WO2011040701A2 - Brush roll for semiconductor wafer - Google Patents

Brush roll for semiconductor wafer Download PDF

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Publication number
WO2011040701A2
WO2011040701A2 PCT/KR2010/005194 KR2010005194W WO2011040701A2 WO 2011040701 A2 WO2011040701 A2 WO 2011040701A2 KR 2010005194 W KR2010005194 W KR 2010005194W WO 2011040701 A2 WO2011040701 A2 WO 2011040701A2
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WO
WIPO (PCT)
Prior art keywords
brush
core
support member
semiconductor wafer
brush roll
Prior art date
Application number
PCT/KR2010/005194
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French (fr)
Korean (ko)
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WO2011040701A3 (en
Inventor
방선정
방병호
Original Assignee
Bang Sunjung
Bang Byungho
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Application filed by Bang Sunjung, Bang Byungho filed Critical Bang Sunjung
Publication of WO2011040701A2 publication Critical patent/WO2011040701A2/en
Publication of WO2011040701A3 publication Critical patent/WO2011040701A3/en

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    • B08B1/32—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Definitions

  • the present invention relates to a PVA brush roll used in a semiconductor CMP process (wafer cleaning process), and more particularly, to maintain flatness of the protrusion of the brush, and to prevent twisting of the brush rotating at high speed or tipping in one direction. It relates to a brush roll for one semiconductor wafer.
  • the wafer cleaning process for manufacturing a semiconductor device may include various semiconductor device manufacturing processes such as a deposition process, an etching process, a photolithography process, and a chemical mechanical polishing (CMP) process. And various objects such as metal impurities, organic contaminants, surface coatings such as natural oxide films, including fine particles remaining on the wafer surface.
  • various semiconductor device manufacturing processes such as a deposition process, an etching process, a photolithography process, and a chemical mechanical polishing (CMP) process.
  • various objects such as metal impurities, organic contaminants, surface coatings such as natural oxide films, including fine particles remaining on the wafer surface.
  • CMP is a planarization process in which a chemical reaction by a slurry containing a silicon dioxide or cerium oxide-based abrasive and a mechanical processing by a polishing pad are simultaneously performed.
  • Such CMP is proposed as a process for planarizing the surface of the wafer, but recently, it is used in the etching of the polysilicon film for forming the contact plug and the etching of the metal film for forming the metal wiring. It's happening.
  • Scrubber cleaning which is a method of rotating and cleaning a brush, is mainly used as the cleaning process.
  • the conventional brush roll 1 used in the cleaning process of the semiconductor wafer has a cylindrical core 10 and a cylindrical brush 20 which is fitted to the outer surface of the core 10 and integrated. )
  • the core 10 is made of Teflon material, and a drain passage 11 is formed therein in the longitudinal direction of the core 10, and a drain passage 11 is formed on an outer surface of the core 10.
  • a plurality of outlets 12 communicated with are formed by drilling.
  • the plurality of outlets 12 are formed to be arranged in a line along the longitudinal direction of the core 10 on the outer surface of the core 10 while the rows of the four outlets 12 arranged as described above are each core 10 On the outer surface of the) is formed spaced at equal intervals of 90 degrees.
  • the number of rows of the outlets 12 as described above can vary.
  • the washing water that is, the ultra pure water (DI Water) used in the washing process is discharged to the outside of the core 10 through the drain passage 11 and the outlet 12 of the core 10. Then, the core material of the same material as the brush 20 to be described later is inserted into the drain passage 11 of the core 10.
  • DI Water ultra pure water
  • the brush 20 is formed of a poly-vinyl acetate foam (PVA) brush, and a plurality of protrusions 21 are formed around the outer surface of the brush 20. Accordingly, the protrusion 21 of the brush 20 contacts the surface of the wafer (not shown) to remove contaminants.
  • PVA poly-vinyl acetate foam
  • the brush 20 which was contracted during the coupling process as described above, is expanded on the outer surface of the core 10 and inserted into all the outlets 12 of the core 10 to block the outlets 12 so that the flow of the washing water ( Circulation).
  • the brush 20 since the protrusions 21 of the surface of the brush 20 which rotates at a high speed during the cleaning operation of the brush furnace 1 are continuously rubbed on the surface of the wafer, the brush 20 is warped or oriented in one direction. As such, the brush 20 twisted or oriented in one direction has a problem of causing a fine scratch on the surface of a soft copper (Cu) wafer which is recently applied to a semiconductor process.
  • Cu soft copper
  • the present invention has been made to solve the problems of the prior art as described above, is formed by integrally molding the support member for supporting the brush when the brush is formed, the mounting of the support member protruding to the inner surface of the brush It is an object of the present invention to provide a brush roll for a semiconductor wafer in which the brush is easily attached to the core by attaching the brush to the core through the protrusion.
  • the excessive expansion of the brush is prevented by the support member formed inside the brush during expansion of the brush coupled to the core to prevent the blockage of the discharge hole of the core to ensure a smooth flow of the wash water To provide a brush roll for a semiconductor wafer.
  • the brush is firmly supported by the support member formed inside the brush, thereby maintaining the flatness of the brush protrusion, and also preventing the brush from being rotated in one direction or from pulling in one direction. It is to provide a brush roll for a semiconductor wafer to prevent.
  • the above object is a brush roll for cleaning a semiconductor wafer, comprising: a rotatable core; A brush installed on an outer surface of the core and having a plurality of protrusions on a surface thereof; It is achieved by a brush roll for a semiconductor wafer comprising a; support member is inserted into the brush to support the brush while one side thereof protrudes from the brush and is coupled to the core.
  • the support member may include a wing portion inserted into the brush to support the brush when the brush is molded; And a mounting protrusion extending from the wing and protruding to an inner surface of the brush to fit into a mounting groove of the core.
  • the support member is preferably divided into a plurality.
  • the support member formed to be embedded in the brush supports the brush so that the brush is distorted or pulled in one direction even when the brush rotates at a high speed during the cleaning operation and continuously rubs against the surface of the wafer. It is possible to prevent the excessive expansion of the brush by the support member, so that the expanded brush does not block the discharge hole of the core, thereby ensuring a smooth flow of washing water, and the brush is provided through the mounting protrusion protruding to the inner side of the brush. easily fitted to the core has an effect that can be firmly combined.
  • FIG. 1 is a perspective view including a partial cross section of a conventional brush roll.
  • FIG. 2 is an exploded perspective view of the brush roll according to the present invention.
  • FIG 3 is a partially enlarged half sectional view of a brush roll according to the present invention.
  • FIG. 4 is a side cross-sectional view of a brush roll according to the present invention.
  • FIG. 2 to 4 illustrate a brush roll for a semiconductor wafer according to the present invention.
  • Brush roll 100 for a semiconductor wafer according to the present invention is largely composed of a core 200, a brush 300, a support member 400 and the like as shown in FIG.
  • the core 200 is made of Teflon (Teflon) material, rotatably installed in the cleaning process, there is formed a drain passage 210 perforated along the longitudinal direction of the core 200,
  • the outer surface of the core 200 is formed by drilling a plurality of outlets 220 communicated with the drain passage 210.
  • the plurality of outlets 220 are formed to be arranged in a line on the outer surface of the core 200 while the rows of the four outlets 220 arranged as described above are equally spaced at 90 degrees to the outer surface of the core 200. Is formed spaced apart, the heat of the outlet 220 may be formed by varying the number. Therefore, the washing water, that is, the ultra pure water (DI Water) used in the washing process is discharged to the outside of the core 200 through the drain passage 210 and the outlet 220 of the core 200.
  • DI Water ultra pure water
  • a plurality of mounting grooves 230 formed are spaced apart at equal intervals of 90 degrees.
  • the brush 300 is formed of a poly-vinyl acetate foam (PVA) brush, and a plurality of protrusions 310 are formed around the surface of the brush 300, that is, the outer surface.
  • PVA poly-vinyl acetate foam
  • the brush 300 is inserted into the support member 400 to be described later to support the brush 300 to supplement the strength and hardness of the brush 300.
  • the support member 400 is inserted into the brush 300 to support the brush 300 as described above, while the mounting protrusion 410 of the support member 400 to be described later protrudes to the inner surface of the brush 300.
  • the brush 300 can be simply and firmly mounted to the core 200.
  • the support member 400 is made of polyethylene (PE), and is largely divided into two wing parts 420 and a mounting protrusion 410, and the two wing parts 420 are formed at the time of forming the brush 300.
  • the mounting protrusion 410 is a brush 300 as one protrusion member extending from both wing portions 420. Protruding to the inner side of the () is fitted into the mounting groove 230 of the core 200, the brush 300 can be firmly mounted to the core 200. At this time, the brush 300 is firmly fixed to the position of the support member 400 in the mounting groove 230 of the core 200 by the elastic force, such as tensile force and compression force.
  • resin support grooves 411 and 421 are formed on the upper surfaces of the mounting protrusions 410 and the wing portions 420 to respectively insert and foam the resins forming the brushes 300, thereby supporting the support member 400.
  • the coupling force between the brushes 300 is firmly increased.
  • the two wing parts 420 protrude outwardly along the circumferential direction of the core 200 or the brush 300 based on the mounting protrusion 410, and both wing parts 420 are illustrated in FIG. 4.
  • the insert 300 is preferably formed to have a length not covering the outlet 220 of the core 200 when insert molding the brush 300.
  • the support member 400 formed as described above may be formed as one member having a length corresponding to the mounting groove 230 of the core 200, More preferably, the support member 400 may be formed in a plurality of members. It is preferable to divide and form into a member. The reason why the supporting member 400 is not molded into one member is to prevent or minimize the damage of the brush 300 during a working process of performing 2 to 30 washing processes. That is, as shown in Figure 3, the plurality of support members 400 inserted into the brush 300 has a structure similar to the spine tissue of the human body.
  • the length of the mounting groove 230 formed in the core 200 is formed by the entire length of the inserted support members 400.
  • more than one support member 400 is inserted so as not to fall to have a length corresponding to the length of the mounting groove 230. Therefore, the support members 400 of both ends inserted into the brush 300 may be mounted to the mounting protrusions 410 in contact with the ends of the mounting groove 230 to prevent the brush 300 from tipping and twisting. do.
  • the brush 300 mounted on the core 200 through the support member 400 as described above may be maintained continuously by the support member 400 therein, even after mounting, thereby maintaining flatness during molding.
  • the brush 300 can be detachably attached to the core 200, the core 200 can be reused.

Abstract

The present invention relates to a PVA brush roll for use in a CMP process (wafer cleaning process) for fabricating semiconductors, wherein said PVA brush roll comprises: a rotatable core; a brush arranged on the outer surface of the core, and having a surface with a plurality of protrusions; and a support member which is inserted into the brush so as to support the brush, and one side of which protrudes from the brush and is coupled to the core, thereby preventing the brush from being twisted or leaning to one side, and fitting and coupling the brush to the core in a convenient and firm manner.

Description

반도체 웨이퍼용 브러쉬 롤Brush roll for semiconductor wafer
본 발명은 반도체 CMP공정(웨이퍼 세정공정)에 사용되는 PVA 브러쉬 롤에 관한 것으로서, 보다 상세하게는 브러쉬의 돌기의 평탄도를 유지할 수 있고, 고속회전하는 브러쉬의 뒤틀림 또는 일방향으로의 쏠림 현상을 방지한 반도체 웨이퍼용 브러쉬 롤에 관한 것이다.The present invention relates to a PVA brush roll used in a semiconductor CMP process (wafer cleaning process), and more particularly, to maintain flatness of the protrusion of the brush, and to prevent twisting of the brush rotating at high speed or tipping in one direction. It relates to a brush roll for one semiconductor wafer.
통상적으로, 반도체 소자의 미세화가 진행됨에 따라 수율과 신뢰성 측면에서 미립자를 비롯한 금속 불순물, 유기 오염물, 자연 산화막과 같은 불순물 제거의 중요성 또한 증대되고 있다. 이러한 불순물은 반도체 소자의 성능과 수율을 좌우하는 중요한 요소이기 때문에, 반도체 소자를 제조하기 위한 각 공정을 진행하기 전에 세정 공정을 거쳐야 한다.In general, as the semiconductor devices become finer, the importance of removing impurities such as metal impurities, organic contaminants, and natural oxide films, including fine particles, also increases in terms of yield and reliability. Since these impurities are important factors that determine the performance and yield of the semiconductor device, the cleaning process must be performed before each process for manufacturing the semiconductor device.
이와 같이, 반도체 소자를 제조하기 위한 웨이퍼의 세정 공정은 증착 공정, 식각 공정, 포토리소그라피(Photolithography) 공정과, 화학적 기계 연마(Chemical Meechanical Polish : CMP) 공정 등의 다양한 반도체 소자 제조 공정을 진행한 후, 웨이퍼 표면에 잔류하는 미립자를 비롯한 금속 불순물, 유기 오염물, 자연 산화막과 같은 표면 피막 등의 다양한 대상물을 제거하기 위하여 실시한다.As described above, the wafer cleaning process for manufacturing a semiconductor device may include various semiconductor device manufacturing processes such as a deposition process, an etching process, a photolithography process, and a chemical mechanical polishing (CMP) process. And various objects such as metal impurities, organic contaminants, surface coatings such as natural oxide films, including fine particles remaining on the wafer surface.
주지된 바와 같이, CMP는 이산화규소(Silica) 또는 산화세륨(Ceria) 계열의 연마제를 포함하는 슬러리(slurry)에 의한 화학 반응과 연마 패드(pad)에 의한 기계적 가공이 동시에 수행되는 평탄화 공정으로서, 이러한 CMP는 웨이퍼의 표면을 평탄화시키기 위한 공정으로 제안된 것이지만, 최근에 들어서는 콘택 플러그 형성을 위한 폴리실리콘막의 식각 및 금속 배선의 형성을 위한 금속막의 식각 공정에 이용되고 있고, 점차 그 이용 분야가 확대되고 있는 실정이다.As is well known, CMP is a planarization process in which a chemical reaction by a slurry containing a silicon dioxide or cerium oxide-based abrasive and a mechanical processing by a polishing pad are simultaneously performed. Such CMP is proposed as a process for planarizing the surface of the wafer, but recently, it is used in the etching of the polysilicon film for forming the contact plug and the etching of the metal film for forming the metal wiring. It's happening.
이러한 CMP 공정 후에는 급격하게 증가하는 오염물질의 제거를 위한 반도체 웨이퍼의 세정공정이 필수적으로 수행되고, 이 세정공정으로는 브러쉬를 회전시키며 세정하는 방법인 스크러버 세정(Scrubber Cleaning)이 주로 사용된다.After such a CMP process, a semiconductor wafer cleaning process is essentially performed to remove rapidly increasing contaminants. Scrubber cleaning, which is a method of rotating and cleaning a brush, is mainly used as the cleaning process.
이와 같은 반도체 웨이퍼의 세정공정에 사용되는 종래의 브러쉬 롤(1)은 도 1에 도시된 바와 같이, 원통형의 코어(10)와, 코어(10)의 외측면에 끼워져 일체화된 원통형의 브러쉬(20)로 이루어진다.As shown in FIG. 1, the conventional brush roll 1 used in the cleaning process of the semiconductor wafer has a cylindrical core 10 and a cylindrical brush 20 which is fitted to the outer surface of the core 10 and integrated. )
상기 코어(10)는 테프론(Teflon) 재질로서, 그 내부에 코어(10)의 길이방향을 따라 천공된 배수통로(11)가 형성되고, 상기 코어(10)의 외측면에는 배수통로(11)와 연통된 다수의 배출구(12)가 천공되어 형성된다. 여기서, 상기 다수의 배출구(12)는 코어(10)의 외측면에 코어(10)의 길이방향을 따라 일렬로 나열되게 형성되는 한편 이와 같이 나열된 4개의 배출구(12)의 열이 각각 코어(10)의 외측면에 90도의 등간격으로 이격되게 형성된다. 물론, 상기와 같은 배출구(12)의 열은 그 개수를 달리 할 수 있음이 자명하다. 따라서, 세정공정에서 사용된 세척수 즉 초순수(DI Water)가 코어(10)의 배수통로(11)와 배출구(12)를 통해 코어(10) 외부로 배출된다. 그리고, 상기 코어(10)의 배수통로(11) 내부에는 후술될 브러쉬(20)와 같은 재질의 심재가 삽입되어 구비된다.The core 10 is made of Teflon material, and a drain passage 11 is formed therein in the longitudinal direction of the core 10, and a drain passage 11 is formed on an outer surface of the core 10. A plurality of outlets 12 communicated with are formed by drilling. Here, the plurality of outlets 12 are formed to be arranged in a line along the longitudinal direction of the core 10 on the outer surface of the core 10 while the rows of the four outlets 12 arranged as described above are each core 10 On the outer surface of the) is formed spaced at equal intervals of 90 degrees. Of course, it is obvious that the number of rows of the outlets 12 as described above can vary. Therefore, the washing water, that is, the ultra pure water (DI Water) used in the washing process is discharged to the outside of the core 10 through the drain passage 11 and the outlet 12 of the core 10. Then, the core material of the same material as the brush 20 to be described later is inserted into the drain passage 11 of the core 10.
상기 브러쉬(20)는 폴리비닐아세틸폼(Poly-Vinyl Acetate : PVA) 브러쉬로 형성되고, 상기 브러쉬(20)의 외측면 둘레에는 다수의 돌기(21)들이 형성되어 있다. 따라서, 상기 브러쉬(20)의 돌기(21)가 웨이퍼(미도시)의 표면에 접촉되면서 오염물질을 제거한다.The brush 20 is formed of a poly-vinyl acetate foam (PVA) brush, and a plurality of protrusions 21 are formed around the outer surface of the brush 20. Accordingly, the protrusion 21 of the brush 20 contacts the surface of the wafer (not shown) to remove contaminants.
하지만, 이와 같은 종래의 반도체 웨이퍼용 브러쉬 롤(1)은 코어(10)와 브러쉬(20)의 견고한 장착을 위해 브러쉬(20)의 내경보다 2∼4㎜ 정도 큰 직경을 갖는 코어(10)에 브러쉬(20)를 끼워 결합시키므로 인해 코어(10)에 브러쉬(20)를 견고하게 장착시키기가 매우 어렵다는 문제가 있었다.However, such a conventional brush roll 1 for semiconductor wafers is applied to the core 10 having a diameter of about 2 to 4 mm larger than the inner diameter of the brush 20 for firmly mounting the core 10 and the brush 20. Since the brush 20 is fitted to each other, there is a problem that it is very difficult to firmly mount the brush 20 to the core 10.
한편, 위와 같은 문제를 해결하기 위해 코어(10)에 직접 브러쉬(20)를 사출 성형하는 경우에는 수지가 60∼80°C에서 12∼24시간 동안 서서히 식어 브러쉬(20)로 성형되는데, 이 과정에서 테프론 재질의 코어(10)가 열에 의해 휘어져 변형되는 또 다른 문제와 더불어 코어(10)에 브러쉬(20)가 직접 사출 성형되는 경우에는 코어(10)의 재사용이 불가하여 폐기해야 하는 단점이 있었다.On the other hand, in order to solve the above problems, when the injection molding the brush 20 directly to the core 10, the resin is gradually cooled to 12 to 24 hours at 60 ~ 80 ° C. to be molded into the brush 20, this process In addition to another problem that the core 10 of the Teflon material is bent and deformed by heat, when the brush 20 is directly injection-molded in the core 10, there is a disadvantage that the core 10 cannot be reused and disposed of. .
또한 전술한 바와 같은 결합과정에서 수축되어 있던 브러쉬(20)가 코어(10)의 외측면 상에서 팽창되면서 코어(10)의 모든 배출구(12)로 삽입되어 배출구(12)를 막음으로써 세척수의 유동(순환)을 저해하는 문제가 있었다.      In addition, the brush 20, which was contracted during the coupling process as described above, is expanded on the outer surface of the core 10 and inserted into all the outlets 12 of the core 10 to block the outlets 12 so that the flow of the washing water ( Circulation).
그리고, 브러쉬 로(1)의 세정작업시 고속회전하는 브러쉬(20) 표면의 돌기(21)가 웨이퍼의 표면에 지속적으로 마찰되므로 인해 브러쉬(20)가 뒤틀리거나 또는 일방향으로 쏠리는 현상이 발생되는 문제가 있었고, 이와 같이 뒤틀리거나 일방향으로 쏠린 브러쉬(20)는 최근 반도체 공정에 적용되는 부드러운 구리(Cu) 웨이퍼의 표면에 미세한 긁힘 현상을 유발하게 되는 문제가 있었다.       In addition, since the protrusions 21 of the surface of the brush 20 which rotates at a high speed during the cleaning operation of the brush furnace 1 are continuously rubbed on the surface of the wafer, the brush 20 is warped or oriented in one direction. As such, the brush 20 twisted or oriented in one direction has a problem of causing a fine scratch on the surface of a soft copper (Cu) wafer which is recently applied to a semiconductor process.
이에, 본 발명은 전술한 바와 같은 종래기술의 문제점을 해결하기 위해 안출된 것으로, 브러쉬의 성형 시 브러쉬를 지지하는 지지부재를 일체로 성형하여 구성하고, 브러쉬의 내측면으로 돌출된 지지부재의 장착돌부를 통해서 브러쉬를 코어에 장착함으로써 브러쉬를 코어에 간편하게 장착할 수 있도록 한 반도체 웨이퍼용 브러쉬 롤을 제공하는데 그 목적이 있다.Accordingly, the present invention has been made to solve the problems of the prior art as described above, is formed by integrally molding the support member for supporting the brush when the brush is formed, the mounting of the support member protruding to the inner surface of the brush It is an object of the present invention to provide a brush roll for a semiconductor wafer in which the brush is easily attached to the core by attaching the brush to the core through the protrusion.
또한, 본 발명의 다른 목적으로는, 코어에 결합된 브러쉬의 팽창 시 브러쉬 내부에 형성된 지지부재에 의해 브러쉬의 과도한 팽창이 방지되어 코어의 배출공의 막힘이 방지됨으로써 원활한 세척수의 흐름을 확보할 수 있도록 한 반도체 웨이퍼용 브러쉬 롤을 제공함에 있다.In addition, in another object of the present invention, the excessive expansion of the brush is prevented by the support member formed inside the brush during expansion of the brush coupled to the core to prevent the blockage of the discharge hole of the core to ensure a smooth flow of the wash water To provide a brush roll for a semiconductor wafer.
또한, 본 발명의 또 다른 목적으로는, 브러쉬의 내부에 형성된 지지부재에 의해서 브러쉬가 견고하게 지지됨으로써 브러쉬 돌기의 평탄도를 유지할 수 있을 뿐만 아니라 고속회전하는 브러쉬의 뒤틀림 또는 일방향으로의 쏠림 현상을 방지할 수 있도록 반도체 웨이퍼용 브러쉬 롤을 제공함에 있다.In addition, according to another object of the present invention, the brush is firmly supported by the support member formed inside the brush, thereby maintaining the flatness of the brush protrusion, and also preventing the brush from being rotated in one direction or from pulling in one direction. It is to provide a brush roll for a semiconductor wafer to prevent.
상술한 목적은, 반도체 웨이퍼의 세정을 위한 브러쉬 롤에 있어서, 회전가능한 코어와; 상기 코어의 외측면에 설치되고 그 표면에는 다수의 돌기들을 갖는 브러쉬와; 상기 브러쉬에 인서트되어 브러쉬를 지지하는 한편 그 일측이 브러쉬에서 돌출되어 코어에 결합되는 지지부재;를 포함하여 구성된 것을 특징으로 하는 반도체 웨이퍼용 브러쉬 롤에 의해 달성된다.The above object is a brush roll for cleaning a semiconductor wafer, comprising: a rotatable core; A brush installed on an outer surface of the core and having a plurality of protrusions on a surface thereof; It is achieved by a brush roll for a semiconductor wafer comprising a; support member is inserted into the brush to support the brush while one side thereof protrudes from the brush and is coupled to the core.
또한, 상기 지지부재는 브러쉬의 성형 시 브러쉬에 인서트되어 브러쉬를 지지하는 날개부; 및 상기 날개부에서 연장되어 브러쉬의 내측면으로 돌출되어 코어의 장착홈에 끼워져 장착돌부;를 포함하여 구성된다.The support member may include a wing portion inserted into the brush to support the brush when the brush is molded; And a mounting protrusion extending from the wing and protruding to an inner surface of the brush to fit into a mounting groove of the core.
그리고, 상기 지지부재는 다수개로 분할 형성됨이 바람직하다.In addition, the support member is preferably divided into a plurality.
본 발명의 반도체 웨이퍼용 브러쉬 롤에 따르면, 브러쉬에 내장되게 성형된 지지부재가 브러쉬를 지지함으로써 브러쉬가 세정작업 시 고속회전되면서 웨이퍼의 표면과 지속적으로 마찰되어도 브러쉬의 뒤틀림 또는 일방향으로의 쏠림 현상을 방지할 수 있고, 지지부재에 의해서 브러쉬의 과도한 팽창이 방지되므로 팽창되는 브러쉬가 코어의 배출공을 막지 않으므로 원활한 세척수의 흐름을 확보할 수 있으며, 브러쉬의 내측면으로 돌출된 장착돌부를 통해 브러쉬를 코어에 간편하게 끼워 견고하게 결합시킬 수 있는 효과가 있다.According to the brush roll for semiconductor wafers of the present invention, the support member formed to be embedded in the brush supports the brush so that the brush is distorted or pulled in one direction even when the brush rotates at a high speed during the cleaning operation and continuously rubs against the surface of the wafer. It is possible to prevent the excessive expansion of the brush by the support member, so that the expanded brush does not block the discharge hole of the core, thereby ensuring a smooth flow of washing water, and the brush is provided through the mounting protrusion protruding to the inner side of the brush. Easily fitted to the core has an effect that can be firmly combined.
도 1은 종래의 브러쉬 롤을 도시한 일부 단면을 포함한 사시도이다.1 is a perspective view including a partial cross section of a conventional brush roll.
도 2는 본 발명에 따른 브러쉬 롤의 분리사시도이다.2 is an exploded perspective view of the brush roll according to the present invention.
도 3은 본 발명에 따른 브러쉬 롤의 일부 확대 반단면도이다.3 is a partially enlarged half sectional view of a brush roll according to the present invention.
도 4는 본 발명에 따른 브러쉬 롤의 측단면도이다.4 is a side cross-sectional view of a brush roll according to the present invention.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
1 : 브러쉬 롤 10 : 코어1: brush roll 10: core
11 : 배수통로 12 : 배출구11: drain passage 12: outlet
20 : 브러쉬 21 : 돌기20: brush 21: protrusion
30 : 심재 100 : 브러쉬 롤30: core material 100: brush roll
200 : 코어 210 : 배수통로200: core 210: drain passage
220 : 배출구 230 : 장착홈220: outlet 230: mounting groove
300 : 브러쉬 310 : 돌기300: brush 310: projection
400 : 지지부재 410 : 장착돌부400: support member 410: mounting protrusion
411 : 수지홈 420 : 날개부411: resin groove 420: wing portion
421 : 수지홈421: Resin Groove
이하, 본 발명의 바람직한 실시예를 첨부도면을 참조하여 설명한다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
첨부도면 도 2 내지 도 4는 본 발명에 따른 반도체 웨이퍼용 브러쉬 롤을 도시한 도면이다.2 to 4 illustrate a brush roll for a semiconductor wafer according to the present invention.
본 발명에 따른 반도체 웨이퍼용 브러쉬 롤(100)은 도 2에 도시된 바와 같이, 크게 코어(200), 브러쉬(300), 지지부재(400) 등으로 대별되어 구성된다. Brush roll 100 for a semiconductor wafer according to the present invention is largely composed of a core 200, a brush 300, a support member 400 and the like as shown in FIG.
상기 코어(200)는, 테프론(Teflon) 재질로 이루어져서, 세정공정에서 회전가능하게 설치되는 구성으로서, 그 내부에는 코어(200)의 길이방향을 따라 천공된 배수통로(210)가 형성되고, 상기 코어(200)의 외측면에는 배수통로(210)와 연통된 다수의 배출구(220)가 천공되어 형성된다. 여기서, 상기 다수의 배출구(220)는 코어(200)의 외측면에 일렬로 나열되게 형성되는 한편 이와 같이 나열된 4개의 배출구(220)의 열이 코어(200)의 외측면에 90도의 등간격으로 이격되어 형성되되, 이와 같은 배출구(220)의 열은 그 개수를 달리하여 형성할 수 있다. 따라서, 세정공정에서 사용된 세척수 즉 초순수(DI Water)가 코어(200)의 배수통로(210)와 배출구(220)를 통해 코어(200) 외부로 배출된다.The core 200 is made of Teflon (Teflon) material, rotatably installed in the cleaning process, there is formed a drain passage 210 perforated along the longitudinal direction of the core 200, The outer surface of the core 200 is formed by drilling a plurality of outlets 220 communicated with the drain passage 210. Here, the plurality of outlets 220 are formed to be arranged in a line on the outer surface of the core 200 while the rows of the four outlets 220 arranged as described above are equally spaced at 90 degrees to the outer surface of the core 200. Is formed spaced apart, the heat of the outlet 220 may be formed by varying the number. Therefore, the washing water, that is, the ultra pure water (DI Water) used in the washing process is discharged to the outside of the core 200 through the drain passage 210 and the outlet 220 of the core 200.
그리고, 상기 다수의 배출구(220)가 이루는 열과 열 사이의 코어(200) 외측면에는 후술될 지지부재(400)의 장착돌부(410)를 삽입하여 끼울 수 있도록 코어(200)의 길이방향을 따라 형성된 다수의 장착홈(230)이 90도의 등간격으로 이격되어 형성된다.In addition, along the longitudinal direction of the core 200 to be inserted by inserting the mounting protrusion 410 of the support member 400 to be described later on the outer surface of the core 200 between the heat formed by the plurality of outlets 220. A plurality of mounting grooves 230 formed are spaced apart at equal intervals of 90 degrees.
상기 브러쉬(300)는, 폴리비닐아세틸폼(Poly-Vinyl Acetate : PVA) 브러쉬로 형성되고, 상기 브러쉬(300)의 표면 즉 외측면 둘레에는 다수의 돌기(310)들이 형성된다. 따라서, 상기 브러쉬(300)의 돌기(310)들이 웨이퍼의 표면에 접촉되면서 오염물질을 제거한다.The brush 300 is formed of a poly-vinyl acetate foam (PVA) brush, and a plurality of protrusions 310 are formed around the surface of the brush 300, that is, the outer surface. Thus, the protrusions 310 of the brush 300 are in contact with the surface of the wafer to remove contaminants.
그리고, 이와 같은 브러쉬(300)에는 후술될 지지부재(400)가 인서트 성형되어 브러쉬(300)를 지지함으로써 브러쉬(300)의 강도 및 경도를 보충하게 된다.In addition, the brush 300 is inserted into the support member 400 to be described later to support the brush 300 to supplement the strength and hardness of the brush 300.
상기 지지부재(400)는, 전술한 바와 같이 브러쉬(300)에 인서트되어 브러쉬(300)를 지지하는 한편 후술될 지지부재(400)의 장착돌부(410)가 브러쉬(300)의 내측면으로 돌출되어 코어(200)에 결합됨으로써 브러쉬(300)를 코어(200)에 간단하면서도 견고하게 장착시킬 수 있게 된다.The support member 400 is inserted into the brush 300 to support the brush 300 as described above, while the mounting protrusion 410 of the support member 400 to be described later protrudes to the inner surface of the brush 300. By being coupled to the core 200, the brush 300 can be simply and firmly mounted to the core 200.
상기 지지부재(400)는 폴리에틸렌(polyethylene : PE) 재질로서, 크게 양 날개부(420)와 장착돌부(410)로 대별되어 구성되고, 상기 양 날개부(420)는 브러쉬(300)의 성형 시 브러쉬(300)에 인서트되어 일체로 성형됨으로써 브러쉬(300)를 축에 수직한 상하 방향으로 지지하며, 상기 장착돌부(410)는 양 날개부(420)에서 연장된 하나의 돌기부재로서 브러쉬(300)의 내측면으로 돌출되어 코어(200)의 장착홈(230)에 끼워져 결합됨으로써 브러쉬(300)가 코어(200)에 견고하게 장착될 수 있다. 이때, 상기 브러쉬(300)는 인장력과 압축력 등의 탄성력에 의해서 코어(200)의 장착홈(230)에 지지부재(400)의 위치를 견고히 고정시키게 된다.The support member 400 is made of polyethylene (PE), and is largely divided into two wing parts 420 and a mounting protrusion 410, and the two wing parts 420 are formed at the time of forming the brush 300. Inserted into the brush 300 and integrally molded to support the brush 300 in the vertical direction perpendicular to the axis, the mounting protrusion 410 is a brush 300 as one protrusion member extending from both wing portions 420. Protruding to the inner side of the () is fitted into the mounting groove 230 of the core 200, the brush 300 can be firmly mounted to the core 200. At this time, the brush 300 is firmly fixed to the position of the support member 400 in the mounting groove 230 of the core 200 by the elastic force, such as tensile force and compression force.
그리고, 상기 장착돌부(410)와 날개부(420)의 상면에는 각각 브러쉬(300)를 형성하는 수지가 삽입되어 발포되는 수지홈(411)(421)이 형성됨으로써, 상기 지지부재(400)와 브러쉬(300) 간의 결합력을 견고하게 증대시키게 된다.In addition, resin support grooves 411 and 421 are formed on the upper surfaces of the mounting protrusions 410 and the wing portions 420 to respectively insert and foam the resins forming the brushes 300, thereby supporting the support member 400. The coupling force between the brushes 300 is firmly increased.
여기서, 상기 양 날개부(420)는 장착돌부(410)를 기준으로 코어(200) 또는 브러쉬(300)의 원주방향을 따라 외측방향으로 돌출 형성된 것으로, 양 날개부(420)는 도 4에 도시된 바와 같이 브러쉬(300)에 인서트 성형 시 코어(200)의 배출구(220)를 덮지 않는 길이로 형성됨이 바람직하다.Here, the two wing parts 420 protrude outwardly along the circumferential direction of the core 200 or the brush 300 based on the mounting protrusion 410, and both wing parts 420 are illustrated in FIG. 4. As described above, the insert 300 is preferably formed to have a length not covering the outlet 220 of the core 200 when insert molding the brush 300.
또한, 상기와 같이 형성된 지지부재(400)는 코어(200)의 장착홈(230)에 대응한 길이를 갖는 하나의 부재로 형성할 수 있지만, 보다 바람직하게는 상기 지지부재(400)를 다수의 부재로 분할하여 형성하는 것이 바람직하다. 이와 같이 지지부재(400)를 하나의 부재로 성형하지 않는 이유는, 2~30회의 세척공정을 하는 작업공정 중에 브러쉬(300)의 파손을 방지 또는 최소화하기 위한 것이다. 즉, 도 3에서와 같이 상기 브러쉬(300)에 인서트된 다수의 지지부재(400)가 마치 인체의 등뼈조직과 유사한 구조를 갖는다.In addition, the support member 400 formed as described above may be formed as one member having a length corresponding to the mounting groove 230 of the core 200, More preferably, the support member 400 may be formed in a plurality of members. It is preferable to divide and form into a member. The reason why the supporting member 400 is not molded into one member is to prevent or minimize the damage of the brush 300 during a working process of performing 2 to 30 washing processes. That is, as shown in Figure 3, the plurality of support members 400 inserted into the brush 300 has a structure similar to the spine tissue of the human body.
그리고, 상기와 같이 다수의 지지부재(400)를 브러쉬(300)에 인서트하는 경우에는 인서트된 다수의 지지부재(400)가 이루는 전 길이가 코어(200)에 형성된 장착홈(230)의 길이를 넘지 않도록 함은 물론 보다 바람직하게는 다수의 지지부재(400)가 장착홈(230)의 길이에 대응한 길이를 갖도록 인서트한다. 따라서, 상기 브러쉬(300)에 인서트된 양끝단부의 지지부재(400)는 그 장착돌부(410)가 장착홈(230)의 단부에 각각 접하여 브러쉬(300)의 쏠림 및 뒤틀림 현상을 방지할 수 있게 된다.In addition, when inserting the plurality of support members 400 to the brush 300 as described above, the length of the mounting groove 230 formed in the core 200 is formed by the entire length of the inserted support members 400. Of course, more than one support member 400 is inserted so as not to fall to have a length corresponding to the length of the mounting groove 230. Therefore, the support members 400 of both ends inserted into the brush 300 may be mounted to the mounting protrusions 410 in contact with the ends of the mounting groove 230 to prevent the brush 300 from tipping and twisting. do.
또한, 상기와 같이 지지부재(400)를 통해 코어(200)에 장착된 브러쉬(300)는 장착 후에도 그 내부의 지지부재(400)에 의해서 지속적으로 지지됨으로써 성형 시의 평탄도를 그대로 유지할 수 있을 뿐만 아니라 브러쉬(300)를 코어(200)에 간편하게 탈.부착시킬 수 있으므로 코어(200)의 재사용이 가능하게 된다.In addition, the brush 300 mounted on the core 200 through the support member 400 as described above may be maintained continuously by the support member 400 therein, even after mounting, thereby maintaining flatness during molding. In addition, since the brush 300 can be detachably attached to the core 200, the core 200 can be reused.

Claims (3)

  1. 반도체 웨이퍼의 세정을 위한 브러쉬 롤에 있어서, In the brush roll for cleaning a semiconductor wafer,
    회전가능한 코어와; A rotatable core;
    상기 코어의 외측면에 설치되고 그 표면에는 다수의 돌기들을 갖는 브러쉬와; A brush installed on an outer surface of the core and having a plurality of protrusions on a surface thereof;
    상기 브러쉬에 인서트되어 브러쉬를 지지하는 한편 그 일측이 브러쉬에서 돌출되어 코어에 결합되는 지지부재;를 포함하여 구성된 것을 특징으로 하는 반도체 웨이퍼용 브러쉬 롤.And a support member inserted into the brush to support the brush while one side thereof protrudes from the brush and is coupled to the core.
  2. 제 1 항에 있어서, The method of claim 1,
    상기 지지부재는 브러쉬의 성형 시 브러쉬에 인서트되어 브러쉬를 지지하는 날개부; 및 The support member may include a wing portion inserted into the brush to support the brush when the brush is molded; And
    상기 날개부에서 연장되어 브러쉬의 내측면으로 돌출되어 코어의 장착홈에 끼워져 장착돌부;를 포함하여 구성된 것을 특징으로 하는 반도체 웨이퍼용 브러쉬 롤.And a mounting protrusion extending from the wing and protruding toward an inner surface of the brush to fit into a mounting groove of the core.
  3. 제 1 항 또는 제 2 항에 있어서, The method according to claim 1 or 2,
    상기 지지부재는 다수개로 분할 형성된 것을 특징으로 하는 반도체 웨이퍼용 브러쉬 롤.Brush roll for a semiconductor wafer, characterized in that the support member is divided into a plurality.
PCT/KR2010/005194 2009-09-29 2010-08-09 Brush roll for semiconductor wafer WO2011040701A2 (en)

Applications Claiming Priority (2)

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KR10-2009-0092239 2009-09-29
KR1020090092239A KR101119951B1 (en) 2009-09-29 2009-09-29 brush roll

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WO2011040701A2 true WO2011040701A2 (en) 2011-04-07
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CN107755371A (en) * 2016-08-16 2018-03-06 中国石油天然气股份有限公司 A kind of tubing coupling cleaning plant and its method for cleaning
EP3714733A1 (en) * 2014-11-10 2020-09-30 Illinois Tool Works Inc. Archimedes brush for semiconductor cleaning

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US9119461B2 (en) * 2012-04-26 2015-09-01 Applied Materials, Inc. High stiffness, anti-slip scrubber brush assembly, high-stiffness mandrel, subassemblies, and assembly methods
KR101584427B1 (en) * 2014-03-31 2016-01-11 주식회사 브러쉬텍 Brush unit for cleaning wafer
KR101600766B1 (en) * 2014-11-03 2016-03-07 주식회사 케이씨텍 Substrate cleaning apparatus and brush assembly used therein

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WO2012170767A1 (en) * 2011-06-08 2012-12-13 Illinois Tool Works Inc. Brush mandrel for pva sponge brush
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CN107755371A (en) * 2016-08-16 2018-03-06 中国石油天然气股份有限公司 A kind of tubing coupling cleaning plant and its method for cleaning
CN107755371B (en) * 2016-08-16 2019-08-02 中国石油天然气股份有限公司 A kind of tubing coupling cleaning plant and its method for cleaning

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