WO2011035570A1

WO2011035570A1 - Intelligent microphone

Info

Publication number: WO2011035570A1
Application number: PCT/CN2010/071287
Authority: WO
Inventors: 张家庆; 潘俊弟; 朱朔鸿
Original assignee: 宣威科技股份有限公司
Priority date: 2009-09-27
Filing date: 2010-03-25
Publication date: 2011-03-31
Also published as: CN201523440U

Abstract

An intelligent microphone mainly includes: a substrate (11), microphone elements (13) located on the substrate (11), and at least a sensor (15) and at least an integrated element (119) located within the microphone elements (13). And a plurality of bonding pads (115), which are on the two sides of the substrate (11), integrate multi-sensors (15) with different functions into the microphone elements (13) to achieve a small size and multi-function intelligent microphone.

Description

Smart microphone

Technical field

The utility model relates to a smart microphone, in particular to a smart microphone structure in which a sensor is arranged in a cavity.

Background technique

For devices that need to transmit sound, such as cell phones, computers, personal digital assistants (PDAs), Voice over Internet Protocol (VOIP) devices, MP3 players, game consoles, headsets, portable satellite navigation devices (GPS), or other Similar to electronic devices, the use of microphones is the most common technique.

At the same time, in order to improve the sound processing performance of the microphone, it is usually focused on how to effectively suppress noise, remove wind noise, eliminate echo, and meet miniaturization and high power demand. At present, related technologies include Taiwan Patent Publication No. 1279155, No. I298984, No. I298984, No. M335900, and U.S. Patent Nos. 20080167516, No. 20080166000, and No. 20080165996. In the case of a generally related technique, a microphone is used to convert sound waves into electrical signals, that is, a single function that provides only sound-to-electrical conversion.

However, Taiwan's new model No. M333740 proposes a microphone that can illuminate and change the color of light. It uses a permeable material as the outer casing of the microphone, and is equipped with a light-emitting diode (LED) or variable light inside the microphone. Light-emitting sources such as diodes, lamps, bulbs or lamps, to produce illuminating and discoloring effects in response to different forms of operation. However, this patented technology is a wired or wireless microphone that is independent of the electronic device and is used by the user to directly carry the sound for transmission. In other words, this patented technology cannot be miniaturized, but directly as a mobile phone, computer, personal digital assistant (PDA), Voice over Internet Protocol (VoIP) device, MP3 player, multimedia player, game console, headset, portable In a satellite navigation device, or other similar electronic device Microphone.

It can be seen that the microphone in the general electronic device only has a single sound transmission function, and the other functions of the electronic device depend on other components. Therefore, how to provide a microphone that can integrate different functions in an electronic device is a matter for those in the field to be explored.

Utility model content

One of the objects of the present invention is to overcome the above-mentioned deficiencies of the prior art and to provide a smart microphone for integrating various functions in an electronic device.

Another object of the present invention is to provide a smart microphone with design flexibility, and to make it smaller in size.

In order to achieve the above object, the present invention provides a smart microphone, comprising: a carrier having opposite first and second surfaces, and a plurality of pads disposed on the first surface and the second surface a plurality of pads of the first surface and the second surface are electrically connected to each other; a microphone member is disposed on the first surface of the guide plate and electrically connected to at least one of the plurality of pads; at least one sensor, Provided on the first surface, and located inside the microphone member, and electrically connected to at least one of the plurality of pads; and at least one integrated component disposed on the first surface and located inside the microphone member, and electrically Optionally connecting at least one of the plurality of pads.

The carrier board can be a substrate and a circuit board. The plurality of pads on the second surface are solder pads, and the utility model can be used to integrate the new utility model into the interior of the electronic device by using Surface Mounting Technology (SMT). The carrier board may further include an electrical connection structure extending through the carrier board for electrically connecting the plurality of solder pads, and may be one of a through hole, a blind hole, and a buried hole.

Additionally, the sensor may be an inertial sensor such as one of an accelerator, a gyroscope, and a gyroscope. Of course, as long as it is applied to an electronic device having a microphone, the sensor can also be Others provide different sensing functions of the electronic device, and may simultaneously select one or several sensors, or simultaneously set different sensors on the carrier, not limited to a single type of embodiment.

The utility model has the advantages of modular design, in addition to providing a sound conversion function, and the sensor integrated in the utility model to provide a sensing function during action or direction conversion, which is convenient for integration in an electronic device. Various functions. Furthermore, the utility model can also set the required sensor according to the requirements of the applied electronic device, and integrate the sensor together with the integrated component in the microphone component, thereby providing more flexible design space and effectively reducing the volume. .

DRAWINGS

The specific technical solution of the smart microphone according to the present invention will be further described below with reference to the accompanying drawings and preferred embodiments.

Figure 1 is a plan view of a preferred embodiment of the present invention;

Figure 2 is a side view of a preferred embodiment of the present invention;

Figure 3 is a bottom view of a preferred embodiment of the present invention;

Figure 4 is a cross-sectional view of a preferred embodiment of the present invention;

FIG. 5 is a block diagram of an electronic device according to a preferred embodiment of the present invention.

Main component symbol description:

I, smart microphone

I I, carrier board

I I I, the first surface

113, the second surface

115, solder pad 119, integrated components

13, microphone components

131, sealing department

132. accommodating space

133, top plate

134, the first gasket

1341, front space

135, diaphragm

136, the second gasket

139, conductive ring

15, sensor

4, the main circuit board

5, displacement control module

6, audio control module

detailed description

The embodiments of the present invention are described by way of specific specific examples, and those skilled in the art can readily understand other advantages and functions of the present invention from the disclosure of the present disclosure.

1 through 5 are graphs drawn in accordance with a preferred embodiment of the present invention. As shown in FIG. 1 to FIG. 3, the appearance of the smart microphone 1 of the present embodiment mainly includes: a carrier 11 having opposite first and second surfaces 111, 113, and being disposed on the first surface. 111 and a plurality of pads 115 of the second surface 113, and electrically connecting the pads 115 between the first surface 111 and the second surface 113 respectively; the microphone member 13 is disposed on the first surface 111, and is electrically Connected to one of the pads 115; at least one sensor 15 is disposed on the first surface 111 and located inside the microphone member 13, and is electrically connected to one of the pads 115 by SMT or wires or the like; At least one integrated component 119 is disposed on the first surface 111, which is also located inside the microphone member 13, and is also electrically connected to one of the pads 115 by SMT or a wire or the like; in addition, the sensor 15 and the product The body assembly 119 is covered in the microphone member 13 and electrically connected to the microphone member 13, which is protected by the microphone member 13, and effectively reduces the volume of the smart microphone 1.

The carrier board 11 is configured to carry the microphone member 13 and the sensor 15, and the pad 115 of the second surface 113 is provided to integrate the smart microphone 1 to the inside of the electronic device (not shown). In this embodiment, the carrier The board 11 can be selected from a general substrate, circuit board or other equivalent component. A substrate or a circuit board having a simple circuit design can be selected as the carrier board 11. A substrate or a circuit board having a complicated circuit design can also be used as needed to complete electrical connection with the electronic device for transmitting signals to the electronic device. Device, not limited to this.

At the same time, in this embodiment, a plurality of pads 115 between the first surface 111 and the second surface 113 are used, and the first surface 111 is provided with an electrical connection structure 117 extending through the carrier 11, such as: through holes, blind holes, inner The buried via or other electrical connection structure is electrically connected to the pad 115 on the second surface 113 by the electrical connection structure 117 for the microphone component 13 , the sensor 15 and the integrated component 119 via the pad 115 . And electrically connected to corresponding components inside the electronic device. It should be noted that although the plurality of pads 115 of the present embodiment are rectangular, in other embodiments they may be changed to a toroidal, circular or other geometric shape. Moreover, when the pad 115 is designed to be annular, and the size of the pad 1 15 can be greater than, equal to, or even smaller than the electrical connection structure 1 17 to electrically conduct the first surface 1 11 and the second surface 113 In addition, one or at least one of the through hole, the blind hole, and the buried hole may be selected as the electrical connection structure 117, that is, the carrier 11 may have a through hole, a blind hole, or a buried hole at the same time, both of which are regarded as The layout of the carrier board 1 itself depends on the layout. That is, the structures in the present embodiment are merely illustrative and not intended to limit the present invention.

In addition, since the principle and specific structure of designing the through-hole, the blind via, the buried via, and the like, and the pad 1 15 are both prior art, the bonding principle using surface adhesion technology such as soldering is also As is well known, detailed descriptions and figures are omitted here.

As shown in FIG. 4, the microphone member 13 is a member that uses a general microphone or a general MEMS microphone. For example, the microphone member 13 includes a housing having a sealing portion 131 and an accommodating space 132. a top plate 133 in the accommodating space 132, a first gasket 134 and a second gasket 136 disposed under the top plate 133, and a diaphragm 135 interposed between the first gasket 134 and the second gasket 136. a cavity 137 between the board 11 and the second spacer 136, an inductive substrate 138 located in the cavity 137 for sensing vibration of the diaphragm 135, and a conductive ring located in the cavity 137 for contacting the sensing substrate 138 139. The top plate 133 has a plurality of through holes 1331 for connecting the front space 134 between the top plate 133 and the first gasket 134. The cavity 137 is formed with a cavity 1371 for stacking the sensing substrate 138 and the conductive ring 139. . At the same time, the sensor 15 and the integrated component 119 are located in the cavity 1371, and the carrier 11 is directly coupled to the main circuit board 4 of the electronic device without a gap. It should be understood that the drawings are merely illustrative of one embodiment of the microphone components of the present invention and are not intended to limit the present invention. The foregoing sensor 15 is an internal member that is bonded to the pad 15 by SMT or wire to complete electrical connection with the microphone member 13 and is electrically connected to the electronic device. In the present embodiment, the sensor 15 is an inertial sensor such as an accelerometer, a gyroscope, or a gyrometer. As shown in FIG. 5, the sensor 15 can be electrically connected to the displacement control module 5 of the electronic device, so that the displacement control module 5 receives the signal of the sensor 15 for subsequent processing, and the microphone component 13 is electrically connected to the electronic device. The audio control module 6 of the device is subjected to subsequent processing by the audio control module 6. Here, the sensor 15 can be used to sense single axis (for example, X axis or Y axis), two axes (X, Y axis), three axes (X, 丫, Z axis) such as tilting motion, acceleration motion, rotation, vibration, Various actions, such as jumping, impact, and left and right movement, to sense the position, direction (displacement), and/or posture of the electronic device. Therefore, when it is applied to an electronic device that performs corresponding operations using position, direction (displacement), and/or posture, such as a game machine, a mobile phone, or other device having a microphone, the smart microphone of the present embodiment can be provided. The relative output signal is to the electronic device. In the meantime, although the sensor 15 is used to provide an inertial sensing function for displacement and is electrically connected to the displacement control module 5, in other embodiments, the sensor 15 can also be used to provide the above-mentioned actions. Inertial sensing, while corresponding to other control modules in the electronic device, is not limited to the structures described in this embodiment, which are understandable and can be implemented by those of ordinary skill in the art to which the electronic device belongs.

For example, the mobile phone user can replace the button operation by tilting, rotating, or moving the mobile phone left and right; or, instead of using the gesture of the game machine, the switch, button, scroll wheel, etc. of the game machine; or The function of the device is integrated into the microphone of the sports MP3 I PMP earphone, sensing the human body action state to calculate the running distance and the calories burned; or, it can be integrated into the electronic device such as mobile phone, camera, camcorder for image stabilization detection. Sensor in the utility model In the smart microphone.

That is, the existing electronic device is provided with a sensor 15 such as an inertial sensor on a main circuit board (for example, the main circuit board 4 of the present embodiment). In the preferred embodiment of the present invention, it can be integrated. In the smart microphone 1. Not only can the smart microphone 1 be modularized, but the configuration space used on the main circuit board can be reduced, and the saved configuration space can be used to set components with other functions, which can further expand the functions of the electronic device.

It should be noted that although in the preferred embodiment, a sensor is disposed inside the microphone member 13 as an example, a plurality of sensors 15 may be provided; for example: combining an inertial sensor or a biosensor, or a temperature sensor, etc. Sensors with other functions can be used to monitor physiological changes in the user's operation, such as: pulse, blood pressure, and even body temperature. Moreover, the sensors 15 can be integrated with the integrated component 119 through the design of the integrated circuit to form an integrated component 119, which not only reduces manufacturing costs, but also effectively reduces the volume.

Since the configurable sensors 15 are numerous, and can be understood and implemented by those of ordinary skill in the art, they will not be described here.

In summary, the present invention is a modular smart microphone 1, so that the smart microphone 1 not only has a sound transmission function, but also integrates different sensors 15 to introduce corresponding functions into the applied electronic device. At the same time, the present invention has design flexibility based on the aforementioned sensor 15 being any sensor 15 having different functions.

The above-described embodiments are merely illustrative of the principles of the present invention and its effects, and are not intended to limit the present invention. Modifications and variations of the above-described embodiments may be made without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as listed in the scope of the patent application described later.

Claims

Claim

1. A smart microphone comprising a carrier, a microphone member, a sensor, and an integrated component, characterized in that:

The carrier has a plurality of pads opposite to the first surface and the second surface, and the first surface and the second surface are electrically connected to each other;

The microphone member is disposed on the first surface and electrically connected to at least one of the plurality of pads;

The at least one sensor is disposed on the first surface and located inside the microphone member and electrically connected to at least one of the plurality of pads;

The at least one integrated component is disposed on the first surface and located inside the microphone component and electrically connected to at least one of the plurality of pads.

2. The smart microphone according to claim 1, wherein: the carrier board is a substrate or a circuit board.

3. The smart microphone according to claim 1, wherein: the integrated component is electrically connected by a wire and a pad.

4. The smart microphone according to claim 1, wherein: the carrier further comprises an electrical connection structure extending through the carrier for electrically connecting the plurality of pads.

The smart microphone according to claim 4, wherein the electrical connection structure comprises a through hole, a blind hole, and a buried hole.

6. The smart microphone of claim 1 wherein: said sensor is an inertial sensor.

7. The smart microphone according to claim 6, wherein: said inertia The sensor includes an accelerator, a gyroscope, and a gyroscope.

8. The smart microphone according to claim 1, wherein: said sensor is a biosensor.

9. The smart microphone according to claim 1, wherein: said sensor is a temperature sensor.

10. The smart microphone according to claim 1, wherein: the sensor and the integrated component are integrated into an integrated component.