WO2011123987A1 - Structure et procédé d'enfermement pour matériau de conversion de longueur d'onde de lumière, et led - Google Patents

Structure et procédé d'enfermement pour matériau de conversion de longueur d'onde de lumière, et led Download PDF

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Publication number
WO2011123987A1
WO2011123987A1 PCT/CN2010/000466 CN2010000466W WO2011123987A1 WO 2011123987 A1 WO2011123987 A1 WO 2011123987A1 CN 2010000466 W CN2010000466 W CN 2010000466W WO 2011123987 A1 WO2011123987 A1 WO 2011123987A1
Authority
WO
WIPO (PCT)
Prior art keywords
wavelength conversion
conversion material
light
air
filler
Prior art date
Application number
PCT/CN2010/000466
Other languages
English (en)
Chinese (zh)
Inventor
李屹
吴忠威
杨毅
Original Assignee
绎立锐光科技开发(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 绎立锐光科技开发(深圳)有限公司 filed Critical 绎立锐光科技开发(深圳)有限公司
Priority to PCT/CN2010/000466 priority Critical patent/WO2011123987A1/fr
Publication of WO2011123987A1 publication Critical patent/WO2011123987A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Definitions

  • the present invention relates to a light wavelength conversion material, and more particularly to a packaging method and structure for moisture and oxidation resistance of a light wavelength conversion material.
  • 98122739 discloses a solution for placing a treated electroluminescent powder into a specially formulated organic colloidal coating liquid, vacuum drying and high temperature sintering in air, in an electroluminescent material.
  • the surface chemistry forms oxides, compound films, and composite films thereof.
  • Chinese Patent Application No. 200710097598.0 discloses a solution for forming a film by mixing a transparent colloid such as silica gel or epoxy glue with a phosphor.
  • a similar solution is also disclosed in US Patent Application No. US 2008/0003160 A1 and U.S. Patent No. 6,346,326 B1.
  • the above prior art has the disadvantage that when the film is coated on the surface of the phosphor particles, the life of the phosphor can be prolonged, but the light from the phosphor is absorbed by the absorption and reflection of the light by the film itself. It is weakened, and the high process complexity of the oxidation treatment will bring about an increase in cost.
  • the silica gel or epoxy glue is used to form a film, although it helps to improve the utilization efficiency of the phosphor light intensity, it is due to the silica gel.
  • epoxy glue generally does not function to block oxygen and water vapor in the air, which is not conducive to maximizing the life of the phosphor.
  • the existing mixing or film coating process can also cause a certain agglomeration of the phosphor particles, and even the phosphor particles are destroyed, which will affect the luminescent properties of the phosphor powder or the fluorescent film.
  • the technical problem to be solved by the present invention is to address the deficiencies of the prior art, and to provide a packaging method and structure, and an LED light source using the same, so that the optical wavelength conversion material does not reduce the luminance of the light. It can also extend the service life.
  • the basic idea of the present invention is: if a transparent material is used to integrally encapsulate the light wavelength conversion material, it is advantageous to maintain the light-emitting brightness of the material without changing the properties of the light wavelength conversion material; If a transparent material, such as glass, is used to seal the optical wavelength converting material together with the insulating filler to isolate it from the air, the purpose of extending the life of the optical wavelength converting material can be achieved at the same time.
  • a method for packaging a light wavelength conversion material comprising: a step of enclosing a light wavelength conversion material between the first and second air isolation media using a filler; The step of sealingly connecting the first and second air-isolated media and/or the filler with an adhesive medium; wherein at least one of the first and second air-isolated media is made of a transparent material.
  • the above solution further includes the step of plating an optical film on the transparent material; the optical film is for controlling the propagation of light from the light wavelength converting material.
  • the first or second air separation medium using the transparent material comprises a glass piece, an alumina piece, a sapphire piece, a quartz piece or a plexiglass piece.
  • the filler may include a metal, plastic or special tape that is impervious to water or air; or a glue that includes a low water permeability; or includes a pressure sensitive adhesive.
  • the method further includes a step of reflecting a light from the light wavelength conversion material by applying a reflective tape or a reflective film on a surface of the first and second air isolation media; the surface is coated with a reflective tape or plated
  • the medium of the reflective film may be made of an opaque heat-dissipating material, or a transparent material may be used together with the other of the air-isolated medium.
  • the method further includes the step of providing a low refractive index dielectric layer between the first and second air isolation media such that the thickness of the filler is slightly larger than the thickness of the light wavelength conversion material.
  • the thickness of the low refractive index dielectric layer is less than one tenth of the diameter of the circumcircle of the spot of the excitation light on the wavelength conversion material layer.
  • a package structure of a light wavelength conversion material is provided, and Including a light wavelength conversion material, in particular: further comprising first and second air isolation media sandwiching the light wavelength conversion material from both sides, surrounded by the first and second air isolation media a filler of the light wavelength conversion material, and an adhesion medium sealingly connecting the first and second air isolation media and/or the filler between the first and second air isolation media; At least one of the second air separation media is made of a transparent material.
  • the adhesive medium is interposed between the first air separation medium and the filler, and between the second air separation medium and the filler.
  • the adhesive medium is interposed between the first air isolation medium and the second air isolation medium to accommodate the filler.
  • the first or second air separation medium surface of the enamel transparent material further includes an optical film layer for changing light propagation.
  • one of the first and second air isolation media further includes a reflective film layer for reflecting light from the optical wavelength conversion material, the medium or the opaque heat dissipation material, or Another of the air isolation media utilizes a transparent material.
  • an LED light source including a light wavelength conversion material and an LED distributed on a substrate, the light wavelength conversion material surrounding a light emitting surface of the LED, in particular:
  • the light source further includes an air isolating dielectric sheet using a transparent material covering the optical wavelength converting material; a filler filled between the substrate and the air isolating dielectric sheet and surrounding the optical wavelength converting material;
  • a dielectric is filled between the substrate and the sheet of air-isolated dielectric to sealingly connect the substrate and the sheet of air-isolated media and/or the filler.
  • the optical wavelength conversion material has the advantages of simple structure, simple process, and easy realization at low cost, under the premise of optimally considering the brightness and the service life of the light wavelength conversion material.
  • FIG. 1 is a cross-sectional view showing a package structure of a light wavelength conversion material of the present invention
  • Figure 2 is a cross-sectional view taken along line A - A of the structure of Figure 1;
  • Figure 3 is a schematic view showing the structure of the structure of Figure 1;
  • Figure 4 illustrates one of the variant embodiments of the structure of Figure 1 in use
  • FIG. 5 illustrates the effect of the package structure of the present invention through a life curve diagram
  • FIG. 6 illustrates a second embodiment of the structure of the structure of FIG. 1 in the use of an LED light source; wherein, the reference numerals are: Transparent material layer, 2 - light wavelength conversion material, 3 - filler, 4 - one adhesion medium, 5 - a second transparent material layer, 6 - a base with a reflective surface, 7 - one LED, 8 a light collecting component,
  • the method for packaging a light wavelength conversion material of the present invention comprises the steps of:
  • the first and second air-isolation media and/or the filler are sealingly connected using an adhesive medium; wherein at least one of the first and second air-isolated media is made of a transparent material.
  • the structure of the package as described above can be illustrated by taking a cross-sectional view of Fig. 1 as an example. As shown, the first air separation medium 1 and the second air isolation medium 5 sandwich the optical wavelength conversion material 2 from the sides, for example, up and down, and the filler 3 is interposed between the first and second air. The optical wavelength converting material is surrounded between the media.
  • the enveloping manner can be illustrated in more detail by the cross-sectional view of the structure shown in FIG. 2: the optical wavelength conversion material 2 is surrounded by the filler 3, and is further divided by the first air separation medium 1 and the second air isolation medium 5 Surrounded by.
  • the conversion material 2 is completely sealed and isolated from the air.
  • the structure may be as shown in FIG. 1, with an adhesive medium 4 interposed between the first air separation medium 1 and the filler 3, and between the second air separation medium 5 and the filler 3. .
  • the filler 3 may be metal, plastic or special tape that is impervious to water or air. Because the thickness of the layer where the light wavelength conversion material is generally small is small, compared with the prior art, most of the contact structure of the package structure is in contact with the outside, and the contact surface of the filler with the outside is relatively small.
  • the filler 3 can also be used with materials that are not required for water permeability, such as glue, including 353ND glue supplied by Epo-tek or epoxy glue which can be cured under certain conditions.
  • the adhesive medium 4 comprises glue or a pressure sensitive adhesive.
  • the pressure sensitive adhesive is a pressure-sensitive adhesive Special double-sided tape for knotting.
  • the adhesive medium 4 and the filler 3 may be combined into one, for example, a pressure sensitive adhesive, which avoids the glue contamination.
  • the light wavelength conversion material 2 has reached the original intention of sealing.
  • the thickness of the light wavelength conversion layer is 0.1 mm
  • the glue is directly used as the filler 3 and the adhesion medium 4, when the fluidity of the glue is relatively good, it is likely to be difficult to control and contaminate the light in the actual operation.
  • the wavelength conversion material in addition, compared with the structure of Fig. 1, the contact surface of the glue with the outside is relatively large (the thickness of the contact of the glue with the outside can be reduced to 0.005 mm in Fig.
  • the adhesive medium 4 in the structure of FIG. 3 is interposed between the first air separation medium 1 and the second air separation medium 5, and accommodates the filler 3. Selecting such that the thickness of the filler 3 is slightly larger than the thickness of the light wavelength conversion material 2, at least one low between the first and second air isolation media 1, 5 and the light wavelength conversion material 2 may be disposed. Refractive index dielectric layer 12.
  • the low refractive index dielectric layer may be a thin air layer, or a layer, or an inert gas layer having a refractive index lower than a refractive index of the optical wavelength conversion material.
  • the low refractive index dielectric layer may also be a low refractive index epoxy layer having a refractive index of less than 1.38.
  • the adhesive medium 4 is glue
  • the glue only penetrates into the filler 3 and the first and second air separation media 1 and 5 based on the capillary phenomenon.
  • the gap is not contaminated by the light wavelength converting material 2.
  • the test verifies that the thickness of the low refractive index dielectric layer is less than a predetermined degree, for example, one tenth of the diameter of the circumcircle of the spot of the excitation light on the phosphor layer, and the brightness of the excited light It is especially good to improve the effect.
  • the first and second air separation media 1 and 5 is made of a transparent material, which is advantageous for maintaining the brightness of the emitted light of the optical wavelength conversion material. Therefore, the first and second air separation media 1, 5 may be a glass piece, an alumina piece, a sapphire piece, a quartz piece or a plexiglass piece, composed of a dense material that is impermeable to air and moisture, or other water permeability. A medium composed of a low transparent material will also be within the scope of the present invention.
  • the first and second air isolation media 1, 5 may each adopt a transparent material.
  • the materials are all in the form of flakes.
  • the light wavelength conversion material thus encapsulated can be easily used by various products and is easy to replace, and the light wavelength conversion material can be prevented from being damp or oxidized during transportation and before use. In use, it is suitable for the case where the excitation light is incident from one side and the excitation light is emitted from the other side.
  • the method or structure of the present invention can be modified as shown in Figure 4 for the case where the excitation light and the excited light are incident and ejected from the same side.
  • a reflective tape such as a tape available from 3M Company
  • a reflective film is applied to the surface of the second air separation medium 5 (the second air separation medium 5 or even a transparent material) to reflect light from the surface.
  • the reflective film may be a metal plating film, a dielectric reflective film or a metal-medium mixed reflective film.
  • the second air separation medium 5 is replaced by a medium 6 with a reflective film layer in Figure 4 .
  • the medium 6 may also be a heat sink base composed of an opaque heat conductive material such as, but not limited to, metal or silicon, and a side close to the light wavelength conversion material 2 includes a light reflecting film layer.
  • the reflective film layer can even be replaced by a polished surface of the heat sink base.
  • the method of the present invention also includes the step of plating an optical film on the transparent material; the optical film is used to control the propagation of light from the optical wavelength converting material, including changing the direction of propagation of a portion of the light or the range of the outgoing wavelength of the selected light. .
  • the first air separation medium 1 is colored glass, and the color of the emitted light can be controlled.
  • the invention has been experimentally verified, as shown in Fig. 5, taking the phosphor as an example, the conversion efficiency of the unsealed phosphor decreases rapidly with time, as indicated by the dotted line curve, and the conversion efficiency after 400 hours is only original. 20%.
  • the conversion efficiency is still more than 95% after 1000 hours, and the service life and conversion efficiency are greatly improved.
  • the prior art film coating method has been disclosed in the literature, and it is necessary to coat two or more oxide films to have a similar effect, but it is undoubtedly to lose part of the emitted light brightness, and the processing process is complicated and the cost is high. Applying the above structure to the LED light source, as shown in FIG.
  • the light source comprises a light wavelength conversion material 2 and an LED 7 distributed on the substrate, the light wavelength conversion material 2 surrounding the light emitting surface of the LED 7; Also included is an air isolating dielectric sheet 1 using a transparent material covering the optical wavelength converting material 2; a filler 3 filling between the substrate and the air isolating dielectric sheet and surrounding the optical wavelength converting material 2 Adhesion medium, filled in the substrate and air separated The substrate and the air isolating dielectric sheet 1 and/or the filler 3 are hermetically sealed from between the dielectric sheets 1.
  • the light source further includes a light collecting assembly 8 open at both ends, on which the LED and the optical wavelength converting material 2 are contained, the LED 7 having a smaller open end therein.
  • the light collecting assembly 8 can be a reflective cup.

Abstract

Une structure d'enfermement pour matériau de conversion de longueur d'onde de lumière comprend un matériau de conversion de longueur d'onde de lumière (2), et des premier et second agents d'isolation d'air (1, 5), le matériau de conversion de longueur d'onde de lumière (2) étant coincé entre les premier et second agents d'isolation d'air (1, 5) des deux côtés. Un procédé d'enfermement comprend un processus consistant à entourer le matériau de conversion de longueur d'onde de lumière (2) entre les premier et second agents d'isolation d'air (1, 5) à l'aide d'un agent de remplissage (3), et un processus consistant à relier hermétiquement les agents d'isolation d'air (1, 5) et/ou l'agent de remplissage (3) à l'aide d'un agent adhésif (4). Le premier et/ou le second agent d'isolation d'air (1, 5) est transparent. Une LED (7) comprend un matériau de conversion de longueur d'onde de lumière (2), un agent d'isolation d'air (1), un agent de remplissage (3) et un agent adhésif (4).
PCT/CN2010/000466 2010-04-09 2010-04-09 Structure et procédé d'enfermement pour matériau de conversion de longueur d'onde de lumière, et led WO2011123987A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2010/000466 WO2011123987A1 (fr) 2010-04-09 2010-04-09 Structure et procédé d'enfermement pour matériau de conversion de longueur d'onde de lumière, et led

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PCT/CN2010/000466 WO2011123987A1 (fr) 2010-04-09 2010-04-09 Structure et procédé d'enfermement pour matériau de conversion de longueur d'onde de lumière, et led

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WO2011123987A1 true WO2011123987A1 (fr) 2011-10-13

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014053951A1 (fr) * 2012-10-01 2014-04-10 Koninklijke Philips N.V. Élément de conversion de longueur d'onde comportant une capsule en céramique
US10374137B2 (en) * 2014-03-11 2019-08-06 Osram Gmbh Light converter assemblies with enhanced heat dissipation

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB740778A (en) * 1953-06-25 1955-11-16 British Thomson Houston Co Ltd Improvements in indicating apparatus embodying electroluminescent material
CN1574007A (zh) * 2003-06-10 2005-02-02 三菱电机株式会社 盘片重放装置
CN201126162Y (zh) * 2007-09-24 2008-10-01 东贝光电科技股份有限公司 结构改良的发光二极管
CN201141564Y (zh) * 2007-12-05 2008-10-29 王元成 一种采用水晶玻璃封装的led
JP2009140835A (ja) * 2007-12-08 2009-06-25 Citizen Electronics Co Ltd 発光装置及び面状ライトユニット並びに表示装置
US20090261708A1 (en) * 2008-04-21 2009-10-22 Motorola, Inc. Glass-phosphor capping structure for leds
CN201462686U (zh) * 2009-02-18 2010-05-12 绎立锐光科技开发(深圳)有限公司 光波长转换材料的封装结构及led光源

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB740778A (en) * 1953-06-25 1955-11-16 British Thomson Houston Co Ltd Improvements in indicating apparatus embodying electroluminescent material
CN1574007A (zh) * 2003-06-10 2005-02-02 三菱电机株式会社 盘片重放装置
CN201126162Y (zh) * 2007-09-24 2008-10-01 东贝光电科技股份有限公司 结构改良的发光二极管
CN201141564Y (zh) * 2007-12-05 2008-10-29 王元成 一种采用水晶玻璃封装的led
JP2009140835A (ja) * 2007-12-08 2009-06-25 Citizen Electronics Co Ltd 発光装置及び面状ライトユニット並びに表示装置
US20090261708A1 (en) * 2008-04-21 2009-10-22 Motorola, Inc. Glass-phosphor capping structure for leds
CN201462686U (zh) * 2009-02-18 2010-05-12 绎立锐光科技开发(深圳)有限公司 光波长转换材料的封装结构及led光源

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014053951A1 (fr) * 2012-10-01 2014-04-10 Koninklijke Philips N.V. Élément de conversion de longueur d'onde comportant une capsule en céramique
US9658520B2 (en) 2012-10-01 2017-05-23 Koninklijke Philips N.V. Wavelength converting element comprising ceramic capsule
US10374137B2 (en) * 2014-03-11 2019-08-06 Osram Gmbh Light converter assemblies with enhanced heat dissipation

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