WO2011063653A1 - Procédé de formation de cartes de module d'identité d'abonné - Google Patents

Procédé de formation de cartes de module d'identité d'abonné Download PDF

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Publication number
WO2011063653A1
WO2011063653A1 PCT/CN2010/074836 CN2010074836W WO2011063653A1 WO 2011063653 A1 WO2011063653 A1 WO 2011063653A1 CN 2010074836 W CN2010074836 W CN 2010074836W WO 2011063653 A1 WO2011063653 A1 WO 2011063653A1
Authority
WO
WIPO (PCT)
Prior art keywords
card
plug
sim
further characterized
aperture
Prior art date
Application number
PCT/CN2010/074836
Other languages
English (en)
Inventor
Wai Keung Chung
Chi Yung Hui
Ka Chu Wong
Original Assignee
Intercard Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intercard Limited filed Critical Intercard Limited
Priority to IN3916DEN2012 priority Critical patent/IN2012DN03916A/en
Priority to CN2010800539996A priority patent/CN102640171A/zh
Publication of WO2011063653A1 publication Critical patent/WO2011063653A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • SIM Subscriber Identity Module
  • SIM cards are removable smart cards, which are available in two standard sizes, the first of which being of a standard credit card (i.e. 85.60mm x 53.98 mm x 0.76 mm), while its more popular version (called a "Plug-In SIM card”) being of a dimension of 25 mm (length) x 15 mm (width) x 0.76 mm (thickness).
  • SIM cards store securely the key identifying a mobile phone service subscriber.
  • the SIM card allows users to change phones easily by removing the SIM card from a first mobile phone and inserting it into a second mobile phone, thereby eliminating the need for activation of the second mobile phone on the network.
  • SIM card also covers Universal Subscriber
  • USB Universal Identity Module
  • R-UIM Removable User Identity Module
  • each Plug-In SIM card is linked to a substrate card whose dimensions conform with the relevant international standards, e.g. as given in International Standard ISO/IEC 7816, the contents of which are incorporated herein by reference.
  • Plug-In SIM cards When the Plug-In SIM cards are required for use, they are broken off from the respective substrate card, whereupon the remaining substrate card will be discarded. As the dimensions and physical characteristics of SIM cards are meticulously specified in the relevant international standards, the machines for manufacturing and installing SIM cards is also highly standardized, and there is very little room for change. However, as can be seen from the above, discarding the substrate cards after detachment of the Plug-In SIM cards is a wastage of resources. It is thus an object of the present invention to provide a method of forming a plurality of Plug-In SIM cards in which the aforesaid shortcoming is mitigated, or at least to provide a useful alternative to the public.
  • a method of forming Plug-In Subscriber Identity Module (SIM) cards including steps (a) providing a substrate card with dimensions conforming with the requirements of ISO 7816-1 and 7816-2 and with a plurality of stepped depressions on a major surface of said substrate card; (b) embedding a SIM integrated circuit (IC) module in each of said stepped depressions; (c) cutting out a plurality of Plug-In SIM cards from said substrate card; and (d) releasably engaging one of said plurality of Plug-In SIM cards obtained in said step (c) with a carrier card with dimensions conforming with the requirements of ISO 7816-1 and 7816-2 but with a thickness of at least 0.76mm.
  • SIM Subscriber Identity Module
  • Fig. 1 is a top view of a card carrying eight Plug-In SIM cards according to a first embodiment of the present invention
  • Fig. 2 is a top view of a card carrying seven Plug-In SIM cards according to a second embodiment of the present invention
  • Fig. 3 is a top view of a card carrying six Plug-In SIM cards according to a third embodiment of the present invention.
  • Fig. 4 is a top view of a card carrying five Plug-In SIM cards according to a fourth embodiment of the present invention.
  • Fig. 5 is a top view of a card carrying four Plug-In SIM cards according to a fifth embodiment of the present invention.
  • Fig. 6 is a top view of a card carrying three Plug-In SIM cards according to a sixth embodiment of the present invention.
  • Fig. 7 is a perspective view of a substrate card for forming a card according to the present invention.
  • Fig. 8 is a top view of the substrate card of Fig. 7 formed with a number of stepped depressions
  • Fig. 9 is a perspective view of the substrate card of Fig. 8.
  • Fig. 10 shows a SIM integrated circuit (IC) module to be embedded onto the substrate card of Fig. 8;
  • Fig. 11 is a perspective view of the substrate card of Fig. 8 embedded with eight SIM IC modules;
  • Fig. 12 shows die-cutting out a Plug-In SIM card from the card of Fig. 11;
  • Fig. 13 shows placement of cut-out Plug-In SIM cards in pockets of a length of plastic bag;
  • Fig. 14 shows steps of personalization of a Plug-In SIM card by using a carrier card;
  • Fig. 15 is a perspective view of an alternative carrier card
  • Fig. 16 is a perspective exploded view of the carrier card of Fig. 15;
  • Fig. 17A is a top view of an upper card layer of the carrier card of Fig 15;
  • Fig. 17B is a top view of a middle card layer of the carrier card of Fig 15;
  • Fig. 17C is a top view of a lower card layer of the carrier card of Fig 15;
  • Fig. 18 is a perspective view of the carrier card of Fig. 15 releasably engaged with a Plug-In SIM card.
  • Fig. 1 shows a plastic substrate card 100 carrying eight Plug-In SIM cards 102 in which all the contact surfaces of the Plug-In SIM cards 102 are on a same side of the substrate card 100.
  • Dimensions of the substrate card 100 conform with the requirements of ISO/IEC 7816- 1 and 7816-2, and in compliance with GSM 11.11.
  • the substrate card 100 is in the general shape of a rectangle with two opposite longer edges 104 and two opposite shorter edges 106. Each longer edge 104 is perpendicular to and adjacent the two shorter edges 106, and each shorter edge 106 is perpendicular to and adjacent the two longer edges 104. At a mid-point along one of the longer edges 104 is formed a V-shaped recess 108; and at a mid-point along one of the shorter edges 106 is also formed a V-shaped recess 110.
  • Fig. 2 shows a substrate card 200 carrying seven Plug-In SIM cards 202.
  • Fig. 3 shows a substrate card 300 carrying six Plug-In SIM cards 302.
  • Fig. 4 shows a substrate card 400 carrying five Plug-In SIM cards 402.
  • Fig. 5 shows a substrate card 500 carrying four Plug-In SIM cards 502.
  • Fig. 6 shows a substrate card 600 carrying three Plug-In SIM cards 602.
  • the material, structure and dimensions of the substrate cards 200, 300, 400, 500, 600 are the same as those of the substrate card 100, the only difference being the number of Plug-In SIM cards 102, 202, 302, 402, 502, 602 carried by the respective substrate cards 100, 200, 300, 400, 500, 600.
  • a method of forming a plurality of Plug-In SIM cards according to this invention will be described below, in the exemplary context of a substrate card 100 carrying eight Plug-In SIM cards 102. It should be readily understood that the same method can be used in the context of a substrate card carrying different numbers of Plug-In SIM cards.
  • a plastic substrate card 100 whose dimensions conforming to the requirements of ISO/IEC 7816-1 and 7816-2, and in compliance with GSM 11.11, as shown in Fig. 7, is provided.
  • Eight generally square stepped depressions 120 are formed on one major surface 122 of the substrate card 100 by milling or injection molding.
  • a V-shaped recess 108 At a mid-point along one of the longer edges 104 is formed a V-shaped recess 108, and at a mid-point along one of the shorter edges 106 is also formed a V-shaped recess 110.
  • These V-shaped recesses 108, 110 are provided for ensuring proper placement, alignment and orientation of the substrate card 100 in a card magazine (loader) (not shown) for subsequent processes and procedures.
  • a SIM integrated circuit (IC) module 125 is embedded in each respective stepped depression 120, e.g. by hot-melt tape method.
  • IC integrated circuit
  • a substrate card 100 carrying eight Plug-In SIM cards 102 is formed, as shown in Fig. 11.
  • a punching machine 128 then cuts out from the substrate card 100 a number of Plug-In
  • SIM cards 126 conforming to the conventional dimensions and shape by die-cut punching, as shown in Fig. 12.
  • a length of plastic bag 130 with a number of pockets 132 are provided, each for storing one of the cut-out Plug-In SIM cards 126.
  • each Plug-In SIM card 126 is inserted into a depression 134 on a major surface 145 of a carrier card 136.
  • the dimensions of the carrier card 136 also conform to the requirements of ISO/IEC 7816-1 and 7816-2, but it may be thicker than 0.76mm, such as 1mm.
  • the depression 134 of the carrier card 136 is sized and configured to receive a Plug-In SIM card 126.
  • the carrier card 136 is in the general shape of a rectangle with two opposite longer edges 138 and two opposite shorter edges 139.
  • Each longer edge 138 is perpendicular to and adjacent the two shorter edges 139
  • each shorter edge 139 is perpendicular to and adjacent the two longer edges 138.
  • At a mid-point along one of the longer edges 138 is formed a V-shaped recess 141; and at a mid-point along one of the shorter edges 139 is also formed a V-shaped recess 143.
  • V-shaped recesses 141, 143 are provided for ensuring proper placement, alignment and orientation of the carrier card 136 (and thus of the Plug-In SIM card 126 releasably engaged therewith) in the subsequent personalization process.
  • the Plug-In SIM card 126 releasably engaged with the carrier card 136 is then personalized by a card personalization machine. After this process, the personalized Plug-In SIM card 126 is then removed from the depression 134 of the carrier card 136.
  • FIG. 15 An alternative carrier card for use in the method according to the present invention is shown in Fig. 15 and generally designated as 140.
  • the dimensions of the carrier card 140 also conform to the requirements of ISO/IEC 7816-1 and 7816-2, but with a thickness over 0.76mm.
  • the carrier card 140 has an upper card layer 142, a middle card layer 144 and a lower card layer 146 fixedly secured with one another.
  • the upper card layer 142 has an aperture 148; the middle card layer 144 has an aperture
  • the lower card layer 146 has an aperture 152.
  • the shapes and dimensions of the apertures 148, 150, 152 differ from one another.
  • the aperture 148 of the upper card layer 142 is of a length a, e.g. of 23.1mm
  • the aperture 148 has a wider end with a width b, e.g. of 15.6mm and a narrower end with a width c, e.g. of 12.6mm.
  • the width c of the narrower end of the aperture 148 is significantly narrower than the width of 15mm of the Plug-In SIM card 126.
  • the aperture 150 of the middle card layer 144 is of a length d, e.g. of 25.1mm, which is longer than the length a of the aperture 148 of the upper card layer 142, and is slightly longer than length of 25mm of the Plug-In SIM card 126.
  • the aperture 150 has a wider end with a width e, e.g. of 15.4mm and a narrower end with a width e.g. of 15.1mm. Both the width e and the width of the aperture 1 0 is slightly longer than the width of 15mm of the Plug-In SIM card 126.
  • the middle layer 144 is of a thickness of 0.76mm. It can be seen that the aperture 150 of the middle card layer 144 is sized and configured to receive the whole of the Plug-In SIM card 126.
  • the aperture 152 of the lower card layer 146 is of a length g, e.g. of 9.5mm (which is significantly shorter than the length of 25mm of the Plug-In SIM card 126), and of a width h, e.g. of 13.6mm (which is significantly narrower than the width of 15mm of the Plug-In SIM card 126).
  • the apertures 148, 150, 152 communicate with one another (as shown in Fig. 15), and the carrier card 140 so formed is of a thickness of over 0.76mm.
  • the Plug-In SIM card 126 When the carrier card 140 so formed is to be releasably engaged with the Plug-In SIM card 126, the Plug-In SIM card 126 has to be slid on and relative to the upper card layer 142 of the carrier card 140, through the wider end of the aperture 148, into the aperture 150 of the middle card layer 144, and rests on the lower card layer 146. This is the only way in which the Plug-In SIM card 126 can be engaged with the carrier card 140.
  • the upper major surface 160 of the Plug-In SIM card 126 is in contact with part of a major surface of the upper card layer 142 facing the second card layer 144; and (4) the lower major surface of the Plug-In SIM card 126 is in contact with part of a major surface of the lower card layer 146 facing the second card layer 144.
  • the Plug-In SIM card 126 may be removed from the carrier card 140 by sliding the Plug-In SIM card 126 out of the aperture 150 of the middle card layer 144 and the aperture 148 of the upper card layer 142. This is the only way in which the Plug-In SIM card 126 can be removed from the carrier card 140.
  • the Plug-In SIM card 126 can be:
  • V-shaped recess at a mid-point along one of the longer edges 156 of the carrier card 140 is formed a V-shaped recess and along one of the shorter edges 158 of the carrier card 140 is also formed a V-shaped recesses. These V-shaped recesses are provided for ensuring proper placement, alignment and orientation of the carrier card 140 (and thus of the Plug-In SIM card 126 releasably engaged therewith) in the personalization process.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention porte sur un procédé de formation de cartes de module d'identité d'abonné (SIM) enfichables (126) comprenant les étapes consistant à (a) utiliser une carte de substrat (100, 200, 300, 400, 500, 600) ayant des dimensions conformes aux exigences ISO 7816-1 et 7816-2 et comprenant un certain nombre de cuvettes échelonnées (120) sur une surface principale (122) de la carte de substrat (100, 200, 300, 400, 500, 600) ; (b) incorporer un module de circuit intégré (CI) SIM (125) dans chacune des cuvettes échelonnées (120) ; (c) découper un certain nombre de cartes SIM enfichables (126) à partir de la carte de substrat (100, 200, 300, 400, 500, 600) ; et (d) solidariser de façon libérable la carte SIM enfichable (126) obtenue à l'étape (c) à une carte porteuse (136, 140) ayant des dimensions conformes aux exigences ISO 7816-1 et 7816-2 mais ayant une épaisseur d'au moins 0,76 mm.
PCT/CN2010/074836 2009-11-30 2010-06-30 Procédé de formation de cartes de module d'identité d'abonné WO2011063653A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IN3916DEN2012 IN2012DN03916A (fr) 2009-11-30 2010-06-30
CN2010800539996A CN102640171A (zh) 2009-11-30 2010-06-30 用户识别模块卡的形成方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
HK09111197A HK1144145A2 (en) 2009-11-30 2009-11-30 Method of forming subscriber identity module cards
HK09111197.9 2009-11-30

Publications (1)

Publication Number Publication Date
WO2011063653A1 true WO2011063653A1 (fr) 2011-06-03

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ID=43513571

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2010/074836 WO2011063653A1 (fr) 2009-11-30 2010-06-30 Procédé de formation de cartes de module d'identité d'abonné

Country Status (4)

Country Link
CN (1) CN102640171A (fr)
HK (1) HK1144145A2 (fr)
IN (1) IN2012DN03916A (fr)
WO (1) WO2011063653A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1952958A (zh) * 2006-11-22 2007-04-25 凤凰微电子（中国）有限公司 采用塑封工艺将芯片和元件组合封装成智能卡的方法
WO2009080126A1 (fr) * 2007-12-26 2009-07-02 Oberthur Card Systems Limited Procédé de fabrication d'une pluralité de cartes enfichables à partir d'un corps de carte
CN201315074Y (zh) * 2008-10-28 2009-09-23 深圳市中兴集成电路设计有限责任公司 Sim卡的卡基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201222265Y (zh) * 2008-07-11 2009-04-15 第一美卡事业股份有限公司 改良式sim卡结构

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1952958A (zh) * 2006-11-22 2007-04-25 凤凰微电子（中国）有限公司 采用塑封工艺将芯片和元件组合封装成智能卡的方法
WO2009080126A1 (fr) * 2007-12-26 2009-07-02 Oberthur Card Systems Limited Procédé de fabrication d'une pluralité de cartes enfichables à partir d'un corps de carte
CN201315074Y (zh) * 2008-10-28 2009-09-23 深圳市中兴集成电路设计有限责任公司 Sim卡的卡基板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HAO QIFENG ET AL.: "Study of SIM Card Body Processing Technologies.", PACKAGING ENGINEERING, vol. 30, no. 7, July 2009 (2009-07-01), pages 37,38,70 *

Also Published As

Publication number Publication date
CN102640171A (zh) 2012-08-15
HK1144145A2 (en) 2011-01-28
IN2012DN03916A (fr) 2015-09-04

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