WO2011129560A3 - 유체공급장치 - Google Patents

유체공급장치 Download PDF

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Publication number
WO2011129560A3
WO2011129560A3 PCT/KR2011/002511 KR2011002511W WO2011129560A3 WO 2011129560 A3 WO2011129560 A3 WO 2011129560A3 KR 2011002511 W KR2011002511 W KR 2011002511W WO 2011129560 A3 WO2011129560 A3 WO 2011129560A3
Authority
WO
WIPO (PCT)
Prior art keywords
inner container
fluid
manufacturing system
connection unit
connection device
Prior art date
Application number
PCT/KR2011/002511
Other languages
English (en)
French (fr)
Other versions
WO2011129560A2 (ko
Inventor
이보영
Original Assignee
주식회사 엘디에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘디에스 filed Critical 주식회사 엘디에스
Priority to JP2013504809A priority Critical patent/JP5438243B2/ja
Priority to CN201180018944.6A priority patent/CN102844837B/zh
Publication of WO2011129560A2 publication Critical patent/WO2011129560A2/ko
Publication of WO2011129560A3 publication Critical patent/WO2011129560A3/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/047—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump supply being effected by follower in container, e.g. membrane or floating piston, or by deformation of container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/205—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30608—Anisotropic liquid etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities

Abstract

본 발명은 제조시스템에서 사용될 유체를 저장하기 위한 내부용기, 내측에 상기 내부용기가 위치되는 외부용기, 및 상기 내부용기에 저장된 유체를 제조시스템에 공급하기 위한 제1연결유닛이 설치되고 상기 외부용기에 결합되는 연결부를 포함하되, 상기 외부용기는 상기 연결부와 상기 내부용기가 연통되게 연결되기 위한 통로기구를 포함하고, 제조시스템에 유체를 공급할 때 상기 통로기구가 중력 방향 쪽을 향하도록 제조시스템에 구비된 설치면을 향하게 설치되는 유체공급장치에 관한 것으로, 본 발명에 따르면, 제조시스템에 유체를 공급하는 작업 후 내부용기에 남아있는 유체의 잔량을 줄임으로써 재료비 손실 등을 줄일 수 있고, 일회성 소모품인 딥튜브 구성을 생략함으로써 작업의 편의성과 작업의 안정성을 향상시키는 동시에 제조단가 및 유지 비용을 절감할 수 있다.
PCT/KR2011/002511 2010-04-12 2011-04-11 유체공급장치 WO2011129560A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013504809A JP5438243B2 (ja) 2010-04-12 2011-04-11 流体供給装置
CN201180018944.6A CN102844837B (zh) 2010-04-12 2011-04-11 流体供给装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0033284 2010-04-12
KR1020100033284A KR100973707B1 (ko) 2010-04-12 2010-04-12 유체공급장치

Publications (2)

Publication Number Publication Date
WO2011129560A2 WO2011129560A2 (ko) 2011-10-20
WO2011129560A3 true WO2011129560A3 (ko) 2012-03-08

Family

ID=42759241

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/002511 WO2011129560A2 (ko) 2010-04-12 2011-04-11 유체공급장치

Country Status (4)

Country Link
JP (1) JP5438243B2 (ko)
KR (1) KR100973707B1 (ko)
CN (1) CN102844837B (ko)
WO (1) WO2011129560A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103496513A (zh) * 2013-10-09 2014-01-08 上海和辉光电有限公司 光刻胶内袋
CN105829214B (zh) 2013-10-18 2019-01-08 恩特格里斯公司 汲取管组件及其制造方法
US10245609B2 (en) 2013-11-26 2019-04-02 Entegris, Inc. Fitment and fitment adapter for dispensing systems and methods for manufacturing same
EP3206969A4 (en) 2014-10-17 2018-05-30 Entegris, Inc. Packaging for dip tubes

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08310573A (ja) * 1995-05-18 1996-11-26 Toshiba Mach Co Ltd 圧力容器
JP2000314499A (ja) * 1999-04-30 2000-11-14 Iwatani Internatl Corp ガス貯蔵ボンベの内面処理方法
JP2002120893A (ja) * 2000-10-16 2002-04-23 Brain Five:Kk 給液用容器
KR20060119290A (ko) * 2005-05-19 2006-11-24 김승수 다중벽으로 다중공간을 구비한 압력유체 저장용기,저장방법 및 그 제조방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6237891B1 (en) * 1999-09-08 2001-05-29 Burnswick Corporation Adaptor for use of alternate gas fuel
CN101208255B (zh) * 2005-04-25 2013-03-06 高级技术材料公司 用于物质储存和分配的包装及方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08310573A (ja) * 1995-05-18 1996-11-26 Toshiba Mach Co Ltd 圧力容器
JP2000314499A (ja) * 1999-04-30 2000-11-14 Iwatani Internatl Corp ガス貯蔵ボンベの内面処理方法
JP2002120893A (ja) * 2000-10-16 2002-04-23 Brain Five:Kk 給液用容器
KR20060119290A (ko) * 2005-05-19 2006-11-24 김승수 다중벽으로 다중공간을 구비한 압력유체 저장용기,저장방법 및 그 제조방법

Also Published As

Publication number Publication date
KR100973707B1 (ko) 2010-08-04
JP2013523553A (ja) 2013-06-17
CN102844837B (zh) 2014-04-16
JP5438243B2 (ja) 2014-03-12
CN102844837A (zh) 2012-12-26
WO2011129560A2 (ko) 2011-10-20

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