WO2011148665A1 - Heat dissipation structure for electronic equipment - Google Patents

Heat dissipation structure for electronic equipment Download PDF

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Publication number
WO2011148665A1
WO2011148665A1 PCT/JP2011/051567 JP2011051567W WO2011148665A1 WO 2011148665 A1 WO2011148665 A1 WO 2011148665A1 JP 2011051567 W JP2011051567 W JP 2011051567W WO 2011148665 A1 WO2011148665 A1 WO 2011148665A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
sheet
chip
heat
electronic device
Prior art date
Application number
PCT/JP2011/051567
Other languages
French (fr)
Japanese (ja)
Inventor
達朗 黒田
Original Assignee
シャープ株式会社
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Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2011148665A1 publication Critical patent/WO2011148665A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat dissipation structure of an electronic device used for a liquid crystal display device or the like.
  • electronic components used in various electronic devices are designed to be more compact in order to cope with the downsizing of electronic devices, and by disposing electronic components such as IC chips at high density in a small space, heat is generated. Measures against heat dissipation are a big problem.
  • the characteristics of electronic components such as IC chips mounted on the substrate may change due to temperature rise due to heat generation during use, resulting in malfunction of the device, or failure of the electronic component itself. Therefore, conventionally, a heat dissipation structure that suppresses a temperature rise of an electronic component such as an IC chip has been proposed.
  • a heat sink to dissipate heat generated by electronic components such as IC chips.
  • a heat conductive rubber sheet is interposed between the heat radiating plate and the IC chip, and the heat of the IC chip is quickly transferred to the heat radiating plate through the rubber sheet.
  • each IC chip is radiated by directly dissipating a heat radiating sheet for each IC chip.
  • a silicone rubber sheet for heat dissipation is interposed between a heating element mounted on a substrate and a metal case, and the heat generated by the heating element is quickly conducted to the metal case, so that the outside of the device
  • a heat dissipation structure for an electronic device that dissipates heat has already been proposed (see, for example, Patent Document 1).
  • a liquid crystal display device having a backlight using an LED (light emitting diode) as a light source
  • the LED chip itself becomes a heating element. Therefore, it is preferable to quickly dissipate the heat generated by the LED chip, and a metal having excellent heat dissipation.
  • a liquid crystal display device in which a case is positioned and mounted via a fitting member to efficiently dissipate heat generated by the LED chip (see, for example, Patent Document 2).
  • An IC chip is formed by interposing a heat-dissipating sheet such as silicone rubber having good thermal conductivity between a heating element such as an IC chip mounted on the substrate and a cover member that covers the substrate and also serves as a heat dissipation plate. It is possible to dissipate the heat generated by the heating element from the cover member. In addition, by using a heat dissipation sheet having flexibility, it is possible to cope with variations in dimensions between a heating element such as an IC chip and a cover member to some extent.
  • a heat-dissipating sheet such as silicone rubber having good thermal conductivity between a heating element such as an IC chip mounted on the substrate and a cover member that covers the substrate and also serves as a heat dissipation plate. It is possible to dissipate the heat generated by the heating element from the cover member.
  • a heat dissipation sheet having flexibility, it is possible to cope with variations in dimensions between a heating element such as an IC chip and a cover
  • a chip pressing portion having thermal conductivity may be provided to protrude from the substrate cover, and a heat dissipation sheet having the same thickness may be interposed.
  • a predetermined protrusion height corresponding to the chip thickness to be mounted in advance. You just have to make it. However, if a manufacturing error occurs, the protruding height is different, and the contact pressure becomes small or too large.
  • the heat dissipation performance is deteriorated. Further, if the contact pressure becomes too large, the substrate may be bent and damaged, or the IC chip may be damaged.
  • the heat dissipation sheet is securely attached to the entire surface of the IC chip with an appropriate contact pressure without falling off during mounting. It is preferable that the heat dissipating structure be in contact with the heat dissipating property.
  • the present invention mounts an IC chip serving as a heating element on a substrate and dissipates heat by interposing a heat dissipation sheet between the IC chip and the cover member. Even if there is variation in the gap between the IC chip and the cover member, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are brought into contact with each other with an appropriate pressure to provide sufficient heat dissipation It is an object of the present invention to provide a heat dissipation structure for an electronic device that can improve the reliability of the electronic device.
  • the present invention includes a substrate on which an IC chip, which is an electronic component serving as a heating element, is mounted, and a cover member that covers the mounting surface side of the substrate and has heat dissipation properties.
  • a heat dissipation structure of an electronic device in which a heat dissipation sheet is interposed between a chip and the cover member in a pressure-contact state and heat is dissipated through the heat dissipation sheet and the cover member, the heat dissipation sheet adheres to the IC chip. It is characterized by comprising a rubber sheet having a sucker portion and having thermal conductivity.
  • the heat dissipation sheet when attaching the heat dissipation sheet to the IC chip, the heat dissipation sheet can be attached via the suction part, so even if the heat dissipation sheet is attached to the plurality of IC chips, these heat dissipation sheets are dropped off. Can be installed safely without Moreover, since it has elasticity in the thickness direction of the heat-dissipating sheet, even if the gap between the IC chip and the cover member varies, the heat-dissipating sheet makes sure contact and exhibits sufficient heat dissipation. Therefore, according to this invention, the heat dissipation structure of the electronic device which can improve the reliability of an electronic device can be obtained.
  • the suction cup portion in the heat dissipation structure for an electronic device having the above-described configuration, includes a gap formed by a flat portion and an umbrella-shaped side portion that opens in an umbrella shape from an outer peripheral portion of the flat portion. It is characterized by that.
  • the suction cup since the suction cup is formed by the umbrella-shaped side surface portion made of the rubber sheet and the gap portion formed by the side surface portion, the structure has elasticity in the thickness direction of the heat dissipation sheet, and the IC chip and the cover member It becomes possible to easily cope with variations in the gap, and it can be surely brought into contact with the gap by pressing, and a predetermined heat radiation effect can be exhibited.
  • the present invention is characterized in that, in the heat dissipation structure for an electronic device having the above-described configuration, the corner portion of the flat portion is cut into a taper shape or a chamfered portion rounded into an arc shape. According to this structure, since the corner
  • the present invention is characterized in that in the heat dissipation structure for an electronic device having the above-described configuration, the heat dissipation sheet has a gripping rib on an outer periphery of the suction cup portion. According to this structure, it becomes easy to remove at the time of rework, and it becomes the heat dissipation structure of the electronic device from which attachment / detachment and maintenance of a heat dissipation sheet become easy.
  • the heat dissipation sheet includes a lower sucker portion and an upper sucker portion, and is attached to the IC chip via any one of these sucker portions. It is characterized in that it is configured to adhere to the cover member via either one of the suction cups. According to this structure, it adheres to an IC chip through one suction cup part, and adheres to a cover member through the other suction cup part, so that the heat dissipation sheet and the cover member can be reliably assembled.
  • the present invention even if the gap between the IC chip and the cover member is varied, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are brought into contact with each other with an appropriate pressure. It is possible to obtain a heat dissipation structure for an electronic device that can exhibit heat dissipation and improve the reliability of the electronic device.
  • the planar portion of the lower sucker portion and the planar portion of the upper sucker portion are opposed to each other, and the respective umbrella-shaped side portions are directed outward. It is characterized in that a sucker-like gap is formed outward.
  • the suction cup is formed by the umbrella-shaped side surface portion made of the rubber sheet and the gap portion formed by the side surface portion, the structure has elasticity in the thickness direction of the heat generating sheet, and the IC chip and the cover member It becomes possible to easily cope with variations in the gap, and it can be surely brought into contact with the gap by pressing, and a predetermined heat radiation effect can be exhibited. Further, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are uniformly in contact with each other with an appropriate pressure.
  • a lower umbrella-shaped portion and an upper umbrella-shaped portion in which the central portion in the thickness direction of the heat-dissipating sheet is constricted and diameters are increased from the central portion toward the outer sides on both sides. Further, there is a void portion penetrating in the thickness direction, and the suction cup portion is constituted by the void portion and the umbrella-shaped portion.
  • the IC chip and the cover member It is possible to easily cope with variations in the gap between the two and the pressure contact, so that the gap can be surely brought into contact, and a predetermined heat radiation effect can be exhibited. Further, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are in uniform contact.
  • the present invention is characterized in that in the heat dissipation structure for an electronic device having the above-described configuration, the gap is a drum-shaped gap that expands from the center toward the outside on both sides. According to this configuration, it is possible to configure the suction cup portion having an excellent suction force with the drum-shaped gap portion and the umbrella-shaped portion, and the suction cup portion can be reliably sucked by being pressed. Further, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are brought into uniform contact with each other, so that a predetermined heat radiating effect can be exhibited.
  • the present invention is characterized in that in the heat dissipation structure for an electronic device having the above-described configuration, the heat dissipation sheet is a flat rubber sheet including a plurality of the suction cups. According to this configuration, it is possible to obtain a heat dissipating sheet that can accommodate a large-area substrate.
  • the present invention is characterized in that in the heat dissipation structure for an electronic device having the above-described configuration, the suction cup portion is disposed in a peripheral region of the heat dissipation sheet. According to this configuration, even if the heat dissipating sheet includes a plurality of sucker parts, it is possible to easily perform the work of attaching each sucker part to the IC chip, and the heat generating part is located in the peripheral area of the heat dissipating sheet. By doing so, it becomes a configuration in which heat is not trapped inside the heat dissipation sheet, and the heat dissipation performance can be sufficiently exhibited.
  • the present invention is characterized in that in the heat dissipation structure for an electronic device having the above-described configuration, the gap portion is a dish-shaped gap portion or a dome-shaped gap portion. According to this structure, it can adhere to the IC chip mounted on the board
  • the present invention is characterized in that, in the heat dissipation structure of the electronic device having the above-described configuration, a chip pressing part is provided on the cover member, and the heat dissipation sheet is pressed against the IC chip through the chip pressing part. According to this configuration, the heat radiation sheet can be brought into contact with the IC chip with an appropriate pressure via the chip pressing member. Further, both the heat dissipation sheet and the cover member can be reliably brought into contact with each other.
  • the chip pressing portion is elastically deformable in a direction in which one end is fixed to the cover member and is elastically deformable in a direction of coming into contact with and away from the cover member.
  • the elastic pressing portion includes an abutting piece portion connected to the other end side of the one portion and abutting against the heat radiating sheet.
  • the heat radiating sheet since the heat radiating sheet includes the sucker portion, when the heat radiating sheet is attached to the IC chip, it can be attached in a sucker shape. Therefore, even if it is the structure which attaches a some heat radiating sheet to a some IC chip, these heat radiating sheets can be safely attached without dropping off. In addition, since it has elasticity in the thickness direction of the heat dissipation sheet, even if there is a variation in the gap between the IC chip and the cover member, it reliably contacts and exhibits sufficient heat dissipation to improve the reliability of the electronic device. It is possible to obtain a heat dissipation structure for an electronic device that can be used.
  • the heat dissipation structure for an electronic device is a heat dissipation structure for an electronic device including a substrate on which an electronic component such as an IC chip (semiconductor chip) is mounted, and is mounted on a substrate 2 as shown in FIG. 1A, for example.
  • the heat dissipating structure dissipates heat by interposing the heat dissipating sheet 1 between the IC chip 3 (3A, 3B) and the cover member 4 such as a substrate cover.
  • the heat radiating sheet 1 includes a sucker portion that adheres to the IC chip 3 (3A, 3B), and is configured by a rubber sheet having thermal conductivity. Therefore, when attaching the heat radiation sheet 1 to the IC chip, the heat radiation sheet 1 can be attached via the suction cup portion. Therefore, even if the plurality of heat radiation sheets 1 are attached to the plurality of IC chips, It can be safely installed without falling off.
  • the heat-dissipating sheet 1 since it has elasticity in the thickness direction of the heat-dissipating sheet 1, even if the gap between the IC chip 3 (3 ⁇ / b> A, 3 ⁇ / b> B) and the cover member 4 varies, the heat-dissipating sheet 1 is in a reliable contact and exhibits sufficient heat dissipation. It becomes.
  • FIG. 2A of the first embodiment shown in FIG. 2A includes a flat surface portion 11a and a side surface portion 11b that opens in an umbrella shape, and forms a void portion 11c having an outward diameter. Therefore, the suction cup part 11 is formed by the side face part 11b and the gap part 11c that are opened in an umbrella shape.
  • a heat dissipation sheet 1 ⁇ / b> B having a drum-like configuration in which the second suction cup portion 12 is overlapped on the suction cup portion 11 and the center portion is constricted may be used.
  • the IC chip 3 is attached via any one of the suction cups
  • the cover member 4 is attached via any one of the suction cups.
  • the suction cup 11 is referred to as the lower suction cup 11 and the suction cup 12 is referred to as the upper suction cup.
  • the plane part 11a of the lower suction part 11 and the plane part 12a of the upper suction part 12 are joined facing each other, and the respective umbrella-shaped side parts 11b and 12b are directed outward.
  • the heat-dissipating sheet 1 (1A, 1B) may be a heat-dissipating rubber sheet such as a silicone rubber sheet or acrylic rubber sheet having an Asker C hardness of about 30-60.
  • the Asker C hardness is a rubber hardness defined by the Japan Rubber Association standard, and corresponds to a Shore hardness E defined by JIS K 6253.
  • the gap between the IC chip 3 and the cover member 4 can be easily dealt with and pressed. Can be brought into contact with each other reliably, and a predetermined heat dissipation effect can be exhibited. Further, the IC chip 3 and the heat radiating sheet 1 and the heat radiating sheet 1 and the cover member 4 can be in uniform contact with each other.
  • the cover member 4 is a substrate cover including an upper surface 41, a side surface 42, and an attachment surface 43, and is configured to be bent using, for example, a metal sheet metal such as an aluminum plate that has thermal conductivity and exhibits heat dissipation,
  • the mounting surface 43 is placed on the substrate 2 and fixed with screws using a set screw 44. Further, when a plurality of IC chips 3 (3A, 3B) are mounted on the substrate 2, chip pressing portions 5 (5A, 5B) are provided on the upper surface portion at a position matching the IC chip mounting portion.
  • the cover member 4 is also formed in a rectangular shape in plan view.
  • chip pressing portions 5 (5A, 5B, 5C, and 5D) are provided on the cover member 4 having a rectangular shape in plan view according to the number of IC chips 3 to be mounted.
  • These chip pressing portions 5 are also preferably made of sheet metal having thermal conductivity, and the upper surface 41 portion of the cover member 4 having thermal conductivity can be provided by sheet metal processing.
  • each chip pressing portion 5 is a height that protrudes between each IC chip 3 and the cover member 4 to such an extent that the heat-dissipating sheet 1 can be interposed in a pressure contact state. Further, if the heat radiating sheet 1 is a flexible sheet made of silicone rubber or acrylic rubber and having excellent heat radiating properties, it is easy to press the heat radiating sheet 1 elastically through the chip pressing portion 5 and press-contact it. It is preferable.
  • the heat of the IC chip 3 is quickly conducted to the cover member 4 serving as a heat radiating plate from the heat conductive heat radiating sheet 1 through the chip pressing portion 5. This heat can be quickly dissipated.
  • the heat dissipation sheet 1B has, for example, a side-view drum shape as shown in FIG. 2B.
  • This heat radiating sheet 1B is provided with the lower suction part 11 and the upper suction part 12, and each suction part is made into the shape provided with the plane part and the side part opened in umbrella shape.
  • the plane part 11a of the lower suction part 11 and the plane part 12a of the upper suction part 12 are joined facing each other, and the respective umbrella-shaped side parts 11b and 12b are directed outward.
  • the lower sucker portion 11 and the upper sucker portion 12 are made of a dish-shaped rubber sheet material having thermal conductivity as described above, and are made of, for example, a flexible silicone rubber sheet having excellent thermal conductivity.
  • each sucker portion includes gap portions 11c and 12c that are expanded outward from the central portion in the thickness direction in which the flat portions are joined to each other, and an umbrella-shaped side portion that is formed of a rubber-like elastic body and is opened in an umbrella shape. 11b and 12b.
  • the umbrella-shaped side part 11b, 12b which consists of rubber sheets has elasticity in the thickness direction of a heat radiating sheet, even if variation in the clearance gap between IC chip and a cover member arises, it is press-contacted. Corresponding easily, it can be made to contact reliably, and it becomes possible to exhibit a predetermined heat dissipation effect. Then, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are uniformly in contact with each other with an appropriate pressure.
  • the shape of the heat dissipation sheet 1 (1A, 1B) is, for example, a circular shape in plan view, as shown in FIG. 2C. Therefore, when the lower suction cup 11 is mounted on the IC chip, the contact surface becomes an annular contact surface 11d, and the annular contact surface 11d is pressed against the upper surface of the IC chip to form a suction cup shape. It is possible to adhere to.
  • planar view shape of the heat radiation sheet 1 (1A, 1B) may not be circular, and may be elliptical or polygonal as long as it can be attached to the IC chip to be attached in a sucker shape.
  • the heat radiating sheet 1 ⁇ / b> C may include a shape having a lower umbrella-shaped portion 13 a and an upper umbrella-shaped portion 13 b that have a diameter, and a drum-shaped gap portion 13 c that penetrates in the thickness direction.
  • the drum-shaped gap portion 13c and the umbrella-shaped portion can constitute a suction cup portion having an excellent suction force, and can be reliably sucked by being pressed. Therefore, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member can be brought into contact with each other uniformly to exhibit a predetermined heat radiating effect.
  • the gap portion penetrating in the thickness direction may have a shape other than the drum shape.
  • the gap portion penetrating in the thickness direction may have a shape other than the drum shape.
  • the gap portion penetrating in the thickness direction may have a shape other than the drum shape.
  • the side wall portion 13 whose diameter is increased from the constricted central portion has elasticity in the thickness direction of the heat radiating sheet 1D, and thus the gap between the IC chip and the cover member varies. Can be easily accommodated, and can be reliably brought into contact with each other by being pressed against each other, and a predetermined heat radiation effect can be exhibited. Further, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are uniformly in contact with each other with an appropriate pressure.
  • These include a heat dissipation sheet 1C having a lower umbrella-shaped portion 13a and an upper umbrella-shaped portion 13b and having a drum-shaped gap portion 13c, and a heat-dissipation sheet 1D having a shape having a round hole-shaped gap portion 13d.
  • a heat radiating sheet is interposed between the IC chip and the cover member and press-contacted, the air is released from the elastic umbrella-shaped portion, and the lower umbrella-shaped portion 13a and the upper umbrella-shaped portion 13b exhibit the suction cup action. Therefore, the lower umbrella-shaped part 13a becomes a lower sucker part, and the upper umbrella-shaped part 13b becomes an upper sucker part.
  • the heat dissipation sheet 1B including the lower suction part 11 and the upper suction part 12 described above is attached to the relatively thin IC chip 3A, and the heat dissipation sheet 1B is similarly attached to the relatively thick IC chip 3B.
  • a state in which the cover member 4A is assembled is shown.
  • the heat radiation sheet 1B since the heat radiation sheet 1B has flexibility in the thickness direction, it can easily cope with IC chips having different heights. Therefore, it is not necessary to provide the cover member 4A with a protruding portion such as a substrate pressing member, which is preferable because the cost of the cover member can be kept low.
  • the heat radiating sheet 1B includes the lower sucker portion 11 and the upper sucker portion 12, the heat sink may be attached to the upper sucker portion 12 instead of a cover member fixed to the substrate 2. This embodiment is shown in FIG. 4B.
  • the heat dissipation sheet 1B is attached to the relatively thin IC chip 3A, and the heat dissipation plate 9A is placed on the heat dissipation sheet 1B so as to be radiated to the relatively thick IC chip 3B.
  • a state in which the sheet 1B is attached and placed so as to adsorb the heat radiating plate 9B thereon is shown.
  • heat sink sheet 1B is attached and assembled to a plurality of IC chips 3 (3A, 3B), respectively. In this case, these heat radiation sheets can be safely attached without dropping off.
  • FIGS. 5A and 5B A modified example of the chip pressing portion is implemented using FIGS. 5A and 5B. A form is demonstrated.
  • the tip pressing portion shown in FIG. 5A is connected to an elastic piece 51b that is fixed to the cover member 4 at one end and is elastically deformable in a direction to come in contact with and away from the cover member, and the other end of the elastic piece 51b. It is the elastic pressing part 51 provided with the contact piece part 51a contact
  • FIG. 5B shows a state in which the heat dissipation sheet 1 (1B) is interposed in the IC chip 3 actually mounted on the substrate 2 using the elastic pressing portion 51.
  • the heat-dissipating sheet 1 is in contact with the upper surface of the IC chip 3 by being pressed by the contact piece 51a.
  • the elastic piece portion 51b is elastically deformed, and the contact piece portion 51a is elastically biased to the upper surfaces of the IC chip 3 and the heat dissipation sheet 1.
  • the heat dissipation structure of the electronic device can be achieved, which can exhibit sufficient heat dissipation and improve the reliability of the electronic device.
  • the substrate 2 is sandwiched and held by the substrate support legs 62 and 63 provided on the base member 6 and the substrate support legs 42 and 43 provided on the cover member 4. Further, the base member 6 is provided with an intermediate support leg 61 that supports an intermediate portion between the IC chip 3A and the IC chip 3B. With this configuration, since the substrate 2 is not deformed, the substrate 2 may be bent or deformed even if the heat dissipation sheet 1 (1A, 1B, 1C, 1D) and the IC chip 3 (3A, 3B) are pressed against each other. It is preferable that the substrate 2 is not damaged.
  • the substrate support leg 72 provided on the lower base member 7 using the lower base member 7 and the upper base member 8, 73 and the substrate support legs 82 and 83 provided on the upper base member 8 are configured to sandwich and hold the substrate 2.
  • the upper base member 8 is provided with an intermediate support leg 81 that supports an intermediate portion between the IC chip 3A and the IC chip 3B.
  • the substrate 2 can be prevented from being bent or deformed. Therefore, even if the heat radiation sheet 1 and the IC chip are pressed against each other, the substrate is not damaged.
  • the substrate pressing portions 71A, 71B may be simply pressing portions that protrude to a predetermined height, similar to the above-described chip pressing portions 5A, 5B, and, like the above-described elastic pressing portion 51, elastic deformation. An easy configuration may be used.
  • the heat dissipating sheet 1A of the first embodiment having a single sucker portion can be attached to the IC chip and the heat dissipating plate, respectively, and can be assembled so as to overlap each other.
  • the suction plate portion 11 of the first heat radiation sheet may be attached to the IC chip 3
  • the suction plate portion 12 of the second heat radiation sheet may be attached to the heat radiation plate 9, and they may be assembled so as to overlap each other.
  • the suction plate portion 11 of the first heat radiation sheet may be attached to the IC chip 3 mounted on the substrate 2, and the heat radiation plate 9 may be directly attached thereon.
  • a heat radiating sheet having a plurality of suction cups may be used, and various shapes of the gaps forming the suction cups are also conceivable, so these various embodiments will be described with reference to FIGS. 9A to 9E.
  • FIG. 9A is a modification of the heat dissipation sheet 1A having a suction cup portion formed of a side surface portion 11Ab opened in an umbrella shape and a dish-shaped gap portion 11Ac, and a corner portion of the flat surface portion 11Aa is cut into a taper shape. Or the chamfered portion 14 is formed by rounding into an arc shape. With such a configuration, the corners on the upper surface of the heat dissipation sheet attached to the IC chip are chamfered, so that it is difficult to drop off during assembly work, and the heat dissipation sheet is securely attached to the IC chip. Can do.
  • one heat radiating sheet 1E is attached to a plurality of IC chips.
  • the heat dissipation sheet can be used for a substrate having a relatively large area.
  • the heat dissipating sheet 1F having a configuration in which a plurality of sucker portions are disposed in the peripheral region is used. If it is such a structure, even if it is a heat radiating sheet provided with a plurality of sucker parts, it is possible to easily perform the work of attaching each sucker part to the IC chip, and the heat generating part is a peripheral part of the heat radiating sheet. By being located in the region, it becomes a configuration in which heat is not trapped inside the heat dissipation sheet, and the heat dissipation performance can be sufficiently exhibited.
  • the shape of the suction cup portion may be other than the dish-shaped gap portion, for example, a dome-shaped gap portion 15C as shown in FIG. 9D. Also, by applying silicone grease to these suction cups in advance to fill the gaps, the suction cup can be brought into close contact with the IC chip to increase the suction force.
  • these heat radiating sheets are preferably removable in consideration of maintenance or replacement with new parts.
  • gripping ribs 16 are provided on the outer periphery of the suction cup portion. It is set as the heat dissipation sheet 1H of the structure which has.
  • Such a configuration is preferable as a heat dissipation structure for an electronic device that can be easily removed at the time of rework, and the heat dissipation sheet can be easily replaced and the substrate can be easily maintained.
  • the heat dissipation sheet in the heat dissipation structure that dissipates heat by interposing the heat dissipation sheet between the IC chip and the cover member, the heat dissipation sheet has a suction cup portion and is elastic in the thickness direction. Therefore, when attaching the heat dissipation sheet to the IC chip, it can be attached like a suction cup, and even if it is configured to attach multiple heat dissipation sheets to multiple IC chips, it is safe without dropping these heat dissipation sheets Can be attached to.
  • a heat dissipating sheet having a lower sucker part and an upper sucker part, attached to the IC chip via the lower sucker part, and holds the cover member in an adsorbed state via the upper sucker part. It becomes the structure which contact
  • the heat dissipation structure of the electronic device according to the present invention can be securely mounted when the heat dissipation sheet is attached to each of the plurality of IC chips without the heat dissipation sheet being displaced or dropped. Therefore, it can be suitably used for an electronic device in which it is desired to mount the IC chip.

Abstract

A heat dissipation structure that dissipates heat comprises an IC chip, which acts as a heat-generating body, mounted on a substrate, and a heat dissipation sheet placed between the IC chip and a cover member. In order to provide a heat dissipation structure for electronic equipment that is capable of improving the reliability of the electronic equipment by bringing an IC chip and a heat dissipation sheet, and a heat dissipation sheet and a cover into contact at a suitable pressure, without dropping off when attached, thereby providing sufficient heat dissipation even if a variation in the gap between the IC chip and the cover member occurs, a heat dissipation sheet (1) is attached to an IC chip (3) via a suction section. The heat dissipation sheet (1) is provided with a bottom suction section (11) and a top suction section (12), and is attached to the IC chip (3) via one of these suction sections, and is attached to the cover member (4) via the other suction section.

Description

電子機器の放熱構造Heat dissipation structure of electronic equipment
　本発明は、液晶表示装置などに用いられる電子機器の放熱構造に関する。 The present invention relates to a heat dissipation structure of an electronic device used for a liquid crystal display device or the like.
　近年、ＩＣチップ（半導体チップ）等の電子部品を搭載した基板を備える電子機器が多く出回っている。例えば、液晶表示装置の液晶表示パネルを駆動するための基板にはこれらの電子部品が多く実装されている。 In recent years, many electronic devices including a substrate on which an electronic component such as an IC chip (semiconductor chip) is mounted are on the market. For example, many of these electronic components are mounted on a substrate for driving a liquid crystal display panel of a liquid crystal display device.
　また、各種電子機器に使用されている電子部品は、電子機器の小型化に対応するため、その集積度が向上し、ＩＣチップ等の電子部品を小さなスペースに高密度に配置することにより、発熱に対する放熱対策が大きな問題となっている。 In addition, electronic components used in various electronic devices are designed to be more compact in order to cope with the downsizing of electronic devices, and by disposing electronic components such as IC chips at high density in a small space, heat is generated. Measures against heat dissipation are a big problem.
　基板上に実装されるＩＣチップ等の電子部品は、使用時の発熱による温度上昇によって特性が変動して機器の誤作動の原因になったり、電子部品自体が故障したりすることがある。そのために、従来から、ＩＣチップ等の電子部品の温度上昇を抑える放熱構造が提案されている。 The characteristics of electronic components such as IC chips mounted on the substrate may change due to temperature rise due to heat generation during use, resulting in malfunction of the device, or failure of the electronic component itself. Therefore, conventionally, a heat dissipation structure that suppresses a temperature rise of an electronic component such as an IC chip has been proposed.
　例えば、ＩＣチップ等の電子部品の発熱を放熱するために、放熱板を用いているものがある。また、この放熱板とＩＣチップとの間に熱伝導性を有するゴムシートを介装して、このゴムシートを介して、ＩＣチップの熱を速やかに放熱板に伝熱しているものもある。 For example, there are some that use a heat sink to dissipate heat generated by electronic components such as IC chips. In some cases, a heat conductive rubber sheet is interposed between the heat radiating plate and the IC chip, and the heat of the IC chip is quickly transferred to the heat radiating plate through the rubber sheet.
　また、同一基板に複数のＩＣチップを搭載している場合には、近接して複数の発熱体が存在する構成となるので、このような構成の電子機器であれば、それぞれのＩＣチップのさらに速やかな放熱が求められる。 Further, in the case where a plurality of IC chips are mounted on the same substrate, a plurality of heating elements are present close to each other. Prompt heat dissipation is required.
　しかし、それぞれのチップ自体の厚みが異なることに起因して、その実装高さが異なる場合には、それぞれのチップ高さに応じたゴムシートや放熱板を設置して、それぞれのＩＣチップ毎に対応した放熱構造を選択する必要がある。 However, if the mounting height differs due to the difference in thickness of each chip itself, a rubber sheet or a heat sink corresponding to the chip height is installed, and each IC chip is It is necessary to select a corresponding heat dissipation structure.
　そのために、それぞれのＩＣチップ毎に直接放熱シートを介装して、それぞれのＩＣチップを放熱させることが行われる。例えば、基板上に搭載される発熱体と金属製のケースとの間に放熱用のシリコーンゴムシートを介装して、この発熱体の発熱を速やかに金属製のケースに伝導して、機器外部に放熱する電子機器の放熱構造が既に提案されている（例えば、特許文献１参照）。 For this purpose, each IC chip is radiated by directly dissipating a heat radiating sheet for each IC chip. For example, a silicone rubber sheet for heat dissipation is interposed between a heating element mounted on a substrate and a metal case, and the heat generated by the heating element is quickly conducted to the metal case, so that the outside of the device A heat dissipation structure for an electronic device that dissipates heat has already been proposed (see, for example, Patent Document 1).
　また、ＬＥＤ（発光ダイオード）を光源とするバックライトを有する液晶表示装置では、ＬＥＤチップ自体が発熱体となるので、このＬＥＤチップの発熱を速やかに放熱させることが好ましく、放熱性に優れた金属ケースを嵌合部材を介して位置決めして装着して、ＬＥＤチップの発熱を効率よく放熱する液晶表示装置が既に提案されている（例えば、特許文献２参照）。 Further, in a liquid crystal display device having a backlight using an LED (light emitting diode) as a light source, the LED chip itself becomes a heating element. Therefore, it is preferable to quickly dissipate the heat generated by the LED chip, and a metal having excellent heat dissipation. There has already been proposed a liquid crystal display device in which a case is positioned and mounted via a fitting member to efficiently dissipate heat generated by the LED chip (see, for example, Patent Document 2).
特開平１０－３０８４８４号公報JP-A-10-308484 特開２０１０－２７４５号公報JP 2010-2745 A
　基板に搭載するＩＣチップなどの発熱体と、この基板をカバーすると共に放熱板ともなるカバー部材との間に、熱伝導性の良好なシリコーンゴムなどの放熱シートを介装することで、ＩＣチップなどの発熱体の発熱をカバー部材から放熱させることが可能である。また、柔軟性を有する放熱シートを用いることで、ＩＣチップなどの発熱体とカバー部材との間の寸法のばらつきにもある程度は対応可能となる。 An IC chip is formed by interposing a heat-dissipating sheet such as silicone rubber having good thermal conductivity between a heating element such as an IC chip mounted on the substrate and a cover member that covers the substrate and also serves as a heat dissipation plate. It is possible to dissipate the heat generated by the heating element from the cover member. In addition, by using a heat dissipation sheet having flexibility, it is possible to cope with variations in dimensions between a heating element such as an IC chip and a cover member to some extent.
　しかし、同一基板上に高さの異なる複数のＩＣチップを搭載する場合では、それぞれのＩＣチップと基板カバーとの間隙寸法も異なるので、ＩＣチップと放熱シートとの当接圧にばらつきが生じて、放熱性が十分発揮されなくなってしまう問題が生じる。そのために、この間隙寸法に応じた適当な厚みの放熱シートを介装することが望ましい。 However, when a plurality of IC chips having different heights are mounted on the same substrate, the gap size between each IC chip and the substrate cover is also different, so that the contact pressure between the IC chip and the heat dissipation sheet varies. As a result, there is a problem that heat dissipation is not sufficiently exhibited. Therefore, it is desirable to interpose a heat dissipation sheet having an appropriate thickness according to the gap size.
　また、基板カバーに熱伝導性を備えるチップ押さえ部を突出して設けて、同一厚みの放熱シートを介装させてもよく、この場合には、予め搭載するチップ厚みに応じた所定の突出高さに製作しておけばよい。しかし、製作誤差が生じると、突出高さが異なってしまい、当接圧が小さくなったり大きくなり過ぎたりして問題となる。 Further, a chip pressing portion having thermal conductivity may be provided to protrude from the substrate cover, and a heat dissipation sheet having the same thickness may be interposed. In this case, a predetermined protrusion height corresponding to the chip thickness to be mounted in advance. You just have to make it. However, if a manufacturing error occurs, the protruding height is different, and the contact pressure becomes small or too large.
　また、複数のＩＣチップにそれぞれ放熱シートを取り付けて、この上に放熱板やカバー部材を載置する際に、放熱シートがずれたり脱落したりすると、十分な放熱性が得られなくなって、ＩＣチップの温度が上昇して特性が変動して機器の誤作動の原因になったり、電子部品自体が故障したりする問題を生じる。 In addition, when a heat radiating sheet is attached to each of a plurality of IC chips and a heat radiating plate or cover member is placed thereon, if the heat radiating sheet is displaced or dropped, sufficient heat dissipation cannot be obtained, and the IC The temperature of the chip rises and the characteristics fluctuate, causing problems such as malfunctioning of the device and failure of the electronic component itself.
　このように、放熱シートとＩＣチップとの当接圧が小さくなったり、放熱シートがＩＣチップから脱落したりすると、放熱性が低下してしまい問題となる。また、当接圧が大きくなり過ぎると、基板が撓んでダメージを受けたり、ＩＣチップが損傷したりして問題となる。 As described above, when the contact pressure between the heat dissipation sheet and the IC chip is reduced or the heat dissipation sheet is detached from the IC chip, the heat dissipation performance is deteriorated. Further, if the contact pressure becomes too large, the substrate may be bent and damaged, or the IC chip may be damaged.
　そのために、基板に複数のＩＣチップを搭載する場合に、それぞれの実装高さが異なっていても、装着の際に脱落せずに適当な当接圧で放熱シートをＩＣチップの全面に確実に当接させて、確実に放熱性を発揮する放熱構造であることが好ましい。 Therefore, when multiple IC chips are mounted on the board, even if the mounting heights are different, the heat dissipation sheet is securely attached to the entire surface of the IC chip with an appropriate contact pressure without falling off during mounting. It is preferable that the heat dissipating structure be in contact with the heat dissipating property.
　そこで本発明は、上記問題点に鑑み、基板に発熱体となるＩＣチップを搭載して、このＩＣチップとカバー部材との間に放熱シートを介装して放熱させる放熱構造において、装着する際に脱落せず、ＩＣチップとカバー部材との隙間にバラツキが生じても、適当な圧でＩＣチップと放熱シート、および、放熱シートとカバー部材とを当接させて、十分な放熱性を発揮して電子機器の信頼性を向上させることが可能な電子機器の放熱構造を提供することを目的とする。 Therefore, in view of the above problems, the present invention mounts an IC chip serving as a heating element on a substrate and dissipates heat by interposing a heat dissipation sheet between the IC chip and the cover member. Even if there is variation in the gap between the IC chip and the cover member, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are brought into contact with each other with an appropriate pressure to provide sufficient heat dissipation It is an object of the present invention to provide a heat dissipation structure for an electronic device that can improve the reliability of the electronic device.
　上記目的を達成するために本発明は、発熱体となる電子部品であるＩＣチップを搭載した基板と該基板の実装面側をカバーすると共に放熱性を備えたカバー部材とを有し、当該ＩＣチップと前記カバー部材との間に放熱シートを圧接状態に介装して、この放熱シートと前記カバー部材を介して放熱させる電子機器の放熱構造において、前記放熱シートは、前記ＩＣチップと付着する吸盤部を備え、熱伝導性を有するゴムシートからなることを特徴としている。 In order to achieve the above object, the present invention includes a substrate on which an IC chip, which is an electronic component serving as a heating element, is mounted, and a cover member that covers the mounting surface side of the substrate and has heat dissipation properties. In a heat dissipation structure of an electronic device in which a heat dissipation sheet is interposed between a chip and the cover member in a pressure-contact state and heat is dissipated through the heat dissipation sheet and the cover member, the heat dissipation sheet adheres to the IC chip. It is characterized by comprising a rubber sheet having a sucker portion and having thermal conductivity.
　この構成によると、放熱シートをＩＣチップに取り付ける際に、吸盤部を介して付着させることができるので、複数のＩＣチップに複数の放熱シートを取り付ける構成であっても、これらの放熱シートを脱落せずに安全に取り付けることができる。また、放熱シートの厚み方向に弾性を有するので、ＩＣチップとカバー部材との隙間にバラツキが生じても、確実に当接して、十分な放熱性を発揮する。そのために、本発明によれば、電子機器の信頼性を向上させることが可能な電子機器の放熱構造を得ることができる。 According to this configuration, when attaching the heat dissipation sheet to the IC chip, the heat dissipation sheet can be attached via the suction part, so even if the heat dissipation sheet is attached to the plurality of IC chips, these heat dissipation sheets are dropped off. Can be installed safely without Moreover, since it has elasticity in the thickness direction of the heat-dissipating sheet, even if the gap between the IC chip and the cover member varies, the heat-dissipating sheet makes sure contact and exhibits sufficient heat dissipation. Therefore, according to this invention, the heat dissipation structure of the electronic device which can improve the reliability of an electronic device can be obtained.
　また本発明は上記構成の電子機器の放熱構造において、前記吸盤部が平面部と該平面部の外周部から傘状に開いた傘状側面部とから形成される空隙部を備えた形状とされることを特徴としている。この構成によると、ゴムシートからなる傘状側面部と該側面部により形成される空隙部とで吸盤を形成するので、放熱シートの厚み方向に弾性を有する構成となり、ＩＣチップとカバー部材との隙間にバラツキに容易に対応可能となって、圧接されることで確実に当接させることができ、所定の放熱効果を発揮することが可能となる。 According to the present invention, in the heat dissipation structure for an electronic device having the above-described configuration, the suction cup portion includes a gap formed by a flat portion and an umbrella-shaped side portion that opens in an umbrella shape from an outer peripheral portion of the flat portion. It is characterized by that. According to this configuration, since the suction cup is formed by the umbrella-shaped side surface portion made of the rubber sheet and the gap portion formed by the side surface portion, the structure has elasticity in the thickness direction of the heat dissipation sheet, and the IC chip and the cover member It becomes possible to easily cope with variations in the gap, and it can be surely brought into contact with the gap by pressing, and a predetermined heat radiation effect can be exhibited.
　また本発明は上記構成の電子機器の放熱構造において、前記平面部の角部をテーパ状にカットするか、もしくは、円弧状に丸めた面取り部としたことを特徴としている。この構成によると、ＩＣチップに付着した放熱シートの上面の角部が面取りされているので、組立作業中に脱落し難い形状となって、放熱シートを確実にＩＣチップに装着することができる。 Further, the present invention is characterized in that, in the heat dissipation structure for an electronic device having the above-described configuration, the corner portion of the flat portion is cut into a taper shape or a chamfered portion rounded into an arc shape. According to this structure, since the corner | angular part of the upper surface of the thermal radiation sheet adhering to IC chip is chamfered, it becomes a shape which is hard to drop off during an assembly operation, and a thermal radiation sheet can be reliably attached to an IC chip.
　また本発明は上記構成の電子機器の放熱構造において、前記放熱シートは、前記吸盤部の外周に把持用リブを有することを特徴としている。この構成によると、リワーク時に取り外し容易となって、放熱シートの着脱やメンテナンスが容易となる電子機器の放熱構造となる。 Further, the present invention is characterized in that in the heat dissipation structure for an electronic device having the above-described configuration, the heat dissipation sheet has a gripping rib on an outer periphery of the suction cup portion. According to this structure, it becomes easy to remove at the time of rework, and it becomes the heat dissipation structure of the electronic device from which attachment / detachment and maintenance of a heat dissipation sheet become easy.
　また本発明は上記構成の電子機器の放熱構造において、前記放熱シートは、下部吸盤部と上部吸盤部を備え、これらの吸盤部のいずれか一方の吸盤部を介して前記ＩＣチップと付着し、いずれか他方の吸盤部を介して前記カバー部材と付着する構成としたことを特徴としている。この構成によると、一方の吸盤部を介してＩＣチップと付着し、他方の吸盤部を介してカバー部材と付着するので、放熱シートとカバー部材とが確実に組み付けられる構成となる。そのために、本発明によれば、ＩＣチップとカバー部材との隙間にバラツキが生じても、ＩＣチップと放熱シート、および、放熱シートとカバー部材とを適当な圧で当接させて、十分な放熱性を発揮して電子機器の信頼性を向上させることが可能な電子機器の放熱構造を得ることができる。 Further, in the heat dissipation structure of the electronic device according to the present invention, the heat dissipation sheet includes a lower sucker portion and an upper sucker portion, and is attached to the IC chip via any one of these sucker portions. It is characterized in that it is configured to adhere to the cover member via either one of the suction cups. According to this structure, it adheres to an IC chip through one suction cup part, and adheres to a cover member through the other suction cup part, so that the heat dissipation sheet and the cover member can be reliably assembled. Therefore, according to the present invention, even if the gap between the IC chip and the cover member is varied, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are brought into contact with each other with an appropriate pressure. It is possible to obtain a heat dissipation structure for an electronic device that can exhibit heat dissipation and improve the reliability of the electronic device.
　また本発明は上記構成の電子機器の放熱構造において、前記下部吸盤部の平面部と前記上部吸盤部の平面部同士を対向して接合して、それぞれの傘状側面部を外側に向けて、外向きに吸盤状の空隙部を形成したことを特徴としている。この構成によると、ゴムシートからなる傘状側面部と該側面部により形成される空隙部とで吸盤を形成するので、発熱シートの厚み方向に弾性を有する構成となり、ＩＣチップとカバー部材との隙間にバラツキに容易に対応可能となって、圧接されることで確実に当接させることができ、所定の放熱効果を発揮することが可能となる。また、ＩＣチップと放熱シート、および、放熱シートとカバー部材とが適当な圧で均一に当接する。 Further, in the heat dissipation structure of the electronic device having the above-described configuration, the planar portion of the lower sucker portion and the planar portion of the upper sucker portion are opposed to each other, and the respective umbrella-shaped side portions are directed outward. It is characterized in that a sucker-like gap is formed outward. According to this configuration, since the suction cup is formed by the umbrella-shaped side surface portion made of the rubber sheet and the gap portion formed by the side surface portion, the structure has elasticity in the thickness direction of the heat generating sheet, and the IC chip and the cover member It becomes possible to easily cope with variations in the gap, and it can be surely brought into contact with the gap by pressing, and a predetermined heat radiation effect can be exhibited. Further, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are uniformly in contact with each other with an appropriate pressure.
　また本発明は上記構成の電子機器の放熱構造において、前記放熱シートの厚み方向の中央部が括れて、この中央部から両側の外側にむけてそれぞれ拡径する下部傘状部と上部傘状部を形成する側壁部を有し、さらに、厚み方向に貫通した空隙部を有し、この空隙部と前記傘状部とで前記吸盤部を構成することを特徴としている。この構成によると、下部傘状部と上部傘状部が放熱シートの厚み方向に弾性を有すると共に厚み方向に貫通する空隙部と傘状部とで吸盤部を構成するので、ＩＣチップとカバー部材との隙間にバラツキに容易に対応可能となり、圧接されることで確実に当接させることができ、所定の放熱効果を発揮することが可能となる。また、ＩＣチップと放熱シート、および、放熱シートとカバー部材とが均一に当接する。 Further, in the heat dissipation structure for an electronic device having the above-described configuration, a lower umbrella-shaped portion and an upper umbrella-shaped portion in which the central portion in the thickness direction of the heat-dissipating sheet is constricted and diameters are increased from the central portion toward the outer sides on both sides. Further, there is a void portion penetrating in the thickness direction, and the suction cup portion is constituted by the void portion and the umbrella-shaped portion. According to this configuration, since the lower umbrella-shaped portion and the upper umbrella-shaped portion have elasticity in the thickness direction of the heat dissipation sheet and the gap portion and the umbrella-shaped portion penetrating in the thickness direction constitute the suction cup portion, the IC chip and the cover member It is possible to easily cope with variations in the gap between the two and the pressure contact, so that the gap can be surely brought into contact, and a predetermined heat radiation effect can be exhibited. Further, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are in uniform contact.
　また本発明は上記構成の電子機器の放熱構造において、前記空隙部が中央部から両側の外側にむけて拡径する鼓状の空隙部であることを特徴としている。この構成によると、鼓状の空隙部と傘状部とで、吸着力に優れた吸盤部を構成可能となって、圧接されることで確実に吸着させることができる。また、ＩＣチップと放熱シート、および、放熱シートとカバー部材とが均一に当接して、所定の放熱効果を発揮することが可能となる。 Further, the present invention is characterized in that in the heat dissipation structure for an electronic device having the above-described configuration, the gap is a drum-shaped gap that expands from the center toward the outside on both sides. According to this configuration, it is possible to configure the suction cup portion having an excellent suction force with the drum-shaped gap portion and the umbrella-shaped portion, and the suction cup portion can be reliably sucked by being pressed. Further, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are brought into uniform contact with each other, so that a predetermined heat radiating effect can be exhibited.
　また本発明は上記構成の電子機器の放熱構造において、前記放熱シートは、前記吸盤部を複数備える平板状のゴムシートとされることを特徴としている。この構成によると、大きな面積の基板に対応可能な放熱シートを得ることができる。 Further, the present invention is characterized in that in the heat dissipation structure for an electronic device having the above-described configuration, the heat dissipation sheet is a flat rubber sheet including a plurality of the suction cups. According to this configuration, it is possible to obtain a heat dissipating sheet that can accommodate a large-area substrate.
　また本発明は上記構成の電子機器の放熱構造において、前記吸盤部は、前記放熱シートの周辺部領域に配設されていることを特徴としている。この構成によると、複数の吸盤部を備える放熱シートであっても、それぞれの吸盤部をＩＣチップに取り付ける作業を容易に行うことが可能であると共に、発熱部が放熱シートの周辺部領域に位置することで、放熱シートの内部に熱がこもらない構成となって、放熱性能が十分発揮可能となる。 Further, the present invention is characterized in that in the heat dissipation structure for an electronic device having the above-described configuration, the suction cup portion is disposed in a peripheral region of the heat dissipation sheet. According to this configuration, even if the heat dissipating sheet includes a plurality of sucker parts, it is possible to easily perform the work of attaching each sucker part to the IC chip, and the heat generating part is located in the peripheral area of the heat dissipating sheet. By doing so, it becomes a configuration in which heat is not trapped inside the heat dissipation sheet, and the heat dissipation performance can be sufficiently exhibited.
　また本発明は上記構成の電子機器の放熱構造において、前記空隙部は、皿型状空隙部もしくはドーム状空隙部からなることを特徴としている。この構成によると、放熱シートに形成された皿型状もしくはドーム状の吸盤部を介して、基板に搭載されたＩＣチップに確実に付着して放熱性を発揮することができる。 Further, the present invention is characterized in that in the heat dissipation structure for an electronic device having the above-described configuration, the gap portion is a dish-shaped gap portion or a dome-shaped gap portion. According to this structure, it can adhere to the IC chip mounted on the board | substrate via the plate-shaped shape or dome-shaped suction cup part formed in the heat-radiation sheet, and can exhibit heat dissipation.
　また本発明は上記構成の電子機器の放熱構造において、前記カバー部材にチップ押さえ部を設け、該チップ押さえ部を介して、前記放熱シートを前記ＩＣチップに押圧していることを特徴としている。この構成によると、チップ押さえ部材を介して放熱シートを適当な圧でＩＣチップに当接させることができる。また、放熱シートとカバー部材とも確実に当接させることができる。 Further, the present invention is characterized in that, in the heat dissipation structure of the electronic device having the above-described configuration, a chip pressing part is provided on the cover member, and the heat dissipation sheet is pressed against the IC chip through the chip pressing part. According to this configuration, the heat radiation sheet can be brought into contact with the IC chip with an appropriate pressure via the chip pressing member. Further, both the heat dissipation sheet and the cover member can be reliably brought into contact with each other.
　また本発明は上記構成の電子機器の放熱構造において、前記チップ押さえ部は、前記カバー部材に一端が固着されてカバー部材から接離する方向に弾性変形可能とされる弾性片部と、この弾性片部の他端側に連接され前記放熱シートに当接する当接片部を備えた弾性押さえ部であることを特徴としている。この構成によると、ＩＣチップとカバー部材との隙間にバラツキが生じても、適当な圧でＩＣチップと放熱シート、および、放熱シートとカバー部材とを当接させて、十分な放熱性を発揮して電子機器の信頼性を向上させることが可能な電子機器の放熱構造となる。 According to the present invention, in the heat dissipation structure for an electronic device having the above-described configuration, the chip pressing portion is elastically deformable in a direction in which one end is fixed to the cover member and is elastically deformable in a direction of coming into contact with and away from the cover member. The elastic pressing portion includes an abutting piece portion connected to the other end side of the one portion and abutting against the heat radiating sheet. According to this configuration, even if the gap between the IC chip and the cover member varies, the IC chip and the heat dissipation sheet are brought into contact with each other with an appropriate pressure, and sufficient heat dissipation performance is exhibited. Thus, the heat dissipation structure of the electronic device can be improved, which can improve the reliability of the electronic device.
　本発明によれば、放熱シートが吸盤部を備えているので、放熱シートをＩＣチップに取り付ける際に、吸盤状に付着させることができる。そのために、複数のＩＣチップに複数の放熱シートを取り付ける構成であっても、これらの放熱シートを脱落せずに安全に取り付けることができる。また、放熱シートの厚み方向に弾性を有するので、ＩＣチップとカバー部材との隙間にバラツキが生じても、確実に当接して、十分な放熱性を発揮して電子機器の信頼性を向上させることが可能な電子機器の放熱構造を得ることができる。 According to the present invention, since the heat radiating sheet includes the sucker portion, when the heat radiating sheet is attached to the IC chip, it can be attached in a sucker shape. Therefore, even if it is the structure which attaches a some heat radiating sheet to a some IC chip, these heat radiating sheets can be safely attached without dropping off. In addition, since it has elasticity in the thickness direction of the heat dissipation sheet, even if there is a variation in the gap between the IC chip and the cover member, it reliably contacts and exhibits sufficient heat dissipation to improve the reliability of the electronic device. It is possible to obtain a heat dissipation structure for an electronic device that can be used.
本発明に係る電子機器の放熱構造の概要を示す概略側面図である。It is a schematic side view which shows the outline | summary of the heat dissipation structure of the electronic device which concerns on this invention. 本発明に係る電子機器の放熱構造の概要を示す概略平面図である。It is a schematic plan view which shows the outline | summary of the heat dissipation structure of the electronic device which concerns on this invention. 本発明に係る第一実施形態の放熱シートの側面図である。It is a side view of the thermal radiation sheet of a first embodiment concerning the present invention. 本発明に係る第二実施形態の放熱シートの側面図である。It is a side view of the thermal radiation sheet of 2nd embodiment which concerns on this invention. 本発明に係る第二実施形態の放熱シートの下平面図である。It is a bottom plan view of a heat dissipation sheet of a second embodiment according to the present invention. 第三実施形態の放熱シートの側面図である。It is a side view of the heat-radiation sheet of 3rd embodiment. 第四実施形態の放熱シートの側面図である。It is a side view of the heat-radiation sheet of 4th embodiment. 平板状のカバー部材を装着した放熱シートの装着例を示す概略説明図である。It is a schematic explanatory drawing which shows the example of mounting | wearing of the thermal radiation sheet | seat which mounted | wore the flat cover member. 放熱板を装着した放熱シートの装着例を示す概略説明図である。It is a schematic explanatory drawing which shows the example of mounting | wearing of the heat sink with which the heat sink was mounted | worn. 基板押さえ部を弾性押さえ部とした例を示す要部拡大図である。It is a principal part enlarged view which shows the example which used the board | substrate holding | suppressing part as the elastic pressing part. 弾性押さえ部の装着例を示す要部拡大図である。It is a principal part enlarged view which shows the example of mounting | wearing of an elastic pressing part. 基板を挟持する基板支持部を備える第一変形例を示す概略断面図である。It is a schematic sectional drawing which shows the 1st modification provided with the board | substrate support part which clamps a board | substrate. 基板を挟持する基板支持部を備える第二変形例を示す概略断面図である。It is a schematic sectional drawing which shows the 2nd modification provided with the board | substrate support part which clamps a board | substrate. 第一実施形態の放熱シートの装着例であって、上下二段式に重ね合わせて使用する例を示す側面図である。It is a side view which shows the example of mounting | wearing of the thermal radiation sheet | seat of 1st embodiment, Comprising: It overlaps and uses in an up-and-down two-stage type. 第一実施形態の放熱シートの装着例であって、一段で使用する例を示す側面図である。It is a side view which shows the example of mounting | wearing of the thermal radiation sheet | seat of 1st embodiment, Comprising: The example used in one step. 単一の吸盤部を備える第一実施形態の放熱シートの側面図である。It is a side view of the thermal radiation sheet of 1st embodiment provided with a single suction cup part. 複数の吸盤部を備える放熱シートの側断面図である。It is a sectional side view of a thermal radiation sheet provided with a plurality of suction cup parts. 複数の吸盤部を備える放熱シートの平面図である。It is a top view of a thermal radiation sheet provided with a plurality of suction cup parts. ドーム状の吸盤部を備える放熱シートの側断面図である。It is a sectional side view of a thermal radiation sheet provided with a dome-shaped suction cup part. 把持用リブを備える放熱シートの側面図である。It is a side view of a thermal radiation sheet provided with the rib for holding.
　以下に本発明の実施形態を図面を参照して説明する。また、同一構成部材については同一の符号を用い、詳細な説明は適宜省略する。 Embodiments of the present invention will be described below with reference to the drawings. Moreover, the same code | symbol is used about the same structural member, and detailed description is abbreviate | omitted suitably.
　本実施形態に係る電子機器の放熱構造は、ＩＣチップ（半導体チップ）等の電子部品を搭載した基板を備える電子機器に関する放熱構造であって、例えば図１Ａに示すように、基板２に実装されるＩＣチップ３（３Ａ、３Ｂ）と基板カバーなどのカバー部材４との間に放熱シート１を介装して放熱する放熱構造である。 The heat dissipation structure for an electronic device according to the present embodiment is a heat dissipation structure for an electronic device including a substrate on which an electronic component such as an IC chip (semiconductor chip) is mounted, and is mounted on a substrate 2 as shown in FIG. 1A, for example. The heat dissipating structure dissipates heat by interposing the heat dissipating sheet 1 between the IC chip 3 (3A, 3B) and the cover member 4 such as a substrate cover.
　また、本実施形態ではこの放熱シート１は、ＩＣチップ３（３Ａ、３Ｂ）と付着する吸盤部を備え、熱伝導性を有するゴムシートからなる構成としている。そのために、放熱シート１をＩＣチップに取り付ける際に、吸盤部を介して付着させることができるので、複数のＩＣチップに複数の放熱シート１を取り付ける構成であっても、これらの放熱シート１を脱落せずに安全に取り付けることができる。また、放熱シート１の厚み方向に弾性を有するので、ＩＣチップ３（３Ａ、３Ｂ）とカバー部材４との隙間にバラツキが生じても、確実に当接して、十分な放熱性を発揮する構成となる。 Further, in the present embodiment, the heat radiating sheet 1 includes a sucker portion that adheres to the IC chip 3 (3A, 3B), and is configured by a rubber sheet having thermal conductivity. Therefore, when attaching the heat radiation sheet 1 to the IC chip, the heat radiation sheet 1 can be attached via the suction cup portion. Therefore, even if the plurality of heat radiation sheets 1 are attached to the plurality of IC chips, It can be safely installed without falling off. Moreover, since it has elasticity in the thickness direction of the heat-dissipating sheet 1, even if the gap between the IC chip 3 (3 </ b> A, 3 </ b> B) and the cover member 4 varies, the heat-dissipating sheet 1 is in a reliable contact and exhibits sufficient heat dissipation. It becomes.
　次に吸盤部を備える放熱シートの構成について図２Ａ～図２Ｃを用いて説明する。 Next, the structure of the heat radiating sheet having the suction cup portion will be described with reference to FIGS. 2A to 2C.
　図２Ａに示す第一実施形態の放熱シート１Ａは、平面部１１ａと傘状に開いた側面部１１ｂを備えて、外向きに拡径した空隙部１１ｃを形成している。そのために、この傘状に開いた側面部１１ｂと空隙部１１ｃとで吸盤部１１を形成する。 2A of the first embodiment shown in FIG. 2A includes a flat surface portion 11a and a side surface portion 11b that opens in an umbrella shape, and forms a void portion 11c having an outward diameter. Therefore, the suction cup part 11 is formed by the side face part 11b and the gap part 11c that are opened in an umbrella shape.
　また、図２Ｂに示す第二実施形態のように、吸盤部１１の上に第二の吸盤部１２を重ね合わせて中央部が括れた鼓状構成の放熱シート１Ｂとしてもよい。この場合には、いずれか一方の吸盤部を介してＩＣチップ３と付着し、いずれか他方の吸盤部を介してカバー部材４と付着する構成とする。 Further, as in the second embodiment shown in FIG. 2B, a heat dissipation sheet 1 </ b> B having a drum-like configuration in which the second suction cup portion 12 is overlapped on the suction cup portion 11 and the center portion is constricted may be used. In this case, the IC chip 3 is attached via any one of the suction cups, and the cover member 4 is attached via any one of the suction cups.
　そのために、例えば、吸盤部１１を下部吸盤部１１と称し、吸盤部１２を上部吸盤部と称する。また、下部吸盤部１１の平面部１１ａと上部吸盤部１２の平面部１２ａ同士を対向して接合して、それぞれの傘状側面部１１ｂ、１２ｂを外側にむけた構成としている。 Therefore, for example, the suction cup 11 is referred to as the lower suction cup 11 and the suction cup 12 is referred to as the upper suction cup. Moreover, the plane part 11a of the lower suction part 11 and the plane part 12a of the upper suction part 12 are joined facing each other, and the respective umbrella-shaped side parts 11b and 12b are directed outward.
　この放熱シート１（１Ａ、１Ｂ）は、例えば、アスカーＣ硬度が３０～６０程度のシリコーンゴムシートやアクリルゴムシートなどの放熱性を有するゴムシートを用いるとよい。なお、アスカーＣ硬度とは、日本ゴム協会標準規格で規定されるゴム硬度であり、ＪＩＳ　Ｋ　６２５３で規定されるショア硬度Ｅに相当する。 The heat-dissipating sheet 1 (1A, 1B) may be a heat-dissipating rubber sheet such as a silicone rubber sheet or acrylic rubber sheet having an Asker C hardness of about 30-60. The Asker C hardness is a rubber hardness defined by the Japan Rubber Association standard, and corresponds to a Shore hardness E defined by JIS K 6253.
　上記の構成であれば、ゴムシートからなる傘状に開いた側面部が厚み方向に弾性を有するので、ＩＣチップ３とカバー部材４との隙間にバラツキに容易に対応可能となり、圧接されることで確実に当接させることができ、所定の放熱効果を発揮することが可能となる。また、ＩＣチップ３と放熱シート１、および、放熱シート１とカバー部材４とが均一に当接することができる With the above configuration, since the side surface portion made of a rubber sheet and opened in an umbrella shape has elasticity in the thickness direction, the gap between the IC chip 3 and the cover member 4 can be easily dealt with and pressed. Can be brought into contact with each other reliably, and a predetermined heat dissipation effect can be exhibited. Further, the IC chip 3 and the heat radiating sheet 1 and the heat radiating sheet 1 and the cover member 4 can be in uniform contact with each other.
　カバー部材４は、上面４１と側面４２と取付け面４３を備えた基板カバーであって、例えば、熱伝導性を備えて放熱性を発揮するアルミ板などの金属板金を用いて折り曲げ構成とされ、取付け面４３を基板２に載置して止めネジ４４を用いてネジ固定される。また、基板２に複数のＩＣチップ３（３Ａ、３Ｂ）を搭載する場合には、このＩＣチップ搭載部に合致した位置の上面部にチップ押さえ部５（５Ａ、５Ｂ）が設けられている。 The cover member 4 is a substrate cover including an upper surface 41, a side surface 42, and an attachment surface 43, and is configured to be bent using, for example, a metal sheet metal such as an aluminum plate that has thermal conductivity and exhibits heat dissipation, The mounting surface 43 is placed on the substrate 2 and fixed with screws using a set screw 44. Further, when a plurality of IC chips 3 (3A, 3B) are mounted on the substrate 2, chip pressing portions 5 (5A, 5B) are provided on the upper surface portion at a position matching the IC chip mounting portion.
　図１Ｂに示すように、例えば、矩形の基板２にＩＣチップ３が４個搭載された構成であれば、カバー部材４も平面視矩形に形成される。また、搭載されるＩＣチップ３の個数に応じて、平面視矩形のカバー部材４に４個のチップ押さえ部５（５Ａ、５Ｂ、５Ｃ、５Ｄ）が設けられている。これらのチップ押さえ部５（５Ａ～５Ｄ）も熱伝導性を備えた板金製であることが好ましく、熱伝導性を備えたカバー部材４の上面４１部を板金加工して設けることができる。また、熱伝導性を備えた別部材からなる押さえ部を接合して設けてもよく、特に限定されるものではない。 As shown in FIG. 1B, for example, in a configuration in which four IC chips 3 are mounted on a rectangular substrate 2, the cover member 4 is also formed in a rectangular shape in plan view. Further, four chip pressing portions 5 (5A, 5B, 5C, and 5D) are provided on the cover member 4 having a rectangular shape in plan view according to the number of IC chips 3 to be mounted. These chip pressing portions 5 (5A to 5D) are also preferably made of sheet metal having thermal conductivity, and the upper surface 41 portion of the cover member 4 having thermal conductivity can be provided by sheet metal processing. Moreover, you may join and provide the pressing part which consists of another member provided with heat conductivity, It does not specifically limit.
　それぞれのチップ押さえ部５の突出高さは、それぞれのＩＣチップ３とカバー部材４との間に放熱シート１を圧接状態に介装可能な程度に突出した高さとされる。また、放熱シート１がシリコーンゴムやアクリルゴムからなる放熱性に優れた柔軟なシートであれば、このチップ押さえ部５を介して、放熱シート１を弾性的に押圧して圧接することが容易となって好ましい。 The protruding height of each chip pressing portion 5 is a height that protrudes between each IC chip 3 and the cover member 4 to such an extent that the heat-dissipating sheet 1 can be interposed in a pressure contact state. Further, if the heat radiating sheet 1 is a flexible sheet made of silicone rubber or acrylic rubber and having excellent heat radiating properties, it is easy to press the heat radiating sheet 1 elastically through the chip pressing portion 5 and press-contact it. It is preferable.
　上記のような構成であれば、熱伝導性を有する放熱シート１からチップ押さえ部５を介して、ＩＣチップ３の熱が放熱板ともなるカバー部材４に速やかに伝導されるので、ＩＣチップ３の熱を速やかに放熱することができる。 With the configuration as described above, the heat of the IC chip 3 is quickly conducted to the cover member 4 serving as a heat radiating plate from the heat conductive heat radiating sheet 1 through the chip pressing portion 5. This heat can be quickly dissipated.
　次に、下部吸盤部と上部吸盤部を備えて厚み方向に鼓状とされる放熱シート１Ｂの構成について図２Ａ～図２Ｃ、および、図３Ａ、図３Ｂを用いてさらに説明する。 Next, the structure of the heat radiating sheet 1B having a lower suction part and an upper suction part and having a drum shape in the thickness direction will be further described with reference to FIGS. 2A to 2C, and FIGS. 3A and 3B.
　放熱シート１Ｂは、例えば、図２Ｂに示すような側面視鼓状とされる。この放熱シート１Ｂは、下部吸盤部１１と上部吸盤部１２を備えていて、それぞれの吸盤部は、平面部と傘状に開いた側面部を備えた形状とされる。また、下部吸盤部１１の平面部１１ａと上部吸盤部１２の平面部１２ａ同士を対向して接合して、それぞれの傘状側面部１１ｂ、１２ｂを外側にむけた構成としている。 The heat dissipation sheet 1B has, for example, a side-view drum shape as shown in FIG. 2B. This heat radiating sheet 1B is provided with the lower suction part 11 and the upper suction part 12, and each suction part is made into the shape provided with the plane part and the side part opened in umbrella shape. Moreover, the plane part 11a of the lower suction part 11 and the plane part 12a of the upper suction part 12 are joined facing each other, and the respective umbrella-shaped side parts 11b and 12b are directed outward.
　これらの、下部吸盤部１１と上部吸盤部１２は、前述したように熱伝導性を有する皿型状のゴムシート材からなり、例えば、熱伝導性に優れた柔軟なシリコーンゴムシート製とされる。そのために、それぞれの吸盤部は、平面部同士が接合された厚み方向の中央部から外向きに拡径した空隙部１１ｃ、１２ｃと、ゴム状弾性体からなり傘状に開いた傘状側面部１１ｂ、１２ｂとから構成される。 The lower sucker portion 11 and the upper sucker portion 12 are made of a dish-shaped rubber sheet material having thermal conductivity as described above, and are made of, for example, a flexible silicone rubber sheet having excellent thermal conductivity. . For this purpose, each sucker portion includes gap portions 11c and 12c that are expanded outward from the central portion in the thickness direction in which the flat portions are joined to each other, and an umbrella-shaped side portion that is formed of a rubber-like elastic body and is opened in an umbrella shape. 11b and 12b.
　上記の構成であれば、ゴムシートからなる傘状側面部１１ｂ、１２ｂが放熱シートの厚み方向に弾性を有するので、ＩＣチップとカバー部材との隙間にバラツキが生じても、圧接されることで容易に対応して、確実に当接させることができ、所定の放熱効果を発揮することが可能となる。そして、ＩＣチップと放熱シート、および、放熱シートとカバー部材とが適当な圧で均一に当接する。 If it is said structure, since the umbrella-shaped side part 11b, 12b which consists of rubber sheets has elasticity in the thickness direction of a heat radiating sheet, even if variation in the clearance gap between IC chip and a cover member arises, it is press-contacted. Corresponding easily, it can be made to contact reliably, and it becomes possible to exhibit a predetermined heat dissipation effect. Then, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are uniformly in contact with each other with an appropriate pressure.
　また、放熱シート１（１Ａ、１Ｂ）の形状は、図２Ｃに示すように、例えば、平面視円形とする。そのために、下部吸盤部１１がＩＣチップに装着される場合には、その当接面が環状の当接面１１ｄとなり、この環状の当接面１１ｄをＩＣチップの上面に押し付けるようにして吸盤状に付着させることが可能である。 The shape of the heat dissipation sheet 1 (1A, 1B) is, for example, a circular shape in plan view, as shown in FIG. 2C. Therefore, when the lower suction cup 11 is mounted on the IC chip, the contact surface becomes an annular contact surface 11d, and the annular contact surface 11d is pressed against the upper surface of the IC chip to form a suction cup shape. It is possible to adhere to.
　また、放熱シート１（１Ａ、１Ｂ）の平面視形状は円形でなくてもよく、装着するＩＣチップに吸盤状に付着可能な形状であれば、楕円形でも多角形でもよい。 Further, the planar view shape of the heat radiation sheet 1 (1A, 1B) may not be circular, and may be elliptical or polygonal as long as it can be attached to the IC chip to be attached in a sucker shape.
　また、図３Ａに示す第三実施形態のように、装着するＩＣチップに吸盤状に付着可能であれば、その厚み方向の中央部が括れて、この中央部から両側の外側にむけてそれぞれ拡径する下部傘状部１３ａと上部傘状部１３ｂを備え、さらに、厚み方向に貫通した鼓状の空隙部１３ｃを備えた形状の放熱シート１Ｃでもよい。 Further, as in the third embodiment shown in FIG. 3A, if the IC chip to be attached can be attached in a sucker shape, the central portion in the thickness direction is constricted and expanded from the central portion toward the outside on both sides. The heat radiating sheet 1 </ b> C may include a shape having a lower umbrella-shaped portion 13 a and an upper umbrella-shaped portion 13 b that have a diameter, and a drum-shaped gap portion 13 c that penetrates in the thickness direction.
　この構成であっても、下部傘状部１３ａと上部傘状部１３ｂが放熱シート１Ｃの厚み方向に弾性を有するので、ＩＣチップ３とカバー部材４との隙間のバラツキに容易に対応可能となる。さらに、鼓状の空隙部１３ｃと傘状部とで、吸着力に優れた吸盤部を構成可能となって、圧接されることで確実に吸着させることができる。そのために、ＩＣチップと放熱シート、および、放熱シートとカバー部材とが均一に当接して、所定の放熱効果を発揮することが可能となる。 Even in this configuration, since the lower umbrella-shaped portion 13a and the upper umbrella-shaped portion 13b have elasticity in the thickness direction of the heat radiation sheet 1C, it becomes possible to easily cope with the gap variation between the IC chip 3 and the cover member 4. . Further, the drum-shaped gap portion 13c and the umbrella-shaped portion can constitute a suction cup portion having an excellent suction force, and can be reliably sucked by being pressed. Therefore, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member can be brought into contact with each other uniformly to exhibit a predetermined heat radiating effect.
　また、傘状部が当接するＩＣチップに吸盤状に付着可能であれば、厚み方向に貫通する空隙部は鼓状以外の形状でもよく、例えば、図３Ｂに示す第四実施形態のような単純な丸孔状の空隙部１３ｄであってもよい。このような第四実施形態の放熱シート１Ｄであっても、括れた中央部から拡径する側壁部１３が放熱シート１Ｄの厚み方向に弾性を有するので、ＩＣチップとカバー部材との隙間にバラツキに容易に対応可能となり、圧接されることで確実に当接させることができ、所定の放熱効果を発揮することが可能となる。また、ＩＣチップと放熱シート、および、放熱シートとカバー部材とが適当な圧で均一に当接する。 Further, if the IC chip with which the umbrella-shaped portion abuts can be attached in a sucker shape, the gap portion penetrating in the thickness direction may have a shape other than the drum shape. For example, as in the fourth embodiment shown in FIG. It may be a round hole-shaped gap portion 13d. Even in the heat radiating sheet 1D of the fourth embodiment, the side wall portion 13 whose diameter is increased from the constricted central portion has elasticity in the thickness direction of the heat radiating sheet 1D, and thus the gap between the IC chip and the cover member varies. Can be easily accommodated, and can be reliably brought into contact with each other by being pressed against each other, and a predetermined heat radiation effect can be exhibited. Further, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are uniformly in contact with each other with an appropriate pressure.
　下部傘状部１３ａと上部傘状部１３ｂとを備え、鼓状の空隙部１３ｃを備えた形状の放熱シート１Ｃでも、丸孔状の空隙部１３ｄを備えた形状の放熱シート１Ｄでも、これらの放熱シートをＩＣチップとカバー部材との間に介装して圧接すると、弾性を有する傘状部から空気が抜けて下部傘状部１３ａと上部傘状部１３ｂとが吸盤作用を発揮する。そのために、下部傘状部１３ａが下部吸盤部となり、上部傘状部１３ｂが上部吸盤部となる。 These include a heat dissipation sheet 1C having a lower umbrella-shaped portion 13a and an upper umbrella-shaped portion 13b and having a drum-shaped gap portion 13c, and a heat-dissipation sheet 1D having a shape having a round hole-shaped gap portion 13d. When the heat radiating sheet is interposed between the IC chip and the cover member and press-contacted, the air is released from the elastic umbrella-shaped portion, and the lower umbrella-shaped portion 13a and the upper umbrella-shaped portion 13b exhibit the suction cup action. Therefore, the lower umbrella-shaped part 13a becomes a lower sucker part, and the upper umbrella-shaped part 13b becomes an upper sucker part.
　次に、放熱シート１Ｂを実際に使用した装着例について図４Ａ、図４Ｂを用いて説明する。 Next, a mounting example in which the heat radiation sheet 1B is actually used will be described with reference to FIGS. 4A and 4B.
　図４Ａには、比較的厚みの薄いＩＣチップ３Ａに前述した下部吸盤部１１と上部吸盤部１２を備える放熱シート１Ｂを取り付け、比較的厚みの厚いＩＣチップ３Ｂに同じく放熱シート１Ｂを取り付けて、カバー部材４Ａを組み付けた状態を示している。 In FIG. 4A, the heat dissipation sheet 1B including the lower suction part 11 and the upper suction part 12 described above is attached to the relatively thin IC chip 3A, and the heat dissipation sheet 1B is similarly attached to the relatively thick IC chip 3B. A state in which the cover member 4A is assembled is shown.
　このように、放熱シート１Ｂは、その厚み方向に柔軟性を備えているので、高さの異なるＩＣチップに対しても容易に対応可能となる。そのために、カバー部材４Ａに、基板押さえ等の突出部を設けなくてもよく、カバー部材のコストを低く抑えることが可能となって好ましい。 Thus, since the heat radiation sheet 1B has flexibility in the thickness direction, it can easily cope with IC chips having different heights. Therefore, it is not necessary to provide the cover member 4A with a protruding portion such as a substrate pressing member, which is preferable because the cost of the cover member can be kept low.
　また、放熱シート１Ｂは下部吸盤部１１と上部吸盤部１２を備えているので、基板２に固定するタイプのカバー部材ではなく、放熱板を上部吸盤部１２に付着させる構成としてもよい。この実施形態を図４Ｂに示す。 Further, since the heat radiating sheet 1B includes the lower sucker portion 11 and the upper sucker portion 12, the heat sink may be attached to the upper sucker portion 12 instead of a cover member fixed to the substrate 2. This embodiment is shown in FIG. 4B.
　図４Ｂには、比較的厚みの薄いＩＣチップ３Ａに放熱シート１Ｂを取り付け、この放熱シート１Ｂの上に放熱板９Ａを吸着させるように載置し、比較的厚みの厚いＩＣチップ３Ｂに同じく放熱シート１Ｂを取り付けて、この上に放熱板９Ｂを吸着させるように載置した状態を示している。 In FIG. 4B, the heat dissipation sheet 1B is attached to the relatively thin IC chip 3A, and the heat dissipation plate 9A is placed on the heat dissipation sheet 1B so as to be radiated to the relatively thick IC chip 3B. A state in which the sheet 1B is attached and placed so as to adsorb the heat radiating plate 9B thereon is shown.
　このように、放熱シート１Ｂが備える上部吸盤部１２に、放熱板９Ａ、９Ｂを吸着させるように取り付けることができるので、複数のＩＣチップ３（３Ａ、３Ｂ）にそれぞれ放熱シート１Ｂを取り付けて組み立てる際に、これらの放熱シートを脱落せずに安全に取り付けることができる。 Thus, since it can attach so that heat sink 9A, 9B may be adsorbed to the upper sucker part 12 with which heat sink sheet 1B is equipped, heat sink sheet 1B is attached and assembled to a plurality of IC chips 3 (3A, 3B), respectively. In this case, these heat radiation sheets can be safely attached without dropping off.
　また、カバー部材に設けるチップ押さえ部を用いて、より確実に、放熱シートをＩＣチップに当接させることが可能であるので、図５Ａ、図５Ｂを用いて、チップ押さえ部の変形例の実施形態について説明する。 Moreover, since it is possible to contact the heat-radiating sheet to the IC chip more reliably by using the chip pressing portion provided on the cover member, a modified example of the chip pressing portion is implemented using FIGS. 5A and 5B. A form is demonstrated.
　図５Ａに示すチップ押さえ部は、カバー部材４に一端が固着されてカバー部材から接離する方向に弾性変形可能とされる弾性片部５１ｂと、この弾性片部５１ｂの他端側に連接され放熱シートに当接して押圧する当接片部５１ａを備えた弾性押さえ部５１である。 The tip pressing portion shown in FIG. 5A is connected to an elastic piece 51b that is fixed to the cover member 4 at one end and is elastically deformable in a direction to come in contact with and away from the cover member, and the other end of the elastic piece 51b. It is the elastic pressing part 51 provided with the contact piece part 51a contact | abutted and pressed to a heat radiating sheet.
　また、図５Ｂに、この弾性押さえ部５１を用いて実際に基板２に搭載されたＩＣチップ３に放熱シート１（１Ｂ）を介装した状態を示す。 FIG. 5B shows a state in which the heat dissipation sheet 1 (1B) is interposed in the IC chip 3 actually mounted on the substrate 2 using the elastic pressing portion 51.
　図に示すように、当接片部５１ａにより押圧されて、放熱シート１がＩＣチップ３の上面に確実に当接した状態となる。このとき、弾性片部５１ｂは弾性変形しており、当接片部５１ａがＩＣチップ３と放熱シート１の上面に弾性的に付勢された状態となる。 As shown in the figure, the heat-dissipating sheet 1 is in contact with the upper surface of the IC chip 3 by being pressed by the contact piece 51a. At this time, the elastic piece portion 51b is elastically deformed, and the contact piece portion 51a is elastically biased to the upper surfaces of the IC chip 3 and the heat dissipation sheet 1.
　この構成であれば、ＩＣチップ３とカバー部材４との隙間にバラツキが生じても、適当な圧でＩＣチップ３と放熱シート１、および、放熱シート１とカバー部材４とを当接させて、十分な放熱性を発揮して電子機器の信頼性を向上させることが可能な電子機器の放熱構造となる。 With this configuration, even if the gap between the IC chip 3 and the cover member 4 varies, the IC chip 3 and the heat dissipation sheet 1 and the heat dissipation sheet 1 and the cover member 4 are brought into contact with each other with an appropriate pressure. Thus, the heat dissipation structure of the electronic device can be achieved, which can exhibit sufficient heat dissipation and improve the reliability of the electronic device.
　また、カバー部材４とベース部材とで基板を挟持するように支持する構成を利用して、基板の変形を抑制すると共に放熱シートとＩＣチップとの当接を良好として、十分な放熱性を発揮することも可能であって、その実施形態について、図６に示す第一変形例と図７に示す第二変形例を用いて説明する。 In addition, by utilizing a structure in which the substrate is supported by the cover member 4 and the base member, the deformation of the substrate is suppressed and the contact between the heat dissipation sheet and the IC chip is good, and sufficient heat dissipation is exhibited. The embodiment will be described with reference to a first modification shown in FIG. 6 and a second modification shown in FIG.
　図６に示す第一変形例は、ベース部材６に設ける基板支持脚６２、６３とカバー部材４に設ける基板支持脚４２、４３とで、基板２を挟持して保持するようにしている。また、ベース部材６に、ＩＣチップ３ＡとＩＣチップ３Ｂとの中間部を支持する中間支持脚６１を設けている。この構成であれば、基板２が変形しないので、放熱シート１（１Ａ、１Ｂ、１Ｃ、１Ｄ）とＩＣチップ３（３Ａ、３Ｂ）とが圧接されても基板２が撓んだり変形したりせず、基板２がダメージを受けない構成となって好ましい。 In the first modification shown in FIG. 6, the substrate 2 is sandwiched and held by the substrate support legs 62 and 63 provided on the base member 6 and the substrate support legs 42 and 43 provided on the cover member 4. Further, the base member 6 is provided with an intermediate support leg 61 that supports an intermediate portion between the IC chip 3A and the IC chip 3B. With this configuration, since the substrate 2 is not deformed, the substrate 2 may be bent or deformed even if the heat dissipation sheet 1 (1A, 1B, 1C, 1D) and the IC chip 3 (3A, 3B) are pressed against each other. It is preferable that the substrate 2 is not damaged.
　また、上記の構成であっても、ＩＣチップ３Ａ、３Ｂに搭載する放熱シート１をカバー部材４に設ける基板押さえ部（弾性押さえ部５１）を介して圧接する構成とすることで、適当な圧でＩＣチップ３Ａ、３Ｂと放熱シート１、および、放熱シート１とカバー部材４とを当接させて、十分な放熱性を発揮して電子機器の信頼性を向上させることが可能な電子機器の放熱構造となる。 Moreover, even if it is said structure, by setting it as the structure which press-contacts via the board | substrate holding | suppressing part (elastic holding | suppressing part 51) which provides the heat dissipation sheet 1 mounted in IC chip 3A, 3B in the cover member 4, appropriate pressure Thus, the IC chips 3A and 3B and the heat dissipation sheet 1 and the heat dissipation sheet 1 and the cover member 4 are brought into contact with each other, so that sufficient heat dissipation can be achieved to improve the reliability of the electronic device. It becomes a heat dissipation structure.
　また、図７に示す第二変形例では、実装面を下向きにして基板２を支持する際に、下ベース部材７と上ベース部材８を用いて、下ベース部材７に設ける基板支持脚７２、７３と上ベース部材８に設ける基板支持脚８２、８３とで、基板２を挟持して保持する構成としている。また、上ベース部材８に、ＩＣチップ３ＡとＩＣチップ３Ｂとの中間部を支持する中間支持脚８１を設けている。 In the second modification shown in FIG. 7, when supporting the substrate 2 with the mounting surface facing downward, the substrate support leg 72 provided on the lower base member 7 using the lower base member 7 and the upper base member 8, 73 and the substrate support legs 82 and 83 provided on the upper base member 8 are configured to sandwich and hold the substrate 2. Further, the upper base member 8 is provided with an intermediate support leg 81 that supports an intermediate portion between the IC chip 3A and the IC chip 3B.
　この構成であっても、基板２の撓みや変形を抑制可能な構成となる。そのために、放熱シート１とＩＣチップとを圧接しても、基板がダメージを受けない構成となる。 Even with this configuration, the substrate 2 can be prevented from being bent or deformed. Therefore, even if the heat radiation sheet 1 and the IC chip are pressed against each other, the substrate is not damaged.
　また、上記の構成であっても、ＩＣチップ３Ａ、３Ｂに搭載する放熱シート１を下ベース部材７に設ける基板押さえ部７１Ａ、７１Ｂを介して圧接する構成とすることで、ＩＣチップ３Ａ、３Ｂと放熱シート１、および、放熱シート１と上ベース部材８とを適当な圧で当接させて、十分な放熱性を発揮して電子機器の信頼性を向上させることが可能な電子機器の放熱構造となる。 Moreover, even if it is said structure, by setting it as the structure which press-contacts via the board | substrate holding | suppressing part 71A, 71B which provides the heat radiation sheet 1 mounted in IC chip 3A, 3B in the lower base member 7, IC chip 3A, 3B And heat dissipation sheet 1, and heat dissipation of electronic device capable of bringing heat dissipation sheet 1 and upper base member 8 into contact with each other with an appropriate pressure to exhibit sufficient heat dissipation and improve the reliability of the electronic device It becomes a structure.
　基板押さえ部７１Ａ、７１Ｂは、前述したチップ押さえ部５Ａ、５Ｂと同様に、単に所定高さに突出された押さえ部であってもよく、また、前述した弾性押さえ部５１と同様に、弾性変形容易な構成であってもよい。 The substrate pressing portions 71A, 71B may be simply pressing portions that protrude to a predetermined height, similar to the above-described chip pressing portions 5A, 5B, and, like the above-described elastic pressing portion 51, elastic deformation. An easy configuration may be used.
　いずれにしても、基板２の両面を挟持するようにして保持する構成であれば、基板２の撓みや変形を抑制可能な構成となって、基板にダメージを与えることなく、放熱シート１をＩＣチップ３に圧接して装着することができる。 Anyway, if it is the structure which hold | maintains so that both surfaces of the board | substrate 2 may be pinched | interposed, it will become the structure which can suppress the bending | flexion and deformation | transformation of the board | substrate 2, and the heat-radiation sheet | seat 1 is IC without damage to a board | substrate It can be mounted in pressure contact with the chip 3.
　また、単一の吸盤部を有する第一実施形態の放熱シート１ＡをそれぞれＩＣチップと放熱板に付着して、これらを重ね合わせるようにして組み付けることも可能であって、例えば、図８Ａに示すように、第一放熱シートの吸盤部１１をＩＣチップ３に付着し、第二放熱シートの吸盤部１２を放熱板９に付着して、これらを重ね合わせるようにして組み立てる構成としてもよい。 Further, the heat dissipating sheet 1A of the first embodiment having a single sucker portion can be attached to the IC chip and the heat dissipating plate, respectively, and can be assembled so as to overlap each other. For example, as shown in FIG. 8A In this manner, the suction plate portion 11 of the first heat radiation sheet may be attached to the IC chip 3, the suction plate portion 12 of the second heat radiation sheet may be attached to the heat radiation plate 9, and they may be assembled so as to overlap each other.
　また、図８Ｂに示すように、基板２に搭載されたＩＣチップ３に第一放熱シートの吸盤部１１を付着し、この上に直接放熱板９を取り付ける構成としてもよい。 Further, as shown in FIG. 8B, the suction plate portion 11 of the first heat radiation sheet may be attached to the IC chip 3 mounted on the substrate 2, and the heat radiation plate 9 may be directly attached thereon.
　また、吸盤部を複数備えた放熱シートでもよく、吸盤部を形成する空隙部の形状も種々考えられるので、これらの各種実施形態例について図９Ａ～図９Ｅを用いて説明する。 Also, a heat radiating sheet having a plurality of suction cups may be used, and various shapes of the gaps forming the suction cups are also conceivable, so these various embodiments will be described with reference to FIGS. 9A to 9E.
　図９Ａは、傘状に開いた側面部１１Ａｂと皿型状の空隙部１１Ａｃから形成される吸盤部を備えた放熱シート１Ａの変形例であって、平面部１１Ａａの角部をテーパ状にカットするか、もしくは、円弧状に丸めて面取り部１４を形成した例を示している。このような構成であれば、ＩＣチップに付着した放熱シートの上面の角部が面取りされているので、組立作業中に脱落し難い形状となって、放熱シートを確実にＩＣチップに装着することができる。 FIG. 9A is a modification of the heat dissipation sheet 1A having a suction cup portion formed of a side surface portion 11Ab opened in an umbrella shape and a dish-shaped gap portion 11Ac, and a corner portion of the flat surface portion 11Aa is cut into a taper shape. Or the chamfered portion 14 is formed by rounding into an arc shape. With such a configuration, the corners on the upper surface of the heat dissipation sheet attached to the IC chip are chamfered, so that it is difficult to drop off during assembly work, and the heat dissipation sheet is securely attached to the IC chip. Can do.
　また、図９Ｂに示すように、皿型状空隙部１５（１５Ａ、１５Ｂ）を複数備える構成の平板状の放熱シート１Ｅであれば、複数のＩＣチップに対して一枚の放熱シート１Ｅを装着して放熱可能となって、比較的大きな面積の基板に対応可能な放熱シートなる。 Further, as shown in FIG. 9B, in the case of a flat plate-like heat radiating sheet 1E having a plurality of dish-shaped gaps 15 (15A, 15B), one heat radiating sheet 1E is attached to a plurality of IC chips. Thus, heat dissipation is possible, and the heat dissipation sheet can be used for a substrate having a relatively large area.
　また、さらに大きな基板形状であれば、図９Ｃに示すように、周辺部領域に複数の吸盤部を配設した構成の放熱シート１Ｆとする。このような構成であれば、複数の吸盤部を備える放熱シートであっても、それぞれの吸盤部をＩＣチップに取り付ける作業を容易に行うことが可能であると共に、発熱部が放熱シートの周辺部領域に位置することで、放熱シートの内部に熱がこもらない構成となって、放熱性能が十分発揮可能となる。 Further, if the substrate shape is larger, as shown in FIG. 9C, the heat dissipating sheet 1F having a configuration in which a plurality of sucker portions are disposed in the peripheral region is used. If it is such a structure, even if it is a heat radiating sheet provided with a plurality of sucker parts, it is possible to easily perform the work of attaching each sucker part to the IC chip, and the heat generating part is a peripheral part of the heat radiating sheet. By being located in the region, it becomes a configuration in which heat is not trapped inside the heat dissipation sheet, and the heat dissipation performance can be sufficiently exhibited.
　また、吸盤部の形状は、皿型状の空隙部以外でもよく、例えば、図９Ｄに示すようなドーム状の空隙部１５Ｃとしてもよい。また、これらの吸盤部に、事前にシリコーングリースを塗布して隙間を埋めておくことで、吸盤部をＩＣチップに密着させて吸着力を増加することができる。 Further, the shape of the suction cup portion may be other than the dish-shaped gap portion, for example, a dome-shaped gap portion 15C as shown in FIG. 9D. Also, by applying silicone grease to these suction cups in advance to fill the gaps, the suction cup can be brought into close contact with the IC chip to increase the suction force.
　また、これらの放熱シートは、メンテナンスを行う場合や新たな部品と取り換える場合を考慮すると着脱自在であることが好ましいので、例えば、図９Ｅに示すように、吸盤部の外周に把持用リブ１６を有する構成の放熱シート１Ｈとする。このような構成であれば、リワーク時に取り外し容易となり、放熱シートの取り換えや基板のメンテナンスが容易となる電子機器の放熱構造となって好ましい。 Further, these heat radiating sheets are preferably removable in consideration of maintenance or replacement with new parts. For example, as shown in FIG. 9E, gripping ribs 16 are provided on the outer periphery of the suction cup portion. It is set as the heat dissipation sheet 1H of the structure which has. Such a configuration is preferable as a heat dissipation structure for an electronic device that can be easily removed at the time of rework, and the heat dissipation sheet can be easily replaced and the substrate can be easily maintained.
　上記したように、本発明によれば、ＩＣチップとカバー部材との間に放熱シートを介装して放熱させる放熱構造において、この放熱シートを、吸盤部を備えて厚み方向に弾性を有する構成としたので、放熱シートをＩＣチップに取り付ける際に、吸盤状に付着させることができ、複数のＩＣチップに複数の放熱シートを取り付ける構成であっても、これらの放熱シートを脱落せずに安全に取り付けることができる。 As described above, according to the present invention, in the heat dissipation structure that dissipates heat by interposing the heat dissipation sheet between the IC chip and the cover member, the heat dissipation sheet has a suction cup portion and is elastic in the thickness direction. Therefore, when attaching the heat dissipation sheet to the IC chip, it can be attached like a suction cup, and even if it is configured to attach multiple heat dissipation sheets to multiple IC chips, it is safe without dropping these heat dissipation sheets Can be attached to.
　また、下部吸盤部と上部吸盤部を備える放熱シートとし、下部吸盤部を介してＩＣチップに吸着状態に取付け、上部吸盤部を介してカバー部材を吸着状態に保持するので、放熱シートとカバー部材とが確実に当接する構成となる。そのために、本発明によれば、ＩＣチップとカバー部材との隙間にバラツキが生じても、ＩＣチップと放熱シート、および、放熱シートとカバー部材とを適当な圧で当接させて、十分な放熱性を発揮して電子機器の信頼性を向上させることが可能な電子機器の放熱構造を得ることができる。 Also, it is a heat dissipating sheet having a lower sucker part and an upper sucker part, attached to the IC chip via the lower sucker part, and holds the cover member in an adsorbed state via the upper sucker part. It becomes the structure which contact | abuts reliably. Therefore, according to the present invention, even if the gap between the IC chip and the cover member is varied, the IC chip and the heat radiating sheet, and the heat radiating sheet and the cover member are brought into contact with each other with an appropriate pressure. It is possible to obtain a heat dissipation structure for an electronic device that can exhibit heat dissipation and improve the reliability of the electronic device.
　そのために本発明に係る電子機器の放熱構造は、複数のＩＣチップのそれぞれに放熱シートを取り付ける際に、放熱シートがずれたり脱落したりせず、確実に装着可能となるので、同一基板に複数のＩＣチップを搭載することが望まれる電子機器に好適に利用可能となる。 For this reason, the heat dissipation structure of the electronic device according to the present invention can be securely mounted when the heat dissipation sheet is attached to each of the plurality of IC chips without the heat dissipation sheet being displaced or dropped. Therefore, it can be suitably used for an electronic device in which it is desired to mount the IC chip.
　　　１　　放熱シート
　　　１Ａ　放熱シート（第一実施形態）
　　　１Ｂ　放熱シート（第二実施形態）
　　　１Ｃ　放熱シート（第三実施形態）
　　　１Ｄ　放熱シート（第四実施形態）
　　　１Ｅ～１Ｈ　放熱シート（その他の実施形態）
　　　２　　基板
　　　３　　ＩＣチップ
　　　４　　カバー部材
　　　５（５Ａ～５Ｄ）　　チップ押さえ部
　　　５１　弾性押さえ部
　　　６　　ベース部材
　　１１　　吸盤部（下部吸盤部）
　　１２　　吸盤部（上部吸盤部）
　　１１ａ、１２ａ　平面部
　　１１ｂ、１２ｂ　傘状側面部
　　１１ｃ、１２ｃ　空隙部
　　１３　　側壁部
　　１３ａ　下部傘状部
　　１３ｂ　上部傘状部
　　１４　　面取り部
　　１６　　把持用リブ 1 Heat dissipation sheet 1A Heat dissipation sheet (first embodiment)
1B heat dissipation sheet (second embodiment)
1C Heat dissipation sheet (third embodiment)
1D heat dissipation sheet (fourth embodiment)
1E to 1H Heat dissipation sheet (other embodiments)
2 Substrate 3 IC chip 4 Cover member 5 (5A to 5D) Chip holding part 51 Elastic holding part 6 Base member 11 Suction cup part (lower suction part)
12 Suction cup (upper suction cup)
11a, 12a Plane part 11b, 12b Umbrella-shaped side part 11c, 12c Gap part 13 Side wall part 13a Lower umbrella-like part 13b Upper umbrella-like part 14 Chamfered part 16 Grabbing rib

Claims (13)

  1. 発熱体となる電子部品であるＩＣチップを搭載した基板と該基板の実装面側をカバーすると共に放熱性を備えたカバー部材とを有し、当該ＩＣチップと前記カバー部材との間に放熱シートを圧接状態に介装して、この放熱シートと前記カバー部材を介して放熱させる電子機器の放熱構造において、
    　前記放熱シートは、前記ＩＣチップと付着する吸盤部を備え、熱伝導性を有するゴムシートからなることを特徴とする電子機器の放熱構造。     A substrate having an IC chip as an electronic component serving as a heating element mounted thereon and a cover member that covers the mounting surface side of the substrate and has heat dissipation properties, and a heat dissipation sheet between the IC chip and the cover member In the heat dissipation structure of the electronic device that heats through the heat dissipation sheet and the cover member,
    The heat dissipating structure of an electronic device, wherein the heat dissipating sheet is made of a rubber sheet having a sucker portion attached to the IC chip and having heat conductivity.
  2. 前記吸盤部が平面部と該平面部の外周部から傘状に開いた傘状側面部とから形成される空隙部を備えた形状とされることを特徴とする請求項１に記載の電子機器の放熱構造。 The electronic apparatus according to claim 1, wherein the suction cup portion has a shape including a gap formed by a flat portion and an umbrella-shaped side portion that is opened in an umbrella shape from an outer peripheral portion of the flat portion. Heat dissipation structure.
  3. 前記平面部の角部をテーパ状にカットするか、もしくは、円弧状に丸めた面取り部としたことを特徴とする請求項２に記載の電子機器の放熱構造。 The heat dissipation structure for an electronic device according to claim 2, wherein a corner portion of the flat portion is cut into a taper shape or a chamfered portion rounded into an arc shape.
  4. 前記放熱シートは、前記吸盤部の外周に把持用リブを有することを特徴とする請求項１から３のいずれかに記載の電子機器の放熱構造。 The heat dissipation structure for an electronic device according to any one of claims 1 to 3, wherein the heat dissipation sheet has a gripping rib on an outer periphery of the suction cup portion.
  5. 前記放熱シートは、下部吸盤部と上部吸盤部を備え、これらの吸盤部のいずれか一方の吸盤部を介して前記ＩＣチップと付着し、いずれか他方の吸盤部を介して前記カバー部材と付着する構成としたことを特徴とする請求項１または２に記載の電子機器の放熱構造。 The heat dissipation sheet includes a lower suction part and an upper suction part, and is attached to the IC chip through one of the suction parts, and is attached to the cover member through the other suction part. The heat dissipation structure for an electronic device according to claim 1, wherein the heat dissipation structure is an electronic device.
  6. 前記下部吸盤部の平面部と前記上部吸盤部の平面部同士を対向して接合して、それぞれの傘状側面部を外側に向けて、外向きに吸盤状の空隙部を形成したことを特徴とする請求項４に記載の電子機器の放熱構造。 The planar part of the lower suction part and the planar part of the upper suction part are joined to face each other, and each umbrella-shaped side part is directed outward, and a suction-like gap is formed outward. The heat dissipation structure for an electronic device according to claim 4.
  7. 前記放熱シートの厚み方向の中央部が括れて、この中央部から両側の外側にむけてそれぞれ拡径する下部傘状部と上部傘状部を形成する側壁部を有し、さらに、厚み方向に貫通した空隙部を有し、この空隙部と前記傘状部とで前記吸盤部を構成することを特徴とする請求項１に記載の電子機器の放熱構造。 A central portion in the thickness direction of the heat-dissipating sheet is constricted, and has a side wall portion that forms a lower umbrella-shaped portion and an upper umbrella-shaped portion that expand from the central portion toward the outer sides of both sides, and further in the thickness direction. 2. The heat dissipation structure for an electronic device according to claim 1, wherein the suction cup portion is configured by the gap portion and the umbrella-like portion.
  8. 前記空隙部が中央部から両側の外側にむけて拡径する鼓状の空隙部であることを特徴とする請求項７に記載の電子機器の放熱構造。 The heat dissipation structure for an electronic device according to claim 7, wherein the gap is a drum-like gap that expands from the center toward the outside on both sides.
  9. 前記放熱シートは、前記吸盤部を複数備える平板状のゴムシートとされることを特徴とする請求項１に記載の電子機器の放熱構造。 The heat dissipation structure for an electronic device according to claim 1, wherein the heat dissipation sheet is a flat rubber sheet including a plurality of the suction cups.
  10. 前記吸盤部は、前記放熱シートの周辺部領域に配設されていることを特徴とする請求項８または９に記載の電子機器の放熱構造。 10. The heat dissipation structure for an electronic device according to claim 8, wherein the suction cup portion is disposed in a peripheral region of the heat dissipation sheet.
  11. 前記空隙部は、皿型状空隙部もしくはドーム状空隙部からなることを特徴とする請求項１から１０のいずれかに記載の電子機器の放熱構造。 The heat dissipation structure for an electronic device according to any one of claims 1 to 10, wherein the gap is a dish-shaped gap or a dome-shaped gap.
  12. 前記カバー部材にチップ押さえ部を設け、該チップ押さえ部を介して、前記放熱シートを前記ＩＣチップに押圧していることを特徴とする請求項１から１１のいずれかに記載の電子機器の放熱構造。 12. The heat dissipation of the electronic device according to claim 1, wherein a chip pressing portion is provided on the cover member, and the heat dissipation sheet is pressed against the IC chip via the chip pressing portion. Construction.
  13. 前記チップ押さえ部は、前記カバー部材に一端が固着されてカバー部材から接離する方向に弾性変形可能とされる弾性片部と、この弾性片部の他端側に連接され前記放熱シートに当接する当接片部を備えた弾性押さえ部であることを特徴とする請求項１２に記載の電子機器の放熱構造。 The tip holding portion is fixed to the cover member at one end and is elastically deformable in a direction to come in contact with and away from the cover member, and is connected to the other end side of the elastic piece portion and contacts the heat radiating sheet. The heat dissipation structure for an electronic device according to claim 12, wherein the heat dissipation structure is an elastic pressing portion having an abutting piece portion in contact therewith.
PCT/JP2011/051567 2010-05-24 2011-01-27 Heat dissipation structure for electronic equipment WO2011148665A1 (en)

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CN114613251A (en) * 2022-03-18 2022-06-10 南京航煜智能科技有限公司 High-voltage power transformer
CN114613251B (en) * 2022-03-18 2024-04-19 江苏寅昊智能装备有限公司 High-voltage power transformer

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