WO2011141503A1 - Dispositif de refroidissement et armoires informatiques - Google Patents

Dispositif de refroidissement et armoires informatiques Download PDF

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Publication number
WO2011141503A1
WO2011141503A1 PCT/EP2011/057598 EP2011057598W WO2011141503A1 WO 2011141503 A1 WO2011141503 A1 WO 2011141503A1 EP 2011057598 W EP2011057598 W EP 2011057598W WO 2011141503 A1 WO2011141503 A1 WO 2011141503A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
cooling
liquid
evaporator
cooling section
Prior art date
Application number
PCT/EP2011/057598
Other languages
English (en)
Inventor
Holger Sedlak
Oliver Kniffler
Original Assignee
Efficient Energy Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Efficient Energy Gmbh filed Critical Efficient Energy Gmbh
Publication of WO2011141503A1 publication Critical patent/WO2011141503A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the present invention relates to the cooling of objects to be cooled, and in particular to cooling electronic components such as are found, for example, in computers which are disposed in computer racks.
  • water would be favorable as a cooling liquid.
  • Water has the further advantage of being easy to control, available at low cost and, moreover, harmless to the environment.
  • One substantial disadvantage of using water as a cooling liquid for cooling objects and, in particular, objects that are sensitive to water, such as electronic components which are shorted by water, is the problems occurring if the cooling system becomes leaky. In that case, water leaks out, typically at high pressure, because a high pressure is maintained in the cooling circuits. The leaking water then runs uncontrolled over the object to be cooled and will, if that object is electronic components and in particular computers, result in short circuits and ultimately in a system breakdown. For that reason, water is avoided in liquid cooling systems of computing centers or, generally speaking, of computers in computer racks.
  • liquids containing CFC are used. While they do not have as good a cooling effect as water, there is no risk of system breakdown if CFC liquids leak out. That is because they evaporate as soon as they leak out, and there is no risk of a short circuit. However, if evaporation occurs too strongly, there may be problems involving a fire alarm, so that a sprinkler system is turned on in the computing center, which again is unfavorable in the case of a false alarm, i.e. if there is no fire, but only a leaky cooling system.
  • the object of the present invention is to provide an efficient and secure cooling concept.
  • the present invention uses a low pressure, which is so low that it is below the atmospheric pressure in which the object to be cooled is disposed.
  • the pressure in the cooling system is less than the atmospheric pressure.
  • the cooling system is run at negative pressure, which is generated by a negative pressure generator such as an evacuating means.
  • the coolant under less pressure than the atmosphere, which coolant is preferably water, is moved past the object to be cooled by a pump in the cooling circuit.
  • a detector which is preferably provided, will detect this pressure rise and initiate an alarm measure, such as a notification by optical or acoustic signals, or activating an emergency cooling circuit, or reducing the power dissipation of the computer system, such as by reducing the clock frequency of the computers or, in the extreme case, shutting down completely a computer to be cooled and/or the computers to be cooled which are disposed in a computer rack.
  • an alarm measure such as a notification by optical or acoustic signals, or activating an emergency cooling circuit, or reducing the power dissipation of the computer system, such as by reducing the clock frequency of the computers or, in the extreme case, shutting down completely a computer to be cooled and/or the computers to be cooled which are disposed in a computer rack.
  • the pressure in the cooling system is kept at 0.8 times the atmospheric pressure or at a pressure less than 0.8 times the atmospheric pressure in which the object to be cooled is disposed. More preferably, the pressure is even lowered to 0.5 times the atmospheric pressure or to even lower pressures, which are, however, so great that there is no evaporation in the cooling circuit just because of the heat of the object to be cooled. In that respect, as a security measure, the negative pressure in the cooling circuit should be at least 10% higher than the "critical pressure" at which the coolant in the cooling circuit would evaporate during operation.
  • Fig. 1 shows a schematic diagram of a device for cooling according to one embodiment of the present invention
  • Fig. 2 shows a preferred embodiment of the present invention with direct coupling to an evaporator of a heat pump
  • Fig. 3 shows a more detailed illustration of an evaporator of a heat pump.
  • Fig. 1 shows a device for cooling an object 10 to be cooled in an atmosphere having an atmospheric pressure.
  • the object 10 to be cooled will be in the normal atmosphere having the normal atmospheric pressure, although the inventive cooling device may also be employed in other atmospheres having other atmospheric pressures.
  • the device for cooling includes a pump 12 for moving a cooling liquid in a cooling section 14, which extends on or in or under the object 10 to be cooled, for example in a serpentine or other manner, as indicated schematically in Fig. 1.
  • the object to be cooled may, for example, be a device with electronic components. That device is, for example, a computer in a computer rack in a computing center, where a great amount of power loss occurs, which has to be dissipated.
  • the inventive system further includes a negative pressure generator 14 which is configured to generate a pressure in the cooling section which is less than the atmospheric pressure.
  • the pressure is less than 0.8 times and/or, even more preferably, less than 0.5 times the atmospheric pressure in which the object 10 to be cooled is disposed.
  • the cooling circuit further includes a pressure detector 16 which is configured to detect, in some known manner, a pressure rise that would occur if the cooling section 14 had a leak.
  • the pressure detector 16 is configured to monitor whether an actual pressure in the cooling section deviates from a target pressure in the cooling section and/or cooling circuit, the target pressure being less than the atmospheric pressure and it further being monitored whether the actual pressure deviates from the target pressure by more than a threshold.
  • the pressure detector may also monitor whether a pressure rise in the cooling circuit occurs faster than a permissible pressure rise.
  • the pressure detector 16 is further configured to have an alarm generator, the alarm generator being configured to take an alarm measure such as outputting an optical or acoustic signal as indicated at 18a.
  • An alternative alarm measure is to influence the object to be cooled via a line 18b, the influencing consisting in controlling the object so that less heat is generated.
  • the influencing of a computer might consist in decreasing the clock frequency to reduce the power loss, or even shutting down the computer system completely.
  • An alternative alarm measure might be to activate a backup cooling system such as a liquid cooling system with its own cooling circuit or a fan cooling system, or a combination of all of these measures.
  • the inventive cooling circuit system includes a heat sink 20 which is configured to extract heat from the hot cooling liquid, i.e. the cooling liquid carrying heat from the object to be cooled, in order to turn the hot cooling liquid back to a cold cooling liquid, it being noted that the expressions “hot” and “cold” are to be understood relative to one another, i.e., that “cold” means colder than hot and “hot” means hotter than cold.
  • the pump 12, the negative pressure generator 14 and the heat sink 20 may be implemented in a single component or in two different components, depending on the particular implementation.
  • the heat sink 20 and the negative pressure generator 14 may collectively be implemented as an evaporator of a heat pump, as schematically indicated in Fig. 2, with Fig. 3 further showing a more detailed illustration of a preferred embodiment of such an evaporator or the connection of the cooling section or cooling circuit to that evaporator.
  • the object 10 to be cooled is preferably configured as a computer in a computer rack.
  • the computer rack in this embodiment includes one or more computers which are mounted in the rack and which are disposed in an atmosphere having an atmospheric pressure.
  • the computer rack includes a pipe section, also referred to as a cooling section 14, which is mounted on the computer rack or on the one or more computers.
  • the pump 12 is disposed for moving a cooling liquid through the pipe section.
  • the computer rack also includes a negative pressure generator for generating a pressure which is less than the atmospheric pressure.
  • water is used as a cooling liquid, the cold liquid having temperatures between e.g. 8°C and 20°C, and the hot liquid having temperatures between e.g. 13°C and 30°C.
  • the evaporator intake 20a in Fig. 2 carries water at the cold temperature
  • the evaporator outlet 20b carries water at a hot temperature.
  • the electronic components to be cooled such as a computer in a computer rack, are shown at reference numeral 10 in Fig. 2.
  • the elements 12, 16 are also not shown in Fig. 2. Shown in Fig. 2, however, is the fact that a negative pressure generator 14 of Fig. 1 and a heat sink 20 of Fig. 1 may collectively be configured as an evaporator 22.
  • the evaporator 22 is part of a heat pump, which further includes a compressor 24 and a liquefier (condenser) 26, as well as a heat dissipator 28, which is coupled to the liquefier 26 via a dissipator intake 30a and a dissipator outlet 30b.
  • a heat pump which further includes a compressor 24 and a liquefier (condenser) 26, as well as a heat dissipator 28, which is coupled to the liquefier 26 via a dissipator intake 30a and a dissipator outlet 30b.
  • a connection 32 shown as a dashed line.
  • the evaporator is supplied with the working liquid and the liquefier discharges the working liquid from the system, so that it is not a closed system in the strict sense, because liquid is constantly supplied on the evaporator side.
  • closed systems are preferred for their easier maintainability.
  • the heat pump in Fig. 2 may either be configured exclusively for cooling the electronic components to be cooled 10, or may at the same time function as an air conditioner for the room in which the computer rack is disposed.
  • the evaporator 22 includes further intakes/outlets for air-cooling the room in which the computer rack is disposed.
  • the computer rack does not necessarily have to be in the same room which is climatized by the heat pump shown in Fig. 2, as the evaporator 22 can easily be used in multiple ways through appropriate piping, i.e. on the one hand for cooling the electronic components 10, and on the other hand to also be configured for an air conditioner.
  • a ventilator not shown in Fig.
  • the evaporator 22 has multiple supply lines, i.e. connections 35a, 35b in addition to connections 20a, 20b.
  • the evaporator is configured as shown in Fig. 3.
  • the evaporator includes an evaporator housing 40, in which a working liquid such as water is contained up to a certain level, as shown at 42.
  • a negative pressure is kept which is so low that the working liquid supplied by the hot inlet 20b evaporates as shown at 44.
  • the hot liquid runs via an intake 46, which may, for example, be centrally disposed in an evaporator body 48, onto the funnel-shaped evaporator body 48, and runs down the inclined surfaces 50.
  • the coolant which has run down and has not evaporated is collected, and is cooled by the evaporation 44 and drained via the cold outlet 20b.
  • the hot outlet and the cold outlet are directly coupled to the evaporator 40, so that in the embodiment shown in Fig. 3 the evaporator performs the functionalities of the heat sink 20 and the negative pressure generator 14.
  • the evaporator and/or the compressor equally functions as a negative pressure generator for the cooling circuit.
  • the vapor generated is constantly discharged, via a vapor discharge line 54, to the compressor, where it is compressed and is liquefied in a liquefier shown at 26 in Fig. 2. Compression takes place such that a "hot" temperature of e.g. 60°C (or in a range of 40°C to 80°C) is maintained in the liquefier.
  • This temperature is suitable, for example, for a dissipator 28 disposed on a roof, which even in warmer countries where external temperatures are already around 40°C still provides sufficient heat dissipation.
  • the cooling section 14 extends in direct contact with the object to be cooled, such as on a board, under a board or within a board on which heat-generating electronic components are disposed.
  • the cooling section in the form of a pipe containing a flow of cooling liquid, also extends along the cooling body or even flows around the cooling body of a component, or runs through special cooling ducts within a computer rack in a computing center.
  • FIG. 1 equally represents a flow chart of a corresponding inventive method, which is also true in particular for the block diagrams of Figs. 2 and 3.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif de refroidissement d'un objet à refroidir, tel qu'un ordinateur dans une armoire informatique d'un centre de calcul, le dispositif comprenant une pompe (12) destinée à faire circuler un liquide de refroidissement dans une section de refroidissement et un générateur (14) de dépression configuré pour générer, dans la section de refroidissement, une pression inférieure à la pression atmosphérique. Le dispositif comporte en outre un évaporateur d'une pompe à chaleur, la pression dans la section de refroidissement étant au moins partiellement influencée par une dépression dans l'évaporateur, ledit évaporateur pouvant être associé à un compresseur prévu pour comprimer et transporter du liquide évaporé jusqu'à un liquéfacteur. De plus, un détecteur (16) de pression peut en outre être disposé dans un circuit de refroidissement afin de prendre des mesures d'alarme en cas de hausse de pression. En raison de la dépression, une fuite ne se traduit pas par un épanchement de liquide de travail, aussi est-il possible d'utiliser de l'eau en tant que liquide de travail.
PCT/EP2011/057598 2010-05-12 2011-05-11 Dispositif de refroidissement et armoires informatiques WO2011141503A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010028950.7A DE102010028950B4 (de) 2010-05-12 2010-05-12 Vorrichtung zum Kühlen und Rechner-Racks
DE102010028950.7 2010-05-12

Publications (1)

Publication Number Publication Date
WO2011141503A1 true WO2011141503A1 (fr) 2011-11-17

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Application Number Title Priority Date Filing Date
PCT/EP2011/057598 WO2011141503A1 (fr) 2010-05-12 2011-05-11 Dispositif de refroidissement et armoires informatiques

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DE (1) DE102010028950B4 (fr)
WO (1) WO2011141503A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013171271A1 (fr) * 2012-05-16 2013-11-21 Efficient Energy Gmbh Pompe à chaleur et procédé de pompage de chaleur dans un mode de refroidissement naturel
WO2017115359A1 (fr) * 2015-12-29 2017-07-06 Zuta-Core Ltd. Système de gestion thermique faisant appel au vide
CN113382616A (zh) * 2021-07-20 2021-09-10 程嘉俊 液冷散热器及其负压结构、储液箱、调阈方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104456795B (zh) * 2014-12-03 2017-04-19 郭祥 一种数据中心集中高效冷却节能系统

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US20040231351A1 (en) * 2003-05-19 2004-11-25 Wyatt William Gerald Method and apparatus for extracting non-condensable gases in a cooling system
US20070119199A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and method for electronic chassis and rack mounted electronics with an integrated subambient cooling system
US20070227710A1 (en) * 2006-04-03 2007-10-04 Belady Christian L Cooling system for electrical devices
US7436666B1 (en) * 2006-08-08 2008-10-14 Sun Microsystems, Inc. Thermal caching for liquid cooled computer systems
US20090133866A1 (en) * 2007-11-26 2009-05-28 International Businiess Machines Corporation Hybrid air and liquid coolant conditioning unit for facilitaating cooling of one or more electronics racks of a data center

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DE102006033030A1 (de) * 2006-07-14 2008-01-24 Janz Informationssysteme Ag Kühlvorrichtung
GB2465140B (en) * 2008-10-30 2011-04-13 Aqua Cooling Solutions Ltd An electronic system

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
US20040231351A1 (en) * 2003-05-19 2004-11-25 Wyatt William Gerald Method and apparatus for extracting non-condensable gases in a cooling system
US20070119199A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and method for electronic chassis and rack mounted electronics with an integrated subambient cooling system
US20070227710A1 (en) * 2006-04-03 2007-10-04 Belady Christian L Cooling system for electrical devices
US7436666B1 (en) * 2006-08-08 2008-10-14 Sun Microsystems, Inc. Thermal caching for liquid cooled computer systems
US20090133866A1 (en) * 2007-11-26 2009-05-28 International Businiess Machines Corporation Hybrid air and liquid coolant conditioning unit for facilitaating cooling of one or more electronics racks of a data center

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013171271A1 (fr) * 2012-05-16 2013-11-21 Efficient Energy Gmbh Pompe à chaleur et procédé de pompage de chaleur dans un mode de refroidissement naturel
CN104428610A (zh) * 2012-05-16 2015-03-18 高效能源有限责任公司 热泵以及用于以自由冷却模式泵送热量的方法
JP2015520351A (ja) * 2012-05-16 2015-07-16 エフィシエント・エネルギ・ゲーエムベーハー ヒートポンプ、および自由冷却モードでの熱ポンプ方法
CN104428610B (zh) * 2012-05-16 2016-11-23 高效能源有限责任公司 热泵以及用于以自由冷却模式泵送热量的方法
US10041708B2 (en) 2012-05-16 2018-08-07 Efficient Energy Gmbh Heat pump and method for pumping heat in a free cooling mode
US10222103B2 (en) 2012-05-16 2019-03-05 Efficient Energy Gmbh Heat pump and method for pumping heat in a free cooling mode
WO2017115359A1 (fr) * 2015-12-29 2017-07-06 Zuta-Core Ltd. Système de gestion thermique faisant appel au vide
IL260284A (en) * 2015-12-29 2018-07-31 Zuta Core Ltd Vacuum-based thermal management system
CN108781523A (zh) * 2015-12-29 2018-11-09 祖达科尔有限公司 基于真空的热管理系统
CN113382616A (zh) * 2021-07-20 2021-09-10 程嘉俊 液冷散热器及其负压结构、储液箱、调阈方法

Also Published As

Publication number Publication date
DE102010028950A1 (de) 2011-11-17
DE102010028950B4 (de) 2020-04-09

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