WO2011126292A3 - Cnt 대전 방지 처리된 작업 스테이지의 수선 방법 - Google Patents
Cnt 대전 방지 처리된 작업 스테이지의 수선 방법 Download PDFInfo
- Publication number
- WO2011126292A3 WO2011126292A3 PCT/KR2011/002397 KR2011002397W WO2011126292A3 WO 2011126292 A3 WO2011126292 A3 WO 2011126292A3 KR 2011002397 W KR2011002397 W KR 2011002397W WO 2011126292 A3 WO2011126292 A3 WO 2011126292A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cnt
- antistatic
- working stage
- repairing
- specific part
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/005—Repairing damaged coatings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
Abstract
본 발명은 CNT대전 방지 처리된 작업 스테이지의 수선 방법을 제공한다. 본 발명의 CNT대전 방지 처리된 작업 스테이지의 수선 방법은, 세척 단계와, 예열 단계와, 코팅 단계와, 열경화 단계를 포함한다. 세척 단계는 작업스테이지 중 수선이 필요한 특정 부위를 세척한다. 예열 단계는 상기 특정 부위를 예열한다. 코팅 단계는 상기 특정 부위에 탄소나노튜브가 함유된 리페어 용액을 코팅한다. 열경화 단계는 상기 리페어 용액이 코팅된 특정 부위를 열경화시킨다. 본 발명에 따르면 현장에서 신속하고, 간편하게 CNT 대전방지 처리된 작업 스테이지를 리페어 할 수 있다.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0031220 | 2010-04-06 | ||
KR1020100031220A KR101171316B1 (ko) | 2010-04-06 | 2010-04-06 | 씨엔티대전 방지 처리된 작업 스테이지의 수선 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011126292A2 WO2011126292A2 (ko) | 2011-10-13 |
WO2011126292A3 true WO2011126292A3 (ko) | 2012-03-08 |
Family
ID=44763397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/002397 WO2011126292A2 (ko) | 2010-04-06 | 2011-04-06 | Cnt 대전 방지 처리된 작업 스테이지의 수선 방법 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101171316B1 (ko) |
WO (1) | WO2011126292A2 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101381864B1 (ko) * | 2012-06-11 | 2014-04-24 | (주)탑나노시스 | 탄소나노튜브 코팅막 및 상기 탄소나노튜브 코팅막을 형성하는 탄소나노튜브 용액 조성물 |
KR102231786B1 (ko) | 2018-12-19 | 2021-03-25 | (주)탑나노시스 | 손상된 작업스테이지 보수용 용액 조성물, 상기 보수용 용액 조성물을 이용한 손상된 작업스테이지 보수 방법 |
KR102261935B1 (ko) | 2019-09-25 | 2021-06-07 | (주)탑나노시스 | 작업 스테이지 수선 방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030047036A (ko) * | 2001-12-07 | 2003-06-18 | 주식회사 코미코 | 플라즈마 스프레이 방식을 이용한 세라믹 반도체 부품의제조 및 재생 방법 |
KR20070040300A (ko) * | 2005-10-11 | 2007-04-16 | 미쓰비시덴키 가부시키가이샤 | 소자기판의 제조 방법 및 기판 지지장치 |
US20070190799A1 (en) * | 2005-01-18 | 2007-08-16 | Applied Materials, Inc. | Refurbishing a wafer having a low-k dielectric layer |
US20080024742A1 (en) * | 2006-07-26 | 2008-01-31 | Tadahiro Ohmi | Substrate stage and heat treatment apparatus |
US20090034149A1 (en) * | 2007-07-31 | 2009-02-05 | Applied Materials, Inc. | Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003083783A (ja) | 2001-09-10 | 2003-03-19 | Advance Denki Kogyo Kk | フローモニター |
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2010
- 2010-04-06 KR KR1020100031220A patent/KR101171316B1/ko active IP Right Grant
-
2011
- 2011-04-06 WO PCT/KR2011/002397 patent/WO2011126292A2/ko active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030047036A (ko) * | 2001-12-07 | 2003-06-18 | 주식회사 코미코 | 플라즈마 스프레이 방식을 이용한 세라믹 반도체 부품의제조 및 재생 방법 |
US20070190799A1 (en) * | 2005-01-18 | 2007-08-16 | Applied Materials, Inc. | Refurbishing a wafer having a low-k dielectric layer |
KR20070040300A (ko) * | 2005-10-11 | 2007-04-16 | 미쓰비시덴키 가부시키가이샤 | 소자기판의 제조 방법 및 기판 지지장치 |
US20080024742A1 (en) * | 2006-07-26 | 2008-01-31 | Tadahiro Ohmi | Substrate stage and heat treatment apparatus |
US20090034149A1 (en) * | 2007-07-31 | 2009-02-05 | Applied Materials, Inc. | Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing |
Also Published As
Publication number | Publication date |
---|---|
KR20110111904A (ko) | 2011-10-12 |
WO2011126292A2 (ko) | 2011-10-13 |
KR101171316B1 (ko) | 2012-08-10 |
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