WO2011087208A3 - 부가 챔버를 사용한 멤스 마이크로폰 패키지 - Google Patents

부가 챔버를 사용한 멤스 마이크로폰 패키지 Download PDF

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Publication number
WO2011087208A3
WO2011087208A3 PCT/KR2010/008253 KR2010008253W WO2011087208A3 WO 2011087208 A3 WO2011087208 A3 WO 2011087208A3 KR 2010008253 W KR2010008253 W KR 2010008253W WO 2011087208 A3 WO2011087208 A3 WO 2011087208A3
Authority
WO
WIPO (PCT)
Prior art keywords
mems microphone
additional chamber
psr
pcb
chamber
Prior art date
Application number
PCT/KR2010/008253
Other languages
English (en)
French (fr)
Other versions
WO2011087208A2 (ko
Inventor
송청담
김창원
김정민
이원택
박성호
Original Assignee
주식회사 비에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 비에스이 filed Critical 주식회사 비에스이
Publication of WO2011087208A2 publication Critical patent/WO2011087208A2/ko
Publication of WO2011087208A3 publication Critical patent/WO2011087208A3/ko

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)

Abstract

본 발명은 PCB기판에 댐(PSR dam)에 의한 부가 챔버를 형성하여 백챔버를 크게 확장함으로써 음향특성을 향상시킨 멤스 마이크로폰 패키지에 관한 것이다. 본 발명의 멤스 마이크로폰 패키지는 멤스 마이크로폰 패키지에 있어서, 멤스 마이크로폰 칩; 상기 멤스 마이크로폰 칩을 실장하기 위한 위치에 소정 높이의 PSR(Photo Solder Resist) 댐에 의한 부가 챔버가 형성된 PCB 기판; 및 상기 PCB 기판과 결합되어 부품을 수용하기 위한 공간을 형성하는 케이스를 구비하여 상기 부가 챔버에 의해 상기 멤스 마이크로폰 칩의 백챔버 공간이 확장된 것을 특징으로 한다. 상기 부가 챔버는 상기 PCB 기판을 제조하는 공정에서 불필요한 부분에 솔더가 부착되는 것을 방지하고 표면회로를 외부 환경으로부터 보호하기 위한 PSR 잉크로 사각링 모양을 형성한 후 경화시켜 제조한 것이다. 본 발명에 따르면 PCB 기판에 PSR 댐에 의해 부가 챔버를 형성한 후 그 위에 멤스 마이크로폰 칩을 부착하여 MEMS칩 자체의 부족한 백 챔버 공간을 늘려 감도를 향상시키고, THD(Total Harmonic Distortion) 등의 노이즈를 개선할 수 있는 효과가 있다.
PCT/KR2010/008253 2010-01-18 2010-11-22 부가 챔버를 사용한 멤스 마이크로폰 패키지 WO2011087208A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0004460 2010-01-18
KR1020100004460A KR101039256B1 (ko) 2010-01-18 2010-01-18 부가 챔버를 사용한 멤스 마이크로폰 패키지

Publications (2)

Publication Number Publication Date
WO2011087208A2 WO2011087208A2 (ko) 2011-07-21
WO2011087208A3 true WO2011087208A3 (ko) 2011-11-03

Family

ID=44304756

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/008253 WO2011087208A2 (ko) 2010-01-18 2010-11-22 부가 챔버를 사용한 멤스 마이크로폰 패키지

Country Status (2)

Country Link
KR (1) KR101039256B1 (ko)
WO (1) WO2011087208A2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101366418B1 (ko) 2012-04-25 2014-02-25 앰코 테크놀로지 코리아 주식회사 반도체 디바이스

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040075750A (ko) * 2003-02-20 2004-08-30 산요덴키가부시키가이샤 컨덴서 마이크로폰
KR100722686B1 (ko) * 2006-05-09 2007-05-30 주식회사 비에스이 부가적인 백 챔버를 갖고 기판에 음향홀이 형성된 실리콘콘덴서 마이크로폰
KR100737730B1 (ko) * 2006-04-21 2007-07-10 주식회사 비에스이 멤스 마이크로폰 패키징 구조
KR20080101374A (ko) * 2007-05-17 2008-11-21 주식회사 비에스이 콘덴서 마이크로폰

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010187277A (ja) 2009-02-13 2010-08-26 Yamaha Corp マイクロフォンパッケージ及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040075750A (ko) * 2003-02-20 2004-08-30 산요덴키가부시키가이샤 컨덴서 마이크로폰
KR100737730B1 (ko) * 2006-04-21 2007-07-10 주식회사 비에스이 멤스 마이크로폰 패키징 구조
KR100722686B1 (ko) * 2006-05-09 2007-05-30 주식회사 비에스이 부가적인 백 챔버를 갖고 기판에 음향홀이 형성된 실리콘콘덴서 마이크로폰
KR20080101374A (ko) * 2007-05-17 2008-11-21 주식회사 비에스이 콘덴서 마이크로폰

Also Published As

Publication number Publication date
KR101039256B1 (ko) 2011-06-07
WO2011087208A2 (ko) 2011-07-21

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