Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
  • F21K9/20—Light sources comprising attachment means
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V19/00—Fastening of light sources or lamp holders
  • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
  • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
  • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
  • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2115/00—Light-generating elements of semiconductor light sources
  • F21Y2115/10—Light-emitting diodes [LED]

Definitions

• the invention relates to a lighting device for uniform illumination of curved, non-planar or polyhedral surfaces, comprising a plurality of planar chip-on-board LED modules, which are arranged adjacent to each other at least in pairs, wherein each chip-on-board LED module Comprising a plurality of light emitting LEDs.
• the invention further relates to a lighting unit and a use.
• sewer rehabilitation where it is known to provide the inside of pipes or hoses with a photohardenable coating or substance in the form of a hose.
• hose liner a resin-impregnated glass fiber fabric with protective plastic films on the outer surfaces of a channel seeding a lamp is forced through the tube or pipe through to progressively dry the coating material by means of intensive lighting sections
• Corresponding lamp systems are ideally bendable for bends up to 90 °, typical diameters of coated tubes and hoses are in the range of a few centimeters to several meters.
• Typical homogeneity tolerances for illumination are in the range of less than ⁇ 15% with respect to a defined mean.
• the irradiances on an illuminated inner wall are for this application a few ⁇ / cm 2 up to 100 W / cm 2 .
• CONFIRMATION OPIE In order to achieve a high light output, corresponding known lamp systems are provided with a diameter which is only a few millimeters below the pipe inside diameter for which they are designed. The lamp can also be up to a few meters from the surface to be irradiated.
• gas discharge lamps which provide an intense light output.
• the traditionally used lamps based on gas discharge develop a strong heat radiation or infrared radiation, which heats the object and the coating to be cured if the lamp is too close to the object to be illuminated or if the irradiation is too long.
• the polymers to be crosslinked can dissociate.
• the liner material to be hardened can thus be thermally damaged.
• the known lamps are particularly suitable for larger pipe diameters, but due to their size less for smaller pipe diameters, as they occur, for example, in the service area, with typical pipe diameters corresponding to 160 mm nominal diameter or smaller.
• no gas discharge lamp systems are available, which can be towed by arcs with 45 ° angles or 90 ° angles.
• the traditional UV lamp technology is limited by the achievable minimum size of the lamps.
• a further limitation in this respect is also due to the need for a mechanically robust support and protection device for the lamps, which usually consist of a substance filled glass sheath in which the gas discharge between two opposing electrodes or by an electrodeless excitation with Microwave takes place.
• a mechanically robust support and protection device for the lamps usually consist of a substance filled glass sheath in which the gas discharge between two opposing electrodes or by an electrodeless excitation with Microwave takes place.
• a mechanically robust holder or protective device for example in the form of metal rods surrounding the lamp, shadowing of the emitted radiation is to be accepted.
• the present invention is therefore based on the object to provide a lighting device for uniform illumination of curved, non-planar or polyhedral surfaces available for compact hollow body or body of typical inner diameters or outer diameters in the range of a few millimeters up to several meters applicable and irradiances on the illuminated inner and outer walls in the range of some 10 pW / cm 2 to 100 W / cm 2 allow.
• the lighting device should be usable in particular for the sewer rehabilitation.
• a lighting device for uniformly illuminating curved, non-planar or polyhedral surfaces comprising a plurality of planar chip-on-board LED modules, which are arranged at least in pairs adjacent to one another, wherein each chip-on-board LED Module has a plurality of light-emitting LEDs, which is further developed in that at least one pair of respectively adjacent chip-on-board LED modules are arranged with respect to their surface normal at an angle which is greater than 0 °.
• the invention is based on the use of LEDs, ie light-emitting diodes, which are processed in a chip-on-board construction technology, also abbreviated as "COB."
• a chip-on-board LED module is used in the context of the present invention a unit comprising a planar substrate and unwound LED chips applied thereon in COB technology and, if appropriate, corresponding conductor tracks, whereby one or more unshaken LED chips with a typical edge length of a few 100 ⁇ m up to a few millimeters are set up on an adapted substrate , which offers good opportunities for the comprehensive fulfillment of the described task.
• COB technology is a flexible construction technology that allows the use of various construction and connection materials.
• thermally highly conductive materials such as metal core PCBs, metal, ceramic and silicon substrates can be used to build high-performance LED lamps, but also cost-effective FR4 circuit boards or substrates required for certain special applications such as glass or plastic. Therefore, COB technology offers great scope for cost and performance optimization.
• SMT technology applicable with less technical effort, ie the "surface-mounted" technology, in which one or typically up to four LED chips in a single housing are usually applied by soldering to a printed circuit board, The more complex chip-on-board technology from a production point of view also offers advantages for this task.
• the small size of the untempered LED chips and the greater flexibility of the possible arrangement of the chips on the substrate allow a good adaptation to the geometry of the curved, polyhedral non-planar surface to be illuminated and, in particular, excellent optimization possibilities of the illumination device with regard to a high homogeneity of the illumination to be irradiated surface.
• the arrangement of the LED chips on the possible substrates can be adapted to the selected task. For this purpose, the known radiation properties and performance of the LEDs to achieve the desired irradiance and homogeneity tolerances must be considered.
• LEDs are known for their mechanical robustness against shocks, the possibility of realizing high lifetimes and the good tunability of the emission wavelength by suitable selection of the LEDs as well as for surface radiators typi ⁇ rule and easy to use or influenced Lambert'schen radiation pattern.
• the gaps between the luminous Z are entren so small that a very uniform light output due to good overlap of Beam of adjacent LEDs already at a small distance above the LEDs, for example, at a distance of only 100 ⁇ ⁇ , is realized.
• the light generation can be connected by means of LEDs with a very low heat generation.
• high densities of up to several tens W / cm 2 can be achieved by the possibility of dense packing of LEDs.
• the mechanical robustness of the LEDs is also an advantage over fragile and shock-sensitive gas discharge and incandescent lamps.
• the electrical operating mode of the LEDs can be optimized for the application and in terms of optical output power, wavelength stability, thermal aspects of the LEDs, structures and the life of the LEDs.
• LEDs can be operated, for example, continuously, in pulse width modulation or in constant charge technology, wherein the available parameters, such as operating current, pulse duration, pulse pattern, pulse amplitude can be adapted to the application and optimized.
• Very compact, high-performance lighting devices with small diameters in the range of a few millimeters up to a few meters can be realized, so that small and large bodies can be strongly illuminated. In the application, this means the possibility of realizing a high-performance arc-running lamp for the rehabilitation of pipes with internal or nominal diameter also from 80 mm to 300 mm in the house connection area.
• the use of the technology for larger pipe diameters possible because the system allows high power and the geometric size is combinatorial cost.
• LEDs can be realized in the spectral range from 220 nm to over 4500 nm with a targeted emission wavelength. Therefore, lighting devices can be realized with a well-defined emission wavelength. In the field of analytical or industrial applications, the wavelength can thus be tailored to the process and optimized. In addition, LEDs of different wavelengths can be used to realize or imitate certain emission spectra as so-called "multi-wavelength lamps".
• LEDs emit narrowband with typical bandwidths of tens of nanometers. Since ⁇ through process or safety sensitive spectral regions can be avoided, such as zellirritierende UV-A, UV-B and UV-C emissions for curing upon application of wavelengths longer than 400 nm, for example pipe liner applications at 430 nm, or infrared radiation in the UV curing with LEDs that provide temperature-sensitive objects. For example, damage from plastics. This is an advantage over medium and high pressure gas discharge lamps which emit spectrally broadband. The spectrally narrowband emission also allows wavelength optimization to the process window of wavelength sensitivity. This increases the energy efficiency compared to broadband light sources, which emit energy in spectral areas that are undesirable or do not contribute to the desired process.
• ⁇ through process or safety sensitive spectral regions can be avoided, such as zellirritierende UV-A, UV-B and UV-C emissions for curing upon application of wavelengths longer than 400 nm, for example pipe liner applications at 430 nm, or infrared
• the temperature of the device remains in a range of less than 60 ° C, so that there is no risk of burns to human tissue.
• LEDs can be operated in demanding environments, possibly with the realization of adapted housing technologies of the lamp, for example under high pressures, low pressure atmospheres, under moisture, in water, in dusty environments, in vibrating machines or under high acceleration. They are faster to switch than traditional lamps. Its full output power is reached in microseconds. This eliminates the need to use mechanical shutters in applications associated with switching operations.
• LEDs in the UV spectrum and in the spectrum of visible light are mercury-free and environmentally friendly. They can therefore be used in critical environments such as in the food industry and drinking water supply. LEDs have lifetimes of more than 10,000 hours, surpassing most traditional bulbs, reducing maintenance costs.
• the chip-on-board LED modules according to the invention at least partially inclined to each other or are at least some adjacent each chip-on-board LED modules with respect to their surface normal arranged at an angle greater than 0 °.
• the set geometry should match the geometry of the surface to be illuminated as well as possible. From a production point of view, a compromise has been found with regard to the number and dimensioning of the chip-on-board LED modules.
• the surfaces to be illuminated may also have combinations of curved and flat surfaces or, like polyhedral surfaces, may not be evenly planar. In the case of larger planar partial surfaces, preferably two or more of the chip-on-board LED modules can be arranged without inclination to one another.
• the advantage of COB technology over SMT technology is that more LEDs per unit area of substrate can be assembled to provide the required power densities.
• the distance to be maintained for a homogeneous light distribution in SMT technology is greater because of the housing size of a few millimeters, because about 75% of the emitted light of a flat LED are emitted in a cone of 120 ° opening angle. Only when the light cones of adjacent LEDs overlap sufficiently and the substrate surface equipped with LEDs is sufficiently expanded, uniform irradiation of the surface to be illuminated is achieved.
• the minimum spacing of adjacent LEDs is also about 5-10 mm (chip-to-chip).
• the COB technology allows for minimum chip spacings of a few tens of microns, so that the light cones of adjacent LEDs overlap well even at a comparable distance, so that no dark spots arise on the object.
• the lighting device according to the invention consists in that the chip-on-board LED modules result in a longitudinally extending lighting device which has an irregular or regular polygonal cross-section along its longitudinal extent at least in sections or in a regular or irregular polyhedral shape, in particular to a Platonic or Archimedean body, are arranged.
• These mentioned geometries of LEDs in COB technology allow the homogeneous illumination and illumination of radially symmetric convex hollow bodies or bodies while avoiding technically complex and expensive complex optics. They are particularly easy to produce even with flat substrates and allow a very homogeneous luminous intensity distribution.
• the elongate shape with a polygonal cross section is particularly suitable for applications in which the inside of a hose or a pipe or the outside of a pipe or a hose is provided with a coating to be cured.
• the polyhedral shape that is not extending longitudinally, is particularly suitable for non along ⁇ extended cavities or body.
• This construction principle can also be used for bodies with low radial symmetry and for bodies which are not completely radiatively symmetrical, for example half-bodies.
• the bodies to be illuminated are not convex, but concave or predominantly convex or concave, and have a structure protruding from the regular body, for example the cross-sectional geometry of a half-tube Star shape, a rectangular cut in a square tube or similar.
• the light source can be adapted to the geometry of the hollow body or body to be illuminated and, if necessary, fill the interior of the hollow body almost completely or be almost completely filled by the body to be illuminated.
• This geometric fit includes both chip size and geometry selection, die placement with respect to position, and die alignment.
• staggered chip arrangements of adjacent lines are provided for shadow-free continuous processes, grid-like or hexagonal packaging structures.
• Further adaptation variables are the size, geometry and arrangement of the substrates as well as the geometry of a body on which the substrates are positioned.
• the lighting device when the shape of the lighting device is flexible, the lighting device is adaptable to different or varying shapes of surfaces to be illuminated.
• the LEDs of the chip-on-board LED modules are arranged facing outward or into a cavity of the lighting device.
• At least two chip-on-board LED modules are connected to a common heat sink, which is in particular connectable or connected to a cooling circuit. Thermal power losses are thus led away from the LED chip by the chip-on-board LED modules are connected to a heat sink. This is done with the help of a thermal grease or by gluing, soldering or sintering.
• This heat sink can serve as a lamp body and use different cooling mechanisms. Common mechanisms are convection cooling, air cooling, water cooling and evaporative cooling. The mechanism to be used can be optimized for the application, taking into account cost aspects, cooling efficiency, cooling capacity, applicability of the supply and cooling media and the space required for the application.
• LEDs have an efficiency of up to several tens of percent and should not exceed certain limit temperatures during operation, the higher packing densities achieved with COB technology require higher cooling capacities of the heat sink. Since the cooling capacity of a heat sink is favored by a larger volume, the largest possible cross sections of these heat sinks are desired. For this reason too, the distance to the inner surface of the hollow body to be illuminated should be small. In this context, dense-packed LEDs assembled in COB technology allow a more homogeneous illumination than, for example, LEDs assembled in SMT technology.
• the occupation of a chip-on-board LED module varies depending on the location with LEDs, in particular decreases towards the edge region of the chip-on-board LED module or increases. In this density variation, no optics is needed to homogenize the radiation distribution at the edge between two chip-on-board LED modules.
• LEDs are arranged on a chip-on-board LED module up to an edge of the chip-on-board LED module, ie to the limit of the substrate. This minimizes the gap between the LED chips on either side of the boundary and maximizes the overlap of emission cones.
• the COB technology allows the COB technology that individual LEDs or groups of LEDs Grup ⁇ a chip-on-board LED module are separately supplied with current.
• the groups preferably consist of a number of LEDs, which corresponds to a square number, ie 4, 9, 16, 25, 36, 49, 64, ...
• the LEDs of a lighting device can be connected individually or in groups such that the light sources can be operated at low voltages. This measure offers a high handling safety, especially in humid environments. It is particularly preferred if separately power-supplyable groups of LEDs of the chip-on-board LED module are arranged in rows, semi-surfaces or quadrants of the chip-on-board LED module.
• the LEDs of a chip-on-board LED module are preferably at least partially covered by an optically transparent or diffuse material or cast in an optically transparent or diffused material.
• the LEDs can be encapsulated with a silicone, epoxy or polyurethane material to protect against mechanical stress, water, dust and for electrical and thermal insulation.
• LEDs can be protected by transparent or opaque and diffuse glasses, for example Borsi ⁇ LIKAT, float glass or quartz glass.
• a diffuse material is understood to mean a milky transparent material. Both protection techniques can be applied to individual LEDs as well as to LED groups.
• lateral boundaries for the overlapping material or housings for the potting material are optically transparent and / or have a height above a surface of the LEDs that does not exceed a distance between adjacent LEDs. This measure also ensures that shading by a housing, especially at the interfaces are kept to a minimum.
• a transparent or opaque or diffused material is used as a dam or frame to promote the overlap of the radiation fields of the edge LEDs of two substrates.
• a chip-on-board LED module has at least one imaging and / or non-imaging primary optical and / or secondary optical element, in particular at least one optical element from the group of reflectors, the lenses and the Fresnel lenses.
• the lighting device preferably comprises at least one sensor, in particular at least one sensor from the group of photosensors, the temperature sensors, the pressure sensors, the motion sensors, the voltage sensors, the current sensors and the magnetic field sensors, which detect an operating status of the lighting device. It can thus be placed on the LED substrate or at other locations in the lighting device sensors, which avoid the operating status of the lighting device.
• Feedback mechanisms can be used to actively affect process-related quantities, e.g. on the operating current, the driving of certain LEDs or groups, the cooling circuit, the lamp shape, the movement of the lamp or a lit object, the temperature of the object to optimize the process flow and the result. Likewise, tolerances or degradation processes can be compensated.
• the object underlying the invention is also achieved by a lighting unit, comprising a control device, a connecting line and at least one lighting device according to the invention as described above, as well as by using a lighting device described above for illuminating at least partially convex hollow bodies, in particular for drying, Curing and / or exposing light-reactive paints, adhesives and resins, in particular a tubular liner.
• the lighting device according to the invention and use offer, for example, in the field of sewer and pipe rehabilitation the advantage of high radiation intensities with high homogeneity of the radiation distribution and at the same time good bowing in 90 ° - bends of small pipes.
• Multiple chip-on-board LED modules can be flexibly coupled together and pulled through a tube to deliver the necessary dose of radiation to cure a light-reactive coating while allowing sufficient drag speed.
• 1 is a schematic representation of a chip-on-board LED oduls
• Fig. 2 is a schematic representation of two tilted against each other arranged
• FIG. 3 is a schematic representation of an encapsulated chip-on-board LED module
• FIG. 4 is a schematic representation of another encapsulated chip-on-board LED module
• FIG. 5 various possible geometries of bodies and lighting devices according to the invention in a schematic representation
• FIG. 6 various further possible geometries of bodies and lighting devices according to the invention in a schematic representation
• FIG. 8 is a schematic cross-sectional view through a lighting device according to the invention.
• FIG. 9 shows different drive options of LEDs in a chip-on-board LED module
• FIG. 10 is a schematic cross-sectional view through a further lighting device according to the invention
• Fig. 11 is a schematic representation of a lighting device according to the invention
• FIG. 12 shows a representation of the homogeneity of the radiation distribution of a lighting device according to the invention.
• a chip-on-board LED module 1 is shown schematically in cross-section, in which on two parallel substrates 2, 2 'conductor tracks 3, 3' and LED chips 4, 4 'are arranged at regular intervals ,
• a substrate 2, 2 ' may be, for example, a metal core board, a ceramic substrate or an FR4 substrate, which may be constructed in rigid, semi-flexible or flexible substrate technology.
• FIG. 1 not all recurring elements of FIG. 1 are provided with reference numerals, but these relate to all similar elements.
• LEDs are approximately Lambertian emitters, which radiate about 75% of the total radiated light output within an opening angle of 120 °.
• a good overlap of the emission cones 5, 5 'at the boundaries of adjacent LED chips 4, 4', is already given at intervals of the order of the chip spacings, also called "pitch", so that no significant intensity modulations along the row of LEDs This is due to the fact that the intensity minima and maxima above the row are averaged out by a good overlap of the emission cones 5, 5 'of adjacent LED chips 4, 4' as well as LED chips of the wider environment become.
• FIG. 2 shows two chip-on-board LED modules 11, 11 'with mutually inclined substrates 12, 12 in cross-section, each having a plurality of interconnects 13, 13' and LED chips 14, 14 'with emissi onskegeln 15, 15 'have. They collide at a joint 16. It turns out that a good overlap of the emission cone 15, 15 'at the joint 16 even with mutually inclined chip-on-board LED modules 1 1, 11' can be realized, as well as in the region 16 of the joint 17 with weaker illumination is limited only very locally.
• the geometry of the chip-on-board LED modules 11, 11 ' can be adapted to the geometry of a surface to be illuminated or illuminated homogeneously.
• FIG. 3 schematically illustrates in cross-section a chip-on-board LED module 21 in which the LED chips 24 are protected on tracks 23 on a substrate 22 by a glass cover 25 which is shown with wave filling.
• a gap 27 may include air, an inert gas, liquids, such as water or an oil, or a gel, such as a silicone gel, and may also be hermetically sealed from the environment, if necessary. Laterally, this enclosure is bounded by edges 26, 26 ', on which the glass cover 25 is applied. Both the glass lid 25 and the edges 26, 26 'are made of a transparent or at least milky transparent material.
• a chip-on-board LED module 31 with a substrate 32, conductor tracks 33 and LED chips 34 is shown schematically in cross-section, in which the LED chips 34 are cast by a transparent potting material 35 are protected.
• the marked with a wave pattern made trans ⁇ parente potting material 35 comprises, for example a silicone, acrylate or urethane material.
• the frame or the housing 36, 36 ' can also be transparent, not transparent, milky transparent or even opaque.
• the illumination device 40 according to the invention shown in FIG. 5a) comprises eight chip-on-board LED modules 41 arranged in the form of a regular octagonal polygon and is arranged inside a hollow body 42 with a circular cross section. The inner surface of the hollow body 42 is illuminated as homogeneously.
• Fig. 5b shows a likewise octagonal lighting device according to the invention 40 'with chip-on-board LED modules 41', which is disposed within a hollow body 42 'with a likewise mountains- angular geometry.
• the edges of the octagons are shifted relative to one another such that the optionally slightly weaker corner points of the illumination device 41 'are opposed to the surface centers of the hollow body 42'. In this way, the more distant corner regions of the hollow body 42 'are well illuminated.
• 6a) to 6c) are based on bodies 47, 47 ', 47 “, lighting devices 45, 45', 45” and chip-on-board LED modules 46, 46 ', 46 “to Figs .) to 5c) komplementä ⁇ ren situations 5a.
• the body 47, 47 ', 47 "to be irradiated from the outside, and the lighting devices 45, 45', 45” are of a hollow body formed, the chip-on-board LED modules 46, 46 ', 46' in the cavities into which there arranged body 47, 47 ', 47 "irradiate.
• FIG. 7a) to 7c) show, in a diagrammatic cross-sectional view, three examples of non-symmetrical geometries of bodies 52, 52 ', 52 "to be illuminated or illuminated.
• FIG. 7a) a half-round tube 52 is shown with a flat side 53, in which a lighting device 50 according to the invention is arranged with chip-on-board LED modules 51, one of which as a planar luminous surface 54 opposite the plane side 53 of the half tube 52 is arranged.
• Fig. 7b it is clear that by adjusting the geometry of the lighting device 50 'and the arrangement of its chip-on-board LED modules 51' to the shape of the body to be irradiated 52 'a homogeneous illumination of the entire surface to be irradiated is possible.
• it is a tube with a recess 56, which is opposed to a recess 55 in the lighting device 50 '.
• the body 52 '' is elliptical in cross-section
• Fig. 8 shows in cross section a lighting device 60 according to the invention in detail.
• a heat sink 65 which has the cross-sectional shape of half a hexagon, three chip-on-board LED modules 61, 61 ', 61 "are arranged, each having a substrate 62, tracks 63 and LED chips 64.
• the sketch shows the possibility of varying the spacing of adjacent LED chips 65 on a substrate 63 given in the COB technology This additional degree of freedom allows further optimization of the homogeneity, in addition to the geometry adjustment of the illumination device shown in FIGS.
• FIGS. 9a) to 9d) schematically show the circuit 73-73 '' of LEDs 72 on a chip-on-board LED module 71-71 '' with which a homogeneous light output is achieved.
• the COB technology allows flexible selection in the wiring of LEDs 72 assembled on the substrates.
• the layout of the wiring on the substrate determines the wiring 73-73 "'of the LEDs 72 and is within the design specifications of the respective substrate technology the respective requirements for the lighting Device to choose.
• LEDs 72 can be individually connected and thus individually controlled. However, with a large number of LED chips 72 this is due to the large number of traces and supply lines i.d.R. not appropriate. Instead, LEDs are interconnected in arrays of combinations of series and parallel circuits. Smaller arrays offer a higher flexibility in the local tuning of the optical output power and thus an optimization possibility with regard to an improvement of the achievable homogeneity in the illumination or illumination of a body.
• FIG. 9a shows the case in which all the LEDs 72 of the chip-on-board LED module 71 are subjected to the same voltage in series and in parallel in a channel "Ch 1" Surface of the chip-on-board LED module 71.
• FIG. 9b shows the LEDs 72 of the chip-on-board LED module 71 'are divided into four quadrants 74-74' ' are. The luminosity can thus be set differently in each quadrant 74 - 74 "'in four channels” Ch 1 "to” Ch 4 ".
• the illumination device 80 comprises an octagonal heat sink 82 having a cavity 83 through which, for example, water flows circularly in the image plane.
• chip-on-board LED modules 81 1 - 81 8 are applied.
• the geometric arrangement of modules and the achievable by COB technology small distance between adjacent LED chips adjacent chip-on-board LED modules 81 1 - 81 8 allows a good overlap of the emission cone of the LEDs and thus at short intervals from the radiating Surface a good in environment running direction homogeneous radiation.
• the light source is surrounded by a cylindrical protective glass 84.
• the geometry of the illumination device 80 and the arrangement of the LEDs on the chip-on-board LED modules 81 1 - 81 8 is adapted to a cylindrical hollow body whose inner wall can be homogeneously irradiated by the source in their vicinity. Such a light source is needed eg in the sewer rehabilitation.
• FIG. 11 shows a modular construction of an exemplary lighting unit 90 according to the invention.
• the illumination unit 90 comprises four matched geometry lighting fixtures 93-93 "'of the invention, which may, for example, be formed like the illumination apparatus 80 in Fig. 10.
• the illumination apparatuses 93-93" include terminal units 94-94 "which are black boxes are shown on the lighting devices 93 - 93 '"at which supply lines 92 are connected to the lighting devices 93 - 93' '.
• a lighting device 93 - 93 "'comprises at least one substrate with one or more LEDs, which is applied to a body, which may be a heat sink.
• the cooling process may include convection cooling with gases, liquid cooling or conduction (line) cooling.
• the heat sink can be produced, for example, by means of milling, punching, cutting, folding, etching, eutectic bonding of metals, etc.
• the lighting devices can be incorporated into a housing.
• sensors for, for example, the temperature, illuminance, current intensity, voltage can be integrated in the lighting unit 90, which report the operating status to a control and supply unit 91 and enable an adjustment of the operating conditions.
• the terminal units 94-94 "'allow a modular extension with respect to the number of lighting devices 93-93", as well as an interchangeability for maintenance purposes.
• the illumination devices 93 - 93 "'can be coupled via rigid or flexible termination units 94 - 94" so that they are either rigidly aligned or flexibly by means of a protective tube, metal springs or the like, so that the light source is arcuate in a tube can be towed.
• FIG. 12 shows the result of a measurement of the radiation properties with respect to power and homogeneity of a lighting device according to the invention.
• the illumination device is an elongated, octagonal cross-section illumination device with chip-on-board LED modules distributed regularly in the circumferential direction. The measurement was carried out using a pipe with a pipe diameter of 14 cm, the distance between the lamp and the pipe inner wall being approximately 1.75 cm. Irradiance levels of up to> 1 W / cm 2 were achieved. The total number of LED chips on the lighting devices 93-93 "'exceeds 300.
• the coordinate system in Fig. 12 is a polar coordinate system.
• the angle running from 0 ° to 360 ° describes the circumferential direction of the measurement around the illumination device, the radial coordinate the intensity in arbitrary units.
• a luminous intensity 101 averaged over the circumference is shown in dashed lines, the actual measured values of the luminous intensity 100 are connected by solid lines.
• the measurement shows that the homogeneity of the lighting device in the direction of rotation with a pipe diameter of 14 cm can be better than ⁇ 5%.

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• Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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• 2010
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