WO2011135780A1 - Dispositif électroluminescent et procédé pour sa fabrication - Google Patents

Dispositif électroluminescent et procédé pour sa fabrication Download PDF

Info

Publication number
WO2011135780A1
WO2011135780A1 PCT/JP2011/002066 JP2011002066W WO2011135780A1 WO 2011135780 A1 WO2011135780 A1 WO 2011135780A1 JP 2011002066 W JP2011002066 W JP 2011002066W WO 2011135780 A1 WO2011135780 A1 WO 2011135780A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
silicone rubber
emitting device
group
core material
Prior art date
Application number
PCT/JP2011/002066
Other languages
English (en)
Japanese (ja)
Inventor
秀一 畔地
康久 大澤
久治 山口
正弘 茂木
Original Assignee
信越化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越化学工業株式会社 filed Critical 信越化学工業株式会社
Priority to JP2012512637A priority Critical patent/JPWO2011135780A1/ja
Priority to CN2011800210235A priority patent/CN102859728A/zh
Publication of WO2011135780A1 publication Critical patent/WO2011135780A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Definitions

  • the present invention relates to a light emitting device used for outdoor lighting and decoration because of excellent weather resistance, and a manufacturing method capable of long molding.
  • Patent Document 4 proposes a proposal to apply a flexible substrate on which a light emitting element is arranged with a silicone tube to be applied to a wide range of environments, but there is no detailed explanation of what kind of silicone is used. (Patent Document 4 below).
  • the structure covered with the tube is simple, but a space (gap) is generated between the tube and the light emitter, so that moisture such as water vapor or rainwater may be mixed in, causing internal electrical damage. There was a possibility of waking up. Further, since the optical space repeats birefringence and reflection, it is not desirable in terms of transparency and light transmission, and there is also a problem that the interior is clouded with moisture. If the product is cut and shortened, it may be difficult to cut the tube well, and if it is longer than 5 m, it is difficult to enclose the light emitter in the tube. Inefficient and inferior in productivity.
  • Patent Document 4 also describes that a flexible substrate on which a light emitting element is arranged is encapsulated in urethane, but urethane is not an optimal material because it easily yellows and changes transmittance, and has low temperature characteristics. Since it is not good, it may be deteriorated due to loss of flexibility when used in a severe low temperature environment.
  • the present invention relates to environmental factors, that is, physical factors such as external stress, impact, vibration, etc., chemical factors such as moisture, rainwater, cleaning agents, harmful gases, ultraviolet rays, biological factors such as mold generation and insect adhesion. There is no deterioration due to the cause, moisture such as water vapor or rainwater is not mixed, causing internal electrical damage, excellent transparency and light transmission, no change in transmittance due to yellowing, and excellent low temperature characteristics. It is an object of the present invention to obtain a light emitting device that does not lose flexibility even when used in a severe low temperature environment.
  • core material made of a wiring body having a light emitter in silicone rubber. I found that it can be solved.
  • the present invention relates to a light-emitting device characterized in that a core material made of a wiring body having a light-emitting body is tightly sealed in silicone rubber.
  • the light emitting device of the present invention is formed by extruding from the die while surrounding the core material with the curable silicone rubber composition, thereby bringing the core material and the curable silicone rubber composition into close contact, and then curing. Can be manufactured.
  • the light emitting device of the present invention is protected from environmental factors because the core material is tightly sealed in the silicone rubber, and it is transparent without causing moisture such as water vapor or rain water to enter the interior and causing electrical damage. It has excellent properties, light transmittance, weather resistance, little change in light transmittance due to yellowing, excellent low temperature characteristics, and does not lose flexibility even when used in severe low temperature environments. Moreover, since silicone rubber is flexible, it is excellent in flexibility. Therefore, there is no restriction on the installation environment, and it can be suitably used for outdoor lighting applications and ornamental applications.
  • the method for manufacturing a light-emitting device of the present invention is extremely useful in that the light-emitting device can be continuously formed into a long shape, and there is little internal damage during manufacture.
  • an LED can be used as the light emitter.
  • the LED may use the LED element as it is, or may be used in the form of an LED module.
  • a flexible printed wiring board or a cable such as a flat cable can be used as the wiring body.
  • a module that controls light emission of a light emitter such as an LED may be mounted on the core material.
  • the core material of the present invention may be generally used, and may be one described in the above prior art document.
  • the present invention is characterized in that the core material is tightly sealed in silicone rubber. Thereby, the core material can be protected from environmental factors, and moisture can be prevented from entering from the outside. Silicone rubber is light-transmitting, has little temperature dependence, and can be suitably used in harsh environments, and can be used for a long time because it has weather resistance.
  • the silicone rubber can be obtained by curing a curable silicone rubber composition.
  • the curable silicone rubber composition those containing the following (A) and (B) can be suitably used, and the following (C ) Is preferable for increasing the strength.
  • R 1 a SiO (4-a) / 2 (1) (Wherein, R 1 is identical or different unsubstituted or substituted monovalent hydrocarbon group with one another, a is a number that satisfies 1.5 ⁇ a ⁇ 2.8, in total R 1, 0.001 ⁇ 20 mol% is an alkenyl group and / or a cycloalkenyl group.)
  • Organopolysiloxane (B) Curing agent (C) Reinforcing filler having an average degree of polymerization of 100 or more
  • the component (A) preferably has an average degree of polymerization of 100 or more from the viewpoint of moldability. More preferably, it is 3000 to 100,000.
  • R 1 preferably has 1 to 12 carbon atoms, more preferably 1 to 8 carbon atoms. Specific examples of R 1 include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, cyclohexyl group, octyl group, nonyl group, Alkyl group such as decyl group, vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, isobutenyl group, hexenyl group, alkenyl group such as octenyl group, cycloalkenyl group such as cyclohexenyl group, phenyl group,
  • Each R 1 group may be different or the same, but preferably has at least two alkenyl groups and / or cycloalkenyl groups in the molecule.
  • the content of the alkenyl group and / or cycloalkenyl group is preferably 0.001 mol% or more and 20 mol% or less in the total R 1 . When the content is less than 0.001 mol%, the curability is inferior, and when it exceeds 20 mol%, the cured rubber becomes brittle and the mechanical strength is lowered.
  • a preferable lower limit is 0.01 mol%, and a more preferable upper limit is 10 mol%.
  • organopolysiloxane examples include those in which a group other than the alkenyl group and / or cycloalkenyl group in R 1 is a methyl group, or a part of the methyl group of such an organopolysiloxane is a phenyl group, trifluoropropyl. Those substituted with a group or the like are preferred.
  • the molecular chain terminal of the component (A) is preferably blocked with a triorganosilyl group or a hydroxyl group.
  • the triorganosilyl group include a trimethylsilyl group, a dimethylvinylsilyl group, and a trivinylsilyl group. Is done.
  • A is preferably a number satisfying 1.5 ⁇ a ⁇ 2.8 from the viewpoint of rubber physical properties after curing. By setting it as this range, the silicone rubber suitable for the use of the present invention in which hardness, elongation, and mechanical strength are balanced can be obtained.
  • a more preferable value of a is in the range of 1.8 to 2.5, and more preferably 1.98 to 2.02.
  • the organopolysiloxane of the above formula (1) may have a linear molecular structure or a branched structure containing R 1 SiO 3/2 units or SiO 4/2 units.
  • Linear diorgano in which the chain portion is basically composed of repeating R 1 2 SiO 2/2 diorganosiloxane units and both ends of the molecular chain are blocked with R 1 3 SiO 1/2 triorganosiloxy units
  • Polysiloxanes can generally be used.
  • the alkenyl group and / or cycloalkenyl group in the molecule may be bonded to either the molecular chain terminal or the silicon atom in the middle of the molecular chain, or may be bonded to both, but it is curable. From the viewpoint of the physical properties of the cured product, it is preferable that it has an alkenyl group and / or a cycloalkenyl group bonded to at least silicon atoms at both ends of the molecular chain.
  • the curing agent for component (B) can be appropriately selected from known curing agents that are usually used for curing silicone rubber.
  • these curing agents include di-t-butyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, dicumyl peroxide and the like used in radical reactions.
  • the organic peroxide or organopolysiloxane of component (A) has two or more alkenyl groups and / or cycloalkenyl groups in one molecule, one molecule of hydrogen atom bonded to a silicon atom is used as an addition reaction curing agent.
  • Two or more organohydrogenpolysiloxanes and platinum-based catalysts can be used. In the present invention, it is preferable to cure by radical reaction and / or addition reaction.
  • organohydrogenpolysiloxane examples include tris (dimethylhydrogensiloxy) methylsilane, tris (dimethylhydrogensiloxy) phenylsilane, 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetra.
  • the molecular structure of the organohydrogenpolysiloxane may be any of linear, cyclic, branched, and three-dimensional network structures, but the number of silicon atoms in one molecule, that is, the degree of polymerization is 2 to 1,000. Preferably, those having about 3 to 500, particularly preferably about 3 to 300 can be used.
  • the compounding amount of the organohydrogenpolysiloxane is preferably 0.1 to 50 parts by mass, particularly 0.3 to 30 parts by mass with respect to 100 parts by mass of the organopolysiloxane as the component (A).
  • the addition amount of these curing agents may be the same as in the case of ordinary silicone rubber, and may be an effective curing amount.
  • the organic peroxide is added to 100 parts by mass of component (A). It is preferable to use 0.1 to 10 parts by mass with respect to the addition reaction.
  • the SiH group of the organohydrogenpolysiloxane is 0 with respect to 1 mol of the alkenyl group and / or cycloalkenyl group of the component (A).
  • the catalyst such as a rhodium-based catalyst or a rhodium-based catalyst is 1 to 2,000 ppm of the curable silicone rubber composition.
  • the reinforcing filler of component (C) may be any substance as long as it is used as a silicone rubber reinforcing material.
  • the reinforcing silica fine powder is preferably used, and those used in the conventional silicone rubber composition can be used, and in particular, the reinforcing silica fine powder having a specific surface area of 50 m 2 / g or more is used. In particular, 50 to 800 m 2 / g of precipitated silica, fumed silica, calcined silica and the like are preferably used. Fumed silica is suitable for improving rubber strength.
  • the reinforcing silica fine powder may be a surface-treated silica fine powder.
  • these silica fine powders may be directly embedded in a powder state in advance. It can be processed by a generally known technique as a normal processing method.
  • the untreated silica fine powder and the processing agent are put in a mechanical kneading apparatus or fluidized bed sealed at normal pressure, and an inert gas is present if necessary. Under the mixing treatment at room temperature or heat treatment. In some cases, a catalyst may be used to facilitate the treatment. After kneading, the treated silica fine powder can be produced by drying.
  • the blending amount of the treatment agent may be more than the amount calculated from the coating area of the treatment agent.
  • Treatment agents are silazanes such as hexamethyldisilazane, methyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane, butyltrimethoxysilane, dimethyldimethoxysilane, diethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane Silane coupling agents such as trimethylmethoxysilane, triethylmethoxysilane, vinyltris (methoxyethoxy) silane, trimethylchlorosilane, dimethyldichlorosilane, divinyldimethoxysilane and chloropropyltrimethoxysilane, polymethylsiloxane, organohydrogenpolysiloxane, etc. Organosilicon compounds are mentioned, and these are surface-treated and used
  • the addition amount can be added within the range that can maintain light transmittance.
  • the amount is preferably 1 to 50 parts by mass with respect to 100 parts by mass of component (A). When it exceeds 50 parts by mass, the transparency is lost and the effects of the present invention cannot be obtained.
  • the amount is preferably 1 to 30 parts by mass.
  • color adjusting agents such as various inorganic substances and organic substances can be added as necessary to adjust transparency and optical characteristics.
  • the color tone adjusting agent is added for the purpose of diffusing light and is not particularly limited as long as it achieves the purpose, but preferably a metal, a metal oxide, a metal nitride, a metal carbide, etc. Examples thereof include light diffusing fillers, organic or inorganic pigments, and dyes.
  • the addition amount of the color tone adjusting agent is not particularly limited as long as the transparency is not impaired. An appropriate amount can be used as long as the light transmittance does not become 50% or less. Preferably, 0.01 to 50% by mass of pigment, dye or light diffusion filler is added to the curable silicone rubber composition.
  • the light transmittance of the 2 mm optical path length of the silicone rubber is preferably 50 to 99.9%.
  • the manufacturing method of a curable silicone rubber composition is not specifically limited, It can obtain by knead
  • the heating temperature and heating time are not particularly limited, but for example, heat treatment is performed at 100 to 200 ° C. for 30 minutes to 5 hours.
  • the curing conditions of the curable silicone rubber composition are not particularly limited, but are generally cured by heat curing at 80 to 250 ° C., particularly 120 to 200 ° C. for 5 seconds to 1 hour, particularly 30 seconds to 30 minutes. A molded product can be obtained. Further, post-curing may be performed at 100 to 200 ° C. for about 10 minutes to 10 hours.
  • the curable silicone rubber composition that can be used is not limited thereto.
  • a curing agent comprising an organopolysiloxane containing two or more silanol groups and
  • an organosilicon compound having two or more hydrolyzable groups such as alkoxy groups, acetoxy groups, ketoxime groups, and propenoxy groups.
  • (C) a reinforcing filler, a color tone adjusting agent and other additives are blended as in the case of the curable silicone rubber composition containing the components (A) and (B). can do.
  • the core material a commercially available one, for example, a core material in which LED elements are arranged in series at a fixed interval on a flexible printed wiring board, or a core material connected with a cable such as a flat cable can be used. .
  • FIG. 1 shows an example of a core material in the present invention in which LED elements 2 are arranged in series at a constant interval on a flexible printed wiring board 1.
  • FIG. 2 shows an example of the light emitting device of the present invention in which the core material is tightly sealed in the silicone rubber 3.
  • the manufacturing method of the light emitting device of the present invention is such that the core material comprising the wiring body provided with the light emitter is surrounded by the curable silicone rubber composition and extruded from the die to bring the core material and the curable silicone rubber composition into close contact with each other. And then cured.
  • FIG. 3 shows a schematic explanatory diagram of an example of the production method of the present invention.
  • the out die in FIG. 3 corresponds to the die referred to in the manufacturing method of the present invention.
  • the indie 7 is disposed so as to be surrounded by the outdie 8.
  • the core material 4 is drawn out from the core material wound body 10 and introduced into the indie 7.
  • the state in the in-die 7 is shown in FIG.
  • the curable silicone rubber composition is introduced into the out die 8 while surrounding the outer periphery of the in die 7 by the extrusion screw 5.
  • the core material 4 and the curable silicone rubber composition 6 are in close contact and integrated into an uncured molded product 9.
  • the molding state of the out die 7 is shown in FIG.
  • FIG. 5 shows a case where the cross-sectional shape of the uncured molded product 9 is a semicircular shape, but the shape can be any shape such as an ellipse or a rectangle according to the outlet shape of the out die 8.
  • the extrusion molding apparatus needs to be designed so that bubbles and the like are not mixed inside the uncured molded product 9.
  • the speed at which the uncured molded product 9 is extruded may be in the range of 0.1 to 5 m / min, and preferably about 0.5 to 3 m / min. In addition, when it is less than 0.1 m / min, productivity will worsen and cost will become high, and when it exceeds 5 m / min, hardening will become inadequate.
  • the curing device may be any device that is continuously connected to the extruder, and may be a vertical type or a horizontal type.
  • the curing temperature is preferably in the range of 80 ° C. to 250 ° C., but a more preferable curing temperature is 120 to 200 ° C.
  • the curing time is 1 to 60 minutes, preferably 3 to 30 minutes. If the temperature is less than 100 ° C, curing is insufficient, and if it exceeds 250 ° C, the cured product is deteriorated, which is not preferable. If the curing time is less than 1 minute, curing is insufficient, and if it exceeds 60 minutes, it is uneconomical and causes internal deterioration.
  • a core material having a length of several meters to several hundred meters or more can be tightly sealed in silicone rubber.
  • the manufactured light emitting device can be cut into a desired dimension such as 5 m or less. Since the wiring of the wiring body is exposed by cutting, a conductive wire may be joined to the exposed wiring and connected to an external power source.
  • Reinforcing silica fine powder (C-1) Reinforcing silica fine powder having a BET specific surface area of 300 m 2 / g (trade name: Aerosil 300, manufactured by Nippon Aerosil Co., Ltd.)
  • Example 1 100 parts by weight of (a-1), 15 parts by weight of (c-1), 4.5 parts by weight of (f-1) as a surface treating agent for (c-1) and 1 part by weight of ion-exchanged water, The mixture was mixed and kneaded while heating at 170 ° C. for 2 hours to homogenize to prepare an unvulcanized silicone compound A.
  • a silicone material A and a core material formed by connecting a plurality of LED elements to a flexible wiring board are simultaneously inserted through separate insertion ports and extruded at a speed of 1 m / min. Then, it was cured at 130 ° C. for 10 minutes to obtain a molded product having an elliptical cross section having a length of 50 m, a thickness of 2 mm, and a width of 15 mm. The following evaluation was performed about what was obtained.
  • Example 2 Molded product in the same manner as in Example 1 except that 100 parts by mass of the silicone composition A of Example 1 was further mixed with 3 parts by mass of titanium oxide (color tone adjusting agent) having an average particle diameter of 3 ⁇ m to obtain a silicone composition B. Got. The following evaluation was performed about what was obtained.
  • Example 3 (A-2) 100 parts by mass, (c-1) 10 parts by mass, (c-1) (f-1) 4.5 parts by mass and ion-exchanged water 1 part by mass with a kneader. The mixture was blended and kneaded while heating at 170 ° C. for 2 hours to homogenize to prepare an unvulcanized silicone compound B.
  • a molded product was obtained in the same manner as in Example 2 except that unvulcanized silicone compound B was used instead of unvulcanized silicone compound A. The following evaluation was performed about what was obtained.
  • Comparative Example 2 A transparent urethane resin used in Comparative Example 1 is injected into a transparent cured tube-shaped urethane resin tube after a core material having a length of 50 cm formed by connecting a plurality of LED elements to a flexible wiring board is inserted. Then, the core is covered and the opening is hermetically sealed with heat, then cured at 80 ° C. for 1 hour, and encapsulated in an elliptical urethane resin having a length of 50 cm, a thickness of 2 mm, and a width of 15 mm. A molded product was obtained. The following evaluation was performed about what was obtained.
  • a spectrophotometer U3310 type manufactured by Hitachi, Ltd. was used as a measuring device, and parallel light having a wavelength of 600 nm was used as light, and measurement was performed at a temperature of 25 ° C.
  • seat of the length: width: thickness 170mm: 150mm: 2mm which consists of a hardened
  • cured material of the transparent urethane resin used in the comparative example 1 was created, and the light transmittance was measured similarly to the above. The measured values are shown in the column of Comparative Example 1 in Table 1.
  • a He-Ne laser beam (Neoarc's wavelength 632.8 nm, oscillation output 0.6 mW, beam diameter 0.8 mm ⁇ ) is vertically incident on the surface of the sheet 30 cm away, and the laser beam spot spreads red on the back of the sheet The diameter was measured. When the spot diameter was 0.8 mm to 1.0 mm, x was marked, and when it exceeded 1.0 mm, it was marked.
  • the light diffusivity was measured similarly to the above using the sheet
  • cured material of the urethane resin of the length: width: thickness 170mm: 150mm: 2mm used by the measurement of light transmittance.
  • the measurement results are shown in the column of Comparative Example 1 in Table 1.
  • the molded product was immersed in warm water at 80 ° C, and the internal state and performance change after 1000 hours were observed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention porte sur un dispositif électroluminescent, dans lequel un cœur comprenant un corps de câblage comportant un élément électroluminescent est étroitement renfermé à l'intérieur de caoutchouc de silicone. Le cœur est extrudé à partir d'une filière tandis que la périphérie de celui-ci est entourée par une composition de caoutchouc de silicone durcissable, et le cœur peut ensuite être étroitement renfermé par durcissement de la composition de caoutchouc de silicone. Il est par conséquent possible d'accroître la résistance aux intempéries du dispositif électroluminescent.
PCT/JP2011/002066 2010-04-27 2011-04-07 Dispositif électroluminescent et procédé pour sa fabrication WO2011135780A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012512637A JPWO2011135780A1 (ja) 2010-04-27 2011-04-07 発光装置及びその製造方法
CN2011800210235A CN102859728A (zh) 2010-04-27 2011-04-07 发光装置及发光装置的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010101828 2010-04-27
JP2010-101828 2010-04-27

Publications (1)

Publication Number Publication Date
WO2011135780A1 true WO2011135780A1 (fr) 2011-11-03

Family

ID=44861109

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/002066 WO2011135780A1 (fr) 2010-04-27 2011-04-07 Dispositif électroluminescent et procédé pour sa fabrication

Country Status (4)

Country Link
JP (1) JPWO2011135780A1 (fr)
CN (1) CN102859728A (fr)
TW (1) TW201205888A (fr)
WO (1) WO2011135780A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020519022A (ja) * 2017-05-02 2020-06-25 シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． Ｌｅｄストリップの固定

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6433398B2 (ja) * 2015-09-25 2018-12-05 ウシオ電機株式会社 光学測定器

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289004A (ja) * 2001-03-28 2002-10-04 Toyoda Gosei Co Ltd Ｌｅｄ蛍光灯
JP2005183721A (ja) * 2003-12-19 2005-07-07 Touken Techno:Kk Ｌｅｄ照明装置
JP2006108077A (ja) * 2004-09-10 2006-04-20 Semiconductor Energy Lab Co Ltd 表示装置およびその作製方法並びにその製造装置
JP2007048861A (ja) * 2005-08-09 2007-02-22 Canon Inc 太陽電池モジュールの製造方法
JP2008074982A (ja) * 2006-09-22 2008-04-03 Shin Etsu Chem Co Ltd 加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子
WO2008082001A1 (fr) * 2006-12-28 2008-07-10 Dow Corning Toray Co., Ltd. Composition de caoutchouc de silicone thermodurcissable
JP2008222849A (ja) * 2007-03-13 2008-09-25 Shin Etsu Chem Co Ltd 耐疲労性に優れた硬化物を与える硬化性シリコーンゴム組成物及びその硬化物
JP2010001336A (ja) * 2008-06-18 2010-01-07 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2010083978A (ja) * 2008-09-30 2010-04-15 Shin-Etsu Chemical Co Ltd 光導波板用シリコーンゴム組成物及び光導波板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2535526B1 (fr) * 1982-10-29 1986-03-28 Radiotechnique Compelec Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques
US8040469B2 (en) * 2004-09-10 2011-10-18 Semiconductor Energy Laboratory Co., Ltd. Display device, method for manufacturing the same and apparatus for manufacturing the same
JP2009158646A (ja) * 2007-12-26 2009-07-16 Erebamu:Kk 発光装置及び面発光装置
JP5555989B2 (ja) * 2008-08-08 2014-07-23 横浜ゴム株式会社 シリコーン樹脂組成物、これを用いるシリコーン樹脂および光半導体素子封止体

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289004A (ja) * 2001-03-28 2002-10-04 Toyoda Gosei Co Ltd Ｌｅｄ蛍光灯
JP2005183721A (ja) * 2003-12-19 2005-07-07 Touken Techno:Kk Ｌｅｄ照明装置
JP2006108077A (ja) * 2004-09-10 2006-04-20 Semiconductor Energy Lab Co Ltd 表示装置およびその作製方法並びにその製造装置
JP2007048861A (ja) * 2005-08-09 2007-02-22 Canon Inc 太陽電池モジュールの製造方法
JP2008074982A (ja) * 2006-09-22 2008-04-03 Shin Etsu Chem Co Ltd 加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子
WO2008082001A1 (fr) * 2006-12-28 2008-07-10 Dow Corning Toray Co., Ltd. Composition de caoutchouc de silicone thermodurcissable
JP2008222849A (ja) * 2007-03-13 2008-09-25 Shin Etsu Chem Co Ltd 耐疲労性に優れた硬化物を与える硬化性シリコーンゴム組成物及びその硬化物
JP2010001336A (ja) * 2008-06-18 2010-01-07 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2010083978A (ja) * 2008-09-30 2010-04-15 Shin-Etsu Chemical Co Ltd 光導波板用シリコーンゴム組成物及び光導波板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020519022A (ja) * 2017-05-02 2020-06-25 シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． Ｌｅｄストリップの固定
US11047537B2 (en) 2017-05-02 2021-06-29 Signify Holding B.V. Fixing of LED strips

Also Published As

Publication number Publication date
TW201205888A (en) 2012-02-01
JPWO2011135780A1 (ja) 2013-07-18
CN102859728A (zh) 2013-01-02

Similar Documents

Publication Publication Date Title
US11908595B2 (en) Use of a silicone rubber composition for the manufacture of an insulator for high voltage direct current applications
JP5746227B2 (ja) 太陽電池モジュールのための封止材としての使用のための硬化性ポリオルガノシロキサン組成物
JP5387764B2 (ja) シリコーンゴムにより密封された照明部材
KR101495691B1 (ko) 광에 의해 가교 가능한 고투과성 실리콘 혼합물
JP5524424B1 (ja) 光半導体素子封止用シリコーン組成物および光半導体装置
EP2938678B1 (fr) Composition pour former un article ayant une excellente réflectance et d'excellentes propriétés ignifugeantes et article formé à partir de celle-ci
KR20100057835A (ko) 성형품의 연속 제조 방법 및 그 방법에 있어서 실리콘 고무의 용도
JP2011132376A (ja) シリコーンエラストマー組成物
EP3533838B1 (fr) Composition de caoutchouc de silicone broyable thermorésistante
JP4704987B2 (ja) 押出成型用シリコ−ンゴム組成物
JP6666247B2 (ja) 選択的光遮蔽用光物理材料及びその選択的光遮蔽用光物理材料を含む光学素子
WO2023087233A1 (fr) Composition de caoutchouc silicone
WO2011135780A1 (fr) Dispositif électroluminescent et procédé pour sa fabrication
JP5322689B2 (ja) 高電圧電気絶縁体用シリコーンゴム組成物
JP5589936B2 (ja) 親水性シリコーンゴム部材
JP5110308B2 (ja) 液状シリコーンゴム組成物の製造方法及び液状シリコーンゴム組成物
JP2007084824A (ja) 貯蔵安定性の付加架橋可能なシリコーン材料、その製造法、シリコーンエラストマーの製造法およびシリコーンエラストマー
JP2010221504A (ja) タイヤ加硫用ブラダー
JP2008150505A (ja) シリコーンゴム組成物及び定着部材
JP4386981B2 (ja) 高電圧電気絶縁体用シリコーンゴム組成物及びポリマー碍子
US20020077440A1 (en) Extrudable silicone rubber composition and method of manufacturing articles extruded from silicone rubber
JP6492996B2 (ja) 黄変シリコーンゴム硬化物の黄変を低減する方法
EP1052655A1 (fr) Caoutchouc de silicone pour isolateurs à haute tension
ES2360156T3 (es) Cámara de aire para la producción de neumáticos.

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201180021023.5

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11774571

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2012512637

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11774571

Country of ref document: EP

Kind code of ref document: A1