and 16a can be kept the same as in the first embodiment.
  • the washer 17 of FIG. 8 may be used to maintain the separation distance between the first horizontal sink 10a and the second horizontal sink 12a.
  • the third tube 16a does not participate in the heat dissipation of the second horizontal sink 12, and the overall heat dissipation mechanism is substantially the same as that of the first embodiment, and thus descriptions of overlapping configurations and operations will be omitted.
  • the overall configuration is the same as in the second embodiment, and the shape of the first tube 14b is different.
  • a tube having a circular cross section is used, and a protrusion 15 forming a rectangular shape is formed at a closed end.
  • the configuration of the first and second horizontal sinks 10b, 12b and the second and third tubes 18b, 16b of the third embodiment is the same as that of the second embodiment, and the first through third tubes 14b, 18b, Since the arrangement relationship of each other of 16b) is also the same, the overlapping structure and operation description about these are abbreviate
  • recesses (see 40 of FIG. 21) that may be coupled to the protrusions 15 may be formed, and the protrusions 15 of the third embodiment may be inserted into the recesses 40 of FIG. 21.
  • a silver conductive adhesive can be used to form a bond for heat dissipation.
  • the fourth embodiment is the same as the second embodiment, the overall configuration of the receiving groove 20 for accommodating the wiring for coupling with the heat generating chip in the first horizontal sink (10c) in one direction, that is, combined with the heat generating chip (20) This is to be formed.
  • the configuration of the second horizontal sink 12c and the first to third tubes 14c, 18c and 16c of the fourth embodiment is the same as that of the second embodiment, and the first to third tubes 14c, 18c and 16c Since the arrangement relationship between each other is also the same, overlapping configuration and operation description thereof will be omitted.
  • the fourth embodiment may be coupled to the heat generating chip as shown in FIG. 22, and the receiving groove 20 may be used to arrange the wiring 44.
  • the air-cooled heat sink according to the present invention may be configured as in the first to fourth embodiments, but the present invention is not limited thereto, and the first and second horizontal sinks and the first to third tubes may be deformed in various shapes.
  • the present invention is not limited thereto, and the first and second horizontal sinks and the first to third tubes may be deformed in various shapes.
  • the above-mentioned heat generating chip includes a chip that generates high heat, such as a light emitting diode lamp chip constituting the light emitting diode lamp, the substrate module mounting the light emitting diode lamp chip may be configured as shown in Figs. have.
  • the substrate module 30 may include a cap 34 for mounting and protecting a light emitting diode lamp chip (not shown) on the front surface of the substrate 32, and a light emitting diode lamp chip on the rear surface of the substrate 32.
  • a self heat sink 36 may be formed to radiate heat.
  • the substrate 32 may be an epoxy base substrate (eg FR4), a metal base (rigid) substrate or a ceramic (eg Al 2 O 3 , Al 2 O 3 -TiC, Si 3 N 4 , CaTiO 3 , AlN, ZrO 2 ) may be composed of any one of a series substrate-based substrate.
  • the substrate module 30 may have a recess 40 that may be coupled to the protrusion 15 protruding from the center of the first horizontal sink of the air-cooled heat sink, as described above with reference to FIG. 21.
  • the substrate module 30 as described above may be combined with any one of the first to fourth embodiments described with reference to FIGS. 1 to 18 to form a light emitting diode lamp, and in constructing the light emitting diode lamp.
  • the wiring 44 may be arranged in the accommodation groove 20.
  • the heat of the substrate module 30 may be radiated by the above-described air-cooled heat sink, and the light-emitting diode lamp according to the present invention is heat-cooled by air conduction and natural air convection. Since it is made by the light emitting diode lamp chip has the effect of improving the life and improve the light efficiency.
  • FIG. 23 is a graph illustrating the luminous flux of a light emitting diode lamp chip in a state in which power of 12V and 750mA is applied using a luminous flux measuring device (CAS140), and the horizontal axis of FIG. lumen) (lm).
  • CAS140 luminous flux measuring device
  • FIG. 24 is a graph showing the temperature of the first horizontal sink having a larger diameter among the horizontal sinks made of aluminum in the state where power is applied, as shown in FIG. 23.
  • the horizontal axis of FIG. Means temperature (° C.).
  • FIG. 25 is a photograph showing the surface temperature of a general metal substrate base on which a power light emitting diode lamp chip or a chip is mounted by using an IR camera (temperature measurement) measuring instrument. As shown in FIG. Indicated.
  • 26 to 33 are photographs and temperature measurement graphs showing temperature distributions on the side, plane, and bottom of a light emitting diode lamp chip employing an air-cooled heat sink according to the present invention.
  • FIG. 26 is a side photograph showing an initial temperature distribution of an air cooled heat sink according to the present invention.
  • the values indicated corresponding to points A to E are temperatures.
  • FIGS. 27 and 28 are side views illustrating a temperature distribution of an air-cooled heat sink according to the present invention 20 minutes after power supply of 12 V and 750 mA in the state of FIG. 26, and FIG. 29 corresponds to the states of FIGS. 27 and 28.
  • It is a temperature measurement graph of the air-cooled heat sink which becomes.
  • the values indicated corresponding to points A to E are temperatures
  • FIG. 28 represents a state in which a temperature is distributed between a maximum value of 35.9 ° C. and a minimum value of 22.0 ° C.
  • a horizontal axis means time (minutes).
  • the vertical axis means temperature.
  • FIG. 30 is a photograph showing a temperature distribution with respect to a plane of a light emitting diode lamp employing an air-cooled heat sink according to the present invention 20 minutes after power supply of 12 V and 750 mA
  • FIG. 31 is an air-cooled heat corresponding to the state of FIG. This is a graph of sink temperature measurement.
  • FIG. 30 illustrates a state in which a temperature is distributed between a maximum value of 36.0 ° C. and a minimum value of 22.0 ° C.
  • a horizontal axis means time (minutes) and a vertical axis means temperature.
  • FIG. 32 is a photograph showing a temperature distribution of a bottom surface of a light emitting diode lamp employing an air-cooled heat sink according to the present invention 20 minutes after applying power of 12 V and 750 mA
  • FIG. 33 is a heat sink corresponding to the state of FIG. 32.
  • FIG. 32 shows a state in which temperatures are distributed between a maximum value of 30.2 ° C. and a minimum value of 22.0 ° C.
  • a horizontal axis means time (minutes) and a vertical axis means temperature.
  • the front surface temperature of the general metal substrate base surface shows 80.7 ° C
  • the rear surface of the air-cooled heat sink of the present invention shows that the temperature indicates 22 ° C.
  • This is a temperature difference between the base metal substrate base surface on which the power LED lamp chip is mounted and the rear surface (bottom surface) of the air-cooled heat sink of the present invention is 58.7 ° C. (Natural convection) by maximizing the natural convection can be confirmed that the heat is released by the efficient thermal conductivity (thermal thermal conductivity) and thermal conductivity (Thermal conduction rate).
  • substrate module 32 substrate
  • cap 36 self heatsink

Abstract

L'invention concerne un dissipateur thermique refroidi par air qui comprend une structure en maillage dans laquelle un tube de cuivre passe à travers des plaques de dissipateur thermique en aluminium et dissipe la chaleur par conduction de chaleur et convection naturelle de l'air dans la structure. L'invention concerne également une lampe à diode électroluminescente qui comprend le dissipateur thermique refroidi par air. Le dissipateur thermique refroidi par air comprend : une partie de dissipateur horizontale comprenant des premiers et seconds dissipateurs horizontaux, les premiers dissipateurs horizontaux ayant un diamètre plus grand que les seconds dissipateurs horizontaux et les seconds dissipateurs horizontaux étant disposés entre deux premiers dissipateurs adjacents ; et une partie de dissipateur verticale comprenant des premiers et deuxièmes tubes, dont une extrémité est fermée, et des troisièmes tubes dont les deux extrémités sont ouvertes, les premiers et deuxièmes tubes passant à travers les premiers et seconds dissipateurs horizontaux et étant intégrés à ceux-ci, et les troisièmes tubes passant au moins à travers les premiers dissipateurs horizontaux.
PCT/KR2010/003550 2010-05-27 2010-06-03 Dissipateur thermique refroidi par air et lampe à diode électroluminescente le comprenant WO2011149139A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0049519 2010-05-27
KR1020100049519A KR100996462B1 (ko) 2010-05-27 2010-05-27 공랭식 히트싱크 및 그를 채용한 발광다이오드 램프

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WO2011149139A1 true WO2011149139A1 (fr) 2011-12-01

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN102563582A (zh) * 2012-01-20 2012-07-11 大连日盛能源科技有限公司 Led点光源散热器

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
KR101142963B1 (ko) 2010-06-14 2012-05-08 서울반도체 주식회사 엘이디 조명 장치

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Publication number Priority date Publication date Assignee Title
US6006827A (en) * 1998-12-28 1999-12-28 Hon Hai Precision Ind. Co., Ltd. Cooling device for computer component
KR20020016683A (ko) * 2000-08-26 2002-03-06 구자홍 디스크 타입 히트싱크
KR20070025146A (ko) * 2005-08-31 2007-03-08 바이오닉스(주) 발광 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6006827A (en) * 1998-12-28 1999-12-28 Hon Hai Precision Ind. Co., Ltd. Cooling device for computer component
KR20020016683A (ko) * 2000-08-26 2002-03-06 구자홍 디스크 타입 히트싱크
KR20070025146A (ko) * 2005-08-31 2007-03-08 바이오닉스(주) 발광 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102563582A (zh) * 2012-01-20 2012-07-11 大连日盛能源科技有限公司 Led点光源散热器

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