WO2011065776A3 - 트레이와 이를 이용한 기판 처리 장치, 및 트레이의 제조 방법 - Google Patents

트레이와 이를 이용한 기판 처리 장치, 및 트레이의 제조 방법 Download PDF

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Publication number
WO2011065776A3
WO2011065776A3 PCT/KR2010/008444 KR2010008444W WO2011065776A3 WO 2011065776 A3 WO2011065776 A3 WO 2011065776A3 KR 2010008444 W KR2010008444 W KR 2010008444W WO 2011065776 A3 WO2011065776 A3 WO 2011065776A3
Authority
WO
WIPO (PCT)
Prior art keywords
tray
manufacturing
processing apparatus
substrate processing
same
Prior art date
Application number
PCT/KR2010/008444
Other languages
English (en)
French (fr)
Other versions
WO2011065776A2 (ko
Inventor
최종용
Original Assignee
주성엔지니어링(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090115888A external-priority patent/KR101669913B1/ko
Priority claimed from KR1020100114260A external-priority patent/KR101691066B1/ko
Application filed by 주성엔지니어링(주) filed Critical 주성엔지니어링(주)
Publication of WO2011065776A2 publication Critical patent/WO2011065776A2/ko
Publication of WO2011065776A3 publication Critical patent/WO2011065776A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

본 발명은 제작 비용을 절감시킬 수 있도록 한 트레이와 이를 이용한 기판 처리 장치, 및 트레이의 제조 방법에 관한 것으로, 트레이의 제조 방법은 베이스 플레이트를 마련하는 공정; 상기 베이스 플레이트의 가장자리를 감싸도록 제 1 코팅층을 형성하는 공정; 및 상기 제 1 코팅층을 포함하도록 상기 베이스 플레이트의 전면 전체에 기상 증착 공정을 이용하여 제 2 코팅층을 형성하는 공정을 포함하여 이루어지는 것을 특징으로 한다.
PCT/KR2010/008444 2009-11-27 2010-11-26 트레이와 이를 이용한 기판 처리 장치, 및 트레이의 제조 방법 WO2011065776A2 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020090115888A KR101669913B1 (ko) 2009-11-27 2009-11-27 트레이 및 이를 사용하는 기판처리장치
KR10-2009-0115888 2009-11-27
KR10-2010-0114260 2010-11-17
KR1020100114260A KR101691066B1 (ko) 2010-11-17 2010-11-17 트레이와 이를 이용한 기판 처리 장치, 및 트레이의 제조 방법

Publications (2)

Publication Number Publication Date
WO2011065776A2 WO2011065776A2 (ko) 2011-06-03
WO2011065776A3 true WO2011065776A3 (ko) 2011-11-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/008444 WO2011065776A2 (ko) 2009-11-27 2010-11-26 트레이와 이를 이용한 기판 처리 장치, 및 트레이의 제조 방법

Country Status (2)

Country Link
TW (1) TWI563589B (ko)
WO (1) WO2011065776A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103155134B (zh) * 2011-07-15 2016-10-26 高美科株式会社 基板载置用托盘
KR101796475B1 (ko) * 2011-07-15 2017-11-14 (주)코미코 기판 적재용 트레이
KR20160017333A (ko) * 2014-08-04 2016-02-16 피에스케이 주식회사 공정 트레이 및 이를 이용한 처리 장치
EP3990680A4 (en) * 2019-06-25 2023-01-11 Picosun Oy SUBSTRATE REAR FACE PROTECTION

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030094493A (ko) * 2002-06-04 2003-12-12 삼성전자주식회사 기판을 지지하기 위한 척
JP2004075175A (ja) * 2002-08-22 2004-03-11 Toppan Printing Co Ltd 大型ガラス基板用トレイ形カセット
JP3547470B2 (ja) * 1993-03-04 2004-07-28 ザイカーブ・ビー・ブイー 基板キャリア
JP2006100297A (ja) * 2004-09-28 2006-04-13 Renesas Technology Corp 半導体装置の搬送方法および半導体装置の製造方法
JP2006179687A (ja) * 2004-12-22 2006-07-06 Murata Mach Ltd 枚葉搬送用トレイおよび搬送システム
KR20060083410A (ko) * 2003-08-01 2006-07-20 에스지엘 카본 악티엔게젤샤프트 반도체 제조시 웨이퍼를 지지하는 홀더
KR100922496B1 (ko) * 2005-10-04 2009-10-20 주식회사 코미코 엠보싱 패턴을 갖는 기판 지지대 및 이의 제조 방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200731448A (en) * 2006-02-15 2007-08-16 guo-dong Chen Manufacturing method of protection layer of wafer tray

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3547470B2 (ja) * 1993-03-04 2004-07-28 ザイカーブ・ビー・ブイー 基板キャリア
KR20030094493A (ko) * 2002-06-04 2003-12-12 삼성전자주식회사 기판을 지지하기 위한 척
JP2004075175A (ja) * 2002-08-22 2004-03-11 Toppan Printing Co Ltd 大型ガラス基板用トレイ形カセット
KR20060083410A (ko) * 2003-08-01 2006-07-20 에스지엘 카본 악티엔게젤샤프트 반도체 제조시 웨이퍼를 지지하는 홀더
JP2006100297A (ja) * 2004-09-28 2006-04-13 Renesas Technology Corp 半導体装置の搬送方法および半導体装置の製造方法
JP2006179687A (ja) * 2004-12-22 2006-07-06 Murata Mach Ltd 枚葉搬送用トレイおよび搬送システム
KR100922496B1 (ko) * 2005-10-04 2009-10-20 주식회사 코미코 엠보싱 패턴을 갖는 기판 지지대 및 이의 제조 방법

Also Published As

Publication number Publication date
TWI563589B (en) 2016-12-21
WO2011065776A2 (ko) 2011-06-03
TW201131686A (en) 2011-09-16

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