WO2011094949A1 - Lampe fluorescente à diode électroluminescente - Google Patents

Lampe fluorescente à diode électroluminescente Download PDF

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Publication number
WO2011094949A1
WO2011094949A1 PCT/CN2010/070550 CN2010070550W WO2011094949A1 WO 2011094949 A1 WO2011094949 A1 WO 2011094949A1 CN 2010070550 W CN2010070550 W CN 2010070550W WO 2011094949 A1 WO2011094949 A1 WO 2011094949A1
Authority
WO
WIPO (PCT)
Prior art keywords
light source
heat
fluorescent lamp
led
led fluorescent
Prior art date
Application number
PCT/CN2010/070550
Other languages
English (en)
Chinese (zh)
Inventor
胡安华
Original Assignee
马士科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 马士科技有限公司 filed Critical 马士科技有限公司
Priority to PCT/CN2010/070550 priority Critical patent/WO2011094949A1/fr
Priority to CN2010800014381A priority patent/CN102016394B/zh
Priority to EP10252162.2A priority patent/EP2357402A3/fr
Priority to TW100101921A priority patent/TW201135148A/zh
Publication of WO2011094949A1 publication Critical patent/WO2011094949A1/fr
Priority to HK11110868.5A priority patent/HK1156681A1/xx

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to the field of lighting fixtures. More specifically, the present invention relates to an LED fluorescent lamp used as a lighting fixture, which has high luminous efficiency and good heat dissipation.
  • the existing LED lamps for illumination generally assemble a plurality of LED light sources to form an LED array structure to achieve the required brightness and power.
  • the LED array structure can meet the lighting requirements, it also generates heat concentration, local temperature is too high, and affects the stability of the circuit control system. Since no special heat conduction and heat dissipation devices are provided, the heat generated by the plurality of LED light sources cannot be effectively dissipated, so that the temperature of the outer casing of the lamp is relatively high, and there is a danger of hot hands when a person touches; High also makes the lamp more susceptible to damage.
  • the object of the present invention is to overcome the above disadvantages in the prior art and to provide a novel LED fluorescent lamp which has good thermal conductivity and heat dissipation, prolongs the service life of the LED lamp, reduces energy consumption and reduces light decay. .
  • the object of the present invention is to provide an LED fluorescent lamp comprising a lamp cap, a glass bulb and a control circuit that can be inserted into a lamp holder and connected to a power source, and the LED fluorescent lamp further comprises:
  • At least two LED light sources connected to the control circuit
  • At least two light source panels wherein the at least two LED light sources are respectively fixed on the at least two light source panels;
  • a heat conducting device comprising at least two heat conducting substrates disposed obliquely to a direction perpendicular to a center line thereof, wherein the at least two light source panels are respectively fixed to the at least two heat conducting substrates in a heat conductive manner, the heat conducting The bottom end of the substrate extends downward to form a receiving cavity, and the bottom edge of the receiving cavity is provided with an annular interface;
  • the rear cover includes a housing and a hollow cylinder for receiving the control circuit, the housing is engaged with the glass bulb, and an upper portion of the inner wall of the housing is provided with an annular interface through which the The annular interface of the heat conducting device is tightly coupled such that the heat conducting device and the back cover are thermally coupled together, and the bottom of the hollow cylinder is fixedly connected to the housing, the hollow cylinder Accommodating with the control circuit is received within the receiving cavity of the thermally conductive device.
  • the LED fluorescent lamp comprises:
  • a heat conducting device comprising three thermally conductive substrates disposed radially equidistantly spaced and inclined toward a vertical centerline thereof, the thermally conductive substrates comprising a lower thermally conductive substrate and upwardly and inwardly along a top end of the lower thermally conductive substrate
  • An upper thermally conductive substrate formed obliquely extending, the upper thermally conductive substrate forming a triangular structure on an upper portion of the heat conducting device, the top surface of the triangular structure having a circle through which the wires connecting the LED light source and the control circuit pass hole.
  • the heat conducting device further includes three lower partition plates disposed between the lower heat conductive substrates and an upper partition plate extending obliquely upward and inward along a top end of each of the lower partition plates, the lower heat conductive substrate Forming a circular surface adjacent to the lower partitioning plate; wherein the light source panel to which the LED light source is fixed is respectively fixed on the upper heat conductive substrate.
  • each of the lower thermally conductive substrates is provided with a spring hole for one end of the snap spring, and the other end of the spring is fixed on the light source panel, so that the light source panel is further Securely attached to the lower thermally conductive substrate.
  • the LED light source can be fixed on the light source panel by dispensing or by any mechanical means, and the light source panel and the heat conductive substrate can pass fasteners, dispensing or adhesive heat dissipation oil. Fixed together.
  • a heat dissipation oil layer is coated between the light source panel and the heat conductive substrate.
  • the outer surface of the back cover housing of the present invention may be provided with a plurality of fins arranged parallel to and spaced apart from the center vertical axis for better heat dissipation.
  • the bottom of the hollow cylinder of the back cover can be fixedly attached to the housing by, for example, snapping, screwing, etc., as will be apparent to those skilled in the art.
  • the light source panel, the heat conducting plate, the heat sink and the reflector cup are preferably made of a heat conductive material such as aluminum, aluminum alloy or ceramic.
  • the main heating element is the LED light source
  • the heat dissipation generated by the LED luminaire affects the stability of the control circuit, which in turn affects the illuminating effect of the LED light source.
  • the LED fluorescent lamp of the invention closely contacts the LED chip light source panel and the heat conducting device, and the heat conducting device is also closely connected with the back cover provided with the heat sink, thereby forming a good heat conduction and heat dissipation path, and the heat emitted by the LED light source
  • the heat dissipation path of the light source panel-heat conducting device-back cover-heat sink is quickly and efficiently dissipated, which reduces the temperature of the LED light source to the inside of the lamp body.
  • the heat conduction and heat dissipation conduction path of the invention can achieve a good heat dissipation effect, ensure that the LED is not hot, and prolong the life of the LED fluorescent lamp, thereby solving the problem of heating of the high power LED fluorescent lamp.
  • the number of LED light sources and light source panels can be increased by merely changing the design of the heat conductive substrate in the heat conducting device, so that the present invention can be made into a series of high power LED fluorescent lamps.
  • Fig. 1 is a front elevational view showing an LED fluorescent lamp according to an embodiment of the present invention.
  • Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1.
  • FIG. 3 is an exploded perspective view of the LED fluorescent lamp shown in FIG. 1.
  • FIG. 4 is a top perspective view of the heat conducting device of the LED fluorescent lamp shown in FIG. 1.
  • FIG. 5 is a bottom perspective view of the heat conducting device shown in FIG. 4.
  • Figure 6 is a front elevational view of the heat transfer device of Figure 4.
  • Figure 7 is a plan view of the heat transfer device shown in Figure 4.
  • an LED fluorescent lamp 10 as a preferred embodiment of the present invention, the fluorescent lamp 10 comprising a glass bubble 100, three LED light sources 400, three light source panels 300, a heat conducting device 500, and control Circuit 600, back cover 700, and base 800.
  • the glass bubble 100 may be a transparent glass bubble, or a glass bubble coated with a silica gel, a twisted glass bubble, or a frosted glass bubble may be used as needed.
  • the lamp cap 800 can be designed as a lamp head of various sizes as required, such as E11, E12, E14, E17, E26, E27, and the like.
  • the control circuit 600 is not the gist of the present invention and will not be described in detail herein.
  • the LED light source can be constructed from one or more LEDs.
  • the three LED light sources 400 are each composed of three chip LEDs, which are respectively fixed on the three light source panels 300.
  • the LED light source 400 and the light source panel 300 can be glued together or fixed together in any known mechanical manner.
  • the upper portion of the heat transfer device is substantially triangular and the lower portion is cylindrical.
  • the heat conducting device 500 includes three thermally conductive substrates disposed radially equidistantly spaced and inclined toward their vertical centerline directions.
  • the heat-conducting substrate is disposed obliquely to the central vertical axis of the fluorescent lamp so that the light emitted from the LED chip can be directly irradiated.
  • Each of the heat conductive substrates includes a lower heat conductive substrate 510 and an upper heat conductive substrate 530.
  • the upper heat conductive substrate 530 is formed to extend obliquely upward and inward along the top end of the lower heat conductive substrate 510.
  • the light source panel 300 to which the LED light source 400 is fixed is fixed on the heat conduction.
  • the three upper thermally conductive substrates 530 abut together to form a triangular structure on the upper portion of the heat conducting device.
  • the triangular structure has a flat top surface 560 with a circular opening 561 at the center of the top surface 560 through which the LED light source 400 and the control circuit 600 can be electrically connected by wires.
  • a layer of heat-dissipating oil may be applied between the light source panel 300 and the heat-conducting substrate to provide better heat conduction.
  • the light source panel 300 can be fixed on the heat conductive substrate by any other means known in the art, and it is better to form a good heat conduction and heat dissipation effect.
  • the light source can be directly used by the viscous heat dissipation oil.
  • the panel 300 is bonded to the heat conducting plate.
  • the spring piece 200 is used to strengthen the fixing between the light source panel and the upper heat conductive substrate 530.
  • a spring hole 511 is disposed on each of the lower heat conductive substrates 510.
  • One end of the spring piece 200 is buckled inside the spring hole, and the other end of the spring piece is pressed against the light source panel 300. Because of the force of the spring, the reaction force of the spring will firmly press the light source panel 300, so that the light source panel 300 is more closely fixed to the upper heat conductive substrate 530.
  • the heat conducting device 500 further includes three lower partition plates 520 disposed between the lower heat conductive substrates 510 and an upper partition plate 540 formed obliquely upward and inward along the top ends of the respective lower partition plates 520.
  • the lower heat conductive substrate 510 and the lower partition plate 520 are circumferentially formed to form a circular surface, as shown in FIGS. 4 and 7.
  • the purpose of arranging the upper and lower partition plates 540, 520 to be inclined is to allow the light emitted from the LED light source 400 in various directions to be sufficiently effectively radiated, so that the divergence of the light is not hindered.
  • a receiving cavity 550 is formed downwardly from the bottom end of the circular vertebral body formed by the lower thermally conductive substrate 510 and the lower dividing plate 520, and an annular interface is provided on the bottom edge of the receiving cavity 550.
  • the annular interface is bent inwardly to form a step 551 for the bottom edge of the receiving cavity 550.
  • the back cover 700 is annular and includes a housing 720 and a hollow cylinder 710, the bottom of which is secured to the housing 720 in any manner known in the art.
  • the upper end of the housing 720 and the glass bulb 100 can be joined together by any means known in the art, such as snapping or screwing.
  • the upper side of the inner wall of the casing protrudes outwardly to form a step, and the step is closely engaged with the step 551 of the heat conducting device 500, so that the heat conducting device 500 and the back cover 700 are thermally coupled together to form good heat conduction and heat dissipation. aisle.
  • the size of the hollow cylinder 710 matches the size of the receiving cavity 550 of the heat conducting device 500, and after receiving the control circuit 600, is received together within the receiving cavity 550 of the heat conducting device.
  • the outer surface of the housing 720 is provided with a plurality of fins 721 arranged parallel to and spaced apart from the central vertical axis.
  • the fins 721 are disposed to dissipate the heat transferred from the heat conducting device 500 to achieve better heat dissipation. effect.
  • the light source panel 300, the heat conducting device 500, and the housing 720 of the back cover are preferably made of a heat conductive material such as aluminum, aluminum alloy or ceramic.
  • the heat-conducting device forms a heat-conducting connection with the rear cover, and the outer surface of the rear cover has a plurality of heat-dissipating fins, thereby forming a good light source.
  • the number of LED light sources may be two or more, such as three or four, or even more, as long as the number of thermally conductive substrates in the heat conducting device 500 is adjusted accordingly. Because it solves the heat dissipation problem of the LED light source, it can be made into LED lamps with higher power, lower power consumption and less light decay.
  • the present invention provides an LED fluorescent lamp, which not only effectively solves the heat dissipation problem of the LED, but also greatly improves the luminous flux and luminous efficiency of the LED.

Abstract

La présente invention a trait à une lampe fluorescente à diode électroluminescente. La lampe fluorescente à diode électroluminescente inclut un culot de lampe, une bulle de verre, un circuit de commande, au moins deux sources lumineuses de diode électroluminescente, au moins deux panneaux de source lumineuse utilisés pour fixer la source lumineuse de diode électroluminescente, un appareil de transfert de chaleur et un couvercle arrière. L'appareil de transfert de chaleur inclut au moins deux substrats de transfert de chaleur, qui sont inclinés vers l'axe vertical. Avec une possibilité de transfert de chaleur, les deux panneaux de source lumineuse ou plus sont respectivement fixés sur les deux substrats de transfert de chaleur ou plus. Les fonds des substrats de transfert de chaleur s'étendent vers le bas de manière à former une cavité d'acceptation. Le couvercle arrière inclut un boîtier et un cylindre creux permettant de recevoir le circuit de commande. Le boîtier est étroitement attaché à l'appareil de transfert de chaleur au moyen d'une interface d'anneau, ce qui permet au couvercle arrière d'engloutir les substrats de transfert de chaleur avec une possibilité de transfert de chaleur. La surface extérieure du couvercle arrière est également pourvue d'une pluralité d'ailettes. Les panneaux de source lumineuse, l'appareil de transfert de chaleur, le boîtier du couvercle arrière et les ailettes constituent un moyen de conductivité thermique et de dissipation thermique.
PCT/CN2010/070550 2010-02-05 2010-02-05 Lampe fluorescente à diode électroluminescente WO2011094949A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/CN2010/070550 WO2011094949A1 (fr) 2010-02-05 2010-02-05 Lampe fluorescente à diode électroluminescente
CN2010800014381A CN102016394B (zh) 2010-02-05 2010-02-05 Led荧光灯
EP10252162.2A EP2357402A3 (fr) 2010-02-05 2010-12-17 Lampe fluorescente à DEL
TW100101921A TW201135148A (en) 2010-02-05 2011-01-19 LED fluorescent lamp
HK11110868.5A HK1156681A1 (en) 2010-02-05 2011-10-13 Led fluorescent lamp led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2010/070550 WO2011094949A1 (fr) 2010-02-05 2010-02-05 Lampe fluorescente à diode électroluminescente

Publications (1)

Publication Number Publication Date
WO2011094949A1 true WO2011094949A1 (fr) 2011-08-11

Family

ID=43844566

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2010/070550 WO2011094949A1 (fr) 2010-02-05 2010-02-05 Lampe fluorescente à diode électroluminescente

Country Status (5)

Country Link
EP (1) EP2357402A3 (fr)
CN (1) CN102016394B (fr)
HK (1) HK1156681A1 (fr)
TW (1) TW201135148A (fr)
WO (1) WO2011094949A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102818234B (zh) * 2011-06-07 2016-12-07 蔡子丰 发光灯体散热结构、相应的照明装置及其制造方法
CN103133896A (zh) * 2011-11-29 2013-06-05 泰金宝电通股份有限公司 灯泡
TW201500687A (zh) 2013-06-24 2015-01-01 Beautiful Light Technology Corp 發光二極體燈泡
CN203517389U (zh) * 2013-09-23 2014-04-02 马士科技有限公司 Led灯泡
JP6393101B2 (ja) 2014-07-16 2018-09-19 株式会社日立エルジーデータストレージ 光モジュールおよび投写型画像表示装置
CN104832833A (zh) * 2015-04-27 2015-08-12 东莞勤上光电股份有限公司 一种紫外杀菌和照明一体灯

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JP2001256805A (ja) * 2000-03-09 2001-09-21 Yamada Shomei Kk 照明灯
JP2005338251A (ja) * 2004-05-25 2005-12-08 Seiko Epson Corp 光源装置及びプロジェクタ
CN2826172Y (zh) * 2005-09-27 2006-10-11 李盛远 一体化led灯具散热装置
US20060274529A1 (en) * 2005-06-01 2006-12-07 Cao Group, Inc. LED light bulb
CN101307887A (zh) * 2007-05-14 2008-11-19 穆学利 一种led照明灯泡
CN201246614Y (zh) * 2008-07-16 2009-05-27 沈李豪 一种led灯泡

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CN2763686Y (zh) * 2005-01-11 2006-03-08 深圳市中电照明有限公司 一种led灯杯
CN1948819A (zh) * 2006-10-26 2007-04-18 诸建平 Led节能灯
US8226270B2 (en) * 2007-05-23 2012-07-24 Sharp Kabushiki Kaisha Lighting device
CN201106805Y (zh) * 2007-11-02 2008-08-27 深圳市邦贝尔电子有限公司 不眩目的led照明灯具
US8274241B2 (en) * 2008-02-06 2012-09-25 C. Crane Company, Inc. Light emitting diode lighting device

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Publication number Priority date Publication date Assignee Title
JP2001256805A (ja) * 2000-03-09 2001-09-21 Yamada Shomei Kk 照明灯
JP2005338251A (ja) * 2004-05-25 2005-12-08 Seiko Epson Corp 光源装置及びプロジェクタ
US20060274529A1 (en) * 2005-06-01 2006-12-07 Cao Group, Inc. LED light bulb
CN2826172Y (zh) * 2005-09-27 2006-10-11 李盛远 一体化led灯具散热装置
CN101307887A (zh) * 2007-05-14 2008-11-19 穆学利 一种led照明灯泡
CN201246614Y (zh) * 2008-07-16 2009-05-27 沈李豪 一种led灯泡

Also Published As

Publication number Publication date
TW201135148A (en) 2011-10-16
CN102016394A (zh) 2011-04-13
HK1156681A1 (en) 2012-06-15
EP2357402A2 (fr) 2011-08-17
EP2357402A3 (fr) 2013-04-10
CN102016394B (zh) 2013-04-10

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