CN201462686U - 光波长转换材料的封装结构及led光源 - Google Patents
光波长转换材料的封装结构及led光源 Download PDFInfo
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- CN201462686U CN201462686U CN2009201300474U CN200920130047U CN201462686U CN 201462686 U CN201462686 U CN 201462686U CN 2009201300474 U CN2009201300474 U CN 2009201300474U CN 200920130047 U CN200920130047 U CN 200920130047U CN 201462686 U CN201462686 U CN 201462686U
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- 239000000463 material Substances 0.000 title claims abstract description 92
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 73
- 230000003287 optical effect Effects 0.000 title claims abstract description 70
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000000945 filler Substances 0.000 claims abstract description 34
- 239000012780 transparent material Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 229920006335 epoxy glue Polymers 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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Application Number | Priority Date | Filing Date | Title |
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CN2009201300474U CN201462686U (zh) | 2009-02-18 | 2009-02-18 | 光波长转换材料的封装结构及led光源 |
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CN2009201300474U CN201462686U (zh) | 2009-02-18 | 2009-02-18 | 光波长转换材料的封装结构及led光源 |
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CN2009201300474U Expired - Lifetime CN201462686U (zh) | 2009-02-18 | 2009-02-18 | 光波长转换材料的封装结构及led光源 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011123987A1 (zh) * | 2010-04-09 | 2011-10-13 | 绎立锐光科技开发(深圳)有限公司 | 光波长转换材料的封装结构、方法和led |
CN102971583A (zh) * | 2010-07-01 | 2013-03-13 | 皇家飞利浦电子股份有限公司 | 在密封玻璃管外部的tl改型led模块 |
CN103647011A (zh) * | 2013-12-18 | 2014-03-19 | 吴震 | 发光二极管封装结构和发光装置 |
CN101805602B (zh) * | 2009-02-18 | 2014-03-26 | 深圳市绎立锐光科技开发有限公司 | 光波长转换材料的封装方法及结构 |
CN103840067A (zh) * | 2013-12-31 | 2014-06-04 | 吴震 | 波长转换装置和发光装置 |
CN104471024A (zh) * | 2012-07-25 | 2015-03-25 | 迪睿合电子材料有限公司 | 荧光体片 |
EP2933884A1 (en) * | 2014-04-09 | 2015-10-21 | Nichia Corporation | Light emitting device |
CN105588013A (zh) * | 2014-11-11 | 2016-05-18 | Lg伊诺特有限公司 | 发光设备以及包括该发光设备的照明设备 |
CN111699420A (zh) * | 2018-02-14 | 2020-09-22 | 日本特殊陶业株式会社 | 光波长转换装置 |
TWI724287B (zh) * | 2018-03-21 | 2021-04-11 | 晶元光電股份有限公司 | 一種發光裝置及其製造方法 |
-
2009
- 2009-02-18 CN CN2009201300474U patent/CN201462686U/zh not_active Expired - Lifetime
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101805602B (zh) * | 2009-02-18 | 2014-03-26 | 深圳市绎立锐光科技开发有限公司 | 光波长转换材料的封装方法及结构 |
WO2011123987A1 (zh) * | 2010-04-09 | 2011-10-13 | 绎立锐光科技开发(深圳)有限公司 | 光波长转换材料的封装结构、方法和led |
CN102971583A (zh) * | 2010-07-01 | 2013-03-13 | 皇家飞利浦电子股份有限公司 | 在密封玻璃管外部的tl改型led模块 |
JP2013534703A (ja) * | 2010-07-01 | 2013-09-05 | コーニンクレッカ フィリップス エヌ ヴェ | 封止ガラス管外のtlレトロフィットledモジュール |
CN102971583B (zh) * | 2010-07-01 | 2015-12-02 | 皇家飞利浦电子股份有限公司 | 在密封玻璃管外部的tl改型led模块 |
CN104471024A (zh) * | 2012-07-25 | 2015-03-25 | 迪睿合电子材料有限公司 | 荧光体片 |
CN103647011A (zh) * | 2013-12-18 | 2014-03-19 | 吴震 | 发光二极管封装结构和发光装置 |
CN103647011B (zh) * | 2013-12-18 | 2018-09-21 | 杨毅 | 发光二极管封装结构和发光装置 |
CN103840067A (zh) * | 2013-12-31 | 2014-06-04 | 吴震 | 波长转换装置和发光装置 |
EP2933884A1 (en) * | 2014-04-09 | 2015-10-21 | Nichia Corporation | Light emitting device |
US10218148B2 (en) | 2014-04-09 | 2019-02-26 | Nichia Corporation | Light emitting device |
CN105588013A (zh) * | 2014-11-11 | 2016-05-18 | Lg伊诺特有限公司 | 发光设备以及包括该发光设备的照明设备 |
CN105588013B (zh) * | 2014-11-11 | 2019-11-15 | Lg伊诺特有限公司 | 发光设备以及包括该发光设备的照明设备 |
CN111699420A (zh) * | 2018-02-14 | 2020-09-22 | 日本特殊陶业株式会社 | 光波长转换装置 |
TWI724287B (zh) * | 2018-03-21 | 2021-04-11 | 晶元光電股份有限公司 | 一種發光裝置及其製造方法 |
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Owner name: SHENZHEN YLX OPTICAL TECHNOLOGY DEVELOPMENT CO., L Free format text: FORMER NAME: YLX (CHINA) CORPORATION |
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Address after: 518057, Guangdong province Shenzhen science and technology park south side square big building 3 hug Patentee after: YLX Inc. Address before: 518057, Guangdong province Shenzhen science and technology park south side square big building 3 hug Patentee before: YLX (CHINA) Corp. |
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Effective date of registration: 20171024 Address after: 518055 Guangdong city of Shenzhen province Nanshan District Xili town tea light road Shenzhen city integrated circuit design and application of Industrial Park 401 Patentee after: APPOTRONICS Corp.,Ltd. Address before: 518057, Guangdong province Shenzhen science and technology park south side square big building 3 hug Patentee before: YLX Inc. |
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Address after: 518000 20-22, 20-22 headquarters building, 63 high tech Zone, Xuefu Road, Nanshan District, Guangdong Province, Guangdong. Patentee after: APPOTRONICS Corp.,Ltd. Address before: 518000 20-22, 20-22 headquarters building, 63 high tech Zone, Xuefu Road, Nanshan District, Guangdong Province, Guangdong. Patentee before: SHENZHEN GUANGFENG TECHNOLOGY Co.,Ltd. |
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Address after: 518000 20-22, 20-22 headquarters building, 63 high tech Zone, Xuefu Road, Nanshan District, Guangdong Province, Guangdong. Patentee after: SHENZHEN GUANGFENG TECHNOLOGY Co.,Ltd. Address before: 518055 Guangdong province Shenzhen Nanshan District Xili town Cha Guang road Shenzhen integrated circuit design application Industrial Park 401 Patentee before: APPOTRONICS Corp.,Ltd. |
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