WO2011077738A1 - インサート成形用装飾フィルム、インサート成形品及びインサート成形用装飾フィルムの製造方法 - Google Patents
インサート成形用装飾フィルム、インサート成形品及びインサート成形用装飾フィルムの製造方法 Download PDFInfo
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- WO2011077738A1 WO2011077738A1 PCT/JP2010/007475 JP2010007475W WO2011077738A1 WO 2011077738 A1 WO2011077738 A1 WO 2011077738A1 JP 2010007475 W JP2010007475 W JP 2010007475W WO 2011077738 A1 WO2011077738 A1 WO 2011077738A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0015—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterized by the colour of the layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
Definitions
- the present invention relates to a decorative film for insert molding for covering an exterior of a resin molded product, an insert molded product, and a method for manufacturing the decorative film for insert molding.
- Patent Document 1 and Patent Document 2 In order to decorate the outer surface of a resin molded product such as a mobile phone, a film whose color changes depending on the viewing angle is provided. Specifically, there is a method of adding a pearl pigment to a film (see Patent Document 1 and Patent Document 2). However, in the method of adding pearl pigments proposed in Patent Document 1 and Patent Document 2, since the amount of pearl pigment added is limited, the range of colors such as reflectance is limited. The problem of not becoming was a problem. In order to solve this problem, Patent Documents 3 and 4 include a method of adjusting optical characteristics by stacking thin films made of dielectric materials by vapor deposition. However, when the film obtained by the method proposed in Patent Document 3 or Patent Document 4 is actually used for insert molding, there is a problem that the film peels off.
- the present invention provides an insert molded product that does not cause cracks or peeling on the exterior and a decorative film for insert molding therefor, and makes this film widely variable in color and brightness depending on the viewing angle.
- An object of the present invention is to provide a production method capable of satisfying the requirements.
- the decorative film for insert molding according to the present invention has a decorative layer on one side of the transparent resin film as described in claim 1, and the decorative layer side is positioned on the main body side of the resin molded product obtained by insert molding.
- the decorative layer for insert molding is formed by stacking dielectric layers so that the total thickness is 50 nm to 800 nm, and the compressive stress of the decorative layer is 250 MPa. It is characterized by being set to ⁇ 350 MPa.
- the transparent resin film is made of a polyethylene or polyolefin resin having a thickness of 50 ⁇ m to 200 ⁇ m.
- a hard coat layer having a thickness of 0.5 ⁇ m to 10 ⁇ m is provided on a surface of the transparent resin film opposite to the decorative layer. It is characterized by providing.
- the decorative layer in the decorative film for insert molding according to any one of the first to third aspects, includes a silicon dioxide layer and a niobium pentoxide layer having a thickness of 5 nm to 200 nm alternately. It is characterized by being laminated on. Moreover, the insert molded product of this invention was equipped with the decorative film for insert molding of any one of Claims 1 thru
- the manufacturing method of the decorative film for insert molding of this invention is provided with the decoration layer in the single side
- the main body of the resin molded product obtained by insert molding the said decoration layer side A method for producing an insert-molding decorative film formed so as to be positioned on the side, wherein a metal atom is sputtered at a film forming pressure of 0.5 Pa to 1.0 Pa, and a thickness of 5 nm to 200 nm is formed on the transparent resin film. After the metal atomic layer is formed, it is oxidized to form a dielectric layer, and the dielectric layer is repeatedly formed to form the decorative layer by laminating the dielectric layer.
- the compressive stress of the decorative layer is 250 MPa to 350 MPa. It is characterized by becoming.
- the transparent resin film is composed of a polyethylene or polyolefin resin having a thickness of 50 ⁇ m to 200 ⁇ m, A hard coat layer having a thickness of 0.5 ⁇ m to 10 ⁇ m is provided on the surface opposite to the layer, and the thickness of the decorative layer is 50 nm to 800 nm.
- the invention according to claim 8 is the method for producing a decorative film for insert molding according to claim 6 or 7, wherein a silicon dioxide layer having a thickness of 5 nm to 200 nm and a niobium pentoxide layer are alternately formed as the dielectric layer.
- the decorative layer is formed by laminating, the sputtering temperature of each dielectric layer is 80 ° C. or less, the deposition rate of the silicon dioxide layer is 1.0 to 3.0 mm / sec, and the niobium pentoxide layer is formed.
- the film rate is set to 1.0 to 2.5 liters / sec.
- the decorative film for insert molding of the present invention it becomes possible to prevent peeling and cracks appearing on the outer surface of a resin molded product such as a mobile phone. Moreover, peeling and cracking at the time of insert molding can be prevented. Furthermore, according to the production method of the present invention, it is possible to obtain a decorative film for insert molding that can have a wide range of desired colors and brightness.
- the decorative film for insert molding of the present invention is used for known insert molding (for example, disclosed in Patent Document 1), and is integrated as a molded product during resin molding.
- This decorative film for insert molding includes a decorative layer formed by laminating a plurality of dielectric layers having different refractive indexes on one side of the transparent resin film (the main body side opposite to the surface side of the molded product). .
- Each dielectric layer is formed by sputtering of metal atoms and oxidation of the sputtered atoms, so that the entire decorative layer has a thickness of 50 nm to 800 nm and a compressive stress of 250 MPa to 350 MPa.
- the combination of the thickness of the entire decorative layer and the compressive stress can prevent cracking and peeling in the decorative layer during insert molding or subsequent use of the molded product. Finding that if the thickness is less than 50 nm or the compressive stress is less than 250 MPa, the adhesive force is insufficient and peeling occurs, and if the thickness exceeds 800 nm or more than 350 MPa, the stress at the time of molding becomes too large and cracks occur. Because.
- the material of the transparent resin film is not particularly limited as long as it is transparent or translucent, and is not easily stretched by heat during insert molding.
- polyvinyl chloride, amorphous or low crystalline polyester type Alternatively, it can be composed of polypropylene-based, polybutylene terephthalate-based, unstretched or low-stretched ethylene vinyl alcohol-based resins, among which it is preferable to use ethylene-based or polyolefin-based resins from the viewpoint of optical properties.
- the thickness is not particularly limited, but is preferably about 20 ⁇ m to 500 ⁇ m.
- the thickness is less than 20 ⁇ m, handling properties such as handling work are difficult, and if it exceeds 500 ⁇ m, the rigidity becomes too high to follow the processed shape at the time of molding, so that cracks and the like occur.
- the range of 50 ⁇ m to 200 ⁇ m is particularly preferable. It is preferable to provide a hard coat layer having a thickness of 0.5 ⁇ m to 10 ⁇ m on the surface of the transparent resin film opposite to the decorative layer. This is because the surface of the insert molded product can be protected.
- the film thickness of the hard coat layer is less than 0.5 ⁇ m, the surface of the transparent resin film is not sufficiently protected, and if it exceeds 10 ⁇ m, curing due to heating or radiation is not sufficiently obtained and blocking is likely to occur. is there.
- a silane-based material or a radiation curable material can be used, but a radiation curable material is preferable, and among them, an ultraviolet curable material is preferable.
- the dielectric layer can be selected from metal oxides that provide a desired reflection angle, chromaticity, and the like.
- metal oxides that provide a desired reflection angle, chromaticity, and the like.
- a silicon compound such as SiO 2 having a refractive index of 1.5 or less is used as the low refractive index layer, and the refractive index is used as the high refractive index layer.
- a Nb 2 O 5 niobium oxide of 2.0 or more, a titanium compound of TiO 2 or the like can be used.
- each dielectric layer is not particularly limited as long as the thickness of the entire dielectric layer is in the range of 50 nm to 800 nm as described above, but the thickness of each dielectric layer is 5 nm to The thickness is preferably 200 nm. This is because when the thickness is less than 5 nm, it is difficult to optically control each dielectric layer, and when it exceeds 200 nm, the cost is increased for industrial production.
- the decorative film for insert molding is placed in a mold during insert molding, and a molding resin such as polypropylene resin, acrylonitrile butadiene styrene resin, polystyrene resin, ethylene vinyl oxide resin, polycarbonate resin, or nylon resin is injected into the mold. Integrated as a molded product.
- a molding resin such as polypropylene resin, acrylonitrile butadiene styrene resin, polystyrene resin, ethylene vinyl oxide resin, polycarbonate resin, or nylon resin is injected into the mold.
- a molding resin such as polypropylene resin, acrylonitrile butadiene styrene resin, polystyrene resin, ethylene vinyl oxide resin, polycarbonate resin, or nylon resin is injected into the mold.
- a molding resin such as polypropylene resin, acrylonitrile butadiene styrene resin, polystyrene resin, ethylene vinyl oxide resin, polycarbonate resin,
- a cylindrical rotating body 3 for supporting a base material 2 is arranged at the center in a cylindrical vacuum chamber 1, and the first rotating along the inner periphery of the chamber 1.
- the sputtering region 4, the ion gun 5, the second sputtering region 6, and the third sputtering region 7 are arranged in this order.
- a vacuum pump is connected to the vacuum chamber 1 so that the inside of the chamber 1 can be evacuated.
- the first to third sputtering regions 4, 6, and 7 are formed by sputtering a film material on the base material 2.
- sputtering gas is provided in the vicinity of the base material 2.
- a gas inlet (not shown) for introduction is provided.
- Each region 4, 6 and 7 is provided with cathodes 11 to 13 to which targets 8 to 10 are attached so as to face the cylindrical rotating body 3, respectively.
- These cathodes 11 to 13 are connected to a direct current or an alternating current power source (not shown) for supplying power to the targets 8 to 10.
- shutters 14 to 16 are provided on the base material 2 side of each of the regions 4, 6, and 7, so that the shutters 14 to 16 are selectively opened during film formation in each of the regions 4, 6, and 7. It has become.
- the ion gun 5 is used to oxidize metal atoms formed in the respective regions 4, 6, and 7.
- An oxygen inlet is provided to introduce oxygen into the region, and a magnetic circuit is provided. Yes.
- a waveguide outside the vacuum chamber 1 and a microwave antenna inside the vacuum chamber 1 are connected via a microwave introduction window.
- the first metal is formed on the base material 2 with a film thickness of about a monoatomic layer by the first sputtering region 4, and the cylindrical rotating body 3 is rotated and oxidized by the ion gun 5 to be oxidized.
- 1 metal oxide film (first dielectric layer) and further rotating the cylindrical rotating body 3 to form a second metal with a film thickness of about a monoatomic layer by the second sputtering region 6;
- the cylindrical rotating body 3 is rotated and oxidized by the ion gun 5 to form a second metal oxide film (second dielectric layer). These are alternately repeated, and a plurality of dielectric layers are laminated on the substrate 2.
- a decorative film is formed.
- the decorative film can be provided with a desired color and brightness.
- the film forming pressure during sputtering and oxidation of the metal material is set to 0.5 Pa to 1.0 Pa. If the film forming pressure is less than 0.5 Pa, the compressive stress of the decorative layer exceeds 350 MPa, and cracks and peeling occur during insert molding. If the film forming pressure exceeds 1.0 Pa, the compressive stress of the decorative layer becomes less than 250 MPa. This is because the adhesion is insufficient and peeling occurs.
- the sputtering temperature is set to 80 ° C. or lower (the lower limit is the temperature at which plasma is generated in the subsequent oxidation). It is preferable. This is because a uniform film having a thickness of about a single atom can be formed at high speed. In this case, the film formation rate can be arbitrarily adjusted. For example, in the case of Nb 2 O 5 , 1.0 to 2.5 ⁇ / s, and in the case of SiO 2 , 1.0 to 3. It can be set to 0 s / s or the like.
- Si Power source DC power source Oxidation source: Ion gun Deposition temperature: Room temperature Cathode input power: 6 w / cm 2 Ar flow rate: 500 sccm O 2 flow rate: 100 sccm b) Nb 2 O 5
- Si Power source DC power source Oxidation source: Ion gun Deposition temperature: Room temperature Cathode input power: 5 w / cm 2 Ar flow rate: 500 sccm O 2 flow rate: 300 sccm
- Example 1 Using the apparatus described in the above embodiment, the vacuum chamber 1 of the apparatus is depressurized to 8.0 ⁇ 10 ⁇ 4 Pa and Ar is introduced into the first sputtering region 4. As shown in FIG. 2, the process of forming a Nb film on one surface of the substrate 2 by sputtering and the process of rotating the cylindrical rotating body 3 and oxidizing the Nb film by the ion gun 5 are repeated.
- the Nb 2 O 5 film (dielectric layer) 17 had a thickness of 87.0 nm.
- the inside of the vacuum chamber 1 is adjusted to 8.0 ⁇ 10 ⁇ 4 Pa, Ar is introduced into the sputtering region 6, and power is supplied to the cathode 12 to form a Si film having a thickness of 100.0 nm by sputtering. did.
- the cylindrical rotating body 3 was rotated, and the Nb film was oxidized by the ion gun 5 to obtain a SiO 2 film (dielectric layer) 18.
- an Nb 2 O 5 film (dielectric layer) 19 having a film thickness of 87.0 nm was formed thereon, similarly to the film formation of the Nb 2 O 5 film 17.
- a urethane-based two-component curable ink (WO7 (RX002) manufactured by Seiko Advance Co., Ltd.) is applied on the Nb 2 O 5 film 19 to a film thickness of 3 ⁇ m by screen mesh printing to form an insert molding film 20 as a decorative film 20. did.
- Example 2 Seven layers of Nb 2 O 5 films and SiO 2 films were alternately laminated in the same manner as in Example 1 in order from the substrate side, and finally a decorative film was formed with the same ink as in Example 1.
- FIGS. 3 and 4 For the film for insert molding obtained in Examples 1 and 2, reflection characteristics and chromaticity diagrams with respect to an incident angle of light incident on the film are shown in FIGS. 3 and 4, respectively. From these figures, it was found that an arbitrary decorative film can be obtained by adjusting the number of layers and the film thickness of the color and brightness depending on the viewing angle.
Abstract
Description
しかしながら、特許文献1及び特許文献2に提案されたパール顔料を添加する方法ではパール顔料の添加量に制約があることから反射率等の色彩の範囲に制限があるため、所望の装飾色とはならないということが問題となっていた。
この問題を解決するために、特許文献3や特許文献4には誘電材料から構成される薄膜を蒸着により積層して光学特性を調整する方法がある。
しかしながら、特許文献3や特許文献4に提案された方法により得られたフィルムを実際にインサート成形に使用するとフィルムが剥離してしまうという問題があった。
即ち、本願発明のインサート成形用装飾フィルムは、請求項1に記載の通り、透明樹脂フィルムの片面側に装飾層を備え、前記装飾層側をインサート成形により得られる樹脂成形品の本体側に位置するように成形されるインサート成形用装飾フィルムであって、前記装飾層は、全体の厚さが50nm~800nmとなるように誘電体層を積層して構成され、前記装飾層の圧縮応力を250MPa~350MPaとしたことを特徴とする。
請求項2記載の本発明は、請求項1に記載のインサート成形用装飾フィルムにおいて、前記透明樹脂フィルムは、厚さ50μm~200μmのポリエチレン系又はポリオレフィン系の樹脂から構成されることを特徴とする。
請求項3記載の本発明は、請求項1又は2に記載のインサート成形用装飾フィルムにおいて、前記透明樹脂フィルムの前記装飾層と反対の面には、厚さ0.5μm~10μmのハードコート層を備えることを特徴とする。
請求項4記載の本発明は、請求項1乃至3の何れか1項に記載のインサート成形用装飾フィルムにおいて、前記装飾層は、厚さ5nm~200nmの二酸化ケイ層及び五酸化ニオブ層を交互に積層したものであることを特徴とする。
また、本発明のインサート成形品は、請求項5に記載の通り、請求項1乃至4の何れか1項に記載のインサート成形用装飾フィルムを備えたことを特徴とする。
また、本発明のインサート成形用装飾フィルムの製造方法は、請求項6に記載の通り、透明樹脂フィルムの片面側に装飾層を備え、前記装飾層側をインサート成形により得られる樹脂成形品の本体側に位置するように成形されるインサート成形用装飾フィルムの製造方法であって、成膜圧力を0.5Pa~1.0Paとして金属原子をスパッタリングして前記透明樹脂フィルム上に厚さ5nm~200nmの金属原子層を成膜した後に酸化して誘電体層とし、前記誘電体層の成膜を繰り返して前記誘電体層を積層して前記装飾層とし、前記装飾層の圧縮応力を250MPa~350MPaとなるようにすることを特徴とする。
請求項7記載の本発明は、請求項6に記載のインサート成形用装飾フィルムの製造方法において、前記透明樹脂フィルムは、厚さ50μm~200μmのポリエチレン系又はポリオレフィン系の樹脂から構成され、前記装飾層と反対の面には、厚さ0.5μm~10μmのハードコート層が設けられ、前記装飾層の厚さは50nm~800nmであることを特徴とする。
請求項8記載の本発明は、請求項6又は7に記載のインサート成形用装飾フィルムの製造方法において、前記誘電体層として厚さ5nm~200nmの二酸化ケイ素層と五酸化ニオブ層とを交互に積層して前記装飾層を構成し、各誘電体層のスパッタリング時の温度を80℃以下、二酸化ケイ素層の成膜レートを1.0~3.0Å/sec、及び、五酸化ニオブ層の成膜レートを1.0~2.5Å/secとすることを特徴とする。
このインサート成形用装飾フィルムは、透明樹脂フィルムの片面側(成形品の表面側とは反対の本体側)に屈折率の異なる複数の誘電体層を積層して構成される装飾層を備えている。各誘電体層は金属原子のスパッタリングとスパッタリングされた同原子の酸化により形成され、装飾層全体の厚さが50nm~800nm及び圧縮応力が250MPa~350MPaとなるようにしている。この装飾層全体の厚さと圧縮応力との組み合わせにより、インサート成形時やその後の成形品の使用時に装飾層におけるクラックや剥離を防ぐことができる。厚さが50nm未満又は圧縮応力が250MPa未満であると密着力が不足して剥離を生じ、厚さが800nmを超えること又は350MPaを超えることにより成形時の応力が大きくなりすぎクラックが生じるを知見したためである。
尚、透明樹脂フィルムの装飾層と反対の面には、厚さ0.5μm~10μmのハードコート層を設けることが好ましい。インサート成形品の表面を保護することができるからである。また、ハードコート層の膜厚は0.5μm未満であると透明樹脂フィルムの表面の保護が不十分となり、10μmを超えると加熱又は放射線による硬化が十分に得られずブロッキングを起こしやすくなるからである。また、ハードコート層の材料は、例えば、シラン系、放射線硬化性等の材料を用いることができるが、放射線硬化性の材料が好ましく、その中でも紫外線硬化性の材料が好ましい。
各誘電体層の厚さについては、誘電体層全体の厚さが上記説明した50nm~800nmの範囲となるものであれば特に制限するものではないが、各誘電体層の厚さは5nm~200nmとすることが好ましい。5nmを下回ると各誘電体層の光学的な制御が困難であり、200nmを上回ると工業生産的にコスト高になるからである。
図1に断面を示す成膜装置は、円筒状の真空チャンバー1内の中央には基材2を支持するための円筒状回転体3が配置され、チャンバー1の内周に沿って、第1のスパッタリング領域4、イオンガン5、第2のスパッタリング領域6及び第3のスパッタリング領域7が順に配置される。真空チャンバー1には、図示しないが真空ポンプが接続されており同チャンバー1内を排気できるようになっている。
また、各領域4,6,7の基材2側には、それぞれシャッター14~16が設けられており、各領域4,6,7における成膜時に選択的にシャッター14~16を開放するようになっている。
上記方法によれば、装飾膜を所望の色味や輝度を付与することが可能となる。
尚、以下の実施例では特に条件を説明しない限り下記の条件で成膜を行うものとする。
(1)基材
厚さ100μm、幅500mm、長さ1000mmのポリエチレン製の透明樹脂フィルムの片面に厚さ1μmのハードコート層が設けられたものを使用した。
(2)誘電体層の成膜条件
本実施例では、誘電体層として、SiO2及びNb2O5を成膜した。
a)SiO2の成膜条件
ターゲット:Si
電源:DC電源
酸化源:イオンガン
成膜温度:室温
カソード投入電力:6w/cm2
Ar流量:500sccm
O2流量:100sccm
b)Nb2O5
ターゲット:Si
電源:DC電源
酸化源:イオンガン
成膜温度:室温
カソード投入電力:5w/cm2
Ar流量:500sccm
O2流量:300sccm
上記実施の形態で説明した装置を使用し、同装置の真空チャンバー1内を8.0×10-4Paに減圧するとともに第1のスパッタリング領域4にArを導入した状態で、カソード11に電力を投入して、図2に示すように、基材2の片面にNb膜をスパッタリングにより成膜する工程と、円筒状回転体3を回転させてイオンガン5によりNb膜を酸化する工程とを繰り返し、膜厚87.0nmのNb2O5膜(誘電体層)17とした。次に、真空チャンバー1内を8.0×10-4Paに調整するとともにスパッタリング領域6にArを導入してカソード12に電力を投入して膜厚100.0nmのSi膜をスパッタリングにより成膜した。続いて、円筒状回転体3を回転させてイオンガン5によりNb膜を酸化してSiO2膜(誘電体層)18とした。そして、その上に、Nb2O5膜17の成膜と同様にして膜厚87.0nmのNb2O5膜(誘電体層)19を成膜した。
その後、Nb2O5膜19上に、ウレタン系2液硬化型のインク(セイコーアドバンス社製WO7(RX002))をスクリーンメッシュ印刷により膜厚3μmで塗布して装飾膜20としてインサート成形用フィルムとした。
基材側から順に、実施例1と同様にしてNb2O5膜とSiO2膜とを交互に7層を積層し、最後に実施例1と同じインクにより装飾膜を成膜した。
各膜厚は、基材側から順に、Nb2O5膜(17.00nm)、SiO2膜(164.00nm)、Nb2O5膜(40.00nm)、SiO2膜(76.50nm)、Nb2O5膜(100.00nm)、SiO2膜(53.50nm)、Nb2O5膜(49.00nm)とした。
得られたインサート成形用フィルムを、PMMA樹脂(三菱レイヨン社製アクリルペットVRL40-001)ととともに、射出成形用装置で金型温度を50度、乾燥条件80度に設定して、射出成形品を製造した。
その結果、図5に示すように、成膜圧力が、0.5Pa~1.0Paの範囲のインサート成形用フィルムでは、クラックや剥離がなく、この範囲以外では、クラックや剥離が確認された。
2 基材
3 円筒状回転体
4,6,7 第1~第3のスパッタリング領域
5 イオンガン
8~10 ターゲット
11~13 カソード
14~16 シャッター
17~19 誘電体層
20 インク層
21 ハードコート層
Claims (8)
- 透明樹脂フィルムの片面側に装飾層を備え、前記装飾層側をインサート成形により得られる樹脂成形品の本体側に位置するように成形されるインサート成形用装飾フィルムであって、前記装飾層は、全体の厚さが50nm~800nmとなるように誘電体層を積層して構成され、前記装飾層の圧縮応力を250MPa~350MPaとしたことを特徴とするインサート成形用装飾フィルム。
- 前記透明樹脂フィルムは、厚さ50μm~200μmのポリエチレン系又はポリオレフィン系の樹脂から構成されることを特徴とする請求項1に記載のインサート成形用装飾フィルム。
- 前記透明樹脂フィルムの前記装飾層と反対の面には、厚さ0.5μm~10μmのハードコート層を備えることを特徴とする請求項1又は2に記載のインサート成形用装飾フィルム。
- 前記装飾層は、厚さ5nm~200nmの二酸化ケイ層及び五酸化ニオブ層を交互に積層したものであることを特徴とする請求項1乃至3の何れか1項に記載のインサート成形用装飾フィルム。
- 請求項1乃至4の何れか1項に記載のインサート成形用装飾フィルムを備えたことを特徴とするインサート成形品。
- 透明樹脂フィルムの片面側に装飾層を備え、前記装飾層側をインサート成形により得られる樹脂成形品の本体側に位置するように成形されるインサート成形用装飾フィルムの製造方法であって、成膜圧力を0.5Pa~1.0Paとして金属原子をスパッタリングして前記透明樹脂フィルム上に厚さ5nm~200nmの金属原子層を成膜した後に酸化して誘電体層とし、前記誘電体層の成膜を繰り返して前記誘電体層を積層して前記装飾層とし、前記装飾層の圧縮応力を250MPa~350MPaとなるようにすることを特徴とするインサート成形用装飾フィルムの製造方法。
- 前記透明樹脂フィルムは、厚さ50μm~200μmのポリエチレン系又はポリオレフィン系の樹脂から構成され、前記装飾層と反対の面には、厚さ0.5μm~10μmのハードコート層が設けられ、前記装飾層の厚さは50nm~800nmであることを特徴とする請求項6に記載のインサート成形用装飾フィルムの製造方法。
- 前記誘電体層として厚さ5nm~200nmの二酸化ケイ素層と五酸化ニオブ層とを交互に積層して前記装飾層を構成し、各誘電体層のスパッタリング時の温度を80℃以下、二酸化ケイ素層の成膜レートを1.0~3.0Å/sec、及び、五酸化ニオブ層の成膜レートを1.0~2.5Å/secとすることを特徴とする請求項6又は7に記載のインサート成形用装飾フィルムの製造方法。
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