WO2011087207A3 - 멤스 마이크로폰 패키지 - Google Patents

멤스 마이크로폰 패키지 Download PDF

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Publication number
WO2011087207A3
WO2011087207A3 PCT/KR2010/008251 KR2010008251W WO2011087207A3 WO 2011087207 A3 WO2011087207 A3 WO 2011087207A3 KR 2010008251 W KR2010008251 W KR 2010008251W WO 2011087207 A3 WO2011087207 A3 WO 2011087207A3
Authority
WO
WIPO (PCT)
Prior art keywords
mems microphone
pcb
metal case
microphone package
package
Prior art date
Application number
PCT/KR2010/008251
Other languages
English (en)
French (fr)
Other versions
WO2011087207A2 (ko
Inventor
송청담
김창원
김정민
이원택
박성호
Original Assignee
주식회사 비에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 비에스이 filed Critical 주식회사 비에스이
Publication of WO2011087207A2 publication Critical patent/WO2011087207A2/ko
Publication of WO2011087207A3 publication Critical patent/WO2011087207A3/ko

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups

Abstract

본 발명은 커링 방식에 의한 멤스 마이크로폰 패키지에서 음이 세는 것을 방지한 멤스 마이크로폰 패키지에 관한 것으로, 본 발명의 패키지는 내부에 부품들을 삽입할 수 있도록 일면이 개방된 사각통 형상에서 커링이 용이하도록 개방측 단부의 모서리를 모따기(chamfering)한 금속 케이스; 멤스(MEMS) 마이크로폰 칩과 특수목적형반도체(ASIC)칩이 실장되고 상기 금속 케이스에 삽입되는 PCB 기판; 및 커링과정에서 상기 PCB기판을 지지하고 수지가 코팅되어 상기 금속 케이스와 상기 PCB 기판 사이에 형성된 공간을 밀폐하는 지지 부재를 구비한 것이다. 여기서, 상기 수지는 실리콘 혹은 고무로 된 것이다.
PCT/KR2010/008251 2010-01-18 2010-11-22 멤스 마이크로폰 패키지 WO2011087207A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0004459 2010-01-18
KR1020100004459A KR101109102B1 (ko) 2010-01-18 2010-01-18 멤스 마이크로폰 패키지

Publications (2)

Publication Number Publication Date
WO2011087207A2 WO2011087207A2 (ko) 2011-07-21
WO2011087207A3 true WO2011087207A3 (ko) 2011-10-27

Family

ID=44304755

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/008251 WO2011087207A2 (ko) 2010-01-18 2010-11-22 멤스 마이크로폰 패키지

Country Status (2)

Country Link
KR (1) KR101109102B1 (ko)
WO (1) WO2011087207A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103475983A (zh) * 2013-09-13 2013-12-25 山东共达电声股份有限公司 Mems麦克风及电子设备
US9924253B2 (en) 2015-07-07 2018-03-20 Hyundai Motor Company Microphone sensor
CN106210945A (zh) * 2016-09-07 2016-12-07 上海展扬通信技术有限公司 麦克风密封结构及终端设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200415820Y1 (ko) * 2006-02-13 2006-05-08 주식회사 씨에스티 마이크로폰 조립체
KR100758840B1 (ko) * 2006-06-02 2007-09-14 주식회사 비에스이 실링패드를 이용한 ｓｍｄ용 콘덴서 마이크로폰 및 그제조방법
JP2008067384A (ja) * 2006-09-05 2008-03-21 Bse Co Ltd 四角筒形状のエレクトレットコンデンサマイクロホン
KR20080056441A (ko) * 2006-12-18 2008-06-23 주식회사 비에스이 케이스의 음향홀에 방진 및 방습 수단이 구비된 콘덴서마이크로폰
KR20090039375A (ko) * 2007-10-18 2009-04-22 주식회사 비에스이 멤스 마이크로폰 패키지

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100982239B1 (ko) * 2007-11-02 2010-09-14 주식회사 비에스이 피시비에 음공이 형성된 멤스 마이크로폰 패키지

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200415820Y1 (ko) * 2006-02-13 2006-05-08 주식회사 씨에스티 마이크로폰 조립체
KR100758840B1 (ko) * 2006-06-02 2007-09-14 주식회사 비에스이 실링패드를 이용한 ｓｍｄ용 콘덴서 마이크로폰 및 그제조방법
JP2008067384A (ja) * 2006-09-05 2008-03-21 Bse Co Ltd 四角筒形状のエレクトレットコンデンサマイクロホン
KR20080056441A (ko) * 2006-12-18 2008-06-23 주식회사 비에스이 케이스의 음향홀에 방진 및 방습 수단이 구비된 콘덴서마이크로폰
KR20090039375A (ko) * 2007-10-18 2009-04-22 주식회사 비에스이 멤스 마이크로폰 패키지

Also Published As

Publication number Publication date
KR20110084741A (ko) 2011-07-26
WO2011087207A2 (ko) 2011-07-21
KR101109102B1 (ko) 2012-01-31

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