WO2011132616A1 - Highly abrasion-resistant imprint material - Google Patents
Highly abrasion-resistant imprint material Download PDFInfo
- Publication number
- WO2011132616A1 WO2011132616A1 PCT/JP2011/059420 JP2011059420W WO2011132616A1 WO 2011132616 A1 WO2011132616 A1 WO 2011132616A1 JP 2011059420 W JP2011059420 W JP 2011059420W WO 2011132616 A1 WO2011132616 A1 WO 2011132616A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- imprint material
- film
- pni
- imprint
- Prior art date
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- 239000000463 material Substances 0.000 title claims abstract description 89
- 238000005299 abrasion Methods 0.000 title abstract description 3
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 37
- 150000001875 compounds Chemical class 0.000 claims abstract description 34
- -1 acryloyloxy, acryloyl Chemical group 0.000 claims abstract description 32
- 239000003999 initiator Substances 0.000 claims abstract description 9
- 230000003287 optical effect Effects 0.000 claims description 36
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- 239000002904 solvent Substances 0.000 claims description 11
- 239000004094 surface-active agent Substances 0.000 claims description 8
- 238000003384 imaging method Methods 0.000 claims description 4
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 description 37
- 239000010408 film Substances 0.000 description 37
- 239000010959 steel Substances 0.000 description 37
- 210000002268 wool Anatomy 0.000 description 37
- 230000000052 comparative effect Effects 0.000 description 36
- 238000000034 method Methods 0.000 description 30
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 28
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 13
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 12
- 150000002148 esters Chemical class 0.000 description 11
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 229940126062 Compound A Drugs 0.000 description 8
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 6
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 6
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000001127 nanoimprint lithography Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000003504 photosensitizing agent Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 3
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical class C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 3
- 229940051250 hexylene glycol Drugs 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- UWNADWZGEHDQAB-UHFFFAOYSA-N 2,5-dimethylhexane Chemical compound CC(C)CCC(C)C UWNADWZGEHDQAB-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- PFNHSEQQEPMLNI-UHFFFAOYSA-N 2-methyl-1-pentanol Chemical compound CCCC(C)CO PFNHSEQQEPMLNI-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- 229920001214 Polysorbate 60 Polymers 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- 239000004147 Sorbitan trioleate Substances 0.000 description 2
- PRXRUNOAOLTIEF-ADSICKODSA-N Sorbitan trioleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCC\C=C/CCCCCCCC PRXRUNOAOLTIEF-ADSICKODSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 2
- VPUGDVKSAQVFFS-UHFFFAOYSA-N coronene Chemical compound C1=C(C2=C34)C=CC3=CC=C(C=C3)C4=C4C3=CC=C(C=C3)C4=C2C3=C1 VPUGDVKSAQVFFS-UHFFFAOYSA-N 0.000 description 2
- 150000004775 coumarins Chemical class 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000223 polyglycerol Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- GPTFURBXHJWNHR-UHFFFAOYSA-N protopine Chemical compound C1=C2C(=O)CC3=CC=C4OCOC4=C3CN(C)CCC2=CC2=C1OCO2 GPTFURBXHJWNHR-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 235000019337 sorbitan trioleate Nutrition 0.000 description 2
- 229960000391 sorbitan trioleate Drugs 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 2
- RWRDLPDLKQPQOW-UHFFFAOYSA-N tetrahydropyrrole Natural products C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 2
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- ZORQXIQZAOLNGE-UHFFFAOYSA-N 1,1-difluorocyclohexane Chemical compound FC1(F)CCCCC1 ZORQXIQZAOLNGE-UHFFFAOYSA-N 0.000 description 1
- XHXSXTIIDBZEKB-UHFFFAOYSA-N 1,2,3,4,5,6,7,8-octamethylanthracene-9,10-dione Chemical compound CC1=C(C)C(C)=C2C(=O)C3=C(C)C(C)=C(C)C(C)=C3C(=O)C2=C1C XHXSXTIIDBZEKB-UHFFFAOYSA-N 0.000 description 1
- DXBHBZVCASKNBY-UHFFFAOYSA-N 1,2-Benz(a)anthracene Chemical compound C1=CC=C2C3=CC4=CC=CC=C4C=C3C=CC2=C1 DXBHBZVCASKNBY-UHFFFAOYSA-N 0.000 description 1
- IGSAVPVCQHAPSM-UHFFFAOYSA-N 1,2-dichloro-4,5-dinitrobenzene Chemical compound [O-][N+](=O)C1=CC(Cl)=C(Cl)C=C1[N+]([O-])=O IGSAVPVCQHAPSM-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- OEJAVRRJJOMQER-UHFFFAOYSA-N 1,4-bis(2-tert-butylperoxypropan-2-yloxy)benzene Chemical compound CC(C)(C)OOC(C)(C)OC1=CC=C(OC(C)(C)OOC(C)(C)C)C=C1 OEJAVRRJJOMQER-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- FLYKCFXKXMGETI-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-2-propan-2-ylbenzene Chemical compound CC(C)C1=CC=CC=C1C(C)(C)OO FLYKCFXKXMGETI-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- CSZZMFWKAQEMPB-UHFFFAOYSA-N 1-methoxybutan-2-ol Chemical compound CCC(O)COC CSZZMFWKAQEMPB-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- NEBBLNDVSSWJLL-UHFFFAOYSA-N 2,3-bis(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical class CC(=C)C(=O)OCC(OC(=O)C(C)=C)COC(=O)C(C)=C NEBBLNDVSSWJLL-UHFFFAOYSA-N 0.000 description 1
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical class C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 1
- HXVNBWAKAOHACI-UHFFFAOYSA-N 2,4-dimethyl-3-pentanone Chemical compound CC(C)C(=O)C(C)C HXVNBWAKAOHACI-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- VADQVYUICMLSHT-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO.COCCOCCO VADQVYUICMLSHT-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- NREFJJBCYMZUEK-UHFFFAOYSA-N 2-[2-[4-[2-[4-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]phenyl]propan-2-yl]phenoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound C1=CC(OCCOCCOC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCCOCCOC(=O)C(C)=C)C=C1 NREFJJBCYMZUEK-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- JMWGZSWSTCGVLX-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;2-methylprop-2-enoic acid Chemical class CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O.CCC(CO)(CO)CO JMWGZSWSTCGVLX-UHFFFAOYSA-N 0.000 description 1
- CKKQLOUBFINSIB-UHFFFAOYSA-N 2-hydroxy-1,2,2-triphenylethanone Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(O)C(=O)C1=CC=CC=C1 CKKQLOUBFINSIB-UHFFFAOYSA-N 0.000 description 1
- BUSYVFTZPOTFQT-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylethanone;2-hydroxy-1-(2-methylphenyl)-2-phenylethanone Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1.CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 BUSYVFTZPOTFQT-UHFFFAOYSA-N 0.000 description 1
- DIVXVZXROTWKIH-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(C)C(=O)C1=CC=CC=C1 DIVXVZXROTWKIH-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 1
- CLEKZIKTEHRDNU-UHFFFAOYSA-N 2-tert-butylperoxycarbonyl-4-(3-tert-butylperoxycarbonyl-4-carboxybenzoyl)benzoic acid Chemical compound C1=C(C(O)=O)C(C(=O)OOC(C)(C)C)=CC(C(=O)C=2C=C(C(C(O)=O)=CC=2)C(=O)OOC(C)(C)C)=C1 CLEKZIKTEHRDNU-UHFFFAOYSA-N 0.000 description 1
- AGIJRRREJXSQJR-UHFFFAOYSA-N 2h-thiazine Chemical compound N1SC=CC=C1 AGIJRRREJXSQJR-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- CPOPXARYEANNSX-UHFFFAOYSA-N 4,6-dimethoxytriazine Chemical compound COC1=CC(OC)=NN=N1 CPOPXARYEANNSX-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- CDSULTPOCMWJCM-UHFFFAOYSA-N 4h-chromene-2,3-dione Chemical compound C1=CC=C2OC(=O)C(=O)CC2=C1 CDSULTPOCMWJCM-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- XZIIFPSPUDAGJM-UHFFFAOYSA-N 6-chloro-2-n,2-n-diethylpyrimidine-2,4-diamine Chemical compound CCN(CC)C1=NC(N)=CC(Cl)=N1 XZIIFPSPUDAGJM-UHFFFAOYSA-N 0.000 description 1
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 description 1
- 229940076442 9,10-anthraquinone Drugs 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- YBLFGGYJBKJICD-UHFFFAOYSA-N O=C=[SiH2] Chemical compound O=C=[SiH2] YBLFGGYJBKJICD-UHFFFAOYSA-N 0.000 description 1
- AUPMEHLZGWJWGU-UHFFFAOYSA-N OO.CC(C)(C=CC(C)(OOC(C)(C)C)C)OOC(C)(C)C Chemical compound OO.CC(C)(C=CC(C)(OOC(C)(C)C)C)OOC(C)(C)C AUPMEHLZGWJWGU-UHFFFAOYSA-N 0.000 description 1
- 229920001213 Polysorbate 20 Polymers 0.000 description 1
- UAKWLVYMKBWHMX-UHFFFAOYSA-N SU4312 Chemical compound C1=CC(N(C)C)=CC=C1C=C1C2=CC=CC=C2NC1=O UAKWLVYMKBWHMX-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- IYFATESGLOUGBX-YVNJGZBMSA-N Sorbitan monopalmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O IYFATESGLOUGBX-YVNJGZBMSA-N 0.000 description 1
- HVUMOYIDDBPOLL-XWVZOOPGSA-N Sorbitan monostearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O HVUMOYIDDBPOLL-XWVZOOPGSA-N 0.000 description 1
- SEEVRZDUPHZSOX-UHFFFAOYSA-N [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(C)=NOC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-UHFFFAOYSA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- KGBBDBRJXGILTQ-UHFFFAOYSA-N [3-(2-methylprop-2-enoyloxy)-2,2-bis(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical class CC(=C)C(=O)OCC(COC(=O)C(C)=C)(COC(=O)C(C)=C)COC(=O)C(C)=C KGBBDBRJXGILTQ-UHFFFAOYSA-N 0.000 description 1
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical class C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- 125000000641 acridinyl group Chemical class C1(=CC=CC2=NC3=CC=CC=C3C=C12)* 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- LHMRXAIRPKSGDE-UHFFFAOYSA-N benzo[a]anthracene-7,12-dione Chemical compound C1=CC2=CC=CC=C2C2=C1C(=O)C1=CC=CC=C1C2=O LHMRXAIRPKSGDE-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- YGWAFVKXCAQAGJ-UHFFFAOYSA-N bis(2-methylpentan-2-yl) 4-[3,4-bis(2-methylpentan-2-ylperoxycarbonyl)benzoyl]benzene-1,2-dicarboperoxoate Chemical compound C1=C(C(=O)OOC(C)(C)CCC)C(C(=O)OOC(C)(C)CCC)=CC=C1C(=O)C1=CC=C(C(=O)OOC(C)(C)CCC)C(C(=O)OOC(C)(C)CCC)=C1 YGWAFVKXCAQAGJ-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical class C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- RNPXCFINMKSQPQ-UHFFFAOYSA-N dicetyl hydrogen phosphate Chemical compound CCCCCCCCCCCCCCCCOP(O)(=O)OCCCCCCCCCCCCCCCC RNPXCFINMKSQPQ-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- KGGOIDKBHYYNIC-UHFFFAOYSA-N ditert-butyl 4-[3,4-bis(tert-butylperoxycarbonyl)benzoyl]benzene-1,2-dicarboperoxoate Chemical compound C1=C(C(=O)OOC(C)(C)C)C(C(=O)OOC(C)(C)C)=CC=C1C(=O)C1=CC=C(C(=O)OOC(C)(C)C)C(C(=O)OOC(C)(C)C)=C1 KGGOIDKBHYYNIC-UHFFFAOYSA-N 0.000 description 1
- YMRYNEIBKUSWAJ-UHFFFAOYSA-N ditert-butyl benzene-1,3-dicarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC(C(=O)OOC(C)(C)C)=C1 YMRYNEIBKUSWAJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 229910021397 glassy carbon Inorganic materials 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical class [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- GSGDTSDELPUTKU-UHFFFAOYSA-N nonoxybenzene Chemical compound CCCCCCCCCOC1=CC=CC=C1 GSGDTSDELPUTKU-UHFFFAOYSA-N 0.000 description 1
- 229940078552 o-xylene Drugs 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- QRMPKOFEUHIBNM-UHFFFAOYSA-N p-dimethylcyclohexane Natural products CC1CCC(C)CC1 QRMPKOFEUHIBNM-UHFFFAOYSA-N 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 1
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 1
- 239000001818 polyoxyethylene sorbitan monostearate Substances 0.000 description 1
- 235000010989 polyoxyethylene sorbitan monostearate Nutrition 0.000 description 1
- 239000001816 polyoxyethylene sorbitan tristearate Substances 0.000 description 1
- 235000010988 polyoxyethylene sorbitan tristearate Nutrition 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229940100515 sorbitan Drugs 0.000 description 1
- 229940035044 sorbitan monolaurate Drugs 0.000 description 1
- 239000001593 sorbitan monooleate Substances 0.000 description 1
- 235000011069 sorbitan monooleate Nutrition 0.000 description 1
- 229940035049 sorbitan monooleate Drugs 0.000 description 1
- 239000001570 sorbitan monopalmitate Substances 0.000 description 1
- 235000011071 sorbitan monopalmitate Nutrition 0.000 description 1
- 229940031953 sorbitan monopalmitate Drugs 0.000 description 1
- 239000001587 sorbitan monostearate Substances 0.000 description 1
- 235000011076 sorbitan monostearate Nutrition 0.000 description 1
- 229940035048 sorbitan monostearate Drugs 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- MVQLEZWPIWKLBY-UHFFFAOYSA-N tert-butyl 2-benzoylbenzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 MVQLEZWPIWKLBY-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical class [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- OKYDCMQQLGECPI-UHFFFAOYSA-N thiopyrylium Chemical class C1=CC=[S+]C=C1 OKYDCMQQLGECPI-UHFFFAOYSA-N 0.000 description 1
- 150000005075 thioxanthenes Chemical class 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- PHYFQTYBJUILEZ-IUPFWZBJSA-N triolein Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CCCCCCCC)COC(=O)CCCCCCC\C=C/CCCCCCCC PHYFQTYBJUILEZ-IUPFWZBJSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000001834 xanthenyl group Chemical class C1=CC=CC=2OC3=CC=CC=C3C(C12)* 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/106—Esters of polycondensation macromers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/022—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations
- C08F299/024—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations the unsaturation being in acrylic or methacrylic groups
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Definitions
- the present invention relates to an imprint material and a film produced from the material and having a pattern transferred thereon. More specifically, the present invention relates to an imprint material having high scratch resistance even after the pattern is transferred, and a film produced from the material and having the pattern transferred thereon.
- the molecular weights of A 1 and A 2 are M A1 and M A2 , respectively.
- the alkylene oxide unit having 2 carbon atoms is represented by (—C 2 H 4 —O—), and is typically an ethylene oxide unit (hereinafter abbreviated as “EO” in this specification). it may be applied 44 as a molecular weight M O.
- the alkylene oxide unit having 3 carbon atoms is represented by (—C 3 H 6 —O—) and is typically a propylene oxide unit, and 58 may be applied as the molecular weight M O thereof.
- Example 3 DPEA-12 of Example 1 was changed to NK ester A-TMPT-3EO (manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 428) (hereinafter abbreviated as “A-TMPT-3EO” in this specification). Except that, an imprint material PNI-A3 was prepared in the same manner as in Example 1. In this example, A-TMPT-3EO corresponds to the component (A), and the number of alkylene oxide units per molecule is 3 EO.
- Example 2 Example 1 except that DPEA-12 of Example 1 was changed to NK ester A-DPH (manufactured by Shin-Nakamura Chemical Co., Ltd.) (hereinafter abbreviated as “A-DPH” in this specification).
- An imprint material PNI-B2 was prepared.
- A-DPH corresponds to the component (A ′).
Abstract
Description
したがって、ナノインプリントリソグラフィは、光リソグラフィ技術に代わり、半導体デバイス、オプトデバイス、ディスプレイ、記憶媒体、バイオチップ等の製造への適用が期待されている技術であることから、ナノインプリントリソグラフィに用いる光ナノインプリントリソグラフィ用硬化性組成物について様々な報告がなされている(特許文献2、特許文献3)。 In 1995, Professor Chou of Princeton University proposed a new technique called nanoimprint lithography (Patent Document 1). Nanoimprint lithography is a resin in which a mold is brought into contact with a substrate on which a resin film is formed, the resin film is pressed, the resin film is pressurized, and heat or light is used as an external stimulus to cure the target pattern. This nanoimprint lithography is a technique for forming a film, and has an advantage that nanoscale processing can be performed easily and inexpensively compared to optical lithography or the like in conventional semiconductor device manufacturing.
Therefore, nanoimprint lithography is a technology that is expected to be applied to the manufacture of semiconductor devices, opto-devices, displays, storage media, biochips, etc., instead of optical lithography technology. Various reports have been made on curable compositions (Patent Documents 2 and 3).
また、本明細書では、形成されるパターンサイズがナノメートルオーダーに限らず、例えば、マイクロメートルオーダーである場合を含む光ナノインプリント技術を光インプリントと称する。 The present invention has been made based on the above circumstances, and the problem to be solved is to provide an imprint material having high scratch resistance even after the pattern is transferred. It is to provide a film that has been fabricated and transferred with a pattern. Specifically, an object of the present invention is to provide an imprint material in which the number of scratches is 10 or less when a steel wool scratch test is performed on a film after transferring a pattern.
Moreover, in this specification, the optical nanoimprint technique including the case where the pattern size to be formed is not limited to the nanometer order but is, for example, the micrometer order is referred to as optical imprint.
すなわち、本発明は、
(A)成分:炭素原子数2または3のアルキレンオキサイドユニットを有し且つ重合性基を少なくとも2つ有する化合物、及び
(B)成分:光重合開始剤
を含むインプリント材料に関する。 In order to improve the scratch resistance of the film, it is conceivable to increase the hardness of the film or to increase the slipperiness of the surface of the film. The present inventors have found that in a film having a pattern such as a concavo-convex structure, scratches are less likely to be formed by increasing the slipperiness of the film surface than by increasing the hardness of the film. The present invention has been completed by using a compound having an alkylene oxide unit of 2 or 3 and a polymerizable group, and a photopolymerization initiator.
That is, the present invention
(A) Component: It relates to an imprint material comprising a compound having an alkylene oxide unit having 2 or 3 carbon atoms and having at least two polymerizable groups, and (B) component: a photopolymerization initiator.
本発明のインプリント材料は、光硬化が可能であり、且つモールドの離型時にパターンの一部の剥がれが生じないため、所望のパターンが正確に形成された膜が得られる。したがって、良好な光インプリントのパターン形成が可能である。
また、本発明のインプリント材料は、任意の基材上に製膜することができ、インプリント後に形成される、パターンが転写された膜は、固体撮像装置、太陽電池、LEDデバイス、ディスプレイなどの、耐擦傷性が求められる部材を使用する製品(電子デバイス)へ好適に用いることができる。
さらに、本発明のインプリント材料は、上記(A)成分の化合物の種類及び含有割合を変更することで、硬化速度、動的粘度、膜厚をコントロールすることができる。したがって、本発明のインプリント材料は、製造するデバイス種と露光プロセス及び焼成プロセスの種類に対応した材料の設計が可能であり、プロセスマージンを拡大できるため、光学部材の製造に好適に用いることができる。 In the imprint material of the present invention, a compound having an alkylene oxide unit having 2 or 3 carbon atoms in the molecule and having at least two polymerizable groups is used. The film to which is transferred has 10 or fewer scratches even when a steel wool scratch test is performed on the pattern, and is far less than the conventional film having 50 or more scratches.
The imprint material of the present invention can be photocured, and part of the pattern does not peel off when the mold is released, so that a film in which a desired pattern is accurately formed can be obtained. Therefore, it is possible to form a good optical imprint pattern.
In addition, the imprint material of the present invention can be formed on an arbitrary substrate, and the film to which the pattern is transferred formed after the imprint is a solid-state imaging device, a solar cell, an LED device, a display, etc. It can be suitably used for products (electronic devices) that use members that require scratch resistance.
Furthermore, the imprint material of this invention can control a cure rate, a dynamic viscosity, and a film thickness by changing the kind and content rate of the compound of the said (A) component. Therefore, the imprint material of the present invention can be designed suitably for the type of device to be manufactured, the type of exposure process and the type of baking process, and the process margin can be expanded. it can.
以下、各成分について詳細に説明する。 The present invention is characterized in that scratch resistance is imparted to a film after pattern transfer by using a compound having an alkylene oxide unit having 2 or 3 carbon atoms and having at least two polymerizable groups. That is, an imprint material comprising (A) a compound having an alkylene oxide unit having 2 or 3 carbon atoms and having at least two polymerizable groups, and (B) a photopolymerization initiator. Furthermore, in addition to the component (A) and the component (B), as the component (A ′), a compound having at least two polymerizable groups and not having an alkylene oxide unit having 2 or 3 carbon atoms, (C It is an imprint material that can also contain one or more components selected from the group consisting of a surfactant as a component and a solvent as a component (D).
Hereinafter, each component will be described in detail.
(A)成分である、炭素原子数2または3のアルキレンオキサイドユニットを有し且つ重合性基を少なくとも2つ有する化合物とは、1分子内に例えばエチレンオキサイドユニットまたはプロピレンオキサイドユニットを1つ以上有し且つ重合性基を分子末端に2つ以上有する化合物を表す。また、上記重合性基としては、例えば、アクリロイルオキシ基、アクリロイル基、メタアクリロイルオキシ基及びメタアクリロイル基からなる群から選ばれる少なくとも1種の有機基のことを指す。ここで、アクリロイルオキシ基はアクリロキシ基と、メタアクリロイルオキシ基はメタアクリロキシ基と表現されることがある。 <(A) component>
The compound (A), which has an alkylene oxide unit having 2 or 3 carbon atoms and has at least two polymerizable groups, has, for example, one or more ethylene oxide units or propylene oxide units in one molecule. And a compound having two or more polymerizable groups at the molecular end. The polymerizable group refers to, for example, at least one organic group selected from the group consisting of an acryloyloxy group, an acryloyl group, a methacryloyloxy group, and a methacryloyl group. Here, the acryloyloxy group may be expressed as an acryloxy group, and the methacryloyloxy group may be expressed as a methacryloxy group.
(A´)成分として、重合性基を少なくとも2つ有し且つ炭素原子数2または3のアルキレンオキサイドユニットを有さない化合物としては、例えば、ジペンタエリスリトールヘキサアクリレート、ジペンタエリスリトールヘキサメタクリレート、ネオペンチルグリコールジアクリレート、ネオペンチルグリコールジメタクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールトリメタクリレート、トリメチロールプロパントリアクリレート、トリメチロールプロパントリメタクリレート、トリシクロデカンジメタノールジアクリレート、トリシクロデカンジメタノールジメタクリレート、1,6-ヘキサンジオールジアクリレート、1,6-ヘキサンジオールジメタクリレート等を挙げることができる。 <(A ') component>
As the component (A ′), examples of the compound having at least two polymerizable groups and not having an alkylene oxide unit having 2 or 3 carbon atoms include dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, neodymium. Pentyl glycol diacrylate, neopentyl glycol dimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, tricyclodecane dimethanol diacrylate, tricyclodecane dimethanol dimethacrylate, 1 , 6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, and the like.
100(MO×nA×x)/{(MA×x)+〔MB×(100-x)〕}・・・(1)
一方、(A)成分が化合物A1及びA2から成り、当該化合物A1をx質量%(xは0<x≦100を満たす正数)及び化合物A2を(100-x)質量%含む場合の、アルキレンオキサイドユニット濃度(%)は、下記式(2)で表される。ただし、化合物A1及びA2のアルキレンオキサイドユニット1個当たりの分子量をそれぞれMO1,MO2、化合物A1及びA2の1分子当たりのアルキレンオキサイドユニットの数をそれぞれnA1,nA2、化合物A1及びA2の分子量をそれぞれMA1,MA2とする。x=100の場合は、(A)成分が化合物A1から成り化合物A2を含まないことを意味する。
100{(MO1×nA1×x)+〔MO2×nA2×(100-x)}/{(MA1×x)+〔MA2×(100-x)〕}・・・(2)
なお、炭素原子数2のアルキレンオキサイドユニットは(-C2H4-O-)で表され、代表的にはエチレンオキサイドユニット(以下、本明細書では「EO」と略称する。)であり、その分子量MOとして44を適用すればよい。炭素原子数3のアルキレンオキサイドユニットは(-C3H6-O-)で表され、代表的にはプロピレンオキサイドユニットであり、その分子量MOとして58を適用すればよい。 For example, in the case of containing x mass% of compound A as component (A) (x is a positive number satisfying 0 <x ≦ 100) and (100−x) mass% of compound B as component (A ′) The oxide unit concentration (%) is represented by the following formula (1). However, molecular weight M O per alkylene oxide unit of Compound A, the number n A of alkylene oxide units per molecule of Compound A, Compound A and the molecular weight of each M A of B, and M B. When x = 100, it means that the component (A ′) is not included.
100 (M O × n A × x) / {(M A × x) + [M B × (100−x)]} (1)
On the other hand, the component (A) is composed of compounds A 1 and A 2 , and the compound A 1 contains x mass% (x is a positive number satisfying 0 <x ≦ 100) and the compound A 2 contains (100−x) mass%. In this case, the concentration (%) of the alkylene oxide unit is represented by the following formula (2). However, the molecular weights per alkylene oxide unit of the compounds A 1 and A 2 are M O1 and M O2 respectively, and the number of alkylene oxide units per molecule of the compounds A 1 and A 2 are n A1 and n A2 , respectively. The molecular weights of A 1 and A 2 are M A1 and M A2 , respectively. In the case of x = 100, it means that the component (A) consists of the compound A 1 and does not contain the compound A 2 .
100 {(M O1 × n A1 × x) + [M O2 × n A2 × (100−x)} / {(M A1 × x) + [M A2 × (100−x)]} (2 )
The alkylene oxide unit having 2 carbon atoms is represented by (—C 2 H 4 —O—), and is typically an ethylene oxide unit (hereinafter abbreviated as “EO” in this specification). it may be applied 44 as a molecular weight M O. The alkylene oxide unit having 3 carbon atoms is represented by (—C 3 H 6 —O—) and is typically a propylene oxide unit, and 58 may be applied as the molecular weight M O thereof.
(B)成分である光重合開始剤としては、例えば、tert-ブチルペルオキシ-iso-ブタレート、2,5-ジメチル-2,5-ビス(ベンゾイルジオキシ)ヘキサン、1,4-ビス[α-(tert-ブチルジオキシ)-iso-プロポキシ]ベンゼン、ジ-tert-ブチルペルオキシド、2,5-ジメチル-2,5-ビス(tert-ブチルジオキシ)ヘキセンヒドロペルオキシド、α-(iso-プロピルフェニル)-iso-プロピルヒドロペルオキシド、2,5-ジメチルヘキサン、tert-ブチルヒドロペルオキシド、1,1-ビス(tert-ブチルジオキシ)-3,3,5-トリメチルシクロヘキサン、ブチル-4,4-ビス(tert-ブチルジオキシ)バレレート、シクロヘキサノンペルオキシド、2,2’,5,5’-テトラ(tert-ブチルペルオキシカルボニル)ベンゾフェノン、3,3’,4,4’-テトラ(tert-ブチルペルオキシカルボニル)ベンゾフェノン、3,3’,4,4’-テトラ(tert-アミルペルオキシカルボニル)ベンゾフェノン、3,3’,4,4’-テトラ(tert-ヘキシルペルオキシカルボニル)ベンゾフェノン、3,3’-ビス(tert-ブチルペルオキシカルボニル)-4,4’-ジカルボキシベンゾフェノン、tert-ブチルペルオキシベンゾエート、ジ-tert-ブチルジペルオキシイソフタレート等の有機過酸化物、9,10-アントラキノン、1-クロロアントラキノン、2-クロロアントラキノン、オクタメチルアントラキノン、1,2-ベンズアントラキノン等のキノン類、ベンゾインメチル、ベンゾインエチルエーテル、α-メチルベンゾイン、α-フェニルベンゾイン等のベンゾイン誘導体、2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン、1-ヒドロキシ-シクロヘキシル-フェニル-ケトン、2-ヒドロキシ-2-メチル-1-フェニル-プロパン-1-オン、1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン、2-ヒドロキシ-1-[4-{4-(2-ヒドロキシ-2-メチル-プロピオニル)ベンジル}-フェニル]-2-メチル-プロパン-1-オン、フェニルグリオキシリックアシッドメチルエステル、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルフォリノプロパン-1-オン、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1、2-ジメチルアミノ-2-(4-メチル-ベンジル)-1-(4-モリフォリン-4-イル-フェニル)-ブタン-1-オン、ビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド、2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド、1,2-オクタンジオン,1-[4-(フェニルチオ)-,2-(O-ベンゾイルオキシム)]、エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)等の光ラジカル発生剤が挙げられるが、光硬化時に使用する光源に吸収をもつものであれば、特に限定されない。 <(B) component>
Examples of the photopolymerization initiator as component (B) include tert-butylperoxy-iso-butarate, 2,5-dimethyl-2,5-bis (benzoyldioxy) hexane, 1,4-bis [α- (Tert-butyldioxy) -iso-propoxy] benzene, di-tert-butyl peroxide, 2,5-dimethyl-2,5-bis (tert-butyldioxy) hexene hydroperoxide, α- (iso-propylphenyl) -iso- Propyl hydroperoxide, 2,5-dimethylhexane, tert-butyl hydroperoxide, 1,1-bis (tert-butyldioxy) -3,3,5-trimethylcyclohexane, butyl-4,4-bis (tert-butyldioxy) valerate , Cyclohexanone peroxide, 2,2 ', 5 5′-tetra (tert-butylperoxycarbonyl) benzophenone, 3,3 ′, 4,4′-tetra (tert-butylperoxycarbonyl) benzophenone, 3,3 ′, 4,4′-tetra (tert-amylperoxycarbonyl) ) Benzophenone, 3,3 ′, 4,4′-tetra (tert-hexylperoxycarbonyl) benzophenone, 3,3′-bis (tert-butylperoxycarbonyl) -4,4′-dicarboxybenzophenone, tert-butylperoxy Organic peroxides such as benzoate and di-tert-butyldiperoxyisophthalate, quinones such as 9,10-anthraquinone, 1-chloroanthraquinone, 2-chloroanthraquinone, octamethylanthraquinone and 1,2-benzanthraquinone, benzoin Methyl Benzoin derivatives such as benzoin ethyl ether, α-methylbenzoin, α-phenylbenzoin, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy- 2-methyl-1-phenyl-propan-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1 -[4- {4- (2-hydroxy-2-methyl-propionyl) benzyl} -phenyl] -2-methyl-propan-1-one, phenylglyoxylic acid methyl ester, 2-methyl-1- [4 -(Methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- ( 4-morpholinophenyl) -butanone-1,2-dimethylamino-2- (4-methyl-benzyl) -1- (4-morpholin-4-yl-phenyl) -butan-1-one, bis (2, 4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O— Benzoyloxime)], ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime) However, there is no particular limitation as long as the light source used for photocuring has absorption.
本発明のインプリント材料は(C)成分として界面活性剤を含有しても良い。(C)成分である界面活性剤を含む場合は、得られる塗膜の製膜性を調整する役割を果たす。
界面活性剤としては、例えば、ポリオキシエチレンラウリルエーテル、ポリオキシエチレンステアリルエーテル、ポリオキシエチレンアセチルエーテル、ポリオキシエチレンオレインエーテル等のポリオキシエチレンアルキルエーテル類、ポリオキシエチレンオクチルフェ二ルエーテル、ポリオキシエチレンノニルフェニルエーテル等のポリオキシエチレンアルキルアリールエーテル類、ポリオキシエチレン・ポリオキシプロピレンブロックコポリマー類、ソルビタンモノラウレート、ソルビタンモノパルミテート、ソルビタンモノステアレート、ソルビタンモノオレエート、ソルビタントリオレエート、ソルビタントリステアレート等のソルビタン脂肪酸エステル類、ポリオキシエチレンソルビタンモノラウレート、ポリオキシエチレンソルビタンモノパルミテート、ポリオキシエチレンソルビタンモノステアレート、ポリオキシエチレンソルビタントリオレエート、ポリオキシエチレンソルビタントリステアレート等のポリオキシエチレンソルビタン脂肪酸エステル類等のノニオン系界面活性剤、エフトップ(登録商標)EF301、同EF303、同EF352(三菱マテリアル電子化成株式会社)、メガファック(登録商標)F171、同F173、同R-08、同R-30(DIC株式会社製)、フロラードFC430、同FC431(住友スリーエム株式会社製)、アサヒガード(登録商標)AG710、サーフロン(登録商標)S-382、同SC101、同SC102、同SC103、同SC104、同SC105、同SC106(旭硝子株式会社製)等のフッ素系界面活性剤、及びオルガノシロキサンポリマーKP341(信越化学工業株式会社製)、BYK(登録商標)-302、同-307、同-322、同-323、同-330、同-333、同-370、同-375、同-378、同-UV3500、同-UV3570(ビックケミー・ジャパン株式会社製)等を挙げることができる。 <(C) component>
The imprint material of the present invention may contain a surfactant as the component (C). When the surfactant (C) is included, it plays the role of adjusting the film forming property of the resulting coating film.
Examples of the surfactant include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene acetyl ether, polyoxyethylene olein ether, polyoxyethylene octyl phenyl ether, polyoxyethylene Polyoxyethylene alkyl aryl ethers such as ethylene nonylphenyl ether, polyoxyethylene / polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, sorbitan Sorbitan fatty acid esters such as tristearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene Nonionic surfactants such as polyoxyethylene sorbitan fatty acid esters such as bitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan trioleate, polyoxyethylene sorbitan tristearate, Ftop (registered trademark) EF301, EF303, EF352 (Mitsubishi Materials Electronics Chemical Co., Ltd.), MegaFac (registered trademark) F171, F173, R-08, R-30 (made by DIC Corporation), Florard FC430, FC431 (Sumitomo) 3M Corporation), Asahi Guard (registered trademark) AG710, Surflon (registered trademark) S-382, SC101, SC102, SC103, SC104, SC105, SC106 (produced by Asahi Glass Co., Ltd.) Surfactant and organosiloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), BYK (registered trademark) -302, -307, -322, -323, -330, -333, -370, -375, -378, -UV3500, and -UV3570 (produced by Big Chemie Japan Co., Ltd.).
本発明のインプリント材料は(D)成分として溶剤を含有しても良い。(D)成分である溶剤を含む場合は、(A)成分である化合物の粘度調節の役割を果たす。本発明の場合、溶剤の使用は任意であるが、通常は溶剤を必要としない。 <(D) component>
The imprint material of the present invention may contain a solvent as the component (D). When the solvent which is (D) component is included, it plays the role of viscosity adjustment of the compound which is (A) component. In the present invention, the use of a solvent is optional, but usually no solvent is required.
<実施例1>
KAYARAD(登録商標)DPEA-12(日本化薬株式会社製、分子量:1080)(以下、本明細書では「DPEA-12」と略称する。)5gにDAROCUR(登録商標)1173(BASFジャパン株式会社製)(以下、本明細書では「DAROCUR1173」と略称する。)を1g(DPEA-12の総質量に対して20phr)加え、インプリント材料PNI-A1を調製した。本実施例において、DPEA-12は(A)成分に該当し、その1分子当たりのアルキレンオキサイドユニットの数は、EO(エチレンオキサイドユニット)が12個である。DAROCUR1173は(B)成分に該当する。 [Preparation of coating solution for film formation]
<Example 1>
KAYARAD (registered trademark) DPEA-12 (manufactured by Nippon Kayaku Co., Ltd., molecular weight: 1080) (hereinafter abbreviated as “DPEA-12” in this specification) 5 g DAROCUR (registered trademark) 1173 (BASF Japan Ltd.) (Hereinafter abbreviated as “DAROCUR1173”) (1 phr) (20 phr with respect to the total mass of DPEA-12) was added to prepare an imprint material PNI-A1. In this example, DPEA-12 corresponds to component (A), and the number of alkylene oxide units per molecule is 12 EO (ethylene oxide units). DAROCUR 1173 corresponds to the component (B).
実施例1のDPEA-12をNKエステルATM-4E(新中村化学工業株式会社製、分子量:529)(以下、本明細書では「ATM-4E」と略称する。)に変更した以外は、実施例1と同様にインプリント材料PNI-A2を調製した。本実施例において、ATM-4Eは(A)成分に該当し、その1分子当たりのアルキレンオキサイドユニットの数は、EOが4個である。 <Example 2>
The procedure was carried out except that DPEA-12 of Example 1 was changed to NK ester ATM-4E (manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 529) (hereinafter abbreviated as “ATM-4E” in this specification). An imprint material PNI-A2 was prepared in the same manner as in Example 1. In this example, ATM-4E corresponds to the component (A), and the number of alkylene oxide units per molecule thereof is 4 EO.
実施例1のDPEA-12をNKエステルA-TMPT-3EO(新中村化学工業株式会社製、分子量:428)(以下、本明細書では「A-TMPT-3EO」と略称する。)に変更した以外は、実施例1と同様にインプリント材料PNI-A3調製した。本実施例において、A-TMPT-3EOは(A)成分に該当し、その1分子当たりのアルキレンオキサイドユニットの数は、EOが3個である。 <Example 3>
DPEA-12 of Example 1 was changed to NK ester A-TMPT-3EO (manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 428) (hereinafter abbreviated as “A-TMPT-3EO” in this specification). Except that, an imprint material PNI-A3 was prepared in the same manner as in Example 1. In this example, A-TMPT-3EO corresponds to the component (A), and the number of alkylene oxide units per molecule is 3 EO.
実施例1のDPEA-12をNKエステルA-TMPT-9EO(新中村化学工業株式会社製、分子量:692)(以下、本明細書では「A-TMPT-9EO」と略称する。)に変更した以外は、実施例1と同様にインプリント材料PNI-A4を調製した。本実施例において、A-TMPT-9EOは(A)成分に該当し、その1分子当たりのアルキレンオキサイドユニットの数は、EOが9個である。 <Example 4>
DPEA-12 of Example 1 was changed to NK ester A-TMPT-9EO (manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 692) (hereinafter abbreviated as “A-TMPT-9EO” in this specification). An imprint material PNI-A4 was prepared in the same manner as in Example 1 except for the above. In this example, A-TMPT-9EO corresponds to component (A), and the number of alkylene oxide units per molecule is 9 EO.
実施例1のDPEA-12をNKエステルA-BPE-20(新中村化学工業株式会社製、分子量:1216)(以下、本明細書では「A-BPE-20」と略称する。)に変更した以外は、実施例1と同様にインプリント材料PNI-A5を調製した。本実施例において、A-BPE-20は(A)成分に該当し、その1分子当たりのアルキレンオキサイドユニットの数は、EOが17個である。 <Example 5>
DPEA-12 of Example 1 was changed to NK ester A-BPE-20 (manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 1216) (hereinafter abbreviated as “A-BPE-20” in this specification). An imprint material PNI-A5 was prepared in the same manner as in Example 1 except for the above. In this example, A-BPE-20 corresponds to the component (A), and the number of alkylene oxide units per molecule is 17 EO.
実施例1のDPEA-12をNKエステルA-BPE-10(新中村化学工業株式会社製、分子量:776)(以下、本明細書では「A-BPE-10」と略称する。)に変更した以外は、実施例1と同様にインプリント材料PNI-A6を調製した。本実施例において、A-BPE-10は(A)成分に該当し、その1分子当たりのアルキレンオキサイドユニットの数は、EOが10個である。 <Example 6>
DPEA-12 of Example 1 was changed to NK ester A-BPE-10 (manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 776) (hereinafter abbreviated as “A-BPE-10” in this specification). An imprint material PNI-A6 was prepared in the same manner as in Example 1 except for the above. In this example, A-BPE-10 corresponds to the component (A), and the number of alkylene oxide units per molecule is 10 EO.
実施例1のDPEA-12をNKエステルA-BPE-4(新中村化学工業株式会社製、分子量:512)(以下、本明細書では「A-BPE-4」と略称する)に変更した以外は、実施例1と同様にインプリント材料PNI-A7を調製した。本実施例において、A-BPE-4は(A)成分に該当し、その1分子当たりのアルキレンオキサイドユニットの数は、EOが4個である。 <Example 7>
Except for changing DPEA-12 of Example 1 to NK ester A-BPE-4 (manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 512) (hereinafter abbreviated as “A-BPE-4” in this specification). Prepared an imprint material PNI-A7 in the same manner as in Example 1. In this example, A-BPE-4 corresponds to the component (A), and the number of alkylene oxide units per molecule is 4 EO.
実施例1のDPEA-12をNKエステルA-400(新中村化学工業株式会社製、分子量:508)(以下、本明細書では「A-400」と略称する)に変更した以外は、実施例1と同様にインプリント材料PNI-A8を調製した。本実施例において、A-400は(A)成分に該当し、その1分子当たりのアルキレンオキサイドユニットの数は、EOが9個である。 <Example 8>
Example 1 except that DPEA-12 of Example 1 was changed to NK ester A-400 (manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 508) (hereinafter abbreviated as “A-400” in this specification). In the same manner as in Example 1, an imprint material PNI-A8 was prepared. In this example, A-400 corresponds to the component (A), and the number of alkylene oxide units per molecule is 9 EO.
実施例1のDPEA-12をNKエステルA-200(新中村化学工業株式会社製、分子量:308)(以下、本明細書では「A-200」と略称する)に変更した以外は、実施例1と同様にインプリント材料PNI-A9を調製した。本実施例において、A-200は(A)成分に該当し、その1分子当たりのアルキレンオキサイドユニットの数は、EOが4個である。 <Example 9>
Example except that DPEA-12 of Example 1 was changed to NK ester A-200 (manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 308) (hereinafter abbreviated as “A-200” in this specification). In the same manner as in Example 1, an imprint material PNI-A9 was prepared. In this example, A-200 corresponds to the component (A), and the number of alkylene oxide units per molecule is 4 EO.
実施例1のDPEA-12をNKエステル1G(新中村化学工業株式会社製、分子量:198)(以下、本明細書では「1G」と略称する。)に変更した以外は、実施例1と同様にインプリント材料PNI-A10を調製した。本実施例において、1Gは(A)成分に該当し、その1分子当たりのアルキレンオキサイドユニットの数は、EOが1個である。 <Example 10>
Example 1 except that DPEA-12 of Example 1 was changed to NK ester 1G (manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 198) (hereinafter abbreviated as “1G” in this specification). An imprint material PNI-A10 was prepared. In this example, 1G corresponds to the component (A), and the number of alkylene oxide units per molecule is EO.
KAYARAD(登録商標)DPHA(日本化薬株式会社製、分子量:552)(以下、本明細書では「DPHA」と略称する。)4.5gにA-400を0.5g(DPHAとA-400の合計100質量部の内、10質量部)、DAROCUR1173を1g(DPHA及びA-400の総質量に対して20phr)を加え、インプリント材料PNI-A11を調製した。本実施例及び後述する実施例12乃至17において、A-400は(A)成分に該当し、DPHAは炭素原子数2または3のアルキレンオキサイドユニットを有さない(A´)成分に該当し、DAROCUR1173は(B)成分に該当する。 <Example 11>
KAYARAD (registered trademark) DPHA (manufactured by Nippon Kayaku Co., Ltd., molecular weight: 552) (hereinafter abbreviated as “DPHA” in this specification) 4.5 g of A-400 (DPHA and A-400) 1 part of DAROCUR1173 (20 phr with respect to the total mass of DPHA and A-400) was added to prepare imprint material PNI-A11. In this example and Examples 12 to 17 described later, A-400 corresponds to the component (A), DPHA corresponds to the component (A ′) having no alkylene oxide unit having 2 or 3 carbon atoms, DAROCUR 1173 corresponds to the component (B).
DPHA4gにA-400を1g(DPHAとA-400の合計100質量部の内、20質量部)、DAROCUR1173を1g(DPHA及びA-400の総質量に対して20phr)を加え、インプリント材料PNI-A12を調製した。 <Example 12>
1 g of A-400 (20 parts by mass of the total of 100 parts by mass of DPHA and A-400) and 1 g of DAROCUR1173 (20 phr with respect to the total mass of DPHA and A-400) are added to 4 g of DPHA, and the imprint material PNI -A12 was prepared.
DPHA3.5gにA-400を1.5g(DPHAとA-400の合計100質量部の内、30質量部)、DAROCUR1173を1g(DPHA及びA-400の総質量に対して20phr)を加え、インプリント材料PNI-A13を調製した。 <Example 13>
1.5 g of A-400 (30 parts by mass of the total of 100 parts by mass of DPHA and A-400) is added to 3.5 g of DPHA, and 1 g of DAROCUR1173 (20 phr with respect to the total mass of DPHA and A-400) is added. An imprint material PNI-A13 was prepared.
DPHA2.5gにA-400を2.5g(DPHAとA-400の合計100質量部の内、50質量部)、DAROCUR1173を1g(DPHA及びA-400の総質量に対して20phr)を加え、インプリント材料PNI-A14を調製した。 <Example 14>
To 2.5 g of DPHA, 2.5 g of A-400 (50 parts by mass of 100 parts by mass of DPHA and A-400) and 1 g of DAROCUR1173 (20 phr with respect to the total mass of DPHA and A-400) are added. An imprint material PNI-A14 was prepared.
DPHA1.5gにA-400を3.5g(DPHAとA-400の合計100質量部の内、70質量部)、DAROCUR1173を1g(DPHA及びA-400の総質量に対して20phr)を加え、インプリント材料PNI-A15を調製した。 <Example 15>
To 1.5 g of DPHA, 3.5 g of A-400 (70 parts by mass of 100 parts by mass of DPHA and A-400) and 1 g of DAROCUR1173 (20 phr with respect to the total mass of DPHA and A-400) are added. An imprint material PNI-A15 was prepared.
DPHA1gにA-400を4g(DPHAとA-400の合計100質量部の内、80質量部)、DAROCUR1173を1g(DPHA及びA-400の総質量に対して20phr)を加え、インプリント材料PNI-A16を調製した。 <Example 16>
4 g of A-400 (80 parts by mass of the total of 100 parts by mass of DPHA and A-400) and 1 g of DAROCUR1173 (20 phr with respect to the total mass of DPHA and A-400) are added to 1 g of DPHA, and the imprint material PNI -A16 was prepared.
DPHA0.5gにA-400を4.5g(DPHAとA-400の合計100質量部の内、90質量部)、DAROCUR1173を1g(DPHA及びA-400の総質量に対して20phr)を加え、インプリント材料PNI-A17を調製した。 <Example 17>
To 0.5 g of DPHA, 4.5 g of A-400 (90 parts by mass, out of 100 parts by mass of DPHA and A-400) and 1 g of DAROCUR1173 (20 phr with respect to the total mass of DPHA and A-400) are added, An imprint material PNI-A17 was prepared.
A-TMPT-9EO2.5gにエポリード(登録商標)GT-401(ダイセル化学工業(株)製、分子量:675)(以下、本明細書では「GT-401」と略称する。)を2.5g、DAROCUR1173を0.5g(A-TMPT-9EOに対して20phr)、IRGACURE PAG103を0.1g(GT-401に対して4phr)を加え、インプリント材料PNI-A18を調製した。本実施例において、A-TMPT-9EOは(A)成分に該当し、GT-401は必要に応じて含有することができるエポキシ化合物に該当し、DAROCUR1173は(B)成分に該当し、IRGACURE PAG103は必要に応じて含有することができる光酸発生剤に該当する。 <Example 18>
2.5 g of E-Polyde (registered trademark) GT-401 (manufactured by Daicel Chemical Industries, Ltd., molecular weight: 675) (hereinafter abbreviated as “GT-401”) in 2.5 g of A-TMPT-9EO. Then, 0.5 g of DAROCUR1173 (20 phr for A-TMPT-9EO) and 0.1 g of IRGACURE PAG103 (4 phr for GT-401) were added to prepare imprint material PNI-A18. In this example, A-TMPT-9EO corresponds to component (A), GT-401 corresponds to an epoxy compound that can be contained as necessary, DAROCUR1173 corresponds to component (B), and IRGACURE PAG103 Corresponds to a photoacid generator that can be contained as required.
実施例1のDPEA-12をDPHAに変更した以外は、実施例1と同様にインプリント材料PNI-B1を調製した。本比較例において、DPHAは(A´)成分に該当する。 <Comparative Example 1>
An imprint material PNI-B1 was prepared in the same manner as in Example 1 except that DPEA-12 in Example 1 was changed to DPHA. In this comparative example, DPHA corresponds to the component (A ′).
実施例1のDPEA-12をNKエステルA-DPH(新中村化学工業株式会社製)(以下、本明細書では「A-DPH」と略称する。)に変更した以外は、実施例1と同様にインプリント材料PNI-B2を調製した。本比較例において、A-DPHは(A´)成分に該当する。 <Comparative Example 2>
Example 1 except that DPEA-12 of Example 1 was changed to NK ester A-DPH (manufactured by Shin-Nakamura Chemical Co., Ltd.) (hereinafter abbreviated as “A-DPH” in this specification). An imprint material PNI-B2 was prepared. In this comparative example, A-DPH corresponds to the component (A ′).
実施例1のDPEA-12をNKエステルA-TMPT(新中村化学工業株式会社製)(以下、本明細書では「A-TMPT」と略称する。)に変更した以外は、実施例1と同様にインプリント材料PNI-B3を調製した。本比較例において、A-TMPTは(A´)成分に該当する。 <Comparative Example 3>
Example 1 except that DPEA-12 in Example 1 was changed to NK ester A-TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd.) (hereinafter abbreviated as “A-TMPT” in this specification). An imprint material PNI-B3 was prepared. In this comparative example, A-TMPT corresponds to the component (A ′).
実施例1のDPEA-12をKAYARAD(登録商標)PET-30(日本化薬株式会社製)(以下、本明細書では「PET-30」と略称する。)に変更した以外は、実施例1と同様にインプリント材料PNI-B4を調製した。本比較例において、PET-30は(A´)成分に該当する。 <Comparative Example 4>
Example 1 except that DPEA-12 of Example 1 was changed to KAYARAD (registered trademark) PET-30 (manufactured by Nippon Kayaku Co., Ltd.) (hereinafter abbreviated as “PET-30” in this specification). The imprint material PNI-B4 was prepared in the same manner as described above. In this comparative example, PET-30 corresponds to the component (A ′).
実施例1のDPEA-12をペンタエリスリトールトリアクリレート(アルドリッチ社製)(以下、本明細書では「PTA」と略称する。)に変更した以外は、実施例1と同様にインプリント材料PNI-B5を調製した。本比較例において、PTAは(A´)成分に該当する。 <Comparative Example 5>
Imprint material PNI-B5 as in Example 1 except that DPEA-12 of Example 1 was changed to pentaerythritol triacrylate (manufactured by Aldrich) (hereinafter abbreviated as “PTA” in this specification). Was prepared. In this comparative example, PTA corresponds to the component (A ′).
実施例1のDPEA-12をKAYARAD(登録商標)NPGDA(日本化薬株式会社製)(以下、本明細書では「NPGDA」と略称する。)に変更した以外は、実施例1と同様にインプリント材料PNI-B6を調製した。本比較例及び後述する比較例7乃至13において、NPGDAは(A´)成分に該当する。 <Comparative Example 6>
In the same manner as in Example 1, except that DPEA-12 in Example 1 was changed to KAYARAD (registered trademark) NPGDA (manufactured by Nippon Kayaku Co., Ltd.) (hereinafter abbreviated as “NPGDA” in this specification). Print material PNI-B6 was prepared. In this comparative example and comparative examples 7 to 13 described later, NPGDA corresponds to the component (A ′).
実施例11のA-400をNPGDAに変更した以外は、実施例1と同様にインプリント材料PNI-B7を調製した。 <Comparative Example 7>
An imprint material PNI-B7 was prepared in the same manner as in Example 1 except that A-400 in Example 11 was changed to NPGDA.
実施例12のA-400をNPGDAに変更した以外は、実施例1と同様にインプリント材料PNI-B8を調製した。 <Comparative Example 8>
An imprint material PNI-B8 was prepared in the same manner as in Example 1 except that A-400 in Example 12 was changed to NPGDA.
実施例13のA-400をNPGDAに変更した以外は、実施例1と同様にインプリント材料PNI-B9を調製した。 <Comparative Example 9>
An imprint material PNI-B9 was prepared in the same manner as in Example 1 except that A-400 in Example 13 was changed to NPGDA.
実施例14のA-400をNPGDAに変更した以外は、実施例1と同様にインプリント材料PNI-B10を調製した。 <Comparative Example 10>
An imprint material PNI-B10 was prepared in the same manner as in Example 1 except that A-400 in Example 14 was changed to NPGDA.
実施例15のA-400をNPGDAに変更した以外は、実施例1と同様にインプリント材料PNI-B11を調製した。 <Comparative Example 11>
An imprint material PNI-B11 was prepared in the same manner as in Example 1 except that A-400 in Example 15 was changed to NPGDA.
実施例16のA-400をNPGDAに変更した以外は、実施例1と同様にインプリント材料PNI-B12を調製した。 <Comparative Example 12>
An imprint material PNI-B12 was prepared in the same manner as in Example 1 except that A-400 in Example 16 was changed to NPGDA.
実施例17のA-400をNPGDAに変更した以外は、実施例1と同様にインプリント材料PNI-B13を調製した。 <Comparative Example 13>
An imprint material PNI-B13 was prepared in the same manner as in Example 1 except that A-400 in Example 17 was changed to NPGDA.
インプリント装置は、NM-0801HB(明昌機構株式会社製)を使用した。実施例1乃至実施例18並びに比較例1乃至比較例13で調製したインプリント材料から作製した各光インプリント用膜をパターニング試験した。用いたモールドはシリコン製であり、パターンは100nmのラインアンドスペースパターン(以下、本明細書では「L/S」と略称する。)及び直径100nmのドットパターン(以下、本明細書では「Dot」と略称する。)の2種類を使用した。モールドは事前にオプツール(登録商標)HD(ダイキン工業株式会社製)に浸漬し、温度が90℃、湿度が90RH%の高温高湿装置を用いて1時間処理し、純水でリンス後、エアーで乾燥させたものを使用した。 [Optical imprint]
As the imprint apparatus, NM-0801HB (manufactured by Myeongchang Organization) was used. Each film for optical imprinting produced from the imprinting materials prepared in Examples 1 to 18 and Comparative Examples 1 to 13 was subjected to a patterning test. The mold used was made of silicon, and the pattern was a 100 nm line and space pattern (hereinafter abbreviated as “L / S” in the present specification) and a dot pattern with a diameter of 100 nm (hereinafter referred to as “Dot” in the present specification). The two types are used. The mold is immersed in Optool (registered trademark) HD (manufactured by Daikin Industries, Ltd.) in advance, treated for 1 hour using a high-temperature and high-humidity device with a temperature of 90 ° C and a humidity of 90RH%, rinsed with pure water, and then air What was dried with was used.
試験機は大栄精機(有)製を使用し、♯0000のスチールウールを使用した。荷重は82gとし、そのスチールウールを10往復させた。
擦傷後の傷本数について以下のように示した結果を表1に示す。
0~5本:A
6~10本:B
11~20本:C
21~30本:D
31~40本:E
41本以上:F [Steel wool scratch test]
The test machine used was made by Daiei Seiki Co., Ltd., and # 0000 steel wool was used. The load was 82 g and the steel wool was reciprocated 10 times.
Table 1 shows the results of the number of scratches after abrasion as follows.
0-5: A
6-10: B
11-20: C
21-30: D
31 to 40: E
41 or more: F
Claims (13)
- (A)成分:炭素原子数2または3のアルキレンオキサイドユニットを有し且つ重合性基を少なくとも2つ有する化合物、及び
(B)成分:光重合開始剤を含み、
前記重合性基はアクリロイルオキシ基、アクリロイル基、メタアクリロイルオキシ基及びメタアクリロイル基からなる群から選ばれる少なくとも1種であるインプリント材料。 (A) component: a compound having an alkylene oxide unit having 2 or 3 carbon atoms and having at least two polymerizable groups, and (B) component: containing a photopolymerization initiator,
The imprint material, wherein the polymerizable group is at least one selected from the group consisting of an acryloyloxy group, an acryloyl group, a methacryloyloxy group, and a methacryloyl group. - 前記(A)成分の分子量に対する前記(A)成分中のアルキレンオキサイドユニットの分子量の割合が7%以上80%以下である請求項1に記載のインプリント材料。 The imprint material according to claim 1, wherein a ratio of a molecular weight of the alkylene oxide unit in the component (A) to a molecular weight of the component (A) is 7% or more and 80% or less.
- 前記(A)成分のほかに、(A´)成分として重合性基を少なくとも2つ有し且つ炭素原子数2または3のアルキレンオキサイドユニットを有さない化合物を更に含有する、請求項1に記載のインプリント材料。 In addition to the component (A), the component (A ') further contains a compound having at least two polymerizable groups and not having an alkylene oxide unit having 2 or 3 carbon atoms. Imprint material.
- 前記(A´)成分と(A)成分の合計100質量部に対する前記(A)成分の割合は10質量部以上100質量部未満である、請求項3に記載のインプリント材料。 The imprint material according to claim 3, wherein a ratio of the component (A) to a total of 100 parts by mass of the component (A ′) and the component (A) is 10 parts by mass or more and less than 100 parts by mass.
- (C)成分として界面活性剤を更に含有する、請求項1乃至請求項4のいずれか一項に記載のインプリント材料。 The imprint material according to any one of claims 1 to 4, further comprising a surfactant as a component (C).
- (D)成分として溶剤を更に含有する、請求項1乃至請求項5のいずれか一項に記載のインプリント材料。 The imprint material according to any one of claims 1 to 5, further comprising a solvent as the component (D).
- 請求項1乃至請求項6のいずれか一項に記載のインプリント材料から作製され、パターンが転写された膜。 A film produced from the imprint material according to any one of claims 1 to 6 and having a pattern transferred thereon.
- 請求項7に記載のパターンが転写された膜を基材上に備えた光学部材。 An optical member provided on a substrate with a film to which the pattern according to claim 7 is transferred.
- 請求項7に記載のパターンが転写された膜を基材上に備えた固体撮像装置。 A solid-state imaging device comprising a film on which a pattern according to claim 7 is transferred on a substrate.
- 請求項7に記載のパターンが転写された膜を基材上に備えたLEDデバイス。 An LED device comprising a film on which a pattern according to claim 7 is transferred on a substrate.
- 請求項7に記載のパターンが転写された膜を基材上に備えた太陽電池。 A solar cell comprising a film on which a pattern according to claim 7 is transferred on a substrate.
- 請求項7に記載のパターンが転写された膜を基材上に備えたディスプレイ。 A display comprising a film on which a pattern according to claim 7 is transferred on a substrate.
- 請求項7に記載のパターンが転写された膜を基材上に備えた電子デバイス。 An electronic device comprising a film on which a pattern according to claim 7 is transferred on a substrate.
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JP2012511640A JP6015937B2 (en) | 2010-04-19 | 2011-04-15 | High scratch-resistant imprint material |
CN201180030040.5A CN102939640B (en) | 2010-04-19 | 2011-04-15 | High marresistance impression materials |
KR1020127030057A KR101852537B1 (en) | 2010-04-19 | 2011-04-15 | Highly abrasion-resistant imprint material |
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JP2014072238A (en) * | 2012-09-27 | 2014-04-21 | Nissan Chem Ind Ltd | Imprint material |
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JP2016199617A (en) * | 2015-04-07 | 2016-12-01 | 日本合成化学工業株式会社 | Photocurable composition |
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WO2018030351A1 (en) * | 2016-08-10 | 2018-02-15 | 日産化学工業株式会社 | Imprint material |
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CN102939640A (en) | 2013-02-20 |
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JP6319596B2 (en) | 2018-05-09 |
TW201302819A (en) | 2013-01-16 |
TWI565721B (en) | 2017-01-11 |
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KR20130054960A (en) | 2013-05-27 |
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