WO2011079545A1 - 一种发光二极管的封装结构 - Google Patents

一种发光二极管的封装结构 Download PDF

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Publication number
WO2011079545A1
WO2011079545A1 PCT/CN2010/070629 CN2010070629W WO2011079545A1 WO 2011079545 A1 WO2011079545 A1 WO 2011079545A1 CN 2010070629 W CN2010070629 W CN 2010070629W WO 2011079545 A1 WO2011079545 A1 WO 2011079545A1
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Prior art keywords
emitting diode
light emitting
phase flow
conducting device
heat conducting
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PCT/CN2010/070629
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English (en)
French (fr)
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李克勤
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中山伟强科技有限公司
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Priority to JP2012546313A priority Critical patent/JP2013516076A/ja
Publication of WO2011079545A1 publication Critical patent/WO2011079545A1/zh
Priority to US13/495,254 priority patent/US8659049B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a semiconductor package assembly, and more particularly to a package structure of a light emitting diode.
  • Known light-emitting diodes have the characteristics of energy saving, high integration, and are now widely used in various lighting fields.
  • the amount of heat radiated is also large, and with the development of technology, in order to meet the demand for high-brightness illumination, the power and configuration density of the LED chip are also getting higher and higher, which is accompanied by the generation of the LED.
  • the problem of high heat accumulation of the chip is that if the heat generated by the LED chip is not effectively discharged, the heat will seriously affect the light-emitting performance of the LED chip, so the heat dissipation requirement of the LED package is high.
  • the light emitted by the LED chip has the characteristics of a point light source and uneven brightness, it is necessary to improve the loss of the light by focusing on the light and improving the luminous efficiency.
  • an object of the present invention is to provide a package structure of a light emitting diode, which can quickly and efficiently discharge heat generated by the light emitting diode chip, and effectively improve luminous efficiency and ensure service life.
  • a package structure of an LED includes a metal case having an inner cavity and having two open ends, and a two-phase-flow heat having a mounting plane (two-phase-flow heat) Transfer Device, the first open end of the metal casing is provided with a lens, at least one LED chip is located in the inner cavity of the metal casing, and is disposed on the mounting plane of the two-phase flow heat conducting device; the LED chip is electrically connected to the external battery The connecting device, wherein the two-phase heat conducting device, the external electrical connecting device and the light-emitting diode chip are fixed together by a fixing seat.
  • the lens is a Fresnel lens.
  • the two-phase flow heat conduction device is a heat column (heat Column), the upper plane of the hot column is a mounting plane on which the LED chip is disposed.
  • the two-phase flow heat conducting device is provided with at least one heat sink in a direction away from the mounting plane.
  • the two-phase flow heat conduction device is a bent and/or flattened heat pipe (heat Pipe), the installation plane is located in the middle of the heat pipe.
  • At least one heat sink is disposed on each side of the two-phase flow heat conducting device.
  • the two-phase flow heat conducting device is a temperature equalizing plate having at least one convex plane (vapor)
  • the convex plane is a mounting plane on which the light emitting diode chip is disposed.
  • the two-phase flow heat conducting device is a heat pipe
  • the flat end surface above the light pipe is a mounting plane on which the light emitting diode chip is disposed, and the heat pipe is provided with a spiral indentation for installing an additional heat pipe.
  • the invention has the beneficial effects that the light-emitting diode package structure comprising the two-phase flow heat-conducting device adopts the excellent heat exchange performance of the two-phase flow heat-conducting device, and the heat generated by the operation of the light-emitting diode chip can be quickly and effectively from two
  • the phase-flow heat-conducting device is dissipated outside the package structure, thereby achieving good working effect and service life;
  • the present invention can use a Fresnel lens as an illumination window to refract the point light source emitted by the LED chip inside the metal casing to achieve the convergence.
  • the Fresnel lens has a flat shape as a whole, when it is assembled with the metal casing, the space is small, the assembly is easier, and the position of the LED chip inside the metal casing can be set.
  • the two-phase flow heat conduction device used in the present invention can be a heat pipe, a hot column or a soaking heat Plates, which are all cooled by the rapid heat transfer principle of a cold medium in a vacuum environment, and Different shapes can be used, and heat sinks or additional heat pipes can be added to increase the heat dissipation area to achieve better heat dissipation effect;
  • the light-emitting diodes of the package structure of the invention can be discharged in time and can cope with long-term continuous operation. Work and have a long service life.
  • FIG. 1 is a schematic structural view of a first embodiment of a package structure of a light emitting diode according to the present invention
  • FIG. 2 is a schematic structural view of a second embodiment of a package structure of a light emitting diode according to the present invention.
  • FIG. 3 is a schematic structural view of a third embodiment of a package structure of a light emitting diode according to the present invention.
  • FIG. 4 is a schematic structural view of a fourth embodiment of a package structure of a light emitting diode according to the present invention.
  • FIG. 5 is a schematic view showing the overall assembly structure of a fourth embodiment of a package structure of a light emitting diode according to the present invention.
  • FIG. 6 is a schematic structural view of a Fresnel lens used in a preferred embodiment of the present invention.
  • Figure 7 is a side cross-sectional view of a Fresnel lens in a preferred embodiment of the present invention.
  • Figure 8 is a schematic view of a ray travel path of a Fresnel lens
  • Fig. 9 is a schematic view showing the use effect of the present invention.
  • a package structure of an LED is mainly composed of the following structures:
  • a metal housing 2 having a cavity 21 and two openings, the inner cavity 21 for accommodating internal components such as the light-emitting diode chip 1, these components being mounted in the inner cavity 21 from the bottom of the metal housing 2;
  • the lens 3 is used for collecting light emitted by the LED chip 1, so that the light exerts a better effect;
  • a two-phase flow heat conducting device 4 having a mounting plane 41 connected to the second open end of the metal casing 2, the two-phase flow heat conducting device 4 used in the present invention is a flow system composed of two-phase materials, usually
  • the phase states used can be divided into gas-liquid system, liquid-liquid system, liquid-solid system, gas-solid system, such as the device used in the present invention, and the typical structure includes a closed space with a high vacuum, which is favorable for the medium phase.
  • liquid for example, filling a small amount of working fluid in a closed space, such as water, ethanol, ammonia or a mixture thereof as a medium for two-phase flow, and forming a series of capillary structures on the inner wall of the closed space, thereby It can be used to transport liquid medium; in operation, the latent heat of the two-phase flow of the working fluid is utilized, and the heat received by the two-phase flow heat conducting device at one end is quickly and massively transmitted to the other end position to achieve the effect of heat exchange.
  • the two-phase flow heat conducting device can be realized by a typical heat pipe, a hot column or a structure of a temperature equalizing plate;
  • the at least one LED chip 1 is located in the inner cavity 21 of the metal casing 2, and is disposed on the mounting plane of the two-phase heat conduction device 4, and can usually be fixed by welding;
  • the external electrical connection device 5 is connected to the LED chip 1 and the external circuit.
  • the external electrical connection device 5 is generally provided with at least one electrically connected to the at least one LED chip 1.
  • the common structure can be metal wire or metal connection. Electric film
  • the lens 3 and the metal casing 2 of the present invention can adopt the conventional structure in the industry.
  • the lens 3 is a Fresnel lens, and its structure can be referred to FIG. 6 and FIG.
  • the lens structure has a flat surface on one side and a concentric circular path of different sizes on the other side. Its texture is designed by utilizing the interference of light and the relative sensitivity and receiving angle, which can produce focusing effect.
  • the concentrating effect is good, and the luminous efficiency can be improved, and at the same time, the structure is simple and small, and the space-saving material is characterized; as shown in Fig. 8, the light of the light source 7 is refracted by the Fresnel lens, and the light is visible.
  • the point source emitted by the diode chip after being refracted by the Fresnel lens, can illuminate the lighter and concentrated light. On the contrary, if the light source is parallel to the Fresnel lens, the light will be refracted and will be focused together.
  • the Fresnel lens is applied to the package structure of the present invention, and a better use effect can be obtained, and since the Fresnel lens is entirely flat
  • the flat shape when assembled with the metal casing 2, takes up a small space, which makes assembly easier, and enables the position of the light-emitting diode chip 1 inside the metal casing 2 to be closer to the opening, thereby making full use of the light source
  • the heat generated by the LED chip 1 does not affect the lens 3 due to the proximity, thereby ensuring the use performance for a longer working time, and the actual use effect is shown in FIG.
  • phosphor powder (not shown) is coated on the back surface of the lens 3, and is packaged facing the light-emitting diode chip.
  • the inner cavity 21 of the metal casing 2 has a smooth surface, and has a shape of a bowl or a cone, which can refract light emitted by the point source of the light-emitting diode chip 1 and is refracted to the lens 3. Its focus and improved luminous efficiency, so that the overall design can achieve the best results.
  • the two-phase flow heat transfer device 4 of the present invention typically comprises a high vacuum closed space, and a capillary structure is formed on the inner wall thereof, and the necessary working fluid is filled in the closed space.
  • FIG. 1 shows a first embodiment of the present invention, wherein the two-phase flow heat conducting device 4 is a hot column, the fixing base 6 is disposed under the metal casing 2, and the two-phase flow heat conducting device 4 is located in the middle of the fixing seat 6 and Extending from below to form a heat dissipating portion, the inside of the hot column is a vacuum, and is provided with a working fluid and a capillary structure for heat conduction, and the upper surface thereof is a mounting plane 41 on which the LED chip 1 is disposed, and away from the mounting plane 41
  • a heat sink 42 is disposed in the direction, and a plurality of heat sinks 42 may be disposed for increasing the heat dissipation area, thereby assisting in increasing the heat dissipation effect.
  • the two-phase flow heat conduction device 4 is a heat pipe formed by bending and/or flattening, a heat pipe inside and a two-phase flow guiding structure, and the installation thereof
  • the plane 41 is located in the middle of the heat pipe, so that both ends become the heat radiating portion
  • the fixing seat 6 is disposed under the metal casing 2
  • the two-phase flow heat conducting device 4 is located thereon, and is extended from both sides to form heat radiating portions on both sides.
  • the heat generated by the LED chip 1 installed in the middle portion during operation can be simultaneously transmitted from both sides, which increases the heat exchange efficiency.
  • the heat dissipating fins 42 are respectively disposed on two sides of the two-phase flow heat conducting device 4, and the heat dissipating fins 42 may be disposed in plurality to increase the heat dissipating area, thereby assisting in increasing the heat conducting effect.
  • FIG. 3 is a third embodiment of the present invention, wherein the two-phase flow heat conducting device 4 is a temperature equalizing plate having at least one convex plane, and the heat equalizing plate is also an internal vacuum, and is filled with a working fluid, wherein the convex plane That is, the mounting plane 41 of the LED chip 1 is disposed, the fixing seat 6 is disposed above the two-phase heat conduction device 4, and the mounting plane 41 is located between the fixing seats 6; the heat dissipation area of the heat equalizing plate is large, so that no additional extra Heat sink.
  • the two-phase flow heat conducting device 4 is a temperature equalizing plate having at least one convex plane
  • the heat equalizing plate is also an internal vacuum, and is filled with a working fluid, wherein the convex plane That is, the mounting plane 41 of the LED chip 1 is disposed, the fixing seat 6 is disposed above the two-phase heat conduction device 4, and the mounting plane 41 is located between the fixing seats 6; the heat dissipation area of the heat equalizing plate
  • FIG. 4 shows a fourth embodiment of the present invention, wherein the two-phase flow heat conducting device 4 is a heat pipe, and the inside of the heat pipe is a typical two-phase flow guiding structure, various components are fixed above the fixing seat 6, and two phases are thermally conductive in the middle portion.
  • the device 4 is extended and exited, and the flat end surface above the two-phase flow heat conducting device 4 is a mounting plane 41 on which the LED chip 1 is disposed.
  • a spiral indentation 43 is provided on the heat pipe, and the indentation 43 is provided.
  • An additional heat pipe 44 of a suitable shape can be secured, the structure of which is finally assembled together as shown in FIG.
  • the tail end of the external electrical connection device 5 passes through the fixing base 6 to form an external electrode, so that the external circuit can be directly connected.

Description

一种发光二极管的封装结构
技术领域
本发明涉及一种半导体封装组件，尤其是一种发光二极管的封装结构。
背景技术
公知的发光二极管具有省电节能、集成度高的特性，现在已普遍使用在各种照明领域。发光二极管在使用时，散发的热量也较大，并且随着科技的发展，为了因应高亮度照明的需求，发光二极管芯片的功率与配置密度也越来越高，这样伴随着也产生了发光二极管芯片热量积蓄高的问题，如果发光二极管芯片在工作时产生的热量无法有效排出，那么这些热量就会严重影响发光二极管芯片的发光性能，因此行业对发光二极管封装的散热要求都很高。目前公知的发光二极管封装结构，通常是安装于印刷电路板上，采用通过印刷电路板将热量传递到散热器上的方式进行散热，如此的结构，其散热的效果欠佳，最终将有导致发光二极管芯片损坏缩短使用寿命之虞。
由于发光二极管芯片所发出的光线具有点光源、亮度不均匀的特点，因此就有必要在光线的聚焦以及提高发光效率着手改进其缺失。
发明内容
针对上述问题，本发明的目的在于提供一种发光二极管的封装结构，其可将发光二极管芯片所产生的热快速且有效地排出，并且有效的提高发光效率，保证使用寿命。
本发明针对其技术问题所采用的技术方案是：
　 一种发光二极管的封装结构，包括有一具有内腔，并设有两开口端的金属壳体以及一具有安装平面的两相流导热装置（two-phase-flow heat transfer device），金属壳体的第一开口端设置有透镜，至少一个发光二极管芯片位于金属壳体的内腔内，并设置于两相流导热装置的安装平面上；发光二极管芯片电气连接有对外电性连接装置，其中两相流导热装置、对外电性连接装置以及发光二极管芯片通过固定座固定在一起。
　　作为上述方案的进一步改进，所述透镜为菲涅尔透镜。
　　作为上述方案的进一步改进，所述两相流导热装置为热柱(heat column)，该热柱的上平面为设置发光二极管芯片的安装平面。
　　其中，所述两相流导热装置离开安装平面的方向上设有至少一个散热片。
　　作为上述方案的进一步改进，所述两相流导热装置为经折弯及/或压扁的热管(heat pipe)，其安装平面位于热管中部。
　　其中，所述两相流导热装置两侧分别设有至少一个散热片。
　　作为上述技术方案的进一步改进，所述两相流导热装置为具有至少一凸平面的均温板(vapor chamber)，所述凸平面为设置发光二极管芯片的安装平面。
　　作为上述技术方案的进一步改进，所述所述两相流导热装置为热管，其上方的平整端面为设置发光二极管芯片的安装平面，在热管上设有用于安装额外热管的螺旋状凹痕。
　　本发明的有益效果是：本发明采用包含两相流导热装置的发光二极管封装结构，通过两相流导热装置优异的热交换性能，发光二极管芯片工作时产生的热量，可以快速有效的地从两相流导热装置散发到封装结构外，因此达到良好的工作效果与使用寿命；本发明可采用菲涅尔透镜作为照射窗口，将金属壳体内部发光二极管芯片发出的点光源折射照出，达到聚光及提高发光效率的效果，而由于菲涅尔透镜整体为一扁平形状，在与金属壳体装配时，占用空间小，装配更为容易，并使得金属壳体内部的发光二极管芯片位置能够设置得更为接近开口，充分采用了光源，且芯片产生的热量不会影响透镜，保证了更长时间工作的使用性能；本发明所采用的两相流导热装置可为热管、热柱或均热板，它们都是采用真空环境下冷介质的快速传热原理进行散热，并且可以采用不同的形状，以及增设散热片或额外的热管来增加散热面积，达到更好的散热效果；采用本发明的封装结构的发光二极管，其工作时热量能够得以及时排出，能够应对长时间连续的工作，并且具有着很长的使用寿命。
附图说明
下面结合附图和具体实施方式，对本发明作进一步的说明：
图1为本发明发光二极管的封装结构实施例一的结构示意图；
图2为本发明发光二极管的封装结构实施例二的结构示意图；
图3为本发明发光二极管的封装结构实施例三的结构示意图；
图4为本发明发光二极管的封装结构实施例四的结构示意图；
图5为本发明发光二极管的封装结构实施例四的整体装配结构示意图；
图6为本发明优选实施方式中采用的菲涅尔透镜的结构示意图；
图7为本发明优选实施方式中菲涅尔透镜的侧面剖视图；
图8为菲涅尔透镜的光线行进路径示意图；
图9为本发明的使用效果示意图。
具体实施方式
　　参照图1、图2、图3、图4、图5及图9为本发明的一种发光二极管的封装结构，其主要由以下结构组成：
　一具有内腔21，并设有两开口的金属壳体2，内腔21用于容纳内部的元件例如发光二极管芯片1，这些元件从金属壳体2的底部安装于内腔21内；
　一设置于金属壳体2的第一开口端的透镜3，透镜3用于聚集发光二极管芯片1发出的光线，使得光线发挥更好的效果；
　一具有安装平面41的两相流导热装置4，其连接于金属壳体2的第二开口端，本发明所采用的两相流导热装置4，即为两相物质所组成的流动系统，通常使用的相态可分为气液系、液液系、液固系、气固系，例如本发明所采用装置，其典型的结构包括有一个高度真空的密闭空间，该密闭空间有利于介质相态的转换，常为液态，例如可在密闭空间填充少量的工作流体，例如水、乙醇、氨水或其混合物作为两相流导的介质，而且在该密闭空间内壁上形成一系列毛细结构，从而可用于传输液态介质；在工作时，利用工作流体两相变化的潜热，将该两相流导热装置在一端位置接受的热迅速且大量地传导至另一端位置，达到热交换的效果。在本发明下述的实施例中，两相流导热装置可采用典型的热管、热柱或均温板的结构形式来实现；
　至少一个发光二极管芯片1位于金属壳体2的内腔21内，并设置于两相流导热装置4的安装平面上，通常可采用焊接方式固定；
　连接发光二极管芯片1及外部电路的对外电性连接装置5，该外电性连接装置5一般至少设有一个，与至少一个的发光二极管芯片1电气连接，例如常见的结构可采用金属导线或金属接电片；
　一用于将两相流导热装置4、对外电性连接装置5以及发光二极管芯片1固定在一起的固定座6。
　　本发明所述的透镜3及金属壳体2可采用业内常规的结构，然而作为本发明的优选实施方式，所述透镜3为菲涅尔透镜，其结构可参照图6及图7，菲涅尔透镜结构一面为平面，另一面设有大小不等的同心圆纹路，它的纹路是利用光的干涉及扰射和根据相对灵敏度和接收角度要求来设计的，可以产生聚焦作用，其特性是聚光效果佳，并且可以提升发光效率，同时兼具结构简单体积小，节省空间材料等特点；如图8给出的为一点光源7的光线经过菲涅尔透镜折射后的效果，可见对于发光二极管芯片发出的点光源，经菲涅尔透镜折射后，可以照射出较为平均并且聚集的光线，相反的如果是平行的光源其光线在行经菲涅尔透镜时，光线经折射后会聚焦在一起，因此菲涅尔透镜应用于本发明的封装结构上，可以得到较佳的使用效果，而由于菲涅尔透镜整体为一扁平形状，在与金属壳体2装配时，占用空间小，将使得装配更为容易，并使得金属壳体2内部的发光二极管芯片1位置能够设置得更为接近于开口，从而充分利用了光源，而发光二极管芯片1产生的热量又不会因距离近而影响透镜3，从而保证了更长时间工作的使用性能，其实际使用效果如图9。在实际的应用于本发明的封装结构时，须在该透镜3背面涂布荧光粉(图中未显示)，并且面对着发光二极管芯片进行封装。
　　并且作为优选方式，所述金属壳体2的内腔21具有光滑表面，且其形状呈碗状或圆锥状，可折射由发光二极管芯片1的点光源所发出的光线，折射到透镜3可使其聚焦并提高发光效率，如此可以使整体设计达到最佳的效果。
　　如前所述，本发明的两相流导热装置4典型的包含高度真空的密闭空间，且在其内壁上形成有毛细结构，在此密闭空间内填充必要的工作流体，下面列举了几种不同的实施例以供参考：
　　如图1所示为本发明的实施例一，其中所述两相流导热装置4为热柱，固定座6设置于金属壳体2下方，两相流导热装置4便位于固定座6中部并从下方延及出去形成散热部，该热柱内部即为真空，并设有工作液及毛细结构用于导热，在其上平面为设置发光二极管芯片1的安装平面41，而在离开安装平面41的方向上设有散热片42，散热片42可设置多个，用于增加散热面积，从而辅助增加散热效果。
　　如图2所示为本发明的实施例二，其中所述两相流导热装置4为经折弯及/或压扁制成的热管，热管内部及为两相流导的结构，并且其安装平面41位于热管中部，这样两端便都成为了散热部，固定座6设置于金属壳体2下方，两相流导热装置4位于其上，并从两方延及出去形成两侧的散热部，安装于其中部的发光二极管芯片1在工作时产生的热量可同时从两侧传递出去，增加了热交换效率。并且，该两相流导热装置4两侧分别设有散热片42，散热片42可设置多个，用于增加散热面积，从而辅助增加导热效果。
　　如图3所示为本发明的实施例三，其中所述两相流导热装置4为具有至少一凸平面的均温板，均热板也是内部真空，并注有工作液，其中的凸平面即为设置发光二极管芯片1的安装平面41，固定座6设置于两相流导热装置4上方，安装平面41便位于固定座6之间；均热板的散热面积较大，因此可以不增加额外的散热片。
　　如图4所示为本发明的实施例四，其中两相流导热装置4为热管，热管内部为典型的两相流导结构，固定座6上方固定各种元件，中部则供两相流导热装置4向外延及出去，两相流导热装置4上方的平整端面为设置发光二极管芯片1的安装平面41，此外，为了增加散热效果，在热管上设有螺旋状凹痕43，该凹痕43可以固定住形状相适配的额外热管44，其最终装配在一起的结构如图5所示。
　　此外，在实际运用中为了方便接电，对外电性连接装置5尾端穿过所述固定座6而形成外部电极，这样可直接连接外电路。
　　当然，上述只是本发明参照较佳实施例而进行的说明示范，惟应了解的是在不脱离本发明之精神及范畴内，对于本发明所属技术领域中具有通常知识者而言，仍得有许多变化及修改。因此，本发明并不限制于所揭露的实施例，而是以后附申请专利范围之文字记载为准，即不偏离本发明申请专利范围所为之均等变化与修饰，应仍属本发明之涵盖范围。

Claims (10)

  1. 一种发光二极管的封装结构，包括发光二极管芯片（1），其特征在于还包括有：
    　一具有内腔（21），并设有两开口端的金属壳体（2）；
    　一设置于金属壳体（2）的第一开口端的透镜（3）；
    　一具有安装平面（41）的两相流导热装置（4），连接于金属壳体（2）的第二开口端；
    　至少一个发光二极管芯片（1）位于金属壳体（2）的内腔（21）内，并设置于两相流导热装置（4）的安装平面（41）上；
    　连接发光二极管芯片（1）及外部电路的对外电性连接装置（5）；
    　一用于将两相流导热装置（4）、对外电性连接装置（5）以及发光二极管芯片（1）固定在一起的固定座（6）。
  2. 根据权利要求1所述的一种发光二极管的封装结构，其特征在于：所述透镜（3）为菲涅尔透镜。
  3. 根据权利要求1所述的一种发光二极管的封装结构，其特征在于：所述金属壳体（2）的内腔（21）具有光滑表面，且其形状呈碗状或圆锥状。
  4. 根据权利要求1~4中任意一项权利要求所述的一种发光二极管的封装结构，其特征在于：所述两相流导热装置（4）为热柱，该热柱的上平面为设置发光二极管芯片（1）的安装平面（41）。
  5. 根据权利要求4所述的一种发光二极管的封装结构，其特征在于：所述两相流导热装置（4）离开安装平面（41）的方向上设有至少一个散热片（42）。
  6. 根据权利要求1~4中任意一项权利要求所述的一种发光二极管的封装结构，其特征在于：所述两相流导热装置（4）为经折弯及/或压扁的热管，其安装平面（41）位于热管中部。
  7. 根据权利要求6所述的一种发光二极管的封装结构，其特征在于：所述两相流导热装置（4）两侧分别设有至少一个散热片（42）。
  8. 根据权利要求1~4中任意一项权利要求所述的一种发光二极管的封装结构，其特征在于：所述两相流导热装置（4）为具有至少一凸平面的均温板，所述凸平面为设置发光二极管芯片（1）的安装平面（41）。
  9. 根据权利要求1~4中任意一项权利要求所述的一种发光二极管的封装结构，其特征在于：所述两相流导热装置（4）为热管，其上方的平整端面为设置发光二极管芯片（1）的安装平面（41），在热管上设有用于安装额外热管（44）的螺旋状凹痕（43）。
  10. 根据权利要求1所述的一种发光二极管的封装结构，其特征在于：所述对外电性连接装置（5）尾端穿过所述固定座（6）而形成外部电极。
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